LWMIRROR2 3.0-H-004[A0]MIRROR2 3.0

Status: Reference No.: LW/MIRROR2 3.0-H-003 [ ] Drafted by: Security Classific

ation:Top Secret

[ ] Checked by Dissemination Scope:

Ultrasound Research and Development Center

Domestic Customer Service CenterInternational Customer Service Department

[] Approved by

Mirror2 3.0 Maintenance Manual

Version No.: V.A/0

Project: Pearl River Project

Formed by: Li Chunbun Mao Xiaoyuan

Date: Oct. 20, 2011

Approved by: Ding Bocheng

Date: Oct. 20, 2011

Approved By: Xi Jinhua

Date: Oct. 20, 2011

Confidential document of Landwind & All Right Reserved

Revision History

Version

Overview of Revised Content Responsible Person

Date

V1.0 First version Li Chunbin 2011-11-22

Table of contents

Confidential document of Landwind & All Right Reserved 2

Chapter I Overview of System ...................................................................................................................... 4 1.1 Overall Structure of System ............................................................................................................ 4 1.2 Classification and Functions of Unit Board .................................................................................... 6

1.2.1 BPM ..................................................................................................................................... 6 1.2.2 BEM ................................................................................................................................... 11 1.2.3 RXM ................................................................................................................................... 14 1.2.4 TXM ................................................................................................................................... 16 1.2.5 PCM ................................................................................................................................... 18 1.2.6 SCM ................................................................................................................................... 20 1.2.7 IOE ..................................................................................................................................... 21 1.2.8 KEY Board ......................................................................................................................... 25

Chapter II Disassembling Drawings ........................................................................................................... 28 2.1 Explosive View of Machine .......................................................................................................... 28 2.2 Disassembling Back Cover ........................................................................................................... 29 2.3 Disassembling Left and Right Covers .......................................................................................... 30 2.4 Disassembling Front Cover .......................................................................................................... 30 2.5 Disassembling Displayer Assembly ............................................................................................. 32 2.6. Disassembling Rocker Arm Assembly ........................................................................................ 33 2.7. Disassembling Key Board ............................................................................................................ 35 2.8 Disassembling Trace Ball ............................................................................................................. 37 2.9 Disassembling TGC Board ........................................................................................................... 38 2.10 Disassembling USB Interface Board .......................................................................................... 38 2.11 Disassembling Standard Keyboard ............................................................................................. 38 2.12 Disassembling External Interface Board .................................................................................... 39 2.13. Disassembling the Fans of Main Body ...................................................................................... 40 2.14 Disassembling Mainframe Box Module ..................................................................................... 40 2.15 Disassembling Power Supply ..................................................................................................... 41 2.16 Disassembling Hard Disk ........................................................................................................... 42 2.17 Disassembling Analog Signal Board .......................................................................................... 43 2.18 Disassembling BEM Board ........................................................................................................ 44 2.19 Disassembling RXM and TXM .................................................................................................. 45 2.20 (PCM) Disassembling PCM Board ............................................................................................ 45 2.21 Disassembling Fans of Mainframe Box ..................................................................................... 46 2.22. Disassembling CD Diver ........................................................................................................... 47 2.23 Disassembling Power Supply Interface Board Assembly .......................................................... 48 2.24 Disassembling Isolation Transformer Assembly ........................................................................ 49 2.25 Disassembling Caster .................................................................................................................. 50

Chapter III: Usual Trouble and Troubles shootings .................................................................................... 51 3.1 Core Box Fault Removal .............................................................................................................. 51 3.2 LCB Fault Removal ...................................................................................................................... 53 3.3 Keyboard Fault Removal .............................................................................................................. 54 3.4 External Interface Fault Removal ................................................................................................. 54 3.5 Other fault removal ....................................................................................................................... 54


Chapter I Overview of System

1.1 Overall Structure of System

In accordance with the system principles of the machine, the system consists of ultrasound core box, control panel, external interface board, monitor and power supply and the general connection of the modules is show in Figure 1.

Probe II

Probe I

Probe III

Ultrasound Core Box BEM RXM TXMPCM BPM COM-EHDD DDR2 Memory

Control Panel

External Interface Board

Audio

Printer

USB

Ethernet

COM

DVI

Monitor

DVD-RW

Power supply

Figure 1 System Block Chart

The ultrasound core box is the main component for ultrasound scanning, which contains the following functional units: back board (BPM), back end board (BEM), transmitting board (TXM), receiving board (RXM), and probe board (PCM), signal board (SCM). It is designed to perform the function of transmitting and receiving the ultrasound signal, digital beam forming (DBF), 2D and 3D image processing, Spectral Doppler, Color Doppler and Continuous Wave Doppler image scanning processing as well as the real-time monitor on the operation parameters of system.


TXFPGA

PulserCircuits

HVMUXes

RE

LAY

BLO

CK

S

PROBE A

PROBE B

PROBE C

TRSwitches

VCAsADCsRXFPGAs

FPGA

Co-Processing Module

PCIeMUXes

DEMOD

DEMOD

BPF

BPF

ADC

ADC

COM Express

USB2LPT FPGA

FLASHMEMORY

Loading FPGAs &DSPUSB

Power Suppy board: High Voltage Regulation & Power Filtering

Custom Power Supply

Overall System Architecture

PC I/O

Figure 2 Ultrasound Core Box Block Chart

PCM

BPM

TXMRXM

BEM

SCMFigure 3 Schematic Diagram of Ultrasound Core Box


1.2 Classification and Functions of Unit Board

1.2.1 BPM

Back module board (BPM) mainly provides the electrical connection for each sub-board of system. It provides the signal connection and power supply connection for BEM, TXM, RXM and PCM, and Figure 4 shows the specified connection scheme, wherein, CWTXM has not been developed yet. Refer to for the signal definition of pins.

Figure 4 Diagram of BPM Connected to TXM, CWTXM, PCM, RXM and BEM


Fan connector

Fan power connector

Dual USB A, for keyboard

Used to link IOE-B

ECG connector

Hard drive, optical drive -SATA data interface

Used to link IOE-A

Audio

Mic

Power supply module control interface

Digital power indicator

Analog power interface

Analog power indicator

Digital power interface

High-voltage power indicator

High-voltage power interface

Monitor DVI interface

CPLD download interface

FPGA download interface

USB A. (Standby)

Keyboard power supply and printer

Figure 5 Schematic Diagram of BPM Back Connector

Table 1 Connectors Signal DescriptionConnector Pin No. Connection Description Remark

Fan connector J65, J66, J67, J68

1 GND2 FAN_TA3 FAN_DRV

Double USB A connector

J4 1 +5V2 USB D-3 USB D+48 GND5 +5V6 USB D-7 USB D+

USB A connector

J3 1 +5V2 USB D-3 USB D+


4 GNDECG connector / / UnusedExternal interface IOE

J1, J2 / Refer to

Hard disc, CD- ROW SATA Data interface

J5, J6 1,4,7 GND2 TX_P3 TX_N5 RX_P6 TX_N

Audio interface J8 1 AUDIO_L2,4,5 GND 3 AUDIO_R

Micro Phone interface

J76 1,3 GND2 AUDIO MIC

Power supply for keyboard and printer

J9 1,5,7,8,12 GND2,3,4 D+5V6 D+5VSB9 ATX_PSON_ON10 REMOTE_P11 REMOTE_N

CPLD and FPGA down load interface

J10, J11 / Debugging interface

Display DVI interface

J75 1 TX_N22 TX_P26 DDC_CLK7 DDC_DAT9 TX_N110 TX_P114 +5V15 GND16 HOT Plug17 TX_N018 TX_P023 TXC_N24 TXC_P3,11,19,22 GND


Control interface of power supply module

J611

L_POW

2GND

3HV_SCL

4HV_SDA

5HVL_STOP

6LV_OK

7LV_ON

8HV_STOP

Power supply connector of fan

J731

D+3.3V

2D+12V

3

4GND

5GND

6


Digital power supply interface

J63 1D+3V

2D+3V

12GND

3D+3V

13GND

4D+3.3V

14GND

5D+3.3V

15GND

6D+3.3V

16GND

7D+5V

17GND

8D+5V

18GND

9D+5V

19GND

10D+12V

20GND

11D+12V

21GND

22GND

Analog power supply interface

J641

A-6V

11AGND

2A+6V

12AGND

3A+3.4V

4A+3.4V

5A-12V

6A+12V

7AGND

8AGND

9AGND

10AGND


High voltage power supply interface

J62 1A-THVL

11AGND

2A-THVL

12AGND

3A+THVL

13AGND

4A+THVL

14AGND

5A-THVH

15AGND

6A-THVH

16AGND

7A+THVH

17AGND

8A+THVH

18AGND

9A-80V

19AGND

10A+80V

20AGND

By default, the other 4 high voltage lines are closed except A+80V and A-80V.By mode B, A+THVH has output.By mode C and D, A+THVH and A+THVL have outputs.

Table 2 Description of power supplys LED indicating light

LED indicating light of high-voltage power supply

LED indicating light of analog power supply

LED indicating light of digital power supply

1.2.2 BEM

BEM (Back End Module Board) mainly includes the system core control, date flow channel and PC module, and the signal coprocessor module interface reserved for the expansion. The board consists of two core components, system control core and PC module. System control core constructed by a single EPGA realizes the real-


time control on the ultrasound module of the slave computer, transmission of parameters, uploading channel of ultrasound data and data BUS interface of PC module; PC module is built based on Com-E modules with I/O expansive components, forming the complete founctions of PC. BEM is the main backend digital processing platform and it also contains a FPGA mainly used to manage system clock, configuration and monitor.

The hardware modules of BEM are: FPGA-System Controller, COM Express Block, I/O Device Controller Module, Clock Manage Module, Co-Processor Block, Signal Processor Block.

FPGA- System Controller: it is the real-time system controlling module that constructs the slave computer-ultrasound module with the single FPGA as its core, including the RTC controlling BUS, up and down parameter data BUS, and ultrasound data uploading BUS; the standard PCIE BUS interface is applied for the module and COM-E module; the module also contains the function of large capacity data buffer as the EPGA with plugin of DDR2 and SRAM memory.

COM Express Block: The module forms the PC system based on COM-E modules of TYPE II standards, and it also help to expand the BEM properly to meet the function requirement of system, such as increasing the USB interfaces, drawing out the hard disc interface SATA and supporting various display interfaces (DVI, LVDS, S-VIDEO).

I/O Device Controller Module: The module is built based on the small-scale EPGA, realizing the start and update of FPGA&DSP system process, monitoring and testing of each single board. As the auxiliary functional module of the system, it is connected to PC system through independent channel and communicates with PC by USB interface.

Clock Manage Module: It is clock management module. The system requires the homologous and in-phase clock for TXM and RXM particularly. In this project, BEM board is simply one of the nodes, which receives the system clock of RXM and outputs the clock to each applied module through PLL and CLOCK BUFFER.

Co-Processor Bock: It is reserved for the future expansion of data processing performance and function, in the project, the daughter card is designed to perform the function of co-processor, and the hardware interface for the daughter card of co-processor is designed in the hardware construction of BEM, which introduces the SO-DIMM interface specification to define the related control and data BUS standards.

Signal Processor Block: It is used for ultrasonic signal processing.Connector to back board: It is used for data exchange and connecting

power supply. Refer to for its signal definition.


1

23

4

5 6

7

Figure 6 BEM Schematic Diagram

Table 3 Power Supply Test Point ListTesting points Voltage

VDD_1V0 1.0V10%VDD_1V2 1.2V10%VDD_1V5 1.5V10%VDD_1V8 1.8V10%VDD_2V5 2.5V10%VDD_3V0 3.0V10%VDD_3V3 3.3V10%VDD_3V3SBY 3.3V10%VDD_5V0 5.0V10%VDD_5VSBY 5.0V10%VDD_12V0 12V10%VDD_0V9 0.9V10%VDD_0V9_DSP 0.9V10%MGTAVCC_1V0 1.0V10%MGTAVCC_1V2 1.2V10%

Table 4 LED Light Status Description ListPin No. LED Light DescriptionConfidential document of Landwind & All Right Reserved 13

D1 2V5_LED Always on after the machine boots upD23 DSP_LED Flickering (2HZ) after the configuration of

XC6SLX100 get normal when the machine boots up

D21 V5_LED3 OffD22 V5_LED2 OffD20 V5_LED1 Flickering (1HZ) after the configuration of V5

gets normal when the machine boots upD19 V5_LED0 Always on after the configuration of V5 gets

normal when the machine boots upD10 S5_LED By power on, always on when the machine shuts

down and off when the machine boots upD9 S4_LED By power on, always on when the machine shuts

down and off when the machine boots upD8 S3_LED By power on, always on when the machine shuts

down and off when the machine boots upD7 STATE_LED By power on, always on when the machine shuts

down and off when the machine boots upD17 XC6SLX9_LED Always on after the configuration of XC6SLX9

get normal when the machine boots upD18 V5_LED Always on after the configuration of V5 gets

normal when the machine boots upD25 XC6SLX9_LED1 Flickering (0.5HZ) after the configuration of

XC6SLX9 get normal when the machine boots up

1.2.3 RXM

Rxm (Receiver Board) is designed to receive the ultrasonic echo signal and resolve the useful information in the echo signal to transmit to BEM Board. There are two ways to receive the ultrasonic echo signal: pulse receiving and continuous wave Doppler receiving, and Rxm contains two receiving channels. The route of pulse receiving is echo signalRswitchLNAVCALPFADCReceive Beamformer; The route of continuous wave Doppler receiving echo signalTRswitchLNACW analog BeamformerBPFADCSpectral Doppler Process.1. TR Switch (Transmit Receiver Switch): It is the transmitting and receiving switch, used for insulating the high voltage signal in the transmitting process and depositing the receiving circuit damaged by high voltage signal;2. Signal amplification channel, including LNA (Low Noise Amplifier) used for the first- stage amplification of echo data; VCA (Voltage Control Amplifier), the amplifier with gain variable that can setup proper amplifications for different echo data to compensate the attenuation in the process of signal transmission; LPF (Low Pass Filter): Used for filtering the unwanted signal and prevent the aliasing of ADC transformation.3. Receiver Beamformer (Beamformer module);


4. CW channel: including CW beamformer, BPF (Band Pass Filter), Spectral Doppler Process;5. TGC channel: used for gain control, including DAC, LPF, Beamformer Controller;6. Clock management cell and storage cell;7. Power supply processing cell;8. Connecter to BPM, refer to 9. Connecter to SCM, refer to

1 2 4

3

5

68

7

8

Figure 7 RXM Schematic Diagram

Table 5 Power Supply Testing Point ListTesting Point Voltage Value

A1V5 1.5V10%A1V8 1.8V10%A3V0 3.0V10%A3v3 3.3V10%A4V0 3.4V10%


A5VN, A5VN-1, A5VN-2, A5VN-3, A5VN-4

-5.0V10%

A5VP, A5VP-1, A5VP-2, A5VP-3, A5VP-4

5.0V10%

A6VN -6.0V10%A6VP 6.0V10%C3V3 3.3V10%C5V0 4.2V10%D0V9 /D1V2 1.2V10%D1V8 1.8V10%D2V5 2.5V10%D3V0 3.0V10%D3V3 3.3V10%D5V 5.0V10%PR_GATERX_GATETP11TP12TP13TP14

Table 6 LED Light Status Description ListPin No. LED Lamp DescriptionD194 VAA3V0 By power on, always on when the

machine boots upD195 VDD2V5 By power on, always on when the

machine boots upD199 CFG_DONE Always on after the configuration gets

normal when the machine boots upD200 S6_LED Flickering (2HZ) after the

configuration gets normal when the machine boots up

1.2.4 TXM

Transmission Board (TxM) receives the parameter transmitted by Back End Module Board (BEM) and produces the corresponding high voltage pulse to excite the probe elements. TXM mainly consists of three parts: FPGA, 5 level pulse generating module and interface circuit. TXM system circuit block diagram is showed as below.

1. FPGA mainly receives the control command and parameter of BEM board, reads SRAM and generates the proper delayed transmission control logic. It also indicates the work status of transmission board;2. Used for forming transmitted wave form;


3. BEM transmits the real time parameters like control command and address to TXM through interface circuit and reads the parameters. It is connected to BEM through BPM. Refer to 4. Power supply process module;5. Connector to SCM, refer to ;

2

1

3

4

5

Figure 8 TXM Schematic Diagram

Table 7 Power Supply Testing Point ListTesting Point Voltage

+THVH adjustable Dimmable: 0 ~ +60V+THVL adjustableDimmable: 0 ~ +60V-THVH adjustableDimmable: 0 ~ -60V-THVL adjustable: 0 ~ -60VAVDD1 10V10%AVSS -10V10%DVDD1 10V10%T+12V 12V10%


app:ds:adjustableapp:ds:adjustableapp:ds:adjustableapp:ds:adjustable

T-12V -12V10%VDD_1V2 1.2V10%VDD_2V5 2.5V10%VDD_3V3 3.3V10%VDD_5V0 5.0V10%

Table 8 LED Light Status Description ListPin No. LED Lights DescriptionD1 ERRORD2 TXDONE Always on after the

configuration gets normal when the machine boots up

D3 ACTIVE Flickering (1HZ) on after the configuration gets normal when the machine boots up

D4 MODED261 VDD_2V5 By power on, always on

when the machine boots up

D263 DVDD1 By power on, always on when the machine boots up

D264 AVDD1 By power on, always on when the machine boots up

D265 AVSS By power on, always on when the machine boots up

1.2.5 PCM

Probe Board (PCM) is the probe that is excited by high voltage pulse for receiving the control signal of transmission board. For the project, there are three 2.0 version probe bases and the 4D probe control is the reserved circuit. The main components of PCM system circuit are: high voltage switch, probe bases and board card work information circuit.

High voltage switch sets one of the three probes as the current working probe and transmits the high voltage pulse or CW pulse generated by transmitting board (TXM) to the aviated probe. BEM captures the temperature and ID of PCM board card through I2C bus and 1 line EEPROM as well as the identification code through 1 line BUS.1. Probe base, refer to for pin signal definition;


2. High voltage switch, used for selecting the transmitting and receiving array element;3. Probe identification and board card work information circuit4. Selection circuit of probe change;5. Connector to BPM, refer to 6. Connector to SCM, refer to

1

2

4

6

53

Figure 9 Schematic Diagram of PCM

Table 9 Power Supply Testing Point ListTest point Voltage

AVPN_80V0 -80V10%AVPP_80V0 +80V10%AVP_12V0 12V10%VDD_3V3 3.3V10%VDD_5V0 5.0V10%


Table 10 LED Light Status Description ListPin No. LED light DescriptionLED1 AVPN_80V0 By power on, always onLED2 AVPP_80V0 By power on, always on

1.2.6 SCM

SCM Board mainly provides the electrical connection for TXM, CWTXM, RXM and PCM, mainly including the signal connection, the details of connection is showed as below. Refer to for the of signal allocations definition of connectors for SCM to TXM, CWTXM, RXM and PCM.

Figure 10 Schematic Diagram of SCM


1.2.7 IOE

The height of all interfaces should be exactly the same, which is difficult to realize in one board under current condition, a solution using one horizontal board and one vertical board is applied:

Horizontal board (IOE_A Board): directly covers on the rear cover of machine, used for the low speed interface;

Vertical (IOE_B Board): is mounted on the rear cover of machine vertically, used for the high speed interface;

Horizontal board (IOE_A Board) directly covers on the rear cover of machine, used for the low speed interface. The applicable interfaces are: input and output of S-VIDEO, input and output of VIDEO, input and output of AUDIO, serial interfaces, parallel interfaces, remote printer interface and VGA interface. VIDIO output requires the power amplification circuit that drivers the external loudspeaker; serial interfaces and parallel interfaces circuit require the corresponding chip to convert to the USB interface. For current version, VGA interface is the virtual without realizing the specific functions.

1 2 3 4 5

6 7

8

Figure 11 IOE-A Diagram

Table 11 Connector ListName Pin No. Connection

DescriptionRemark

1. Audio Connecter

J2, J3 1 AUDIO LEFT2 GND3 AUDIO RIGHT

J2 is audio outputJ3 is audio input

2. -VIDEO J10, J11 1 TV OUT2,3,4 GND

J10 is Video outputJ11 is Video input

3. IDEO J8, J9 1,2 GND3 C

J8 is S-video outputJ9 is S-video input


4 Y4. S232 J1 1 DCD#

2 RXD3 TXD4 DTR#5 GND6 DSR#7 RTS#8 CTS#9 RI#

5. GA J12 / VGA output is not realized

6. Parallel Interface

J5 1 STB#2~9 D0~D710 ACK#11 BUSY12 PEMP13 SLCT14 AFD#15 ERR#16 INI#17 SIN#18~25 GND

7. Remote printer interface

J4 1 REMOTE_P2,4 REMOTE_N3,5,6

8. BPM signal interface

J81 Refer to

Located on the back side of PCB

Table 12 Testing Point ListTesting point Voltage

TP1 AUDIO RIGHTTP2 AUDIO LEFTTP3 RS232-RXDTP4 RS232-TXDTP5 PAR ERR#TP6 PAR BUSY

Table 13 LED Light Status Description ListPin No. LED Description LED1 RS232 CBUS1LED2 RS232 CBUS0LED3 VDD5V0 By power on, always on

when the machine boots up.

LED4 VDD3V3 By power on, always on when the machine boots


up.LED5 D+12V By power on, always on


Vertical (IOE_B Board): is mounted on the rear cover of machine vertically, used for the high speed interface and the applicable interfaces are USB interfaces, DVI-I Interface and Ethernet interface. The four USB interfaces adopt the double USB interface, which is designed to save space and provide the interface for USD footswitch; DVI-I interface is converted to provide to display. Ethernet interface supinterfaces the GB interface.

1 2 3 4

56

Figure 12 IOE-B Schematic Diagram

Table 14 Connecter ListName Pin No. Connection

DescriptionRemark

1. Double USB A interface

J9, J10 1 +5V2 USB D-3 USB D+4,8 GND5 +5V6 USB D-7 USB D+

Used for external interface

2. Interface J3 1 CTREF2 MD1+3 MD1-4 MD2+5 MD2-6 MD3+7 MD3-8 MD4+9 MD4-10 GND11 LINK#12 3V3


13 LINK#14 ACT#

3. DVI Interface J8 1 TX_N22 TX_P26 DDC_CLK7 DDC_DAT9 TX_N110 TX_P114 +5V15 GND16 HOT Plug17 TX_N018 TX_P023 TXC_N24 TXC_P3,11,19,22 GND

4. VGA J2 / VGA input, not implemented

5. Double USB A Interface

J11, J12 1 +5V2 USB D-3 USB D+48 GND5 +5V6 USB D-7 USB D+

Used for the machine internally.

6. Connector to BPM

J82 Refer to

Table 15 Testing Point ListTesting Point Voltage

TP1 J3.11 LINK#TP2 J3.14 ACT#

Table 16 LED Light Status Description ListPin No. LED Light DescriptionLED2 DVI HOT PLUG If DVI equipments is

connected, LED light onLED3 LINK100# If the 100M Ethernet is

accessed, LED light onLED4 LINK1000# If the Gigabit Ethernet is

accessed, LED light onLED5 VDD_5V0 By power on, always on


LED6 VDD_3V3 By power on, always on when the machine boots up.


1.2.8 KEY Board

In the project (PR_V2), the control panel has 4 PCBs:1. KB_top : Key board top board;2. KB Usb_core : Key board core board;3. KB Tgc : Key board TGC board;4. KB Usb_led : Key board LED light;5. Trace ball

The control panel includes a standard PC key board (special one for note book), a trace ball, a special key board for ultrasonic instrument that contains the function keys, encoder and TGC, and the LED light for indicating the keys status. Control panel is connected to BPM with USB and power line.

Figure 13 Control panel connection diagram


3

12

5

4

6

7 8 9

10

11

12 13

Figure 14 Key board schematic diagramTable 17 Connector list

Name Pin No. Description Remark1. TGC connector

KB top J14KBTGC J1

1,3 D5V2,5,9,13,17 GND4,6,8,10,12,14,16,18 TGC8~17 AD REF11 5VSBY15 ATX_PSON_N

2. Standard key board connector

KB top J11

1~15 K_R_IN0 ~ K_R_IN1516~24 KEY_LINE0 ~ KEY_LINE7

3. Connector to BPM, power supply

KB top J13

1,5,7,8,12 GND2,3,4 D+5V6 D+5VSB9 ATX_PSON_ON10 REMOTE_P11 REMOTE_N

4. connector to BPM USB-B

KB top J17

1 USB_VBUS2 USB_DN2


3 USB_DP24 GND

5. Connector to trace ball

KB top J18

1 D5V2 PS2_DATA3 PS2_CLK4 GND

6. Connector to the key board core

KB top J15

Refer to

7. Connector to BPM USB-B

KB TGC J2 1 USB_VBUS2 USB_DN23 USB_DP24 GND

8. USB-A, external interface

KB TGC J1 1 USB_VBUS2 USB_DN23 USB_DP24 GND

Table 18 Testing Point ListTesting Point Voltage

KB TOP - TP1 J15 PIN13KB TOP - TP2 J15 PIN15

Table 19 LED Light Status description listPin No. LED Light DescriptionKB USB CORE D1 VDD3V3 By power on, always on


KB USB CORE D2 VCC5V0 By power on, always on when the machine boots up.

KB USB CORE D3 FPGA LED USB is connected, normal operation status, always on

KB TOP D1 VCC5V0 By power on, always on when the machine boots up.

KB TOP D2 VDD3V3 By power on, always on when the machine boots up.


Chapter II Disassembling Drawings

2.1 Explosive View of Machine

Figure 2.1 Explosive view of machine

1 Front cover assembly

2 Mainframe box assembly

3 Left cover assembly

4 Rack frame

5 Display and rocker arm assembly

6 Key board assembly

7 Top cover assembly

8 Back cover


9 Right cover assembly

10

Isolation transformer assembly

11

Base Cover

2.2 Disassembling Back Cover

1. Disassemble 6 pieces of M4*12 screws used for fixing the back cover.2. Take down the back cover.

Figure 2.2 Disassembling the back cover


2.3 Disassembling Left and Right Covers

1. Carry out the steps in 2.2 (1~2).2. Disassemble 6 pieces of M4*12 screws used for fixing the right cover.3. Take down the right cover.4. Disassemble 6 pieces of M4*12 screws used for fixing the left cover.5. Take down the left cover.

Figure 2.3 Disassembling left and right covers

2.4 Disassembling Front Cover

1. Carry out the steps in 2.3 (1~5).


2. Disassemble 8 pieces of M4*12 screws used for fixing the front cover.3. Take down the front cover.

Figure 2.4 Disassembling Front Cover


2.5 Disassembling Displayer Assembly

1. Disassemble 4 pieces of M4*12 screws used for fixing the displayer assembly.2. Pull up the power line, DVI line and Audio line.3. Remove the displayer assembly.

Figure 2.5 Disassembling the display assembly


2.6. Disassembling Rocker Arm Assembly

1. Take down 6 pieces plugs from the upper cover of rocker arm and 6 pieces of M3*10 screws.2. Disassemble lower cover of lower rocker arm, side cover of lower rocker arm, upper cover of lower rocker arm.3. Take down two link block plugs of rocker arm and 2 pieces of M3*12 screws4. Disassemble link block cover of rocker arm.

Figure 2.6-1 Disassembling the rocker arm assembly 1

5. Take down 4 pieces of M3*10 screws.6. Disassemble upper cover of upper rocker arm, side cover of upper rocker

arm, upper cover of upper rocker arm.



7. Pull up the power line, DVI line and Audio line.8. Take down one 4*10 set screw (hexagonal). Just unscrewing is ok.9. Disassemble rocker arm assembly.



2.7. Disassembling Key Board

1. Take down 8 pieces of M4*12 screws and 2 pieces of M3*8 screws2. Take down the insertion end of ground wire and pull up the USB wire of key board and signal line of BPM to Kbtop.3. Disassemble keyboard assembly.

Figure 2.7-1 Disassembling Key Board

4. Take down 8 pieces coder caps and 8 pieces of TGC caps (if TGC Board is not intended to disassemble, TGC cap is not required to disassemble).


Figure 2.7-2 Disassemble coder cap and TGC cap

5. Take down the 23 pieces of ST2.9*8 self-tapping screws and 2 pieces of M3*8 screws.6. Remove the silica gel keys and keyboard.


Figure 2.7-3 Disassembling Key Board

2.8 Disassembling Trace Ball

1. Carry out steps 2.7 (1-3)2. Pull up the link wire of track ball and take down 4 pieces of M3*8 screws.3. Disassemble trace ball.


Figure 2.8 Disassembling trace ball, TGC and USB port board

2.9 Disassembling TGC Board

1. Carry out steps 2.7 (1-4), the encoder cap does not take down.2. Pull up the connection wire of TGC Board.3. Take down 4 pieces of M3*8 screws.4. Remove the silica gel keys and TGC board (showed as in Figure 2.8).

2.10 Disassembling USB Interface Board

1. Carry out steps 2.7 (1-3)2. Take down 4 pieces of M3*8 screws.3. Pull up the connection wire and remove of USB interface board.

2.11 Disassembling Standard Keyboard

1. Carry out steps 2.7 (1-3)2. Take down 8 pieces of M3*8 screws.3. Pull up the connection wire and remove the pressing plate on PC keyboard.4. Disassemble the standard keyboard.


Figure 2.11 Disassembling Standard Keyboard

2.12 Disassembling External Interface Board

1. Carry out steps 2.3 (1~5)2. Pull up all the wires of external interfaces.3. Take down 6pieces of M4*12 screws and remove external interface board assembly.

Figure 2.12-disassembling external port board and fan assembly

4. Take down 6 pieces of M3*8 screws.5. Disassemble IOE-B board and IOE-A board.


Figure 2.12-2 Disassemble PCB of external port board

2.13. Disassembling the Fans of Main Body

1. Carry out steps 2.3 (1~5).2. Pull up connection wires of fan and take down 4 pieces of M4*12 screws (showed as in 2.12-1).3. Remove the fan assembly of main body.

Figure 2.13 Disassemble fan4. Take down 8 pieces of M5*10 self-tapping screws.5. Remove fans

2.14 Disassembling Mainframe Box Module

1. Carry out steps 2.4 (1~3), 2.12 (1~3), 2.13 (1~3).2. Take down 4 pieces of M6*16 socket head cap screws (including spring washers and flat gaskets) for fixing the mainframe box module.3. Pull up all the connecting wires and disassemble the mainframe box module.


Figure 2.14 Disassemble mainframe box module

2.15 Disassembling Power Supply

1. Carry out steps 2.3 (1~5).2. Take down 4 pieces of M4*12 screws for fixing power suppy.3. Pull up all the connecting wires on the back of the power supply of mainframe box, drag out the connecting wire of transformer on the front and pull up.4. Remove the power supply of mainframe box.


Figure 2.15 Disassemble power supply

2.16 Disassembling Hard Disk

1. Carry out 2.12 (1~3) and 2.13 (2~3).2. Pull up data link and power line of hard disk.3. Take down 4 pieces of M3*8 screws for fixing the hard disk and remove the hard disk assembly.

Figure 2.16-1 Disassemble hard disk 14. Take down 4 pieces of hard disc screws.5. Draw out hard disc from the side.


Figure 2.16-2 Disassemble hard disk 2

2.17 Disassembling Analog Signal Board

1. Carry out 2.3 (1~3).2. Take down six pieces of 3*8 screws for connecting the shield cover module.3. Disassemble shield cover module.

Figure 2.17-1 Disassembling analog signal board 1

4. Take down 2 pieces of 3*8 screws for fixing analog signal board.5. Open the upper and lower wrenches on analog signal board.6. Drag out analog signal board.


Analog signal wrench


7. Take down 4 pieces of M3*8 screws and remove analog signal board.


2.18 Disassembling BEM Board

1. Carry out steps 2.17 (1~3).2. Pull the PC handle and drag out the BEM board.


PC handle

Figure 2.18 Disassembling BEM board

2.19 Disassembling RXM and TXM

1. Carry out steps 2.17 (1~6).2. Pull the PC handle and drag out the TXM board.3. Pull the PC handle and drag out the RXM board.

Figure 2.19 Disassembling RXM and TXM


2.20 (PCM) Disassembling PCM Board

1. Carry out steps 2.14 (1~2) and carry out steps 2.17 (1~6).2. Drag out the mainframe box (for about 50mm) and pull up the connecting wires.3. Take down 12 pieces of 3*6 screws for fixing PCM board assembly.4. Remove PCM board assembly.

Figure 2.20-1 Disassembling PCM Board (PCM) 1

7. Take down 8 pieces of M3*8 screws and remove PCM Board.

Figure 2.20-2 Disassembling PCM (PCM) 2


2.21 Disassembling Fans of Mainframe Box

1. Carry out steps 2.14 (1~3).2. Take down 4 pieces of M3*30 screws for fixing the fans (for each fan, there are 4 pieces of screws for fixing).3. Remove fans

Figure 2.21 Disassembling Fans of Mainframe Box

2.22. Disassembling CD Diver

1. Carry out steps 2.142.3 (1,4~5).2. Take down 2 pieces of M4*12 screws for fixing the CD driver.3. Pull up the connecting wires and disassemble the CD driver assembly.4. Take down 4 pieces of M3*6 screws on the back side of CD driver assembly.5. Draw out CD driver.


Figure 2.22 Disassembling CD Dive

2.23 Disassembling Power Supply Interface

Board Assembly

1. Take down 5 pieces of M3*8 screws for fixing the power supply interface board.2. Pull up connecting wire and remove the power supply interface board assembly.


Figure 2.23 Disassembling Power Supply Port Board Assembly

2.24 Disassembling Isolation Transformer

Assembly

1. Carry out steps 2.23.2. Pull up the connecting wire of isolation transformer.3. Take down 4 pieces of M4*12 combined screws.4. Lift the handle to lower down the right (according to the machine) of transformer firstly, and them carry out the same on the other side of the machine.5. Pull up the connecting wire to power supply and drag out isolation transformer assembly.

Figure 2.24-1 Disassembling Isolation Transformer Assembly 1

5. Take down 4 pieces of M6*16 socket head cap screws, spring washers and flat gaskets.6. Remove isolation transformer.


Lift the handle on the side and lower down the transformer

And then lift the handle on this side to lower down the transformer.

Figure 2.24-2 Disassembling Isolation Transformer Assembly 2

2.25 Disassembling Caster

1. Lean or lift the rack2. Loose the screws of caster with wrench.3. Take down caster (the same for the other three).

Figure 2.25 Disassembling Caster


Chapter III: Usual Trouble and Troubles

shootings

The following data should be recorded when there are any errors and other faults.1. Using conditions: power supply, socket status (and ground protection status), connection cable, environmental pollution level, equipments connected to the instrument and ambient temperature.2. If there is any fault for the above: the working status or status changes of the instruments when the power is on or when it is in working process;3. Taking photos for the external fault phenomenon that can not be described by words;4. Saving the documents "pearl_river\Project\ColorUltrsound\Release\Log.txt under soft catalogue to U Disk;5. Check the fan (free rotated blade), cable connector (whether it is heated), junction point of connecting wire and instrument (damaged), stability of all the connecting parts of instrument and the condition of joints (whether there is the carbon deposition, oxidizing material, crack and defective capsulation of cable and others).


3.1 Core Box Fault Removal

No Fault Possible cause Fault Removal1 The probe

can not be identified and there is no image.

1. Check if the version number is correct, if not, it may be caused by the incorrect version and unusual working status of FPGA. (Operation status of FPGA can be checked with observing the flickering light on the board card).

The version is not correct, please update.

2 The probe can be indentified but there is no image and the parameter can not be adjusted.

1. Check if the version number is correct. If not, it may be caused by the incorrect version and incorrect installation of PCIE driver.2. If the version is right, the image data can not be uploaded, which may be caused by the malfunction of uploading channel between RXM and BEM, and can be checked with testing jugs or changing board card.

1. The version is not correct, please update.2. Change board card.

3 The probe can be indentified but there is no initial pulse for image.

1. Adjust transmitting power and check the noise of probe whether it has obvious change, if yes, it may be the problem of receiving; and then check whether the connection of SCM board and analogy power supply of receiving board is normal;2. If the noise of probe has no obvious change, it is the problem of transmitting, and then check whether the high voltage power supply is normal and the operation of transmitting board is normal.

1. Re-insert the SCM board or check power supply according to table 2;2. Switch to C mode and check if there is the initial pulse. If yes, it should be the problem of high voltage, if no, check power supply according to table 2;

4 Automatically switch on by power on.

1. In BIOS, After Power Failure under the option of Power in settings configuration is Disable.2. Check if the battery of BEM Board is dead.

1. BIOS; Reset the BIOS.2. Change the battery.

5 Slowly starting up

1. System problem;2. The connection of the peripherals is error, such as the

1. Reinsert the sata wire of CD driver and connecting wire of key board.


USB, CD driver and key board. 2. Re-install system6 Blackening of

image1. The problem of receiving channel, which can be solved by RXM;2. The problem of problem, which can be solved by changing the probe.3. The problem of match between the plug and connector of probe, which can be checked by shaking the probe to see the blackening to disappear or change; it can be solved by change the probe.

1. Change probe firstly2. If the problem can not be solved, change RXM board.

3.2 LCB Fault Removal

If the screen has image during the process of starting up and it has no image after the machine enters the system, it is the problem caused by that the system supports the double-screen display and the display default setting is not correct, which can be solved by change-over with ALT+F4 of standard keyboard.

If the system boots up normally, the screen has abnormal image or even no image, please check according to the following steps;


3.3 Keyboard Fault Removal

If the keyboard can not be programmed, check the power supply of keyboard; if the keyboard operates abnormally after burned, check if the programming is successful or U1 and U7 is poorly soldered.

If there is abnormal during operation, check as the following steps:


3.4 External Interface Fault Removal

The problems of external interface are often caused by system settings and driver installation. If there is any problem, check the setting and driver program. If the problems still exist after the above is eliminated, check the hard ware related to BPM, BEM, wires and two IOE board. Generally, the problem can be determined by changing board card.

3.5 Other fault removal

No. Faults Possible Causes Trouble Removal1 Fan do not

work. Abnormal of +12V power

supply Cable fault Fan fault

1. Test the voltage and change the fan if voltage is normal;2. Otherwise, change the power supply.

2 By power on and switching off, the machine automatically switches on at certain time.

The setting of BIOS is not correct or BEM Boards battery is dead, which cause the BIOS can not save.

1. In BIOS, the PME Wake-UP under the option Power in settings configuration should be reset as Disable.2. Change battery


3 No response of key board after starting up.

1. Check the work status of USBCORE Board, wherein, it is the normal work if the three blue lamps light on by power on; two blue lamps light on indicates that USBCORE Board is loose or is not inserted; if there is no lamp lighting on, USBCORE Board is affected with short circuit, it should switch off the electricity;2. Ststem does not detect the key board3. Check if the cable conneting the keyboard to BPM Board is loose;4. Check if the program burning or upgrading of key board is error, and re-burn the keyboard.

1. Check USBCORE Board and re-insert if necessary.2. Restart equipment.3. Re-insert cable;4. Re-burn the keyboard board.

4 The color key is not workable.

1. The voltage of DDR2 for dealing with color is abnormal;

1. Check if R545 and R546 of BEM is normal.

5 Displayer has no image.

1. Displayer has image during the BIOS stage, and has no image after entering the system. It is required to switch over the display interface.2. If the displayer has no image since starting, check whether the system starts (Press Caps or Num key on the externally connected USB keyboard and check if the LED on the keyboard lights on). If COME does not starts, it may be the problem of COME, otherwise, check the displayer, power supply wire, DVI wire and DVI interface.

1. Switch over the display with CTRL+ALT+F4;2. Check the displayer, power supply wire, DVI wire and DVI interface.

6 Keyboard is not workable and track ball performs well.

1. Only one of the two USB interface (J3&J10) has installed the driver WINDRIVER USB;2. System has no response and does not detect the keyboard;3. Check if the cable is loose.

1. Inter-change the position of J3 and J10;2. Restart the equipment; 3. Check if the cable on BPM is loose.

7 Stuck key of track ball

The dirty on the edge of trace ball causes he stuck key.

Clear the edge of trace bal by brush.


Chapter I Overview of System1.1 Overall Structure of System1.2 Classification and Functions of Unit Board1.2.1 BPM1.2.2 BEM1.2.3 RXM1.2.4 TXM1.2.5 PCM1.2.6 SCM1.2.7 IOE1.2.8 KEY Board

Chapter II Disassembling Drawings2.1 Explosive View of Machine2.2 Disassembling Back Cover2.3 Disassembling Left and Right Covers2.4 Disassembling Front Cover2.5 Disassembling Displayer Assembly2.6. Disassembling Rocker Arm Assembly2.7. Disassembling Key Board2.8 Disassembling Trace Ball2.9 Disassembling TGC Board2.10 Disassembling USB Interface Board2.11 Disassembling Standard Keyboard2.12 Disassembling External Interface Board2.13. Disassembling the Fans of Main Body2.14 Disassembling Mainframe Box Module2.15 Disassembling Power Supply2.16 Disassembling Hard Disk2.17 Disassembling Analog Signal Board2.18 Disassembling BEM Board2.19 Disassembling RXM and TXM2.20 (PCM) Disassembling PCM Board2.21 Disassembling Fans of Mainframe Box2.22. Disassembling CD Diver2.23 Disassembling Power Supply Interface Board Assembly2.24 Disassembling Isolation Transformer Assembly2.25 Disassembling Caster

Chapter III: Usual Trouble and Troubles shootings3.1 Core Box Fault Removal3.2 LCB Fault Removal3.3 Keyboard Fault Removal3.4 External Interface Fault Removal3.5 Other fault removal

LWMIRROR2 3.0-H-004[A0]MIRROR2 3.0

Documents

Transcript of LWMIRROR2 3.0-H-004[A0]MIRROR2 3.0