Low Power CMOS Dr. Lynn Fuller - RIT - People · © April 19, 2019 Dr. Lynn Fuller Low Power CMOS...

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© April 19, 2019 Dr. Lynn Fuller Low Power CMOS Page 1 Rochester Institute of Technology Microelectronic Engineering ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Low Power CMOS Dr. Lynn Fuller Webpage: http://people.rit.edu/lffeee Microelectronic Engineering Rochester Institute of Technology 82 Lomb Memorial Drive Rochester, NY 14623-5604 Email: [email protected] Department webpage: http://www.rit.eduu/kgcoe/microelectronic/ 4-19-2019 LowPowerCMOS.ppt

Transcript of Low Power CMOS Dr. Lynn Fuller - RIT - People · © April 19, 2019 Dr. Lynn Fuller Low Power CMOS...

Page 1: Low Power CMOS Dr. Lynn Fuller - RIT - People · © April 19, 2019 Dr. Lynn Fuller Low Power CMOS Page 1 Rochester Institute of Technology Microelectronic Engineering ROCHESTER INSTITUTE

© April 19, 2019 Dr. Lynn Fuller

Low Power CMOS

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Rochester Institute of Technology

Microelectronic Engineering

ROCHESTER INSTITUTE OF TECHNOLOGYMICROELECTRONIC ENGINEERING

Low Power CMOS

Dr. Lynn FullerWebpage: http://people.rit.edu/lffeee

Microelectronic EngineeringRochester Institute of Technology

82 Lomb Memorial DriveRochester, NY 14623-5604

Email: [email protected] webpage: http://www.rit.eduu/kgcoe/microelectronic/

4-19-2019 LowPowerCMOS.ppt

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ADOBE PRESENTER

This PowerPoint module has been published using Adobe Presenter. Please click on the Notes tab in the left panel to read the instructors comments for each slide. Manually advance the slide by clicking on the play arrow or pressing the page down key.

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INTRODUCTION

CMOS is suppose to be low power because CMOS gates only draw current from the supply during switching. In steady state High or Low CMOS gates do not draw power (almost zero). This document will investigate Energy and Power used by a complex CMOS integrated circuit and propose methods for reducing power consumed by the circuit.

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INTRODUCTION

What is a complex integrated circuit.

Answer: A big chip with many small transistors on it. The biggest chips could be as large as 1” by 1” and the small transistors could be 20nm gate lengths or smaller.

Chip Area is: 1”x1” or 25.4mm x 24.5mm = 645 mm2

Transistor size is : L=20nm and W = several times larger, plus room for drain and source, contact cuts and metal. This might be around 100nm x 100nm = 10,000 nm2

A complex chip could have as many as #N transistors based on area:#N = Chip Area / Transistor Area#N = 645 mm2 / 10,000 nm2 = 645x1E12/10,000

= 64.5 Billion Transistors!!

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INTRODUCTION

Transistor count for selected microcontrollers.

Name #’s of Transistors Date Design Size Area

“Transistor Count" Wikipedia: The Free Encyclopedia.

Wikimedia Foundation, Inc., Web. 25 April 2017.

https://en.wikipedia.org/wiki/Transistor_count

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CMOS INVERTER CURRENT DURING TRANSITION

Imax =70uA

Vout

Vin

Imin =0uA

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POWER MEASUREMENTS

Power consumed by a micro circuit can be easily measured.

Power = I V just measure I and V (while chip is operating)

To compare chips of different sizes we can use power density.

Power Density = Power / Chip Area

Example: 5 volts, 10 amps, chip area = 1cm x 1cm

P = 50 watts

Power Density = 50 w/cm2 Very Hot!!

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COOLING MICROCHIPS

Why is one chip cooled

and not the others.

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POWER DENSITY TRENDS

CMOS is suppose to be low power. Power density surpassed hot-plate at 0.5um technology node. Today we are way past the

power density of a nuclear reactor.

Fred Pollack, Intel

1000

100

10

1

Watt

s/cm

2

1.5u 1u 0.7u 0.5u 0.35u 0.25u 0.1u 0.13u 0.1u 0.07u

Hot PlatePentium III

Pentium II

Pentium Pro

Pentium

i486

Nuclear Reactor

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WE DEMAND HIGH SPEED COMPLEX CHIPS

CMOS running at high speed with millions of active gates is needed to provide capabilities we demand:

Java interpreterText/Graphics processingSpeech recognitionVideo decompressionProtocolsEncryptionHandwriting recognitionGamesmore…..

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COOLING MICROCHIPS

Chip Cooling is Expensive

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POWER USED BY A CMOS INVERTER

How Do we get to such high power densities? CMOS is suppose to be low power because CMOS gates only draw current during switching. Lets investigate a CMOS inverter first and maybe we can apply what we learn to more complex integrated circuits.

First Review:Power (electrical) P = I V (watts)Power Density P = P / Area (watts/cm2)Energy W = Power x Time (watt-seconds, joules)Charge storage in a battery Q = I t (amp-hours)

note: battery voltage is known so Energy W = V Q

Example: CR2032 (3 volt battery is rated at 200 mA-hr)it can deliver 720 coulombs of charge or 2160 joules of energy

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POWER FOR INVERTER TRANSITION

V+

VinVout

C

Q = CV

I = Q/t = CV/t

P = IV

P = CV2/tVout

t

+V

0

Vin

t

+V

0

I

t

Imax

0

Each low to high transition is accompanied by a pulse of current from the V+ supply.

Assume no current from V+ to ground when both transistors are on during switching. (current only to charge C)

I

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SPICE OF INVERTER FOR PULSED INPUT

Zoom in of output Transition

waveforms on next page

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SPICE OF INVERTER FOR PULSED INPUT

Because there are internal capacitors connected from gate to drain (input to output) we see some spikes from capacitive feed through.

We also see the voltage and current during the transition of the output.

Lets find the average current per transition.

Feed through

Feed through

Output High to Low

Output Low to High

Transition Iave

Vin Vout

Iload

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SPICE OF INVERTER FOR PULSED INPUT

Current from power supply during the low to high transition is Iave = 1/t integral of i(t) dtIave here ~ 50uA

Current to the load capacitor Iave= ~ 10uA

and should equal CV/t=0.48fF 2.5/120ps=10uA

Difference is current through both transistors during switching ~40uA

Isupply

Iload

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MATCHING RISE AND FALL TIME IS GOOD

Wpmos = 1.25 x WnmostdLTH = 604ps

tdHTL = 652psGate delay is the time to get to 50% of the final value.

I in C1

Vout

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CURRENT COMPONENTS FOR CMOS INVERTER

The current flows from the V+ to the capacitive load during the low to high transition, tLTH. That current is CV/tLTH.

Current also flows from V+ through the PMOS and NMOS during switching when both transistors are on.

Current also leaks through the reverse biased drain and source junctions to the substrate plus gate leakage. (assume small compared to the two currents above)

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TOTAL POWER

Supply Iave per transition = IavePower per transition = Iave x V+ Load Capacitance = CPower to load only = C V2 / tLTHClock frequency = fTransitions/sec = some ?% of possible transitionsNumber of gates = thousands or millions

Total Power = combination of above

Total Power = Iave x V x f x tLTH x ?% x N

Power to charge load capacitance only= C V2 / tLTH x f x tLTH x ?% x N

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EXAMPLE POWER CALCULATION

Example for 2um technology: Assume rise and fall time are matched thus Iload will be matched and = 100uA. Iave from supply is 300uA per transition. Assume V+ = 3 volts, Load C = 0.028pF, clock f = 1Mhz, Transitions = 20% of clock, tLTH = 600ps, Number of gates N = 20 million

Total Power = Iave x V x f x tLTH x 20% x N

= 300u x 3 x 1M x 600p x 20% x 20E6 = 2.16 watts

Power to charge load capacitance only= C V2 / tLTH x f x tLTH x ?% x N

= 0.028p x 9 x 1M x 20% x 20 million = 1.01 watts

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SUMMARY

Power is an important design criteria1. Reduce Vdd

(at 28nm node Vdd ~0.5 volts)2. Lower clock speed

(not always possible)3. Reduce transistor size4. Minimize capacitances5. Optimize and minimize gate delays6. Use dynamic logic where appropriate

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CMOS DOMINO LOGIC EVOLUTION

+V

VOVA

VB

precharge

VA

+V

VO

VB

evaluate

VA

+V

VO

VB

CLKCMOS

Dynamic Domino

YEARS

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CMOS DOMINO LOGIC

VA

VB

VC

VOUT

CLK

+V

DOMINO Logic

NMOS

complex

Domino Logic gates require a clock. High output is easy to obtain since the upper transistor will be on when the clock is off. If the output is suppose to be low it is only low during the clock pulse when the lower transistor is on (dynamic logic).

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CMOS DOMINO LOGIC

When the clock is low Vout is precharged high. When the clock is high Vout is valid.

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STATIC CMOS NOR-2

When the clock is low Vout is precharged high. When the clock is high Vout is valid.

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REFERENCES

1. Microelectronic Circuits, Sedra and Smith, 7th edition.

2. More

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HOMEWORK – LOW POWER CMOS

1. If some gates used dynamic logic techniques it might be possible to reduce power by reducing current. Investigate and compare static CMOS gate versus dynamic logic gate for power.

2. Compare power for 2um technology with power for 200nm technology. Assume same number of gates. Show an example approximate calculation.