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Transcript of Lecture01 IC Technology
7/31/2014
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Integrated Circuit Technology(Course Code: EE652)
Lecture 1: Introduction
Indian Institute of Technology Jodhpur, Year 2014‐2015
Course Instructor: Dr. Shree Prakash Tiwari
Email: [email protected]
Office: 3102, Phone: 0291‐244‐9096
Webpage: http://home.iitj.ac.in/~sptiwari/Course related documents will be uploaded on http://home.iitj.ac.in/~sptiwari/IC_Technology/
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Note: The information provided in the slides are taken mainly form two text books of VLSI Design(Jan M. Rabaey, .. & Neil H. Weste, …) other resources from internet, for teaching/academic use only
Course Introduction• “Introduction to Electronics” was to provide an overall
flavor of electronics.
• Microelectronics‐I was the next electronics course to id i d th d t di f l t i i itprovide an in‐depth understanding of electronic circuit
design and analysis.
• A good understanding of Physics of electronic devices and CMOS is required
• “Integrated Circuit Technology” course is designed for ICT PG students and some Final Year UG students to providePG students and some Final Year UG students to provide them a flavor of basics of Technology associated with fabrication of devices and integrated circuits.
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What is this course all about?Course Objectives:• Understanding of the fabrication methods and unit processes for device and circuit fabrication and issues in current ULSIand issues in current ULSI – Unit Processes– Emerging CMOS technologies
• Learning the scientific principles associated with the technologies used in VLSI fabrication.
• Exposure to the processing for newer t h l itechnologies
• Outcome:Understanding of fabrication processes and technology associated with it
BooksText Books:
• James D Plummer, Michael D Deal, Peter B. Griffin, Silicon VLSI Technology‐ Fundamentals, Practice And Modelling, Pearson (2009)(2009)
• S.M.Sze, VLSI Technology, Tata McGraw‐Hill, 2003.
• Stephen Campbell, The Science and Engineering of Microelectronics Fabrication, Oxford University Press, 1996
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EvaluationTheory
• Midterm Exam 1 15%
d• Midterm Exam 2 15%
• Final Exam 40%
• Lab/Assignment 30%
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Introduction
Co‐recipient of Nobel prizein physics in 2000
First Point contact Transistor (1947 Bell
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Bardeen, Brattain, and Shockley (Seated) @ Bell Laboratories, 1948. The Nobel prize was given in 1956.
Transistor (1947, Bell Labs) with Germanium semiconductor, and two gold contacts separated by 50 micron.
First IC, Developed independently byJ. Kilby (Texas Instruments) andR. Noyce, J. Hoerni (FairchildSemiconductor), 1958.
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Evolution of Electronic Devices
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The First Computer
Mechanical computer
The BabbageDifference Engine
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Difference Engine(1832)
25,000 partscost: £17,470
Digital Integrated Circuits, 2nd Ed., Rabaey.
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The first electronic computer (1946)18000 Vacuum tubes, 80 feet long computer
9Digital Integrated Circuits, 2nd Ed., Rabaey.
1959: Planar Technology
• Developed at Fairchild Semiconductor
• Planar Technology (Jean gy (Hoerni): base region is diffused into collector (substrate) and emitter region into the base
• Integrated Wiring (Robert Noyce): By covering the planarNoyce): By covering the planar transistor with an oxide, a layer of aluminum can be used on top to wire the device(s)
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1961: First Commercial Planar ICs
• Based on the planar process by Hoerni and Noyce, Fairchild developed family of logic chips p y g pcalled resistors‐transistor logic(RTL)
• Example shown is flip flop with 4 bipolar transistors and five
i tresistors
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The First Integrated Circuits
Bipolar logic1960’s
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ECL 3-input GateMotorola 1966
Digital Integrated Circuits, 2nd Ed., Rabaey.
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Intel 4004 Micro‐Processor
19711000 t i t1000 transistors1 MHz operation
13Digital Integrated Circuits, 2nd Ed., Rabaey.
Intel Pentium (IV) microprocessor
14Digital Integrated Circuits, 2nd Ed., Rabaey.
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From 4 Transistors to 300‐mm WafersBatch Fabrication
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Introduction
• ICs are the basic block of electronic device design.
• They contain many transistors on one chip.
• First half of 20th century ruled by vacuum tubes.
• The magical PN junction ‐ 1939
• Transistor – 1947, BJT – 1949, TTL – 1962,
• PMOS – 60’s, NMOS – 70’s,
• CMOS – 80’s surviving until nowadays.
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Integrated Circuits
22 nm CMOS
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Evolution of VLSI
Generation Year Transistors
Small Scale Integration (SSI) 1967 1~100Small Scale Integration (SSI) 1967 1 100
Medium Scale Integration (MSI) 1967 100~1000
Large Scale Integration (LSI) 1972 1000~10000
Very Large Scale Integration (VLSI) 1978 10000~……..
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Moore’s Law
In 1965 Gordon Moore noted that theIn 1965, Gordon Moore noted that the number of transistors on a chip doubled every 18 to 24 months.
He made a prediction that semiconductor h l ll d bl ff
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technology will double its effectiveness every 18 months
Moore’s Law
1,000,000K 1 Billion Transistors 1 Billion Transistors
!!!!!!
100,000
10,000
1,000
10
100
8086
80286i386
i486Pentium®
Pentium® ProPentium® II
Pentium® III
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11975 1980 1985 1990 1995 2000 2005 2010
8086Source: IntelSource: Intel
ProjectedProjected
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Transistors on Lead Microprocessors double every 2 years
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The Ever Shrinking Transistor
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Using 45 nm technology, ≈ 400 transistors fit on a red blood cell!
Design Hierarchy
SYSTEM
+
CIRCUIT
GATE
MODULE
n+n+S
GD
DEVICE
CIRCUIT
22Digital Integrated Circuits, 2nd Ed., Rabaey.
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Advantages of CMOS
• Very low power consumption.
R il t il lt• Rail‐to‐rail voltage.
• Modular design.
• Reliable and robust.
Choice of the industry!
Intel 4004Intel Pentium 4
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Complementary MOS Transistors (CMOS)
• Fabricate PMOS and NMOS devices on the same substrate to build complementary MOS (CMOS)
• This is solved by using a p‐tub diffusion to create the background for the n‐channel devices
p
VDD
n
GND
A Y = A'
[Adapted from http://infopad.eecs.berkeley.edu/~icdesign/. Copyright 1996 UCB]
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For researchers…. • New Circuit Design Techniques• Novel Device Structures
Double gate MOSFETs– Double gate MOSFETs– FinFETs
• New materials for electronics– Graphene– Carbon nanotubes (CNTs)– Organic semiconductors
• Cost reduction and large area circuits/systems– Organic/Flexible/printed Electronics
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Along with training and manpower building, exploratory research is also necessary
Summary
• CMOS will be continuing for next many years
• Proper understanding and Training for CMOS and VLSI is requiredand VLSI is required
• Research for new device designs and materials is necessary
• Exploratory work should also be encouraged for new technologies
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