Lead Free:What is happening in

the USA?

David W. Bergman

IPC Vice President Standards, Technology and International Relations

June 2002

                                                             

You Can’t win!!!

                              

                                                             

Change

                                                             

                                                             

If a terrorist wanted to sabotage the World Electronics industry, he'd come up with lead free solder.

                                                             

Recycle

                                                             

                                                             

The High Tech Trashing of China

                                                             

Recycling WEEE

• US electronic waste for recycling• 50-80% of “e-waste” collected for recycling is shipped to Asia (China,

India, Pakistan) –according to unidentified “Informed Industry Sources”

• Ignores the Basel Convention 1994 on hazardous waste. U.S. is not a signatory to this convention.

                                                             

Lobby against Change

IPC Board of Directors Position StatementThe US electronic interconnection industry, represented by the IPC, uses less than 2% of the world’s annual lead consumption. Furthermore, all available scientific evidence and US government reports indicate that the lead used in US printed wiring board (PWB) manufacturing and electronic assembly produces no significant environmental or health hazards.

•Nonetheless, in the opinion of IPC, the pressure to eliminate lead in electronic interconnections will continue in the future from both the legislative and competitive sides. IPC encourages and supports research and development of lead-free materials and technologies. These new technologies should provide product integrity, performance and reliability equivalent to lead-containing products without introducing new environmental risks or health hazards. IPC prefers global rather than regional solutions to this issue, and is encouraging a coordinated approach to the voluntary reduction or elimination of lead by the electronic interconnection industry.

                                                             

Political Activities

• European Commission (EC) Waste Electrical and Electronic Environment (WEEE) Directive– Seeks to increase recycling and recovery of

waste equipment.

• Restriction of Use of Hazardous Substances (RoHS)– Bans lead, mercury, cadmium, hexavalent

chromium, PBBs, PBDEs

                                                             

EPA Toxics Release Inventory (TRI)

• The January rule (66 FR 4499-4547) lowered the reporting thresholds for lead and lead compounds to 45kg from 12,000 kg.

• Many IPC member companies will be filing reports for the first time under the Emergency Planning and Community Right-to-Know Act (EPCRA).

                                                             

EPA Toxics Release Inventory (TRI)

• Companies using >130kg eutectic SnPb per year will meet the threshold

• TRI for 2001 emissions due July 1, 2002• EPA’s ignored to SBREFA leading to

industry lawsuit– Application of PBT Criteria to metals not supported by

sound science– Rule did not properly evaluate the effects on small

business (as required by law)

                                                             

Who you gonna Lobby?

                                                             

Do nothing

• Awarded products that meet specific environmental requirements– France • Canada– US • EU– Germany • Nordic Swan– Japan • Netherlands

• Enable consumers to know they are buying products that are environmentally sound

• Manufacturers use them as marketing tool

MarketingEcolabelsEcolabels

                                                             

Japan Environmental Information

1..Personal Computer/Halogen- and Lead- free Solder Technology - Toshiba - Toshiba Corporation put into market new personal computer model in Japan on February 28, 2001.[DynaBook SS 3490] is an environment friendly PC using halogen/antimony-free printed wiring board as well as lead-free technology (Sn-Ag-Cu Alloy). 2/01

2. Personal Computer/Halogen- free Technology - Toshiba - Toshiba Corporation put into market new personal computer model in Japan on February 28, 2001. [DynaBook Satellite 4600 SA100P/5] is an environment friendly PC using halogen/antimony-free printed wiring board. 3/01

3. Refrigerator/Lead-free Technology -Sharp - Sharp will put market refrigerator using lead-free technology. 3/01

                                                             

“Motorola endorses the goal to reduce the use of Pb and other materials of environmental concern as part of our pledge to preserve the Earth as a home

for future generations.” Gary Tooker, Chairman of the Board - 1997

                                                             

Lead Replacement Choice

                                                             

The path is getting clearerA bit more traveled

Not paved well yet

                                                             

SnAgCu Recommendations

• SOLDERTEC (ITRI UK) general purpose solder suitable for SM, wave and hand soldering

Sn [3.4-4.1] Ag [0.45-0.9] Cu• NEMI solder recommendation for reflow

Sn3.9Ag0.6Cu PasteSn0.7Cu Wave

                                                             

NEMI Major Project Activities• Alloy – Carol Handwerker, NIST

– Alloy Material Property development.

• Components/PCBs – Rich Parker, Delphi– Effect of High temperature reflow. Pb-free terminations

• Solder Reliability – John Sohn, NEMI– Transparent test procedure.

• Process Development – Jasbir Bath, Solectron– Generic process for Reliability test boards.

• Tin Whisker – Swami Prasad, ChipPAC• Rework – Jerry Gleason, H.P.

                                                             

                                                             

                                                             

                                                             

Solder Process Value Council

• Aim• Alpha –Fry

Technologies• Amtech, Inc.• EFD, Inc.• Indium

Corporation• Kester Solder

• Koki Company, Ltd.

• Nihon Superior Company Ltd

• Qualitek• Senju Metal

Industry

                                                             

Position Statement

• Help standardize the electronics industry on one lead-free alloy.

• Recommending Sn/3Ag/0.5Cu family for additional study.

• Data will be sent to IPC staff .• The final alloy will then be verified in

testing and a final report will then be published under the Council’s guidelines.

                                                             

High Temperature Solution?

• SUNNYVALE, Calif., March 14 02/PRNewswire/ • The Electronic Materials business of Honeywell

(NYSE: HON)• Introduced lead-free solder for die attach in power

packages• New Bi-Ag solder is a replacement for Pb5Sn and

similar high-Pb alloys used in components• Currently in final customer evaluation

Design for the Environment Program

www.epa.gov/dfe

                                                             

Environmental Impact of Lead-Free Solder

• Environmental impacts of a switch to lead-free solder has never been fully investigated

• Concern about switching to other metals – May have environmental concerns – May be regulated or banned in the future

                                                             

DfE Vision

Decision-makersconsider environmentalfactors, along withcost andperformance criteria

Cost

PerformanceEnvir

on

ment

Decision

                                                             

Projects Completed with Electronics Industry

• Printed wiring board Cleaner Technologies Substitutes Assessments:

- making holes conductive (1998)

- lead-free surface finishes (2001)

• DfE Computer Display Project (2001)

- evaluated life-cycle environmental impacts of CRT and LCD desktop monitors

- identified environmental challenges that can be addressed by display manufacturers

+ +++++=Immersion Tin (C)

++++=Immersion Tin (NC)

+++++++Immersion Silver (C)

+++++++++OSP (C)

++++++OSP (NC)

++ =Nickel palladium gold (NC)

++ Nickel gold (NC)

=++++=HASL (C)

NonCancerbCancera

CostEnergyWaterRisk

Comparison to HASL (NC)Surface Finish

Alternative

a: Based on number of known or probable human carcinogensb: Based on number of chemicals with risk results above concern levelsc: Based on number of chemicals with estimated surface water concentrations above concern concentrations

Summary of Risk, Resource Use, and Cost

= 10%

10-50% better 10-100% worse

50+% better 100%+ worse

Aquaticc

to ++

to ++

to ++

to ++

= to +

Overall

to ++

to ++

to ++

+

+

                                                             

Raw Materials Extraction/Processing

Solder Manufacturing

Solder Application

Use/Reuse/Maintenance

EOL Disposition

Inputs Life-Cycle Stages Outputs

Raw Materials

Energy

WaterEffluents

AirborneEmissions

Solid Wastes

Products

Co-ProductsBoundary

Life-Cycle Stages

                                                             

Impact Categories• Resource consumption

(renewable & non-renewable)

• Energy use• Water use • Landfill space use• Global warming• Ozone depletion• Photochemical smog• Acidification

• Local air quality (PM10)

• Water eutrophication • Local water quality (BOD,

TSS, pH)• Human health toxicity

(occupational & public, acute & chronic)

• Aesthetics (odor)• Ecotoxicity (aquatic &

terrestrial)

Electronic Soldering Energy Consumption

Sn-Pb Std. Profile Pb-free Profile(Min. assumption,

25% increase)

Pb-free Profile(Max. assumption,

50% increase)Assembly Oven PowerConsumption

~ 21 kW ~ 26 kW ~ 31.5 kW

Annual Oven PowerConsumption (WW)

5,058,900,000 kWh 6,263,400,000 kWh 7,588,350,000 kWh

Delta increase (WW)Power requirement

1,204,500,000 kWh 2,529,450,000 kWh

CO2 Emission due toincrease ~ 750 Metric Tons ~ 1500 Metric Tons

Assumptions: There are approx. 25,000 to 30,000 assembly ovens in use World Wide (used 27,500 for calculation)Assembly ovens operate 24 Hrs./Day, 365 Days/yearPb-free soldering is estimated to require 25% to 50% more energy than Sn-PbDiablo Canyon Nuclear Power Plant capacity: 2,190,000 kW (52,560,000 kWh/Day)Generating 1 MWh causes ~ 0.623 Metric Tons of CO2 emission (Source: U.S. Dept. of Energy)

Karl Tiefert, FEB. 2001

                                                             

Scoping– SoldersWave Application Solders• Sn/Pb (63 Sn/ 37 Pb)

• Sn/Cu(99.3 Sn/ 0.7 Cu)

• Sn/Ag/Cu (95.5 Sn/4.0 Ag/0.5 Cu)

Reflow Application Solders• Sn/Pb (63 Sn/ 37 Pb)

• Sn/Ag/Cu (95.5 Sn/4.0 Ag/0.5 Cu)

• Sn/Ag/Bi (42 Sn/1.0 Ag/57 Bi)

or SnAg/Cu/Bi (92.3 Sn/3.4 Ag/1.0 Cu/3.3 Bi)

                                                             

Project Schedule

• Complete Goal Definition and Scoping -February 2002

• Develop life-cycle inventory – September 2002

• Draft LCA - April 2003• Draft Final LCA - July 2003• Present results/outreach – July-December

2003

                                                             

Project Funding Contributors• Agilent• Alpha Metals• Delphi Delco• Hewlett-Packard• IBM• Intel• Pitney Bowes

• Rockwell Collins• SEMATECH• Thompson

Multimedia• U.S. EPA

                                                             

Hewlett Package Position

                                                             

HP’s Position on Lead Elimination(approved for External Use)

• Actively investigating alternatives to the use of lead (Pb) in its electronic assemblies.

• An industry standard solution is best for the supply chain.

• Implementation timelines depend on proven reliability, regulations, market demand, supply, cost, and scientific evidence of the alternative being environmentally better than lead (Pb).

                                                             

Expectations for HP’s Supply Chain Partners

• Planning The Supplier is expected to provide HP a written plan as to how it intends to meet the timelines

• Cost Implication Notification Must provide information about any cost impact of the lead-free conversion … and work with HP to minimize the impact of such a conversion on cost.

• Reliability Impact The Supplier must provide HP any info identified impacting quality, yield or long term reliability.

• Labeling The Supplier must provide a product labeling plan.

• Design Impact The Supplier is expected to develop design for manufacturability and test rules

                                                             

Pb-free Program Assumptions

• EU Pb-free compliance date is expected to be Jan 1, 2006. • NEMI’s choice of SMT solder alloy (Sn/Ag/Cu) will be

adopted by the industry. Alloy choice for wave solder processing is likely to be either Sn/Cu, Sn/Ag, or Sn/Ag/Cu.

• Peak processing temperature will be 260 oC max for as long as 90sec.

• HP’s plans may change, depending on the marketplace, legislative outcomes, and internal program schedules.

                                                             

Pb-free Program Schedule• January 2002 Roll out the Pb-free program• May 1, 2002 Supplier plans to HP • May - Dec 2002 HP integrates feedback with EU legislation and builds plans

• June 2002 Pb-free evaluation products and services available• February 2003 HP rolls out Pb-free schedules and supplier requirements• June 2003 Pb-free qualification products and services available• June 2004 Pb-free components available for volume shipments

* May be subject to change

                                                             

IPC and JEDEC

Table 5-2 - Classification Reflow ProfilesSn-Pb Eutectic Assembly Pb-Free Assembly

Profile FeatureLarge Body Small Body Large Body Small Body

Average ramp-up rate(TL to Tp)

3° / .C second max 3° / .C second max

Preheat• Temperature Min (Tsmin)• Temperature Max (Tsmax)• Time (min to max) (ts)

100°C150°C

60-120 seconds

150°C200°C

60-180 secondsTsmax to TL

- Ramp-up Rate 3°C/second maxTime maintained above:

• Temperature (TL)• Time (tL)

183°C60-150 seconds

217°C60-150 seconds

Peak Temperature (Tp) 225 +0/-5°C 240 +0/-5°C 245 +0/-5°C 250 +0/-5°CTime within 5°C of actual PeakTemperature (tp)

10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds

Ramp-down Rate 6°C/second max. 6°C/second max.Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.

Table 4-1 –Package Peak Reflow TemperaturesReflow Conditions Pkg. Thickness ≥ 2.5 mm or

. Pkg Volume≥ 350 mm3. < 2.5 Pkg Thickness mm and. < 350 Pkg Volume mm3

SnPb Eutectic 225 +0/-5Convection °C 245 +0/-5Convection °C Pb Free 240 +0/-5Convection °C 250 +0/-5Convection °C

Issue: Small mass components on large mass boards can exceed MSL test temperatures!

                                                             

Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and or non-integral heat sinks.

Note 2: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD Packages may still exist.

Note 3: Components intended for use in a “Lead Free” assembly process shall be evaluated using the “Pb Free” peak temperature and profiles defined in Tables 2 and 5 regardless of being Pb free or not.

Note 4: It is possible that very large (>1400 cm2) thick boards (>2.5 mm) that use components with a wide range of thermal mass might have difficulty maintaining all component bodies below the maximum temperatures in this specification. In such cases, the MSL level must be determined based on the body temperature the component will attain.

A note to remind users that they may need to set unique requirements:

                                                             

Conclusion

U.S. Companies are:

• Driven by European Legislation.

• Fueled by Japanese marketing drive.

• Changing slowly – solutions will be in place by RoHS dates.

• Tin/Silver/Copper will be alloy of choice for first wave lead elimination.