LAUNCHXL-F28069M overview (Rev. B)

1SPRUI11B–January 2015–Revised March 2019Submit Documentation Feedback

Copyright © 2015–2019, Texas Instruments Incorporated

LAUNCHXL-F28069M Overview

User's GuideSPRUI11B–January 2015–Revised March 2019


Contents1 Introduction ................................................................................................................... 22 Kit Contents................................................................................................................... 33 Installation .................................................................................................................... 34 Getting Started With the LAUNCHXL-F28069M ......................................................................... 45 Hardware Configuration..................................................................................................... 56 LAUNCHXL-F28069M Hardware .......................................................................................... 97 Frequently Asked Questions (FAQ)...................................................................................... 228 References .................................................................................................................. 23

List of Figures

1 LAUNCHXL-F28069M Board Overview .................................................................................. 32 USB Serial Port .............................................................................................................. 53 Boot Switch Orientation ..................................................................................................... 64 LAUNCHXL-F28069_B_1400922 Block Diagram Schematic ........................................................ 115 LAUNCHXL-F28069_B_1400922 USB to JTAG Schematic ......................................................... 126 LAUNCHXL-F28069_B_1400922 F28069_A Schematic ............................................................. 137 LAUNCHXL-F28069_B_1400922 F28069_B Schematic ............................................................. 148 LAUNCHXL-F28069_B_1400922 Connector Schematic ............................................................. 159 LAUNCHXL-F28069_B_1400922 Logic Choice Schematic .......................................................... 1610 LAUNCHXL-F28069_B_1400922 Power Schematic .................................................................. 1711 Top Silk ...................................................................................................................... 1812 Top Copper ................................................................................................................. 1813 Inner Copper 1.............................................................................................................. 1814 Inner Copper 2.............................................................................................................. 1815 Bottom Silk .................................................................................................................. 1816 Bottom Copper.............................................................................................................. 18

List of Tables

1 Serial Connectivity........................................................................................................... 62 S1 Boot Mode Settings ..................................................................................................... 73 F28069M LaunchPad Pin Out and Pin Mux Options - J1, J3.......................................................... 94 F28069M LaunchPad Pin Out and Pin Mux Options - J4, J2.......................................................... 95 F28069M LaunchPad Pin Out and Pin Mux Options - J5, J7 ........................................................ 106 F28069M LaunchPad Pin Out and Pin Mux Options - J8, J6 ........................................................ 107 LAUNCHXL-F28069M Bill of Materials .................................................................................. 19

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Introduction www.ti.com

2 SPRUI11B–January 2015–Revised March 2019Submit Documentation Feedback



TrademarksC2000, Piccolo, LaunchPad, Code Composer Studio are trademarks of Texas Instruments.Windows is a registered trademark of Microsoft Corporation in the United States and/or other countries.All other trademarks are the property of their respective owners.

1 IntroductionThe C2000™ Piccolo™ LaunchPad™, LAUNCHXL-F28069M, is a complete low-cost development boardfor the Texas Instruments Piccolo F2806x devices and InstaSPIN technology. The LAUNCHXL-F28069Mkit features all the hardware and software necessary to develop applications based on the F2806xmicroprocessor. The LaunchPad is based on the superset F28069M device, and easily allows users tomigrate to lower cost F2806x devices once the design needs are known. It offers an on-board JTAGemulation tool allowing direct interface to a PC for easy programming, debugging, and evaluation. Inaddition to JTAG emulation, the USB interface provides a universal asynchronous receiver/transmitter(UART) serial connection from the F2806x device to the host PC.

Users can download an unrestricted version of Code Composer Studio™ IDE to write, download, anddebug applications on the LAUNCHXL-F28069M board. The debugger is unobtrusive, allowing the user torun an application at full speed with hardware breakpoints and single stepping available while consumingno extra hardware resources.

As shown in Figure 1, the LAUNCHXL-F28069M C2000 LaunchPad features include:• USB debugging and programming interface via a high-speed galvanically isolated XDS100v2 debug

probe featuring a USB/UART connection• Superset F28069M device that allows applications to easily migrate to lower cost devices• Two user LEDs• Device reset pushbutton• Easily accessible device pins for debugging purposes or as sockets for adding customized extension

boards• InstaSPIN library in ROM, allowing implementation of InstaSPIN-MOTION and InstaSPIN-FOC

solutions• Dual 5 V quadrature encoder interfaces• CAN Interface with integrated transceiver• Boot selection switches

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Figure 1. LAUNCHXL-F28069M Board Overview

2 Kit ContentsThe LAUNCHXL-F28069M LaunchPad experimenter kit includes the following items:• C2000 LaunchPad Board (LAUNCHXL-F28069M)• Mini USB-B Cable, 0.5m• Quick Start Guide

2.1 RevisionsThe first and only production released of the LAUNCHXL-F28069M in 2014 was revision 1.2.

All Revisions:• Resistor R7 in the oscillator circuit is incorrectly placed or should not be installed. This resistor may

impact startup time or robustness of the clocking circuit over the full operating range of the MCU ordifferent physical layouts of this circuit. The probability is low that this resistor will have any impact onthe functionality of this EVM as is not intended to be operated outside of Standard Temperature andPressure in a lab or prototype environment. Do not use this circuit as reference. For more informationon the Follow the requirements for the oscillator schematic, see the device-specific data sheet.

3 InstallationThe F28069M LaunchPad is supported in both Code Composer Studio and Energia. Depending on yourtools preference you may wish to install one or the other or both.

3.1 EnergiaGo to Energia.nu and and click on the Guide tab. Click on the link for your operating system and follow thedirections to install Energia.

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3.2 Code Composer Studio

3.2.1 Download the Required SoftwareCode Composer Studio IDE (www.ti.com/ccs) is available for free without any restriction when used withthe XDS100v2 debug probe on the C2000 LaunchPad. Drivers, examples, and other support softwareneeded to get started are distributed through C2000Ware (www.ti.com/tool/c2000ware) and controlSUITE(www.ti.com/tool/controlsuite). C2000Ware is the recommended download for new installations.

For InstaSPIN motor control projects, install and run the latest version of MotorWare.exe(www.ti.com/motorware). In the window that opens, under Resources, follow the Kit Readme and GUIQuick Start Guide for the LAUNCHXL-F28069M.

3.2.2 Install the SoftwareOnce downloaded, install Code Composer Studio and C2000Ware or controlSUITE.

3.2.3 Install the HardwareAfter Code Composer Studio is installed, plug the supplied USB cable into the C2000 LaunchPad boardand into an available USB port on your computer.

Windows® will automatically detect the hardware and ask you to install software drivers. Let Windows runa search for the drivers and automatically install them. After Windows successfully installs the drivers forthe integrated XDS100v2 debug probe, your LaunchPad is now ready for use.

NOTE: If the USB Serial COM Port is not identified by the computer, reprogram the XDS100v2EEPROM using these instructions.

4 Getting Started With the LAUNCHXL-F28069M

4.1 Getting StartedThe first time the LAUNCHXL-F28069M is used, a demo application automatically starts when the board ispowered from a USB host. If your board does not start the demo application, try placing S1 in the followingpositions and resetting the board: UP - UP - DOWN. To start the demo, connect the LAUNCHXL-F28069M with the included mini-USB cable to a free USB port. The demo application starts with the LEDsflashing to show the device is active.

4.2 Demo Application, Internal Temperature MeasurementThe LAUNCHXL-F28069M includes a pre-programmed TMS320F28069M device. When the LaunchPad isconnected via USB, the demo starts with an LED flash sequence. After a few seconds the device switchesinto a temperature measurement mode.

A reference temperature is taken at the beginning of this mode and the LEDs of the LaunchPad are usedto display any difference between the current temperature and the reference temperature. If the devicegets warmer than the reference temperature the red LED is lit with an intensity proportional to thetemperature difference. However, if the device cools down compared to the reference temperature, a blueLED is lit in the same fashion.

In addition to the LED display, temperature information is also displayed on your PC through theUSB/UART connection. To view the UART information on your PC, first figure out the COM portassociated with the LaunchPad. To do this in Windows, right click on My Computer and click onProperties. In the dialog box that appears, click on the Hardware tab and open Device Manager. Look foran entry under Ports (COM & LPT) titled "XDS100 Class USB Serial Port (COMX)", where X is a number.

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http://www.ti.com/ccs

http://www.ti.com/tool/c2000ware

http://www.ti.com/tool/controlsuite

http://www.ti.com/motorware

https://e2e.ti.com/support/microcontrollers/c2000/f/171/t/670519

www.ti.com Getting Started With the LAUNCHXL-F28069M




Figure 2. USB Serial Port


Remember this number for when you open a serial terminal. The demo applications UART data waswritten and debugged using PuTTY, and for the best user experience we recommend you use PuTTY toview the UART data. PuTTY can be downloaded from the following URL:

http://www.chiark.greenend.org.uk/~sgtatham/putty/download.html

Open your serial terminal program and open the COM port you found previously in device manager withthe following settings: 115200 Baud, 8 data bits, no parity, 1 stop bit. After opening the serial port in yourserial terminal, reset the Launchpad with the reset push button and observe the serial terminal for asurprise.

4.3 Program and Debug the Temperature Measurement Demo ApplicationThe project and associated source code for the C2000 Piccolo LaunchPad demo is included in thecontrolSUITE software package and should automatically be found by the TI Resource Explorer in CodeComposer Studio v6. In the resource explorer, open the controlSUITE folder and then the DevelopmentTools entry and look for the C2000 LaunchPad line item. Expand this item and LAUNCHXL-F28069M,then select the LaunchPad Demo Application. Follow the steps in the main pane of the resource explorerto import, build, debug, and run this application.

5 Hardware ConfigurationThe F28069M LaunchPad gives users several options as to how to configure the board.

5.1 Power DomainThe F28069M LaunchPad has several different power domains to enable JTAG isolation. Jumpers JP1,JP2, JP3, JP4, and JP5 configure where power is passed.

Jumper Power DomainJP1 Enable 3.3 V from USB (disables isolation)JP2 Enable GND from USB (disables isolation)JP3 Enable 5 V switcher (powered off 3.3 V supply of target device)JP4 Connects target MCU 3.3 V to second set of BoosterPack

headersJP5 Connects target MCU 5 V to second set of BoosterPack headers

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http://www.chiark.greenend.org.uk/~sgtatham/putty/download.html

Hardware Configuration www.ti.com




5.2 Serial ConnectivityThe LAUNCHXL-F28069M has a USB to UART adapter built in. This makes it easy to print debuginformation back to the host PC even in isolated environments. The F28069M device on this LaunchPadcontains two SCI (UART) peripherals, while the LaunchPad has three places these peripherals need to berouted. Because of this, a serial connectivity mux has been added to the board to make configuration ofthe SCI routing easy. Routing is configured via two jumpers (JP6 and JP7). Configure the jumpers asshown in Table 1 for the serial connectivity you desire.

Table 1. Serial Connectivity

MUX_SEL(JP7)

CH_SEL(JP6) Function

ON ON USB/UART Disabled; J1.3 and J1.4 – GPIO28 and GPIO29; J7.3 and J7.4 – GPIO15 and GPIO58ON OFF USB/UART – GPIO28 and GPIO29, J1.3 and J1.4 – Hi-Z; J7.3 and J7.4 – GPIO15 and GPIO58OFF ON USB/UART – GPIO15 and GPIO58; FAULT/OCTW – GPIO28 and GPIO29; J7.3 and J7.4 – Hi-ZOFF OFF USB/UART – GPIO15 and GPIO58; FAULT/OCTW – GPIO28 and GPIO29; J7.3 and J7.4 – Hi-Z


5.3 Boot Mode SelectionThe LaunchPad's F28069M device includes a boot ROM that performs some basic start-up checks andallows for the device to boot in many different ways. Most users will either want to perform an emulationboot or a boot to flash (if they are running the application standalone). S1 has been provided to allowusers to easily configure the pins that the boot ROM checks to make this decision.

Figure 3. Boot Switch Orientation

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The boot modes shown in Table 2 can be selected using S1:

Table 2. S1 Boot Mode Settings

Boot ModeS1-Switch 1 (GPIO34)

H = Pulled to 1L = Pulled to 0

S1-Switch 2 (GPIO37 / TDO)H = Pulled to 1L = Pulled to 0

S1-Switch 3 (TRSTn)H = XDS100v2 (1)

L = Tied to 0Emulation Boot (2) L H H

Parallel IO L L LSCI H L LWait L H L

GetMode H H L

(1) TRSTn is controlled by the XDS100v2 when Switch 3 is set to the H position. While connected to the device, TRSTn is driven to1 by the XDS100v2. While disconnected from the device, TRSTn is pulled to 0.

(2) When the board is first powered on through the XDS100v2 USB port, the device will boot before the user can connect to thedevice. Therefore, Switch 1 and Switch 2 should be configured to the Wait boot mode to hold the CPU in a safe state until theuser can connect to the device.

NOTE: The USB debugger cannot connect to the device when S1-Switch 3 is placed in the Lposition because TSRTn is disconnected from the XDS100v2.

More information about boot mode selection can be found in the Boot ROM section of the TMS320x2806xPiccolo technical reference guide.

5.4 Connecting a CrystalAlthough the Piccolo device present on the LAUNCHXL-F28069M has an internal oscillator — and formost applications this is sufficient — the LaunchPad offers a footprint for through-hole HC-49 crystals forusers who require a more precise clock. If you wish to use an external crystal, solder the crystal to the Q1footprint and appropriate load capacitors to the C3 and C4 footprints. You also need to configure thedevice to use the external oscillator in software.

5.5 Connecting a BoosterPackThe F28069M LaunchPad is the perfect experimenter board to start hardware development with theF2806x devices. All of the connectors are aligned in a 0.1-in (2.54-mm) grid to allow easy and inexpensivedevelopment of add on boards called BoosterPacks. These satellite boards can access all of the GPIOand analog signals. The the pin out of the connectors can be found in Section 5.

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Hardware Configuration www.ti.com




5.6 Device Migration PathApplications developed on the LAUNCHXL-F28069M can easily be migrated to any of these lower costdevices in the F2806x family:

Part Number DescriptionTMS320F28069 32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 100KB RAMTMS320F28069F 32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 96KB RAMTMS320F28069M 32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 96KB RAMTMS320F28068 32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 100KB RAMTMS320F28068F 32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 96KB RAMTMS320F28068M 32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 96KB RAMTMS320F28067 32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 100KB RAMTMS320F28066 32-Bit Real Time Microcontroller, 90 MHz, 256KB Flash, 68KB RAMTMS320F28065 32-Bit Real Time Microcontroller, 90 MHz, 128KB Flash, 100KB RAMTMS320F28064 32-Bit Real Time Microcontroller, 90 MHz, 128KB Flash, 100KB RAMTMS320F28063 32-Bit Real Time Microcontroller, 90 MHz, 128KB Flash, 100KB RAMTMS320F28062 32-Bit Real Time Microcontroller, 90 MHz, 128KB Flash, 52KB RAMTMS320F28062F 32-Bit Real Time Microcontroller, 90 MHz, 128KB Flash, 52KB RAM

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www.ti.com LAUNCHXL-F28069M Hardware




6 LAUNCHXL-F28069M Hardware

6.1 Device Pin Out

The F28069M LaunchPad is not 100% compatible with the BoosterPack Standard pin out. to verify compatibility between a BoosterPack and thisLaunchPad, consult both the tables below as well as the pin out requirements of the BoosterPack. TI provides a tool that can help ease thisprocess. Use the Ti BoosterPack Checker tool. Some existing BoosterPacks can be used, or one can be created.

Table 3 through Table 6 lists the pin out and pin mux options for the C2000 LaunchPad.

The F28069M LaunchPad is not 100% compatible with the BoosterPack Standard pin out. to verify compatibility between a BoosterPack and thisLaunchPad, consult both the tables below as well as the pin out requirements of the BoosterPack. TI provides a tool that can help ease thisprocess. Use the TI BoosterPack Checker tool. Some existing BoosterPacks can be used, or one can be created.

Table 3. F28069M LaunchPad Pin Out and Pin Mux Options - J1, J3

Mux ValueJ1 Pin J3 Pin

Mux Value3 2 1 0 0 1 2 3

+3.3V 1 21 +5VADCINA6 2 22 GNDJ1.3 3 23 ADCINA7J1.4 4 24 ADCINB1

SPISIMOB SCITXDA TZ1 GPIO12 5 25 ADCINA2ADCINB6 6 26 ADCINB2

XCLKOUT SCITXDB SPICLKA GPIO18 7 27 ADCINA0SCITXDB MCLKXA EQEP1S GPIO22 8 28 ADCINB0ADCSOCBO EPWMSYNCO SCLA GPIO33 9 29 ADCINA1ADCSOCAO EWPMSYNCI SDAA GPIO32 10 30 NC



Mux Value3 2 1 0 0 1 2 3

Rsvd Rsvd EPWM1A GPIO0 40 20 GNDCOMP1OUT Rsvd EPWM1B GPIO1 39 19 GPIO19 SPISTEA SCIRXDB ECAP1Rsvd Rsvd EPWM2A GPIO2 38 18 GPIO44 MFSRA SCIRXDB EPWM7BCOMP2OUT SPISOMIA EPWM2B GPIO3 37 17 NCRsvd Rsvd EPWM3A GPIO4 36 16 RESET#ECAP1 SPISIMOA EPWM3B GPIO5 35 15 GPIO16 SPISIMOA Rsvd TZ2SPISOMIB Rsvd TZ2 GPIO13 34 14 GPIO17 SPISOMIA Rsvd TZ3

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https://dev.ti.com/bpchecker/#/

https://dev.ti.com/bpchecker/#/

LAUNCHXL-F28069M Hardware www.ti.com




Table 4. F28069M LaunchPad Pin Out and Pin Mux Options - J4, J2 (continued)Mux Value

J4 Pin J2 PinMux Value

3 2 1 0 0 1 2 3NC 33 13 GPIO50 EQEP1A MDXA TZ1DAC1 32 12 GPIO51 EQEP1B MDRA TZ2DAC2 31 11 GPIO55 SPISOMIA EQEP2B HRCAP2



Mux Value3 2 1 0 0 1 2 3

+3.3 V 41 61 +5 VNC 42 62 GNDJ7.3 43 63 ADCINB7J7.4 44 64 ADCINB4

COMP1OUT MDXA EQEP1A GPIO20 45 65 ADCINA5NC 46 66 ADCINB5

SPICLKB SCITXDB TZ3 GPIO14 47 67 ADCINA3COMP2OUT MDRA EQEP1B GPIO21 48 68 ADCINB3SCIRXDB MFSXA EQEP1I GPIO23 49 69 ADCINA4HRCAP1 EQEP2A SPISIMOA GPIO54 50 70 NC



Mux Value3 2 1 0 0 1 2 3

EPWMSYNCO EPWMSYNCI EPWM4A GPIO6 80 60 GNDECAP2 SCIRXDA EPWM4B GPIO7 79 59 GPIO27 HRCAP2 EQEP2S SPISTEBADCSOCAO Rsvd EPWM5A GPIO8 78 58 GPIO26 ECAP3 EQEP2I SPICLKBECAP3 SCITXDB EPWM5B GPIO9 77 57 NCADCSOCBO Rsvd EPWM6A GPIO10 76 56 RESET#ECAP1 SCIRXDB EPWM6B GPIO11 75 55 GPIO24 ECAP1 EQEP2A SPISIMOB

NC 74 54 GPIO25 ECAP2 EQEP2B SPISOMIBNC 73 53 GPIO52 EQEP1S MCLKXA TZ3DAC3 72 52 GPIO53 EQEP1I MFSXA RsvdDAC4 71 51 GPIO56 SPICLKA EQEP2I HRCAP3

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Figure 4. LAUNCHXL-F28069_B_1400922 Block Diagram Schematic

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Figure 5. LAUNCHXL-F28069_B_1400922 USB to JTAG Schematic

http://www.ti.com


1.0

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80

69

_A

PW

M

TD

OG

PIO

34

TR

ST

10

00 0 0 0

xx

0 1 1

1 10

Em

ula

tio

nB

oo

tP

ara

llel I/

OS

CI

Wa

itG

etM

ode

RE

SE

TB

OO

T

+3

V3

36p36p

1M

GN

D

GN

D

2.2k

2.2k

2.2k

820

820

+3

V3

+3

V3

GN

DG

ND

2.2

u2

.2u

TP

-113

8K

9-B

E11

25

GN

D

820

+3

V3

GN

D

20

4-3

ST

2.2k GN

D

BKP1005HS221-T

BLM15PD600SN1D

2.2

u2

.2u

2.2

u

GN

D

TM

S3

20

F2

806

9M

PZ

T

TM

S32

0F

28

06

9M

PZ

T

2.2

u2

.2u

2.2

u2

.2u

GN

D 2.2

u2

.2u

2.2

u2

.2u

2.2

u

GN

D

+3

V3

+3

V3

GN

D

GN

D

0.1

u

0.1

u

GN

DQ1

C4C3

R7

R6

R8

R9

R4

R5C

5C

6

S2

D1

R1

S1

4561 2 3

R10

L3

L4

C1

9C

20

C2

1

TR

ST

12

VR

EG

EN

Z9

0

XR

S11

AD

C_

INA

02

3A

DC

_IN

A1

22

AD

C_

INA

2/C

OM

P1

A/A

IO2

21

AD

C_

INA

32

0A

DC

_IN

A4

/CO

MP

2A

/AIO

41

9A

DC

_IN

A5

18

AD

C_

INA

6/C

OM

P3

A/A

IO6

17

AD

C_

INA

71

6

AD

C_

INB

02

8A

DC

_IN

B1

29

AD

C_

INB

2/C

OM

P1

B/A

IO1

03

0A

DC

_IN

B3

31

AD

C_

INB

4/C

OM

P2

B/A

IO1

23

2A

DC

_IN

B5

33

AD

C_

INB

6/C

OM

P3

B/A

IO1

43

4A

DC

_IN

B7

35

TC

K/G

PIO

38

67

TD

I/G

PIO

35

71

TD

O/G

PIO

37

70

TE

ST

24

5

TM

S/G

PIO

36

72

VD

D_

FL

46

VR

EF

HI

24

VR

EF

LO

27

X1

60

X2

59

XC

LK

_I/

GP

IO1

96

4

XC

LK

_O

/GP

IO1

85

1

U1

G$

1

VD

D1

3

VD

D2

14

VD

D3

37

VD

D4

63

VD

D5

81

VD

D6

91

VD

DA

25

VD

DIO

15

VD

DIO

21

3

VD

DIO

33

8

VD

DIO

46

1

VD

DIO

57

9

VD

DIO

69

3

VS

S1

4

VS

S2

15

VS

S3

36

VS

S4

47

VS

S5

62

VS

S6

80

VS

S7

92

VS

SA

26

U1

G$

3

C1

C2

C2

2C

23

C2

6C

27

C2

8C

29

C3

0

TP

18

TP

19

TP

20

TP

21

TP

22

TP

23

TP

24

C3

9

C4

0

TC

K

TD

IT

DO

TD

O

TM

S

TR

ST

TR

ST

RE

SE

T#

RE

SE

T#

GP

IO3

4

AD

CIN

A6

AD

CIN

A4

AD

CIN

A1

AD

CIN

A2

AD

CIN

B1

AD

CIN

B2

AD

CIN

B4

GP

IO1

8

JTA

G_T

RS

T

AD

CIN

A7

AD

CIN

A3

AD

CIN

A0

AD

CIN

B3

AD

CIN

B7

AD

CIN

B6

AD

CIN

A5

AD

CIN

B5

AD

CIN

B0

GP

IO1

9

Ro

yY

au

ng

1 2 3

ON

A B C D E

A B C D E

12

34

56

JTAG CLOCK

ADC

DN

P





Figure 6. LAUNCHXL-F28069_B_1400922 F28069_A Schematic

http://www.ti.com


1.1

F2

80

69

_B

PW

MU

AR

T

PW

M_

DA

C

SN

74

LVC

2G

07

330

330

+3

V3

+3

V3

+3

V3

GN

D

TM

S3

20

F2

80

69

MP

ZT

1K

1K

1K

1K

0.1

u0

.1u

0.1

u0

.1u

GN

DG

ND

GN

DG

ND

0.1

u

GN

D

D9

D10

U9

1A

1

2A

32

Y4

1Y

6

VCC5 GND 2

R38

R39

GP

IO0

/EP

WM

1A

87

GP

IO1

/EP

WM

1B

/CO

MP

1O

UT

86

GP

IO2

/EP

WM

2A

84

GP

IO3

/EP

WM

2B

/SP

ISO

MIA

/CO

MP

2O

UT

83

GP

IO4

/EP

WM

3A

9

GP

IO5

/EP

WM

3B

/SP

ISIM

OA

/EC

AP

11

0

GP

IO6

/EP

WM

4A

/EP

WM

SY

NC

I/E

PW

MS

YN

CO

58

GP

IO7

/EP

WM

4B

/SC

IRX

DA

/EC

AP

25

7

GP

IO8

/EP

WM

5A

/AD

CS

OC

AO

54

GP

IO9

/EP

WM

5B

/SC

I_T

XD

B/E

CA

P4

9

GP

IO1

0/E

PW

M6

A/A

DC

SO

CB

O7

4

GP

IO11

/EP

WM

6B

/SC

I_R

XD

B/E

CA

P1

73

GP

IO1

2/T

Z1

/SC

ITX

DA

/SP

ISIM

OB

44

GP

IO1

3/T

Z2

/SP

ISO

MIB

95

GP

IO1

4/T

Z3

/SC

ITX

DB

/SP

ICL

KB

96

GP

IO1

5/E

CA

P2

/SC

I_R

XD

B/S

PIS

TE

B8

8

GP

IO1

6/S

PI_

SIM

O_

A/T

Z2

55

GP

IO1

7/S

PI_

SO

MI_

A/T

Z3

52

GP

IO2

0/E

QE

P1

A/M

DX

A/C

OM

P1

OU

T6

GP

IO2

1/E

QE

P1

B/M

DR

A/C

OM

P2

OU

T7

GP

IO2

2/E

QE

P1

S/M

CL

KX

A/S

CIT

XD

B9

8G

PIO

23

/EQ

EP

1I/

MF

SX

A/S

CIR

XD

B2

GP

IO2

4/E

CA

P1

/EQ

EP

2A

/SP

ISIM

OB

97

GP

IO2

5/E

CA

P2

/EQ

EP

2B

/SP

ISO

MIB

39

GP

IO2

6/E

CA

P3

/EQ

EP

2I/

SP

ICL

KB

/US

B0

DP7

8

GP

IO2

7/H

RC

AP

2/E

QE

P2

S/S

PIS

TE

B/U

SB

0D

M77

GP

IO2

8/S

CI_

RX

DA

/SD

AA

/TZ

25

0

GP

IO2

9/S

CI_

TX

DA

/SC

LA

/TZ

34

3

GP

IO3

0/C

AN

_R

XA

/EQ

EP

2I/

EP

WM

7A

41

GP

IO3

1/C

AN

_T

XA

/EQ

EP

2S

/EP

WM

8A

40

GP

IO3

2/S

DA

_A

/EP

WM

SY

NC

I/A

DC

SO

CA

O9

9

GP

IO3

3/S

CL

_A

/EP

WM

SY

NC

O/A

DC

SO

CB

O1

00

GP

IO3

4/C

OM

P2

OU

T/C

OM

P3

OU

T6

8

GP

IO3

96

6

GP

IO4

0/E

PW

M7

A/S

CI_

TX

DB

82

GP

IO4

1/E

PW

M7

B/S

CI_

RX

DB

76

GP

IO4

2/E

PW

M8

A/T

Z1

/CO

MP

1O

UT

1

GP

IO4

3/E

PW

M8

B/T

Z2

/CO

MP

2O

UT

8

GP

IO4

4/M

FS

RA

/SC

IRX

DB

/EP

WM

7B

56

GP

IO5

0/E

QE

P1

A/M

DX

A/T

Z1

42

GP

IO5

1/E

QE

P1

B/M

DR

A/T

Z2

48

GP

IO5

2/E

QE

P1

S/M

CL

KX

A/T

Z3

53

GP

IO5

3/E

QE

P1

I/M

FS

XA

65

GP

IO5

4/S

PIS

IMO

A/E

QE

P2

A/H

RC

AP

16

9

GP

IO5

5/S

PIS

OM

IA/E

QE

P2

B/H

RC

AP

27

5

GP

IO5

6/S

PIC

LK

A/E

QE

P2

I/H

RC

AP

38

5

GP

IO5

7/S

PIS

TE

A/E

QE

P2

S/H

RC

AP

48

9

GP

IO5

8/M

CL

KR

A/S

CI_

TX

DB

/EP

WM

7A

94

U1

G$

2

R3

6

R3

7

R4

0

R4

1

C3

3C

34

C3

5C

36

C2

4

TP

5

TP

6

TP

7

TP

8

GP

IO1

7G

PIO

16

GP

IO1

GP

IO0

GP

IO3

2

GP

IO2

GP

IO3

GP

IO4

GP

IO5

GP

IO6

GP

IO7

GP

IO1

2

GP

IO2

8

GP

IO3

3

GP

IO8

GP

IO2

9

GP

IO4

4G

PIO

50

GP

IO5

1

GP

IO2

2

GP

IO1

3G

PIO

14

GP

IO9

GP

IO1

0G

PIO

11G

PIO

40

GP

IO4

0

GP

IO4

1

GP

IO4

1

GP

IO4

2

GP

IO4

2

GP

IO4

3

GP

IO4

3

GP

IO2

6G

PIO

27

GP

IO2

5

GP

IO5

2G

PIO

53

GP

IO2

4

GP

IO2

0G

PIO

21

GP

IO2

3

GP

IO5

4G

PIO

55

GP

IO5

6

GP

IO3

0G

PIO

31

GP

IO5

8G

PIO

15

GP

IO3

4

GP

IO3

4

GP

IO3

9

GP

IO3

9

DA

C1

DA

C2

DA

C3

DA

C4

GP

IO5

7G

PIO

57

Ro

yY

au

ng

A B C D E

A B C D E

12

34

56





Figure 7. LAUNCHXL-F28069_B_1400922 F28069_B Schematic

http://www.ti.com


1.1

CO

NN

EC

TO

R

Vdc

V_A

1V

_B

1V

_C

1I_

A1

I_B

1I_

C1

V_A

2V

_B

2V

_C

2I_

A2

I_B

2I_

C2

PW

R

PW

R

PW

RA

NA

FA

ULT

nO

CT

Wn

GP

IOA

NA

GP

IO1S

PI_

CLK

1P

WM

_A

H1P

WM

_A

L1P

WM

_B

H1P

WM

_B

L1P

WM

_C

H1P

WM

_C

LG

PIO

GN

D1S

PI_

CS

GP

IO

RE

SE

T1S

PI_

SI

1S

PI_

SO

1E

N_G

AT

E1D

C_C

AL

PW

RA

NA

FA

ULT

nO

CT

Wn

AN

A2S

PI_

CLK

SC

LS

DA

2P

WM

_A

H2P

WM

_A

L2P

WM

_B

H2P

WM

_B

L2P

WM

_C

H2P

WM

_C

L

PW

M_D

AC

GN

D2S

PI_

CS

GP

IO

RE

SE

T2S

PI_

SI

2S

PI_

SO

2E

N_G

AT

E2D

C_C

AL

A B I GN

DP

WR

GN

D

GN

D

PW

M_D

AC

PW

M_D

AC

PW

M_D

AC

CA

N

LE

VE

LS

HIF

T

Vdc

+3V

3

GN

D

GN

D

+5VGN

D

GN

D+3V3

+5V

TX

B0106P

WR

+5V

+5V

GN

DG

ND

+5V

+3V

3

2.2

k

GND

120

10K 10K

0R 0R

+3V

3

GN

DG

ND

0.1u

GN

D

0.1u

GN

D

0.1u

GN

D

GN

D

+3V

3

PG

ND

1K

1K

1K

0.001u

0.001u

0.001u

1K

1K

1K

0.001u

0.001u

0.001uJ1

J4

J2

12

JP

4

12

JP

5

J3

J7

J5 J8

J6

A1

P$

1

A2

P$

3

A3

P$

4

A4

P$

5

A5

P$

6

A6

P$

7

B1

P$

16

B2

P$

14

B3

P$

13

B4

P$

12

B5

P$

11

B6

P$

10

GN

DP

$9

OE

P$

8

VC

CA

P$

2V

CC

BP

$1

5

U2

1 2 3 4 5

QE

P_A

1 2 3 4 5

QE

P_B

R2

CA

NH

P$

7

CA

NL

P$

6D

P$

1

EN

P$

5

GND P$2

RP

$4

RS

P$

8

VCCP$3

U3

SN

65H

VD

234D

R34

1 2 3

J12

R35

R42

R43

R44

C31

C32

C37

1 2 3

J9

R13

R29

R48

C50

C51

C52

R49

R50

R51

C53

C54

C55

RE

SE

T#

RE

SE

T#

GP

IO19

GP

IO17

GP

IO16

GP

IO1

GP

IO0

GP

IO32

GP

IO2

GP

IO3

GP

IO4

GP

IO5

GP

IO6

GP

IO7

GP

IO12

AD

CIN

A6

AD

CIN

A4

AD

CIN

A2

AD

CIN

B2

AD

CIN

B4

GP

IO18

GP

IO33

AD

CIN

A1

AD

CIN

B1

AD

CIN

A3

AD

CIN

A0

AD

CIN

B3

AD

CIN

B7

AD

CIN

A5

AD

CIN

B0

GP

IO22

GP

IO13

AD

CIN

B5

GP

IO14

GP

IO24

GP

IO27

GP

IO26

GP

IO25

GP

IO52

GP

IO53

GP

IO8

GP

IO9

GP

IO10

GP

IO11

GP

IO50

GP

IO51

GP

IO44

GP

IO20

GP

IO20

GP

IO21

GP

IO21

GP

IO23

GP

IO23

GP

IO54

GP

IO54

GP

IO55

GP

IO55

GP

IO56

GP

IO56

EQ

EP

1A

EQ

EP

1A

EQ

EP

1B

EQ

EP

1B

EQ

EP

1I

EQ

EP

1I

EQ

EP

2A

EQ

EP

2A

EQ

EP

2B

EQ

EP

2B

EQ

EP

2I

EQ

EP

2I

AD

CIN

B6

DA

C1

DA

C2

DA

C3

DA

C4

GP

IO30

GP

IO31

CA

NH

CA

NL

AD

CIN

A7

J7.3

J7.4

J1.3

J1.4

Roy

Yau

ng

A B C D E

A B C D E

12

34

56

1 2 3 4 5 6 7 8 9 10

41

42

43

44

45

46

47

48

49

50

1112

13

14

15

16

17

18

19

20

51

52

53

54

55

56

57

58

59

60

21

22

23

24

25

26

27

28

29

30

61

62

63

64

65

66

67

68

69

70

31

32

33

34

35

36

37

38

39

40

71

72

73

74

75

76

77

78

79

80





Figure 8. LAUNCHXL-F28069_B_1400922 Connector Schematic

http://www.ti.com


1.1

Lo

gic

Ch

oic

e

MU

X_S

ELC

H_S

EL

00 0

1

UA

RT

Dis

able

; G

PIO

28&

29

—J1.3

& J

1.4

; G

PIO

15&

58

—J7.3

& J

7.4

.

U11

& U

15

Dis

able

; G

PIO

15&

58

—J7.3

& J

7.4

;G

PIO

28&

29

—U

AR

T.

Channel D

escription

1 1

0 1

U16 D

isable

; G

PIO

28&

29

—F

ault

& O

ctw

;G

PIO

15&

58

—U

AR

T.

U16 D

isable

; G

PIO

28&

29

—F

ault

& O

ctw

;G

PIO

15&

58

—U

AR

T.

MU

X2

MU

X1

OR

G

GN

D

SN

74A

HC

1G

32

+3V

3

0.1u

GN

D

SN

74A

HC

1G

32

+3V

3

0.1u

GN

D

SN

74LV

4052A

PW

0.1u

GND

+3V

3

GN

D

GN

D

TS

5A

31

53

DC

UR

+3V

3

0.1u

GND

GN

D

TS

5A

31

53

DC

UR

+3V

3

0.1u

GNDG

ND

GN

D

TS

5A

23

15

9D

GS

R

+3V

3

GN

D

+3V

3

0.1u

GND

GN

D

10K

10K

+3V

3

0.1u

GN

D

GN

D

SN

74LV

C1G

04D

CK

R

0.1

u GN

D

+3V

3

SN

74A

HC

1G

02D

BV

R

A1

B2

GND 3VCC5

Y4

U13

C46

A1

B2

GND 3VCC5

Y4

U14

C47

1C

OM

P$

13

1Y

0P

$1

2

1Y

1P

$1

4

1Y

2P

$1

5

1Y

3P

$11

2C

OM

P$

32

Y0

P$

1

2Y

1P

$5

2Y

2P

$2

2Y

3P

$4

GND1 P$8

GND2 P$7

INH

P$

6S

0P

$1

0

S1

P$

9

VCCP$16

U10

C38

12

JP6T

P25

TP

26

EN

P$

2

CO

MP

$1

GN

D1

P$

3

GN

D2

P$

4IN

P$

5

NC

P$

7

NO

P$

6V

+P

$8

U11

C48

EN

P$

2

CO

MP

$1

GN

D1

P$

3

GN

D2

P$

4IN

P$

5

NC

P$

7

NO

P$

6V

+P

$8

U1

5

C49

CO

M1

P$

10

CO

M2

P$

6

IN1

P$

1

IN2

P$

5

NC

1P

$9

NC

2P

$7

NO

1P

$2

NO

2P

$4

V+P$8 V- P$3

U1

6

12

JP7

C42

TP

3

TP

4

TP

9

TP

27

TP

28

TP

29

R3

R11

C7

TP

12

4

U18A

35 U18P

GNDVCC

C9

A1

B2

GND 3VCC5

Y4

U4

GP

IO28

GP

IO28

GP

IO29

GP

IO29

FA

ULT

_O

FA

ULT

_O

OC

TW

_O

OC

TW

_O

J1.3

J1.3

J7.3

J7.3

J7.4

J7.4

J1.4

J1.4

GP

IO58

GP

IO58

GP

IO15

GP

IO15

SC

I_R

X

SC

I_T

X

CH

_S

EL

CH

_S

EL

CH

_S

EL

MU

X_S

EL

MUX_SELMU

X_S

EL

MU

X_S

EL

MU

X_S

EL

EN

EN

Ro

yY

au

ng

A B C D E

A B C D E

12

34

56





Figure 9. LAUNCHXL-F28069_B_1400922 Logic Choice Schematic

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1.1

Po

we

r

Vo

ut

= 5

VIo

ut

=0

.5A

CD

RH

3D

16/H

PN

P-3

R3N

C

82

0p

LM

R6

24

21

XM

FE

/NO

PB

10K

3.3

uH

1N

58

19

HW

-7-F

10

uF

30.1K 10K

4.7

u

+3

V3

GN

DG

ND

C2

5

FB

3

GND2

SD

4

SW

ITC

H1

VIN

5

U1

2

R14

L6

D3

C4

1

R17 R45

TP

2

C8

LP

_5

V

Ro

yY

au

ng

A B C D E

A B C D E

12

34

56





Figure 10. LAUNCHXL-F28069_B_1400922 Power Schematic

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6.3 PCB LayoutFigure 11 through Figure 16 shows the LAUNCHXL-F28069M PCB layout.

Figure 11. Top Silk Figure 12. Top Copper

Figure 13. Inner Copper 1 Figure 14. Inner Copper 2

Figure 15. Bottom Silk Figure 16. Bottom Copper

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6.4 Bill of Materials (BOM)Table 7 lists the LAUNCHXL-F28069M bill of materials.

Table 7. LAUNCHXL-F28069M Bill of Materials

S No Category MPN Per Mfg. Description Package ValueWorkingVoltage Reference

1 PCB LAUNCHXL-F28069M PCB 1 4 layers PCB,Red Soldermask, white Silkscreen,Immersion gold, 51 mm*130.5 mm,LAUNCHXL-F28069M PCB

2 MCU TMS320F28069MPZT 1 TI MCU 32-bit C2000 C28x RISC 128KB Flash 3.3 V100-Pin LQFP, customer supply

LQFP-100 1.71~1.995 V U1

3 Memory 93LC56BT-I/OT 1 Microchip IC, EEPROM Serial-Microwire 2K-Bit 128 x 16 2 MHz,93LC56BT-I/OT,SOT-23-6, SMD

SO-23-6 2Kb 2.5~5.5 V U8

4 DC-DC LMR62421XMFE/NOPB 1 TI Conv DC-DC Single Step Up 2.7 V to 5.5 V 5-Pin SOT-23T/R, customer supply

SOT23-5 2.7 V to 5.5 V U12

5 DC-DC TPS62162DSGR 1 TI Conv DC-DC Single Step Down 3 V to 17 V 8-Pin WSONEP T/R, customer supply

WSON-8 3 V to 17 V U17

6 Logic SN74AHC1G32DBVR 2 TI IC, Single 2-Input Positive-OR Gate,SN74AHC1G32DBVR, SOT23-5, SMD, customer supply

SOT23-5 2~5.5 V U13,U14

7 Logic TXB0106PWR 1 TI IC, 6-BIT Bidirectional Voltage-Level Translator withAuto-Direction Sensing and ±15-kV ESD Protection,TXB0106PWR, TSSOP-16, SMD, cusomer supply

TSSOP-16 1.2~5.5 V U2

8 Logic SN74LV4052APW 1 TI Analog Multiplexer Dual 4:1 16-Pin TSSOP Tube,customer supply

TSSOP-16 2~5.5 V U10

9 Logic SN74LVC2G07DBVR 1 TI Buffer/Driver 2-CH Non-Inverting Open Drain CMOS6-Pin SOT-23 T/R, customer supply

SOT23-6 1.65~5.5 V U9

10 Logic SN74LVC1G04DCKR 1 TI IC, Single Inverter Gate, SN74LVC1G04DCKR, SC70-5,SMD

SC70-5 1.65 V ~ 5.5 V U18

11 Logic SN74AHC1G02DBVR 1 TI "IC, NOR Gate 1-Element 2-IN CMOS,SN74AHC1G02DBVR,SOT23-5, SMD

SOT23-5 2 V ~ 5.5 V U4

12 Interface SN65HVD234D 1 TI IC, 3.3 V CAN Transceiver with Sleep Mode,SN65HVD234D,SOIC-8, SMD, customer supply

SO-8 3.3V U3

13 Interface FT2232HQ-REEL 1 FTDI IC, Dual High Speed USB to Multipurpose UART/FIFOIC,FT2232HQ-REEL, QFN-64, SMD

QFN-64 1.62 V to 1.98V

U6

14 Interface TS5A3153DCUR 2 TI Analog Switch Single SPDT 8-Pin VSSOP T/R, customersupply

VSSOP-8 1.65~5.5 V U11, U15

15 Interface TS5A23159DGSR 1 TI Analog Switch Dual SPDT 10-Pin VSSOP T/R, customersupply

VSSOP-10 1.65~5.5 V U16

16 Isolator ISO7231CDWR 1 TI IC DGTL ISO 3CH CMOS 16SOIC, customer supply SO-16 3.15~5.5 V U7

17 Isolator ISO7240CDWR 1 TI IC DGTL ISO 4CH CMOS 16SOIC, customer supply SO-16 3.15~5.5 V U5

18 Thick film Resistor RC0402JR-070RL 4 YAGEO RES, 0R, ±5%,1/16W, SMD0402 0402 0R 50 V R15, R33, R43,R44

19 Thick film Resistor RC0402JR-07120RL 1 YAGEO RES, 120R, ±5%, 1/16W, SMD0402 0402 120R 50 V R34

20 Thick film Resistor RC0402JR-07330RL 4 YAGEO RES, 330R, ±5%, 1/16W, SMD0402 0402 330R 50 V R26, R27, R38,R39

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Table 7. LAUNCHXL-F28069M Bill of Materials (continued)


21 Thick film Resistor RC0402JR-07820RL 4 YAGEO RES, 820R, ±5%, 1/16W, SMD0402 0402 820R 50 V R1, R4, R5,R46

22 Thick film Resistor RC0402JR-071KL 6 YAGEO RES, 1K, ±5%, 1/16W, SMD0402 0402 1K 50 V R22, R23, R36,R37, R40, R41

23 Thick film Resistor RC0402JR-072K2L 6 YAGEO RES, 2K2, ±-5%, 1/16W, SMD0402 0402 2K2 50 V R2, R6, R8,R9, R10, R31

24 Thick film Resistor RC0402JR-0710KL 7 YAGEO RES, 10K ±5%, 1/16W, SMD0402 0402 10K 50 V R3, R11, R12,R14, R35, R42,R45

25 Thick film Resistor RC0402FR-0712KL 1 YAGEO RES, 12K, ±1%,1/16W, SMD0402 0402 12K 50 V R24

26 Thick film Resistor RC0402FR-0730K1L 1 YAGEO RES, 30K1, ±1%, 1/16W, SMD0402 0402 30K1 50 V R17

27 Thick film Resistor RC0402JR-07100KL 1 YAGEO RES, 100K, ±5%, 1/16W, SMD0402 0402 100K 50 V R47

28 Ceramic Capacitor GRM1555C1H821JA01D 1 Murata CAP, 820PF, ±5%, C0G, 50 V, SMD0402 0402 820PF 50 V C25

29 Ceramic Capacitor GRM155R71C104KA88D 23 Murata CAP, 100 NF, ±10%, X7R,16 V, SMD0402 0402 100 NF 16 V C7, C9, C12,C13, C14, C16,C24, C31, C32,C33, C34, C35,C36, C37, C38,C39, C40, C42,C43, C46, C47,C48, C49

30 Ceramic Capacitor GRM155R60J225ME15D 14 Murata CAP, 2.2 µF, ±20%, X5R, 6.3 V, SMD0402 0402 2.2 µF 6.3 V C1, C2, C5,C6, C19, C20,C21, C22, C23,C26, C27, C28,C29, C30

31 Ceramic Capacitor GRM32DR71E106KA12L 2 Murata CAP, 10 µF, ±10%, X7R, 25 V, SMD1210 1210 10 µF 25 V C41, C44

32 Ceramic Capacitor CC1210KKX5R7BB226 1 YAGEO CAP, 22 µF, ±10%, X5R, 16 V, SMD1210 1210 22 µF 16 V C45

33 Ceramic Capacitor GRM155R60J475ME47 3 Murata CAP, 4.7 µF, ±20%, X5R, 6.3 V, SMD0402 0402 4.7 µF 6.3 V C8, C10, C11

34 Ceramic Capacitor CL05A335MR5NNNC 1 Samsung CAP, 3.3 µF, ±20%, X5R, 4 V, SMD0402 0402 3.3 uF 4 V C15

35 Ceramic Capacitor GRM1555C1H360JA01D 2 Murata CAP, 36 pF, ±5%, C0G, 50 V, SMD0402 0402 36 pF 50 V C17, C18

36 Inductor CDRH2D18/HPNP-2R2NC 1 Sumida Power Inductor, Magnetic shielded, 2.2 µH, 1.6A, 0.06 Ω,3.0 x 3.0 x 1.8 mm, SMD

3.0X3.0mm 2.2 µH L7

37 Inductor CDRH3D16/HPNP-3R3NC 1 Sumida Power Inductor, Magnetic shielded, 3.3 µH,1.4A, 0.085 Ω,3.8 x 3.8 x 1.6 mm, SMD

3.8X3.8mm 3.3 µH L6

38 Ferrite Bead BLM15AG601SN1D 2 Murata Ferrite Bead, 60 Ω@100 MHz, ±25%, 300 mA,0.6 Ω,SMD0402

0402 600 Ω L1, L2

39 Ferrite Bead BLM15PD600SN1D 1 Murata Ferrite Bead, 60 Ω@100 MHz, ±25%,1700 mA, 0.06Ω,SMD0402

0402 60 Ω L4

40 Ferrite Bead BLM15AG221SN1D 1 Murata Ferrite Bead, 220 Ω@100 MHz, ±25%, 300 mA, 0.6 Ω,SMD0402

0402 220 Ω L3

41 LED 19-217/R6C-AL1M2VY/3T 2 Everlight LED, Brilliant Red, Water Clear, 20 mA, SMD0603 0603 1.7~2.3 V D8, D9

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Table 7. LAUNCHXL-F28069M Bill of Materials (continued)


42 LED 19-217/G7C-AN1P2/3T 2 Everlight LED, Super Yellow Green, Water Clear, 20 mA,SMD0603

0603 1.75~2.35 V D1, D4

43 LED 19-217/BHC-AN1P2/3T 2 Everlight LED, Blue, Water Clear, 20 mA, SMD0603 0603 1.7~2.2 V D7, D10

44 Diode 1N5819HW-7-F 1 Diodes Diode,Schottky Diode, 1N5819HW-7-F, 40 V, 1A, SOD-123,SMD

SOD-123 40 V D3

45 Polyswitch SMD1812P050TF 1 PTTC Polyswitch, SMD1812P050TF, 15 V, Ihold=0.5A, Itrip=1A,0.5 Ω, SMD1812

1812 15 V F1

46 Crystal 7D12000182BTAF60Q5 1 Interquip Crystal, 7D12000182BTAF60Q5, 12 MHz, ±20 PPM,18PF, HC-49S, SMD

HC-49SMD 12 MHz Q3

47 Pin Header P6E02A-602530-B1 7 CHI-BAN Connector, Pin Header, Straight, Male,1 x 2 Pin, 2.54 MMpitch, 6.06, 3.00, Gold Flash 1µ, black, DIP

DIP JP1,JP2,JP3,JP4,JP5,JP6,JP7

48 Pin Header P6E03A-602530-B1 2 CHI-BAN Connector, Pin Header, Straight, Male, 1 x 3 Pin, 2.54MM pitch, 6.06, 3.00, Gold Flash 1µ, black, DIP

DIP J9,J12

49 Pin Header P101-1*05SGF-116A-NX 2 Townes Connector, Pin Header, Straight, Male, 1 x 5 Pin, 2.54MM pitch, 6.06, 3.00, Gold Flash 1µ, black, DIP

DIP QEP_A,QEP_B

50 Pin Socket CRD-081413-A-G 4 Major League Connector, Pin Socket, Straight, Female, 2 x 10 Pin, 2.54MM pitch, 8.5, 9.92, Gold Flash 1µ, black, DIP

DIP J1,J2,J3,J4,J5,J6,J7,J8

51 USB Connector UBF11-03 1 JXT Connector, MiniUSB AB port, 5 Position, Right Angle,Gold Flash 1µ, black, SMD

SMD CON1

52 Shunt MJ501-EOGF-B-K 7 Townes Connector, Shunt, 2Pin, 2.54 MM Pitch, 6 MM Height,Gold Flash 1µ, black

U$1, U$2, U$9,U$10, U$11,U$12, U$13,

53 Tacticle Switch TP-1138K9-BE1125 1 Toneparts Switch, Tacticle, 160gf ±50gf, black housing, blackplunger, 6*6*4.3 MM, SMD

SMD-4 S2

54 DIP Switch DSIC03LSGET 1 KE Switch, DIP SWITCH, 3 Position, 2.54 MM Pitch, blackhousing, white plunger, SMD

SMD S1

55 Thick Film Resistor RC0402FR-071KL 6 YAGEO RES, 1K, ±1%, 1/16W, SMD0402 0402 1K 50 V R13,R29,R48-R51

56 Ceramic Capacitor GRM155R71H102KA01D 6 Murata CAP ,1NF, ±10%, X7R, 50 V, SMD0402 0402 1NF 50 V C50-C55

57 ESD bag Anti-static bag 180*130mm , 1 Anti-static bag 180*130 mm

58 Label 700/SCH, Label,11mm*7mm 1 700/SCH Label,11 mm*7 mm

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Frequently Asked Questions (FAQ) www.ti.com




7 Frequently Asked Questions (FAQ)1. Can other programming and debug tools (such as an XDS510 debug probe) be used with the C2000

LaunchPad?While a user could potentially connect an external debug probe to the F28069M device present on theLaunchPad, it would require some rework of the board. It is recommended that users who want to usean external debug probe purchase a controlCard and docking station that includes an external JTAGconnector.

2. What versions of Code Composer Studio can be used to develop software for the C2000 LaunchPad?It is highly recommend that novice users develop applications with Code Composer Studio v6. Thedrivers, examples, and other associated software are tailored to make the user experience as smoothas possible in Code Composer Studio v6.

3. Why can’t I connect to the LaunchPad in Code Composer Studio?There are a number of things that could cause this and they all have an easy fix.• Is S1 switch 3 in the down position?

This is the TRST pin that enables and disables JTAG functionality on the chip. This switch must bein the up position for the debug probe to be able to connect.

• Are both power LEDs lit?The board has two power domains because of the isolated JTAG interface. For low-voltageapplication development, JTAG isolation is not needed and the power domains can be combined toallow for convenience (that is, the board can be powered completely through the USB). Ensure thatjumpers are placed on the posts of JP1 and JP2.

• Are drivers correctly installed for the XDS100v2 present on the LaunchPad?Right click on My Computer and select properties. Navigate to the Hardware tab in the dialog boxand open the device manager. Scroll to the bottom of the list and expand the USB Serial Buscontrollers item. Are there two entries for TI XDS100 Channel A/B? If not, try unplugging andreplugging in the board. Does Windows give you any messages in the system tray? In DeviceManger, do either of the entries have a yellow exclamation mark over their icon? If so, tryreinstalling the drivers.

4. Why is the serial connection not working?The most common cause of this is the serial muxing being set incorrectly. Ensure that JP7 has ajumper placed on it while JP6 does not have a jumper before proceeding further.• Are you using the correct COM port?

Right click on My Computer and select properties. Navigate to the Hardware tab in the dialog boxand open the device manager. Scroll to Ports (COM & LPT) and expand this entry. Is there a USBSerial Port listed? If so, read the COM number to the right of the entry; this is the COM number youshould be using.If the USB Serial COM Port is not identified by the computer, reprogram the XDS100v2 EEPROMusing these instructions.

• Are you using the correct baud rate?Most, if not all, of the examples are configured for a baud rate of 115200 when the CPU is runningat 60 MHz. If you have changed the PLL settings or written your own application you may have torecalculate the baud rate for your specific application. For information on how to do this, see theTMS320x2802x, 2803x Piccolo serial communications interface (SCI) reference guide.

http://www.ti.com



http://www.ti.com/lit/pdf/SPRUGH1

www.ti.com References




8 ReferencesThe following documents describe the C2000 devices. Copies of these documents are available on theInternet at http://www.ti.com/c2000 and www.ti.com/c2000-launchpad, or click on the links below:• Texas Instruments: TMS320F2806x Piccolo™ microcontrollers data manual• Texas Instruments: TMS320F2806x Piccolo™ MCUs Silicon errata revisions B, A, 0• Texas Instruments: TMS320x2806x Piccolo technical reference guide• Texas Instruments: TMS320C28x extended instruction sets technical reference manual• Texas Instruments: TMS320C28x instruction set simulator technical overview• Texas Instruments: TMS320C28x optimizing C/C++ compiler user's guide• Texas Instruments: TMS320C28x assembly language tools user's guide• Texas Instruments: TMS320x2802x, 2803x Piccolo serial communications interface (SCI) reference

guide

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http://www.ti.com/c2000

http://www.ti.com/c2000-launchpad

http://www.ti.com/lit/pdf/SPRS698

http://www.ti.com/lit/pdf/SPRZ342


http://www.ti.com/lit/pdf/SPRUHS1

http://www.ti.com/lit/pdf/SPRU608





Revision History www.ti.com



Revision History

Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from A Revision (August 2018) to B Revision ................................................................................................ Page

• Global replace of "emulator" with "debug probe"...................................................................................... 1• Added Section 2.1 to document known issues with Design ......................................................................... 3• Added link to XDS100 reprogram instructions ....................................................................................... 22

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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2019, Texas Instruments Incorporated

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LAUNCHXL-F28069M overview (Rev. B)

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Transcript of LAUNCHXL-F28069M overview (Rev. B)