Leading Indicator Program OverView Rev A
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Transcript of Leading Indicator Program OverView Rev A
Leading Indicator Program
Overview
Sampled material
All other production material
MANUFACTURING INTERACTIONS
Leading Indicator Description
A continuous improvement program based
on statistical limits for both material and
equipment through the approach of zero
defects, process results, close loop controls,
maverick material analysis and improvement,
equipment utilization /uptime analysis and
real time controls/analysis. It includes three
type indicators – process, equipment, and
electrical leading indicators. The system
identifies any maverick processed material
prior to leaving the manufacturing site.
A multiple faceted approach to manufacturing
Zero defect approach
Process results; closed loop controls
Equipment utilization/uptime analysis
Real time controls/analysis
Continuous improvement based on statistical limits for both material and equipment
Key Elements of Leading Indicators
Leading Indicator Program Features
Event based analysis
Known as Leading indicators
Based on location; machine, process, or electrical leading indicators
By package family ( SOIC, P-Dip, DFN, BGA )
Limits are derived by statistical analysis
Analysis is real time
Each nonconforming event will define action to be taken
OCAP’s, ( out of control action plans )
Failure analysis
Material disposition
Line requalification
Leading Indicator Program Features
Data is generated real time
OCAP’s ( Out of control action plan ) are required for each operation
Closed loop analysis, maverick data requires F.A. ( Failure Analysis ) and C.A. ( Corrective action) on each event
Pareto charts defines major issues which need to be worked
Data to be sent to WEB or FTP site for continuous monitoring of controls and improvements
Assembly Continuous Improvement • Definition of defects
– Goal of assembly is continuous drive to zero defects
– Definition of different types of defects
– Systemic
More than one incident with identical failure
Requires OCAP ( out of control action plan ) if 3 incidents in a 2 week period line shutdown until problem/problems are solved
– Maverick
Random defects
Outliers
Difficult to predictMaverick point
Leading Indicator Process Driven
Program
List of current Process Leading Indicators used in manufacturing
Assembly yields by operation ( .2% yield loss notification limit )
Wetting angle (post D/A cure)
W/B ( Wire Bond ) work holder cratering test by bond site
C-Sam monitoring ( post mold IR reflowed and analysis )
FVI ( final visual inspection)
Final Test Parametric Analysis
Tape and reel
Process Leading Indicator (actual data)
Process Leading Indicator Tape and Reel
yields (actual data)
Equipment Leading Indicator Tape
and ReelOperator will inspect all rejects > .2% , separating rejects by
category for engineers to define R/C
Lead Scan
Good
Mark
Analysis
Lead
AnalysisR track
Reject
Rescreen
Next station
Good
Lead Scan
Basic Process Flow
Closed loop analysis
to determine R/C
Equipment Leading Indicators
Each piece of equipment will be under ELI’s ( EquipmentLeading Indicators )
Each piece of equipment will be divided into sub-systems for analysis
Data will be generated on assist and failures
Statistical control on assist and machine failures
OCAP ( Out of Control Action Plan ) limits to be set for assist and hard failures
Paytner and pareto charts will be generated to identify weak sub-systems
Equipment Leading Indicator
SOIC 8LDS HDLF WIREBOND MACHINE LEADING INDICATOR (Actual data)
Corrective Actions for Wire Bonders
Corrective actions are based on assist by
subsystem
Electrical Leading IndicatorsParametric Maverick lot trend analysis
A statistical approach to maverick lot analysis
Parametric yields ( .3% per failure mode or .4% overall parametric yield limit)
Analysis based on parametric yields
Limits based on a statistical mean and
Std Dev. ( Standard Deviation )
Opens, shorts, Isb (standby current ) and pin leakage
F.A. training required to understand failure mechanism
All lots which fail, require F.A. to determine R/C
F.A. flow defined to prevent destroying critical information in determining R/C
Maverick lot trend Parametric failures
(Actual Data)
Parametric Failure Analysis F.A. flow for
Electrical Failures Parametric leading indicators
Close loop analysis – Assembly, test and F.A. work together to solve root cause of maverick lots
All lots which fail maverick lot limits are analyzed for root cause and C/A ( Corrective Actions ) are implemented in assembly to prevent reoccurrence of problem.
Leading Indicators
Conclusion
Program identifies any maverick processed material prior to leaving the manufacturing siteZero defect program
Continuous improvement through statistically based analysis
Program is both equipment and process focused
Real time monitoring and analysis
Predicts potential equipment mis-processing before it happens