Large-Scale Photonic Integrated Circuitsconference.vde.com/ecoc-2009/programs/documents/ws7... ·...
Transcript of Large-Scale Photonic Integrated Circuitsconference.vde.com/ecoc-2009/programs/documents/ws7... ·...
1Effective Date: 01SEP2009 PPT-INFN-01-001-0909-00
Large-Scale Photonic Integrated Circuits
Fred Kish
2
Telecom ApplicationsMetrics that truly matter ….
Cost/bit Power/bit
Capacity per chip
Spectral Efficiency
Direct CapEx and OpEx implications
Maximum fiber capacity
Operational ease, density and
reliability
3
Why PICs?Providing Value to Network Solutions
• PIC disruption
–Space
–Reliability
–Power
–Cost
• “Digital experience” Disruption
–Speed
–Intelligence
–Bandwidth Virtualization
4
Large-Scale 100 Gb/s Commercial PICsEnable Scaling of the Network
10 x 10Gb/s
Electrical Input
Optical
Output
1... 10
10 x 10Gb/sA
WG
Mult
iple
xer
CH1
CH10
DC
Ele
ctri
cal
Bia
s an
d C
ontr
ol
VO
A A
rray
EA
M A
rray
OP
M A
rray
Tunab
le D
FB
Arr
ay
Optical
Input
CH1
CH10
PIN
Photo
dio
de
Arr
ay
AW
G D
e-M
ult
iple
xer
10 x
10G
b/s
Ele
ctri
cal
Outp
ut
10 x 10Gb/s
Electrical Input
Optical
Output
1... 10
10 x 10Gb/sA
WG
Mult
iple
xer
CH1
CH10
DC
Ele
ctri
cal
Bia
s an
d C
ontr
ol
VO
A A
rray
EA
M A
rray
OP
M A
rray
Tunab
le D
FB
Arr
ay
Optical
Input
CH1
CH10
PIN
Photo
dio
de
Arr
ay
AW
G D
e-M
ult
iple
xer
10 x
10G
b/s
Ele
ctri
cal
Outp
ut
10 x 10Gb/s
Electrical Input
Optical
Output
1... 10
10 x 10Gb/s
AW
G M
ult
iple
xer
CH1
CH10
DC
Ele
ctri
cal
Bia
s an
d C
on
tro
l
VO
A A
rray
EA
M A
rray
OP
M A
rray
Tu
nab
le D
FB
Arr
ay
Optical
Input
CH1
CH10
PIN
Ph
oto
dio
de
Arr
ay
AW
G D
e-M
ult
iple
xer
10
x 1
0G
b/s
Ele
ctri
cal
Ou
tput
10 x 10Gb/s
Electrical Input
Optical
Output
1... 10
10 x 10Gb/s
AW
G M
ult
iple
xer
CH1
CH10
DC
Ele
ctri
cal
Bia
s an
d C
on
tro
l
VO
A A
rray
EA
M A
rray
OP
M A
rray
Tu
nab
le D
FB
Arr
ay
Optical
Input
CH1
CH10
PIN
Ph
oto
dio
de
Arr
ay
AW
G D
e-M
ult
iple
xer
10
x 1
0G
b/s
Ele
ctri
cal
Ou
tput
-80
-70
-60
-50
-40
-30
-20
-10
0
10
1526 1530 1534 1538 1542
Wavelength (nm)
No
rma
lize
d P
ow
er (
dB
)
-35
-30
-25
-20
-15
-10
-5
0
5
1528 1533 1538 1543 1548Wavelength (nm)
No
rma
lize
d P
ho
tore
spo
nse
(d
B)
200 Million Field Hours Without Failure
1
10
100
1,000
0
50
100
150
200
FIT
Fie
ld h
ou
rs (
Mil
lio
n-h
ou
rs)
5
0
1
2
3
4
5
6
7
8
1970 1980 1990 2000 2010
Kil
ler
Defe
ct
Den
sit
y (
cm
-2)
Si Integrated
Circuits
Infinera
Photonic ICs
Large-Scale Photonic IC Defect Density
Killer defect density of
Infinera PICs comparable to
Si circa 1993
YD =
-
1 + D1/
Random defect density reduction most important for higher
capacity / complexity PICs
0.1
1
10
100 1000 10000Cumulative Volume
Kille
r D
efe
dct
Den
sit
y (
cm
-2)
Large-Scale PIC
Defect “Learning Curve”
Volume Manufacturing
Enables Defect “Learning Curve”
6
Transmitter PIC with Integrated SOAs
SOA used for both gain (increased launch power), power flatness and/or pre-emphasis control
Optical
Output
1... N
Ch 1
Ch 10
DC ElectricalBias and
Control
RF Input
10 Gb/s
... Mult
iple
xer
Ch 2Ch 3
• •
•
•
• •
• •
•
• •
•
• •
•
• •
••
• •
• •
•
• •
•
• •
•
7
100Gb/s PICs in ULH ApplicationsSubmarine Networks
• 25 GHz and high density• > 6,000 km links• >50,000 km of routes deployed• Operational simplicity
-30
-25
-20
-15
-10
-5
191.9 192.4 192.9 193.4
Po
we
r (d
B)
9
10
11
12
13
14
15
191.9 192.4 192.9 193.4
Q (d
B)
FEC LIMIT
>6100km Trans-Atlantic System
31 channels @ 25 GHz spacing
8
PICs & SOA Enable Use of The Entire Fiber Bandwidth
• S, C and L band PICs demonstrated.
2 3 4
SOA SOA SOA SOA AW
G
S-Band
Tx PIC
S-Band
Rx PIC
1
-30
-25
-20
-15
-10
-5
0
1480 1485 1490 1495 1500
Inte
ns
ity
(a
rb u
nit
s)
Wavelength (nm)
Ch 1Ch 10
NF ~ 6.5 dB4 x 80 = 320 km spans of LEAF
No external dispersion
compensation
Xu et al., OFC 2009 JThA49
9
~300 SOAs
High Gain
Receiver PIC with Integrated SOA
Low Noise Figure
10
PIC Platform Scalable to 40 Channels
-60
-50
-40
-30
-20
-10
0
No
rma
lize
d O
utp
ut
Po
we
r (d
B)
1.5651.5601.5551.550
Wavelength (µm)
-35
-30
-25
-20
-15
-10
-5
0
No
rma
lize
d R
es
po
nsiv
ity
[d
B]
15641560155615521548
Wavelength [nm]
40-Channel Tx PIC 40-Channel Rx PIC
11
Unit Share for 10G Waves
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
1998 2000 2002 2004 2006 2008
Shar
e o
f W
ave
s Sh
ipp
ed
Infinera
First Mover in 10G
Source: Infinera and analyst estimates
12
Worldwide Wavelength Shipments
0
50
100
150
200
250
300
350
1995 2000 2005 2010(E)
Tho
usa
nd
s o
f W
ave
len
gth
s
2.5G
10G
40G
Source: Ovum and Infinera analysis
Infinera market entry
13
1
10
100
1000
10000
1990 2000 2010 2020
Year
Dat
a C
apac
ity
Per
Ch
ip (
Gb
/s)
1
10
100
1000
10000
Scaling of InP-Based Transmitter
Photonic Integrated Circuits
in Telecommunications Networks
EML
Large-Scale DWDM Tx PICs
10 x 10 Gb/s (OOK)
10 x 40 Gb/s (DQPSK)
PIC Roadmap
(Projected)
100
400
1000
2000
4000
10
1
100
400
1000
2000
4000
10
1
Photonic Integrated Circuit Capacity Scaling History and Roadmap
Large-Scale DWDM TxPICs
PM-DQPSK (10 x 40G)
10GBaud x 4 /
1.6 bits/Hz
DQPSK (10 x 40G)
20GBaud x 2 /
0.8 Bits/Hz
14
400 Gb/s Transmitter Architecture
PBC
TE
(to become TM)
DFB
DFB
DFB
DFB
DFB
DFB
DFB
DFB
DFB
MUX
PM
PM
PM
PM
PM
PM
PM
PM
PM
PM
DFB
DFB
DFB
DFB
DFB
DFB
DFB
DFB
DFB
DFB
DFB
MUX
Rot
SOA
SOA
15
DFB linewidth
= 1.0MHz
10-8
10-7
10-6
10-5
10-4
10-3
10-2
Po
we
r (
a.u
.)
194.7550194.7545194.7540194.7535194.7530
Frequency (THz)
Raw Data Linewidth = 1MHz
(Lorentzian Curve Fit)
OSA resolution = 15MHz
400 Gb/s PIC: 10-Channel DFB L-I and Spectra
-60
-50
-40
-30
-20
-10
0
Norm
aliz
ed P
ow
er
(dB
)
1.5451.5401.5351.5301.525
Wavelength (µm)
20
15
10
5
DF
B P
ow
er
(a.u
.)
14012010080604020
DFB Current (mA)
SMSR
> 48dB
16
400 Gb/s Tx PIC: MZM Performance
Vπ (material) = 2Vπ (switching)
-50
-40
-30
-20
-10
0
10
Po
wer
(dB
)
-2 -1 0 1 2
Voltage (V)
Overlay Plot
Y
01-tm-I1-I2-initialPA1
01-tm-Q1-Q2-init ialPA1
ER
> 4
0d
BV = 2.5V
TM to be
I
Q
TE
I
Q
17
400 Gb/s PIC: MZM Bandwidth Characterization
Small-signal BW = 15GHz-12
-9
-6
-3
0
3E
/O r
esponse (
dB
e)
20151050
Frequency (GHz)
18
-15
-10
-5
0
Po
wer
(dB
m)
1535.4 1535.6 1535.8 1536
Wavel ength (nm)
Overlay Plot
-1
0
1
Q
-1 0 1
I
Overlay Plot
400 Gb/sTx PIC
VOAEDFA
ASE
Source
Bandpass
Filter
From
PIC
OSA
Pol.
Scr
VOA
3dB Coupler
Scope
OPM
19
Wrap-up
Now …….
PIC Scaling
Going Forward…….
100G + 400G PICs
• Match discretes in performance
• Unmatched space, power and reliability
• Deliver lowest cost/bit with high spectral efficiency
• Double capacity per chip every three years
• Ability to support advanced modulation schemes and receiver designs
• Expansion to other bands - L-band, S-band