L293NE Texas Instruments

8/3/2019 L293NE Texas Instruments

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L293, L293DQUADRUPLE HALFH DRIVERS

SLRS008C SEPTEMBER 1986 REVISED NOVEMBER 2004

1POST OFFICE BOX 655303 DALLAS, TEXAS 75265

D Featuring Unitrode L293 and L293D

Products Now From Texas Instruments

D Wide Supply-Voltage Range: 4.5 V to 36 V

D Separate Input-Logic Supply

D Internal ESD Protection

D Thermal ShutdownD High-Noise-Immunity Inputs

D Functionally Similar to SGS L293 andSGS L293D

D Output Current 1 A Per Channel(600 mA for L293D)

D Peak Output Current 2 A Per Channel(1.2 A for L293D)

D Output Clamp Diodes for InductiveTransient Suppression (L293D)

description/ordering information

The L293 and L293D are quadruple high-currenthalf-H drivers. The L293 is designed to providebidirectional drive currents of up to 1 A at voltagesfrom 4.5 V to 36 V. The L293D is designed to

provide bidirectional drive currents of up to600-mA at voltages from 4.5 V to 36 V. Bothdevices are designed to drive inductive loads suchas relays, solenoids, dc and bipolar steppingmotors, as well as other high-current/high-voltageloads in positive-supply applications.

All inputs are TTL compatible. Each output is a

complete totem-pole drive circuit, with aDarlington transistor sink and a pseudo-Darlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4enabled by 3,4EN. When an enable input is high, the associated drivers are enabled, and their outputs are active

and in phase with their inputs. When the enable input is low, those drivers are disabled, and their outputs areoff and in the high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or bridge)reversible drive suitable for solenoid or motor applications.

ORDERING INFORMATION

TA PACKAGE ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

HSOP (DWP) Tube of 20 L293DWP L293DWP

PDIP (N) Tube of 25 L293N L293N

0C to 70C

Tube of 25 L293NE L293NEPDIP (NE)

Tube of 25 L293DNE L293DNE

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

Copyright 2004, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing doesnot necessarilyincludetesting of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

HEAT SINK ANDGROUND

HEAT SINK ANDGROUND

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

1,2EN

1A

1Y

2Y

2A

VCC2

VCC14A

4Y

3Y

3A

3,4EN

L293 . . . N OR NE PACKAGE

L293D . . . NE PACKAGE

(TOP VIEW)

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

1,2EN

1A

1Y

NCNC

NC

NC

NC

2Y

2A

VCC2

VCC14A

4Y

NCNC

NC

NC

NC

3Y

3A

3,4EN

L293 . . . DWP PACKAGE

(TOP VIEW)

HEAT SINK ANDGROUND

HEAT SINK ANDGROUND


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2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

description/ordering information (continued)

On the L293, external high-speed output clamp diodes should be used for inductive transient suppression.

A VCC1 terminal, separate from VCC2, is provided for the logic inputs to minimize device power dissipation.

The L293and L293D are characterized for operation from 0C to 70C.

block diagram

10

3

4

5

6

7

89

10

11

12

13

14

15

161

210

1

10

2

4

3

M

M

M

10

10

10

VCC2

VCC1

NOTE: Output diodes are internal in L293D.

FUNCTION TABLE

(each driver)

INPUTS OUTPUT

A EN Y

H H H

L H L

X L Z

H = high level, L = low level, X = irrelevant,

Z = high impedance (off) In the thermal shutdown mode, the output is

in the high-impedance state, regardless of

the input levels.


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logic diagram

2

1

7

10

9

15

3

6

11

14

1A

1,2EN

2A

3A

3,4EN

4A

1Y

2Y

3Y

4Y

schematics of inputs and outputs (L293)

Input

VCC2

Output

GND

TYPICAL OF ALL OUTPUTSEQUIVALENT OF EACH INPUT

VCC1

Current

Source

GND


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schematics of inputs and outputs (L293D)

Input

VCC2

Output

GND

TYPICAL OF ALL OUTPUTSEQUIVALENT OF EACH INPUT

VCC1

CurrentSource

GND

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage, VCC1(see Note 1) 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Output supply voltage, VCC2 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Input voltage, VI 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output voltage range, VO 3 V to VCC2 + 3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Peak output current, IO (nonrepetitive, t 5 ms): L293 2 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Peak output current, IO (nonrepetitive, t 100 s): L293D 1.2 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous output current, IO: L293 1 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous output current, IO: L293D 600 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Package thermal impedance,

JA(see Notes 2 and 3): DWP package TBDC/W. . . . . . . . . . . . . . . . . . . . . . .

N package 67C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .NE package TBDC/W. . . . . . . . . . . . . . . . . . . . . . . . .

Maximum junction temperature, TJ 150C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Storage temperature range, Tstg 65C to 150C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. All voltage values are with respect to the network ground terminal.

2. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable

ambient temperature is PD = (TJ(max) TA)/qJA. Operating at the absolute maximum TJ of 150C can affect reliability.

3. The package thermal impedance is calculated in accordance with JESD 51-7.


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recommended operating conditions

MIN MAX UNIT

VCC1 4.5 7

Supply voltageVCC2 VCC1 36

V

VCC1 7 V 2.3 VCC1 V

VIH

High-level input voltageVCC1 7 V 2.3 7 V

VIL Low-level output voltage 0.3 1.5 V

TA Operating free-air temperature 0 70 C

The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage levels.

electrical characteristics, VCC1 = 5 V, VCC2 = 24 V, TA = 25C

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOH High-level output voltageL293: IOH = 1 A

L293D: IOH = 0.6 AVCC2 1.8 VCC2 1.4 V

VOL Low-level output voltageL293: IOL = 1 A

L293D: IOL = 0.6 A1.2 1.8 V

VOKH High-level output clamp voltage L293D: IOK = 0.6 A VCC2 +1.3 V

VOKL Low-level output clamp voltage L293D: IOK = 0.6 A 1.3 V

A

0.2 100

IIH High-level input current ENVI = 7 V 0.2 10

A

A

3 10

IIL Low-level input current ENVI = 0 2 100

A

All outputs at high level 13 22

ICC1 Logic supply current IO = 0 All outputs at low level 35 60 mA

All outputs at high impedance 8 24

All outputs at high level 14 24

ICC2 Output supply current IO = 0 All outputs at low level 2 6 mA

All outputs at high impedance 2 4

switching characteristics, VCC1 = 5 V, VCC2 = 24 V, TA = 25C

L293NE, L293DNE

PARAMETER TEST CONDITIONSMIN TYP MAX

UNIT

tPLH Propagation delay time, low-to-high-level output from A input 800 ns

tPHL Propagation delay time, high-to-low-level output from A input

400 ns

tTLH Transition time, low-to-high-level outputCL = 30 pF, See Figure 1

300 ns

tTHL Transition time, high-to-low-level output 300 ns

switching characteristics, VCC1 = 5 V, VCC2 = 24 V, TA = 25C

PARAMETER TEST CONDITIONS

L293DWP, L293N

L293DN UNIT

MIN TYP MAX

tPLH Propagation delay time, low-to-high-level output from A input 750 ns

tPHL Propagation delay time, high-to-low-level output from A input

200 ns

tTLH Transition time, low-to-high-level outputCL = 30 pF, See Figure 1

100 ns

tTHL Transition time, high-to-low-level output 350 ns


6/19




PARAMETER MEASUREMENT INFORMATION

Output

CL = 30 pF

(see Note A)

VCC1

Input

3 V

TEST CIRCUIT

tf tr

3 V

0

tPHL

VOH

tTHL tTLH

VOLTAGE WAVEFORMS

tPLH

Output

Input

VOL

tw

NOTES: A. CL includes probe and jig capacitance.

B. The pulse generator has the following characteristics: tr 10 ns, tf 10 ns, tw = 10 s, PRR = 5 kHz, ZO = 50 .

Pulse

Generator

(see Note B)

5 V 24 V

VCC2

A

EN

Y90% 90%

50%

10%

50%

10%

90% 90%

50%

10%

50%

10%

Figure 1. Test Circuit and Voltage Waveforms


7/19




APPLICATION INFORMATION

24 V5 V

10 k

VCC1VCC2

Control A

Control B

4, 5, 12, 13

GND

Thermal

Shutdown

Motor

16 8

3

6

11

14

4Y

3Y

2Y

1Y

1,2EN

1A

2A

3,4EN

3A

4A

15

10

9

7

2

1

Figure 2. Two-Phase Motor Driver (L293)


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24 V5 V

10 k

VCC1 VCC2

16 8

1,2EN

1

1A

2

2A

7

3,4EN

9

3A

10

4A

15

Control A

Control B

4, 5, 12, 13

GND

ThermalShutdown

Motor

1Y

3

2Y

6

3Y

11

4Y

14

Figure 3. Two-Phase Motor Driver (L293D)


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EN 3A M1 4A M2

H H Fast motor stop H Run

H L Run L Fast motor stop

L XFree-running motor

stopX

Free-running motor

stop

L = low, H = high, X = dont care

EN 1A 2A FUNCTION

H L H Turn right

H H L Turn left

H L L Fast motor stop

H H H Fast motor stop

L X X Fast motor stop

L = low, H = high, X = dont care

VCC2 SES5001

1/2 L293

4, 5, 12, 13

10

SES5001

VCC1

EN

1511 14

16

9

M2

M1

3A 4A

8

Figure 4. DC Motor Controls(connections to ground and to

supply voltage)

GND

2 SES5001

1/2 L293

4, 5, 12, 13

367

8

1

2

16

VCC2

2 SES5001

2A 1A

VCC1

EN

M

Figure 5. Bidirectional DC Motor Control

GND


10/19





3

4

5

6

7

8

1

2

9

10

11

12

13

14

15

16

+

+

+

+

D7

D8 D4

D3

L2 IL2

C1

D5 D1

D6 D2

VCC1

L293

IL1/IL2 = 300 mA

0.22 F

VCC2L1 IL1

D1D8 = SES5001

Figure 6. Bipolar Stepping-Motor Control

mounting instructions

The Rthj-amp of the L293 can be reduced by soldering the GND pins to a suitable copper area of the printedcircuit board or to an external heat sink.

Figure 9 shows the maximum package power PTOTand the JA as a function of the side of two equal square

copper areas having a thickness of 35 m(see Figure 7). In addition, an external heat sink can be used (seeFigure 8).

During soldering, the pin temperature must not exceed 260C, and the soldering time must not exceed 12seconds.

The external heatsink or printed circuit copper area must be connected to electrical ground.


11/19





Copper Area 35-m Thickness

Printed Circuit Board

Figure 7. Example of Printed Circuit Board Copper Area(used as heat sink)

11.9 mm

17.0 mm

38.0 mm

Figure 8. External Heat Sink Mounting Example(JA= 25C/W)


12/19





3

1

0

2

0 10 20

P

4

MAXIMUM POWER AND JUNCTION

vs

THERMAL RESISTANCE

30

TOTPowerDissipationW

60

20

0

40

80

JAThermalResistanceC/W

40

Side mm

Figure 9

JA

PTOT (TA = 70C)

50

5

3

1

0

2

50 0 50

4

MAXIMUM POWER DISSIPATION

vs

AMBIENT TEMPERATURE

100

TA Ambient Temperature C

With Infinite Heat Sink

Free Air

Heat Sink With JA = 25C/W

Figure 10

150

PTOTPowerDissipationW


13/19

PACKAGING INFORMATION

Orderable Device Status (1) PackageType

PackageDrawing

Pins PackageQty

Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

L293DDWP OBSOLETE SOIC DW 28 TBD Call TI Call TI

L293DDWPTR OBSOLETE SOIC DW 28 TBD Call TI Call TI

L293DN OBSOLETE PDIP N 16 TBD Call TI Call TI

L293DNE ACTIVE PDIP NE 16 25 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type

L293DNEE4 ACTIVE PDIP NE 16 25 Pb-Free(RoHS)


L293DSP OBSOLETE 16 TBD Call TI Call TI

L293DSP883B OBSOLETE 16 TBD Call TI Call TI

L293DSP883C OBSOLETE UTR TBD Call TI Call TI

L293DWP ACTIVE SOPowerPAD

DWP 28 20 Green (RoHS &no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

L293DWPG4 ACTIVE SOPowerPAD

DWP 28 20 Green (RoHS &no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

L293DWPTR OBSOLETE SOPowerPAD

DWP 28 TBD Call TI Call TI

L293N ACTIVE PDIP N 16 25 Green (RoHS &no Sb/Br)


L293NE ACTIVE PDIP NE 16 25 Pb-Free(RoHS)


L293NEE4 ACTIVE PDIP NE 16 25 Pb-Free(RoHS)


L293NG4 ACTIVE PDIP N 16 25 Green (RoHS &no Sb/Br)


(1)

The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please checkhttp://www.ti.com/productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak soldertemperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

PACKAGE OPTION ADDENDUM

www.ti.com 18-Jul-2006

Addendum-Page 1
http://www.ti.com/productcontenthttp://www.ti.com/productcontent


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accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis onincoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limitedinformation may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TIto Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com 18-Jul-2006

Addendum-Page 2


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16/19

MECHANICAL DATA

MPDI003 OCTOBER 1994


NE (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE

20 PIN SHOWN

2016PINS **

0.780 (19,80)

0.240 (6,10)

0.260 (6,60)

Seating Plane

DIM

0.975 (24,77)

0.914 (23,22)

0.930 (23,62)

1.000 (25,40)

0.260 (6,61)

0.280 (7,11)

Seating Plane

0.010 (0,25) NOM

4040054/ B 04/95

0.310 (7,87)

0.290 (7,37)

0.070 (1,78) MAX

C

10

0.021 (0,533)

0.015 (0,381)

A

11

1

20

0.015 (0,381)

0.021 (0,533)

B

0.200 (5,08) MAX

0.020 (0,51) MIN

0.125 (3,17)

0.155 (3,94)

0.020 (0,51) MIN

0.200 (5,08) MAX

0.155 (3,94)

0.125 (3,17)

M0.010 (0,25)

M0.010 (0,25)0.100 (2,54) 015

0.100 (2,54)

C

B

A

MIN

MAX

MIN

MAX

MIN

MAX

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-001 (16 pin only)


17/19


18/19


19/19

I M P O R T A N T N O T I C E

T e x a s I n s t r u m e n t s I n c o r p o r a t e d a n d i t s s u b s i d i a r i e s ( T I ) r e s e r v e t h e r i g h t t o m a k e c o r r e c t i o n s , m o d i f i c a t i o n s , e n h a n c e m e n t s , i m p r o v e m e n t s , a n d o t h e r c h a n g e s t o i t s p r o d u c t s a n d s e r v i c e s a t a n y t i m e a n d t o d i s c o n t i n u e a n y p r o d u c t o r s e r v i c e w i t h o u t n o t i c e . C u s t o m e r s s h o u l do b t a i n t h e l a t e s t r e l e v a n t i n f o r m a t i o n b e f o r e p l a c i n g o r d e r s a n d s h o u l d v e r i f y t h a t s u c h i n f o r m a t i o n i s c u r r e n t a n d c o m p l e t e . A l l p r o d u c t s a r e s o l d s u b j e c t t o T I s t e r m s a n d c o n d i t i o n s o f s a l e s u p p l i e d a t t h e t i m e o f o r d e r a c k n o w l e d g m e n t .

T I w a r r a n t s p e r f o r m a n c e o f i t s h a r d w a r e p r o d u c t s t o t h e s p e c i f i c a t i o n s a p p l i c a b l e a t t h e t i m e o f s a l e i n a c c o r d a n c e w i t h T I s s t a n d a r d

w a r r a n t y . T e s t i n g a n d o t h e r q u a l i t y c o n t r o l t e c h n i q u e s a r e u s e d t o t h e e x t e n t T I d e e m s n e c e s s a r y t o s u p p o r t t h i s w a r r a n t y . E x c e p t w h e r e m a n d a t e d b y g o v e r n m e n t r e q u i r e m e n t s , t e s t i n g o f a l l p a r a m e t e r s o f e a c h p r o d u c t i s n o t n e c e s s a r i l y p e r f o r m e d .

T I a s s u m e s n o l i a b i l i t y f o r a p p l i c a t i o n s a s s i s t a n c e o r c u s t o m e r p r o d u c t d e s i g n . C u s t o m e r s a r e r e s p o n s i b l e f o r t h e i r p r o d u c t s a n d a p p l i c a t i o n s u s i n g T I c o m p o n e n t s . T o m i n i m i z e t h e r i s k s a s s o c i a t e d w i t h c u s t o m e r p r o d u c t s a n d a p p l i c a t i o n s , c u s t o m e r s s h o u l d p r o v i d e a d e q u a t e d e s i g n a n d o p e r a t i n g s a f e g u a r d s .

T I d o e s n o t w a r r a n t o r r e p r e s e n t t h a t a n y l i c e n s e , e i t h e r e x p r e s s o r i m p l i e d , i s g r a n t e d u n d e r a n y T I p a t e n t r i g h t , c o p y r i g h t , m a s k w o r k r i g h t , o r o t h e r T I i n t e l l e c t u a l p r o p e r t y r i g h t r e l a t i n g t o a n y c o m b i n a t i o n , m a c h i n e , o r p r o c e s s i n w h i c h T I p r o d u c t s o r s e r v i c e s a r e u s e d . I n f o r m a t i o np u b l i s h e d b y T I r e g a r d i n g t h i r d - p a r t y p r o d u c t s o r s e r v i c e s d o e s n o t c o n s t i t u t e a l i c e n s e f r o m T I t o u s e s u c h p r o d u c t s o r s e r v i c e s o r a w a r r a n t y o r e n d o r s e m e n t t h e r e o f . U s e o f s u c h i n f o r m a t i o n m a y r e q u i r e a l i c e n s e f r o m a t h i r d p a r t y u n d e r t h e p a t e n t s o r o t h e r i n t e l l e c t u a l p r o p e r t y o f t h e t h i r d p a r t y , o r a l i c e n s e f r o m T I u n d e r t h e p a t e n t s o r o t h e r i n t e l l e c t u a l p r o p e r t y o f T I .

R e p r o d u c t i o n o f T I i n f o r m a t i o n i n T I d a t a b o o k s o r d a t a s h e e t s i s p e r m i s s i b l e o n l y i f r e p r o d u c t i o n i s w i t h o u t a l t e r a t i o n a n d i s a c c o m p a n i e d b y a l l a s s o c i a t e d w a r r a n t i e s , c o n d i t i o n s , l i m i t a t i o n s , a n d n o t i c e s . R e p r o d u c t i o n o f t h i s i n f o r m a t i o n w i t h a l t e r a t i o n i s a n u n f a i r a n d d e c e p t i v e b u s i n e s s p r a c t i c e . T I i s n o t r e s p o n s i b l e o r l i a b l e f o r s u c h a l t e r e d d o c u m e n t a t i o n . I n f o r m a t i o n o f t h i r d p a r t i e s m a y b e s u b j e c t t o a d d i t i o n a l r e s t r i c t i o n s .

R e s a l e o f T I p r o d u c t s o r s e r v i c e s w i t h s t a t e m e n t s d i f f e r e n t f r o m o r b e y o n d t h e p a r a m e t e r s s t a t e d b y T I f o r t h a t p r o d u c t o r s e r v i c e v o i d s a l l

e x p r e s s a n d a n y i m p l i e d w a r r a n t i e s f o r t h e a s s o c i a t e d T I p r o d u c t o r s e r v i c e a n d i s a n u n f a i r a n d d e c e p t i v e b u s i n e s s p r a c t i c e . T I i s n o t r e s p o n s i b l e o r l i a b l e f o r a n y s u c h s t a t e m e n t s .

T I p r o d u c t s a r e n o t a u t h o r i z e d f o r u s e i n s a f e t y - c r i t i c a l a p p l i c a t i o n s ( s u c h a s l i f e s u p p o r t ) w h e r e a f a i l u r e o f t h e T I p r o d u c t w o u l d r e a s o n a b l y b e e x p e c t e d t o c a u s e s e v e r e p e r s o n a l i n j u r y o r d e a t h , u n l e s s o f f i c e r s o f t h e p a r t i e s h a v e e x e c u t e d a n a g r e e m e n t s p e c i f i c a l l y g o v e r n i n g s u c h u s e . B u y e r s r e p r e s e n t t h a t t h e y h a v e a l l n e c e s s a r y e x p e r t i s e i n t h e s a f e t y a n d r e g u l a t o r y r a m i f i c a t i o n s o f t h e i r a p p l i c a t i o n s , a n d a c k n o w l e d g e a n d a g r e e t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r a l l l e g a l , r e g u l a t o r y a n d s a f e t y - r e l a t e d r e q u i r e m e n t s c o n c e r n i n g t h e i r p r o d u c t s a n d a n y u s e o f T I p r o d u c t s i n s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s , n o t w i t h s t a n d i n g a n y a p p l i c a t i o n s - r e l a t e d i n f o r m a t i o n o r s u p p o r t t h a t m a y b e p r o v i d e d b y T I . F u r t h e r , B u y e r s m u s t f u l l y i n d e m n i f y T I a n d i t s r e p r e s e n t a t i v e s a g a i n s t a n y d a m a g e s a r i s i n g o u t o f t h e u s e o f T I p r o d u c t s i n s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s .

T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n m i l i t a r y / a e r o s p a c e a p p l i c a t i o n s o r e n v i r o n m e n t s u n l e s s t h e T I p r o d u c t s a r e s p e c i f i c a l l y d e s i g n a t e d b y T I a s m i l i t a r y - g r a d e o r " e n h a n c e d p l a s t i c . " O n l y p r o d u c t s d e s i g n a t e d b y T I a s m i l i t a r y - g r a d e m e e t m i l i t a r y s p e c i f i c a t i o n s . B u y e r s a c k n o w l e d g e a n d a g r e e t h a t a n y s u c h u s e o f T I p r o d u c t s w h i c h T I h a s n o t d e s i g n a t e d a s m i l i t a r y - g r a d e i s s o l e l y a t t h e B u y e r ' s r i s k , a n d t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r c o m p l i a n c e w i t h a l l l e g a l a n d r e g u l a t o r y r e q u i r e m e n t s i n c o n n e c t i o n w i t h s u c h u s e .

T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n a u t o m o t i v e a p p l i c a t i o n s o r e n v i r o n m e n t s u n l e s s t h e s p e c i f i c T I p r o d u c t s a r e d e s i g n a t e d b y T I a s c o m p l i a n t w i t h I S O / T S 1 6 9 4 9 r e q u i r e m e n t s . B u y e r s a c k n o w l e d g e a n d a g r e e t h a t , i f t h e y u s e a n y n o n - d e s i g n a t e d p r o d u c t s i n a u t o m o t i v e a p p l i c a t i o n s , T I w i l l n o t b e r e s p o n s i b l e f o r a n y f a i l u r e t o m e e t s u c h r e q u i r e m e n t s .

F o l l o w i n g a r e U R L s w h e r e y o u c a n o b t a i n i n f o r m a t i o n o n o t h e r T e x a s I n s t r u m e n t s p r o d u c t s a n d a p p l i c a t i o n s o l u t i o n s :

P r o d u c t s A p p l i c a t i o n s A m p l i f i e r s a m p l i f i e r . t i . c o m A u d i o w w w . t i . c o m / a u d i o D a t a C o n v e r t e r s d a t a c o n v e r t e r . t i . c o m A u t o m o t i v e w w w . t i . c o m / a u t o m o t i v e D S P d s p . t i . c o m B r o a d b a n d w w w . t i . c o m / b r o a d b a n d C l o c k s a n d T i m e r s w w w . t i . c o m / c l o c k s D i g i t a l C o n t r o l w w w . t i . c o m / d i g i t a l c o n t r o l I n t e r f a c e i n t e r f a c e . t i . c o m M e d i c a l w w w . t i . c o m / m e d i c a l L o g i c l o g i c . t i . c o m M i l i t a r y w w w . t i . c o m / m i l i t a r y P o w e r M g m t p o w e r . t i . c o m O p t i c a l N e t w o r k i n g w w w . t i . c o m / o p t i c a l n e t w o r k M i c r o c o n t r o l l e r s m i c r o c o n t r o l l e r . t i . c o m S e c u r i t y w w w . t i . c o m / s e c u r i t y R F I D w w w . t i - r f i d . c o m T e l e p h o n y w w w . t i . c o m / t e l e p h o n y R F / I F a n d Z i g B e e S o l u t i o n s w w w . t i . c o m / l p r f V i d e o & I m a g i n g w w w . t i . c o m / v i d e o

W i r e l e s s w w w . t i . c o m / w i r e l e s s

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