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2013 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.3 9/14/16

AN-9080

Motion SPM 5 Series Version 2 Users Guide

Table of Contents

1. Introduction ........................................................ 2

1.1. About this Application Note .......................... 2

1.2. Design Concept ............................................. 2

1.3. Features ........................................................ 2

2. Product Selections .............................................. 3

2.1. Ordering Information .................................... 3

2.2. Product Line-up ............................................. 3

2.3. SPM 5 Version Comparison ........................... 3

3. Package ............................................................... 4

3.1. Internal Circuit Diagram ................................ 4

3.2. Pin Description .............................................. 4

3.3. Package Structure ......................................... 5

3.4. Packages ........................................................ 6

3.5. Marking Specifications .................................. 7

4. Integrated Functions and Protection Circuit .... 11

4.1. Internal Structure of HVIC ........................... 11

4.2. Circuit of Input Signal (VIN(H), VIN(L)) .............. 11

4.3. Functions vs. Control Supply Voltage.......... 11

4.4. Under-Voltage Lockout (UVLO) .................. 12

5. New Parameter Design Guidance .................... 13

5.1. Thermal Sensing Unit (TSU) ........................ 13

5.2. Bootstrap Circuit Design ............................. 14

5.3. Minimum Pulse Width ................................ 17

5.4. Short-Circuit SOA ........................................ 17

6. Application Example ......................................... 18

6.1. Recommended Wiring of Shunt Resistor ... 19

6.2. Snubber Capacitor ...................................... 19

6.3. PCB Layout Guidance .................................. 19

6.4. Heat Sink Mounting .................................... 20

6.5. System Performance .................................. 21

7. Handling Guide and Packing Information ........ 22

7.1. Handling Precautions.................................. 22

7.2. Packing Specifications ................................ 23

8. Related Resources ............................................ 28

AN-9080 APPLICATION NOTE

2013 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.3 9/14/16 2

1. Introduction

1.1. About this Application Note

This application note is about Motion SPM 5 Series

Version 2 products. It should be used in conjunction with

the datasheet, reference designs, and related application

notes listed in . This note focuses on the difference between

Version 2 and the previous versions of SPM parts, with

emphasis on new IC functions

1.2. Design Concept

The key design objective of the SPM 5 series is to provide a

compact and reliable inverter solution for small power

motor drive applications. Ongoing efforts have improved

the performance, quality, and power rating of SPM 5 series

products and the Version 2 products are the latest results of

these enhancements. The new features include temperature-

sensing capability, built-in bootstrap diodes, and upgraded

ruggedness. Two higher power rating devices based on

super-junction MOSFET technology are added to cover

higher power rating applications without significantly

increasing cost.

The MOSFETs in SPM 5 series are specially processed to

reduce the amount of body-diode reverse recovery charge to

minimize the switching loss and enable fast switching

operations. Softness of the reverse-recovery characteristics

is managed through advanced MOSFET design with

optimized gate resistor selections to contain Electromagnetic

Interference (EMI) noise within a reasonable range.

SPM 5 series has six fast-recovery MOSFETs (FRFET

)

and three high-voltage half-bridge gate drive ICs. These

MOSFETs and HVICs are not available as discrete parts.

An FRFET-based power module has much better

ruggedness and a larger safe operation area (SOA) than

IGBT-based module or Silicon-On-Insulator modules.

The FRFET-based power module has a big advantage in

light-load efficiency over IGBT-based because the voltage

drop across the transistor decreases linearly as current

decrease, whereas IGBT Vce saturation voltage stays at the

threshold level. Some applications require continuous

operation at light load except short transients and improving

the efficiency in the light-load condition is the key to saving

energy. Refrigerators, water circulation pumps, and some

fans are good examples.

The temperature-sensing function of version 2 products is

implemented in the HVIC to enhance system reliability. An

analog voltage proportional to the temperature of the HVIC

is provided for monitoring the module temperature and

necessary protections against over-temperature situations.

Three internal bootstrap diodes with resistive characteristics

reduce the number of external components and make the

PCB design more compact, beneficial when designing an

inverter built inside the motor.

1.3. Features

The detailed features and integrated functions are:

Variety of products with different voltage and power ratings: 250/500/600 V 3-phase FRFET

inverter ,including HVICs

Three divided negative DC-link terminals for leg current sensing

HVIC for gate driving of FRFET, under-voltage protection, and thermal sensing functions

3.3/5 V Schmitt trigger input with active HIGH logic

Built-in bootstrap diodes

Single-grounded power supply and optocoupler-less interface due to built-in HVIC

Minimized standby current of HVIC for energy regulation

Packages; DIP, SMD, Double-DIP, Zigzag-DIP

Isolation voltage rating of 1500 VRMS for 1 minute

Moisture Sensitive Level 3 (MSL3) for SMD package

AN-9080 APPLICATION NOTE

2013 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.3 9/14/16 3

2. Product Selections

2.1. Ordering Information

F S B 5 0 2 5 0 X X ( D )

S : SMD T : Double DIP

blank : DIP

Version

Motion SPM 5 Series

Comparative Current Rating ( Not in Amps )

Voltage Rating ( x 10 )

blank : Ver.1

U : Ver.1.5

A : Ver.2

SF : Ver.2 with SuperFET2

Package

BSD in Ver.1 & 1.5blank : W/O BSD

D : With BSD

B : Zigzag DIP

Figure 1. Ordering Information

2.2. Product Line-up

Tab