IPC 2018 High Reliability Forum - cat-test.info · . coupons shall include component (a), via (b)...
Transcript of IPC 2018 High Reliability Forum - cat-test.info · . coupons shall include component (a), via (b)...
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IPC2018HighReliabilityForum
May2018
Copyright©1994-2018ConductorAnalysisTechnologies,Inc.–AllRightsReserved
IPCReliabilityUpdates•Conformancecoupons•1-10ccommiGee
•Reliabilitytestmethods•D-32commiGee
•PerformancespecificaMons•D-33acommiGee(IPC-6012)•D-22commiGee(IPC-6018)
•ReliabilitytesMngtoday
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1-10cCommi?ee•Developedanewsuiteofcoupons• IPC-2221AppendixA
•LegacyDcouponforviareliability•Only24holes•DaisychainconnecMonsonalllayers•Allstructuresinsinglenet
•NewDcouponforviareliability•Manyholeswithvariablepitch•DaisychainconnecMonsatextremes•Singlestructurepernet•Twouniquenets
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IPCDCouponGenerator•BasedonIPC2221BAppendixA•Featuresdesignedtomatchproductboard•ConMnuousdevelopmentwithIPC1-10c
•Menudriveninputs•Gerberfileoutputs•Twoindependent/uniquenets•Viastructures•Through•Sub-composite•Blind•Buried•Stacked•Staggered
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D-32Commi?ee•TM-650Method2.6.2.27A(08/2017)•ConMnuousresistancemonitoringthroughreflowsimulaMon•Failureat5%changeinresistance
•TM-650Method2.6.7.2B(inprogress)•ThermalcyclingacerreflowsimulaMon•Expandedthermalcyclingrange• -55to(Tg-10C)•Usingthelaminatetoworkthecopper• Lookingfordamagefromreflowandmanufacturingissues•NotusedforlifepredicMons
•Failureat5%changeinresistance•PotenMalforreducMoninnumberofcycles(100?)
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ReflowSimulaGon
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Through
Blind
Stacked
6xReflow
Failure
Healing
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IPCSpecificaGons•Slowlymovingtowardperformancebasedacceptance
•Microviadefectsareocennotfound
•IPC-6012(D-33a)andIPC-6018(D-22)•Revisionsinprocess• IPC-2221AppendixAcouponsrequired•ConMnuousresistancemeasurementsthroughreflowsimulaMonasanopMonaltest
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DetecGngMicroviaDefects•MicrosecMons•Extremelysmallsamplesize•Verydifficulttosee•Openatreflowtemperatures•Veryocengoodatroomtemperature(selfhealing)
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DetecGngMicroviaDefects
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CourtesyofRobisonLabs
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DetecGngMicroviaDefects
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CourtesyofRobisonLabs
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ReliabilityTesGngToday•ResistancemonitoringthroughreflowsimulaMon•CurrentlyusedbymanyOEMs•6,12,and24cyclesiscommon
•Thermalstress/thermalshock•ManybasedonoldtestcondiMonsB-Fwith250to500cycles•Somemovingto-55Cto(Tg-10C)with100cycles
•IPCPCQR2Program•NewtestpaGernsasofQ3-2017•Manymicroviastructures•ReflowsimulaMonand500thermalcycles
•IPC6012QMLProgram•ReflowsimulaMonand100thermalcycles
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RecommendedDrawingNotesXX.IPCDCOUPONTESTING
A.IPCDCOUPONSSHALLBEDESIGNEDUSINGTHECOUPONGENERATORATWWW.CAT-TEST.INFO.COUPONSSHALLINCLUDECOMPONENT(A),VIA(B)ANDALLPROPAGATEDBSTRUCTURESIAWIPC-2221BAPPENDIXA.2OFEACHCOUPONDESIGNSHALLBETESTEDPERMANUFACTURINGPANEL.
B.THEIPCDCOUPONSSHALLBESUBJECTEDTO6REFLOWSIMULATIONSIAWIPC-TM-650,METHOD2.6.27AUSINGTHE230CPROFILE.ACCEPTANCECRITERIASHALLBE<5%CHANGEINRESISTANCE.
C.AFTERREFLOWSIMULATIONTHEIPCDCOUPONSSHALLBESUBJECTEDTO100THERMALCYCLESIAWIPC-TM-650,METHOD2.6.7.2FROM(TG-10C)OFTHELAMINATEMATERIALTO-55C.ACCEPTANCECRITERIASHALLBE<5%CHANGEINRESISTANCE.
D.RESULTSFROMALLCOUPONSTESTEDSHALLBEREPORTED.
Note:Parametersingreenshouldbetailoredtoeachapplica;on.
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CostofPCBDefectEscapes
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RelaMveCo
st
Coupon BarePCB AssembledPCB System FieldFailure
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