3° ISDE Digital Earth Summit, June 12-14, 2010, Nessebar, Bulgaria
Introduction to ISDE
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Transcript of Introduction to ISDE
Introduction to ISDE
Lloyd MassengillInstitute for Space and Defense Electronics
Vanderbilt UniversityNashville, Tennessee, USA, 37235
Vanderbilt Engineering
Massengill – ISDE Introduction 2DTRA 6.1 Kickoff – 5/08
Vanderbilt University Home of the Commodores (and the Radiation Effects Research Group and ISDE)
Located in Nashville, TN Private Institution ~11,000 students
Undergraduate: 6,532
Graduate/professional: 5,315
School of Engineering: 1,305 Engineering, Arts &
Sciences, Medicine, Nursing, Law, Business, Education, Music, Divinity
Degrees in 2007Baccalaureate: 1,468
MS: 1,062
PhD: 498
Vanderbilt Engineering
Massengill – ISDE Introduction 3DTRA 6.1 Kickoff – 5/08
Vanderbilt Radiation Effects Program
30 graduate students A few undergraduate students Open access Basic research and support of ISDE
engineering tasks Training ground for rad-effects engineers
14 full time engineers 2 support staff ITAR compliant Support specific radiation effects engineering
needs in government and industry
Radiation Effects Research (RER) Group
Institute for Space and Defense Electronics (ISDE)
World’s largest university-based radiation effects program
10 faculty with extensive expertise in radiation-effects Beowulf supercomputing cluster Custom software codes EDA tools from multiple commercial vendors Multi-million $ aggregate annual funding Test and characterization capabilities and partnerships
Vanderbilt Engineering
Massengill – ISDE Introduction 4DTRA 6.1 Kickoff – 5/08
DTRA-supported Grad Student “Product” Examples
> 25 peer-reviewed publications in 2007 under DTRA/RHM support > 35 presentations in 2007 under DTRA/RHM support 13 presentations accepted for IEEE NSREC 2008 with DTRA/RHM
credit line >8 DTRA-supported graduate student degrees awarded last two years
Vanderbilt Engineering
Massengill – ISDE Introduction 5DTRA 6.1 Kickoff – 5/08
What is ISDE?
ISDE is a contract engineering unit of Vanderbilt University created to bring world-class support of space and DoD mission needs through radiation effects analysis and rad-hard design
ISDE brings several decades of “academic” resources/expertise and “real-world” engineering to bear on system-driven needs
ISDE provides: Government and industry radiation-effects resource
Modeling and simulation: RHTCAD, RHEDADesign support: radiation models, RHBDTechnology support: assessment, characterizationSystem support: systems engineering
Flexible staffing driven by project needsFacultyGraduate studentsProfessional engineering staff
ISDE Particulars: Established as a unit of Vanderbilt University: 1 Jan 2003 Academic staff: 10 faculty / ~30 graduate students Full-time engineering staff: 14 Support staff: 2
Vanderbilt Engineering
Massengill – ISDE Introduction 6DTRA 6.1 Kickoff – 5/08
ISDE Capabilities
Support the design and analysis of radiation-hardened electronics Supply radiation effects models, design tools, and simulation services Provide engineering services for technology insertion and transfer Develop radiation hardness assurance test methods Address system-specific problems related to radiation effects Provide training to the community Retain a radiation effect “SWAT” team Reality training for future radiation effects “experts” (aka grad students)
Vanderbilt Engineering
Massengill – ISDE Introduction 7DTRA 6.1 Kickoff – 5/08
Sampling of Current Projects
• U.S. Navy Trident II Life Extension (Draper prime)• Honeywell SOI-IV, TI BiCom 1.5, and Intersil EBHF technologies
• DTRA Radiation Hardened Microelectronics• IBM 9SF 90nm, TI 65 nm
• DARPA/DTRA Radiation Hardened by Design (Boeing prime)• IBM 8SF 130nm and 9SF 90 nm CMOS – Trusted Foundry
• NASA Electronic Parts & Packaging Program (NASA/GSFC)• IBM: 5HP, 8HP, 9SF 90nm, TI: 65 nm, 45 nm
• NASA Extreme Environment Electronics (Ga Tech prime)• IBM 5AM SiGe and BAE 150 nm CMOS
• CREME Monte Carlo (NASA MSFC/RHESE)• Aging of Electronics (U.S. Navy DTO/Lockheed-Martin)• U.S. Air Force Minuteman Technology Readiness• BAE SEU-Hardened SRAMs (BAE prime)• SEE Charge Collection Signatures at 90nm (and below) (ANT/IBM prime)• Virtual Irradiation Simulator Development (Air Force/AEDC/PKP)• Integrated Multi-scale Modeling of Molecular Computing Devices (DOE)• Substrate Charge Collection Studies (MEMC)• CFDRC TCAD Tool Development (DTRA SBIR and NASA STTR)• Lynguent Compact Model Development (DTRA SBIR)• SEU Analysis (Medtronic)• GaN HEMT/amplifier simulation (Lockheed Martin)• Radiation Effects on Emerging Electronic Materials and Devices (AFOSR/MURI)• Design for Reliability Initiative for Future Technologies (AFOSR/MURI through
UCSB)• DTRA Basis Research Efforts (three 6-1 grants)
Vanderbilt Engineering
Massengill – ISDE Introduction 8DTRA 6.1 Kickoff – 5/08
USN D5LE Modeling Activities
AMS- Custom DevelopmentPDK DevelopmentEBHF – 5 Design-fab-eval cycles supportedSOI-IV – 5 Design-fab-eval cycles supportedBicom 1.5 – 2 Design-fab-eval cycles supported
DigitalIBISStandard Cell library validationSSI –SOI-IV & SOI-V
DiscreteActivesPassives
New Electrical Model CreationMagampPower MOSFET
Design Community Support (remote & local)Bugzilla – over 90 bugs reported, analyzed, & closedApp-notesModel inventoryTutorialsDesigner Interface meetings
Vanderbilt Engineering
Massengill – ISDE Introduction 9DTRA 6.1 Kickoff – 5/08
USN D5LE Model Completion Summary
937 model files tested/calibrated/delivered to NEPL database 757 of these are ISDE custom developed and calibrated Over 100-million calibration simulations performed Significant support, training, design, simulation activities
Vanderbilt Engineering
Massengill – ISDE Introduction 10DTRA 6.1 Kickoff – 5/08
USN D5LE Model Completion Summary
A few milestones: 45 major model releases/updates since Jan 2006 Complete PDK radiation models for EBHF, SOI-IV, BiCom Complete electrical, dose-rate, and degraded / corner models for all accepted program
parts Degraded parameter guide and corner models released PCIC macro, micro, design, simulation support – identified a feedback path design
enhancement to correct out-of-spec recovery time Enhanced macro models to include high-fidelity transient response (based on user
request) New MOSFET electrical models developed to the fill vendor gaps Developed and designed 8 test chips for program model calibration and verification Implemented an online community model support and feedback process Model training and designer interface meetings General ELDO training and aid
Vanderbilt Engineering
Massengill – ISDE Introduction 11DTRA 6.1 Kickoff – 5/08
The Vandy to ISDE Connection
Vanderbilt has a comprehensive radiation effects analysis program to support DOD and commercial needs
Physics investigations – NASA/GSFC, NASA/MSFC, AFOSR MURI, DTRA 6.1 support – Vandy academic
Response mechanisms investigations – DTRA RHM, NASA, Navy support – Vandy academic / ISDE
RHBD development – DARPA RHBD and DTRA RHM support – ISDE
Vanderbilt Engineering
Massengill – ISDE Introduction 12DTRA 6.1 Kickoff – 5/08
“Applied” Side of the Single Event Program
Through DTRA, DARPA, and NASA support, Vanderbilt has been investigating single-event mechanisms, circuit responses, hardening techniques, and rad-hard design from submicron to sub-100nm IC technology nodes
General Observations: Moore’s law complicates the testing, simulation, and analysis of all radiation
effects, especially single-events and soft error-rates The 250nm technology node was a watershed for the microelectronics
reliability community (especially those ‘radiation-concerned’). At 100-nm scale:Circuits that “should” be SEE hard are proving not to beCommercial ICs are showing alarming vulnerabilities to ground-based SEE
environmentsUnexpected SEE vulnerabilities (e.g. protons) have appeared
Why? Single events can no longer be considered localized, time-isolated, average
energy phenomena The ‘region of influence’ of an ion strike extends far beyond a single circuit ‘bit’
- spatially, logically, and temporally
Vanderbilt Engineering
Massengill – ISDE Introduction 13DTRA 6.1 Kickoff – 5/08
“Applied” Side of the Single Event Program
Through DTRA, DARPA, and NASA support, Vanderbilt has been investigating single-event mechanisms, circuit responses, hardening techniques, and rad-hard design from submicron to sub-100nm IC technology nodes
General Observations: Moore’s law complicates the testing, simulation, and analysis of all radiation
effects, especially single-events and soft error-rates The 250nm technology node was a watershed for the microelectronics
reliability community (especially those ‘radiation-concerned’). At 100-nm scale:Circuits that “should” be SEE hard are proving not to beCommercial ICs are showing alarming vulnerabilities to ground-based SEE
environmentsUnexpected SEE vulnerabilities (e.g. protons) have appeared
Why? Single events can no longer be considered localized, time-isolated, average
energy phenomena The ‘region of influence’ of an ion strike extends far beyond a single circuit ‘bit’
- spatially, logically, and temporally
Heuristic approaches to IC hardening are failing
Failure (upset rate) predictions are failing
Comprehensive radiation effects modeling, incorporating a priori physics, is an essential part of mission-critical hardness assurance
Heuristic approaches to IC hardening are failing
Failure (upset rate) predictions are failing
Comprehensive radiation effects modeling, incorporating a priori physics, is an essential part of mission-critical hardness assurance
Vanderbilt Engineering
Massengill – ISDE Introduction 14DTRA 6.1 Kickoff – 5/08
Example of VU Basic Research to ISDE Application to Community Tech Transfer:A “Real World” Problem
Baze broadbeam testing (Feb 07) revealed: 90nm RHBD DICE latches are hyper-sensitive to longitudinal-axis angular SE strikes
Upset saturated cross-sections approach unhardened designs Results do not follow conventional cos() charge collection rules
Baze broadbeam testing (Feb 07) revealed: 90nm RHBD DICE latches are hyper-sensitive to longitudinal-axis angular SE strikes
Upset saturated cross-sections approach unhardened designs Results do not follow conventional cos() charge collection rules
DICE 9SF shift register SEU test data
1E-11
1E-10
1E-9
1E-8
1E-7
0 20 40 60 80 100 120 140
LET (MeV/mg/cm2)
Cross Section (cm
-2)
SF-1-0deg-1111SF-1-0deg-0000SF-1-0deg-1010SF-1-0deg-1100
SF-3-0deg-1010SF-3-60degA-1010SF-3-60degB-1010WeibullSF-2-0deg-1010
60deg, orthogonal to rails
60deg, longitudinal to rails
Cro
ss S
ecti
on
(cm
2)
LET (MeV/mg/cm2)
Vanderbilt Engineering
Massengill – ISDE Introduction 15DTRA 6.1 Kickoff – 5/08
“Real World” Issue
Issue: Boeing RHBD Phase 1.5 90nm DICE V1 latch did not meet SEE on-orbit error-
rate goals (< 1E-10 E/BD) based on broadbeam error data and CREME96 rate calculations
Cause: Phase 1.5 TCAD research work identified charge sharing as error mechanism
Complication: CREME96 (and other space error-rate codes)
do not properly handle layout-dependent effects (e.g. charge sharing) and
can significantly mis-predict error rates (by orders of magnitude) Therefore: unclear if DICE V1 or V2 on-orbit error rates, calculated for RHBD,
are accurate or dubious predictions
Vanderbilt Engineering
Massengill – ISDE Introduction 16DTRA 6.1 Kickoff – 5/08
Resolution Strategy
VU “basic research” tools: Vanderbilt-ISDE has performed comprehensive TCAD analysis of SEE
mechanisms in sub-100nm technologies:
uncovered the importance of charge sharing
identified critical circuit node pairs (supported in part by DTRA/RHM, DARPA RHBD, NRL Albany Nanotech)
Vanderbilt-ISDE has developed a Monte-Carlo-based error-rate modeling technique that
operates from first principles physics for ion energy deposition – “virtual irradiation”
does not apply conventional error-rate assumptions
(supported in part by NASA/GSFC and DTRA)
Task Plan: Vanderbilt-ISDE was asked by the RHBD program to apply this technique to the
Phase 1.5 90nm DICE V2 latch in order to calculate a more accurate on-orbit error-rate expectation
Vanderbilt Engineering
Massengill – ISDE Introduction 17DTRA 6.1 Kickoff – 5/08
Mixed-Mode TCAD DICE Setup
Calibrated 620/80 PMOS devices constructed in TCAD using ISDE physical description of the IBM 9SF FEOL technology
Calibrated 280/80 NMOS BSIM3 devices constructed in DESSIS-SPICE for pull-down loading
Vanderbilt Engineering
Massengill – ISDE Introduction 18DTRA 6.1 Kickoff – 5/08
MRED Solid Modeling Component Setup
The solid model serves as the foundation for the radiation transport and calorimetry component of the analysis
Use GDSII layout information to generate an extruded model of the 9SF Latch Each layer is assigned an accurate compositional description – chemical
stoichiometry and density
Substrate, Active, and PolySubstrate, Active, and PolyOnlyOnly Substrate, Metallization,Substrate, Metallization,
and Passivation Shownand Passivation Shown
Vanderbilt Engineering
Massengill – ISDE Introduction 19DTRA 6.1 Kickoff – 5/08
MRED/SPICE Interface
This project required the first application of the MRED-Spice coupling concept.
For each particle that strikes a sensitive volume, a Spice simulation is launched.
Each transistor’s collected charge is converted to a current pulse and directed to the appropriate node during run-time.
Q(TXQ(TXijij))
MRED MRED EventEventjj
TX1TX1
TX2TX2....TXnTXn
SPICESPICE(Circuit Template)(Circuit Template)
%I%I11
%I%I22
%I..%I..%I%Inn
Q DD
CLK CLK
D
CLK
QQPRECLR
FF1 FF2Irradiate FF1 at a random time and Irradiate FF1 at a random time and watch for an upset clocked out of FF2.watch for an upset clocked out of FF2.This process was repeated over This process was repeated over 100,000 times for the final simulation 100,000 times for the final simulation set.set.
Vanderbilt Engineering
Massengill – ISDE Introduction 20DTRA 6.1 Kickoff – 5/08
Calibration to Broadbeam Data
Tilt
Roll
Tilt
Roll
0 10 20 30 40 50 60 7010-12
10-11
10-10
10-9
10-8
10-7
Simulation (50 MHz)Data (25<f<50 MHz)
Simulation 0o Tilt, 0o Roll Experiment 0o Tilt, 0o Roll
LET (MeVcm2/mg)
0 10 20 30 40 50 60 7010-12
10-11
10-10
10-9
10-8
10-7
Simulation 60o Tilt, 0o Roll Experiment 60o Tilt, 0o Roll Simulation 60o Tilt, 90o Roll Experiment 60o Tilt, 90o Roll
LET (MeVcm2/mg)
Simulation (50 MHz)Data (25<f<50 MHz)
Best agreement between model and experiment is with the highest cross sections and lowest LET – rate dominating
Vanderbilt Engineering
Massengill – ISDE Introduction 21DTRA 6.1 Kickoff – 5/08
SEU Rate Prediction
To perform the rate prediction, the beam-calibrated model is modified to:
Mimic the isotropic environment and sample appropriately from each spectrum (z=1,z=2,z=3,etc.)
Events are weighted to the relative abundance in the overall spectrum. This methodology has been tested extensively and proven valid.
The calculated rate is 1.7 +/- 0.2 x 10-8 error/bit-day (the error bar is due to counting uncertainty only)
Most errors occurred at grazing incidence ( >60 degrees ) Began observing errors regularly around Z = 12 (Mg, max LET 10 MeV-
cm2/mg)
Tech Transfer: Based on Vandy analyses, improved V3 DICE latches have been designed
and fabbed by Boeing as part of the RHBD Phase 2.0 program Results on charge sharing, angular effects, well collapse, and MRED upset
rate modeling have been briefed to the community at NSREC, IRPS, GOMAC…
Vanderbilt Engineering
Massengill – ISDE Introduction 22DTRA 6.1 Kickoff – 5/08
The “Big Picture”
Technology
Requirements
FunctionalDesign
ArchitectureDesign
Library ModuleDesign
Device Design / Layout
Qualification
FunctionalVerification
ArchitectureVerification
Library Validation
Component Response
Design Flow
Qualification Flow
M&S Enabled ASIC D,T,&Q
Rad-Aware EDA Virtual Irradiation
Targeted Radiation Testingfor M&S Support
3DMixed -Mode
TCAD
First PrincipleRadiation Physics
(MRED)
Monte -CarloVirtual
Irradiation
On-Orbit Error Rates(Creme -MC)
Mixed -SignalFunctional Rad
Models
TCAD-DrivenRad PDKModels
Failure Mechanisms
Rad-Aware VHDL
Radiation Aware Design
Simulation Enhanced Test
AvailableUnder developmentFuture research
A multi -agency-funded development effort is underway to integrate M&S into D&Q
A multi -agency-funded development effort is underway to integrate M&S into D&Q