1 Microelectronics Processing Course - J. Salzman - Jan. 2002 Microelectronics Processing Oxidation.
Internet of Things: What’s in it for the microelectronics industry · 2015-05-14 · Internet of...
Transcript of Internet of Things: What’s in it for the microelectronics industry · 2015-05-14 · Internet of...
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Internet of Things: What’s in it for the microelectronics
industry
Yosi Shacham-Diamanda,b
a, Department of Physical Electronics, School of EE, Faculty of Engineering, Tel-Aviv University b Applied Chemistry Department , Waseda University, Tokyo, Japan C Email: [email protected],
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IoT and VLSI circuits ‒ challenge and opportunity
• IoT overview • Short, medium and long range opportunities
• End units • Cloud, servers • Communication
• VLSI design with other technologies • Sensors and actuators for IoT • Flexible electronics, printed electronics
• Summary • Application specific IoT (ASIT)
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IoT levels
• Generic IoT device that can operate via the Internet (IoT) or an Integrated private mesh (IPM)
• Will replace smartphones in “things” interface where cost & power or security is an issue
An application specific integrated circuit ‒ processing, memory, communication
Power supply
Cloud, Fog, mesh, grid: big data
Sensors & actuators
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‘‘Internet of Things” paradigm as a result of the convergence of different visions
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L. Atzori et al. / Computer Networks 54 (2010) 2787‒2805
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Real Physical world Virtual Cyber
world
Digital world
“Things” integration
Data integration
Schematics integration
Internet of Things: Interactions among the physical, digital, virtual worlds
Manish Kumar, Journal of Electron Devices 21, 1801-1805 (2015)
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IOT end units Autonomous units
– Wearable – RFID
Non autonomous/Embedded units Powered by the mother system Will become integral part of every item: cars, kitchen items, house items etc.
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IoT and our daily life.....
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IoT application space
D. Blaauw et. al, 2014 Symposium on VLSI Technology Digest of Technical Papers
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IoT challenge: 50B systems in 2010
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IoT and VLSI circuits ‒ challenge and opportunity
Major issues ‒ end units
• Power supply, energy à autonomous vs. non autonomous systems
• Design for cost, design for power • Design for “hostile environment” ‒
• High noise, • Limited computation capability, • Limited bandwidth • Not standard interfaces to sensors
and actuators 11
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IoT and VLSI circuits ‒ challenge and opportunity
Major issues ‒ cloud servers • Memory • CPU • DSPs • More...
Major issues ‒ communication • Wireless • Algorithms
• Metadata, compression, security, etc.
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Those are standard observations, what are the challenges ?
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VLSI design for IoT & more
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Flexible electronics
Flexible Electrodes
Printed electronics
Nano-bio sensors
Si CMOS ICs: VLSI, ASIC etc.
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Printed electronics - forecast
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Printed Electronics Silicon IC’s
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Moore’s law and more
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Conventional CMOS IC à Next generation technologies
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IoT & design challenges System architecture • IoT module
– Connectivity – Data processing – Sensing & actuating
• Many components and standards already exist: Bluetooth, Bluetooth low energy, ZigBee, WiFi and Near Field Communication (NFC).
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ASIT: Application Specific IoT
• Application or field of use • Sensors specific to the application • Specific End units and mid-units • Application specific: power, security, cost • Total hardware/software immersion • Internet Connectivity • Specific metadata algorithms
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IoT power vs. lifetime
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Average power draw constraint as a function of lifetime and battery size
D. Blaauw et. al, 2014 Symposium on VLSI Technology Digest of Technical Papers
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Common protocols used for wireless sensor applications
20 M.J. McGrath and C.N. Scanaill, “Sensor technologies”, Intel Labs Europe, 2013, ApressOpen
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IoT needs • IoT processing capability • More memory: HDD, SLC, MLC, TLC etc. • More information closer to the node • Performance tailored to application • Reduce latency • Good controller and server performance • Bandwidth monitoring & control allowing
maximum connectivity
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IoT security main issues S. Sicari et al. / Computer Networks 76 (2015) 146–164
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Sensing
23 M.J. McGrath and C.N. Scanaill, “Sensor technologies”, Intel Labs Europe, 2013, ApressOpen
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Bio sensing
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M.J. McGrath and C.N. Scanaill, “Sensor technologies”, Intel Labs Europe, 2013, ApressOpen
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Sensor cloud architecture
25 M.J. McGrath and C.N. Scanaill, “Sensor technologies”, Intel Labs Europe, 2013, ApressOpen
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IoT challenge: latency
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M2M technology
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(NICT, Japan)
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IoT M2M technology (Beecham Research, 2015)
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A Vision of the Future
Emergence of Ambient Intelligence: Sense/monitor, communicate and react to the environment à Ultra‐low‐power, robust computing technology required!
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Internet of Things, MEMS and VLSI: the total integration challenge
30 Development and diversification of core mechatronics technologies in the period 1970‒2010. (D. Bradley et al. / Mechatronics 27 (2015) 57‒74)
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A conceptual model of a conventional mechatronic system.
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Advantage: extremely low cost Challenge: only 104-105 transistors.
New technologies: Thin film transistor (TFT) IC + sensors on plastic ;
flexible electrics IoTs.
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The challenge
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Differentiation is created in software • Common hardware platform, multiple Applications • Memory requirements: • Low power with Instant-On • Small Silicon Footprint • Programmable, non-volatile code storage • Highly Secure to Protect S/W IP and Prevent Hacking
(Linh Hong, Flash summit 2014)
Or
Arduino UNO R3 board Raspberry pi board
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Extreme low power technologies
• Spintronics
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Comparison of logic-LSI architectures; (a) conventional, (b) nonvolatile logic-in-memory.
Nonvolatile TCAM cell layouts; (a) 6T-2MTJ twin-cell, (b) (b) complementary 5T-4MTJ cell.
Takahiro Hanyu et al, “Spintronics-Based Nonvolatile Logic-in-Memory Architecture Towards an Ultra-Low-Power and Highly Reliable VLSI Computing Paradigm”, 2015 Design, Automation & Test in Europe Conference & Exhibition (DATE)
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Extreme low power technologies
• Nano Watts amplifier
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Block diagram of proposed AMP.. Schematic of proposed AMP
Toshihiro Ozakiet al, “Nano watt power rail-to-rail CMOS amplifier with adaptive biasing circuits for ultralow-power analog LSIs”, Jpn. J. Appl. Phys. 54, 04DE13 (2015)
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Memory for IoT
36 Paul Hill, Director of Product Marketing Adesto Technologies, Flash Summit 2014
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Example: Sensor integration for food tracking
• Cartasense Inc., Israel • Tel Aviv university: sensor R&D
– Gas sensor: O2, CO2, Ethanol, Ethylene glycol, ethylene, ammonia etc.
– Fluid sensors: pathogens, toxic materials – Physical sensors: Humidity, Temperature,
pressure, position, velocity, acceleration etc. • The challenge: adapt sensor to the
application in very short time, low cost • Method: Generic platorm
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© 2014 CartaSense Ltd. 38
Web applica:on
s
Complete suite of hardware and soAware aimed to collect data to support business decisions and increased profitability
Wireless Sensors
Gateways Comm. Server soAware
The CartaSense Offering
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© 2014 CartaSense Ltd. 39
The Only Complete IoT Logis7cs Solu7on
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• Few major factors: • Most advanced technologies fail; that is inevitable and not unhealthy.(R. Landauer 1990)
• Integrated systems may reach their downscaling limits by 2025; maybe
• Israel has a wide base of Ultra Large Scale integration (ULSI) circuit design.
• Therefore, IoT is an opportunity • Application Specific IoT • Standard sensor & actuator interface • Circuit design on silicon & flexible substrates
Some general thoughts
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