Standard Power

Data Sheet Rev. 1.02, 2009-12-10

IFX24401Low Dropout Voltage Regulator

IFX24401TEV50 IFX24401ELV50

Low Dropout Voltage Regulator

IFX24401

PG-TO252-5

PG-SSOP-14

1 Overview

Features• Output voltage 5 V ±2%• Ultra low current consumption: 20 µA (typ.)• 300 mA current capability• Enable input• Very low-drop voltage• Short circuit protection• Overtemperature protection• Low Dropout Voltage, 250mV (typ.)• High Input Voltage 45 V• Temperature Range -40 °C ≤ Tj ≤ 125 °C• Green Product (RoHS compliant)

Applications• Battery powered devices (e.g. Handheld GPS)• Portable Radios• HDTV Televisions• Game Consoles• Network Routers

For automotive and transportation applications, please refer to the Infineon TLE and TLF voltage regulator series.

Functional DescriptionThe IFX24401 is a monolithic integrated low-drop voltage regulator for load currents up to 300 mA. The outputvoltage is regulated to VQ,nom = 5.0 V with an accuracy of ±2%. A sophisticated design allows stable operation withlow ESR ceramic output capacitors down to 470 nF. The device is designed for the harsh environments. Thereforeit is protected against overload, short circuit and overtemperature conditions. Due to its ultra low stand-by currentconsumption of 20 µA (typ.) the IFX24401 is ideal for use in battery powered applications. The regulator can beshut down via an Enable input which further reduces the current consumption to 5 µA (typ.). An integrated outputsink current circuitry keeps the voltage at the Output pin Q below 5.5 V even when reverse currents are applied.Thus connected devices are protected from overvoltage damage.

Type Package MarkingIFX24401TEV50 PG-TO252-5 2440150IFX24401ELV50 PG-SSOP-14 24401V50

Data Sheet 2 Rev. 1.02, 2009-12-10

IFX24401

Block Diagram

2 Block Diagram

Figure 1 Block Diagram

IFX24401Q

GND

EN

I

OvertemperatureShutdown

1Bandgap

Reference

ChargePump

Enable

Data Sheet 3 Rev. 1.02, 2009-12-10

IFX24401

Pin Configuration

3 Pin Configuration

Figure 2 Pin Configuration PG-TO252-5 (top view)

3.1 Pin Definitions and Functions (PG-TO252-5 )Pin Symbol Function1 I Input

Connect ceramic capcitor between I and GND2 N.C. No Connect

May be open or connected to GND3 GND Ground

Internally connected to heat slug4 EN Enable Input

Low signal level disables the regulator. Pull-down resistor is integrated.5 Q Output

Place capacitor between Q pin and GND. Capacitor placement should be close to pin.Refer to capacitance and ESR requirements in “Functional Range” on Page 6

Heat Slug -- Heat SlugConnect to board GND and heatsink

I NC EN Q

Data Sheet 4 Rev. 1.02, 2009-12-10

IFX24401

Pin Configuration

Figure 3 Pin Configuration PG-SSOP-14 (top view)

3.2 Pin Definitions and Functions (PG-SSOP-14 )Pin Symbol Function1,2,3,5,7 N.C. No Connect

May be open or connected to GND4 GND Ground

6 EN Enable InputLow signal level disables the regulator. Pull-down resistor is integrated.

8,10,11,12,14

N.C. No ConnectMay be open or connected to GND

9 Q OutputPlace capacitor between Q pin and GND. Capacitor placement should be close to pin.Refer to capacitance and ESR requirements in “Functional Range” on Page 6

13 I InputConnect ceramic capcitor between I and GND

Pad Exposed PadConnect to board GND and heatsink

Data Sheet 5 Rev. 1.02, 2009-12-10

IFX24401

General Product Characteristics

4 General Product Characteristics

4.1 Absolute Maximum Ratings

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation.

4.2 Functional Range

Note: In the operating range, the functions given in the circuit description are fulfilled.

Absolute Maximum Ratings1)

Tj = -40 °C to 150 °C; all voltages with respect to ground, positive current flowing into pin(unless otherwise specified)

1) Not subject to production test, specified by design.

Parameter Symbol Limit Values Unit Test ConditionMin. Max.

Input IVoltage VI -0.3 45 V –Current II -1 – mA –Enable ENVoltage VEN -0.3 45 V Observe current limit

IEN,max2)

2) External resistor required to keep current below absolute maximum rating when voltages ≥ 5.5 V are applied.

Current IEN -1 1 mA –Output QVoltage VQ -0.3 5.5 V –Voltage VQ -0.3 6.2 V t < 10 s3)

3) Exposure to these absolute maximum ratings for extended periods (t > 10 s) may affect device reliability.

Current IQ -1 – mA –TemperatureJunction temperature Tj -40 150 °C –Storage temperature Tstg -50 150 °C –

Parameter Symbol Limit Values Unit RemarksMin. Max.

Input voltage VI 5.5 42 V –Junction temperature Tj -40 125 °C –Output Capacitor CQ 470 – nF 1)

1) The minimum output capacitance requirement is applicable for a worst case capacitor tolerance of 30%ESR (CQ) – 10 Ω f = 10 kHz

Data Sheet 6 Rev. 1.02, 2009-12-10

IFX24401

General Product Characteristics

4.3 Thermal Resistance

Pos. Parameter Symbol Limit Value Unit ConditionsMin. Typ. Max.

IFX24401TEV50 (PG-TO252-5, ) 4.3.1 Junction to Case1)

1) not subject to production test, specified by design

RthJC – 4 – K/W measured to pin 54.3.2 Junction to Ambient1) RthJA – 115 – K/W Footprint only2)

2) EIA/JESD 52_2, FR4, 80 × 80 × 1.5 mm; 35µ Cu, 5µ Sn

4.3.3 – 57 – K/W 300mm2 heatsink area on PCB2)

4.3.4 – 42 – K/W 600mm2 heatsink area on PCB2)

IFX24401ELV50 (PG-SSOP-14) 4.3.5 Junction to Case1) RthJC – 7 – K/W measured to pin 54.3.6 Junction to Ambient1) RthJA – 120 – K/W Footprint only2)

4.3.7 – 59 – K/W 300mm2 heatsink area on PCB2)

4.3.8 – 49 – K/W 600mm2 heatsink area on PCB2)

Data Sheet 7 Rev. 1.02, 2009-12-10

IFX24401

General Product Characteristics

Table 1 Electrical CharacteristicsVI = 13.5 V; VEN = 5 V; -40 °C < Tj < 125 °C (unless otherwise specified)Parameter Symbol Limit Values Unit Measuring Condition

Min. Typ. Max.Output QOutput voltage VQ 4.9 5.0 5.1 V 0.1 mA < IQ < 300 mA;

6 V < VI < 16 VOutput voltage VQ 4.9 5.0 5.1 V 0.1 mA < IQ < 100 mA;

6 V < VI < 40 VOutput current limit IQ,LIM 320 – – mA 1)

1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V.

Output current limit IQ,LIM – – 800 mA VQ = 0VCurrent consumption;Iq = II - IQ

Iq – 20 30 µA IQ = 0.1 mA;Tj = 25 °C

Current consumption;Iq = II - IQ

Iq – – 40 µA IQ = 0.1 mA;Tj ≤ 80 °C

Quiescent current;Disabled

Iq – 5 9 µA VEN = 0 V;Tj < 80 °C

Drop voltage Vdr – 250 500 mV IQ = 200 mA;Vdr = VI - VQ

1)

Load regulation ∆VQ, lo -40 15 40 mV IQ = 5 mA to 250 mALine regulation ∆VQ, li -20 5 20 mV Vl = 10V to 32 V;

IQ = 5 mAPower supply ripple rejection PSRR – 60 – dB fr = 100 Hz;

Vr = 0.5 VppTemperature output voltage drift dVQ/dT – 0.5 – mV/K –Enable Input ENTurn-on Voltage VEN ON 3.1 – – V VQ ≥ 4.9 VTurn-off Voltage VEN OFF – – 0.8 V VQ ≤ 0.3 VH-input current IEN ON – 3 4 µA VEN = 5 VL-input current IEN OFF – 0.5 1 µA VEN = 0 V;

Tj < 80 °C

Data Sheet 8 Rev. 1.02, 2009-12-10

IFX24401

Typical Performance Characteristics

5 Typical Performance Characteristics

Current Consumption Iq versusJunction Temperature TJ

Current Consumption Iq versusInput Voltage VQ

Current Consumption Iq versusOutput Current IQ

Output Voltage VQ versusJunction Temperature TJ

1_Iq -Tj .vsd

10

1

0.01

100

Iq [µA]

-40

TJ [°C]

-20 20 40 80 1000 60 140120

VI = 13.5V

IQ = 100 µA

0

VI [V ]

20 30

Iq [µA]

3_IQ -V I.VS D

30

20

10

40

10 40

I Q = 0.2mA

IQ = 10mA

IQ = 50mA

TJ = 25°C

0 40 60

2_IQ-IQ.VSD

15

10

5

20

20 100

Tj = -40 °C

30

Tj = 25 °C

IQ [mA]

Iq [µA] VI = 13.5 V

-40Tj [°C]

-20 20 40 80 100

VQ [V]

5A_VQ-TJ.VSD

5.00

4.95

4.90

5.05

0 60 140120

VI = 13.5 V

IQ =100µA...100mA

Data Sheet 9 Rev. 1.02, 2009-12-10

IFX24401

Typical Performance Characteristics

Dropout Voltage Vdr versusOutput Current IQ

Maximum Output Current IQ versusJunction Temperature Tj

Dropout Voltage Vdr versusJunction Temperature

Maximum Output Current IQ versusInput Voltage VI

0

IQ [mA]

100 200

Vdr [mV ]

6_VDR-IQ .VS D

300

200

100

400

300

600

TJ = 150 °C

TJj = 25 °C

TJ = -40 °C

-40

TJ [°C]

-20 20 40 80 100

IQ [mA ]

8_IQMAX -TJ.VS D

560

540

520

580

0 60 140120

VI= 13.5 V

500

620

-40

TJ [°C]

-20 20 40 80 100

Vdr [mV]

7_V DR-TJ.V SD

300

200

100

400

0 60 140120

IQ = 150mA

600

IQ = 250 mA

IQ = 10 mA

0

VI [V]

20 30

IQ,LIM[mA]

9_S OA.VS D

300

200

100

400

10 40

600

T j = 25 °C

T j = 125 °C

Data Sheet 10 Rev. 1.02, 2009-12-10

IFX24401

Typical Performance Characteristics

Region of Stability Output Voltage VQ Start-up behavior

Power Supply Ripple Rejection PSRR versus Frequency f

Load Regulation ∆VQ versusOutput Current Change ∆IQ

12_ESR-IQ.VSD

1

0.1

0.01

ESRCQ[Ω]

0IQ [mA]

100 15050 200

CQ = 10nF ...10 µFTj = 25 °C

100

10

StableRegion

VQ [V]

14_VI-time _startup.vsd

5.00

4.90

4.80

5.05IQ = 5mA

1

t [ms]

3 42 5

EN = HIGH

10

f [Hz]

10k

PSRR[dB]

13_P SRR.VS D

60

50

100 1k 100k

80

30

40

IQ = 30 mA

VRIPPLE = 0.5 VPP

VI = 13.5 VCQ = 10 µF TantalumTJ = 25 °C

IQ = 100 mA

IQ = 0.1 mA

0

IQ [mA]

100 150

∆VQ[mV ]

18a_dVQ-dIQ _V i6V.vsd

-15

-20

-25

-10

50 250

0

Tj = 25 °C

-30

VI = 6V

T j = -40 °C

T j = 150 °C

Data Sheet 11 Rev. 1.02, 2009-12-10

IFX24401

Typical Performance Characteristics

Load Regulation ∆VQ versusOutput Current Change dIQ

Line Regulation ∆VQ versusInput Voltage Changed VI

Load Regulation ∆VQ versusOutput Current Change ∆IQ

Line Regulation ∆VQ versusInput Voltage Changed VI

0

IQ [mA]

100 150

∆VQ[mV ]

18b_dV Q-dIQ_V i135V.vsd

-15

-20

-25

-10

50 250

0

TJ = 25 °C

-30

V I = 13.5V

TJ = -40 °C

TJ = 150 °C

0

VI [V]

5 15 20 30 35

∆VQ[mV ]

19_dVQ-dVI__150C.vsd

-3

-4

-5

-2

10 25 4540

0TJ = 150 °C

-6

IQ = 10mA

IQ = 200mA

IQ = 100mA

IQ = 1mA

0

IQ [mA]

100 150

∆VQ[mV ]

18c_dV Q-dIQ_V i28V.vsd

-15

-20

-25

-10

50 250

0

TJ = 25 °C

-30

VI = 28

TJ = -40 °C

TJ = 150 °C

0

VI [V]

5 15 20 30 35

∆VQ[mV ]

19_dV Q-dVI_25C.vsd

-3

-4

-5

-2

10 25 4540

0TJ = 25 °C

-6

IQ = 10mA

IQ = 200mAIQ = 100mA

IQ = 1mA

Data Sheet 12 Rev. 1.02, 2009-12-10

IFX24401

Typical Performance Characteristics

Line Regulation ∆VQ versusInput Voltage Change VI

Load Transient Response Peak Voltage ∆VQ

Load Transient Response Peak Voltage ∆VQ Line Transient Response Peak Voltage ∆VQ

0

VI [V]

5 15 20 30 35

∆VQ[mV ]

19_dV Q-dV I_-40C.vsd

-3

-4

-5

-2

10 25 4540

0TJ =40 °C

-6

IQ = 10mA

IQ = 200mA

IQ = 100mA

IQ = 1mA

20_Load Trancient vs time 125.vsd

VQ

t = 40 µs/DIV

VQ = 100 mV/DIV

TJ = 125 °CV I = 13.5 V∆IQ=100mA

IQ

∆IQ = 100mA

t = 40 µs/DIV

VQ = 100 mV/DIV

VQ

TJ = 25 °CV I = 13.5 V

20_Load Trancient vs time 25.vsd

IQ

21_Line Trancient vs time 25.vsd

VQ

VI

t = 400 µs/DIV

VQ = 50 mV/DIV

∆VI = 2V

TJ = 25 °CVI = 13.5 V

Data Sheet 13 Rev. 1.02, 2009-12-10

IFX24401

Typical Performance Characteristics

Line Transient Response Peak Voltage ∆VQ

I

Enabled Input Current IEN versusInput Voltage VI , EN=Off

Enabled Input Current IEN versusEnabled Input Voltage VEN

Thermal Resistance Junction-Ambient RTHJAversus Power Dissipation PV

21_Line Trancient vs time 125.vsd

VQ

TJ = 125 °CVI = 13.5 V

t = 400 µs/DIV

∆VI = 2 V

VQ = 50 mV/DIV

VI

IEN[µA]

25_IINH vs V IN INH _off .vsd

0.6

0.4

0.2

0.8TJ = 25°C

10

VI [V]

30 4020

1.0

TJ = -40°C

TJ = 150°C

EN = L (i.e. IC OFF)

IEN[µA]

24_IINH vs V INH.vsd

30

20

10

40TJ = 25°C

10

VEN [V]

30 4020

50

TJ = -40°C

TJ = 150°C

PV [W]

6 9

RTH-JA[K/W]

32_RTH VS PV TO252.VS D

60

55

50

65

3 12

A = 300mm2

Cooling Area single sided PCB

75

TO252-5

Data Sheet 14 Rev. 1.02, 2009-12-10

IFX24401

Application Information

6 Application Information

Figure 4 Application Diagram

Input, OutputAn input capacitor is necessary for damping line influences. A resistor of approx. 1 Ω in series with CI, can dampthe LC of the input inductivity and the input capacitor.The IFX24401 requires a ceramic output capacitor of at least 470 nF. In order to damp influences resulting fromload current surges it is recommended to add an additional electrolytic capacitor of 4.7 µF to 47 µF at the outputas shown in Figure 4.Additionally a buffer capacitor CB of > 10µF should be used for the output to suppress influences from load surgesto the voltage levels. This one can either be an aluminum electrolytic capacitor or a tantalum capacitor followingthe application requirements.A general recommendation is to keep the drop over the equivalent serial resistor (ESR) together with the dischargeof the blocking capacitor below the allowed Headroom of the Application to be supplied (e.g. typ. dVQ = 350mV). Since the regulator output current roughly rises linearly with time the discharge of the capacitor can be calculatedas follows: dVCB = dIQ*dt/CB

The drop across the ESR calculates as:dVESR = dI*ESRTo prevent a reset the following relationship must be fullfilled:dVC + dVESR < VRH = 350mV

Example: Assuming a load current change of dIQ = 100mA, a blocking capacitor of CB = 22µF and a typicalregulator reaction time under normal operating conditions of dt ~ 25µs and for special dynamic load conditions,such as load step from very low base load, a reaction time of dt ~ 75µs.dVC = dIQ*dt/CB = 100mA * 25µs/22µF = 113mV

So for the ESR we can allowdVESR = VRH2 - dVC = 350mV - 113mV = 236mV

The permissible ESR becomes:ESR = dVESR / dIQ = 236mV/100mA = 2.36Ohm

IFX24401

3, TabGND

OvertemperatureShutdown

1

5Q

470nF

VCC

+ 4.7µF

EN2

1 I

100nF

VBat

e. g.Ignition

BandgapReference

ChargePump

Enable

Data Sheet 15 Rev. 1.02, 2009-12-10

IFX24401

Package Outlines

7 Package Outlines

Figure 5 PG-TO252-5

Figure 6 PG-SSOP-14

1) Includes mold flashes on each side.

4.560.25 M A

6.5

5.7 MAX.

±0.1

per side0.15 MAX.

-0.2

6.22

±0.5

9.98 (4

.24)

1

A

1.14

5 x 0.6

±0.1

50.

8

±0.1

+0.15-0.05

0.1

B

-0.04+0.08

0...0.15

0.51

MIN

.

0.5

B

2.3 -0.10

0.5

+0.05

-0.04+0.08(5)

-0.010.9 +0.20

B

1)

All metal surfaces tin plated, except area of cut.

GPT09527

PG-SSOP-14-1,-2,-3-PO V02

1 7

14 8

14

1 7

8

14x0.25±0.05 2)

M0.15 DC A-B

0.65C

Sta

nd O

ff

0 ...

0.1

(1.4

5)

1.7

MA

X.

0.08 C

A

B

4.9±0.11)A-BC0.1 2x

1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Does not include dambar protrusion

Bottom View±0.23

±0.2

2.65

0.2±0.2

D6

M D 8x

0.64±0.25

3.9±0.11)

0.35 x 45˚

0.1 C D

+0.0

60.

19

8˚ M

AX

.

Index Marking

Exposed Diepad

GPT09113

Data Sheet 16 Rev. 1.02, 2009-12-10

IFX24401

Revision History

Data Sheet 17 Rev. 1.02, 2009-12-10

8 Revision History

Revision Date Changes1.02 2009-12-10 Corrections to pin assignment 1.01 2009-10-19 Coverpage changed

Overview page: Inserted reference statement to TLE/TLF series.1.0 2009-04-28 Initial Release

Edition 2009-12-10Published byInfineon Technologies AG81726 Munich, Germany© 2009 Infineon Technologies AGAll Rights Reserved.

Legal DisclaimerThe information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.

InformationFor further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com).

WarningsDue to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office.Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.