I T R S 2013 E M - JEITA
Transcript of I T R S 2013 E M - JEITA
INTERNATIONAL TECHNOLOGY ROADMAP
FOR
SEMICONDUCTORS
2013 EDITION
METROLOGY
THE ITRS IS DEVISED AND INTENDED FOR TECHNOLOGY ASSESSMENT ONLY AND IS WITHOUT REGARD TO
ANY COMMERCIAL CONSIDERATIONS PERTAINING TO INDIVIDUAL PRODUCTS OR EQUIPMENT.
THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
TABLE OF CONTENT 1 èšæž¬ (Metrology) ............................................................................................................ 1
1. è«žèšãšæŠèŠ ................................................................................................................... 1 1.1. è«žèš ..................................................................................................................... 1
1.2. æŠèŠ ..................................................................................................................... 3
1.3. ç£æ¥åºç€ã®å¿ èŠæ§ïŒINFRASTRUCTURE NEEDSïŒ .......................................................... 4
2. å°é£ãªæè¡èª²é¡ ............................................................................................................ 4 2.1. å°é£ãªæè¡èª²é¡ ........................................................................................................ 4
3. é¡åŸ®é¡èŠ³å¯ïŒMICROSCOPYïŒ ........................................................................................ 7
4. ãªãœã°ã©ãã£ã«ãããèšæž¬ïŒLITHOGRAPHY METROLOGYïŒ .................................................. 10 4.1. ã©ã€ã³ã©ããã¹(LINE ROUGHNESS) .............................................................................. 13
4.2. èšæž¬ã®äžç¢ºãã(Measurement Uncertainty) ................................................................ 14
4.3. TABLE MET3ãMET4 ã«ãããâäžç¢ºããâã®èª¬æ ............................................................... 17
5. FEP ã«ãããèšæž¬ïŒFRONT END PROCESSES METROLOGYïŒ ........................................... 19 5.1. ã·ãªã³ã³ãŠã§ãŒãïŒStarting MaterialsïŒ .......................................................................... 19
5.2. è¡šé¢åŠçïŒSurface PreparationïŒ ............................................................................ 20
5.3. ç±åŠç/èè圢æïŒThermal/Thin FilmsïŒ ................................................................... 20
5.4. æªïŒ³ïœããã»ã¹ïŒStrained Si processesïŒ .................................................................... 20
5.5. FERAM ............................................................................................................... 22
5.6. ããŒãã³ã°æè¡......................................................................................................... 23
6. 3次å é ç·ã«ãããèšæž¬(3D Interconnect Metrology) ...................................................... 26 6.1. ãã³ãã£ã³ã°ãªãŒããŒã¬ã€ ............................................................................................... 26
6.2. ãã³ãã£ã³ã°çé¢ã®ãã€ãæ€åºïŒBonded Interface Void DetectionïŒ ..................................... 27
6.3. ãã³ãã£ã³ã°çé¢ã®æ¬ é¥æ€æ»ïŒBONDED INTERFACE DEFECT IDENTIFICATIONïŒ ................ 27
6.4. ãã³ãã£ã³ã°çé¢ã®æ¬ é¥èŠ³å¯ïŒBONDED INTERFACE DEFECT REVIEWïŒ ............................. 27
6.5. ãšããžããã«æ¬ é¥ïŒEdge Bevel DefectsïŒ ..................................................................... 28
6.6. æ¥ç匷床åäžæ§ ..................................................................................................... 28
6.7. BONDED WAFER PAIR THICKNESS (æ¥åãŠã§ãŒãã®ç·åã¿) ............................................. 28
6.8. TSV ãšããæ·±ã ........................................................................................................ 29
6.9. TSV ãšããåœ¢ç¶ ....................................................................................................... 29
6.10. TSV ã«ããããªãã¢ã»ããªã¢ã»ã·ãŒãèå ............................................................................ 29
6.11. 貫éãã¢ïŒTSVïŒãã€ã .......................................................................................... 30
6.12. 圢ç¶ãšå¿å ......................................................................................................... 30
6.13. Cu ãã€ã«ããã©ãŒã®äžæ¬¡å èšæž¬ .................................................................................. 30
7. é ç·ã«ãããèšæž¬ ïŒINTERCONNECT METROLOGYïŒ ..................................................... 31
THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
7.1. CU-LOW-kèã®ã¡ããé ç·ã®èª²é¡ãšèšæž¬èŠæ± ................................................................... 31
7.2. äœèªé»çïŒLOW-ÎïŒèã®èª²é¡ãšèšæž¬èŠæ± ...................................................................... 33
8. ææãšæ±æã®è©äŸ¡ïœ¥è§£æ .................................................................................................. 36 8.1. æªããã€ã¹ã®ææãšæ±æ .............................................................................................. 38
9. æ°æ¢æ±ææãšããã€ã¹ã®çºã®èšæž¬ ....................................................................................... 40 9.1. ã°ã©ãã§ã³ã®èšæž¬ã«ãããé²å±ã«é¢ããæŽæ° ........................................................................ 40
9.2. ã¡ã¢ãªã¹ã¿ïŒèšæ¶æµæããã€ã¹ïŒã®èšæž¬ã«ãããé²å±ã«é¢ããæŽæ°............................................... 41
9.3. ããã¹ã±ãŒã«å¯žæ³ã®èšæž¬ãžã®ã€ã³ãã¯ãã«é¢ããã³ã¡ã³ã ............................................................. 41
9.4. 3次å ååã€ã¡ãŒãžã³ã°ãšåå æ³ .................................................................................... 41
9.5. èµ°æ»ãããŒãé¡åŸ®é¡ãå«ãä»ã®é¡åŸ®é¡ã®å¿ èŠæ§ .................................................................. 42
9.6. ããç©è³ªã®å åŠç¹æ§.................................................................................................. 44
9.7. æ°æ¢æ±ææãšããã€ã¹ã®çºã®é»æ°çç¹æ§è©äŸ¡ .................................................................... 44
10. æšæºè©Šæ .................................................................................................................. 45
11. ïŒD ããæ§é èšæž¬ã®å¿ èŠæ§ãšèª²é¡ ...................................................................................... 47 11.1. åç¬ããã€ã¹ã®ïŒD ããæ§é ã®è§£æ ............................................................................... 48
11.2. ããã¹ã±ãŒã«ãã¢ã°ã©ãã£ãŒã®ãã¬ã³ã ................................................................................. 49
11.3. ã¡ããããžãŒæè¡ã®çµã¿åãã ..................................................................................... 50
11.4. ã©ããŠãŒã¹ãšãã¡ããŠãŒã¹ã®éã ..................................................................................... 51
12. æšæºèšæž¬ã·ã¹ãã ......................................................................................................... 51
List of Figures
Figure MET1 Lithography Metrology Potential Solutions ................................................. 18
Figure MET2 Review of Stress/Strain Measurement Methods .......................................... 22
Figure MET3 3D Metrology Requirements .................................................................... 23
Figure MET4 FEP Metrology Potential Solutions ............................................................. 25
Figure MET5 Interconnect Metrology Potential Solutions ................................................ 35
List of Tables
Table MET1 Metrology Difficult Challenges ....................................................................... 5
Table MET2 Metrology Technology Requirements .............................................................. 7
Table MET3 Lithography Metrology (Wafer) Technology Requirements .............................. 17
Table MET4 ITRS 3D Interconnect TSV Roadmap ............................................................ 26
THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 1
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2 Metrology
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Metrology 3
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4 Metrology
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Metrology 5
Table MET1 Metrology Difficult Challenges
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6 Metrology
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Metrology 7
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TableMET 2 Metrology Technology Requirements
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
8 Metrology
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 9
He ã€ãªã³é¡åŸ®é¡èŠ³å¯ïŒHIMïŒ ïŒ â现ãçµãããé»åããŒã ãšè©Šæã®çžäºäœçšã«äŸã£ãŠå®å¹çãªãããŒããµã€ãºãæ¡ããããšâã«ä¿ãåé¡ãå æããããã®æ段ãšããŠææ¡ãããããã®æè¡ã¯ CD枬å®ãæ¬ é¥ã¬ãã¥ãŒãããã³ãããã¯ãããžãŒã«å¿çšã§ããå¯èœæ§ãæã£ãŠãããHIM 㧠1nm 以äžã®å解èœãéæãããããããè©Šæãšã®çžäºäœçšã«ã€ããŠã¯æªã çåã®ãŸãŸã§ããã IC補é ã«ãããã€ã³ã©ã€ã³ã®ãŠã§ãŒãèšæž¬æ©ãšããŠäœ¿çšã§ããããã«ã¯ãHIMã¯é«ã¢ã¹ãã¯ãã®ãšããã³ã°åŸã®ã³ã³ã¿ã¯ãããŒã«ããã¬ã³ããã¿ãŒã³ããé»åç·æå·ãæå¶ããŠèšæž¬ã§ããããã«ããå¿ èŠãããã èµ°æ»ãããŒãé¡åŸ®é¡èŠ³å¯ïŒSPMïŒScanning Probe MicroscopyïŒ ïŒ CD-SEMïŒCritical Dimension Measurement Scanning Electron MicroscopeïŒã®æž¬å®çµæã®æ ¡æ£ã«äœ¿çšãããããç¥ããªããååéåé¡åŸ®é¡ïŒAFMïŒã®ããã«èµ°æ»ãããŒãé¡åŸ®é¡ã¯ãâ被枬å®è©Šæã®æ質ã«åœ±é¿ããé£ã 3次å 枬å®âãå¯èœã«ããããããŒãã现éãããšããããŒãå 端ã®ãããå 端éšãæ²ããããŠæž¬å®ç²ŸåºŠãæªããªãããããã£ãŠããããŒãæ質ãšèµ°æ»æã«åããåãèæ ®ããŠããããŒãã®åœ¢ç¶ãšã¢ã¹ãã¯ãæ¯ã劥åœãªå€ã«èšå®ããªããã°ãªããªããçãã«ãŒãã³ãããã¥ãŒãïŒèš³è 泚ïŒççŽ ååã§æ§æãããåŸã nmçšåºŠã®çïŒã®ãããªéåžžã«ç¡¬ããããŒãææãããã®åé¡ãå€å°ãšã解æ¶ããŠãããããç¥ããªãã ä»ã®èµ°æ»åãããŒãé¡åŸ®é¡ã«ã€ããŠã®è°è«ã¯ãæ°æ¢ç©¶ææåã³æ°æ¢ç©¶ããã€ã¹ã®ç« ã«èšèŒããŠããã é èŠéé¡åŸ®é¡èŠ³å¯(Far-field Optical Microscopy) ïŒ èš³è 泚ïŒåæå ãå©çšããéåžžã®é¡åŸ®é¡ã§ã®èŠ³å¯ïŒïŒå解èœã¯å ã®æ³¢é·ã«äŸã£ãŠæ±ºãããããæ³¢é·ã«ããéçãæç Žãããããé 玫å€å æºãçšããé¡åŸ®é¡ããã³è¿æ¥å Žå åŠé¡åŸ®é¡ïŒNear-field MicroscopyïŒ èš³è 泚ïŒå ãæ³¢ãšããŠã®æ§è³ªãçºæ®ã§ããªã極埮å°ãªé åã®å ãããªãã¡è¿æ¥å Žå ãããã¯ãšãããã»ã³ãå ãå©çšããé¡åŸ®é¡ã§ã®èŠ³å¯ïŒã®éçºãé²ãã§ãããèªåæ¬ é¥åé¡ãœããã®æ¹è¯ãå¿ èŠã§ãããå åŠé¡åŸ®é¡ã¯ãä»åŸãåŒç¶ããŠããã«ããããã¢ãžã¥ãŒã«ã®ãã³ããã³ãã®ãããªå€§ããªãã¿ãŒã³ã®æ€æ»ã«äœ¿ãããŠè¡ãã§ãããã ãŸããä»ã®å®éšçã«è¡ãããŠããæ°ããªå åŠçå¿çšäºäŸãšããŠãåŸæ¥ã®ç»åããçŽæ¥èšæž¬ããææ³ãšã¯å šãç°ãªããåŸæ¥ã®èšæž¬ã«ä»£ãã£ãŠããããã¯ãããã»ã¹ã®çªçºçãªå€åãå¯ç¥ããããã«ããã埮现ãªåœ¢ç¶ãæ€åºã§ããå¯èœæ§ãæããŠãããããããªãããã€ã³ã©ã€ã³èšæž¬ãšããŠã®å°äœã確ç«ããã«ã¯ãããã«ç 究ã»éçºãå¿ èŠã§ãã 2, 3 ã æ¬ é¥æ€åºæè¡ ïŒ åæè¡ã極éçåé¡ãæ±ããŠãããæ¬ é¥ã¯âæ©çããäœäžãããæããããå šãŠã®ç©ççãé»æ°çãããã¯ãã©ã¡ãŒã¿çãªç°åžžâãšããŠå®çŸ©ããããçŸè¡ã® SEMã SPM ã®æ¬ é¥æ€åºé床ã¯ãå åŠé¡åŸ®é¡ã«åã£ãŠä»£ããã«ã¯äœãã«ãé ããããã¢ã¬ãŒå SPMïŒèš³è 泚ïŒè€æ°ã® SPM ãé åãã SPMïŒãçšããããšã§é«éèµ°æ»ã®å¯èœãªããšãå®èšŒãããŠããïŒSEM ããã¯éãããç¥ããªãïŒãããããããŒãã®å¯¿åœãåäžæ§ãç¹æ§ãããã³æ©æ» ã«ä¿ããåé¡ãåŠçãããã°ãªããªããã¢ã¬ãŒå SPM ã®æè¡ã¯ã䞊ã¹ã SPM ã®æ°ãå¢ããããšãšå€æ§ãªæäœã¢ãŒããéçºããããšã«åã泚ãã¹ãã§ãããã¢ã¬ãŒåãã€ã¯ãã«ã©ã SEMïŒèš³è 泚ïŒè€æ°ã®è¶ å°åé¡çãé åãã SEMïŒã SEM ã®ã¹ã«ãŒããããäžããããã®ææ³ãšããŠææ¡ãããåé¡çã®ãã€ã¯ãã«ã©ã SEM ã§ã¯ãã®åäœãå®èšŒããããéé»ã¬ã³ãºããã³ç£çã¬ã³ãºã®èšèšéçã«æãç 究ãå¿ èŠã§ããã
4. ãªãœã°ã©ãã£ã«ãããèšæž¬ ãã¿ãŒã³å å·¥æè¡ã®æ¥éãªé²æ©ã¯ããªãœã°ã©ãã£çšèšæž¬ã«å¯ŸããŠãçžå€ãããå°é£ãªèª²é¡ã課ãç¶ããŠãããããããããã»ã¹é åã«ãããŠãæ°ããªææãçšãããããšããªãœã°ã©ãã£çšèšæž¬ãééãã課é¡ã¯å¢å ããããã©ã³ãžã¹ã¿ã®ã²ãŒãé·ã«ãããå€åãæ£ç¢ºã«å¶åŸ¡ããåãçµã¿ã¯ããã¹ã¯èšæž¬ããå§ãŸãããšã«ãªãããã¹ã¯äžã®å šãŠã®å³åœ¢ã¯ãé²å è£ çœ®ã®æ圱åçã®é¢ä¿äžã
THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
10 Metrology
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Metrology 11
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
12 Metrology
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Metrology 13
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14 Metrology
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 15
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16 Metrology
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 17
çšéã«ãã£ãŠãâæ£ç¢ºãâïŒaccuracyïŒãåäžèšæž¬è£ 眮ã®â粟å¯ãâïŒprecisionïŒããããã³ã°ã®èŠæ±å€ãå®çŸ©ãããããšã«ãªãã幟ã€ãã®çšéã«ãããŠã¯ãçžå¯Ÿçãªâæ£ç¢ºãâïŒaccuracyïŒããåäžèšæž¬è£ 眮ã®â粟å¯ãâïŒprecisionïŒãæåªå ãããããŸããããçšéã«ãããŠã¯ãèšæž¬è£ 眮éã®ãããã³ã°ãåäžèšæž¬è£ 眮ã®â粟å¯ãâïŒprecisionïŒãæåªå ãããããŸãä»ã®çšéã«ãããŠã¯ãåäžã®èšæž¬çµæã ãã§ã¯å¿ èŠãšãããèšæž¬æ å ±ãæäŸããã«ã¯äžååã§ãããããããè€æ°ã®èšæž¬çµæã®å¹³åã¯ãèšæž¬ãšããŠéèŠãªæå³ãæã€ããã®å Žåãâ粟å¯ãâïŒprecisionïŒã¯ãå¹³åå€ã®äžç¢ºããã®èŠæ±å€ãšããŠè§£éãããã¹ãã§ãããè¡šäžã®â粟å¯ãâïŒprecisionïŒã®å€ã¯ãäžç¢ºããã®å€ãšããŠå€æŽãããâ粟å¯ãâïŒprecisionïŒãšâäžç¢ºããâïŒuncertaintyïŒÏïŒïŒã®é¢ä¿ã¯åŒïŒ1ïŒã«äžããããŠããã
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äžç¢ºãã (Ï) ã¯æ¬¡ã®æåãå«ãã§ããïŒÏP (Precision), ÏM (Matching), ÏS (Sample variation) ãš Ïother (inaccuracy and other effects)ãããããã®æåã¯ãç¬ç«ãªæ£èŠååžã§ãããšä»®å®ãã 5ã
Table MET3 Lithography Metrology (Wafer) Technology Requirements
THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
18 Metrology
Figure MET1 Lithography Metrology Potential Solutions
2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026
18 1/2 pitch (Flash)
CD-SEMOptical Scatterometry
CD-AFM (calibration)Mueller Matrix Scatterometry
14.2 nm 1/2 pitch (Flash)
CD-SEMOptical Scatterometry
CD-AFM (calibration)Mueller Matrix Scatterometry
CD-SAXS
10.9 nm 1/2 pitch (Flash)
CD-SEMOptical Scatterometry
CD-AFM (calibration)Mueller Matrix Scatterometry
CD-SAXS
8 nm 1/2 pitch (Flash)
CD-SEMOptical Scatterometry
CD-AFM (calibration)Mueller Matrix Scatterometry
CD-SAXS
This legend indicates the time during whichresearch, development, and qualification/prer-production should be taking place for the solution.
Research RequiredDevelopment Underway
Qualification/ Pre-ProductionContinuous Improvement
First Year of IC Production
THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 19
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20 Metrology
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
24 Metrology
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 25
Figure MET4 FEP Metrology Potential Solutions
2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026
18 1/2 pitch (Flash)
Thin Dielectric Film ThicknessSpectroscopic Ellipsometry
X-ray Reflectivity
14.2 nm 1/2 pitch (Flash)
Thin Dieletric Film ThicknessSpectroscopic Ellipsometry
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3 axis HR XRDPhotoluminescence
3D Fin MetrologyScatterometry/MM Scatterometry
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3D Fin MetrologyScatterometry/MM Scatterometry
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This legend indicates the time during whichresearch, development, and qualification/prer-production should be taking place for the solution.
Research RequiredDevelopment UnderwayQualification/ Pre-ProductionContinuous Improvement
First Year of IC Production
THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
26 Metrology
6. 3次å é ç·ã«ãããèšæž¬ 3次å é ç·åœ¢ææè¡ã¯ãé ç·æè¡ããŒããããã®äžã ãã§ãªããçµç«ãããã±ãŒãžã³ã°æè¡ã®äžã§ãè°è«ãããŠãããé«ã¢ã¹ãã¯ãæ¯ã® TSV ããå åŠé¡åŸ®é¡æè¡ã䜿ãã«ãã SiãCuãªã©ã®äžéæææãèšæž¬å¯Ÿè±¡ãšããäºãã3次å èšæž¬ã«ãããäž»ãªèª²é¡ã§ããããã®èª²é¡ã¯ãã€ã³ã©ã€ã³èšæž¬ãšãç Žå£æ€æ»ã䌎ããªãã©ã€ã³æ€æ»ã® 2çš®é¡ã®èšæž¬ææ³ã«åããŠèããããšãã§ããã 補é å¯èœãª 3次å ããã»ã¹ã®éçºã¯ãæ¢åã®åå°äœèšæž¬æè¡ãäŸãã°ãèèèšæž¬ãããã±ãŒãžã³ã°èšæž¬ãé»æ°çè©Šéšãªã©ã«ããå¹ åºãäŸåããŠãããããããªããããããã®èšæž¬æè¡ã«é¢ããŠã¯ ITRS ã®æ¬ã»ã¯ã·ã§ã³ã«ãããŠèšåããªãã
Table MET4 ITRS 3D Interconnect TSV Roadmap
6.1. ãã³ãã£ã³ã°ãªãŒããŒã¬ã€ 3次å é ç·ã®ããã®ãŠã§ãæ¥åããã»ã¹è£ 眮æ§èœãæ€èšŒããã«ã¯ãæ¥çãããŠã§ããã¢ïŒBonded Wafer PairsïŒã®çé¢ã«ããã¢ã©ã€ã¡ã³ãåºæºããèµ€å€ç·(IR)é¡åŸ®é¡æ€æ»ã«ãã£ãŠæž¬å®ããéãåãã粟床èŠæ Œã«å¯Ÿãã誀差éã確èªããå¿ èŠããããããã«ãã£ãŠãéãåãã粟床ããé»æ°çã«åé¡ã®ãªãé ç·åœ¢æã«ååã§ãããã©ãããå€æãããèµ€å€ç·ã¯ã·ãªã³ã³ãŠã§ã(300mm ãŠã§ãã®åã¿ã¯ 775um)ãééããäºãã§ãããããã·ãªã³ã³ã¯èµ€å€ç·ã«å¯ŸããŠéæã ãšèšããããã®ç¹æ§ã«ãããèµ€å€ç·ã«ãã£ãŠéãåãã粟床ãèšæž¬ããããšãå¯èœãšãªã£ãŠããã çŸåšãæ¥åãŠã§ãã®éãåãã粟床ãã倧éçç£ãã§ãŒãºã§ã€ã³ã©ã€ã³èšæž¬å¯èœãª IRé¡åŸ®é¡è£ 眮ãå€æ°ååšããããããã®è£ 眮ã¯ãããŒããã³ã IRïŒéåžžãããã²ã³ã©ã³ããå æºïŒããããã¯ç¹å®æ³¢é·ã® IR ã¬ãŒã¶ãŒïŒéåžžãæ³¢é· 1310nmïŒãå©çšããŠããããããã® IR枬å®åšã¯ãæ¥åãŠã§ãã®éãåãã枬å®ã«ãããŠã1Ï㧠0.1 ãã¯ãã³ã®èšæž¬åçŸæ§ãæããããŸãã空éå解èœãšããŠã¯ãã¬ã€ãªãŒåºæºã§ 0.5umçšåºŠã§ããããã£ãªã¢åºæ¿ãå¯èŠå ãééããæ質ã§ããå Žåãè¡šé¢é¡åŸ®é¡ãšè£é¢é¡åŸ®é¡ãåãã枬å®è£ 眮ã IRé¡åŸ®é¡ã®ä»£æ¿è£ 眮ãšããŠæå¹ã§ããããã®å Žåãã1Ï㧠0.1 ãã¯ãã³ä»¥äžã®æž¬å®åçŸæ§ãæããã
THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 27
ã€ã³ã©ã€ã³ã®éãåãã粟床枬å®ã¯ãé»æ°çé ç·ã«åé¡ã®ããæ¥åãŠã§ãã®ã¢ã©ã€ã¡ã³ãäžè¯ãæ€åºããããã«å¿ èŠã§ãããããã«ãããäžè¯ãŠã§ãã次工çšã§åŠçããç¡é§ãªè²»çšãšæéã®çºçãé¿ããããšãã§ããããŸãããŠã§ãæ¥åããã»ã¹ãã¯ããŒãºããã£ãŒãããã¯ã«ãŒãã§å¶åŸ¡ããããšãã§ãããIRé¡åŸ®é¡ã®è§£åå 0.5um ã¯ã2009-2012 ã«ããããé ç·ããŒããããã®éãåãã粟床èŠæ±ãæºãããŠãããããŒããããã«ããã°ã2012 幎以éãéãåãã粟床èšæž¬ã®è§£ååæ¹åãæ±ããããŠããã éãåããç¹æ§ã¯æ¬è³ªçã« 2Dãã©ã¡ãŒã¿ã§ãããæ¥åãŠã§ããã¢ã®å šé¢ã«ååžãããã¿ãŒã³ã«ãããŠãå圢ãã¢ãå圢ãããã«æ¥ç¶ãããŠãããéãåããç¹æ§ã«é¢ããã»ãšãã©ã®è°è«ã¯äžè»žæ¹åã«ãããŠã®ã¿ãªãããŠãããå®éã®èŠæ±ã§ãããšããã®å€æ¬¡å æ§ãå å³ããéãåããã®å®çŸ©ãšããŠã§ãå šé¢ã§ã®éãåãã粟床ãè©Šéšå¯èœãªææ³ããITRS2013 ã«å®çŸ©ããã¹ãã§ããã
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
28 Metrology
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 29
6.8. TSV ãšããæ·±ã
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
30 Metrology
6.11. 貫éãã¢ïŒTSVïŒãã€ã TSV ãé ç·é åã§ã®ãã€ã¯ããã€ãã®çºçã¯ãé»æ°çãªãããã¯ä¿¡é Œæ§ã®äžã§ã®äžè¯ãšãªããæšæºçãªåææ³ã FIB/SEMæè¡ã«ãããããç¹å®ã®æ¥çæžã¿ãã¢ã®ç¶æ ãç Žå£çã«è©äŸ¡ããããšã¯å¯èœã§ããããããã®æ¬ é¥ãéç Žå£çææ³ã«ãã£ãŠç¹å®ããããšã¯ãããã»ã¹éçºããã³æ é解æã®åæ¹ã«ãšã£ãŠå€§ããªå©çãããããã ããã
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6.12. 圢ç¶ãšå¿å 貌ãåãããŠã§ãŒãïŒBWPïŒã®åœ¢ç¶ã¯éåžžãå šããã»ã¹ãããŒã®äžã§ããã¿ã»æªã¿æž¬å®ã«ãã£ãŠå¶åŸ¡ãããŠããããã®ããšã¯ããã»ã¹ã¢ãã¿ãªã³ã°ã«å¯ŸããŠã®ã¿ãªããã補é ãšããç¶æ³ã§ã®èããŠã§ãŒãã®ãã³ããªã³ã°ã«é¢é£ãããã¹ãŠã®åŽé¢ã«å¯ŸããŠæ±ºå®çã«éèŠã§ãããçŸåšã¯ãããã®ã€ã³ã©ã€ã³èšæž¬ããµããŒãã§ããå€ãã®èšæž¬ããŒã«ããããã¬ãŒã¶ãŒååã容éãè²ãå¹²æžèšãã³ããŒã¬ã³ãåŸé æ€åºãšãã£ãæ§ã ãªææ³ã BWP ã®åœ¢ç¶ã枬å®ã§ãããçŸç¶ã§ã¯ãèšæž¬çµæã¯ãŠã§ãŒãã®ä¿ææ¹æ³ã«åŒ·ãäŸåãããŸãéåå¹æã«ã倧ãã圱é¿ãããå¯èœæ§ããããåå°äœèšæž¬ããŒã«ã¡ãŒã«ãŒå士ããSEMI ã¹ã¿ã³ããŒãã®æèšãéããŠçµ±äžæ§ãåäžããŠããå¿ èŠãããããã®ããšã¯ææ³éã§ã®çµæã®æ¯èŒãå¯èœã«ããã
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6.13. CUãã€ã«ããã©ãŒã®äžæ¬¡å èšæž¬ ç©å±€åè·¯ãããã¯ã 3 次å éç©åè·¯ãšãã£ãå°æ¥ã® 3 次å é ç·æè¡ã®ããã«ãç©å±€ãããã€ã®äžéšãšäžéšãæ¥ç¶ãã Cu ãã©ãŒã®é«ããçŽåŸãé¢åäžæ§ãå¶åŸ¡ããããšããããŒãºãããããã®èŠæ±ã¯ãåŸå·¥çšè£œé ãã©ã³ãã«ããããã³ãèšæž¬ãšå šãåçã®ãã®ã§ãããä»ã IC補é äžãŠã§ãŒãã¬ãã«ã§éåžžã«éèŠãªæå³ãæã£ãŠããŠããã
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 31
7. é ç·ã«ãããèšæž¬ æ°èŠããã»ã¹åã³æ§é ã«å¯Ÿããã¡ããããžãŒã®èª¿æ»ãéçºã¯åŒãç¶ãç¶ããããŠãããæ¢ã«ããŒã©ã¹ãª low-k æã¯éç£é©å¿
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埮现åãã Cu/low k é ç·ã«å ããŠãå åŠ, ã«ãŒãã³,ã¹ãã³ããŒã¹ã®æ°ããé ç·ã®è§£ã¯ããããåºæã®ã¡ããããžãŒææŠã
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
32 Metrology
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 33
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
34 Metrology
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 35
Figure MET5 Interconnect Metrology Potential Solutions
2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026
18 1/2 pitch (Flash)Barrier Metal
X- Ray Reflectivity4 PT Probe
XRFSpectroscopic Ellipsometry
Patterned ILDScatterometry/MM Scatterometry
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This legend indicates the time during whichresearch, development, and qualification/prer-production should be taking place for the solution.
Research RequiredDevelopment UnderwayQualification/ Pre-ProductionContinuous Improvement
First Year of IC Production
THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
36 Metrology
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Metrology 37
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38 Metrology
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42 Metrology
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 43
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è€éãªç¹æ§ â æããå°æ¥äžä»£ã®ããã€ã¹ã§ã¯ãææ©ç©ãçäœååæåãå«ãåºç¯å²ãªææ矀ã䜿çšãããããã«ãä»å çãªç¹æ§ã®èšæž¬ãå¿ èŠãšããããæ§ã ãªæ€åºæ§æã«ãããŠé«ãåšæ³¢æ°ã䜿ãããšã«ãããå±æçãªèªé»å®æ°ãé»æªãå§é»ä¿æ°ãã¹ã€ããã³ã°åäœçãåããããããã®èšæž¬ã¯èªé»ç¹æ§è©äŸ¡ã ãã§ãªãããã£ãã·ã¿ã«åºã¥ãã¡ã¢ãªã®éçºãšè€åããã€ã¹æ§é ã«å¯ŸããŠãéèŠã§ããã å€éå€èª¿ïŒMultiple ModulationïŒãšè€ååãããŒã â è€æ°ã®èšæž¬ã®çµã¿åããã¯ãç¹æ§ãåé¢ããäžã§å¿ èŠã§ãããæã«ã¯æ å ±ãæ倧ã«ããã®ã«åœ¹ç«ã€ãäŸãã°ç£æ°åã®æž¬å®æã«çºçãã枬å®ãç¡å¹ã«ããéé»çžäºäœçšã®äŸããããè¡šé¢é»äœãé«ãåšæ³¢æ°ã§èšæž¬ããããšã«ããçžäºäœçšãç¡ãããç£æ°åã¯äœãåšæ³¢æ°ã§èšæž¬ããããšã«ãããçžäºäœçšã¯åé¢ããå®éåãããããã®ã¢ãããŒãã¯æ®éåãããèšæž¬ããŒã«ãéçºããã®ã«å¿çšã§ããã 9.5.2. é«ç©ºéå解èœãæã€å±æçç¹æ§çšãããŒãïŒææŠç課é¡ïŒChallengesïŒ ææŠç課é¡ã¯ã補ååã®ç°å¢ãšæéã¹ã±ãŒã«ã®äžã§çã 埮现åãããããã€ã¹ãšè€éãªææ矀ã«ããããã®æ段ãæäŸã
ãããšã§ããã å šè¬çãªã¢ã¯ã»ã¹ã®ããããïŒGeneral AccessibilityïŒ â ç 究宀ã«æŒããéçºããåååãŸã§ã«èŠããæéã¯ãæ§èœãšã¢ã¯ã»ã¹ã®ãããããšã®éã®å€§ããªéããã«èµ·å ãããèšèšã«ïŒå¹ŽçšåºŠã®æéãè²»ããäŒæ¥ãããããã®ããšã¯ãããã€ã¹ã®
THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
44 Metrology
ç 究ã High-k絶çžèã®çºã®æ°ããææãå å«ããç°ãªãæ§é ã®æ¢æ±åã³ CMOSåŸã®æè¡ã«åããããšã«ãªãã®ã§ãçŸæç¹ã§å€§ããªåé¡ã§ãããããŒããããã®èŠæ±ã«åãããã«ãã¢ã¯ã»ã¹ããããããããã®æ°ããä»çµã¿ãå¿ èŠã§ããã é«å解èœå â 埮现åãšã¬ã¯ãããã¯ã¹æ代ã«ãããŠã¯ãããé«ã空éå解èœã«åããåŸåã¯æãŸãããSPMã®äžã«ã¯ãåºæ¬åçã«ãã£ãŠæçµçãªå解èœãå¶éããããã®ãããã§ãããããã®ä»ã®ææ°ã®æ段ã§ã¯ãéçãæªã 調ã¹ãããŠããªããã®ããããèµ°æ»ã±ã«ãã³ãããŒãé¡åŸ®é¡ã«æŒããæè¿ã®ææã¯ãããã€ãã®è€éãªç¹æ§ã®ãããŒãã«å¯ŸããŠååã¹ã±ãŒã«ã®å解èœãå¯èœã§ããããšã瀺åããŠãããããã§ããã°ãæ°ããç©çãåºçŸããåºãŠããçµæã解éããããã®çè«ãå¿ èŠãšãããã§ããããé匟æ§ãã³ããªã³ã°ãåäžé»åæ€åºã«ãã£ãŠå®èšŒãããŠããããã«ãå€ãã®èšæž¬ã®ãšãã«ã®ãŒå解èœãåäžããå¯èœæ§ããããæé«ã®ãšãã«ã®ãŒå解èœã¯äœæž©äžã§éæãããã§ãããããããã¯ã¹ã«ãŒããããšå©äŸ¿æ§ã«çžåããã æ¢éãšã«ã³ãã¬ããŒæè¡ â 補é æ¥è ã¯å€ãã®ç¹æ®ãªSPMçšã«ã³ãã¬ããŒåã³æ¢éãéçºããŠããã補é ã®åçŸæ§ã«ã¯ãã°ãã°åé¡ããããè¯åãããã®æ©çã30ïŒ å°ã®å Žåãããããã£ãšé倧ãªããšã¯ãåžè²©ã®ã«ã³ãã¬ããŒâæ¢éãšããŒã«éçºã«èŠæ±ãããããããšã®éã®éããã§ãããããŒã«éçºçšã®æ¢éã¯åã蟌ãŸããé»æ°åè·¯ãè€éãªæ¢éã®åœ¢ç¶ã䌎ã£ãŠããã®ã§ããã®éããã¯ãã倧ãããªã£ãŠããã æ ¡æ£æšæº â ããã¡ãŒã¿ãŒãµã€ãºã®ç©è³ªæ§é ã«å¯Ÿããæ ¡æ£æšæºã®æ¬ åŠã¯é倧ãªåé¡ã§ãããé«ã空éå解èœåãšç¹æ®ãªç°å¢äžã§ã¯ãååæ§é ãå©çšåºæ¥ããã«ãŒãã³ãããã¥ãŒãã¯äžè¬çãªéžæè¢ãšããŠææ¡ãããéé»ç¹æ§ã®æ ¡æ£ã«å¯ŸããŠã䜿çšã§ãããæšæºæ ¡æ£ã®ããã®æ¹æ³ã¯ããã¡ãŒã¿å¯žæ³é åã«ãããŠåŒãç¶ãéçºãããã¹ãã§ããã
9.6. ããç©è³ªã®å åŠç¹æ§ ããã¹ã±ãŒã«ã®çµæ¶ææãç¹ã«åå°äœã®å åŠç¹æ§ã¯ãéåçéã蟌ããšè¡šé¢ç¶æ ã«ãã£ãŠå€èª¿ãåãããç©è³ªã®å åŠå¿
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ã蟌ãã¯ãèšçç¹ã®ãšãã«ã®ãŒãšçµåç¶æ å¯åºŠãå€åãããããã®ããã«ãããµã€ãºã®ç©è³ªã«ãããèªé»é¢æ°ã®èæ°éšã®åœ¢ã¯ãçµåç¶æ å¯åºŠã®å€åãšéã蟌ãã«ããæ°ããèšçç¹ã®åºçŸã«ãã£ãŠå€åãããçŽåŸ2.2nm以äžã®ã·ãªã³ã³ããã¯ã€ã€ã«ããã匷ãç°æ¹æ§ã®åºçŸãåã³çŽ°ç·ã®è»žã«æ²¿ã£ãåå ã«å¯Ÿããæ°ããåžåããŒã¯ã®çè«çäºæž¬ã¯èå³æ·±ãäŸã§ãã17ã 匷ãå±èµ·åïŒé»åãšããŒã«ã®çµåç¶æ ãããªãæºç²åïŒã®ç¹åŸŽããã€å åŠçé·ç§»ã®ç¹æ§ã¯ãè¯ãç解ã§ããŠããªããããã¹ã±ãŒã«ã®ç©è³ªã«ãããå±èµ·åã®åœ¹å²è§£æã®ããã«ã¯ãããã«çè«çãã€å®éšçãªåãçµã¿ãå¿ èŠãšãããã
9.7. æ°æ¢æ±ææãšããã€ã¹ã®ããã®é»æ°çç¹æ§è©äŸ¡ å€ãã®æ°æ¢æ±ããé»åããã€ã¹ã¯ãè² ã®åŸ®åæµæãå±¥æŽãæã£ãã¹ã€ããã³ã°ãšãã£ãåŸæ¥ã«ã¯ãªãæ¯ãèãã瀺ã 18, 19, 20ã
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 45
CMOS ãšã¯å šãç°ãªã£ãã¡ã«ããºã ã«åºã¥ããŠãããäŸãã°ãæ¬è³ªçã«éåååŠçãªæ¯ãèããããããã€ã¹ãããã°ãèšç®ã®ç¶æ ãå€ããã®ã«é»è·ã®èŒžéã§ã¯ãªãç£æã®å€åãšãã£ãå¥ã®ã¡ã«ããºã ã«ããããã€ã¹ããããæšæºç㪠MOSFETæ§é ãšã¯ç°ãªãç©çåçã«ãã£ãŠåãæ°ããããã€ã¹ã®çºã«ãäž»èŠãªããã€ã¹å€æ°ãšãã®æœåºæ¹æ³ãå®çŸ©ããããšãå¿ èŠã§ããããæ°ããããã€ã¹æ§é åã³åè·¯æ§æã®å®å®æ§ãšä¿¡é Œæ§ãç¹åŸŽä»ããçºã®æ¹æ³è«ãæã¡ç«ãŠãããšãå¿ èŠã§ãããã é»æ°çãªãã¹ãã®æ¹æ³è«ã«æŒããé²æ©ã«å ããŠãããã¡ãŒã¿ãŒãµã€ãºã®çé¢èŠçŽ ïŒåã ã®ååãããã¡ãŒã¿ãŒãµã€ãºã®åå°
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
46 Metrology
äžã€ãšããŠããããŸã§åœéçã«èªããããŠãããæ°éã®æšæºè©Šæ/æšæºç©è³ªã®äŸçµŠæ¥è ã¯ãæ ¡æ£çšã«åœ¹ã«ç«ã€ãšæãããç©è³ªãNISTã«ãããNTRMãéçºããããã®èªèšŒã·ã¹ãã ã«æåºããããšãã§ãããæšæºè©Šæ/æšæºç©è³ªã®çç£è ã¯ãNISTã®èªèšŒã·ã¹ãã ã®äžã§çç£ããããšã«ãã£ãŠãNISTã«ãã£ãŠç¢ºèªãããäžé£ã®ç©è³ªã«å¯ŸããŠNTRMã®ãã¬ãŒãããŒã¯ãä»ããããšãã§ãã 2ã
ïŒèš³è 泚ïŒISO ã® VIMïŒåœéèšéèšæž¬çšèªéïŒã«ã¯ãæšæºç©è³ªïŒRMïŒãšèªèšŒæšæºç©è³ªïŒCRMïŒãå®çŸ©ãããŠãããRM ã®å®çŸ©ã¯ã"æ©åšã®æ ¡æ£ã枬å®æ³ã®è©äŸ¡ããŸãã¯ç©è³ªã®å€ä»ãã«çšããããã«ãåäžãŸãã¯è€æ°ã®ç¹æ§å€ãååã«åäžã§è¯ã確å®ãããç©è³ªãŸãã¯ææ" ãCRM ã®å®çŸ©ã¯ã"ç¹æ§å€ã®è¡šçŸã«çšããããŠããåäœã®æ£ç¢ºãªçŸç€ºãžã®ãã¬ãŒãµããªãã£ã確ç«ããããã€è¡šèšãããä¿¡é Œã®æ°Žæºã§ã®äžç¢ºãããåèªèšŒå€ã«ä»ããããšããæç¶ãã«ãã£ãŠããã®äžã€ãŸãã¯è€æ°ã®ç¹æ§å€ãèªèšŒãããèªèšŒæžä»ãã®æšæºç©è³ª" ãšãããŠãããïŒæ¬ããŒããããã§ã¯ã NISTïŒç±³åœæšæºæè¡ç 究æãç±³åœã®åœå®¶èšéæ©é¢ïŒã®çšæ³ãèšèŒãããŠãããNIST ã® RM ã«é©åããŠãããCRM ã«é©åããŠããå ŽåãæããNIST ã® SRM ã¯ãISO ã® CRM ã«é©åããŠãããïŒ
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ïŒèš³è 泚ïŒã°ããŒãã«åãã瀟äŒã«ãããŠãå€åœéã«ååšããéåã«ãããæè¡ç課é¡ãå æ¬çã«è§£æ±ºããä»çµã¿ãšããŠãåœé床éè¡¡å§å¡äŒã®äžã«ãèšéæšæºã®åœéçžäºæ¿èªïŒMutual RecognitionïŒããšããå¶åºŠãææ¡ããããããã¯åºå¹¹æ¯èŒïŒKey ComparisonïŒã«åºã¥ããŠååœã®åœå®¶èšéæ©é¢ïŒNMIïŒã®èšéã®æè¡èœåã審æ»ããããã«åºã¥ããŠä»åœã®èšéã®ãã¬ãŒãµããªãã£ãæ¿èªãããšãããã®ã§ãããäžéšã§ããããåå°äœé¢é£ã®èšæž¬æè¡ã«ãããŠãåºå¹¹æ¯èŒããã§ã«å®æœãããå 容ã¯ãŠãšãã§å ¬éãããŠããããã®å¶åºŠã¯ 2004幎ããéçšãããŠãããïŒ
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⢠æšæºè©Šæ/æšæºç©è³ªãçšããçŸå Žã§ã®æçµçãªæž¬å®ã®äžç¢ºããã¯ãæšæºè©Šæ/æšæºç©è³ªèªèº«ã®èªèšŒå€ã®äžç¢ºãããšæšæºè©Šæ/æšæºç©è³ªãæªç¥è©Šæãšæ¯èŒããéã®äžç¢ºãããå«ãããã®ã§ããããã®ãããæšæºè©Šæ/æšæºç©è³ªã®äžç¢ºããã¯æçµçã«å¿ èŠãªäžç¢ºãããããå°ãããªããŠã¯ãªããªããç®å®ãšããŠãåå°äœè£œé ããã»ã¹ã®è©äŸ¡ïœ¥å¶åŸ¡ã«çšããããè£ çœ®ãæ ¡æ£ããå Žåãæ ¡æ£çšæšæºè©Šæ/æšæºç©è³ªã®èªèšŒå€ã®äžç¢ºããã¯ãçç£ããã»ã¹ã°ãã€ãã® 1/4 ããå°ãããªããã°ãªããªãã
2 Use of the NTRM mark on a subsequent series of artifacts, even of the same type, requires additional verification testing by NIST. 3 Refer to The International Bureau of Weights and Measuresâ website http://www.bipm.org/en/convention/mra/.
THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 47
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
48 Metrology
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 49
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
50 Metrology
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THE INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS: 2013
Metrology 51
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12. æšæºèšæž¬ã·ã¹ãã æšæºèšæž¬ã·ã¹ãã ïŒRMS; Reference Measurement SystemïŒ ã¯äžã€ã®æ©åšã§ãããããããããªã¢ã¹ãã¯ãã®å¯žæ³æž¬å®ã«ãããŠããã€ãã®æ©åšãããããã®æ§èœã«ãã£ãŠäºãã«è£å®ãåãäžçµã®æ©åšã§ããã RMS ã¯ãå¿çšç©çåŠãé³é¿çµ±èšåŠãé¢é£æšæºãå©çšå¯èœãªæé©ãªèšæž¬ãããã³ã«ã«åºã¥ã枬å®èª€å·®ã®é©åãªåãæ±ãæ¹æ³ãªã©ã寞æ³èšæž¬ã®ããã®æè¯
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52 Metrology
ã®ç§åŠæè¡ã«åºã¥ããŠååã«è©äŸ¡ããããã®ã§ãããååã«è©äŸ¡ãããŠããããã«ãRMS ã¯çç£å·¥å Žã«çœ®ãããŠããä»ã®è£ 眮ãããæããæ¡éãã«æ£ç¢ºã§ããã粟床ãé«ãã§ãããã RMS ã¯ãã®ä»ã®æž¬å®ã·ã¹ãã ãããŸãæãåããããã«ååã«å®å®ããŠããªããã°ãªããªããRMS ã¯å·¥å Žã®èšæž¬è£ 眮éã§ã®æž¬å®ã®éãã远跡ããçç£çšèšæž¬åšã®ããã©ãŒãã³ã¹ããããã³ã°ãæŒå€ã«æž¡ãå¶åŸ¡ããããã«å©çšã§ããã
ãã®æ©åšã«èŠæ±ãããããã©ãŒãã³ã¹ãä¿¡é Œæ§ã®ããã«ãRMS ã¯å·¥å Žã®ä»ã®æ©åšãããèããé«åºŠã®æ³šæã粟æ»ããã¹ããå¿ èŠãšãããæè¯ãšæããããã®âgoldenâ æ©åšãçšãã枬å®ãè¡ãããšã¯ãçç£ãšã³ã¹ãäœæžã®äžå©ãšãªããããããªããã枬å®ããããŠã§ãŒããããã»ã¹ã¹ããªãŒã ã«æ»ãããšãã§ããããã«ããã®èšæž¬æ©åšã¯çç£ã©ã€ã³ã®ã¯ãªãŒã³ãªç°å¢ã®äžã«èšçœ®ãããªããã°ãªããªãããã®ããšã¯åå°äœããã»ã¹ã®æ§è³ªã«ãããRMS ã¯äžäŒæ¥å ããããã¯è€æ°äŒæ¥ã«ãŸããã in-house æšæºãšããªãããã被枬å®ãŠã§ãŒãã¯ä»ã®çç£ã©ã€ã³ãããå±ãã枬å®åŸè¿åŽããããšãããã
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