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Transcript of Http:// Terrence E. Zavecz [email protected] TEA Systems Confidential & Proprietary Copyright...
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Terrence E. Zavecz [email protected]
TEA Systems Confidential & ProprietaryCopyright © 2007 TEA Systems Corp.
Vector RaptorOverlay Analysis for Double Patterning
& Beyond
Preview Presentation of basic features & applications User-customized models Drill-down graphics Precision Analysis Covariance Analysis Five levels of manual & automated data culling Multi-layer, Multi-variable lot analysis Engineering Analyses can be “one-click” automated using Weir Daily Monitor Scripts Remote program automation & calling
June 6, 2007
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Advanced Overlay Analysis & Modeling Model raw data for each structure separately Remove outliers by using the model
Use at most a second order polynomial? Use 3 sigma or the range from the population median as a control threshold
Agenda Interface Overview Spatial model generation & graphics
“What-if” scenario Graph generation using mouse selection
Vector Raptor Excel Workbook Data Storage Data Storage Organization Example Reports
Interactive graph customization Radial Wafer Analysis & Radial Culling Multi-Pattern Lot Splits (Families)
Results by family Reports & mouse generated graphics
Model Editor
Vector Raptor
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Concept
Vector Raptor; Classic Overlay Modeling Employs all classic models for stepper & scanners WITH additional sophistication in:
Graphics & control Analysis Portability Results reporting Ability to apply models to whole field, row (reticle scan response) and column (scan-slit response)
Advanced Features Proprietary modeling engine using adaptive model elements and singular value decomposition
Models adaptive to both singularities and fit-culling Multi-level, automate and manual methods for data culling Multi-Family Analysis
For true overlay-structure and pattern-split analysis Error Source Discrimination
Ability to resolve error sources from between: Process Wafer-chuck Field Reticle Scan Lens Slit
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Poly DP Solution
193i – 1.2 NA
X-Y Polarized light
K1 = 0.28Pitch 90 nm
Double Patterning (DP) is a split of the pattern layers to provide sub-0.45 nm lithograph
Double Patterning can actually be more than two splits
Situations are envisioned of up to five (5) patterned splits that must each undergo multiple alignment, exposure, develop deposition and etch steps.
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Double Patterning Concepts
“Double Patterning” Actually adds multiple alignment and process levels for each split
Mask Critical Overall mask registration errors will be critical:
Alignment accuracy to scanner registration marks for the layer Overall mask magnification, uniformity, rotation and skew will become more
critical Processing
Variations in processing can influence not on CD size but the mask response to lens aberrations when wafer is exposed Greater or less sensitivity to variation in focus, polarization and dose
Process Critical Alignment sensitivity of the scanner to the registration on the mask Mask bow/distortion while mask is chucked varies from scanner to scanner Overlay distortion across a single field is now sensitive to lens-placement
distortions from tool response to Dose and deFocus Problems will exist in trying to understand the sources of these overlay errors
due as they vary across the finished device layer.
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Vector Raptor Interface
Vector Raptor is an engineering interface May be used with Weir DM
for script automation of any engineering analysis
Data Data is stored in the TEA
Standard metrology format Microsoft Excel
Workbooks are used for data storage “VR Workbooks”
Any metrology may be imported and stored into VR Workbooks
Reports etc. All reports, analyses and
extractions are stored in the VR data workbook.
Microsoft Windows XP, 2000, 2004 Server etc.
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Vector Raptor Button Bar
Model Editor Create and/or modify substrate and field surface models
Layout Editor Enter exposure information for each die including focus, dose, NA, Sigma and reticle scan direction Adjust wafer size, die size, offset, notch etc.
Active Workbook By default this is the metrology data workbook Analyses and modeling generate additional data that can also be analyzed and graphed
Import Metrology Data
Load Workbook Data
Print screen
View current data in workbook format Copy Screen
Copy Graphic only
Model Editor
Layout Editor
Variable Under Analysis
Family Member Selection
Active data worksheet in workbook
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Loading Data
With Vector Raptor Load RV Workbooks directly Import any metrology data Drag & drop any ASCII or
workbook into the interface
With Daily Monitor analysis using Vector Raptor models & methods Load data directly Drag & drop Load data, and start analysis,
using calls from external programs
Drag & drop with mouse
Data Import
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Data Selection & culling
Field Layout
Wafer Layout
“Field Sites” data sheet
• Exposure Subset Selection for:
• Wafer
• Focus Dose
• Reticle Scan direction
• NA
• Partial Coherence (Sigma)
• Exposure Subset Selection for:
• Wafer
• Focus Dose
• Reticle Scan direction
• NA
• Partial Coherence (Sigma)
Data culling by variable
range
‘one-click’ histogram for range selection aid
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Data Culling & Sub-Set Plotting
Box-in any set of data during selection With ‘wafer’ you can plot or cull individual data points With the ‘field’ plot on left, you can remove selected ‘sites’ on the field
Mouse-box
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Spatial Models
Raw Data analysis of wafer & field Mouse-sensitive data
viewing/graphing
Histogram of corner site dataCreated by boxing in site with mouse
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Contour & 3D plots
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1-D Vector Plots
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Wafer & Field Modeled results
Apply models as needed
Perform “What-if” scenarios for terms
Colored vector-amplitude can be switched off
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“What-if” Scenarios
Left – full-field model Each field individually modeled & results plotted
Right- response with “Piston” or the “offset” removed.
Note: for this example the field model used here is a simple A +Bx –Cy –DX2 –EY2
And does not represent any valid overlay model.For demo purposes only
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Scale change
Vector-scale, as shown or Magnitude bar-scale can be
changed independently
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Graph Generation using mouse
Mouse hovered over point to see data value
Use mouse to graph, delete or spreadsheet-view a section of data
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Interactive Index Sheet for data workbook
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Detailed field-by-field aberrations
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Field Response Report
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Graph interface for customization
XY line graphs can also Create box-plots Population-density plots Fit general polynomial trend-
lines Add comments & messages Rescale with the mouse or by
this interface Etc.
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Field Sites with “split” families
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Terrence E. Zavecz [email protected]
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Radial Wafer Analysis & Radial Culling
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Cull Radius control
Data sets of over 22,000 data sites have been measured
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Radial Analysis
Press the “cull radius” command button
Screen appears Graphic & report generated
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Population response for Range & Sigma Cull
Compares multiple “family’s” or pattern-splits
Only one shown here
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Terrence E. Zavecz [email protected]
TEA Systems Confidential & ProprietaryCopyright © 2007 TEA Systems Corp.
Multi-Pattern Lot Splits (Families)
Lot contains data with three (3) overlay splits
Splits are defined in the single data file as different site family values.
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Field Model
This summarizes all splits
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Results by family
Graphs are automatically created
Fitted Range of values
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Fitted Reports
Focus and Dose response can also be evaluated
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Modeled X & Y overlay split response across wafer
Response across wafer
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Terrence E. Zavecz [email protected]
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Model Editor
Vector Raptor comes with standard ASML, Nikon and CANON models
User customization and model additions are performed using the Model Editor
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Models Editor
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Precision & Covariance
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Overlay Precision Analysis
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Covariance
Covariance chart in workbook shown
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X-Y Covariance plot
First order fitted line (red) and fit-polynomial message added by graph editor
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U7 Overlay wafer & field model
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Wafer model
Wafer offset not included
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Wafer (Process) Modeled Errors
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Field Component
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Field Mag, rotation & trap
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Field Mag, Rot & Trap
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After data point removal
14,861 data points ASML XT1400 XYSMO data
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X & Y Overlay
X and Y overlay Note center-of-wafer “hot”
spot
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Model Editor
Any number of sequential models• Model coefficients are
summarized into one algorithm for each sub-model
Coefficient Control Area• Display name is used in reports• Units-of-measure
• Select from drop-down or enter any format such as “nm/cm2” or “ergs/mm2” or ppm etc.
• Equation can use any format with variables “X,Y,R and Theta”
• Threshold = number of points that must be in the data to use this coefficient
• Control bar allows individual coefficient to be created, copied, pasted, deleted or moved up/down in the analysis.
This analysis shows three wafer-based models available for analysis from the library. User can add/delete models
Field models can be seen if the user clicks on the field
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Excluded data points
Registration/overlay data excluded by ASML.
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Wafer Model
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Wafer Residuals
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Field Residuals
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Fitted Field values
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Full field model, trap & wedge contribution
Note that lower row on each field is changing X direction
Noise in scan-start/end
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X-Reg, Trapezoid & Wedge
Wafer #1 Wafer #2 Wafer #3
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Xreg, Trap2 (X*Y)
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Wafer #2 Fitted errors without offset
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Wafer #2, Trapezoid
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Wafer #2, field rotation
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Fitted Double -Pattern Overlay
Field & Lens Slit Rotation Component
Modeled X-Registration for Trap & Wedge