High-end Camera Coupled Radiated Emission Analysis for...

4
High-end Camera Coupled Radiated Emission Analysis for Mobile Handsets Yongsup Kim, Jungmin Kim, Dongsoon Lim, Austin S. Kim Advanced CAE Lab., Samsung Electronics Co. Suwon, Korea, [email protected] 1. Introduction Mobile handset design is getting complicated and all the components are closely neighbouring each other. Almost every audio/video functions are embedded, simply mobile phone goes to mobile computer in terms of hardware design as well as software design. Especially, hardware complexity with high speed signals makes hard to meet EMC specification at the end of development stage. Radiated emission (RE) is one of mandatory EMC testing standard for mobile handset development. As an international EMC testing standard, CISPR22 Class B[1], RE testing is required for all the mobile handset models targeting Europe and China market. Recently, high-end camera module over 10M pixels is getting mounted in the phone. As camera resolution goes up, camera clock rates also increase and meeting the RE specification - 30dBuV/m (30~230MHz) and 37dBuV/m (230~1,000MHz) goes to a quite challenging task. In this paper, a computer aided engineering (CAE) technique analyzing camera coupled noise is addressed. Distinguished coupling noise analysis methodology is introduced and noise enhancement points are validated through simulation data and chamber measurement data. Simulated coupling noise analysis closely matches with measured data and shows costless virtual simulation could considerably shorten burdensome RE debugging time. 2. Camera Coupled Noise Analysis To understand overall EMC phenomenon, EMI scanning is done in advance. Scanned image in figure 2(a) shows EMI noise around camera lens body is densely distributed. There are two clocks to drive camera operations in this handset model. One named as MCLK is provided from MODEM and works as main clock, the other clock named PCLK comes from Image Signal Processor (ISP) IC and works as pixel clock. Both high speed clocks seem to worsen EMC performance. Main Board ISP Board Camera FPCB CAM Module incl. FPCBs & Motors (a) The 2009 International Symposium on Antennas and Propagation (ISAP 2009) October 20-23, 2009, Bangkok, THAILAND - 743 -

Transcript of High-end Camera Coupled Radiated Emission Analysis for...

Page 1: High-end Camera Coupled Radiated Emission Analysis for ...ap-s.ei.tuat.ac.jp/isapx/2009/pdf/1069.pdf · Radiated emission (RE) is one of mandatory EMC testing standard for mobile

High-end Camera Coupled Radiated Emission Analysis for Mobile Handsets

Yongsup Kim, Jungmin Kim, Dongsoon Lim, Austin S. Kim Advanced CAE Lab., Samsung Electronics Co. Suwon, Korea, [email protected]

1. Introduction Mobile handset design is getting complicated and all the components are closely neighbouring each other. Almost every audio/video functions are embedded, simply mobile phone goes to mobile computer in terms of hardware design as well as software design. Especially, hardware complexity with high speed signals makes hard to meet EMC specification at the end of development stage. Radiated emission (RE) is one of mandatory EMC testing standard for mobile handset development. As an international EMC testing standard, CISPR22 Class B[1], RE testing is required for all the mobile handset models targeting Europe and China market. Recently, high-end camera module over 10M pixels is getting mounted in the phone. As camera resolution goes up, camera clock rates also increase and meeting the RE specification - 30dBuV/m (30~230MHz) and 37dBuV/m (230~1,000MHz) goes to a quite challenging task. In this paper, a computer aided engineering (CAE) technique analyzing camera coupled noise is addressed. Distinguished coupling noise analysis methodology is introduced and noise enhancement points are validated through simulation data and chamber measurement data. Simulated coupling noise analysis closely matches with measured data and shows costless virtual simulation could considerably shorten burdensome RE debugging time. 2. Camera Coupled Noise Analysis To understand overall EMC phenomenon, EMI scanning is done in advance. Scanned image in figure 2(a) shows EMI noise around camera lens body is densely distributed. There are two clocks to drive camera operations in this handset model. One named as MCLK is provided from MODEM and works as main clock, the other clock named PCLK comes from Image Signal Processor (ISP) IC and works as pixel clock. Both high speed clocks seem to worsen EMC performance.

Main BoardISP Board

Camera FPCB

CAM Module incl. FPCBs & Motors

(a)

The 2009 International Symposium on Antennas and Propagation (ISAP 2009)October 20-23, 2009, Bangkok, THAILAND

- 743 -

Page 2: High-end Camera Coupled Radiated Emission Analysis for ...ap-s.ei.tuat.ac.jp/isapx/2009/pdf/1069.pdf · Radiated emission (RE) is one of mandatory EMC testing standard for mobile

done a2(c) iseem

imporfigure

(a) 3D

To clarifyas below in s the one unto work as m

(a

(a) EM

In order trted at first. e 3 below.

D structure of

y influence offigure 2(b) anderneath len

major aggress

a) Figure 2: E

MI scanned i

to get the noCoupling si

Figur

Figure 1: Caf camera mod

f the clocks aand 2(c). Figns cap. Twosors degradin

EMI scannedimage (b) E-

oise simulatimulation me

C

re 3: Noise c

(b) amera moduldule in the ph

and confirm gure 2(b) is Eo high speedng RE throug

(b)d photograph-field covere

tion begun, Pethodology i

CAD Data Imp

TL S-Parameter

E-Field Analy

What-IF Improve

Meet the Spe

Design Revis

RE Measurem

LK Time-domain

CLK FFT Anal

Topology Build

Developer Feed

coupling simu

le configurathone (b) cam

the noise disE-field distrid clocks run ghputs.

h and E-fieldd w/ lens cap

PCB CAD, is expanded

port

r Ext.

ysis

ements

ec.?

sion

ents

Analysis

ysis

d-up

dback

ulation meth

tion mera module

stribution, 3Dibution with

through cam

d distributionp. (c) E-field

Mechanical from the pa

hodology

block diagra

D modelling camera lens

mera FPCB

(c) ns d w/o lens cap

CAD file sast [2] and s

am

has been cap. and and they

p.

should be shown in

The 2009 International Symposium on Antennas and Propagation (ISAP 2009)October 20-23, 2009, Bangkok, THAILAND

- 744 -

Page 3: High-end Camera Coupled Radiated Emission Analysis for ...ap-s.ei.tuat.ac.jp/isapx/2009/pdf/1069.pdf · Radiated emission (RE) is one of mandatory EMC testing standard for mobile

informwith Ivendo clock designmanip 3. No directamounFigurefilter +

FigureSimulpredic

PCB tracemation such IBIS I/O modor models are

By the cirnoise analy

n and for thpulations are

oise Simu

As perforions. Secondnt of coupline 4(b) shows+ FPCB coat

(a)

e 5 shows clolation data rection would b

es on the instack-up andels of ICs. e available anrcuit simulat

ysis comes trhe modified

done.

ulation &

rmance enhadly, FPCB bng noise. Figs E-field distting.

Figure improving

ock timing aeveals considbe obtainable

(a

nteresting signd via. And For connectond used to betion combinerue in termsdesigns havi

RE Meas

ancing poinblack coatinggure 4(a) showtribution star

e 4: Improvinpoints (b) E-

and frequencyderable corree.

a)

gnal path frthen, extractor standing fe part of circed with elecs of time-doming a few en

surement

nts, new EMg (or silver cws modifiedrting from or

(a)

(b) ng points and-field distrib

y spectrum ielation with m

om MODEMted PCB patfor ‘CON’ incuit simulatioctromagnetic main and frnhancement

MI passive fcoating) virtud block diagrariginal desig

d E-field distutions from

in terms of mmeasured dat

M to ISP arttern S-paramn figure 1(b)on topology.

(EM) 3D strequency dom

points. Usu

filters are aually manipuam including

gn, with filter

tributions the original t

measurementta and suffici

(b)

re modelled meters are c, S-paramete tructural infomain for the

ually, filterin

added in botulated to evag enhancemer insertion u

to the final

t and simulatient perform

with 3D combined er formed

ormation, e original ng, FPCB

th signal aluate the ent points. up to with

tion. ance

The 2009 International Symposium on Antennas and Propagation (ISAP 2009)October 20-23, 2009, Bangkok, THAILAND

- 745 -

Page 4: High-end Camera Coupled Radiated Emission Analysis for ...ap-s.ei.tuat.ac.jp/isapx/2009/pdf/1069.pdf · Radiated emission (RE) is one of mandatory EMC testing standard for mobile

After then b

4. Co majordirectenougreduci Refe [1] In

Ra[2] D

sys[3] D

em

(a) m(c) s(e)

applying twobefore and m

onclusion

Primary lir noise sourcly. However

gh performaning design cy

erences

nternational adio disturban. Lim, Y. Kistems”, IEEE. Kam, J. K

mission from

(c

(e

measured orisimulated orisimulated fil

o treatments meet the stand

(a)

(a

n

imitation of tce. Also simr, this analy

nce tendencyycle could be

Electrotechnnce characteim, A.S. KimE Int. Sympo

Kim, P. Jun, high-speed d

c)

e) Figure 5: Simiginal clock iginal clock tltered clock t

such filterindard specifica

Figu

a) before imp

this couplingmulation showysis techniquy and correlate achievable

nical Commeristics - Limm, “A digitaosium on EM“Suppressed

digital system

mulation andtiming (b) mtiming (d) simtiming (f) sim

ng and FPCBation.

ure 6: RE testprovements (

g noise methws simply coue based ontion making .

ission, “CISmits and methal to RF cou

MC, 2008 d carrier clom”, IEEE Int

d measurememeasured orig

mulated origmulated filte

B coating, upd

t results (b) after imp

hodology is poupled noisen proposed shardware de

SPR22, Inforhods of measuupling analys

ck for reduct. Symposium

(d)

(f) ents ginal clock spginal clock spred clock spe

dated RF tes

(b)

provement

presuming hie characteristsimulation mevelopers com

rmation techurements” sis methodol

ction of elecm on EMC, 2

pectrum pectrum ectrum

st data is muc

igh speed clotics, not shomethodologymfortable. A

hnology equ

ogy for mix

ctromagnetic2003

ch better

ock [3] as owing RE y delivers t the end,

uipment -

xed-signal

c radiated

The 2009 International Symposium on Antennas and Propagation (ISAP 2009)October 20-23, 2009, Bangkok, THAILAND

- 746 -