Hf impurities in Si/SiO 2 /HfO 2 stacks
description
Transcript of Hf impurities in Si/SiO 2 /HfO 2 stacks
Hf impurities in Si/SiO2/HfO2 stacks
Klaus van Benthem2
Sergey Rashkeev1,2,4
Stephen Pennycook2,1
(1) Vanderbilt University, Department of Physics & Astronomy(2) Oak Ridge National Laboratory
(3) Vanderbilt University, Department of Electrical Engineering & Computer Science
(4) Present address: Idaho National Laboratory
SUPPORT: AFOSR and DOE
Apostolos Marinopoulos1
Xing Zhou3
Sasha Batyrev1
Ronald Schrimpf3
Daniel Fleetwood3
Sokrates Pantelides1,2
• Stray Hf atoms in SiO2 interlayer (Oak Ridge National Lab)
(van Benthem and Pennycook)
Hf atoms inside SiO2
Silicon SiO2 HfO2
0.8 nm
• Electrical measurements under switched-bias annealing after irradiation and constant-voltage stress (Vanderbilt)
SiO2 interlayer formation duringpost-deposition annealing
Constant-voltage stress (CVS) and irradiation (10 keV X-rays)
Oscillations of interface-trapdensity by switching bias
applied to Si/SiOxNy/HfO2 stacks
(Zhou, Schrimpf, Fleetwood)
H+ reactions at near-interface region
Pb centers
@ 25o – 150o C
H+
H+
Si SiSi
Hf
H+
suboxide
Si-sub
SiO2
HfO2
bond
H
NEGATIVE BIAS
H+
H+
Si SiSi
Hf
H+
suboxide
Si-sub
SiO2
HfO2
bond
H
NEGATIVE BIAS
Number of Hf atoms versus distance from interface
1 nm
Single Hf atoms inside SiO2 interlayer
interface2 Å
4 Å
distance (Å)
substitutional Hf: localized perturbationperfect structure
interstitial Hf rebonding
E(int) = E(sub) + 4 eV
HIGH-ENERGYSTATES !
SUBSTITUTIONAL IMPURITIES
SUBSTITUTIONAL IMPURITIES
1.4 eV penaltyfor segregation
Tu & Tersoff 2000
quartz
Ordering of Si planes
No particular crystalline polymorph
Hf atoms: markers
Constant-voltage stress (CVS) and irradiation (10 keV X-rays)
Oscillations of interface-trapdensity by switching bias
applied to Si/SiOxNy/HfO2 stacks
(Zhou, Schrimpf, Fleetwood)
H+ reactions at near-interface region
Pb centers
@ 25o – 150o C
H+
H+
Si SiSi
Hf
H+
suboxide
Si-sub
SiO2
HfO2
bond
H
NEGATIVE BIAS
H+
H+
Si SiSi
Hf
H+
suboxide
Si-sub
SiO2
HfO2
bond
H
NEGATIVE BIAS
Passivated Pb-center
Hole capture
Proton motion in the presence of interface defects at Si/SiO2
Suboxide bond
Depassivation
Proton trapping at bond center
BARRIER > 2.2 eV
+
+
Passivated Pb-center
Hole capture
Hafnium substitutional defect near Si/SiO2
Hf-suboxide bond
Depassivation
H+ near bond center
BARRIER ~ 1.1 eV
+
+
CONCLUSIONSCONCLUSIONS
Presence of Hf in SiO2 interlayer: important in near-interface reactions of Hydrogen
Can explain observed oscillations of interface trap density
Hf lowers the barrier for H+ shuttling
H+
H+
Si SiSi
Hf
H+
suboxide
Si-sub
SiO2
HfO2
bond
H
NEGATIVE BIAS
N B T S
H+ MOTION AND INTERACTION WITH INTERFACE DEFECTS
H+
H+
Si SiSi
Hf
H+
suboxide
Si-sub
SiO2
HfO2
bond
H
NEGATIVE BIAS
Pb centers
N B T S
H+
H+
Si Si
-
Si
Hf
H+
suboxide
(1) (2) (3) (4)
Si-sub
SiOxNy
HfO2+
bond
H
(a)
MECHANISMS FOR ELECTRON EXCHANGE AND H+ MOTION
NEGATIVE BIAS
• HfO2 deposition on Si
• annealing at 950o C
Z-contrast image
No Hafnium atom observed to segregate
Silicon HfO2
formation of SiO2 interlayer
SiO2
Single Hafnium atoms inside SiO2 interlayer
0.8 nm
(van Benthem and Pennycook)
Switched-bias annealing after constant-voltage stress
Enhanced magnitude/reversibility of interface-trap charge
MOS capacitors with high-κ gate dielectric
Al / HfO2+SiOxNy / Si