HERMETICS(Metal Can)

Process Capabilities

(Metal Can)

WAFER SAW & WASH• Capabilities up to 8 inch wafer and 3

mils thick wafer

• Wafer Saw DAD 341 and Ultratech

603 Cleaner

• With CO2 Re-ionizer to maintain

water resistivity of 0.1 to 1 Meg-ohm

• 100% saw through and partial cut

Process Controls

• Kerf width measurement

• Visual inspection

• 100% saw through and partial cut

DIE DEMOUNTER• Manually operated using Viking equipment –

mostly being used for big die sizes

• Manual die plating process using butyrate plastic

sheet for smaller die sizes

• Viking 1010B

• Eutectic Attach - ESEC 2003 semi-auto

attach process (forming gas N2/H2)

• Eutectic Attach - Manual using tunnel die

attach (forming gas N2/H2)

• Au/Si (380°C to 420°C); Au/Sn (320°C to

340°C)

• Epoxy Attach - AMI 3200 auto machine

DIE ATTACH

• Epoxy Attach - AMI 3200 auto machine

• Epoxy Attach - Manual process using

dispenser I & J fisnar and AD3000

• Epoxy Cure - 170°C to 180°C @ 1hr

DIE SHEAR TEST

Process Controls

• Die Shear Test – max 5kg

• Die Punch Test – 90% silicon remaining

• Die Flick Test – 75% silicon remaining and

no more than 75% voids

• Ultrasonic bonding

• M20 manual - capable for heavy wires (5.0 to

15 mils aluminum wire 99.99%).

• ASM509 and ASM559 automatic bonders -

capable for fine wires (1.0 mil to 2.0 mils

aluminum wire 99.99%)

WIREBOND

• KNS1470 semi-auto bonder - capable for fine

wires (1.0 mil to 2.0 mils aluminum wire

99.99%)

• KNS484 manual bonders - capable for fine

wires (1.0 mils to 4.0 mils aluminum wire

99.99%)

WIRE PULL TESTER

Process Controls

• Wire Pull Test

• Sealers for hermetic packages with

excellent hermeticity.

• Taylor & Windfield, Polaris 150 or 13

SEAL

• Fine & Gross Leak

• Crimp Test

• Electrode imprint

• Moisture Level - 50 PPM max

• Oxygen Level - 500 PPM max

GROSS LEAK

FINE LEAK

Process Controls

• Transfer Ink marking (black ink – single part)

• Markplate developer (AGFA Repromaster,

Markem 452E / 452W)

• Markem 300T / Markem U-1131 marking

using mark plate and ink

MARKING

using mark plate and ink

Process Controls

• Mark permanency test for ink

type process

• 100% visual inspection

STABILIZATION BAKE (Blue M-Oven)

• 883 condition C: 150°C to 155°C @ 24hrs

• 883 condition D: 200°C to 205°C @ 24 hrs

TEMPERATURE CYCLE (Ransco)

• Military:

No. of Cycles: 10 cyclesNo. of Cycles: 10 cycles

Cold Temp: -65°C to -75°C

Hot Temp: 150°C to 165°C

• Commercial:

No. of Cycles: 5 cycles

Cold Temp: -55°C to -75°C

Hot Temp: 150°C to 165°C

CENTRIFUGE (Triotech)

• Stress Level: 20,000 to 30,000CENTRIFUGE

TEMPERATURE CYCLE

• Manual pneumatic system solder dip

• Solder Dip: Pb (63Sn/37Pb) and Pbfree

(96.5Sn/3.0Ag/0.5Cu) Solder Alloy; Flux water

LEAD FINISH

(96.5Sn/3.0Ag/0.5Cu) Solder Alloy; Flux water

soluble

• Solderability Test

Process Controls

FINE LEAK (Alcatel Helium)

• 100% Fine leak test

• Helium purity: 95%

GROSS LEAK (Triotech / Binks)GROSS LEAK (Triotech / Binks)

• 100% Gross leak test

• Galden

PACK• Pack in box, tube or styrofor

GROSS LEAK

FINE LEAK