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Gate Driver Market and Technology Trends - 2017 Report by Yole Developpement
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Transcript of Gate Driver Market and Technology Trends - 2017 Report by Yole Developpement
From Technologies to Market
Sample
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netGate Driver Market
and Technology Trends 2017
2
REPORT OBJECTIVES
• This report’s objectives include:
• Access the gate driver market for ICs, IPMs, and Plug-and-Play gate driver boards, and new power semiconductormaterials, specifically SiC and GaN
• Understand the market dynamics for gate driver applications
• Have a clear overview of current technologies for gate drivers
• Identify the key technology trends that will shape the market in the future
• Understand the main challenges and proposed innovations
• Provide an overall view of the competitive landscape of the gate driver market
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
3
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
4
REPORT METHODOLOGY
Technology analysis methodology Information collection
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
5
3D TSV EQUIPMENT & MATERIALS
Table of contents
• Executive summary p.9
• Gate driver description p.26
• What is a gate driver?
• Driving a MOSFET vs IGBT
• Driver IC market p. 43
• Driver IC market by application and forecast 2017-2022
• Driver IC market by type
• Driver IC market by voltage
• Players’ market shares
• Gate driver current technologies and evolution p. 69
• Towards better integration with Intelligent Power Modules (IPM)
• Gate driver challenges for SiC and GaN
• Gate drivers for high temperature
• Plug and Play gate driver solutions
• Isolation technologies
• Driver IC players p. 142
• Gate driver business models
• Player landscape
• Company profiles:
• Broadcom Limited
• Infineon
• Renesas
• STMicroelectronics
• ON Semiconductor
• NXP
• Technology roadmaps p.177
• Conclusion p.182
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
6
Biography & contact
ABOUT THE AUTHORS
Mattin GraoTxapartegi, Market & Technology Analyst, Power Electronics
Jonathan Liao, Senior Analyst, Power Electronics & Business Development Manager
Mattin Grao Txapartegi is a Technology & Market Analyst | Power Electronics at Yole Développement (Yole). He is engaged in many custom studies and reports dedicated
to the evolution of inverters architecture and passive components, from capacitors to protection devices. Get a deep understanding of the technology evolution, the
market trends and the strategies of each player are part of his mission at Yole. Indeed Mattin is daily driving technology and market scouting, roadmap definition, disruptive
technologies and market opportunities identification and competitive landscape analysis. Previously he acquired a comprehensive expertise in the design of power
converters for EV at Renault. As an engineer, Mattin is graduated from Grenoble INP (FR) with specialization in embedded systems for transportation. He has also an
advanced master in aeronautics from the Arts & Métiers ParisTech (FR).
Contact: [email protected]
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
Jonathan Liao is a Senior Analyst & Business Development Manager at Yole Développement (Yole). Jonathan is leading the quarterly power management market updates. In
addition, he performs technology & market reports for gate driver, discrete, module, compound semiconductors, and power management IC. Before joining Yole, Jonathan
served as a power electronics Sr. Analyst at IHS Markit. Within a global semiconductor business ecosystem, financial analyses and power management scouting were part of
his mission. Prior to IHS, he was a product engineer at Microchip Technology Inc. During this period, Jonathan gained a strong expertise in analog & mixed signal devices.
Jonathan Liao earned his Master of Science (AZ, North America) and graduated with a Bachelor of Science (PA, North America).
Contact: [email protected]
8
MARKET FIGURES AND FORECAST
Split by driver IC type, application, voltage range, etc.
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
9
DRIVER IC SPLIT
MOSFET vs. IGBT gate drivers end-markets per application
The split by application for gate drivers
being used for MOSFETs or IGBTs is
somewhat different in 2016.
The xxx segment is
the principal
market for IGBT
gate drivers.
xxxx, xxxx, and xxxx
markets are the main
ones for MOSFETs gate
drivers
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
10©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
GLOBAL TOP-10 DRIVER IC SUPPLIERS
Market shares on the
driver IC market for
2015 and 2016 can be
found in the report
11
INTELLIGENT POWER MODULES (IPM)
• IPMs will grow at a faster rate than gatedrivers, consistent with the trend ofintegration by suppliers.
• Key growth drivers:
• With the current global slow economyrecovery, global economic and politicalenvironment, the gate driver market andIPMs market are forecast to have minimumgrowth in 2017, but 2018 is forecast to bemore positive.
• IPM is forecast to grow the fastest around2021 by taking away some existing marketsfor discrete solutions (gate driver + powerswitches).
IPMs is forecast to grow faster than Gate Drivers in the next five years.
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
12
SIC & GAN DRIVER NEEDS
Analysis of technological solutions
and several case studies with the
latest GaN and SiC products and
developments for companies on the
playground
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
13
PLUG & PLAY VS. DRIVER IC
Plug & Play products are used at very high power applications.
Power range
Voltage level
xxkV
xxV
xxV
High
power
IGBTs
IGBTs
HV MOSFETs
Rail traction
Wind turbines
Motor drives
UPS
PV inverter
LV MOSFETs
IT & consumers
HVDC
EV/HEV
xxWxxW
Plug & Play
gate driver
market
Driver IC
market
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
14
TECHNOLOGY ANALYSIS
Focus on advanced isolation techniques
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
15
ISOLATION TECHNOLOGY
Main isolation technologies used at gate drivers
The Gate Signal Isolation
Optical Isolation
Optocoupler Fiber Optics
Isolation by Transformer
Pulse transformer Coreless transformers
Monolithic level shifter
Not possible to
use at power
supply !
>1,200VUp to
900V
• The isolation between IGBT and the controller is a challenge inside the High Voltage Gate drivers
• 3 main families of gate signal isolation are used today :
Capacitive coupling
Integrated on chip
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
16
SUPPLY CHAIN AND BUSINESS MODEL EVOLUTIONS
Explanation of
different existing
business models
and the emerging
opportunities and
markets
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
17
COMPANY PROFILES
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
18
WBG GATE DRIVER PLAYERS
Some Notable SiC Driver Players
Driving SiC FETs is less challenging technically than driving high speed GaN FETs.
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
19
TECHNOLOGY ROADMAPS
Yole Développement’s
view on which
technological solutions
will impact the gate
drivers industry in the
coming years
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
20
RELATED REPORTS
Discover more related reports within our bundles here.
©2017 | www.yole.fr | Gate Driver Market and Technology Trends 2017
In recent years, a much greater percentage of home appliances, electric vehicles, hybrid vehicles, including mild hybrids, and renewable energy products have implemented dedicated power semiconductors devices on-board. The majority of these applications utilize power MOSFETs and IGBTs as power switches, but the adoption rate of gate drivers and applications of IGBTs and MOSFETs are different. In 2016, more than 60% of the gate drivers used in power applications were attached to MOSFETs. Nevertheless, the revenue gap between MOSFET and IGBT gate drivers is quickly narrowing.
Yole Développement (Yole) forecasts gate driver ICs will benefit from power semiconductors delivering a 6.1% compound annual growth rate (CAGR) from 2017-2022. The gate driver IC market revenue, which was estimated to have been $1.2B in 2016, is forecast to have a 5.1% CAGR for 2017-2022.
Based on Yole’s analysis, usage of single channel and half bridge gate driver ICs will increase over the next few years due to the need for isolation integration. Half bridge gate driver ICs are estimated to have accounted for over 40% of gate driver revenues in 2016. Single side gate driver ICs were the second most popular topology with about 30% of revenue. Full bridge and three phase gate drivers are mostly found in motor control and inverter applications for low-mid power.
In this gate driver report, Yole examines the difference in topologies and analyzes the market size, split by type: single channel, half-bridge, full bridge, and three phase. It also splits the market by application, into automotive, consumer, industrial, computers, and communication, and by voltage, into ranges <400V, 400V-1,200V, and >1,200V. Yole aims to provide a comprehensive understanding of market segments, opportunities, business models, and technology trends associated with the gate driver ICs in this report.
GATE DRIVER MARKET AND TECHNOLOGY TRENDSMarket & Technology report - March 2017
THE GATE DRIVER IC MARKET WILL BENEFIT FROM THE STEADY GROWTH OF THE POWER SEMICONDUCTOR INDUSTRY
Gate driver ICs will be challenged by greater integration demands and the arrival of GaN and SiC.
KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• Detailed discussion about the gate
driver market, including gate driver ICs, Intelligent Power Modules (IPMs), and Plug-and-Play (PnP) driver boards
• Market size and market share information in US dollars for gate driver ICs, and IPMs
• Revenue forecast for gate driver market for 2017-2022
• Key application and sector size breakdown in each of the five key markets: automotive, consumer, computing, communications, industrial
• Market breakdown by type of driver IC, including single channel, half bridge, full bridge, and three phase, and by voltage, with ranges <400V, 400V-1,200V, and >1,200V
• Technology analysis, covering isolation technologies, high temperature gate drivers, solutions for SiC and GaN, and gate driver technology roadmaps
• Business models, supply chain evolution, and case studies of some key companies competing in the gate driver market
OBJECTIVES OF THE REPORT• Access the gate driver market
for ICs, IPMs, and Plug-and-Play gate driver boards, and new power semiconductor materials, specifically SiC and GaN
• Understand the market dynamics for gate driver applications
• Have a clear overview of current technologies for gate drivers
• Identify the key technology trends that will shape the market in the future
• Understand the main challenges and proposed innovations
• Provide an overall view of the competitive landscape of the gate driver market
(Yole Développement, March 2017)
Gate driver IC market size and forecast (in B$)
NEW TECHNICAL REQUIREMENTS RELATED TO ISOLATION OR THE USE OF GaN AND SiC POWER TRANSISTORS DEMAND ADVANCED DRIVER IC TECHNOLOGIES TO BE DEVELOPED
Over recent years, all major players have started providing isolation-integrated products, the coreless transformer being the main type. Having isolation in the same package as the driver IC
provides greater integration, which is sought by many system manufacturers. In this report, Yole provides an in-depth technical analysis regarding several main types of isolation techniques including
0
1.2
1.6
2016 2017 2018 2019 2020 2021 2022
Driver IC market forecast by application in M$ USD
Automotive Computers Communication Consumers Industrial
GATE DRIVER MARKET AND TECHNOLOGY TRENDS 2017
pulse transformers, level shifters, opto-isolators and coreless transformers, their primary applications, disadvantages and advantages, and how companies are positioned on the use and development of these technologies.
Besides isolation technologies, niche applications such as high temperature (HT) operation and other harsh environment requirements provide additional growth opportunities for gate drivers. SiC-based power switches can endure high temperature environments with the material’s high Tj and Te performance characteristics. Companies such as Cissoid and X-Rel Semiconductor are looking to capitalize on the potential of SiC in these niche applications.
GaN FETs can switch at a much higher frequency than silicon-based MOSFETs. Higher frequency provides advantages but also challenges. Yole provides a case study of Navitas, a company trying to incorporate a GaN FET with GaN controllers on the same substrate. This monolithic solution, integrating the power transistor and its driver, shows the level of involvement of several GaN and SiC players, in order to get adequate drivers to facilitate the use of wide band gap devices in the new generation of converters. This report includes a complete chapter on the new requirements needed for GaN and SiC power transistor gate drivers.
(Yole Développement, March 2017)
Gate driver technology roadmap for high power and low/mid power applications
THE SUPPLY CHAIN OF THE GATE DRIVER IS EVOLVING, PUSHED BY HIGHER INTEGRATION NEEDS, AS WELL AS AN INCREASING NEED FOR MORE COMPLETE PRODUCT SOLUTIONS
(Yole Développement, March 2017)
Business model evolution in the gate driver competitive landscape
In additional to gate driver IC manufacturers, other players emerged along the supply chain to offer alternative solutions for various power management needs. Two of the more notable solutions are Intelligent Power Modules (IPMs) and Plug-and-Play (PnP) gate driver boards. An IPM integrates control,
protection, gate driver, and power switching devices in a single package to address the need for compact, efficient, and application-specific power management needs. Over 70% of all IPMs are in white goods and motor control. Some notable players such as Mitsubishi, ON Semiconductor, Semikron, and
Higher integration
2015
2005
2025
System-on-Package or IPM
New market
Evolving technology
Monolithic GaN driver + switch
Some manufacturers are developing monolithic
solutions between driver IC + GaN HEMTs
Isolated driver IC Isolation + driver IC in
unique package
Isolated driver IC for SiC
Integration High temperature capability
High temperature driver ICs integrated
in high power modules
IPM: driver IC + MOSFETs/IGBTs
in the same package
Monolithic solutions
Miniaturization
2015
2025
2005 Low/mid power
Business model evolutions
Amantys, Agile switch, Semikron, Panasonic…
Gate driver board manufacturers Gate driver IC Makers Power module Makers Final applications
Dynex, Toshiba, Vishay, Panasonic … Texas Instrument, Avago…
Several driver IC makers are climbing up in
the supply chain Cissoid, Valeo, Bosch…
Gate driver IC Makers From GDU to power modules Final applications
Texas Instrument, Broadcom...
Plug & play gate driver boards
manufacturers are willing to
have their own driver IC
Strong trend
Find more details about
this report here:
MARKET & TECHNOLOGY REPORT
Executive summary 9
Gate driver description 26
> What is a gate driver?> Driving a MOSFET vs IGBT
Driver IC market 43
> Driver IC market by application and forecast 2017-2022
> Driver IC market by type> Driver IC market by voltage > Players’ market shares
Gate driver current technologies and evolution 69
> Towards better integration with Intelligent Power Modules (IPM)
> Gate driver challenges for SiC and GaN
> Gate drivers for high temperature> Plug and play gate driver solutions > Isolation technologies
Driver IC players 142
> Gate driver business models> Player landscape> Company profiles:
- Broadcom - Infineon- Renesas- STMicroelectronics- ON Semiconductor- NXP
Technology roadmaps 177
Conclusions 182
TABLE OF CONTENTS (complete content on i-Micronews.com)
COMPANIES CITED IN THE REPORT (non exhaustive list)Broadcom Limited, Infineon, Renesas, STMicroelectronics, ON Semiconductor, NXP, Mitsubishi, Panasonic, MediaTek, RichTek, Sanken Electric, Toshiba, ROHM, Cassoid, X-Rel, Wolfspeed, Dialog semiconductor, Navitas, Texas Instruments, Agile Switch, Analog Devices, Silicon Labs, NVE corporation, ABB, GaN Systems, EPC, GE, and more.
Mattin Grao Txapartegi i s a Technology & Market Analyst | Power Electronics at Yole Développement (Yole). He is engaged in many custom studies and reports dedicated to the evolution of inverters architecture and passive components, from capacitors to protection devices. Get a deep understanding of the technology evolution, the market trends and the strategies of each player are part of his mission at Yole. Indeed Mattin is daily driving technology and market scouting, roadmap definition, disruptive technologies and market opportunities identification and competitive landscape analysis.Previously he acquired a comprehensive expertise in the design of power converters for EV at Renault.As an engineer, Mattin is graduated from Grenoble INP (FR) with specialization in embedded systems for transportation. He has also an advanced master in aeronautics from the Arts & Métiers ParisTech (FR).
• Power SiC 2016: Materials, Devices, Modules, and Applications
• Status of the Power Electronics Industry 2016
• Inverter Technology Trends and Market Expectations
Find all our reports on www.i-micronews.com
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Infineon compete fiercely in the IPM market. Based on Yole’s analysis, high voltage IPMs are forecast to slowly replace discrete solutions in several key markets, such as automotive, industrial, and consumer.
The gate driver report describes the detailed competitive landscape and supply chain evolution for coming years. The top take-away messages are: • The top five gate driver IC suppliers control
more than 50% of the market, with most of them also competing in the power semiconductor segment, including NXP, Infineon, and STMicroelectronics. Compared to other semiconductor segments such as memory, CPU, and sensors, the power semiconductor sector is less consolidated and can still provide opportunities for companies to grow with the right business model and strategy.
• Various business models can be successful in addressing diverse customer needs in the gate driver market. Companies change their business models periodically to address fast growing
markets. For instance, Texas Instruments, traditionally an IC supplier, increased its focus on providing system level solutions by integrating multiple chips in the same package or board.
• New materials such as SiC and GaN will increase the level of integration. Both SiC and GaN devices have been in development for years. To recoup the cost and maximize the profit, companies are gearing towards offering system level solutions instead of components. Other companies traditionally not invested in these two materials can get product portfolios and expertise by acquiring other companies.
Lastly, company profiles, gate driver offerings, and revenue breakdowns are included for Broadcom, Infineon, Renesas, NXP, Texas Instruments, and other top suppliers. The gate driver report from Yole aims to provide the most up-to-date information of gate drivers, power semiconductors, competitive landscapes, and major power applications.
AUTHORS
Jonathan Liao is a Senior Analyst & Business Development Manager at Yole Développement (Yole). Jonathan is leading the quarterly power management market updates. In addition, he performs technology & market reports for gate driver, discrete, module, compound semiconductors, and power management IC.Before joining Yole, Jonathan served as a power electronics Sr. Analyst at IHS Markit. Within a global semiconductor business ecosystem, financial analyses and power management scouting were part of his mission. Prior to IHS, he was a product engineer at Microchip Technology Inc. During this period, Jonathan gained a strong expertise in analog & mixed signal devices. Jonathan Liao earned his Master of Science (AZ, North America) and graduated with a Bachelor of Science (PA, North America).
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− Equipment & Materials for 3D T(X)V Technology 2017
− Emerging Non Volatile Memories 2017
** To be confirmed
©2017 | www.yole.fr | About Yole Développement
31
OUR 2017 REPORTS PLANNING (2/2)
o POWER ELECTRONICS
− Status of Power Electronics Industry 2017
− Power Mosfets Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
− Power Packaging Market and Technology Trends 2017
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications
− Materials Market Opportunities for Cellphone Thermal Management (Battery
Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017
− Gate Driver Market and Technology Trends in Power Electronics 2017
− Power Management ICs Market Quarterly Update 2017
− Power Electronics for Electrical Aircraft, Rail and Buses 2017
− Thermal Management for LED and Power 2017
o BATTERY AND ENERGY MANAGEMENT
− Status of Battery Industry for Stationary, Automotive and Consumer Applications
2017
o COMPOUND SEMICONDUCTORS
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− Bulk GaN Technology Status and Market Expectations (Power, LED, Lasers) 2017
o DISPLAYS
− Microdisplays and MicroLEDs 2017
− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017
− QD for Display Applications 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− Emerging Display Technologies 2017**
o LED
− UV LEDs 2017 - Technology, Manufacturing and Application Trends
− Agricultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends
− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs 2017 - Technology, Manufacturing and Application Trends
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− CSP LED Module 2017
− LED Packaging 2017
PATENT ANALYSIS by Knowmade
− 3D Monolithic Memory: Patent Landscape Analysis
− Microfluidic Diagnostic: Patent Landscape Analysis
− GaN Technology: Top-100 IP profiles**
− Uncooled Infrared Imaging: Patent Landscape Analysis**
− MEMS Microphone: Patent Landscape Analysis**
− MEMS Microphone: Knowles' Patent Portfolio Analysis**
− MicroLEDs: Patent Landscape Analysis**
− Microbolometer: Patents used in products**
− Micropumps: Patent Landscape Analysis**
− Flexible batteries: Patent Landscape Analysis**
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
** To be confirmed
©2017 | www.yole.fr | About Yole Développement
32
OUR 2016 PUBLISHED REPORTS LIST (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology & Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− LED Packaging 2017: Market, Technology and Industry Landscape
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends & Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016©2017 | www.yole.fr | About Yole Développement
33
OUR 2016 PUBLISHED REPORTS LIST (2/2)
PATENT ANALYSIS by Knowmade
− Microbattery Patent Landscape Analysis
− Miniaturized Gas Sensors Patent Landscape Analysis
− 3D Cell Culture Technologies Patent Landscape
− Phosphors and QDs for LED Applications Patent Landscape 2016 report
− TSV Stacked Memory Patent Landscape
− Fan-Out Wafer Level Packaging Patent Landscape Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
MORE INFORMATION
o All the published reports from the Yole Group of Companies are available on our website
www.i-Micronews.com.
o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the
number of reports you are interested in and select the related offer. You then have up to 12
months to select the required reports from the Yole Développement, System Plus Consulting
and KnowMade offering. Pay once and receive the reports automatically (multi-user format).
Contact your sales team according to your location (see the last slide).
©2017 | www.yole.fr | About Yole Développement
34
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility. They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
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ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
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targeted audience. Webcasts
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Benefit from the i-Micronews.com
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weekly readers of @Micronews
e-newsletter
Seven main events planned for
2017 on different topics to
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Gain new leads for your business
from an average of 300
registrants per webcast
Contacts: Camille Veyrier ([email protected]) and Clotilde Fabre ([email protected]), Marketing & Communication Project Managers.
©2017 | www.yole.fr | About Yole Développement
35
CONTACT INFORMATION
Follow us on
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Japan & Asia: Miho Othake, Account ManagerEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
o FINANCIAL SERVICES
• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected] - +33 4 72 83 01 80
o GENERAL
• Public Relations: [email protected] - +33 4 72 83 01 89
• Email: [email protected] - +33 4 72 83 01 80
©2017 | www.yole.fr | About Yole Développement