From%Standard%MEMS% Processes%(MUMPs®)%to% …meptec.org/Resources/10 - Cowen.pdf · Design...

From Standard MEMS Processes (MUMPs®) to Commercial Success

Allen Cowen MUMPs Program Manager

[email protected] www.memscap.com

MEPTEC MEMS Symposium

2 May 16 MEPTEC MEMS Symposium

Overview

! MUMPs (MultiUser MEMS Processes) – Standardized MPW Processes and Examples

!  PolyMUMPs !  SOIMUMPs !  PiezoMUMPs ! MetalMUMPs

! Semicustom Process and Examples (MUMPsPlus) ! Outside Vendor Standardized Processes ! Custom MEMS Fabrica8on (Pros and Cons) ! MEMSCAP Introduction


•  Bulk Micromachining – Deep RIE/RIE – Wet bulk micro-machining – VOA, 2x2, SOIMUMPs

•  Surface Micromachining – Poly-Silicon Processing (PolyMUMPs) – Adaptive Optics, Microphones

•  High aspect ratio thick metal plating – LIGA-like (MetalMUMPs) – Microrelay, Copper Cross Connect

MEMSCAP Fabrication Capabilities


!  Started in December 1992 ◦  215 Process Runs to Date ◦  Hundreds of thousands of

devices shipped !  Worldwide Customer Base !  Supports ◦  Low volume foundry work ◦  Standard films, thicknesses on Si substrates ◦  Rapid Prototyping ◦  IP Generation ◦  Undergraduate (MEMS 101) and Graduate (Thesis) Level


MUMPs® Textbook

•  Textbook uses MUMPs as the example MEMS processes

•  Author: Joel Kubby, University of California at Santa Cruz "  Long 8me MUMPs user even prior to Academia


!  Regular Run Schedule !  12 scheduled MUMPs runs in 2016 (4 Poly, 4 SOI, 3 Piezo, 1 Metal)

!  Process flexibility !  PolyMUMPs (traditional) !  SOIMUMPs (Silicon-On-Insulator) !  MetalMUMPs (Electroplated Nickel) !  PiezoMUMPs (SOIMUMPs like, with additional Piezoelectric AlN layer) !  MUMPs-PLUS (semi-custom)

!  Web-based interface: www.memscap.com/products/MUMPS !  Reference and Support

!  Process files available for all platforms and CAD tools !  Element Libraries

! CaMEL (PolyMUMPs) ! SOIMUMPs and MetalMUMPs

!  PolyMUMPs Technical FAQ !  Microsoft Guide to PolyMUMPs !  Bibliography of MUMPs® published papers

! Google Scholar for more!

MUMPs® Summary


PolyMUMPs® Process

"  Polysilicon surface micromachining "  8 lithography levels, 7 physical layers

"  3 Polysilicon layers "  1 Metal layer

"  ApplicaLons "  Adap8ve op8cs "  Microphones "  Sensors and Actuators

Poly0 Poly1 Poly2 Metal

Nitride 1st Oxide 2nd Oxide


PolyMUMPs® Process

"  Programmable Elements "  Springs, Comb drives etc "  Parameterized layouts

"  Correct by construcLon "  Incorporates design rules

"  Anchors etc correctly drawn "  Proven to work


PolyMUMPs® Process

"  Design Rules "  Allow check of manufacturabiliy

"  CAD tools "  Automa8c checks

"  Spacing, Surround

"  Structure specific checks


SOIMUMPs Process

"  Bulk Micromachining "  10 or 25um structure layer (single crystal silicon)

"  Double-‐side paVern/etch "  2 Metal layers "  Deep RIE/RIE Processing

"  ApplicaLons "  VOA, 2x2 Op8cal Switches "  Mirror arrays "  Resonators, Oscillators, and Gyroscopes

"  Micro-‐actuators

VOA


Bulk Si

10 µm Si 1 µm buried oxide

Not to scale

2000 Å thermal oxide

200 Å Cr, 1 µm Al 0.5 µm AlN

! SOI-Based, Bulk Micromachining with piezoelectric layer

!  0.5 µm Piezoelectric Aluminum Nitride !  AlN is a large band gap (6 eV) material

with a large resistivity !  Good temperature/humidity stability !  Higher signal-to-noise ratio

!  Applications –  Ultrasonic transmitters and receivers (MUTs). –  Frequency references. –  Temperature sensors (resonant frequency

changes with temperature) –  Force sensor –  Energy harvesters

PiezoMUMPs Process


MetalMUMPs® Process

"  Thick Metal PlaLng Process "  10 lithography layers "  Thick electroplated Ni (18-‐22um) "  Nitride, Polysilicon, and thin metal structural layers

"  ApplicaLons "  Microrelays "  RF Switches, cross-‐connect switches "  Magne8c devices

Courtesy of Zyvex Corporation


Prototype to Production


Seacoast Science’s PolyMUMPS Sensors

Upper and lower plates are polycrystalline silicon, polymer is filled through holes in the top plate to make the individual capacitors sensitive to chemicals. http://www.seacoastscience.com/Downloads/Seacoast_White_Paper.pdf

Individual chemicapacitor


SeaPort Mini Gas Chromatograph for Educa8on

•  Single chemicapacitor readout •  Separate, analyze and idenLfy compounds •  For volaLle liquids or gas samples •  Uses Seacoast’s MCCD detector •  Current design sold for educaLonal use •  Distributed by Vernier SoSware and

Technology •  Used by students right out of the box •  1500 deployed in schools


Standard+Custom=MUMPs-PLUS!

!  Slight modification of one of the four MUMPs processes !  Extra layer, different thickness or

material !  Customer’s wafers are added to regular

MUMPs lot to take advantage of batch processing/pricing for unmodified process steps

!  Singulated, shipped at die level !  Quoted on a case-by-case basis

!  Examples !  Additional Patternable Nitride !  Thicker Poly or oxide !  Additional/Different Metal !  Backside Etch

PolyMUMPsPlus Std Layer Range(µm) Nitride 0.1-1.5

Poly0 0.1-3.0

Oxide1 0.3-5.0

Poly1 0.1-3.0

Oxide2 0.3-5.0

Poly2 0.1-3.0

Metal 0.05-1.0


MUMPs-PLUS Capabilities

Std Layer Range(µm) Isolation Oxide 0.1 – 2.2

Oxide1 0.1 – 3.0

Nitride1 0.1 – 1.0

Poly 0.1 – 3.0

Nitride2 0.1 – 1.0

Oxide2 0.1 – 3.0

Anchor Metal 0.05 – 1.0

Nickel 1 – 30?

Sidewall Metal 0.1 – 5.0

MetalMUMPsPlus Std Layer Range(µm) Pad Metal 0.05 - 1.0

Silicon 3 - 100

Buried Oxide 0.5 – 4.0

Substrate 300 - 600

Blanket Metal 0.05 – 1.0

SOIMUMPsPlus

Std Layer Range(µm) AlN 0.5 - 10

Isolation Oxide 0.5 – 4.0

PiezoMUMPsPlus

Custom Layer/Processes

Oxide below Nitride

Nitride between Poly layers

Metals (Au, Cr, Pt, Cu, Ag, Ni)

CMP


!  MEMSCAP MagSwitch

!  BMC Adaptive Optics

!  Silicon Microphones Deformable mirror

Electrostatically actuated

diaphragm Attachment post

Membrane mirror

Diced WLP wafer before P&P


!  Used PolyMUMPs for cost-effective prototyping in early 90s

!  Design variations and iterations on each run validated target designs and encouraged further development

!  Vision Science ◦  Retinal Imaging ◦  Corneal Ablation

!  Laser Communication ◦  Point To Point Secure Communication ◦  Holographic Waveform Coding

!  Astronomy ◦  Extreme AO ◦  Terrestrial Planet Finder

!  Consistent Development program for MEMSCAP

Star

Planet

Visible Nulling Coronagraph for Terrestrial Planet Finder

Deformable mirror

Electrostatically actuated

diaphragm Attachment post

Membrane mirror

Images from Scanning Ophthalmoscopes


Cheaper and Faster To Market

Process Type Proof of Principle Prototyping Pre-Production Production

Custom Process $$$$$$ $$$$$ $$$$$ $$$$

Standard Process $ $ $$$$ $$$

Custom Process 6-12 months 12 months 9 months

Standard Process 3 months 6-9 months 6 months

Standard Processes

! CAD tools for MEMS can be effective for standard processes

! Design Rules allow checks of manufacturability

! Allow simulation of designs before fab

! Many runs of same process ->statistical analysis


!  MEMS packaging not trivial issue !  Packaging is a major part of the cost. !  Generic MEMS packaging nonexistent

!  Each system is a custom package

!  Packaging may impact system performance !  Viscous damping of moving parts

!  Vacuum packaging may be desirable

!  Failure due to moisture -‐> s8c8on

!  Package strain on piezoresis8ve or membrane devices

!  Thermal impact on op8cal systems

Slides courtesy Simon Fraser University


!  MEMS scanning micro-mirror !  Electrostatic actuation controls

movement along short axis !  Electromagnets control actuation

along the long axis. !  Precise alignment between bottom

stator and top rotor.

Maradin Ltd. Tel. +972 (4) 6273653 E-Mail: [email protected] www.maradin.co.il


Custom Products BU MEMSCAP, Inc.

Highly Experienced MEMS Foundry Over 20 years •  MCNC-Cronos-JDSU-

MEMSCAP

All major MEMS processes on

6” toolset 7000 ft2 of cleanroom

space 3000 ft2 of test space

Mature ISO Program


•  Deposition –  Low Stress Nitride –  Low Stress Poly-Silicon –  Thermal and Low Temperature Oxides –  Phosphosilicate Glass (PSG) –  Anneals

•  Lithography –  Projection Alignment –  Contact Alignment –  Front/Back Alignment –  Wafer Bonding –  Photo-mask Layout and Fab

•  Post Processing –  Wafer Probe –  Dicing –  Die Bonding –  Wire Bonding –  CO2 and HF Release –  Pick / Place

MEMSCAP Process Capabilities •  Wafer Bonding

–  Silicon-Silicon, Silicon-Glass, Silicon-Metal Eutectic, Metal-Metal Eutectic

•  Etching –  Deep RIE – Silicon –  RIE – Poly-Silicon –  RIE – Dielectrics –  Wet – KOH, HF Vapor Phase

•  Metallization –  Evaporative – Lift-Off, Planetary Electroplating –  Sputter – DC, RF, RF-Biased

•  Metrology –  SEM Measurements and Analysis –  Film: Stress, Thickness, Resistivity –  Profilometry –  Interferometry –  Infrared Inspection –  Parametric In-Line Testing


Product Development in U.S.

Lambda Router VOA MAG OXC

Pre-MEMSCAP

2x2 Switch

MEMSCAP Foundry

Mag Switch Endosure™ Deformable Mirrors

VOA

From%Standard%MEMS% Processes%(MUMPs®)%to% …meptec.org/Resources/10 - Cowen.pdf · Design...

Documents

Transcript of From%Standard%MEMS% Processes%(MUMPs®)%to% …meptec.org/Resources/10 - Cowen.pdf · Design...