Footprint Naming Convention - Surface Mount 3749778

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© 2015 PCB Libraries, Inc. 02/26/15 PCB Libraries Footprint Naming Convention for Standard SMD Components Component, Category Footprint Name Ball Grid Array’s ................................................ BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height + Environment BGA w/Dual Pitch .................... BGA + Pin Qty + C or N + Col Pitch X Row Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height + Environment BGA w/Staggered Pins ..................................... BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height + Environment BGA Note: The C or N = Collapsing or Non-collapsing Balls Capacitors, Chip, Array, Concave.......................................................................... CAPCAV + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Capacitors, Chip, Array, Flat ................................................................................. CAPCAF + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Capacitors, Chip...................................................................................................................................... CAPC + Body Length + Body Width X Height + Environment Capacitors, Chip, Polarized ................................................................................................................... CAPPC + Body Length + Body Width X Height + Environment Capacitors, Dual Flat No-lead ............................................................................................................ CAPDFN + Body Length + Body Width X Height + Environment Capacitors, Dual Flat No-lead, Polarized.......................................................................................... CAPDFNP + Body Length + Body Width X Height + Environment Capacitors, Molded, Non-polarized ....................................................................................................... CAPM + Body Length + Body Width X Height + Environment Capacitors, Molded, Polarized ............................................................................................................. CAPPM + Body Length + Body Width X Height + Environment Capacitors, Aluminum Electrolytic .......................................................................................................................... CAPAE + Base Body Size X Height + Environment Ceramic Flat Packages .................................................................................................................... CFP127P + Lead Span Nominal X Height - Pin Qty + Environment Column Grid Array, Circular Lead ............................... CGA + Pin Qty + C + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height + Environment Pillar Column Grid Array ........................................... PCGA + Pin Qty + S + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height + Environment Crystals (2 leads) .................................................................................................................................... XTAL + Body Length X Body Width X Height + Environment Crystals, Dual Flat No-lead............................................................................................................... XTALDFN + Body Length X Body Width X Height + Environment Crystals, Side Concave ........................................................................................................................ XTALSC + Body Length X Body Width X Height + Environment Diodes, Chip ........................................................................................................................................... DIOC + Body Length + Body Width X Height + Environment Diodes, Dual Flat No-lead ................................................................................................... DIODFN + Body Length X Body Width X Height – Pin Qty + Environment Diodes, Molded ..................................................................................................................................... DIOM + Body Length + Body Width X Height + Environment Diodes, Non-polarized Chip .................................................................................................................. DIONC + Body Length + Body Width X Height + Environment Diodes, Non-polarized Molded........................................................................................................... DIONM + Body Length + Body Width X Height + Environment Diodes, MELF ............................................................................................................................................. DIOMELF + Body Length + Body Diameter + Environment Diodes, Side Concave, 2 Pin.................................................................................................... DIOSC + Body Length X Body Width X Height - Pin Qty + Environment Diodes, Side Concave, 4 Pin...................................................................................... DIOSC+ Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Ferrite Bead, Chip ................................................................................................................................. BEADC + Body Length + Body Width X Height + Environment Fuses, Chip ............................................................................................................................................. FUSC + Body Length + Body Width X Height + Environment Fuses, Dual Flat No-Lead .................................................................................................................... FUSDFN + Body Length + Body Width X Height + Environment Fuses, Molded ....................................................................................................................................... FUSM + Body Length + Body Width X Height + Environment Fuses, Side Concave............................................................................................................................... FUSSC + Body Length + Body Width X Height + Environment Inductors, Chip ....................................................................................................................................... INDC + Body Length + Body Width X Height + Environment Inductors, Chip, Array, Concave ........................................................................... INDCAV + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Inductors, Chip, Array, Flat .................................................................................... INDCAF + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Inductors, Dual Flat No-lead ............................................................................................................... INDDFN + Body Length + Body Width X Height + Environment Inductors, Molded ................................................................................................................................. INDM + Body Length + Body Width X Height + Environment Inductors, Precision, Molded............................................................................................................... INDPM + Body Length + Body Width X Height + Environment Inductors, Side Concave ........................................................................................................................ INDSC + Body Length + Body Width X Height + Environment Land Grid Array, Circular Lead .................................... LGA + Pin Qty + C + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height + Environment Land Grid Array, Square Lead ......................................LGA + Pin Qty + S + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height + Environment LED’s, Chip ............................................................................................................................................... LEDC + Body Length + Body Width X Height + Environment LED’s, Dual Flat No-lead ..................................................................................................................... LEDDFN + Body Length + Body Width X Height + Environment LED’s, Molded........................................................................................................................................ LEDM + Body Length + Body Width X Height + Environment LED’s, Side Concave, 2 Pin ...................................................................................................... LEDSC + Body Length X Body Width X Height - Pin Qty + Environment LED’s, Side Concave, 4 Pin ....................................................................................... LEDSC + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Oscillators, Dual Flat No-lead ............................................................................... OSCDFN + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Oscillators, Side Concave ......................................................................................... OSCSC + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Oscillators, Side Flat ................................................................................................ OSCSF + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Oscillators, J-Lead ...................................................................................................... OSCJ + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Oscillators, L-Bend Lead ............................................................................................ OSCL + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Oscillators, Corner Concave.................................................................................................................. OSCCC + Body Length X Body Width X Height + Environment Plastic Leaded Chip Carriers ..................................................................... PLCC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty + Environment Plastic Leaded Chip Carrier Sockets Square ............................................ PLCCS + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty + Environment Quad Flat Packages ................................................................................... QFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty + Environment Ceramic Quad Flat Packages.................................................................... CQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty + Environment Quad Flat No-lead .............................................................................. QFN + Pitch P + Body Length X Body Width X Height - Pin Qty + Thermal Pad + Environment Pull-back Quad Flat No-lead ............................................................. PQFN + Pitch P + Body Length X Body Width X Height - Pin Qty + Thermal Pad + Environment Quad Leadless Ceramic Chip Carriers .......................................................................... LCC + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Quad Leadless Ceramic Chip Carriers (Pin 1 on Side) ................................................. LCCS + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Resistors, Chip ......................................................................................................................................... RESC + Body Length + Body Width X Height + Environment Resistors, Chip, Array, Concave ............................................................................. RESCAV + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Resistors, Chip, Array, Convex, E-Version (Even Pin Size) .................................... RESCAXE + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Resistors, Chip, Array, Convex, S-Version (Side Pins Diff) .................................... RESCAXS + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Resistors, Chip, Array, Flat ..................................................................................... RESCAF + Pitch P + Body Length X Body Width X Height - Pin Qty + Environment Resistors, Dual Flat No-lead................................................................................................ RESDFN + Body Length X Body Width X Height – Pin Qty + Environment Resistors, MELF ......................................................................................................................................... RESMELF + Body Length + Body Diameter + Environment Resistors, Molded .................................................................................................................................. RESM + Body Length + Body Width X Height + Environment Resistors, Side Concave ......................................................................................................................... RESSC + Body Length + Body Width X Height + Environment

description

footprint naming

Transcript of Footprint Naming Convention - Surface Mount 3749778

  • 2015 PCB Libraries, Inc. 02/26/15

    PCB Libraries Footprint Naming Convention for Standard SMD Components

    Component, Category Footprint Name

    Ball Grid Arrays................................................ BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height + EnvironmentBGA w/Dual Pitch ....................BGA + Pin Qty + C or N + Col Pitch X Row Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height + EnvironmentBGA w/Staggered Pins.....................................BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height + EnvironmentBGA Note: The C or N = Collapsing or Non-collapsing BallsCapacitors, Chip, Array, Concave.......................................................................... CAPCAV + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentCapacitors, Chip, Array, Flat ................................................................................. CAPCAF + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentCapacitors, Chip...................................................................................................................................... CAPC + Body Length + Body Width X Height + EnvironmentCapacitors, Chip, Polarized ................................................................................................................... CAPPC + Body Length + Body Width X Height + EnvironmentCapacitors, Dual Flat No-lead ............................................................................................................ CAPDFN + Body Length + Body Width X Height + EnvironmentCapacitors, Dual Flat No-lead, Polarized.......................................................................................... CAPDFNP + Body Length + Body Width X Height + EnvironmentCapacitors, Molded, Non-polarized.......................................................................................................CAPM + Body Length + Body Width X Height + EnvironmentCapacitors, Molded, Polarized.............................................................................................................CAPPM + Body Length + Body Width X Height + EnvironmentCapacitors, Aluminum Electrolytic ..........................................................................................................................CAPAE + Base Body Size X Height + EnvironmentCeramic Flat Packages ....................................................................................................................CFP127P + Lead Span Nominal X Height - Pin Qty + EnvironmentColumn Grid Array, Circular Lead ............................... CGA + Pin Qty + C + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height + EnvironmentPillar Column Grid Array ........................................... PCGA + Pin Qty + S + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height + EnvironmentCrystals (2 leads) .................................................................................................................................... XTAL + Body Length X Body Width X Height + EnvironmentCrystals, Dual Flat No-lead............................................................................................................... XTALDFN + Body Length X Body Width X Height + EnvironmentCrystals, Side Concave ........................................................................................................................ XTALSC + Body Length X Body Width X Height + EnvironmentDiodes, Chip ........................................................................................................................................... DIOC + Body Length + Body Width X Height + EnvironmentDiodes, Dual Flat No-lead ................................................................................................... DIODFN + Body Length X Body Width X Height Pin Qty + EnvironmentDiodes, Molded ..................................................................................................................................... DIOM + Body Length + Body Width X Height + EnvironmentDiodes, Non-polarized Chip .................................................................................................................. DIONC + Body Length + Body Width X Height + EnvironmentDiodes, Non-polarized Molded........................................................................................................... DIONM + Body Length + Body Width X Height + EnvironmentDiodes, MELF............................................................................................................................................. DIOMELF + Body Length + Body Diameter + EnvironmentDiodes, Side Concave, 2 Pin....................................................................................................DIOSC + Body Length X Body Width X Height - Pin Qty + EnvironmentDiodes, Side Concave, 4 Pin...................................................................................... DIOSC+ Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentFerrite Bead, Chip.................................................................................................................................BEADC + Body Length + Body Width X Height + EnvironmentFuses, Chip ............................................................................................................................................. FUSC + Body Length + Body Width X Height + EnvironmentFuses, Dual Flat No-Lead ....................................................................................................................FUSDFN + Body Length + Body Width X Height + EnvironmentFuses, Molded ....................................................................................................................................... FUSM + Body Length + Body Width X Height + EnvironmentFuses, Side Concave...............................................................................................................................FUSSC + Body Length + Body Width X Height + EnvironmentInductors, Chip ....................................................................................................................................... INDC + Body Length + Body Width X Height + EnvironmentInductors, Chip, Array, Concave ........................................................................... INDCAV + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentInductors, Chip, Array, Flat .................................................................................... INDCAF + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentInductors, Dual Flat No-lead............................................................................................................... INDDFN + Body Length + Body Width X Height + EnvironmentInductors, Molded ................................................................................................................................. INDM + Body Length + Body Width X Height + EnvironmentInductors, Precision, Molded............................................................................................................... INDPM + Body Length + Body Width X Height + EnvironmentInductors, Side Concave ........................................................................................................................ INDSC + Body Length + Body Width X Height + EnvironmentLand Grid Array, Circular Lead .................................... LGA + Pin Qty + C + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height + EnvironmentLand Grid Array, Square Lead ......................................LGA + Pin Qty + S + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height + EnvironmentLEDs, Chip...............................................................................................................................................LEDC + Body Length + Body Width X Height + EnvironmentLEDs, Dual Flat No-lead .....................................................................................................................LEDDFN + Body Length + Body Width X Height + EnvironmentLEDs, Molded........................................................................................................................................ LEDM + Body Length + Body Width X Height + EnvironmentLEDs, Side Concave, 2 Pin ...................................................................................................... LEDSC + Body Length X Body Width X Height - Pin Qty + EnvironmentLEDs, Side Concave, 4 Pin ....................................................................................... LEDSC + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentOscillators, Dual Flat No-lead ............................................................................... OSCDFN + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentOscillators, Side Concave.........................................................................................OSCSC + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentOscillators, Side Flat ................................................................................................ OSCSF + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentOscillators, J-Lead...................................................................................................... OSCJ + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentOscillators, L-Bend Lead ............................................................................................ OSCL + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentOscillators, Corner Concave..................................................................................................................OSCCC + Body Length X Body Width X Height + EnvironmentPlastic Leaded Chip Carriers ..................................................................... PLCC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty + EnvironmentPlastic Leaded Chip Carrier Sockets Square............................................ PLCCS + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty + EnvironmentQuad Flat Packages ................................................................................... QFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty + EnvironmentCeramic Quad Flat Packages.................................................................... CQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty + EnvironmentQuad Flat No-lead .............................................................................. QFN + Pitch P + Body Length X Body Width X Height - Pin Qty + Thermal Pad + EnvironmentPull-back Quad Flat No-lead ............................................................. PQFN + Pitch P + Body Length X Body Width X Height - Pin Qty + Thermal Pad + EnvironmentQuad Leadless Ceramic Chip Carriers .......................................................................... LCC + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentQuad Leadless Ceramic Chip Carriers (Pin 1 on Side) .................................................LCCS + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentResistors, Chip .........................................................................................................................................RESC + Body Length + Body Width X Height + EnvironmentResistors, Chip, Array, Concave .............................................................................RESCAV + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentResistors, Chip, Array, Convex, E-Version (Even Pin Size) ....................................RESCAXE + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentResistors, Chip, Array, Convex, S-Version (Side Pins Diff) ....................................RESCAXS + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentResistors, Chip, Array, Flat..................................................................................... RESCAF + Pitch P + Body Length X Body Width X Height - Pin Qty + EnvironmentResistors, Dual Flat No-lead................................................................................................ RESDFN + Body Length X Body Width X Height Pin Qty + EnvironmentResistors, MELF ......................................................................................................................................... RESMELF + Body Length + Body Diameter + EnvironmentResistors, Molded.................................................................................................................................. RESM + Body Length + Body Width X Height + EnvironmentResistors, Side Concave ......................................................................................................................... RESSC + Body Length + Body Width X Height + Environment

  • 2015 PCB Libraries, Inc. 02/26/15

    Small Outline Diodes, Flat Lead ................................................................................................. SODFL + Lead Span Nominal + Body Width X Height + EnvironmentSmall Outline IC, J-Leaded ....................................................................................................... SOJ + Pitch P + Lead Span Nominal X Height - Pin Qty + EnvironmentSmall Outline IC, L-Leaded....................................................................................................... SOL + Pitch P + Lead Span Nominal X Height - Pin Qty + EnvironmentSmall Outline Integrated Circuit, (50 mil Pitch SOIC) .................................................................... SOIC127P + Lead Span Nominal X Height - Pin Qty + EnvironmentSmall Outline Packages............................................................................................................SOP + Pitch P + Lead Span Nominal X Height - Pin Qty + EnvironmentSmall Outline No-lead......................................................................... SON + Pitch P + Body Length X Body Width X Height - Pin Qty + Thermal Pad + EnvironmentThermistors, Chip ................................................................................................................................THRMC + Body Length + Body Width X Height + EnvironmentPull-back Small Outline No-lead ....................................................... PSON + Pitch P + Body Length X Body Width X Height - Pin Qty + Thermal Pad + EnvironmentSmall Outline Transistors, Flat Lead..................................................................................... SOTFL + Pitch P + Lead Span Nominal X Height - Pin Qty + EnvironmentSOD (Example: SOD3717X135 = JEDEC SOD123) ..........................................................................SOD + Lead Span Nominal + Body Width X Height + EnvironmentSOT143 & SOT343 (JEDEC Standard Package) .........................................................................SOT + Pitch P + Lead Span Nominal X Height - Pin Qty + EnvironmentSOT143 & SOT343 Reverse (JEDEC Standard Package)......................................................SOT + Pitch P + Lead Span Nominal X Height - Pin Qty + R + EnvironmentSOT23 & SOT223 Packages (Example: SOT230P700X180-4) ...................................................SOT + Pitch P + Lead Span Nominal X Height - Pin Qty + EnvironmentTO (Generic DPAK - Example: TO228P970X238-3) .................................................................................. TO + Pitch P + Lead Span X Height - Pin Qty + EnvironmentTransistors, Dual Flat No-lead............................................................................................. TRXDFN + Body Length X Body Width X Height Pin Qty + EnvironmentVaristors, Chip ........................................................................................................................................VARC + Body Length + Body Width X Height + Environment

    PCB Footprint Expert Naming Convention Notes

    All dimensions are in Metric Units All Lead Span and Height numbers go two places past the decimal point and include trailing Zeros All Lead Span and Body Sizes go two place before the decimal point and remove leading Zeros All Chip Component Body Sizes are one place to each side of the decimal point Pitch Values are two places to the right & left of decimal point with no leading Zeros but include trailing zeros

    Naming Convention Special Character Use for Footprints

    The _ (underscore) is the separator between pin qty. in Hidden & Deleted pin components and to append modifiers at the endThe (dash) is used to separate the pin qty.The X (capital letter X) is used instead of the word by to separate two numbers such as height X width like Quad Packages.

    Suffix Naming Convention for Footprints

    Common SMT Land Pattern to Describe Environment Use (This is the last character in every name)Note: This excludes the BGA component family as they only come in the Nominal Environment Condition

    M ................. Most Material Condition (Level A) N.................. Nominal Material Condition (Level B)

    L.................. Least Material Condition (Level C)

    Components that have different Thermal Tab sizes, different Lead Tolerances or different BGA Ball Diameters

    Thermal Tab Examples for QFN, PQFN, SON, PSON, SOP and QFP w/Thermal Tabs: QFN50P600X600X100-41T365 = Thermal Tab size is 3.65 mm square QFN50P600X600X100-41T365X200 = Thermal Tab size is 3.65 mm X 2.00 mm rectangular

    Lead Tolerance Examples for Gull Wing Lead pkg. and QFN & SON that need additional differentiators: SOP65P490X110-8L20 = Lead Terminal has a 0.20 mm Tolerance

    BGA Ball Size Examples to add an additional differentiator to eliminate duplication: BGA100C80P10X10_900X900X150B43 = Ball size is 0.43 mm nominal

    Components with Hidden, Deleted or Reversed pins

    Reverse Pin Order (or Mirrored Part) -20RN.......... 20 pin part, Reverse Pin Order, Nominal Environment

    Hidden Pins -20_24N ...... 20 pin part in a 24 pin package. The pins are numbered 1 24 the hidden pins are skipped. The schematic

    symbol displays up to 24 pins.

    Deleted Pins -24_20N ...... 20 pin part in a 24 pin package. The pins are numbered 1 20. The schematic symbol displays 20 pins.


Host Naming

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X3 TACTIX PRD - Riton Optics1. Your Riton PRD come with a picatinny rail mount and when removed it has a RMR footprint. 2. Picatinny mount may be removed by using the provided allen

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