Fabrication, Assembly, Integration, Testing and Supply of ......FABRICATION, ASSEMBLY, INTEGRATION,...

Fabrication, Assembly, Integration, Testing andSupply of Electronic Packages Type M3A

TECHNICALANNEXURE

SENSORS PRODUCTION GROUP(SPG)SENSORS PRODUCTION AREA(SPA)

LABORATORY FOR ELECTRO-OPTICS SYSTEMS (LEOS)INDIAN SPACE RESEARCH ORGANISATION (ISRO) PEENYA,

BANGALORE – 560058

SENSORS PRODUCTION DIVISION LEOS/ISRO

ELECTRONIC PACKAGES TYPE M3A of 72

Fabrication, Assembly, Integration, Testing and Supply of Electronic Packages Type M3A

CONTENTS

1. Introduction2. Scope of work3. Work specification for Fabrication, Assembly, Integration, Testing and Supply of

Electronic Packages Type M3A3.1 Introduction3.2 Work specification3.3 Terms and Conditions3.4 General Terms and Conditions4. Statement of work for fabrication, assembly, integration, testing and supply of

Electronic Packages Type M3A4.1 General4.2 Scope of work4.3 Phase – I Training Activities4.4 Phase-II Production Activities for Fabrication, Assembly, Integration, Testing and supply

of Electronic Packages.4.5 Inspection and Auditing4.6 Non conformance management4.7 Photographic Records4.8 Component Management4.9 Test Systems4.10 Schedule, Planning and Reporting/Quality Control4.11 Cost Breakup for Realization of M3A Packages4.12 Intellectual property rights4.13 Roles and Responsibilities4.14 List of deliverables by vendor4.15 Safety precautions to be followed by vendor4.16 Delivery Schedules4.17 Payment Terms

Appendix A: Activities for Fabrication, assembly, integration, testing and Supply of ElectronicPackages Type M3AA1 Mechanical parts detailsA2 PCB fabrication detailsA3 Card and Package Testing details



Appendix B: Activities for Fabrication, assembly, integration and testing of Power Modules forElectronic Packages Type M3AB1 Mechanical parts detailsB2 PCB fabrication detailsB3 Card and Package Testing details

Appendix C: Typical list of consumables used for Electronic packages type M3AAppendix D: Typical list of Equipment required for card/package fabrication and AssemblyAppendix E: Typical list of equipment used for Electronic packages type M3A



LIST OF ABBREVIATIONS

LEOS-Laboratory for Electro Optic SystemsISRO-Indian Space Research OrganizationRFP-Request for ProposalFIM-Free Issue of MaterialsTVC-Thermal VacuumQC-Quality ControlPCB-Printed Circuit BoardESD-Electro Static DischargeEEE-Electrical Electronic and Electro MechanicalF/T-Functional testsLD-Liquidated DemurrageSMD-Surface Mount Devices



FABRICATION, ASSEMBLY, INTEGRATION, TESTING AND SUPPLYOF ELECTRONIC PACKAGES TYPE M3A

1.0 Introduction

Laboratory for Electro Optic Systems (LEOS), an ISO 9001:2008 certified unit of ISRO is the

lead Centre in Indian Space Research Organization (ISRO) responsible for realization of all

Sensors for various ISRO Satellite programs. ISRO is embarking on a mission to double the

number of satellites to be put in orbit in the next five years and realizing 10 to 12 spacecrafts per

year in future. This calls for a large number of Sensors to be fabricated, tested and made ready

for integration with Satellite. To meet this requirement, it is planned to involve industries,

wherever required, to realize Sensor subsystems under different modes of operation. LEOS

wishes to forge long term working relationship with vendors for realizing these hardwares.

In order to increase the throughput of sensors for future satellite programs, the sensors are

standardized for production. LEOS has established facilities at its premises for production

of various types of Sensors. These hard wares are planned to be realized through ISRO

qualified vendors who are familiar and have experience in Space Electronic Hardware

realization. The vendors should follow applicable quality and reliability standards, production

practices, testing procedures and documentation methods etc. towards manufacturing of

aerospace packages.

In pursuit of the above, it is decided to fabricate 15 Numbers of Electronic Packages Type M3A

fabricated through the vendors. The scope of work to be carried out by the vendor is described in

detail in the subsequent chapters as indicated below.

Section-2 gives the Scope and the details of the work involved.

Section-3 gives a detailed description of the work, the terms and conditions, manpower

requirements, the schedule, the reference standards to be followed, documents involved and the

responsibilities of LEOS and Vendor.

Section 4 gives a detailed list of the documentation and the sub activities of the work involved,

the review requirements, quality requirements, payment terms and the delivery schedules



involved.

The Appendix A,B,C,D,E indicate the fabrication and testing requirements for the electronic

packages M3A and the sub module namely the power modules and also a detailed list of

materials required

2.0 Scope and Details of work

Electronic Packages Type M3A consists of Electronic Cards (Main and Redundant) and Power

Electronic Modules (Main and Redundant). The activity involves parallel fabrication of

Electronic packages Electronic Cards (Main and Redundant) and Power modules (Main and

Redundant). Power modules are realized after completion of card fabrication, testing,

assembly, Bench tests and environmental tests. After completion of these tests power modules

are integrated with the Electronic packages Electronic cards (Main and Redundant) to realize

Electronic Packages Type M3A. The details involved in the production of the Electronic

packages are discussed in Section 3.

Vendor development is planned in two phases. In Phase-I, the vendor’s personnel will be trained

for fabrication, assembly, inspection and testing of the first Electronic Packages Type-M3A by

LEOS engineers. In Phase-II, the vendor will produce the hardware independently in LEOS.

The ultimate aim is to make the vendor well versed with the fabrication practices, Quality

control procedures and their implementation to ensure the reliability of the product.

3.0 Work Specification for Fabrication, Assembly, Integration, Testing andSupply of Electronic Packages Type M3A

3.1 Introduction

The Electronic Packages Type M3A work order is planned to be executed by external

vendors by giving suitable training. The detailed work specification is discussed in this

document. The various responsibilities of Vendor and LEOS to execute the work is also

discussed.



3.2 Work Specification

The activities involved in realizing the Electronic Packages Type M3A are as enlisted below.

Fabrication of precision mechanical parts. Fabrication of Printed Circuit Boards. Procurement of consumables for card and package fabrication and assembly.

Printed Circuit Board Wiring.

Testing of wired PCBs.

Realization of Power Modules.

Sub assembly level tests.

Final Assembly.

Ambient Performance tests.

Environmental tests.

Final Ambient Performance Tests.

Reports Preparation for Certification.

Representative activities, flow charts, component lists for Electronic Packages Type-M3A

are enclosed in Appendix-A. Realization of power modules is a sub-activity for realization of

Electronic Packages Type M3A. The representative activities, flow charts, component lists for

Power Modules are enclosed in Appendix-B. Details of the consumables used for card

and package fabrication is given in Appendix C. A representative list of equipment

required for card and package fabrication and assembly is given in Appendix D. A list of

general purpose equipment required for testing is given in Appendix E. Copies of Mechanical

drawings, PCB fabrication and wiring details, Assembly document, and Electrical

configuration etc. of Electronic Packages Type M3A will be available at LEOS for Vendor’s

reference.

3.3 Terms and Conditions

3.3.1 Validity of the contract:

The contract is for Supply of 15 Electronic Packages Type-M3A in 36 months from the date of

the purchase order placement. If delivery of packages is delayed beyond schedule due to



reasons attributable to Vendor, demurrage clauses will apply. In such case vendor is required to

complete the activities and deliver the Electronic packages with no additional financial

implication to LEOS.

LEOS proposes to finalize a firm and fixed price contract. However, due any unforeseen

exigencies due to LEOS, leading to delay in the execution of the contract, beyond the contract

period, standard price variation clause of per GFR2017 is applicable and the typical formula for

Price variation reproduced here

P1=P0{F+a[M1/M0]+b[L1/L0]}-P0

Where

P1 is the adjustment amount payable to the supplier (a minus figure will indicate a reduction in

the contract price.)

P0 is the contract price at the base level

F is the fixed element not subject to price variation

a is the assigned percentage to the material element in the contract price

b is the assigned percentage to the labour element in the contract price

L0 and L1 are the wage indices at the base month and year and at the month and year of

calculation respectively.

M0 and M1 are the material indices at the base month and year and at the month and year of

calculation respectively.

3.3.2 Deliverables by LEOS

Soft copy of all necessary mechanical and thermal drawings for fabrication and

thermal treatment of all mechanical parts.

Details of consumables to be procured for card and package fabrication.

All necessary details for PCB fabrication along with list of approved sources.

All screened EEE components necessary for the production as Free Issue of Materials

(FIM).

Test jigs for card level tests, test consoles and all special test equipment

Facilities for PCB wiring, testing, assembly and environmental test facilities.



3.3.3 Raw Material procurement and Parts fabrication by vendor:

Flight Quality PCB’s with all necessary tests and reports.

The space qualified raw material like Al 6061-T6, Titanium alloy (Ti-6AL-4V), SS 304,

GFRP spacers, copper and tantalum sheets etc., required for fabrication of mechanical

parts of cards and packages.

Consumables used for card and package fabrication and assembly, a list of which

is given in Appendix C with an approximate quantity.

All document copies like log books, fabrication details for card and package, assembly

documents required for each package fabrication.

Procurement of all items used for flight packages s h a l l be made only from LEOS

approved sources only.

The vendor shall fabricate the mechanical parts from LEOS approved sources only.

3.3.4 Reference Standards to be followed for Card/Package Fabrication:

The following documents shown in Table-3.1 shall serve as reference documents for the

contract and will be made available at the production site. They cover various phases of

activity including facility requirements and certification, manpower certification, ESD

and clean room requirements. Vendors shall comply with requirements as listed out in

these documents and which are applicable to them.

Table-3.1: Reference Standards to be followed

Document Identification Document title

ISRO-PAX-300Rev1 Workmanship Standards for the Fabricationof Space Electronics Packages.

ISRO-PAS-207 Storage, Handling and Transportationrequirements for Electronics hardware.

ISRO-PAS-100 Rev 1 Non Conformance Control Requirement forISRO Projects.

ISRO-PAS-201-Rev1 Failure Reporting, Analysis and CorrectiveAction Procedures

ISRO-PAS-400 Contamination Control and CleanlinessRequirements

MIL-HDBK-263B ESD Control Hand Book

ISRO-LEOS-QAG-MTA-GL-01 Space Electronics Production AssuranceGuideline



3.3.5 Reference Documents for Electronic Packages Type M3A:

The approved reference copy of all applicable documents specific to Electronic

packages type M3A namely PCB fabrication and wiring details, Mechanical parts

fabrication details, mechanical assembly, electrical configuration, test matrix and log

sheets shall be provided by LEOS. Vendor shall follow the documents provided by

LEOS as a guideline to carry out all the activities. He shall record the test results and

observations in the standard log sheet formats. For detailed list of documentation refer

Section 4.3.

3.3.6 Schedule:

Phase–I: Training and realization of 1st package will be 6 months from the date of

release of purchase order.

Phase-II: Delivery of 14 numbers (2nd-15th) of Electronic Packages Type M3A s to be

realized in 30 months from the training package or 36 months from the date of release

of purchase order. A minimum of three packages to be delivered every half yearly.

Throughput of the Power Modules should be maintained so as to meet the Electronic

Packages Type M3A delivery schedule. Delivery schedule chart is shown in Fig.1.

The vendor is free and encouraged to complete the activities deliver packages before

the schedule without any financial implications on LEOS

3.3.7 Facilities Requirements

LEOS shall provide all the facilities required at LEOS production labs for wiring,

assembly, Ambient Performance test, environmental tests and calibration as per ISO-

9000-2008 standards in vogue. The Vendor is required to carry out Wiring of PCB’s,

testing at card and package level, assembly of package and environmental tests at LEOS.

Some of the facilities are located in other ISRO centers (ISAC/ISITE) and part of the

work needs to be carried out by vendor.



3.3.8 Man power Requirements

1. The Vendor shall provide requisite qualified personnel supervised by a team leader for

effectively executing the project. The team leader should be a B.E (Electronics/Electrical)

with 5 years of working experience in Aerospace/ Defense projects and knowledgeable in

Aerospace standards. The following Table-3.2 provides minimum man power requirements

for Phase-I and Phase-II and is indicative only.

Table-3.2: Minimum Manpower Requirements for completion of ContractSl.No Engineer

/TechnicianResponsibility Qualification

MinimumNo. ofstaff

Activities involvedin

1 Test Engineers(Electronics/Electrical)

Testing Diploma with 65% 2 Card/Package TestingActivities (AnnexureA,B)B.E. With 65%marks 2

2 MechanicalEngineer + QA

Assembly,Environmental tests

Diploma with 65% 2 Card/PackageMechanicalActivities(Annexure A,B)

B.E. With 65%marks 2

3 Technicians +QA(Electrical)

Wiring andInspection

ITI Certificatewith First class

4+2 PCB wiring.(AnnexureA,B)

4 Team Leader OverallIncharge

B.E(ECE/EEE)with min 5 yearsexperience inaerospaceindustry

1 Monitoring all aboveacitivities, schedulingactivities to meetdelivery schedule

2. Responsibility to suitably estimate/scale the manpower and operate in shifts if required to

meet the delivery schedules lies with the Vendor. Delivery Schedules are to be met without

fail.

3. The Vendor shall comply with statutory rules connected with relevant and current Contract

Labor Act, Employees Provident Fund Act, Employees State Insurance Act, Insurance Act,

Payment of Wages Act, Workmen’s compensation Act, etc., and shall submit necessary

registration documents whenever called for.

3. The vendor personnel employed to carry out this activity have to work for a minimum

period of 40 months or till completion of this contract whichever is earlier. Training to the

vendor personnel will be given during the 1st phase only. Any training to personnel



recruited at a later stage for this activity will be charged to the vendor by LEOS. Vendor

should retain trained human resources till end of contract work after training. Repeated

training would increase time and resources and hence limited to two times only including

initial training. Charges for training manpower beyond the training period (2nd time) is as

indicated

Engineer (B.E/Diploma,. Electronics/Mechanical) :Rs 40,000/-

Technician (ITI, Electrical/Mechanical) :Rs 30,000/-

4. Additional manpower to be provided by Vendor in training phase to cater to employee

attrition.

5. All the engineers and technicians will be trained and evaluated before inducting them on

actual flight version packages.

6. Manpower requirements shown are representative and Vendor may suitably scale up the

requirements to meet the delivery schedule.

7. The employees of vendor deployed to LEOS/ISRO for undertaking the work,

antecedents/police verification shall be carried out by the Vendor at his cost and when

necessary, such records will have to be produced by them (Vendor) to authority concerned.

The Vendor shall give undertaking to purchaser (LEOS) to the effect that the

engineers/technicians/employees deputed at the premises of purchaser for carrying out the

services are not involved in any crime or unlawful activities. In case of any

misbehavior/discourteous behavior they shall be immediately replaced.

8. Transport/Conveyance, canteen and medical facilities will not be extended to vendor/vendor

personnel deployed at LEOS. The vendor shall be responsible for the same.

9. The employees deputed to undertake the work by the vendor shall remain the employees of

vendor and they will not acquire any claim for future employment or regularization in LEOS

or any other LEOS, ISRO centers.

3.4 General Terms & Conditions

3.4.1 Should any component(s)/part(s)/material(s) etc., issued by LEOS to vendor be damaged

or rendered unusable/unserviceable during the realization of the Electronic packages, it

shall be compensated on actuals by vendor with penal interest.



3.4.2 Procurement/fabrication of other hardware by Vendor shall be from LEOS approved

vendors to ensure consistency in Quality and cost advantages.

3.4.3 Vendor shall strictly follow/adhere Quality Assurance guidelines, requirements given by

LEOS.

3.4.4 Vendor to guarantee for a period of one year from the date of acceptance by LEOS the

performance of each of the Electronic packages supplied by it to LEOS against

workmanship defects. Vendor shall carryout necessary repair and testing free of charge

during the warranty period.

3.4.5 The vendor shall accept and implement any modifications in components /materials/tests

/methods necessitated by functional requirement/improvement/on-orbit observations for

LEOS project needs, and brought out by LEOS, in the Electronic packages units supplied

by vendor at no extra cost, unless the modifications call for major changes in the

Electronic packages. In the event of configuration change any PCB procured or housings

fabricated would be reimbursed suitably. Compensation shall be mutually agreeable

basis. The date of reckoning for Electronic packages delivery would be suitably modified.

For the deployed manpower vendor shall quote/claim for hourly basis.

3.4.6 All the information/documentation (in all forms) of the activities/works forms intellectual

property of LEOS. LEOS has complete, exclusive right on the

information/documentation (in all forms). The vendor guarantees that all the technical

information and knowhow provided by LEOS within the scope of this contract shall be

treated as confidential and will not be divulged to any other party. The Vendor also

undertakes and guarantees that the documentation issued by LEOS shall be kept by

vendor in safe custody and in good condition for the entire period of this contract. Vendor

shall return all the documents to LEOS and declare in writing that no other copy exist

with him or the personnel employed by him. Further the vendor shall execute a non

disclosure agreement with LEOS.

3.4.7 The first Electronic packages produced by vendor independently, after training, is

considered as first article which shall be subjected to higher level testing. On successful

completion of first article, vendor shall be given clearance for further production

activities.



3.4.8 The vendors personnel deployed at LEOS for activities of contract shall carry out

pending work, if any, towards meeting schedules beyond office hours and on holidays,

with consent from LEOS, without any financial implications to LEOS.

3.4.9 The vendor shall be an established/Registered Indian company (with majority stake with

Indian owners) without any insolvency, and actively doing business for past 5 years.

3.4.10 Vendor shall have valid ISO9001/ASI900 certification and confirm the same in the

quotation.

3.4.11 The vendor shall have a minimum of 3 years of experience in the nature of the present

proposed work.

3.4.12 The vendor shall have executed and successfully completed atleast one work/order

involving similar kind and scope of work involving wiring, fabrication, assembly and

testing for Aerospace, ISRO or similar organizations in India. Details are to be filled as in

Table 3.3

Table-3.3: Experience of Vendor for past 2 years ending with current year.).(Mandatory; be sent along with or as part of technical bid; otherwise bid would be considered

invalid)Sl.

NO.Brief

description ofof Work.

Name of Customer,category of customer(Aerospace, ISRO,

Defence)

Duration,Number of

products, cost,number ofmanpowerdeployed

Nature/quantum ofwork

(eg., wiring,assembly, testing,operating specialequipment etc.,)

3.4.13 The vendor shall not sub-contract either whole or any part of the work to other vendors

except for procurements and mechanical parts/PCB fabrication.

3.4.14 LEOS reserves the right to enter into parallel/adhoc contract with one or more Vendors

during the currency of this contract for same Electronic packages.

3.4.15 Under exigencies, LEOS may have to short close its commitment to produce Electronic

packages by vendor under this agreement. Should such exigency arise, LEOS would issue

a THREE months notice to vendor for such short closure of the Order/contract. Upon

issue of short closure notice, a committee, formed by LEOS shall work out the details of

actions to be completed by either parties, relating to free issue of materials, contract



commitments, balance of work, compensation etc., to mutual satisfaction. The committee

shall complete the evolution of mutually agreed action plan within 30 days from the date

of issue of short closure notice.

3.4.16 Both LEOS and vendor shall have the right to terminate this agreement by giving a notice

of THREE months in writing to the other for any other reason, not specified in and which

shall be by mutual consent. The payments would be made to the extent of deliverables by

vendor. Unused raw material/PCB/Mechanical parts to be handed over to LEOS and the

committee (mentioned in 3.4.15 above) shall decide all these modalities of stock taking

and termination.

3.4.17 During the effective period of this contract, if it is found that the Electronic packages

manufactured by vendor, after training period, fail to meet the workmanship standards,

fabrication and assembly requirements repeatedly the matter may be brought to the notice

of vendor by LEOS for rectifications, free of cost to LEOS. If after a reasonable period,

necessary for rectification has not been affected or the Electronic packages do not still

meet the specifications, LEOS reserves the right to revoke the order/contract granted to

vendor without any notice and no liability on the part of LEOS.

3.4.18 LEOS reserves the right to terminate the revoke/cancel order or terminate the contract if

vendor fails to deploy required resources towards training/executing within a reasonable

period of time (one month from the date of order) or fails to meet the obligations under

this contract.

3.4.19 Arbitration/Settlement of Disputes: Difference of opinion, if any, arising during the

period of the contract, will be settled on the basis of mutual consultation by the

signatories of the contract or their designated nominees. In the event of any question,

dispute or difference arising under these conditions or any special conditions of the

agreement/contract, or in connection with this agreement/contract (except as to any

matters the decision of which is specially provided for by these or the special conditions)

the same shall be referred to the sole arbitration of Director, LEOS (arbitrator) or a

committee constituted by him. The decision/award of the Director or his nominated

committee shall be final and binding on the parties to this contract.

3.4.20 Compensation for damages caused for persons, goods or property: The vendor shall

indemnify and hold harmless, LEOS and/or any Officer, employees or assignees thereof



against any loss, damage or expense resulting from damage to property or personnel

injury arising out of willful misconduct or gross negligence of the Vendor or their

personnel in the execution of the work under this contract. The Vendor shall at its

expense, defend any suit or proceedings brought against the LEOS on account thereof,

and shall satisfy all judgments and pay all expenses which may be incurred by or

rendered against them, in connection therewith.

3.4.21 All defective parts fabricated by Vendor are property of LEOS and shall not be returned.

3.4.22 Vendor shall quote for a minimum order quantity of 10 Nos and subsequent slab of 5 Nos

as shown in Table 3.4. LEOS reserves the right to place part orders for any quantity.

Table 3.4: Quote for Ordering Quantity (Mandatory; be sent along with or as partof technical bid; otherwise bid would be considered invalid)

Sl.NO. Order Quantity (Nos) Cost per Electronicpackage

1 102 11-15



SECTION 4Statement of work for fabrication, assembly, integration, testing and supply of

Electronic Packages type M3A

4.1 GeneralThis statement of work comprises of nature of work and the responsibilities of the vendor inconnection with the fabrication, assembly, integration, testing and supply of Electronic PackagesType M3A.

4.2 Scope of work

The scope of the work is planned in two phases.

PHASE – I :

In this phase, the vendor will be trained at LEOS by LEOS representatives. During this phase,the vendor will be trained for actual fabrication and testing of sensors. Training and realizationof first package shall be completed within 6 months from the date of release of purchase order.Further the vendor has to get all the required details from LEOS towards Consumablesprocurement, PCB procurement and procurement of raw materials for mechanical partsfabrication. He has to procure the materials and submit to LEOS the reports and conformancecertificates for clearance to use in Phase-2 Production Activities.

PHASE – II:In this phase, the vendor is totally responsible, for the fabrication of PCB’s and mechanical partsready for assembly in all respects. This includes mechanical parts fabrication, 100% metrology,thermal treatment (Anodising and Black painting) of parts etc. and PCB procurement. Thevendor is totally responsible for wiring of PCBs, inspection, testing at sub assembly level,assembly of total package and testingthem for their performance, environmental tests andcalibration as per the approved production and test documents. The remaining 14 packages willbe fabricated and tested independently by the vendor in 30 months from the date of trainingcompletion or 36 months from the date of purchase order in a staggered manner with 15th

package delivered by the end of 36th month and as per the delivery schedule given.



4.3 PHASE – I : TRAINING ACTIVITIES4.3.1 TRAINING PACKAGE AND DOCUMENTS TO BE REFERRED:

The approved reference copy of all applicable documents namely PCB wiring, packageassembly, test matrix and log sheets shall be provided by LEOS. Based on the referencedocuments, the party has to make hard copies for the production package folders of eachindividual card and package as . The documents provided by LEOS are comprehensivedescribing every minute details so as to enable the vendor to understand the requirement andproduce the hardware required as per specifications and test every aspect of the functionalitywithout leaving any issue/item, without change of parts, consumables, process, procedure andmethod, without any additional item/process. To summarize, these documents are self-instructiveto the vendor and contain every requirement of LEOS in view that he/she should be ultimatelyable to fabricate, assemble, test and deliver with the least participation from LEOS. The card /package folder should have the following details filed based on the master copy provided byLEOS.

The documents supplied are as follows and typical contents of the document are as discussedbelow.

4.3.2 DOCUMENT TO BE REFERRED FOR PCB WIRING

01. PCB Layout, number of layers etc.02. Component details in the LEOS standard format.03. Component positioning / mounting details with component marking details.04. Drilling details for components mounting etc., on PCB.05. Mechanical details such as dimensions and stack holes sizes scheme of mounting etc.06. Mechanical housing details and stacking diagram and position of the card in the stack.07. Connector details and identification of input/output.08. Component placement and lead bending requirements specific to components.09. Conformal coating, potting and lacing requirements10. Fabrication / soldering specifications like temperature solder material, soldering time and

specific tools to be used.11. Handling precautions of the components.12. ESD protection methods and practices.13. Any special notes, as called for14. List of Applicable ISRO / Other documents.



15. Others Layout marking etc. Inspection procedure etc. Soldering / desoldering Card identification marks Card mechanical, electrical inspection records Solder masks (if applicable) Special land patterns Cleaning Procedure

4.3.3 DOCUMENT TO BE REFERRED FOR MECHANICAL PARTS FABRICATIONa) Approved Mechanical Fabrication Drawings for mechanical fabrication.b) Drawings used for thermal treatment of Mechanical Parts.c) Details of Sample coupons.d) Quality control log books and formats for inspection / metrology / after fabrication and

thermal treatment of parts.e) Details of raw materials used like mechanical properties, chemical composition,

4.3.4 DOCUMENT TO BE REFERRED FOR ASSEMBLY OF PACKAGE.The vendor has to refer to the master copy of the assembly document provided by LEOS andstrictly follow the sequence/procedures as explained during the training of first package. Thevendor has to ensure availability of the following documents/details before starting thefabrication activities01. Flow chart showing the sequence of activities during Electronic packages fabrication.02. Description of each activity giving the previous activity to be completed and other pre-

requisites.03. Materials, parts and special epoxies to be used.04. Tools and Instrument used for assembly.05. Documents for wire routing, connector mounting on PCB etc.06. Interconnection details such as card to mother board / package to package etc.07. Connection details input / output designations etc.08. Interconnection harness requirements etc.09. Stacking details10. Mechanical details such as card to card to spacing, torque requirements etc.



11. Assembly procedure for parts including cleaning, handling procedure and precautions to betaken.

12. Assembly environment.13. Check points / test points.14. Failure report / correction mechanism15. Log books with formats at all stages of sub-assembly and system level assembly.16. Rework procedure at different stages, incase of re-work is called for. Report of fabrication

deviations, authorizations, QC Check points.17. Time required for each activity, type of infra structure / overheads needed and estimated

utilization time on each facility and infrastructure man-hours required for each activityincluding engineers, technicians and management and supervisory staff.

18. Rework procedures.

4.3.5 DOCUMENT ON TEST PROCEDURE FOR EACH CARD AND SUB-ASSEMBLY

The vendor has to refer to the master copy of the test procedure document provided byLEOS and strictly follow the sequence/procedures as explained during the training of firstpackage. The vendor has to ensure availability of the following documents/details beforestarting the testing activities. Each card / sub assembly functional inputs and outputs are to beunderstood and discussed with LEOS engineers while undergoing the training.Card level / subassembly test procedure document shall have the following details01. Circuit diagram with identification of input / output and destination information.02. Block schematic03. Functional description04. Input / output specification05. Environmental requirements06. Test set up, special simulators and jigs and procedures07. ESD protection requirements08. Log book09. Analysis report10. Precautions during tests11. Environmental tests, if any12. Burn in components / devices if any13. Test results, anomalies, corrections, reviews



4.3.6 DOCUMENT ON TEST PROCEDURE FOR TEST PROCEDURE FORASSEMBLED PACKAGES.

The vendor has to refer the master copy of “Test procedure document for assembledpackages” provided by LEOS. The document contains the following details

Test Specifications: Details of various environmental tests, calibration procedure. Equipment and special jigs, simulators, mechanical equipment and special facilities for

assembly including cleanliness requirements at the place of test. Procedure for all interface checks Identification of inputs / outputs ports and their designations, expected type of signals, levels

and limits Detailed test matrix and expected results for every test Test set up required for every test to be described and to be documented. The requirement in terms of interfaces, test and measuring instruments. Test procedure for performance evaluation using special simulators, logging and test results. Alignment procedure and log sheets. Precautions to be taken during tests.

4.3.7 RESPONSIBILITIES OF LEOS DURING PHASE – 1

LEOS shall supply all the necessary drawings, wiring, assembly & test procedures for makingprototype sensors. The vendors will be exposed to actual fabrication work and inspectionpractices and testing of sensors. The vendor personnel will be trained by LEOS for carryingout various tasks involved in realization of first package. All the required facilities relevant tothe activity shall be provided by LEOS. The performance of fabrication, test and evaluationpersonnel of the vendor will be tested and certified by LEOS for their eligibility in theactual fabrication and testing activities.



4.3.8 RESPONSIBILITIES OF THE VENDOR DURING PHASE – IThe vendor shall position the required manpower as specified in section 3.3.9 at LEOS. Thepersonnel have to participate and get trained at each stage of fabrication, assembly andtesting. The personnel must familiarize with all the activities viz;understanding sensorterminology, understanding the mechanical drawings, mechanical parts fabrication and100% inspection, understanding the thermal treatment aspects of mechanicalparts, helicoil fixing, fabrication and assembly procedures, fabrication sequential flowcharts,mechanical and electrical functional aspects, Quality control, ESD related, handling of specialdevices, test consoles, equipment, simulators, card and package test parameters andspecifications, interface aspects , mechanical assembly of cards and packages, environmentaltests and procedures by thorough understanding of documents provided and the applicationof these documents for completion of each stage activity etc.

The vendor personnel have to get familiarized with management of folders/files containingcomplete data related to card level fabrication, package level activities folder and assemblydocument. These documents reflect the history, traceability and progress of work on day-to-day basis with record of execution of activity. The package will be certified based on theevaluation of sensor delivery requirements by auditing.

The vendor shall position the required manpower at LEOS. All the documents as explained inthe previous section shall be prepared for the first package as per the training given by LEOS andget them approved before the final documents are submitted. Changes/modifications if any fromthe documented procedures that may arise during the training period shall be recorded and usedby the vendor for updating the existing documents after necessary approvals from LEOS.



4.4 PHASE–IIPRODUCTION ACTIVITIES FOR FABRICATION, ASSEMBLY, INTEGRATION,TESTING AND SUPPLY OF ELECTRONIC PACKAGES.

This activity shall be executed at LEOS production facility by the Vendor personnel. Vendorhas to carry out all activities towards package realization independently. During the fabricationprocess, the following are to be followed without exception wherever applicable.

4.4.1 MECHANICAL PARTS FABRICATION

Mechanical parts fabrication as per approved drawings by fabricators approved by LEOS. Matching of parts. Serial number, Bench number, Part number marking, engraving & marking of parts. Inspection of Mechanical Parts for – QC. Acceptance /Rejection / Rework reports. Anodizing the parts as per approved drawings by facility approved by LEOS. Drilling, Tapping, Fitting, Helicoils fixing etc. Black painting/black dying of the parts as per approved drawings. Certificates for all thermal treated parts.

4.4.2 PCB FABRICATION

PCB fabrication as per approved spool files by an approved facility. Carrying out all tests on PCBs as specified for aerospace requirements. Visual and Mechanical Inspection reports. Submission of PCB’s along with traceability, inspection reports including Group B test

reports, test coupons to LEOS for obtaining clearance. Storage of PCB in proper condition as per procedure.

4.4.3 PCB WIRING

All the PCBs connectors, buffer connectors, auxiliary and temporary wiring shall be made asper the standards defined by LEOS QC.

The vendor shall strictly adhere to the ESD protection measures. The vendor shall maintain a folder to each card being fabricated and to log all relevant

information as per the prescribed log book.



Vendor shall receive components and carry out inward inspection as per component list. Getting necessary clearance for components deviating from component list or getting

replacement components. Pre-fabrication activities – card cleaning, baking and PTH filling. Component mounting, inspection and soldering and lead bending wherever applicable. Provision of chotherm and heat sinks wherever required as per the fabrication procedures. The vendor shall follow the fabricated procedures as per the guidelines of LEOS and inspect

at every stage before proceeding to the next stop. Any deviations, anomalies observed and noticed must be logged and reported to the

concerned authorities and to proceed only after clearance by competent authorities. The vendor shall make the card ready for functional tests, after completion of the fabrication

and inspection of the cards. The vendor shall obtain clearance from LEOS for functional testing and carry out the testing. Vendor shall make arrangements for the incorporation of test selectable components to

realize the design goals and complete card level testing. After completion of card testing the vendor shall carry out radiation shielding, coating,

potting , Dam and fill as per the fabrication procedures and guidelines of LEOS. Vendor shall inspect the cards after conformal coating and carry out card tests and get

clearance for next activity/assembly/initial bench test.

4.4.4 CARD TESTING

Follow all ESD precautions for testing of the cards. To make ready all the cards and subassemblies fabricated for functional tests by visual

inspection and passive measurement of various parameters. To make the test setup as per the card test procedure and setup verification which may

include reading the stimuli’s power sources, setting up the voltage and current limits, testequipment, log books etc.

To log the test conditions, test results and reporting any deviations to the subsystem incharge and proceed only after necessary clearance.

Every card to be checked as per the pre-determined procedure and tabulate the results in theprescribed format.

After completion of the test on each card, the results are to be viewed and their complianceto be recorded. Any deviations are to be notified.



Anomaly reporting / corrective actions / trouble shooting / waivers to be followed as perISRO guidelines.

Package level assembly and testing is to be carried out after clearance for all cards.

4.4.5 PACKAGE ASSEMBLY AND PACKAGE LEVEL TESTS

After completing functional tests of all cards following activities will be carried outo Package Assembly: All the cards and power modules will be integrated with the

mechanical housings as per the approved assembly procedure. The assembledpackage shall be offered to LEOS for clearance for further activities.

o Initial Ambient Performance Checks: the assembled package will undergo Ambientperformance checks as per the test matrix. Testing is to be carried out with theassociated test jigs, test equipment and simulators.

o Vibration Test: After completing ambient performance tests and obtaining necessaryapproval/clearance from LEOS and mandatory inspection by QA, the packages willundergo vibration as per the test levels given by LEOS.

o Thermovac Test: The packages have to undergo thermal vacuum (TVAC) test aftervibration test. The temperature-time profile and vacuum limits (TVAC profile) willbe provided by LEOS. Cursory Package performance will be monitored throughoutthermovac and detailed readings as per test matrix will be done as per the specifiedtime indicated in the test profile.

o Final Ambient Performance Checks: the package after completion of all above testswill undergo Final ambient performance checks as per the test matrix. Results will beverified for matching with the results of initial ambient performance checks.

o Pre-certification: After completion of all tests, all data is to be compiled in therequired form and data is to be submitted to LEOS for obtaining QA certificate.

4.4.6 REWORK / RETESTS

To conduct the tests both on cards and package and total systems as and when required (apartfrom the above tests) due to various anomalies, requirements, suggestions, etc. If any failureoccurs at Electronic packages level testing at any stage of the testing, the entire testing cycle is tobe repeated towards meeting the specifications.



4.5 INSPECTION AND AUDITING

The flight fabrication activity involves inspection and audit by the vendor QC personnel. Theyshall carry out inspection on 100% basis at all stages of activity and shall make specific mentionof inspection in the fabrication folder. For inspection guidelines, vendor may refer to thereference documents section. Subsequently before every higher stage of activity as indicated inTRR, audit shall be carried out internally to assure that all activities at the earlier stage arecompleted. Formal stage audits will be carried out by LEOS and clearance will be given toproceed to next stage. The Mandatory Inspection points are where LEOS shall mandatorilyaudit/review the progress of activity and readiness of hardware for further activity. LEOS reservesthe right to inspect/audit hardware at any stage of the activity.

4.6 NON-CONFORMANCE MANAGEMENT

For non-conformances observed during fabrication, assembly and testing, following are therecommended guidelines:

1. All non-conformances related to materials, fabrication, assembly, testing etc to bereported to LEOS within 24 hours in writing.

2. For all Non-conformances, LEOS shall recommend next course of action.3. The NCR shall be addressed to Focal Point, LEOS.

4. Focal Point from Vendor shall ensure complete reporting of all non-conformances andthe assessment of Vendor to LEOS.

5. LEOS shall after receipt of NCR discuss in the appropriate forum and suggest furthercourse of action.

4.7 PHOTOGRAPHIC RECORDS

Photographs of the hardware shall be maintained. A checklist for mandatory photographicrecords will be given and it is the responsibility of the vendor to produce photographs as per thechecklist. Further Photographic evidence needs to be maintained as a record of thefabrication/assembly activity. Towards this purpose, fabrication records shall also carry record ofphotographs meant to record fabrication activity completion, rework completion, conformalcoating completion, tray wiring and package assembly. Images shall be captured only byinstruments provided by LEOS for this activity.



4.8 COMPONENT MANAGEMENT

1. All the EEE parts shall be issued to vendor based on the requirement for realization ofthe packages.

2. The components given by LEOS for fabrication work shall be received andacknowledged by the vendor.

3. Vendor shall maintain all records of components received and utilized, unused componentsetc., and submit to Focal Point, LEOS a statement at the time of package delivery and returnthe unused components.

4. Vendor shall take utmost care in handling and transportation of the components.

5. Defective components, if any, found should be accounted and informed to the LEOS forreplacement.

6. Vendor is responsible for keeping track of the expiry date of the components and to wire thecomponents within the expiry date.

7. Vendor shall be responsible for any loss/ damage of components and shall make suitablecompensation to LEOS.

8. The components supplied by LEOS against each order will be used to the vendor for thesole purpose for which it is intended.

4.9 TEST SYSTEMS

Test consoles, Custom made card jigs and Electro optical simulators, general purposeinstruments required for testing at card and package level shall be provided by LEOS.

4.10 SCHEDULE, PLANNING AND REPORTING / QUALITY CONTROL

4.10.1 SCHEDULE AND PLANNING

The total time schedule of activities shall be met without fail. Schedules to be made for eachindividual package. Vendor shall make detailed plan for all sub-activities involved in realizingthe packages and communicate the same to LEOS to ensure timely availability of LEOSpersonnel and facilities wherever applicable.



4.10.2 STATUS REPORTING

Status report of major activities like fabrication, testing and documentation shall be submitted forreview on weekly basis. Any deviation from the agreed plan shall be informed to LEOS forapproval/ratification.

4.10.3 LOG BOOKS, FOLDERS AND FILE MAINTENANCE

All log books, test procedures, test results, individual card and package folders and files to bemaintained as per procedures of LEOS in vogue.

4.10.4 FOCAL POINT

Vendor will identify the focal point for all communications / instructions to have bettermanagement. Similarly, LEOS will identify an Officer to communicate with the Vendor.

4.10.5 QUALITY PROVISIONS

Vendor shall use facilities for the fabrication, assembly and testing of Electronicpackages which are approved by LEOS. All approved practices of Quality assurance ofelectronic systems, assemblies shall be adhered to. All processes used shall be approvedby LEOS-QA. All materials and components used shall be approved by LEOS-QA. AllISRO documents on Quality assurance shall be applicable Towards Review / acceptance /non-conformance / rework / authorization / waivers.

6. Vendor should strive to have minimum non-conformances and completely avoidrecurring of the same non-conformance by ensuring proper checks as required at allstages.

The Quality of the package will be judged based on the total number of non-conformances

4.11 COST BREAKUP FOR REALIZATION OF M3A PACKAGES

The clear breakup of cost for carrying out PCB wiring, PWB testing, mechanical assembly,package level testing and environmental tests, cost of consumables, fabrication cost andPCBs and mechanical parts are to be indicated as per Table-4.1 for Electronic Packages typeM3A and power modules separately. Vendors while making their techno-commercial bidsshall carefully go through the requirements as spelt out in this document and respondaccordingly.



Sl.No Activity Cost Remarks

1 Wiring, Assembly and Testing

1.1 PCB Wiring

Refer Appendix A and

B

1.2 Wired PCB Testing

1.3 Package Assembly

1.4 Assembled Package Tests

2 PCB, Materials, Consumables and Fabrication

2.1 PCB for Electronic Packages Type M3ARefer Appendix A,B

2.2 Fabrication cost of Mechanical housings forElectronic Packages Type M3A

2.3 Consumable cost for package Refer Appendix C

3 Total cost per sensor

Table-4.1:Cost Break-up for each activity for one Electronic package. (Breakup for

power modules to be given using same format)



4.12 INTELLECTUAL PROPERTY RIGHTS

All documents prepared shall be the property of LEOS and all the intellectual property rights of

all documents shall be solely with LEOS. The intellectual property rights of all sensors produced

shall be with LEOS-ISRO. Vendor can at no point in time or in any format claim the design or

sensor as his own product. Exclusive, Full, complete IPR Rights rests with LEOS.

4.13 ROLES AND RESPONSIBILITIES

This section outlines the roles and responsibilities of LEOS and Vendor so as to provideclarity and to enable smooth operation of the contract. The responsibilities of LEOS and Vendorare shown in Tables -4.3.

4.13.1 RESPONSIBILIITES OF LEOS Necessary infrastructure essential for carrying out the Realization of Hardware. Training and certification of Fabrication, Technicians, training for Test Engineers

shall be provided for the first package only.

Audit/Clearance of consumables & materials procured by vendor.

Supply of EEE parts and special components as required for the realization ofhardware as per RFP and the same is to be collected by vendor as per PurchaseProcedure.

All software in embedded form. Provide sufficient documentation to carry out the activities as per contract.

Carry out audits and provide approvals for the fabrication, assembly and testing. Disposal for all Non conformances arising at various stages of package realization

4.13.2 RESPONSIBILIITES OF VENDOR

The vendor shall execute the work as per the content and delivery schedulementioned in the RFP.

The Vendor is responsible for safe custody of the materials supplied by LEOS. Vendor shall procure and use approved consumables, where applicable. Maintain records towards traceability of all mechanical parts, and consumable like



batch. No, Expiry data etc with each package. Ensure calibration validity of Test & Measurement equipment. Rework as well as replenishment of rejected Sensors on the basis of the feedback

from LEOS. The vendor shall nominate a technically qualified person as a Focal Point for work

scheduling, progress review and for interaction with LEOS. Submission of periodic progress report. Procurement of consumables and materials, obtaining approvals for their

acceptance & Storage at LEOS by submitting relevant reports/certificates ofconformance/compliance.

Interaction with various agencies in LEOS for smooth execution of the fabrication,testing and documentation during the period of contract through Focal Point, LEOS

Deployment of technical manpower at LEOS to carry out the stated works. Ensure submission of periodic reports. Report all non-conformances arising at any stage during fabrication and testing

within 24 hours of its occurrence to LEOS and obtain approvals for continuingwith further activities.

Safe custody of the equipment, test jigs, test consoles given towards variousactivities at LEOS.

All parts supplied by Vendor and found defective are property of LEOS and shallnot be returned in lieu of replacements.



Table 4.3: Activity Responsibility Matrix for LEOS and Vendor

SL. No. ACTIVITY RESPONSIBILITY Remarks

1 PCB Gerber files/Films LEOS

2 PCB Vendor

3 Mechanical Drawing LEOS

4 EEE Components LEOS

5 Mechanical Housings and fasteners Vendor

6 Consumables/Materials Procurement Vendor List of materials will be given by LEOS

7 Consumables Qualification Vendor By NABL accredited Lab certificate

8 Audit for Consumables LEOS Audit/Clearance by LEOS

9 Incoming Inspection, Storage & Handling ofcomponents before start of fabrication activity

Vendor

10 PCB Wiring Details LEOS Reference document will be given in the trainingperiod and has to be followed for all packages

12 PCB Wiring Vendor

13 Card Level Audit prior to card F/T Vendor and LEOS

14 Card Level Test setup Vendor Test setup preparation to be carried out by vendor

15 Testing of cards Vendor Card Level test procedure shall be given in thetraining period and to be followed for all packagesand cards

16 Card Test Results clearance LEOS

17 Radiation shielding, Conformal coating, potting Vendor



SL. No. ACTIVITY RESPONSIBILITY Remarks

18 Clearance for Functional test after coatingand potting

Vendor

19 Testing of cards after Radiation Shielding,coating and potting(RCP)

Vendor

21 Package Assembly and wiring Vendor

22 Buffer harness for package level testing Vendor Wires and gold plated connectors will be provided by LEOS.

23 Package level Test setup preparation Vendor Test system will be provided by LEOS. Any required harnessto be fabricated by Vendor. Test setup to be done by Vendor

24 Initial Ambient Performance Test Vendor

25 Package Permanent Assembly Vendor

26 Package Assembly Inspection as perMandatory Inspection Points

LEOS &Vendor

27 Package Tests after Assembly Vendor

28 Package Clearance for Vibration LEOS

29 Vibration Test Vendor and LEOS

30 Package Tests after Vibration Vendor

31 Package Clearance for Thermovac LEOS

32 Thermovac Test Vendor and LEOS LEOS shall give the Specifications document.33 Final Ambient Performance Test Vendor Tests to be done as per procedures provided in training phase

34 Pre-certification process Vendor & LEOS All the necessary Consolidated test results and observations tobe prepared for precertification



4.14 LIST OF DELIVERABLES BY VENDOR

o All relevant certificates relevant to raw materials procured including proof of

purchase of raw material, mechanical inspection reports, detailed dimensional

sheets (sheets consisting of 100% inspection details), thermal treatment reports.

o All PCB fabrication reports and inspection reports.

o Electronic packages type M3A fully fabricated and tested as per requirement.

o Fabrication history folders for each card and package.

o Test results in hardcopy and softcopy form, log books, analysis reports, failure

analysis, samples rejections etc.

o Sample test coupons (thermal treatment), unused surplus materials/ components.

o Warranty certificate related to workmanship defects for a period of 12 months

from the date of delivery

4.15 SAFETY PRECAUTIONS TO BE FOLLOWED BY VENDOR

The vendor personnel should strictly adhere to the general work rules, procedures and office

timings followed at LEOS and keep harmonious relations with staff during their stay at LEOS.

The personnel of vendor must adhere to all the safety guidelines while handling components,

cards, packages, while testing and transporting, particularly the ESD protection measures such as

wearing ESD overcoats, footwear / chapel, wrist - band etc.

4.16 DELIVERY SCHEDULE:

1. The Sensors should be delivered /completed within stipulated time from the release of

purchase order or issue of last free issue of material (component/inputs/test facility)

whichever is later.

2. Delivery schedule shall be as indicated in Fig.1 in the RFP. Vendor shall be responsible

to maintain schedule. The date of delivery shall be the period as indicated in the RFP and

is to be calculated from the date of last free issue of material (components/inputs/test

facility) by LEOS. Delays attributable to awaiting clearances/test facilities availability

etc. which are to be provided by LEOS, shall not be taken into consideration for delivery



period. LD clause may be applicable for delay in delivery beyond the delivery period

indicated in Fig-1 and subject to above mentioned conditions.

3. In order to carry out reworks due to reasons like change in design the vendor has to quote

separately on hourly basis for each individual.

4. All reworks due to fabrication, assembly, handling and transportation shall be done by

vendor free of cost and within the delivery schedules.

4.17 PAYMENT TERMS

Payment shall be made either on completion of all activities as per work order or split bills for

each package as per milestone payment terms as provided in Table-10.

Table 10: Milestone Payments For Electronic Packages

Test procedures and test specifications for all stages and end product specification compliance

are provided to the vendor at the start of the contract. Payments shall be made on completing

activities of all stages and meeting the final specifications.

Payment after completion of activity as % of total package costPower Modules 2Nos (%) Total Package level (%) Environmental (%)

Fabrication FBT CardsFabrication

CardTesting

Final Assemblyand testing

Vibration, ThermovacTesting ,FBT & Pre-

Certification- 20 - - 40 40

Activity Month 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36Start of Activity T0Documentation completionCard FabricationCard TestingStack Assembly &TestingIBTT&E T6Delivery of 2nd,3rd,4th Sensor T12Delivery of 5th,6th,7th Sensor T18Delivery of 8th,9th,10th Sensor T24Delivery of 11th,12th,13th Sensor T30Delivery of 14th and 15th Sensor T36

Fig.1: DELIVERY SCHEDULE FOR ELECTRONIC PACKAGES TYPE M3A

End of Phase 1.Deliveryof 1st Package

End of Phase2.Delivery of 15th

electronic



APPENDIX -A

Activities for Fabrication. Assembly, Integration, Testing and Supply ofElectronic Package Type M3A

Electronic Packages Type M3A consist of two Rigid PCB’s of the same type in Main and redundant

configuration and two power modules of the same type in the main and redundant configuration. Power

Modules are independently fabricated, tested, assembled into package form and tested at package level

before integrating them with the Electronic Packages Type M3A. Activities relevant to power modules

are discussed in Appendix B. This section discusses the fabrication, assembly and testing requirements

of electronic Packages Type M3A . A typical drawing of the electronic packages depicting the major

parts is shown in Fig. A1.

120 mm

253 mm253 mm

Figure A1: Typical Electronic Package M3A



Realization of Electronic packages Type M3A involves the following activities

a. Fabrication of the Mechanical Parts as per drawings and their inspection and approval.

Mechanical parts and their details are given in SectionA1.

b. Fabrication of the Rigid PCBs as per spool files, their inspection and approval. Details of PCB’s

are indicated Section A2, and Section 4.

c. Receipt of components and their inspection. Component details are indicated in Table-A3.

d. Wiring of PCB’s including mechanical mounting of connectors, heat sink plates etc followed by

radiation shielding, coating and potting. PCB wiring requirements are indicated in terms of

activities and time is shown in Table-A4 and Section 4.

e. Testing of PCB’s. (Section A3, Section 4)

f. Final assembly of the package. (Section A3, Section 4)

g. Ambient Performance Tests (Section A3, Section 4).

h. Environmental tests (Section A3, Section 4)

i. Final Ambient Performance tests of the package. (Section A3, Section 4)

j. Results compilation and package certification. (Section A3, Section 4)

A1 Mechanical parts details

The various mechanical parts of electronic Packages Type M3A are shown in Table-A1. The detailed

mechanical diagrams are enclosed in Fig-A2 to Fig-A4. The activities involved in fabrication of these

parts are discussed in Section 4.Table A1: Mechanical parts details

Mechanicalpart Sub assembly Dimension

Main housing 1 Refer drawings ofmajor mechanicaldrawings shown inFig-A2,Fig-A3,Fig-A4. Part tolerances tobe strictly followed.

Tray type housing 2

Cover plates 1Shield plate for Chasiscomponents 1

Screws and Spacers 6



Fig- A2: Typical Mechanical Dimensions of Electronic Packages Trays-2Nos

REPRESENTATIVE MECHANICAL DIAGRAMS FORELECTRONIC PACKAGES TYPE M3A

All dimensions in mm



Fig A3: Typical Mechanical Dimensions of Electronic Packages Cover plates-2Nos




8

Fig A4: Typical Mechanical Dimensions of Electronic Packages Bottom Box-1Nos


253253

45



A2 PCB fabrication details

The electronic Packages Type M3A consist of two identical PCB’s whose dimensions and componentcount in each card is shown in Table-A2. The component type and quantity for each type is shown inTable- A3. The activities involved in wiring of these PCB’s is discussed in Table-A4 and Section 4.The PCB’s are rigid PCB’s which are manufactured to aerospace standards with all the necessarytests and reports and the material used is Polyimide. PCBs are to be sourced from ISRO approvedvendors including Group B reports.

Table-A2: PCB detailsPCBNo

Layers Dimension Componentcount

No of PCBs/packageL W

1 10 248 200 503 2

Table-A3: Component list for Electronic Packages Type M3AComponent Style Quantity/Card Qty /package

CFP14 4 8CFP16 8 16CFP24 1 2CFP28 1 2CFP36 3 6CFP48 7 14CFP86 3 6

CQFP352 1 2MBCFP16 4 8

MFP20 1 2SOIC16 1 2SOP64 4 8

DO213AA 6 12DO7/DO35 4 8

TO257 1 2Diode SMD 9 18

Transistor SMD 23 46TO5/TO39 5 10

TO3 4 8TO78 1 2

RM1206 224 448RWR80 17 34

CDR 131 262CTC 26 52

DSUB-MICRO-9P-PCB-90 4 8DSUBN-15S-PCB-90L5 1 2DSUBN-25P-PCB-90L5 1 2

DSUB-MICRO-21P-PCB-90 1 2FRB-41-FD 4 8

DSUBN-37P-PCB-90L4 1 2TRANSFORMER –FP-8 PIN 2 4



Table A4: PCB WiringS.No CARD

FABRICATIONNo of subactivities Approx Man Hours Manpower

Involved1 Card-01 M a Component Segregation 360 Table 3.2,

Sl.No 3.

Activity issupported byPersonnel fromTable 3.2Sl.No 1,2 forspecific minoractivities.

b Bare PCB Cleaning, Baking and PTH fillingc SMD Component Mounting and Inspectiond Flatpacks tinning and Lead formatione Flatpack Mounting and Inspectionf Soldering of componentsg Leaded component mountingh Chotherm component mountingi Cleaningj Inspection before FT and photographsk DAM and Fill of Flatpacksl Radiation shielding, Conformal Coating and Pottingm Connector Mounting ,Torquing and Ecobondingn Inspection before FT and photographs

2 Card-01 R a Component Segregation 360 Table 3.2,Sl.No 3.

Activity issupported byPersonnel fromTable 3.2Sl.No 1,2 forspecific minoractivities.

b Bare PCB Cleaning,Baking and PTH fillingc SMD Component Mounting and Inspectiond Flatpacks tinning and Lead formatione Flatpack Mounting and Inspectionf Soldering of componentsg Leaded component mountingh Chotherm component mountingi Cleaningj Inspection before FT and photographsk DAM and Fill of Flatpacksl Radiation shielding,Conformal Coating and Pottingm Connector Mounting ,Torquing and Ecobondingn Inspection before FT and photographs



A3 Card and Package Testing details

Electronic Packages Type M3A undergo card level tests once the PCB’s are fabricated. The cards areassembled t into a package form and tested at an integrated level. Once the performance is ensured,the package under goes environmental tests and alignment.

Electronic Packages Type M3A underogo vibration and thermovac. Electrical performance ofElectronic packagess is tested prior to and after these test and during the test for acceptancethermovac. Package will undergo Vibration on a vibration shaker as per the levels specified by LEOSand thermovacum performance checks in a thermovacum chamber. The package is to be preparedfor the tests, tested to the required levels and its conformance to the test matrix to be monitored. Thepackage performance is to be ensured throughout the test and adequate monitoring for specifedparameters to be logged in a periodical basis

A list of tests that are carried out on the package and the corresponding references for the subactivities are given in Table-A5. Table-A6 gives a list of the activities at various stages, theresponsibilities of the personnel and the approximate time involved in the activities. The thermovacprofiles are shown in Fig-A5. The flowcharts of the inputs for the various activities and the activitysequence are indicated in Fig-A6 to Fig-A11. A detailed list of the activities involved in testing arealso discussed in Chapter 4.

Table-A5: Card and Package Wiring, Assembly and Testing detailsS.No Activity Activity Reference

1 Card Wiring Table A42 Card level Functional Tests Table A6: Card and

Package levelActivities

3 Package Assembly4 Package level tests



Table A6: CARD AND PACKAGE LEVEL TESTSS.No CARD TESTS No of sub activities Approx

Man HoursManpowerInvolved

A.Testing Activities1 Passive and Active Checks of Card- 01 M a Support activities for Card wiring 55 Test

EngineersTable 3.2Sl.No1

b Passive checks and visual inspectionc Test setup preparation and functional testsd Photographs

2 Passive and Active Checks of Card- 01 R a Support activities for Card wiring 55b Passive checks and visual inspectionc Test setup preparation and functional testsd Photographs

3 Package Assembly As per assembly document 404 Ambient Performance Checks including

EEPROM fusing.a Integrated mode test with all cards 36

5 Package level Testing after vibration a Integrated mode test with all cards 306 Package level Testing in Thermovac a Testing with monitoring 367 Package level Testing FBT a Integrated mode test with all cards 30

8 Data compilation and preparation forcertification

Compiling of test data of all stages and reportgeneration

32

B. Mechanical Activities9 Inspection of Mechanical parts after fabrication

parts matching, reports preparation for clearance32 Mechanical

Engineers.Table3.2 SlNo 2

10 Helicoil fixing 811 Inspection of parts after thermal treatment 812 Card level connector mounting activities 413 Radiation shielding parts preparation 1614 Package assembly 4015 Vibration preparation and vibration test As per ETLC levels 12



Ambient

Fig A5: Thermovac Test Profile

Temperature: Ambient : +25°C ; Hot: 50° C ; Cold: -10°C

Profile: 5 short cycles,2 hrs dwell at each extreme temperature,2 long cycles of 24hrs dwell.

Hot

Cold

1 2 3 4 5#

#

#

#

# : Measurements

##



FLOWCHARTS FOR FABRICATION, ASSEMBLY, INTEGRATION ANDTESTING OF ELECTRONIC PACKAGES TYPE M3A

PCB’s READINESS(To be fabricated by

Vendor)

MECHANICAL PARTSREADINESS(To be fabricated byVendor)

START

A

CONSUMABLESREADINESS

(To be P by Vendor)

COMPONENTSREADINESS

(Will be given byLEOS)

B C D

Fig A6: INITIAL READINESS FOR ELECTRONIC PACKAGES



Fig A7: PCB READINESS FOR ELECTRONIC PACKAGES

A

YES

NO

Collect PCB Spool files andMechanical Drawings from LEOS

Issue Work order for PCB fabricationfrom LEOS approved Sources

Fabrication of PCB by LEOS approvedsources through Vendor

Submit the fabricated PCB with all thereports to LEOS for clearance for flightuse

Do necessary Rework orFabricate new PCB

PCB’s are ready for flight use

A1

PCBcleared



Fig A8: CONSUMABLES READINESS FOR ELECTRONIC PACKAGES

B

Collect list of all consumablerequired and their quantity from

LEOS

Issue of Work order for procurementfrom LEOS approved Sources by

Vendor

Receipt of consumables and theirinspection by Vendor

Submit the received consumables withall the reports to LEOS for clearancefor flight use

Return and procure thecorrect consumables

Consumables are ready for flightuse

A2

Consumablescleared

YES

NO



Collect approved drawings from LEOS

Fig A9 MECHANICAL PARTSREADINESS FOR ELECTRONICPACKAGES

A3

C

Submit Received Materials and reportsto LEOS for clearance for fabrication

Parts matching by vendor

Anodizing of all aluminum parts asper anodizing drawings

Helicoil fixing / matching

Thermal treatment as per drawings

MECHANICAL PARTS REDY FORASSEMBLY

Issue of Work order for procurement ofmaterials from LEOS approved

Sources by Vendor

Materialscleared

Fabricate the Mechanical parts throughLEOS approved Sources

Partscleared

Submit fabricated parts and inspectionreports to LEOS for clearance for thermal

treatments fabrication

Reprocure thematerial

Refabricate theparts or doreworks

YES

YES

NO

NO



Collect Components from LEOS

Inspect the components as percomponents list

If not correct or get the necessaryclarifications from LEOS

Return the componentsand collect new

components

Components are ready for flight use

A4

Componentscleared

YES

NO

D

Fig A10: COMPONENT READINESS FOR ELECTRONIC PACKAGES



Fig A11: OVERALL ASSEMBLY, TEST SEQUENCE FOR ELECTRONIC PACKAGES

PCB WIRING and Readiness for Testing(Refer PCB wiring and Assembly Document for Complete Details)

Package Assembly

Package Level Test after Assembly

Acceptance Vibration

Package Level Test after vibration

Card-1 Main Testing

Card-1 Redundant Testing

DC-DC box Testing (2 Nos)

Card Testing

Active Thermovac Tests

FBT

Pre-Certification and handing over toLEOS

A1 A2 A3 A4



ANNEXURE-BActivities for Fabrication, Assembly, Integration, testing of Power Modules for

Electronic Packages Type M3A

Electronic Packages Type M3A consists of two power modules of the same type in the main and

redundant configuration. Power Modules are independently fabricated, assembled into package form and

tested before integrating them with the Electronic Packages Type M3A. This section discusses the

fabrication, assembly and testing requirements of Power Modules. A typical drawing of the power

Module depicting the major parts is shown in Fig. B1.

97 106

39

FIG B1: TYPICAL POWER MODULE AND ITS DIMENSIONS



Realization of Power Modules involves the following activities

a. Fabrication of the Mechanical Parts as per drawings and their inspection and approval.

Mechanical parts and their details are given in Section B1.

b. Fabrication of the Rigid PCBs as per spool files, their inspection and approval. Details of PCB’s

are indicated Section B2.

c. Receipt of components and their inspection. Component details are indicated in Table-B2

d. Wiring of PCB’s including mechanical mounting of connectors, heat sink plates etc followed by

radiation shielding, coating and potting. PCB wiring activities and typical time required for PCB

wiring is indicated in Table-B3 and Section 4.

e. Testing of PCB’s. (Section B3, Section 4)

f. Temporary package assembly with wired PCBs main and redundant with power modules main

and redundant. (Section B3, Section 4)

g. Initial ambient performance tests. (Section B3, Section 4)

h. Permanent assembly of the package. (Section B3, Section 4)

i. Environmental tests (Section B3, Section 4)

j. Final ambient performance tests of the package. (Section B3, Section 4)

k. Results compilation and package certification. (Section B3, Section 4)

B1 Mechanical parts details:

The various mechanical parts of Power Electronic Modules are shown in Table:B1. The majormechanical parts are shown in Fig-B to Fig-B.The activities involved in fabrication of these partsare discussed in Section-4.

Table B1: Mechanical parts details

Mechanical part Sub assembly Dimension

Main housing 1 Major parts are shown in Fig-B2,Fig-B3,Fig-B4.Parttolerances to be strictlyfollowed.

Cover plates 2

Spacer for PCB 2

Heat Sink 1



Fig B2: POWER MODULE MAIN HOUSING


0.1

830.1

920.1

0.1

0.1

850.1



Fig B3: POWER MODULE COVER PLATE-1

104

95 All dimensions in mm



Fig B4: POWER MODULE COVER PLATE-2

10697 16




B2 PCB fabrication details

The Power Electronic Modules have 2 types of PCB’s whose dimensions and component count in eachcard is shown in Table: B2. The total component count of each t yp e for the Power electronicModules is given in Table-B3. The activities involved in fabrication of these PCB’s arediscussed in Table-B4 and Section 4. PCB material is of type Polyimide. PCBs are to be sourcedfrom ISRO approved vendors including Group B reports.

Table B2: PCB detailsPCB No Layers Dimension Component

countNo of

PCBs/packageL W1 6 101 92 193 12 8 61 92 122 1

Table B3 :Component list for Power Electronic Modules (with 95% accuracy)

Component Style Quantity/Card Qty /packageSOP14 2 4TO46 0 0CFP14 2 4CFP16 0 0Diode SMD 33 66TO5/TO39 8 16TO18 2 4TO78 2 4CDR31 5 10CDR32 7 14CDR33 18 36CDR34 4 8CDR35 16 32CWR29-G 1 2RADIAL 0 0MLCC2225 52 104MLCC1206 2 4RM0505 80 160RM1206 58 116RWR80 4 8CWR29-D 2 4CWR29-H 3 6MLCC1206 2 4TO257 5 10DIP8 2 4TO254 5 10



Table–B4: PCB WiringS.No CARD FABRICATION No of sub activities Approx

Man HoursManpowerInvolved

1 DC-DC converter Card 1 a Component Segregation 180 TechniciansSl.No 3Table 3.2

b Bare PCB Cleaning,Baking and PTH fillingc Heat Sink Mountingd SMD Mountinge Connector Mountingf Coil WindingG TO3/ xx Module mountingh Leaded Component Mounting and Inspectioni Soldering of componentsj Jumper Mountingk Cleaningl Inspection before FT and photographsm Radiation Shielding ,Potting and Conformal Coating0 Connector Mounting ,Torquing and Ecobonding

2 DC-DC converter Card 2 a Component Segregation 180 TechniciansSl.No 3Table 3.2

b Bare PCB Cleaning, Baking and PTH fillingc Heat Sink Mountingd SMD Mountinge Connector Mountingf Coil WindingG TO3 Module mountingh Leaded Component Mounting and Inspectioni Soldering of componentsj Jumper Mountingk Cleaningl Inspection before FT and photographsm Radiation Shielding ,Potting and Conformal Coating0 Connector Mounting ,Torquing and Ecobonding


ELECTRONIC PACKAGES TYPE- M3A of 72

B3 Card and Package Testing details

Power Electronic Modules undergo card level tests once the PCB’s are fabricated. The cards areassembled temporarily into a package form and tested at an integrated level. Tuning is done at thisstage to get the desired performance. Once the performance is ensured, the package is assembledpermanently and under goes for active Thermovac tests. Package level tests are done pre and postThermovac test and during the active Thermovac.

A list of tests that are carried out on the package and the corresponding references for the subactivities are given in Table-B5. Table-B6 gives a list of the activities at various stages, theresponsibilities of the personnel and the approximate time involved in the activities. The thermovacprofiles are shown in Fig-B5. The flowcharts of the inputs for the various activities and the activitysequence are indicated in Fig-B6 to Fig-B11. A detailed list of the activities involved in testing arealso discussed in Chapter 4.

Table-B5: Card and Package Wiring, Assembly and Testing detailsS.No Activity Activity Reference

1 Card Wiring Table B42 Card level Functional Tests Table B6: Card and

Package levelActivities

3 Package Assembly4 Package level tests



Table-B6: CARD AND PACKAGE LEVEL TESTSS.No CARD TESTS No of sub activities Approx

Man hoursManpowerInvolved

1 Passive and Active Checks of Powerelectronics Card 1

a Component Placement verification 64 Test engineersSl.No1 table 3.2b Capacitor polarity verification

c Test setup verificationd Performance verificatione Photographs

2 Passive and Active Checks of Powerelectronics Card 2

a Component Placement verification 64b Capacitor polarity verificationc Test setup verificationd Performance verificatione Photographs

3 Temporary Box Level Tests and Tuning a Performance verification and tuning at box level 24 Test Engineers4 Ambient Performance Checks a Integrated mode test with all cards 24 Test Engineers5 Package Assembly a As per package assembly document 32 Mechanical

EngineersSl.No 2 Table 3.2

6 Package level Testing after assembly a Integrated mode test with all cards 16 Test Engineers7 Package level Testing in Thermovac a Testing with monitoring 36 Test Engineers

and MechanicalEngineers

8 Final Ambient Performance checks a Integrated mode test with all cards 24 Test engineers



FIG-B5: ACCEPTANCE THERMOVAC LEVELS FOR POWER MODULES

Temperature: Ambient : +25°C ; Hot: 50° C ; Cold: -10°C

Profile: 5 short cycles,2 hrs dwell at each extreme temperature,2 long cycles of 24hrs dwell.

Hot

Cold

1 2 3 4 5#

#

#

#

# : Measurements

Ambient



FLOWCHARTS FOR FABRICATION, ASSEMBLY, INTEGRATION ANDTESTING OF POWER MODULES

PCB’s READINESS(To be fabricated by

Vendor)

MECHANICAL PARTSREADINESS(To be fabricated byVendor)

START

E

CONSUMABLESREADINESS

(To be Procured byVendor)

COMPONENTSREADINESS

(Will be given byLEOS)

F G H

Fig B6: INITIAL READINESS FOR POWER MODULES



Collect PCB Spool files andMechanical Drawings from LEOS

Issue Work order for PCB fabricationfrom LEOS approved Sources

Fabrication of PCB by LEOS approvedsources through Vendor

Submit the fabricated PCB with all thereports to LEOS for clearance for flightuse

Do necessary Rework orFabricate new PCB

PCB’s are ready for flight use

B1

PCBcleared

E

Fig B7: PCB READINESS FOR POWER MODULES



Collect list of all consumablerequired and their quantity from

LEOS

Issue of Work order for procurementfrom LEOS approved Sources by

Vendor

Receipt of consumables and theirinspection by Vendor

Submit the received consumables withall the reports to LEOS for clearancefor flight use

Return and procure thecorrect consumables

Consumables are ready for flightuse

B2

Consumablescleared

YES

NO

F

Fig B8: CONSUMABLES READINESS FOR POWER MODULES



Fig B9: MECHANICAL PARTSREADINESS FOR POWERMODULES

Collect approved drawings fromLEOS

Submit Received Materials andreports to LEOS for clearance for

fabrication

Parts matching by vendor

Anodizing of all aluminium parts asper anodizing drawings

Helicoil fixing / matching

Thermal treatment as per drawings

MECHANICAL PARTS REDY FORASSEMBLY

B3

Issue of Work order for procurement ofmaterials from LEOS approved Sources

by Vendor

Materialscleared

Fabricate the Mechanical partsthrough LEOS approved Sources

Partscleared

Submit fabricated parts and inspectionreports to LEOS for clearance for

thermal treatments fabrication

Reprocure thematerial

Refabricate theparts or doreworks

YES

YES

NO

NO

G



Collect Components from LEOS

Inspect the components as percomponents list

If not correct or get the necessaryclarifications from LEOS

Return the componentsand collect new

components

Components are ready for flight use

B4

Componentscleared

YES

NO

H

Fig B10: COMPONENTS READINESS FOR POWER MODULES



Initial Bench Tests

Package Assembly

Package Level Test after Assembly

Active Thermovac Tests

FBT

Card-1 Testing

Card-2 Testing

Temporary Assembly,Testingand Tuning

Card Testing

CARDS FABRICATION(Refer Assembly Document for Complete Details)

B1 B2 B3 B4

Fig B11: OVERALL FABRICATION, ASSEMBLY AND TEST SEQUENCEFOR POWER MODULES



APPENDIX-CTYPICAL LIST OF CONSUMABLES USED FO R ELCTRONIC PACKAGES

TYPE M3ACONSUMABLE FOR PCB WIRING

Sl.No Item Description Known Sources Approx QuantityRequired

1 Electronic Grade Isopropyl AlcoholAs per LEOS specification

EMEREK Brand,SAP Specialities 20 Ltrs

2 Conformal coating Material(PartA,Part B, S 8)

1 Kit/6Months

3 Dow Coming RTV3145 Gray Colouronly

Dow Corning India (P)Ltd, MumbaiTentacle aerologistix pvt ltd, Bangalore

2 tubes/package

4 Adhesive Tape like Polymide,Kapton, Copper PTFE Etc.

Intek Tape(P) ltd, Bangalore3M,USA Inde enterprises, Chandigarh

1 reel

5 Electrical Grade Copper Sheets Sri.Anugraha Enterprises, BangaloreShanti Metals, Bangalore

6. Polyolefin Tubing 1.6mm 3M India Ltd; Bangalore 2mtrs7. Panduit Terminals Liberty International India Ahmedabad

Advance Tech services New Delhi8. Ultrapure Solder wire As per F.S

QQ-S-571F SN63B.T.Solders(P)Ltd:Bangalore-94AAIM Inc,Canada HIE2S4Multicore Solders Ltd;HPw 4RQ-UK

100 gms

9. Insulation Bushes for Diode &Transistors

Nanni Engineering Works,Bangalore-54 1mtr/package

10. Solder Bar As per QQ-S-571F SN63 Advance Tech services Bangalore 2.5Kg/ 6 meters

11. Harnessing materials like cableties/Bushes

Inde Enterprises, ChandigarhElectrical terminal service USA

20 Nos/package

12.Self Adhesive polyester Filmlabels

Brady corporation Bangalore 1 Reel/10 Pkgs

13 Liquid FluxType R&RMA B.T.Solders(P) ltd; MysoreSumitron exports(P) ltd; New Delhi

5 Litres/6 Months

14 ConapCE1155 (Part A, Part B,CS8)

Tentacles aerologistix(P) LTD;BangaloreLiberty International 15852, USA

1 Kit /6 Months

15 Turrets Sumitron Exports Bangalore 25 nos16 Lacing Thread Sumitron Exports Bangalore

Tag international INC, USA2 reel for allpackages

17 Tantalum sheet 300 x 230 mm-4Sheet18 Chotherm Tentacles aerologistix(P) LTD;

Bangalore, Syschotech300 x 230 for 10Pkgs. 4 Sheets/10packages

19 DC 93500 1 kit/6 months20 SIL pad 50 x50mm / pkg21 Lint Free tissues 1 box/6 months



CONSUMABLE REQUIRED FOR MECHANICAL ACTITIVTIES

Sl.No Item Description Known Sources Approx QuantityRequired

22 Selflock Helicoils Armstrong Fasterning Systems,UK 32 Numbers withdifferent sizes perpackage

23 Aero tight Locking Nuts Apex stainless steel fastenerslimited unitUK Precision stainless fasteners UK24 Non Magnetic SS 316 cheese head

& CSK Screws, Washers as perDIN/ISO

Avdel India Ltd, BangaloreLPS Bossard(P)Ltd,New Delhi

CSK screws M4=8NosWashers M2.5=24 Nosplane and 24 Nosspring

25 100% Non Magnetic SS316 specialwashers &Spacers

Nanni Engineering Works, Bangalore

27 Ecobond 286 1 Kit/2 packages

27 Thermal grease 1 Kit

Note: List is only representative and not exhaustive



APPENDIX D

TYPICAL LIST OF EQUIPMENT REQUIRED FOR CARD/PACKAGE

FABRICATION AND ASSEMBLY

WIRING EQUIPMENTSl.No Equipment

1 Soldering Stations(Weller,ERSA)2 soldering bits of different sizes3 Cutter4 Tweezer5 Thermal Wire stripper6 Manual wire stripper7 Crimping tool8 Crimping insert removal tool9 Noseblair

10 Hot air blower11 PCB mounting stands12 Turret swaging equipment15 Stands for holding blower

16Weighin Balance 0.01gms to500gms

17 Weighin Balance 1gms to 5kg18 Lead forming equipment19 Baking Oven20 Ultrasonic cleaning21 Vapour degreaser22 Nitrogen purging storage23 Vinyl tables with ESD mats24 Laminar Flow tables25 Magnifiers (6X,8X,40X)

26Trays and beakers formixing,cleaning

27 ESD brushes28 Tools for conformal coating29 Tools for potting,DAM and fill30 ESD wristraps31 ESD coats ,caps,slippers

MECHANICAL EQUIPMENTSl.No Equipment

1 Steel Rule2 Twezer3 Comperssor air supply4 Grinding machine5 Torque wrench with bits6 Screw drivers7 Allen Keys Set8 M2,M2.5,M3 Allen and CSK screw bits9 Air Blow Brush

10 Scissors11 4.5mm Femal nut drive bit12 4.0 mm male nut drive bit13 Flush cutter14 Penvac15 Mixing and Potting Acessories16 Teflon Twezer17 Glass rods18 Finger cots19 Drill bits20 Files21 Cutting Pliers22 Hammer23 Mallet Hammer24 Helicoil insert tools and accessories25 Helicoil tape set26 Drilling Machine27 Files set28 Vernier claipers29 Micro height30 Feeler gauge

Note: List is only representative and not exhaustive



APPENDIX-ETYPICAL LIST OF TEST EQUIPMENT USED FOR ELCTRONIC PACKAGES

TYPE M3A

Serial No Test Equipment Remarks

1 Power Supplies Will be

provided by

LEOS

2 Digital Multimeters

3 Oscilloscopes

4 Function Generator

5 Decade Resistance Box

6 On-line Monitors

7 Clip on meter

8 Current Probe Amplifier

9 LCR Meter

10 Simulators for Electronic packages

11 Card test jigs

12 Test consoles

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