Electronic Costing & Technology Experts - System Plus …C_R… · · 2014-07-17DISCLAIMER :...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

June 2014 – Version 1 – Written by Romain Fraux

http://www.systemplus.fr/index.php?lang=ge&page=home.php

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

mailto:[email protected]

Bosch BMA355 3-Axis WLCSP Accelerometer

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Glossary1. Overview / Introduction 4

– Executive Summary– Reverse Costing Methodology

2. Company Profile 7– Bosch Sensortec– BMA355 Characteristics

3. Physical Analysis 12– Synthesis of the Physical Analysis– Physical Analysis Methodology– Package 15

– Package Views, Dimensions & Pin Out– Package Opening– Package Cross-Section

– TSV – Redistribution

– ASIC 36– View, Dimensions & Marking– Delayering– Main Blocks Identification– Process Identification

– Technology node, Capacitors, Memories– Cross-Section

– Thickness, Metal Layers– Process Characteristics

– MEMS 51– View, Dimensions & Marking– Bond Pad Opening & Bond Pad– Cap Removed & Cap Details– Sensing Area Details– Cross-Section

– Cap & Sealing– Sensor, Bond Pads

– Process Characteristics

4. Consumer 3-Axis Accelerometers Comparison 81

5. Manufacturing Process Flow 85– Global Overview– ASIC FEOL & BEOL Process– ASIC TSV Via-Middle Process Flow– ASIC Wafer Fabrication Unit– MEMS Process Flow– MEMS Wafer Fabrication Unit– Wafer-Level Packaging Process Flow & Assembly Unit

6. Cost Analysis 110– Synthesis of the cost analysis– Main steps of economic analysis– Yields Hypotheses– ASIC 115

– ASIC FEOL & BEOL Cost– ASIC TSV Cost– ASIC TSV Cost per Process Steps– ASIC Total Front-End Cost

– MEMS 120– MEMS Front-End Cost– MEMS Front-End Cost per process steps– MEMS Probe Test & Dicing Cost– MEMS Wafer & Die Cost

– Wafer-Level Packaging 129– Wafer-Level Packaging Cost– Wafer-Level Packaging Cost per process steps– Total Wafer Cost

– Back-End : Final Test & Calibration Cost– BMA355 Component Cost

7. Estimated Price Analysis 141– Manufacturer Financial Ratios– Estimated Selling Price

8. Consumer 3-Axis Accelero Cost Comparison 146

Contact 148


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the Bosch BMA355 WLCSP 3-Axis Accelerometer.

• The BMA355 is a 12-bit digital resolution accelerometer well suited for applications requiring

extremely small form factors.

• With a size of only 1.4mm3 (1.2x1.5x0.8mm), the BMA355 is the smallest MEMS accelerometer on

the market and features 60% volume reduction compared to state of the art 2x2x0.9mm MEMS

accelerometers.

• This size reduction has been made possible by the use of a WLCSP package where all the

manufacturing steps are realized at the wafer-level.

• To interconnect MEMS and ASIC with a WLCSP package, Through-Silicon Vias (TSVs) are used,

introducing the first MEMS component with TSV Via-Middle process.

• The report is including a detailed technical and cost comparison with state of the art MEMS

accelerometers from STMicroelectronics and mCube.


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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• The die marking includes the logo of Bosch and:

BAA256CB

BOSCH

2012

ASIC Die Marking


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• The die marking includes:

BOSCH

CMA332M

MEMS Die Marking


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

Electronic Costing & Technology Experts - System Plus …C_R… · · 2014-07-17DISCLAIMER :...

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