Electronic Costing & Technology Experts - System Plus
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DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected] October 2015 – Version 1 – Written by Sylvain Hallereau
Transcript of Electronic Costing & Technology Experts - System Plus
DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.
© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]
October 2015 – Version 1 – Written by Sylvain Hallereau
GaN Systems GS66508T – AT&S Top Cooled ECP Package
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 2
Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Companies Profile 8
– AT&S Profile
3. GS66508T Characteristics 11
– GS66508T Characteristics
4. GS66508T Packaging Physical Analysis 14
– Physical Analysis Methodology
– Package
– Views & Dimensions
– Marking
– Top-Side Delayering
– Bottom-Side Delayering
– Package Cross-Section
– Overview
– Through-Vias Cross-Section
– Micro-Vias Cross-Section
– EDX Material Analysis
– Die
– Redistribution Cross-Section
– Die Views & Dimensions
– GaNpx – ECP® technology
– Adaptation of AT&S ECP® package for high voltage power
– Comparison with GaNpx Bottom-Side Cooling
5. Manufacturing Process Flow 44
– Global Overview
– GaNpx Packaging Fabrication Unit
– GaNpx Packaging Process Flow
6. Cost Analysis 50
– Main steps of economic analysis
– GaNpx package
– Yields Hypotheses
– ECP Panel Efficiency
– GaNpx package Cost
– GaNpx package Cost per process steps
– GS66508T Component
– GS66508T Final Test Cost
– GS66508T Component Cost
7. Selling Price Estimation 61
8. Cost Comparison with Bottom-Side Cooling 65
Contact 68
GaN Systems GS66508T – AT&S Top Cooled ECP Package
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 3
• This full Reverse Costing study has been conducted in order to give insight on technology data andmanufacturing cost of the ECP power package “GaNpx” used in the GS66508T from GaN Systems.
• The GS66508T package contains one Normally-off HEMT GaN on Si. The GS66508T drives 30A at25°C for 52 mohms and 20A at 150°C for 136 mohms .
• The component offers a GaN HEMT transistor in an innovating package developed by AT&S andGaN Systems.
• The component is provided in a specific Low inductance GaNpx™ package (AT&S ECP®Process) , PCB embedded die package, compatible with SMD process.
• The GaN Transistor has a current density of 2.4A per mm² at 25°C under 650V.
• The Top Cooled package is the second generation of the ECP power package from AT&S.
• The packaging is realized by AT&S and is assumed to take place in a plant in Austria.
GaN Systems GS66508T – AT&S Top Cooled ECP Package
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 4
6.9mm
4.4mm
• The GaN HEMT is assembled in a GaNpx Top cooled package.
• The package is 6.9mm x4.4mm x0.51mm
• The source and drain solder pads are located along the periphery on each side of the package.
• The gate pad and a source-sense pad are on the side.
• The thermal pad is on the top of the package. The thermal pad is connected electrically with the source.
0.51mm
Top view Back view
Drain solder pad
Source solder pad
Thermal pad
G
Side view
G
GaN Systems GS66508T – AT&S Top Cooled ECP Package
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 5
GaN Systems GS66508T – AT&S Top Cooled ECP Package
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 6
Assembly & Cavity
Formation
• Laser drilling of fiducials and Copper foil
Assembly & Cavity
Formation
•Printing of adhesive
•Vaccum treatment
Assembly & Cavity
Formation
Assembly & Cavity
Formation
GaN Systems GS66508T – AT&S Top Cooled ECP Package
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 7
GaN Systems GS66508T – AT&S Top Cooled ECP Package
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© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 8
• Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimatescompleted by industry experts.
• Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 20% correction on themanufacturing cost (if all parameters are cumulated)
• These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
