EB100 - iCE40 Ultra Wearable Development Platform User Guide

iCE40 Ultra Wearable Development Platform User Guide

EB100 Version 1.0, July 2015

2

iCE40 Ultra Wearable Development Platform

IntroductionThe iCE40 Ultra Wearable Development Platform is an easy-to-use platform which demonstrates how the iCE40 Ultra and MachXO2 FPGAs can be utilized in wearable and mobile applications. Along with the evaluation board and acces-sories, there are reference designs available to demonstrate the functionality of the boards and components.

The iCE40 Ultra Wearable Development Platform consists of two boards: the Main Board and the Sensor Board. The Main Board contains the iCE40 Ultra and MachXO2 FPGAs, which drive various components on the board. The iCE40 Ultra focuses on interfacing with peripheral components such as LEDs, sensors and BLE connectivity. The MachXO2 focuses on driving the MIPI DSI Display from a Quad SPI flash functioning as a frame buffer and storage device. The Sensor Board contains several sensors that are typically found in mobile and wearable devices. By separating the two boards, the interconnect headers can be used to directly interface with peripherals for testing (see the Headers section).

The contents of this user guide include a description of the board features, header connection descriptions and pinouts, instructions on loading demonstration bitstreams, a complete set of schematics, and the bill of materials.

FeaturesThe iCE40 Ultra Wearable Development Platform includes:

• iCE40 Ultra Wearable Development Platform Main Board:— iCE40 Ultra (iCE5LP-4K-SWG36) device in a 36-ball WLCSP package— MachXO2 (LCMXO2-2000ZE-1UWG49) device in a 49-ball WLCSP package— High-current IR, White, and RGB LEDs— Stereo Microphones— Connector and driver circuitry for MIPI DSI Display— Headers for I2C, SPI, and UART— Mini-USB programming connection— Battery charger— RoHS-compliant packaging and process

• iCE40 Ultra Wearable Development Platform Sensor Board:– Bluetooth Low-Energy Module– Heart-rate/SpO2 Sensor and Analog Front End– Skin temperature sensor– Pressure sensor– Accelerometer/Gyroscope– Pads for soldering on battery (charger accepts Li-Ion and Li-Po)

• Syma 652030 Battery – 3.7 V, 250 mAh Lithium-Polymer Battery provides power while the USB cable is discon-nected

• LG LH154Q01 Display – 240x240 Single Lane MIPI DSI Display. Must be attached prior to power-up

• USB Connector Cable – A mini-USB port provides power and a programming interface for the board

• Watch Strap – A watch strap comes pre-attached to the Sensor Board

Note: Static electricity can severely shorten the lifespan of electrical components. Use care while handling the iCE40 Ultra Wearable Development Platform to avoid ESD damage.

3


Figure 1 through Figure 4 show the top and bottom sides of the Main and Sensor boards, with key features high-lighted.

Figure 1. Main Board (Top Side)

Figure 2. Main Board (Bottom Side)

Reset Button

User LEDs (XO2)

RGB LED

High-Brightness LED

IR LED

Battery Charger Status LEDs

Microphone (L)

Display ConnectorMachXO2

iCE5LP Config LED MachXO2 Config LED

iCE5LP

FTDI Power JumperLED Select Jumper

Microphone (R)

Power Switch

FTDI Programming Chip

Mini -USB Socket

Battery Charger

Backlight Driver

4


Figure 3. Sensor Board (Top Side)

Figure 4. Sensor Board (Bottom Side)

Heart Rate/Oxygen Sensor Analog Front End

Bluetooth Low -Energy Module

Pressure Sensor

Accelerometer/Gyroscope

Heart Rate/Oxygen Sensor

Skin Temperature Sensor

5


Lattice Semiconductor DevicesThe Main Board features an iCE5LP4K and a MachXO2-2000ZE FPGA.

The iCE5LP4K has a 1.2 V core supply and is packaged in a 36-ball WLCSP package. For a complete description of this device, see DS1048, iCE40 Ultra Family Data Sheet.

The MachXO2-2000ZE has a 1.2 V core supply and is packaged in a 49-ball WLCSP package. For a complete description of this device, see DS1035, MachXO2 Family Data Sheet.

Software RequirementsThe following software must be installed before designs can be developed for this board:

• iCEcube2 2014-12 (or higher)

• Diamond® 3.4 (or higher)

• Diamond Programmer 3.4 (or higher)

This software is available at the Lattice website Design Software & IP page.

Board PowerThe iCE40 Ultra Wearable Development Platform uses the USB connection as its primary source of power. It is also equipped with a battery and charger for use without a wired connection. A power switch (SW2) allows for the regulators to be disabled while allowing the battery to continue charging. Two status LEDs allow the battery charger to be monitored (see Table 12).

The battery charger and regulators are located on the Main Board. The battery attaches to the Sensor Board. Power is transferred between the two boards using the Power Connector header. See Table 2 for connections.

The VREG_ADJ I/O supply net for the iCE5LP is adjustable, but is an internal, reserved feature. Changing this net from 3.3 V (default) to 1.8 V will cause voltage-level mismatches that can permanently damage the iCE5LP.

To allow current measurements to be made for specific supplies, resistors with test points have been inserted into the circuit. Refer to Table 1 to see which test points correspond to which supplies.

Table 1. Supply Current Test Points

Supply TP+ TP- Resistance

MachXO2 1.2 V TP20 TP21 0.5 Ohms

MachXO2 3.3 V TP18 TP19 0.5 Ohms

iCE5LP 1.2 V TP20 TP33 0.5 Ohms

iCE5LP 3.3 V TP18 TP32 0.5 Ohms

3.3 V Regulator TP16 TP17 0.5 Ohms

Display 3 V TP25 TP24 0.5 Ohms

Display 1.8 V TP22 TP23 0.5 Ohms

www.latticesemi.com/view_document?document_id=50666

http://www.latticesemi.com/en/Products/DesignSoftwareAndIP.aspx

www.latticesemi.com/view_document?document_id=38834

6


HeadersFour headers are used to connect the Main Board and the Sensor Board. The signals and connections are shown in the tables below:

Figure 5. Headers

Power Connector (Main Board J7, Sensor Board J5): Power connection between the two boards

Table 2. Power Connector

I2C Connector (Main Board J5, Sensor Board): Interface for pressure sensor, temperature sensor, and accelerom-eter/gyroscope

Table 3. I2C Connector

SPI Connector (Main Board J6, Sensor Board): Interface for the Analog Front-End of the Heart Beat/SpO2 sensor

Table 4. SPI Connector

Pin Number Signal Description

1 3V3 Regulated 3.3 V supply

2 BT_3V7 Unregulated ~3.7 V battery voltage

3 VREG_ADJ Adjustable I/O Voltage (3.3 V default)

4 GND Ground

Pin Number Signal iCE5LP Ball #

1 Sensor SCL C1

2 Sensor SDA E2

Pin Number Signal iCE5LP Ball #

1 AFE SCLK D6

2 AFE MISO F6

3 AFE Ready B5

4 AFE SS D5

5 AFE MOSI E6

6 GND —

SPI Connector

I2C Connector

Power Connector

BLE Connector

7


BLE Connector (Main Board J3, Sensor Board): Contains a UART connection to iCE5LP and a configuration SPI connection for the iCE5LP

Table 5. BLE Connector

JumpersThe following jumpers can be used for adjusting board functionality:

• High-current LED select (J50): Controls whether the IR LED (1+2) or High-current White LED (2+3) is driven by the iCE5LP device

• FTDI Power (J51): To minimize power consumption and increase battery life, the FTDI programming chip can have its power supply cut-off by removing the jumper from J51. J51 must be in place prior to powering up in order to program the devices on this board.

Pin Number Signal Ball #

1 BLE Prog MachXO2 G2

2 BLE SS Config

3 BLE MISO Config

4 BLE MOSI Config

5 BLE SCLK Config

6 CRSTb —7 CDONE MachXO2 E3

8 UART Rx (out) iCE5LP F5

9 UART Tx (in) iCE5LP E5

10 GND —

8


Test PointsSeveral test points have been included into the design to ease debug. Descriptions of these test points can be found below:

Table 6. Main Board Test Points

Test Point Signal/Function

1 Configuration Signal: CResetn_FTDI

2 Configuration Signal: iCE_CDONE

3 Configuration Signal: FTDI_TCK (XO2)

4 Configuration Signal: FTDI_TDI (XO2)

5 Configuration Signal: FTDI_TDO (XO2)

6 Configuration Signal: FTDI_TMS (XO2)

11 Configuration Signal: JTAGEN (XO2)

12 Configuration Signal: PROGRAMN (XO2)

13 Configuration Signal: INITN (XO2)

16 Current Measurement (See Table 1)










28 Configuration Signal: FLASH_MISO (iCE)

29 Configuration Signal: FLASH_MOSI (iCE)

30 Configuration Signal: FLASH_CSB (iCE)

31 Configuration Signal: FLASH_SCLK (iCE)



34 3.3 V Regulator Output Control (See TPS7A7200)



9


Table 7. Sensor Board Testpoints

Device InterconnectsSix general purpose connections have been made between Lattice MachXO2 and iCE5LP devices for communica-tion between FPGAs. Level translators have been implemented on these lines, which limit their operation fre-quency. Table 8 lists connection ports and maximum operation frequencies:

Table 8. MachXO2 and iCE5LP Interconnections

Test Point Signal/Function

1 AFE4403: CLKOUT

2 BLE Config: SWCLK

3 LPS25H: INT1

4 AFE4403: TX3

5 AFE4403: INN

6 AFE4403: INP

7 AFE4403: ADC_RDY

8 AFE4403: LED_DRV_SUP

9 AFE4403: VCM

10 AFE4403: TXP

11 AFE4403: TXN

12 Battery Connector (+)

13 Battery Connector (-)

14 LSM330DLC: INT1_G

15 LSM330DLC: INT2_G

16 BLE Config: SWDIO

17 AFE4403: Manual Reset, short to TP18

18 AFE4403: Manual Reset, short to TP17

Net Number MachXO2 Ball iCE5LP Ball Max Frequency

1 E6 C2 20 MHz

2 E5 B1 20 MHz

3 D5 D2 100 MHz

4 D4 B2 100 MHz

5 G4 B4 100 MHz

6 F4 F4 100 MHz

10


DisplayThe iCE40 Ultra Wearable Development Platform includes an LG LH154Q01 Display and necessary driving cir-cuitry. MIPI DSI clock and data signals are driven by the Lattice MachXO2 device, through a resistor network for achieving proper voltage levels. This display also provides a frame-sync signal, B_Sync, which is routed to a MachXO2 pin. Display supplies and the backlight driver are controlled by outputs from the MachXO2.

Table 9. Display Signals

Note: For the high-speed differential signals (Clock HS, Data HS) only the positive channel must be assigned, the negative channel will be automatically placed.

Clock SourcesThe Main Board has a single 27 MHz clock source that connects to the Lattice MachXO2 device. To use this exter-nal clock with the iCE5LP device, the 27 MHz clock can be routed from the MachXO2 via one of the six general purpose interconnects. These connections can be found in Table 8.

Table 10. Clock Sources

Reset ButtonA button (SW1) is included for performing resets of systems on board the iCE40 Ultra Wearable Development Plat-form. By default, this button will perform a configuration reset of the iCE5LP, MachXO2, and the Bluetooth module.

Table 11. Reset Resistors and Pins

Note: If VREG_ADJ (see the Board Power section) is changed, these resistors must be removed to prevent voltage level mismatches.

Signal MachXO2 Ball I/O Type

Clock HS+ C4 LVDS25

Clock HS- D3 (Auto) LVDS25 (Auto)

Clock LP+ C7 LVCMOS12

Clock LP- C6 LVCMOS12

Data HS+ C1 LVDS25

Data HS- D2 (Auto) LVDS25 (Auto)

Data LP+ A7 LVCMOS12

Data LP- B6 LVCMOS12

Reset B2 LVCMOS33

B_Sync A3 LVCMOS33

Backlight PWM C3 LVCMOS33

3 V Enable C2 LVCMOS33

1.8 V Enable E2 LVCMOS33

Source Frequency XO2 Ball iCE Ball

Oscillator 27 MHz E4 —

Device Resistor FPGA Ball

MachXO2 R110 B3

iCE5LP R62 —Seeed BLE R63 —

11


LEDsThe Main Board has four system status LEDs, two user LEDs, an RGB LED, an IR LED, and a High-current White LED.

The iCE40 Ultra has I/O ports specially built for sinking current from high-power LEDs. The RGB LED ports (A6, B6, and C6) are able to sink 24 mA each, while the high-current LED port (A2) is able to sink up to 500 mA.

Please note that the IR LED is only rated for 100 mA and can be damaged by incorrectly configuring the port in custom designs. This is not a problem for the RGB LED and High-current White LED, since they are rated for more current than the ports can sink.

The LED functions and FPGA connections are detailed below:

Table 12. Main Board LEDs

Sensors and PeripheralsThe iCE40 Ultra Wearable Development Platform utilizes several third-party devices. Links for more information can be found below:

Table 13. Main Board Sensors and Peripherals

LED Number MachXO2 Ball iCE40 Ball Function

D1 — — Power Source Connected

D2 — — Battery Charging

D3 Config — MachXO2 CDONE

D4 E7 — User LED

D5 F7 — User LED

D8 — Config iCE40 CDONE

D9 (R) — C6 RGB LED (Red)

D9 (G) — B6 RGB LED (Green)

D9 (B) — A6 RGB LED (Blue)

D10 — A2* IR LED (see the Jumpers section)

D11 — A2* High-current White LED (see the Jumpers section)

NameReference Number Interface

FPGA Connections Part Number Link

Microphone U6, U7 I2S iCE5LP: Clock (F3), Data (E3)

MP34DB01 http://www.st.com/web/en/catalog/sense_power/FM125/SC1564/PF250941

http://www.st.com/web/en/catalog/sense_power/FM125/SC1564/PF250941

12


Table 14. Sensor Board Sensors and Peripherals

Flash Memory DevicesThe Lattice MachXO2 and iCE5LP are each equipped with an external SPI Flash memory device.

Table 15. Flash Devices

The iCE5LP external Flash memory is intended for holding configuration data, while the MachXO2 external Flash memory is intended for storing data, such as images for the included display. Because of the target application, the Flash device connected to the MachXO2 is capable of using the higher-bandwidth Quad-SPI protocol.

Table 16. Flash Connections

NameReference Number Interface

FPGA Connections Part Number Link

Temperature Sensor

U7 I2C See Table 3 TMP112 http://www.ti.com/prod-uct/tmp112

Pressure Sensor U3 I2C See Table 3 LPS25H http://www.st.com/web/catalog/sense_power/FM89/SC1316/PF255230

Accelerometer/Gyroscope

U4 I2C See Table 3 LSM330DLC http://www.st.com/web/en/catalog/sense_power/FM89/SC1448/PF252427

Heart Rate & Oxygen Sensor

U6 — — SFH7050 http://www.osram-os.com/osram_os/en/products/product-promo-tions/infrared-products/sensor-family/biomon-sensor-sfh-7050/index.jsp

Analog Front End

U2 SPI See Table 4 AFE4403 http://www.ti.com/prod-uct/afe4403

BLE Module U5 UART See Table 5 Seeed 113050012

http://www.seeedstu-dio.com/wiki/BLE_Micro

Master Device Reference Number Part Number

MachXO2 U5 Micron N25Q032A13ESC40G

iCE5LP U10 Micron M25P80-VMN6TP

Master Device Reference Number Signal FPGA Ball

MachXO2 U5 DQ0 G1

DQ1 F5

DQ2 F3

DQ3 G3

SCLK F6

CS G7

iCE5LP U10 MISO F2

MOSI D1

SCLK E1

CS F1

http://www.ti.com/product/tmp112

http://www.st.com/web/catalog/sense_power/FM89/SC1316/PF255230

http://www.st.com/web/en/catalog/sense_power/FM89/SC1448/PF252427

http://www.osram-os.com/osram_os/en/products/product-promotions/infrared-products/sensor-family/biomon-sensor-sfh-7050/index.jsp

http://www.ti.com/product/afe4403

http://www.seeedstudio.com/wiki/BLE_Micro

13


Board Configuration and ProgrammingLattice MachXO2The Lattice MachXO2 features internal configuration Flash. This allows configuration data to be stored internally while the external Flash memory device is used for auxiliary functions.

1. Ensure that header J51 is shunted and the power switch (SW2) is in the on position.

2. Plug in the mini-USB cable (J1).

3. Launch Diamond Programmer.

4. Select Create a new project from a scan and click Detect Cable.

5. Select the FTUSB-1 Port.

6. Select MachXO2 and LCMXO2-2000ZE in the Device Family and Device columns.

7. Double click on the Operation column and select the appropriate operation.a. Internal Flash: Flash Programming Mode: SPI Flash Erase, Program, Verifyb. External Flash: SPI Flash Programming: SPI Flash Erase, Program, Verify

8. If targeting the External Flash memory, copy the SPI Flash Options from Figure 6.

9. Select the programming bitstream in the “File Name” column.

10. Click the Program Icon or select Program from the Design dropdown menu.

14


Figure 6. MachXO2 External Flash

Lattice iCE5LPThe Lattice iCE5LP can be directly programmed, however, unless single-time programmable NVCM is used, the configuration data will be lost when the device is powered down.

1. Ensure that header J51 is shunted and the power switch (SW2) is in the on position.

2. Plug in the mini-USB cable (J1).

3. Launch Diamond Programmer.

4. Select Create a new project from a scan and click Detect Cable.

5. Select the FTUSB-0 Port.

6. Select iCE5LP and iCE5LP4K in the Device Family and Device columns.

15


7. Double click on the Operation column and select the appropriate operationa. Direct Program: CRAM Programming: Fast Program (Volatile)b. NVCM (Single-use): NVCM Programming Mode: NVCM Program, Verify, Securec. External Flash: SPI Flash Programming: SPI Flash Erase, Program, Verify

8. If targeting the External Flash memory, copy the SPI Flash Options from Figure 7.

9. Select the programming bitstream in the File Name column

10. Click the Program Icon or select Program from the Design dropdown menu

Figure 7. iCE5LP External Flash

16


Pre-Loaded Demonstration DesignThe iCE40 Ultra Wearable Development Platform comes pre-loaded with the Parallel-to-MIPI DSI demo. In order to run the demo, follow these steps:

1. Ensure that the display is attached in the proper orientation, with the connector ribbon extending toward the right edge of the device (see Figure 8).

Figure 8. Display Connector

2. Plug a mini-USB cable into the mini-USB port (J1) to supply power to the device.

3. Switch power switch to the on position.

4. The screen should alternate between two images, with the User LEDs (D4, D5) indicating the demo mode.

For more detailed operation instructions, please refer to the Quick Start User Guide included with the demo design.

This demo design can be reprogrammed onto the board by downloading the project (see the Additional Demon-stration Designs section) and following the documented instructions. Please note that in this demo, the MachXO2 uses its internal Flash to store configuration data and the external Flash to store image data, so two programming procedures must be performed.

17


Additional Demonstration DesignsSeveral additional demonstration designs have been developed for the iCE40 Ultra Wearable Development Plat-form. These designs can be found under the Design File Tab of the Documentation section of the board web page here: http://www.latticesemi.com/ultrawearable.

Ordering Information

Technical Support AssistanceSubmit a technical support case through www.latticesemi.com/techsupport.

Revision History

© 2015 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

Description Ordering Part Number China RoHS Environment-Friendly Use Period (EFUP)

iCE40 Ultra Wearable Development Plat-form

ICE5LP4K-WDEV-EVN

Date Version Change Summary

July 2015 1.0 Initial release.

www.latticesemi.com/techsupport

http://www.latticesemi.com/corporate/legal/index.cfm

http://www.latticesemi.com/ultrawearable

18


Appendix A. Main Board Schematic DiagramsFigure 9. Block Diagram

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

BQ24232

Battery Charger

Regulators

XO2-2000ZE

WLCS49

Bank 0

5035481220

MIPI DSI

Display Connector

Bank 2

Bank 5

N25Q032A

NOR FLASH

Video Frame Buffer

LEDs

iCE40 Ultra

SWG36Bank 0

Bank 2

Bank 1

FT2232H

FTDI USB

SPI Config

JTAG Config

Port 0

Port 1

SPI Header J6

SPI UART CFG Header J3

M25P80

CFG SPI Flash

I2C Header J5

ASCSM-27.000MHZ

27Mhz Oscillator

MP34DB01

Left Microphone

MP34DB01

Right Microphone

RGB LED

Voltage Header J7

Mini USB

Connector

ON/OFF

Switch

Wearable (Top) Main Board

Reset

Push Button

Y2

U6

U7

U9

D9

SW1

U10

J2

U4

U5

D4-D5

U2

J1

U1

SW2

U13,U14,U16

2X3 1X2

2X5

2X6

IR LED

D10

LED

D11

2X2

Connect to Wearable

(Bottom) Sensor Board

Connect to Wearable


Connect to Wearable


Connect to Wearable(Bottom) Sensor Board

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

17

Tue

sday

, Jun

e 02

, 201

5ofof

WE

AR

AB

LE S

OLU

TIO

N -

MA

IN B

OA

RD

19


Figure 10. Mechanical Design

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

Mic

3.3 Reg

Battery Chg

LED Driver

VLED

3, 1.8 Reg

1.2 Reg

SPI J4

Voltage

i2c

A. Front End

Pressure

Acc/

Gyro

Osc

Top

Bottom

Bottom

Top

IR LED

RGB LED

Flash

Button

Switch

iCE

X02

EEPROM

Osc

Osc

Display Conn.

Battery

Conn. Pads

Mic

i2c

SPI+

UART

Voltage

Sensor Board

Main Board

SPI

SPI+

UART

J2

J5

J3

Cutout

Cutout

BLE

Cutout

Boost

Regulator

Cutout

Cutout

PPG

Temp

Cutout

Flash

Level

Shifter

LED Selector

FTDI Power

FDTI USB

Mag

Mag

Mag

Mag

J5

J6

J3

J7

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

27

Tue

sday

, Jun

e 02

, 201

5ofof

WE

AR

AB

LE S

OLU

TIO

N -

MA

IN B

OA

RD

20


Figure 11. Battery Charger Connections

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

Ba

tte

ry C

ha

rge

r C

on

ne

ctio

ns

Iterm is set to be 25 mA.

Default timings are used for timer programming.

5-hour fast charge and 30-minute precharge

Input Current Limit is set to be 500 mA

Fast-charge current is set to be 200 mA

+5V

_US

B

BT

_3V

7

+5V

_US

BB

T_3

V7

VO

UT

_BT

VO

UT

_BT

VO

UT

_BT

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

37

Tue

sday

, Jun

e 02

, 201

5of

B

R4

4.32

K

R04

021%

R6

3.57

K

R04

021%

R3

10K

R04

025%

12

R5

2.94

K

R04

021%C

60.

1uF

16V

C04

02

C2

0.1u

F16

VC

0402

R7

DN

LR

0402

C4

1uF

C04

0216

V

D1

YE

LLO

W

Manufacturer = Lite-On IncPART_NUMBER = LTST-C193KSKT-5A

1 2

D2

GR

EE

N

Manufacturer = OsramPART_NUMBER = LG L29K-G2J1-24-Z

1 2

��

��

��

�

U1

BQ

2423

2M

anuf

actu

rer

= T

IP

AR

T_N

UM

BE

R =

BQ

2423

2RG

TT

TS

1

BA

T1

2

BA

T2

3

CE

_L4

EN

25

EN

16

PG

OO

D_L

7

VS

S8

CH

G_L

9

OU

T1

10

OU

T2

11IN

13

EP

AD

17

TM

R14

ITE

RM

15

ILIM

12

ISE

T16

C1

4.7u

F10

VC

0402

R1

1K R04

025%

R2

2K R04

025%

C5

4.7u

F10

VC

0402

C3

0.1u

F16

VC

0402

WE

AR

AB

LE S

OLU

TIO

N -

MA

IN B

OA

RD

21


Figure 12. USB-FTDI Connections

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

US

B-B

MIN

I

US

B-F

TD

I Co

nn

ect

ion

s

60mA

150mA

EE

DA

TA

EE

SK

EE

CS

VC

C18

FT

V3P

3_F

TD

I

V3P

3_F

TD

I

+5V

_US

B

V3P

3_F

TD

I

V3P

3_F

TD

I

V3P

3_F

TD

I

V3P

3_R

EG

V3P

3_R

EG

V3P

3_F

TD

I

FT

DI_

TC

K[5

]

FT

DI_

TM

S[5

]F

TD

I_T

DO

[5]

FT

DI_

TD

I[5

]

FT

DI_

SC

LK[6

]F

TD

I_D

O[6

]F

TD

I_D

I[6

]

CR

ES

ET

n_F

TD

I[6

]iC

E_C

DO

NE

[6]

FT

DI_

SS

B[6

]

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

47

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

47

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

47

Tue

sday

, Jun

e 02

, 201

5

C9

0.1u

F

C04

0216

V

C12

0.1u

F

C04

0216

V

TP

1

U3

93LC

56B

T

Man

ufac

ture

r =

Mic

roch

ip T

echn

olog

yP

AR

T_N

UM

BE

R =

93L

C56

BT

-I/O

T

CS

5

DIN

3

DO

UT

1

VC

C6

CLK

4

VS

S2

R11

4.7K

5% R04

02

R68

2.2k

R04

025%

R17

10K

R04

025%

12

TP

4

R18

10K

R04

025%

12

Y1

12M

Hz

13

2

4

TP

2

R15

0

5VD-

D+ID

G

US

B P

WR

J1

1

2

3

4

S2

5

S1

S3

S4

C11

10uF

10V

C04

02

C10

0.1u

F

C04

0216

V

C14

0.1u

F

C04

0250

V

C7

4.7u

F

C04

0216

V

R16

1K 5% R04

02

C16

27pF

50V

C04

02

R13

0

TP

5

R10

4.7K

5% R04

02

C17

0.1u

FC

0402

16V

R20

2.2K

5%R

0402

12

C8

0.1u

F

C04

0216

V

R12

0

L1 600o

hm, 5

00m

A

L060

3

C13

10uF

10V

C04

02R

812

k1%

R04

02

R9

4.7K

5% R04

02

R19

10K

R04

025%

12

L3 600o

hm, 5

00m

A

L060

3

TP

3

J51

1X2

HE

AD

ER

_RT

_AN

GLE

PA

RT

_NU

MB

ER

= M

22-5

3302

05M

anuf

actu

rer

= H

arw

in In

c

1

2

C15

27pF

50V

C04

02

L260

0ohm

, 500

mA

L060

3

FT

22

32

H

FT

DI H

igh

-Sp

ee

d U

SB

FT

2232

HQ

U2

PA

RT

_NU

MB

ER

= F

T22

32H

QM

anuf

actu

rer

= F

TD

I

VR

EG

IN50

VR

EG

OU

T49

DM

7

DP

8

RE

F6

RE

SE

T#

14

EE

CS

63

EE

CLK

62

EE

DA

TA

61

OS

CI

2

OS

CO

3

TE

ST

13

AD

BU

S0

16

AD

BU

S1

17

AD

BU

S2

18

AD

BU

S3

19

VPHY4

VPLL9

VCORE112

VCORE237

VCORE364

VCCIO120

VCCIO231

VCCIO342

VCCIO456

AGND10

GND11

GND25

GND311

GND415

GND525

GND635

GND747

GND851

PW

RE

N#

60

SU

SP

EN

D#

36

AD

BU

S4

21

AD

BU

S5

22

AD

BU

S6

23

AD

BU

S7

24

AC

BU

S0

26

AC

BU

S1

27

AC

BU

S2

28

AC

BU

S3

29

AC

BU

S4

30

AC

BU

S5

32

AC

BU

S6

33

AC

BU

S7

34

BD

BU

S0

38

BD

BU

S1

39

BD

BU

S2

40

BD

BU

S3

41

BD

BU

S4

43

BD

BU

S5

44

BD

BU

S6

45

BD

BU

S7

46

BC

BU

S0

48

BC

BU

S1

52

BC

BU

S2

53

BC

BU

S3

54

BC

BU

S4

55

BC

BU

S5

57

BC

BU

S6

58

BC

BU

S7

59

R14

0

TP

6

WE

AR

AB

LE S

OLU

TIO

N -

MA

IN B

OA

RD

22


Figure 13. MachXO2-2000ZE Connections

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

XO

2-2

00

0Z

E C

on

ne

ctio

ns

Duty C

ycle i

s =

80%

NO

R F

lash

0201

LE

D D

RIV

ER

DONE

Pla

ce F

lash

pa

rt a

s cl

ose

to

XO

2 a

s p

oss

ible

27

MH

Z C

lock

MIP

I_C

lock

_out

_HS

_PM

IPI_

Clo

ck_o

ut_H

S_N

MIP

I_D

ata_

0_ou

t_H

S_P

MIP

I_D

ata_

0_ou

t_H

S_N

CD

ON

E

RE

SE

T_X

O2

JTA

GE

N

XO

2_LE

D1

XO

2_LE

D2

B_S

ync

Dis

play

_res

et_L

T

PW

M_C

TR

L

PR

OG

RA

MN

LED

+LE

D-

XO

2_S

CLK

XO

2_C

S

PW

M_C

TR

L

XO

2_D

Q0

XO

2_D

Q1

XO

2_D

Q2

XO

2_D

Q3

INIT

N

MIP

I_C

lock

_out

_PM

IPI_

Clo

ck_o

ut_N

MIP

I_D

ata_

0_ou

t_P

MIP

I_D

ata_

0_ou

t_N

B_S

ync

LED

+LE

D-

MIP

I_D

ata_

0_ou

t_N

MIP

I_D

ata_

0_ou

t_P

MIP

I_C

lock

_out

_N

MIP

I_C

lock

_out

_P

MIP

I_D

ata_

0_ou

t_LP

MIP

I_D

ata_

0_ou

t_LN

MIP

I_C

lock

_out

_LP

MIP

I_C

lock

_out

_LN

Ena

ble_

LED

_1V

8E

nabl

e_LE

D_3

V0

MIP

I_D

ata_

0_ou

t_LP

MIP

I_D

ata_

0_ou

t_LN

MIP

I_C

lock

_out

_LP

MIP

I_C

lock

_out

_LN

XO

2_iC

E3_

LTX

O2_

iCE

4_LT

Dis

play

_res

etD

ispl

ay_r

eset

_LT

XO

2_iC

E3

XO

2_iC

E5

XO

2_iC

E6

XO

2_iC

E3_

LT

XO

2_iC

E5_

LTX

O2_

iCE

6_LT

XO

2_iC

E4_

LTX

O2_

iCE

4

XO

2_C

LK

XO

2_iC

E1_

LTX

O2_

iCE

2_LT

TS

_CLK

BLE

_MO

D_C

DO

NE

MIP

I_D

ata_

0_ou

t_H

S_P

MIP

I_D

ata_

0_ou

t_H

S_N

MIP

I_C

lock

_out

_HS

_P

MIP

I_C

lock

_out

_HS

_NX

O2_

CS

XO

2_C

LK

XO

2_S

CLK

XO

2_D

Q1

TS

_CLK

XO

2_D

Q0

XO

2_D

Q2

BLE

_MO

D_p

rog

XO

2_iC

E6_

LT

XO

2_iC

E5_

LTX

O2_

DQ

3

XO

2_iC

E1

XO

2_iC

E2

XO

2_iC

E1_

LT

XO

2_iC

E2_

LT

V3P

3_X

O2

V3P

3_X

O2

V3P

3_X

O2

V3P

3_R

EG

V3P

3_R

EG

V3P

3_R

EG

VD

D_V

3P0

VE

E_V

1P8

V1P

2_X

O2

V3P

3_X

O2

V1P

2_X

O2

VE

E_V

1P8

V3P

3_R

EG

VR

EG

_AD

JV

3P3_

RE

G

V3P

3_R

EG

V3P

3_R

EG

VR

EG

_AD

JV

1P2_

RE

G

V3P

3_R

EG

FT

DI_

TD

O[4

]F

TD

I_T

DI

[4]

FT

DI_

TC

K[4

]F

TD

I_T

MS

[4]

RE

SE

T_X

O2

[6] Ena

ble_

LED

_1V

8[7

]E

nabl

e_LE

D_3

V0

[7]

XO

2_iC

E3

[6]

XO

2_iC

E6

[6]

XO

2_iC

E5

[6]

XO

2_iC

E4

[6]

BLE

_MO

D_C

DO

NE

[6]

BLE

_MO

D_p

rog

[6]

XO

2_iC

E2

[6]

XO

2_iC

E1

[6]

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

57

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

57

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

57

Tue

sday

, Jun

e 02

, 201

5

R24

2k2

5% R04

02

TP

13

C62

700.

1uF

C04

0216

V

330

R35

5%R02

01

TP

11

LCM

XO

2-2

00

0Z

E

LCM

XO

2-20

00Z

E-1

UW

G49

U4D VC

CD

1

VC

CD

7G

ND

A4

GN

DD

6

GN

DE

1

GN

DG

5

C20

0.1u

F

C02

0116

V

U5

NO

R F

lash

PA

RT

_NU

MB

ER

= N

25Q

032A

13E

SC

40G

Man

ufac

ture

r =

Mic

ron

CS

_L1

DQ

05

SC

LK6

DQ

23

DQ

37

VC

C8

VS

S4

DQ

12

DN

LR

111

R04

02

R26

1K R04

025%

C62

730.

1uF

C04

0216V

330

R34

5%R02

01

R40

10k

R04

025%

R41

0R04

02

U12

2-B

IT_T

RA

NS

LAT

OR

Man

ufac

ture

r =

Tex

as In

stru

men

tsP

AR

T_N

UM

BE

R =

TX

B01

02Y

ZP

R

GN

DB

1

VC

CA

C1

A1

D2

OE

C2

VC

CB

B2

B1

A2

B2

A1

A2

D1

BANK2

LCM

XO

2-2

00

0Z

E

SE

C 2

/4

LCM

XO

2-20

00Z

E-1

UW

G49

U4B PB

3AE

7

PB

3BF

7

PB

5A ||

CS

SP

ING

7

PB

8A ||

MC

LKF

6

PB

8B ||

SO

F5

PB

11A

|| P

CLK

TE

4

PB

11B

|| P

CLK

CE

3

VC

CIO

2G

6

PB

12A

F4

PB

12B

F3

PB

16A

|| P

CLK

TG

4

PB

16B

|| P

CLK

CG

3

PB

25A

|| S

NG

2

PB

25B

|| S

IG

1

U8

TP

S61

061

Man

ufac

ture

r =

TI

PA

RT

_NU

MB

ER

= T

PS

6106

1

SW

6

GN

D1

FB

4

VIN

8

VO

UT

7

EP9

ILE

D3

EN

2P

GN

D5

D5

Red

1 2

Y2

27.0

00M

Hz

PA

RT

_NU

MB

ER

= A

SC

SM

-27.

000M

HZ

-LR

-TM

anuf

actu

rer

= A

brac

on

TS

1

GN

D2

VC

C4

OU

T3

330

R30

5%R02

01

D3

GR

EE

N

1 2

BANK5

LCM

XO

2-2

00

0Z

E

LCM

XO

2-20

00Z

E-1

UW

G49

U4C

PL2

A ||

GP

LLT

_IN

A7

PL2

B ||

GP

LLC

_IN

B6

PL3

AC

7

PL3

BC

6

VC

CIO

5B

7

PL5

AE

6

PL5

BE

5

30R33

R02

015%

R67

33 R04

025%

C22

0.1u

F

C02

0116

V

C29

0.1u

F16

VC

0402

30R25

R02

015%

TP

12

D4

Red

1 2

R42

12 R04

025%

330

R31

5%R02

01

R11

71K R

0402

5%

C35

1uF

35V

C12

06

C28

0.1u

F

C02

0116

V

C24

0.1u

F

C02

0116

V

C18

1uF

16V

C04

02

C62

660.

1uF

C02

01

30R32

R02

015%

C34

1uF

16V

C04

02

R27

1K R04

025%

C19

0.1u

F

C02

0116

V

L422

uHL0

805

C21

1uF

C04

0216

V

J2 5035

48-1

220

Man

ufac

ture

r =

Mol

ex In

c

PA

RT

_NU

MB

ER

= 5

0354

8122

0

2 4 6 8 10 12

1 3 5 7 9 11

U15

1-B

IT_T

RA

NS

LAT

OR

Man

ufac

ture

r =

Tex

as In

stru

men

tsP

AR

T_N

UM

BE

R =

SN

74A

UP

1T34

DS

FR

VC

CA

1

A2

GN

D3

VC

CB

6

B4

NC

5

C23

1uF

16V

C04

02

C62

710.

1uF

C04

0216

V

C27

0.1u

F

C02

0116

V

C62

720.

1uF

C04

0216

V

U11

4-B

IT_T

RA

NS

LAT

OR

Man

ufac

ture

r =

Tex

as In

stru

men

tsP

AR

T_N

UM

BE

R =

TX

B01

04Y

ZT

R

GN

DD

2

VC

CA

B2

A1

A3

OE

C2

VC

CB

A2

B1

A1

B2

B1

A2

B3

A3

C3

A4

D3

B3

C1

B4

D1

C62

690.

1uF

C04

0216

V

C62

650.

1uF

C02

01

BANK0

LCM

XO

2-2

00

0Z

E

U4A

LCM

XO

2-20

00Z

E-1

UW

G49

PT

17B

|| P

CLK

CD

3P

T17

A ||

PC

LKT

C4

PT

16C

|| T

CK

B4

PT

16D

|| T

MS

B5

PT

10A

D5

PT

10B

D4

PT

12C

|| T

DO

A6

PT

12D

|| T

DI

C5

PT

18C

B3

PT

18D

|| S

DA

C3

VC

CIO

0_1

A2

VC

CIO

0_2

A5

PT

20A

A3

PT

20B

B2

PT

20C

|| J

TA

GE

NF

2

PT

20D

|| P

RO

GR

AM

NF

1

PT

23A

E2

PT

23B

C2

PT

24A

C1

PT

24B

D2

PT

24C

|| IN

ITN

B1

PT

24D

|| D

ON

EA

1

30R36

R02

015%

WE

AR

AB

LE S

OLU

TIO

N -

MA

IN B

OA

RD

SE

C 4

/4

SE

C 1

/4

SE

C 3

/4

23


Figure 14. iCE5LP4K Connections

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

Plac

e Ne

ar F

PGA

Pin

Place Near FPGA Pin

Plac

e Ne

ar F

PGA

Pin

Place Near FPGA Pin

Place Near FPGA Pin

iCE

5L

P4

K C

on

ne

ctio

ns

DONE

CRST

Pu

sh B

utt

on

NO

R F

lash

SP

I SE

NS

OR

BL

E M

OD

UL

E

I2C

SE

NS

OR

Tri

Co

lou

r

RIG

HT

MIC

LE

FT

MIC

500mA traces

100mA trace

Pla

ce 0

oh

m r

esi

sto

rs f

or

SP

I fla

sh a

s cl

ose

to t

he

iCE

pa

rt a

s p

oss

ible

CR

ES

ET

_iC

EiC

E_C

DO

NE

MIC

_CLK

MIC

_DA

TA

AF

E_S

PI_

SC

LK

BLE

_MO

D_F

LAS

H_C

SB

BLE

_MO

D_i

CE

40_M

OS

IB

LE_M

OD

_iC

E40

_MIS

O

BLE

_MO

D_F

LAS

H_S

CLK

BLE

_MO

D_C

RS

Tb

CR

ES

ET

n_F

TD

I

FLA

SH

_SC

LK

FLA

SH

_MO

SI

FLA

SH

_MIS

O

FLA

SH

_CS

B

FLA

SH

_SC

LK

BLE

_MO

D_F

LAS

H_S

CLK

BLE

_MO

D_F

LAS

H_C

SB

FLA

SH

_CS

B

SP

I_S

CLK

SP

I_C

S

BLE

_MO

D_i

CE

40_M

ISO

BLE

_MO

D_i

CE

40_M

OS

I

FLA

SH

_MIS

O

FLA

SH

_MO

SI

SP

I_M

OS

I

SP

I_M

ISO

MIC

_CLK

MIC

_DA

TA

MIC

_CLK

MIC

_DA

TA

AF

E_S

PI_

ST

E

AF

E_S

PI_

MIS

O

CR

ES

ET

_iC

E

SP

I_M

ISO

SP

I_S

CLK

SP

I_C

S

SP

I_M

OS

I

AF

E_S

PI_

ST

E

AF

E_S

PI_

MIS

OA

FE

_SP

I_M

OS

IA

FE

_SP

I_S

CLK

iCE

40_I

RLE

D

AF

E_S

PI_

MO

SI

UA

RT

_RX

UA

RT

_TX

Sen

sor_

SD

A

Sen

sor_

SC

L

BLE

_MO

D_C

RS

Tb

UA

RT

_TX

UA

RT

_RX

Sen

sor_

SC

LS

enso

r_S

DA

RE

SE

T_X

O2

AF

E_R

DY

AF

E_R

DY

V1P

2_iC

E

V1P

2_iC

E

V3P

3_iC

E

V3P

3_R

EG

V3P

3_R

EG

V3P

3_R

EG

V3P

3_R

EG

V3P

3_R

EG

V3P

3_R

EG

V3P

3_iC

E

V3P

3_iC

E

VR

EG

_AD

J

VR

EG

_AD

J

VD

D_M

IC1

VD

D_M

IC2

VR

EG

_AD

JV

RE

G_A

DJ

VR

EG

_AD

JV

DD

_MIC

1

VD

D_M

IC2

iCE

40_B

LUE

[6] iC

E40

_GR

EE

N[6

]iC

E40

_RE

D[6

]

iCE

_CD

ON

E[4

]

iCE

40_B

LUE

[6]

iCE

40_G

RE

EN

[6]

iCE

40_R

ED

[6]

CR

ES

ET

n_F

TD

I[4

]

FT

DI_

SS

B[4

]

FT

DI_

SC

LK[4

]

FT

DI_

DI

[4]

FT

DI_

DO

[4]

BLE

_MO

D_C

DO

NE

[5]

BLE

_MO

D_p

rog

[5]

RE

SE

T_X

O2

[5]

XO

2_iC

E3

[5]

XO

2_iC

E4

[5]

XO

2_iC

E1

[5]

XO

2_iC

E2

[5]

XO

2_iC

E5

[5]

XO

2_iC

E6

[5]

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

67

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

67

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

67

Tue

sday

, Jun

e 02

, 201

5

C50

0.1u

F

C02

0116

V

C37

10nF

16V

C02

01

C33

0.1u

F

C04

0216

V

C45

0.1u

F

C02

0116

V

R38

DN

L

0R

112

R04

02

R44

1K R04

025%

D11

LED

Manufacturer = Cree IncPART_NUMBER = XBDAWT-00-0000-00000LCE3

1 2

R61

10k

R04

025%

U10

NO

R-F

LAS

H

PA

RT

_NU

MB

ER

= M

25P

80-V

MN

6TP

Man

ufac

ture

r =

Mic

ron

CS

1

SD

I5

SC

K6

WP

3

HO

LD7

VCC8

GND4

SD

O2

��

��

��

��

U6

MIC

_LE

FT

Man

ufac

ture

r =

ST

Mic

roel

ectr

onic

sP

AR

T_N

UM

BE

R =

MP

34D

B01

TR

CLK

1

LR2

VD

D3

DO

UT

4

GN

D5

R56

1K R02

015%

C36

0.1u

F

C04

0216

V

D12

CD

BU

05201

2

0R

113

R04

02

C32

10uF

10V

C04

02

TP

28

R97

0R

0201

C40

0.1u

F

C02

0116

V

TP

30

0R

60R

0402

0R

58R

0402

BA

NK

0

BA

NK

1

BA

NK

2

iCE

5L

P4

K

iCE

5LP

4K

U9

Man

ufac

ture

r =

Latti

ceP

AR

T_N

UM

BE

R =

iCE

5LP

-4K

-SW

G36

IRLE

DA

2

IOB

_10A

B4

IOB

_11B

_G5

F4

CR

ES

ET

_BD

3

IOB

_16A

F3

IOB

_20A

E3

IOB

_25B

_G3

C2

IOB

_26A

B1

IOB

_27B

D2

IOB

_29B

E2

IOB

_30A

C1

IOB

_31B

B2

IOB

_32A

_SO

_MIS

O_S

PI1

F2

IOB

_33B

_SI_

MO

SI_

SP

I1D

1

IOB

_34A

_SC

K_S

CK

_SP

I1E

1

IOB

_35B

_SS

_MC

SN

O_S

PI1

F1

SP

I_V

CC

IO1

C3

IOB

_12A

_G4_

CD

ON

EE

4

IOB

_2A

_MIS

O_S

PI2

F6

IOB

_3B

_G6_

MO

SI_

SP

I2E

6

IOB

_4A

_SC

K_S

PI2

D6

IOB

_5B

_MC

SN

0_S

PI2

D5

IOB

_6A

F5

IOB

_7B

E5

VC

CIO

_2C

4

VC

CP

LLB

3

IOT

_46B

_G0

B5

RG

B2

A6

RG

B1

B6

RG

B0

C6

VC

CIO

_0A

4

VP

P_2

V5

D4

VC

CA

5

GN

D1

A3

GN

D2

C5

VS

SIO

_LE

DA

1C

511u

F

C04

0216

V

0R

52R

0402

0R

59R

0402

0R

51R

0402

0R

57R

0402

0R

50R

0402

C43

1uF

C04

0216

V0

R53

R04

02

0R

49R

0402

R46

10k

R04

025%

0R

110

R04

02

J5

1X2

SO

CK

ET

Man

ufac

ture

r =

Sul

lins

PA

RT

_NU

MB

ER

= N

PP

C02

1KF

XC

-RC

1 2

0R

55R

0402

C48

10nF

16V

C02

01

R47

0 1% R04

02

R95

0R

0201

R37

0R

0402

0R

63R

0402

0R

48R

0402

J3

2x5

HE

AD

ER

PA

RT

_NU

MB

ER

= 0

0159

1010

0M

anuf

actu

rer

= M

olex

Inc

1 2 3 4 5678910

C44

0.1u

F

C02

0116

V

D8

GR

EE

N

1 2

C38

10nF

16V

C02

01

0R

62R

0402

��

��

��

��

U7

MIC

_RIG

HT

Man

ufac

ture

r =

ST

Mic

roel

ectr

onic

sP

AR

T_N

UM

BE

R =

MP

34D

B01

TR

CLK

1

LR2

VD

D3

DO

UT

4

GN

D5

C42

0.1u

F

C02

0116

V

R43

0 R04

02

C53

0.1u

F

C04

0216

V

TP

29C

461u

F

C04

0216

V

C49

10nF

16V

C02

01

C31

0.1u

F

C04

0216

V

R45

10k

R04

025%

J50

1X3

R/A

HE

AD

ER

Man

ufac

ture

r =

Har

win

Inc

PA

RT

_NU

MB

ER

= M

22-5

3303

05

1 2 3

C41

1uF

C04

0216

V

TP

31

C30

10uF

10V

C04

02

0R

54R

0402

D10

IR_L

ED

Manufacturer = OSRAMPART_NUMBER = SFH 4645

1 2

R10

610

k

R02

015%

SW

1

PB

Man

ufac

ture

r =

E-S

witc

hP

AR

T_N

UM

BE

R =

TL1

015A

F16

0QG

C47

0.1u

F

C02

0116

V

C39

10nF

16V

C02

01

BLUE

GREE

N

RED

D9 TR

ICO

LOU

R_L

ED

Man

ufac

ture

r =

Kin

gbrig

htP

AR

T_N

UM

BE

R =

AP

TF

1616

SE

EZ

GQ

BD

C

1

234R

940

R02

01

J6

2X3

HE

AD

ER

Man

ufac

ture

r =

Mol

ex In

cP

AR

T_N

UM

BE

R =

001

5910

100

1 2

4 5 63

R10

710

k

R02

015%

R39

DN

L

WE

AR

AB

LE S

OLU

TIO

N -

MA

IN B

OA

RD

24


Figure 15. Regulator Connections

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

PO

WE

R C

ON

NE

CT

OR

ON

/OF

F S

WIT

CH

3.3

V @

2 A

Re

gu

lato

r C

on

ne

ctio

ns

Input / Output capacitor's requirement

- ESR < 1 ohms, X7R / X5R type is recommended

Dan

ger:

This

resi

stor

opt

ion

supp

orts

1.8

V fo

r ban

k 1

of th

e iC

E5LP

4K.

The

SEEE

D B

LE, F

TDI,

FLA

SH a

nd X

O2,

stil

l are

pow

ered

by

a 3.

3V ra

il.It

is re

quir

ed to

als

o pu

ll al

l 0 o

hm re

sist

ors

rela

ted

to th

e BL

E, F

TDI a

nd F

LASH

that

are

con

nect

ed to

the

SPI b

us.

It is

als

o re

quir

ed th

at th

e XO

2 be

un-

prog

ram

med

or h

ave

sign

als

conn

ecte

d be

twee

nth

e XO

2 an

d iC

E pa

rt s

et to

hig

h im

peda

nce.

If th

is a

ctio

n is

not

per

form

ed th

e iC

E5LP

4Kco

uld

beco

me

perm

anen

tly d

amag

ed

1.2

V @

3.0

mA

1.8

V @

1.5

mA

3.0

V @

1.5

mA

Ena

ble_

LED

_1V

8E

nabl

e_LE

D_3

V0

RE

G_E

NA

BLE

RE

G_E

NA

BLE

RE

G_E

NA

BLE

V3P

3_X

O2

VO

UT

_BT

VD

D_V

3P0

VE

E_V

1P8

VO

UT

_BT

VO

UT

_BT

V1P

2_X

O2

VR

EG

_AD

J

V3P

3_iC

E

V1P

2_iC

E

V1P

2_R

EG

V3P

3_R

EG

V3P

3_R

EG

BT

_3V

7

VO

UT

_BT

V3P

3_R

EG

VE

E_V

1P8

V3P

3_R

EG

VR

EG

_AD

J

Ena

ble_

LED

_1V

8[5

]E

nabl

e_LE

D_3

V0

[5]

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

77

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

77

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

77

Tue

sday

, Jun

e 02

, 201

5

C68

1uF

C04

0216

V

R10

20.

5

C62

751u

F16

VC

0402

TP

18

R10

90 D

NI

TP

24

C71

4.7u

F10

VC

0402

R11

610

K

R04

025%

12

C70

100u

F10

VC

1206

C54

1uF

16V

C04

02

C69

1uF

C04

0216

V

TP

34

TP

21

R10

10.

5R

100

0.5

TP

36

C61

1uF

C04

02 16V

R10

40.

5

TP

35

TP

19

MIC

5320

U13

PA

RT

_NU

MB

ER

= M

IC53

20-P

GY

MT

TR

Man

ufac

ture

r =

Mic

rel I

nc

3.0V

O6

3.0E

N4

1.8E

N3

1.8V

O5

VIN1

GND2

EP7

J7

2X2

HE

AD

ER

Man

ufac

ture

r =

Mol

ex In

cP

AR

T_N

UM

BE

R =

001

5910

100

1 2

3 4

C55

4.7u

F10

VC

0402

TP

25T

P22

C62

741u

F16

VC

0402

C63

1uF

C04

0216

VT

P33

R11

40.

5

C67

1uF

C04

0216

V

MIC

5504

U16

PA

RT

_NU

MB

ER

= M

IC55

04-1

.2Y

MT

TZ

Man

ufac

ture

r =

Mic

rel I

nc

1.2E

N3

1.2V

O1

VIN

4

GN

D2

EP

5

C60

1uF

C04

0216

V

TP

32

SW

2

ON

/OF

F S

WIT

CH

Man

ufac

ture

r =

C&

KP

AR

T_N

UM

BE

R =

PC

M12

SM

TR

11

22

33

44

55

66

77

C62

7622

uF10

VC

0603

C62

0.1u

FC

0402 16V

TP

17

R10

30.

5

��

��

��

��

�

U14

TP

S7A

7200

Man

ufac

ture

r =

Tex

as In

stru

men

tsP

AR

T_N

UM

BE

R =

TP

S7A

7200

RG

TT

SN

S1

FB

2

PG

3

SS

11

EN

12

IN1

13

IN2

14O

UT

115

OU

T2

16

GN

D7

EP

AD

117

50m

V4

100m

V5

200m

V6

400m

V8

800m

V9

1.6V

10

C56

220p

F

C04

0225

V

TP

16

TP

23

R11

50.

5

TP

20

R10

80 D

I

WE

AR

AB

LE S

OLU

TIO

N -

MA

IN B

OA

RD

25


Appendix B. Sensor Board Schematic DiagramsFigure 16. Block Diagram

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

LPS

25

HP

ress

ure

Se

nso

r

AF

E4

40

3A

na

log

Fro

nt

En

d

LSM

33

0D

LCA

cce

l. &

Gyr

o

BLE

Mo

du

leS

PI

TM

P1

12

Te

mp

era

ture

Se

nso

rI2

C

I2C

I2C

SP

IS

FH

70

50

He

art

Ra

te

&

Oxy

ge

n S

en

sor

So

lde

rab

le

Ba

tte

ry C

on

tact

I2C Header J4

SPI Header J2

SPI/UART CFGHeader J3

Voltage Header J5

3.3

V

GN

D

We

ara

ble

(B

ott

om

) S

en

sor

Bo

ard

So

lde

rab

le

Ba

tte

ry C

on

tact

BT

_3

V3

U4

U7

U3

U2

U6

U5

VR

EG

_A

DJ

Fro

m M

AIN

Bo

ard

1

.8V

or

3.3

V

1X2 2X2

2X3 2X5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

15

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

15

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

15

Tue

sday

, Jun

e 02

, 201

5

We

ara

ble

_S

en

sor_

Bo

ard

26


Figure 17. Mechanical Design

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

Mic

3.3

Re

g

Ba

tte

ry C

hg

LED

Dri

ve

r

VLE

D

3, 1

.8 R

eg

1.2

Re

g

SP

I J4

Vo

lta

ge

i2c

A. F

ron

t E

nd

Pre

ssu

re

Acc

/G

yro

Osc

To

pB

ott

om

Bo

tto

mT

op

IR L

ED

RG

B L

ED

Fla

sh

Bu

tto

n

Sw

itch

iCE

X0

2

EE

PR

OM

Osc

Osc

Dis

pla

y C

on

n.B

att

ery

Co

nn

. Pa

ds

Mic

i2c

SP

I+U

AR

T

Vo

lta

ge

Se

nso

r B

oar

d

Mai

n B

oar

d

SP

I

SP

I+U

AR

T

J2

J5

J3

Cutout

Cu

tou

t

BLE

Cutout

Bo

ost

Re

gu

lato

r

Cutout

Cutout

PP

G

Te

mp

Cu

tou

t

Fla

sh

Lev

el

Sh

ifte

r

LED

Se

lect

or

FT

DI P

ow

er

FD

TI US

B

Ma

gM

ag

Ma

gM

ag

J5J6J3

J7

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

25

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

25

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

25

Tue

sday

, Jun

e 02

, 201

5

We

ara

ble

_S

en

sor_

Bo

ard

27


Figure 18. Sensor Connections - 1

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

Te

mp

era

ture

Se

nso

r

Acc

ele

rom

ete

r

I2C

Add

ress

: 001

1001

b

Se

ee

d B

LE

Mo

du

le

Pre

ssu

re S

en

sor

Se

nso

r C

on

ne

ctio

ns

- 1

I2C

Add

ress

: 101

1100

b

I2C

So

cke

t

BL

E M

OD

UL

E

Pla

ce t

em

pe

ratu

re s

en

sor

far

aw

ay

fro

m b

att

ery

an

d c

ha

rgin

g c

ircu

it

I2C

Add

ress

: 100

1000

b

UA

RT

_RX

UA

RT

_TX

Sen

sor_

SC

L

Sen

sor_

SD

A

BLE

_MO

D_p

rog

Sen

sor_

SC

L

Sen

sor_

SD

A

BLE

_MO

D_C

DO

NE

Sen

sor_

SC

L

Sen

sor_

SD

A

BLE

_MO

D_F

LAS

H_C

SB

UA

RT

_RX

UA

RT

_TX

BLE

_MO

D_i

CE

40_M

OS

IB

LE_M

OD

_iC

E40

_MIS

O

BLE

_MO

D_F

LAS

H_S

CLK

BLE

_MO

D_F

LAS

H_C

SB

BLE

_MO

D_i

CE

40_M

OS

IB

LE_M

OD

_iC

E40

_MIS

O

BLE

_MO

D_F

LAS

H_S

CLK

BLE

_MO

D_C

RS

Tb

BLE

_MO

D_C

DO

NE

BLE

_MO

D_C

RS

Tb

BLE

_MO

D_p

rog

Sen

sor_

SC

LS

enso

r_S

DA

3V3

3V3

3V3

VR

EG

_AD

J

3V3

VR

EG

_AD

J VR

EG

_AD

J

VR

EG

_AD

J

VR

EG

_AD

JV

RE

G_A

DJ

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

35

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

35

Tue

sday

, Jun

e 02

, 201

5

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

35

Tue

sday

, Jun

e 02

, 201

5

C1

10uF

16V

C08

05

R10

0 R04

02

R7

0R

0402

C5

0.01

uFC

0402

16V

R17

0 R04

02

C8

4.7u

FC

0603

16V

C4

0.1u

FC

0402

16V

TP

16 1

��

��

��

��

��

��

�

U4

LSM

330D

LC

Man

ufac

ture

r =

ST

Mic

roel

ectr

onic

sP

AR

T_N

UM

BE

R =

LS

M33

0DLC

TR

GN

D1

1

GN

D2

6

VD

D1

7

VD

D2

8

VD

D3

9

CA

P15

DE

N_G

16

DR

DY

_G/IN

T2_

G17

INT

1_G

18

INT

2_A

19

INT

1_A

20

CS

_G22

CS

_A23

RE

S1

2

RE

S2

3

RE

S3

4

RE

S4

5

RE

S5

10

RE

S6

11

RE

S7

12

RE

S8

13

RE

S9

14

VD

D_I

O1

21

VD

D_I

O2

25

SC

L_A

/G24

SD

O_G

26

SD

O_A

27

SD

A_A

/G28

R4

0R

0402

C7

0.1u

FC

0402

16V

R11

0 R04

02

TP

151

C10

0.1u

FC

0402

16V

BLE

Mic

ro

U5

See

edB

LEM

anuf

actu

rer

= S

eeed

PA

RT

_NU

MB

ER

= 1

1305

0012

GN

D27

SW

CLK

26

SW

DIO

25

VC

C24

p12

22p1

323

p11

21

p919

p818

p717

p616

p515

p414

p313

p212

p111

p010

p10

20

GN

D1

p18

2

p17

3

p23

4

p24

5

p25

6

p28

7

p29

8

p30

9

R13

0R

0402

TP

141

R2

0 R04

02

C2

0.1u

FC

0402

16V

R6

0R

0402

R1

10K

R04

02

LP

S2

5H

U3

LPS

25H

Man

ufac

ture

r =

ST

Mic

roel

ectr

onic

sP

AR

T_N

UM

BE

R =

LP

S25

HT

R

VD

D_I

O1

SC

L_S

PC

2

Res

erve

d3

SD

A_S

DI_

SD

I/SD

O4

SD

O_S

A0

5

CS

6

INT

17

GN

D1

8

GN

D2

9

VD

D10

R16

0 R04

02

��

��

��

U7

TM

P11

2M

anuf

actu

rer

= T

IP

AR

T_N

UM

BE

R =

TM

P11

2AID

RLT

SC

L1

GN

D2

ALE

RT

3

AD

D0

4

V+

5

SD

A6

J4

1X2

Hea

der

PA

RT

_NU

MB

ER

= 0

0159

1010

0M

anuf

actu

rer

= M

olex

Inc

1 2

C3

0.1u

FC

0402

16V

R9

0 R04

02

R8

0R

0402

R15

10K

R04

02

TP

2 1

C9

0.1u

FC

0402

16VR

50

R04

02

TP

31

J3

2X5

SO

CK

ET

Man

ufac

ture

r =

Sul

lins

PA

RT

_NU

MB

ER

= N

PP

C05

2KF

MS

-RC

1 2 3 4 5678910

C6

0.1u

FX

5R16

VC

0402

R3

0 R04

02

R12

10K

R04

02

R14

0R

0402

We

ara

ble

_S

en

sor_

Bo

ard

28


Figure 19. Sensor Connections - 2

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

LE

D_

DR

V_

SU

P

R

X_

AN

A_

SU

P

RX

_D

IG_

SU

P

T

X_

CT

RL

_S

UP

Se

nso

r C

on

ne

ctio

ns

- 2

SPI pins will go to GPIO pins

on main boards iCE device

SP

I SE

NS

OR

LED

_DR

V_S

UP

TX

_LE

D_N

TX

_LE

D_3

TX

_LE

D_P

TX

_LE

D_3

LED

_DR

V_S

UP

TX

_LE

D_N

AF

E_S

PI_

SC

LKA

FE

_SP

I_M

OS

IA

FE

_SP

I_M

ISO

AF

E_S

PI_

ST

E

AF

E_R

DY

INN

INP

TX

_LE

D_P

AF

E_S

PI_

MO

SI

AF

E_S

PI_

SC

LKA

FE

_SP

I_S

TE

AF

E_S

PI_

MIS

OIN

P

INN

AF

E_R

DY

3V3

3V3

V5P

0_A

FE

V5P

0_A

FE

3V3

V5P

0_A

FE

VC

M_O

UT

3V3

3V3

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

45

Tue

sday

, Jun

e 02

, 201

5

Rev

of

BR

ev B

Y1

8MH

z

TP

8 1

TP

61

C16

0.1u

FC

0402

16V

Green LED Red LED Infrared LED

Photodiode

SF

H7

05

0

U6

SF

H70

50M

anuf

actu

rer

= O

SR

AM

PA

RT

_NU

MB

ER

= S

FH

7050

GC

1

GA

2

RA

3

PA

4

PC

5

RC

6

IA7

IC8

R26

10K

R04

02

R22

0.00

1R

1206

J2

2X3

SO

CK

ET

PA

RT

_NU

MB

ER

= N

PP

C03

2KF

MS

-RC

Man

ufac

ture

r =

Sul

lins

1 2

4 5

36

C18

0.1u

FC

0402

16V

TP

9

1 TP

41

R20

DN

LR

0402

TP

111

C15

8pF

C04

02

C20

0.1u

FC

0402

16V

R18

DN

LR

0402

C23

1uF

C04

0216

V

C13

2.2u

F16

VC

0402

R24

1KR

0402

TP

101

TP

51

C17

0.1u

FC

0402

16V

R23

0R

0402

C11

2.2u

FC

0402

16V

R25

10K

R04

02

TP

18T

PO

INT

R

C14

8pF

C04

02

TP

17T

PO

INT

R

C19

0.1u

FC

0402

16V

TP

11

R21

0R

0402

R19

0R

0402

C12

0.01

uFC

0402

16V

AF

E4

40

3

U2

AF

E44

03M

anuf

actu

rer

= T

IP

AR

T_N

UM

BE

R =

AF

E44

03Y

ZP

T

DN

C_A

1A

1

TX

_CT

RL_

SU

PA

2

LED

_DR

V_S

UP

A6

TX

_RE

FB

1

VC

MD

1

VS

SD

2

DN

C_D

3D

3

DN

C_E

3E

3

DN

C_F

5F

5

DN

C_B

5B

5

DN

C_B

6B

6

DN

C_C

1C

1

XIN

F3

XO

UT

F4

RX

_AN

A_S

UP

_E4

E4

RX

_AN

A_S

UP

_F2

F2

RX

_DIG

_SU

PE

5

SC

LKC

6

SP

ISIM

OC

4

SP

ISO

MI

C5

SP

IST

ED

6

INP

E1

INN

F1

DIA

G_E

ND

B4

AD

C_R

DY

D5

AF

E_P

DN

_LC

3

RX

_DIG

_GN

D_B

2B

2

RX

_DIG

_GN

D_F

6F

6

LED

_DR

V_G

ND

A3

RX

_AN

A_G

ND

E2

TX

PA

5

TX

NA

4

TX

3B

3

BG

C2

RE

SE

T_L

D4

CLK

OU

TE

6

TP

71

We

ara

ble

_S

en

sor_

Bo

ard

29


Figure 20. Boost Regulator

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

Thro

ugh

hole

test

pad

s fo

r bat

tery

sol

derin

g

Re

gu

lato

r C

on

ne

ctio

ns

Po

we

r C

on

ne

cto

r

BT

_3V

3

3V3

V5P

0_A

FE

3V3

BT

_3V

3V

RE

G_A

DJ

Titl

e

Siz

eD

ocum

ent N

umbe

rR

ev

Dat

e:S

heet

of

<Doc

>B

B

55

Tue

sday

, Jun

e 02

, 201

5

Titl

e

of

BB

55

Tue

sday

, Jun

e 02

, 201

5

Titl

e

of

B

We

ara

ble

_S

en

sor_

Bo

ard

B

55

C21

10uF

C06

036.

3V

TP

1280

_MIL

_PA

D1

J5 2X2

SO

CK

ET

PA

RT

_NU

MB

ER

= M

20-7

8702

46M

anuf

actu

rer

= H

arw

in In

c

1 2

3 4

C22

22uF

C06

036.

3V

TP

1380

_MIL

_PA

D1

L1 0.47

uHL2

016

R27

10K

R04

02

��

��

��

��

U1

FA

N48

610

Man

ufac

ture

r =

Fai

rchi

ldP

AR

T_N

UM

BE

R =

FA

N48

610U

C50

X

VO

UT

1A

1

VO

UT

2A

2V

INA

3

SW

1B

1

SW

2B

2

EN

B3

PG

ND

1C

1

PG

ND

2C

2

AG

ND

C3

30


Appendix C. Main Board Bill of MaterialsFigure 21. Main Board Bill of Materials

Item Reference Qty Part PCB Footprint Comments Part Number Manufacturer Description

1 C1,C5,C55,C71 4 4.7uF C0402 — C1005X5R1A475K050BC TDK CAP CER 4.7 µF 10 V 10% X5R 0402

2 C2,C3,C6,C6269,C6270,C6271,C6272

7 0.1uF C0402 — C1005X5R1C104K050BA TDK CAP CER 0.1 µF 16 V 10% X5R 0402

3 C4 1 1uF C0402 — GRM155R61C105KE01D Murata CAP CER 1 µF 16 V 10% X5R 0402

4 C7 1 4.7uF C0402 — C1005X5R1A475K050BC TDK CAP CER 4.7 µF 10 V 10% X5R 0402

5 C8,C9,C10,C12,C14,C17,C29,C31,C33,C36,C53,C62,C6273


6 C11,C13,C30,C32 4 10uF C0402 — CL05A106MP5NUNC Samsung CAP CER 10 µF 10 V 20% X5R 0402

7 C15,C16 2 27pF C0402 — CL05C270JB5NNNC Samsung CAP CER 27 pF 50 V 5% NP0 0402

8 C18,C21,C23,C34,C41,C43,C46,C51,C54,C60,C61,C63,C67,C68,C69,C6274,C6275

17 1uF C0402 — GRM155R61C105KE01D Murata CAP CER 1 µF 16 V 10% X5R 0402

9 C19,C20,C22,C24,C27,C28,C40,C42,C44,C45,C47,C50

12 0.1uF C0201 — C0603X5R1C104K030BC TDK CAP CER 0.1 µF 16 V 10% X5R 0201

10 C35 1 1uF C1206 — GMK316BJ105KLHT Taiyo Yuden CAP CER 1 µF 35 V 10% X5R 1206

11 C37,C38,C39,C48,C49

5 10nF C0201 — GRM033R61C103KA12D Murata CAP CER 10000 pF 16 V 10% X5R 0201

12 C56 1 220pF C0402 — GRM1555C1E221JA01D Murata CAP CER 220 pF 25 V 5% NP0 0402

13 C70 1 100uF C1206 — F951A107KAAAQ2 AVX CAP TANT 100 µF 10 V 10% 1206

14 C6265,C6266 2 0.1uF C0201 — C0603X5R1E104M030BB TDK Corporation CAP CER 0.1 µF 25 V 20% X5R 0201

15 C6276 1 22uF C0603 — C1608X5R1A226M080AC

TDK CAP CER 22 µF 10 V 20% X5R 0603

16 D1 1 YELLOW LED0603 — LTST-C193KSKT-5A Lite-On Inc LED YELLOW RECT CLEAR 0603

17 D2 1 GREEN LED0603 — LG L29K-G2J1-24-Z Osram LED SMARTLED GREEN 570NM 0603

18 D3,D8 2 GREEN LED0603 — LG L29K-G2J1-24-Z Osram LED SMARTLED GREEN 570NM 0603

19 D4,D5 2 Red LED0603 — LTST-C190KRKT LITE-On INC LED SUPER RED CLEAR 0603 SMD

20 D9 1 TRICOLOUR_LED APTF1616SE_RGB — APTF1616SEEZGQBDC Kingbright LED RED/GREEN/BLUE WTR CLEAR SMD

21 D10 1 IR_LED SFH4645_2SMD — SFH 4645 OSRAM EMITTER 950NM MIDLED SIDELK SMD

22 D11 1 LED XBDAWT_2SMD — XBDAWT-00-0000-00000LCE3

Cree Inc LED HIGH BRIGHT-NESS

23 D12 1 CDBU0520 DIODE_SOD523F — CDBU0520 Comchip DIODE SCHOTTKY 20 V 500 mA 0603

24 J1 1 USB PWR CONN_S5P1RMINIUSBB_MOLEX

— 67503-1020 Molex CONN RECEPT MIN-IUSB R/A 5POS SMD

25 J2 1 503548-1220 2X6HDR_5035481220 — 5035481220 Molex Inc CONN RCPT BTB 12POS DL VERT SMD

26 J3 1 2x5 HEADER 2X5_HDR_SMD BREAKAWAY PART

15910100 Molex Inc CONN HEADER 10POS .100" STR 15AU

27 J5 1 1X2 SOCKET 1X2_SOCKET_SMD — NPPC021KFXC-RC Sullins CONN FEMALE 2POS .1" SMD GOLD

28 J6 1 2X3 HEADER 2X3_HDR_SMD BREAKAWAY PART


29 J7 1 2X2 HEADER 2X2_HDR_SMD BREAKAWAY PART


30 J50 1 1X3 R/A HEADER 1X3_HDRRAM22_SMD

— M22-5330305 Harwin Inc 3 WAY SIL HORIZ SMT PIN HDR

31 J51 1 1X2 HEADER_RT_ANGLE

1X2_HDRM22_SMD — M22-5330205 Harwin Inc 2POS SIL HORIZ SMT PIN HEADER

31


32 L1,L2,L3 3 600ohm, 500mA L0603 — MMZ1608R601A TDK Corp FERRITE CHIP 600 Ohm 500 mA 0603

33 L4 1 22uH L0805 — AIML-0805HC-220M-T Abracon Corporation

HIGH CURRENT CHIP IND 22.0UH 20%

34 R1 1 1K R0402 — ERJ-2GEJ102X Panasonic RES SMD 1K Ohm 5% 1/10W 0402


36 R3,R116 2 10K R0402 — ERJ-2GEJ103X Panasonic RES SMD 10K Ohm 5% 1/10W 0402

37 R4 1 4.32K R0402 — ERJ-2RKF4321X Panasonic RES SMD 4.32K Ohm 1% 1/10W 0402



40 R7 1 DNL R0402 DNL — — —

41 R8 1 12k R0402 — ERJ-2RKF1202X Panasonic RES SMD 12K Ohm 1% 1/10W 0402

42 R9,R10,R11 3 4.7K R0402 — ERJ-2GEJ472X Panasonic RES SMD 4.7K Ohm 5% 1/10W 0402

43 R12,R13,R14,R15,R37,R43,R48,R49,R50,R51,R52,R53,R54,R55,R57,R58,R59,R60,R62,R63,R112,R113

22 0 R0402 — ERJ-2GE0R00X Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0402

44 R16,R26,R27,R44 4 1K R0402 — ERJ-2GEJ102X Panasonic RES SMD 1K Ohm 5% 1/10W 0402

45 R17,R18,R19,R40,R45,R46,R61

7 10k R0402 — ERJ-2GEJ103X Panasonic RES SMD 10K Ohm 5% 1/10W 0402

46 R20,R68 2 2.2k R0402 — ERJ-2GEJ222X Panasonic RES SMD 2.2K Ohm 5% 1/10W 0402

47 R24 1 2k2 R0402 — ERJ-2GEJ222X Panasonic RES SMD 2.2K Ohm 5% 1/10W 0402

48 R25,R32,R33,R36 4 30 R0201 — ERJ-1GEJ300C Panasonic RES 30 Ohm 1/20W 5% 0201 SMD

49 R30,R31,R34,R35 4 330 R0201 — CRCW0201330RJNED Vishay RES 330 Ohm 1/20W 5% 0201 SMD

50 R38,R39 2 DNL R0402 DNL — — —

51 R41 1 0 R0402 — ERJ-2GE0R00X Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0402

52 R42 1 12 R0402 — ERJ-2GEJ120X Panasonic RES SMD 12 Ohm 5% 1/10W 0402


54 R56 1 1K R0201 — ERJ-1GEJ102C Panasonic RES SMD 1K Ohm 5% 1/20W 0201

55 R67 1 33 R0402 — ERJ-2GEJ330X Panasonic RES SMD 33 Ohm 5% 1/10W 0402

56 R94,R95,R97 3 0 R0201 — ERJ-1GN0R00C Panasonic RES SMD 0.0 Ohm JUMPER 1/20W 0201

57 R100,R101,R102,R103,R104,R114,R115

7 0.5 Current_Sens_Res_0603

— RL0603FR-070R5L Yageo RES SMD 0.5 Ohm 1% 1/10W 0603

58 R106,R107 2 10k R0201 — ERJ-1GEJ103C Panasonic RES SMD 10K Ohm 5% 1/20W 0201

59 R108 1 0 R0603 — ERJ-3GEY0R00V Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0603

60 R109 1 0 R0603 DNL ERJ-3GEY0R00V Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0603


62 R111 1 DNL R0402 DNL — — —


64 SW1 1 PB 2psmd_eswitch — TL1015AF160QG E-Switch SWITCH TACTILE SPST-NO 0.05A 12 V

65 SW2 1 ON/OFF SWITCH PCM12SMTR — PCM12SMTR C&K SWITCH SLIDE SPDT 300 mA 6 V


32


66 TP1,TP2,TP3,TP4,TP5,TP6,TP11,TP12,TP13,TP16,TP17,TP18,TP19,TP20,TP21,TP22,TP23,TP24,TP25,TP32,TP33,TP34,TP35,TP36

24 T POINT R TEST_POINT DNL — — —

67 TP28,TP29,TP30,TP31

4 T POINT R TEST_POINT DNL — — —

68 U1 1 BQ24232 BQ24232_16VQFN — BQ24232RGTT TI IC LI+ CHARGER PWR MGMT 16QFN

69 U2 1 FT2232HQ FT2232HQ_64QFN — FT2232HQ FTDI IC USB HS DUAL UART/FIFO 64-QFN

70 U3 1 93LC56BT 93LC56BT_6SOT23 — 93LC56BT-I/OT Microchip Technology

IC EEPROM 2KBIT 2MHZ SOT23-6

71 U4 1 LCMXO2-2000ZE-1UWG49

XO2_2000ZE_49CSP CUSTOMER SUPPLIED

LCMXO2-2000ZE-1UWG49

Lattice LCMXO2-2000ZE-1UWG49

72 U5 1 NOR Flash N25Q032A_8SOIC — N25Q032A13ESC40G Micron IC FLASH 32MBIT 108MHZ 8SO

73 U6 1 MIC_LEFT MP34DB01_RHLGA — MP34DB01TR STMicroelectronics MIC MEMS DIGITAL PDM OMNI -26DB

74 U7 1 MIC_RIGHT MP34DB01_RHLGA — MP34DB01TR STMicroelectronics MIC MEMS DIGITAL PDM OMNI -26DB

75 U8 1 TPS61061 TPS61061_8QFN — TPS61061DRBR TI IC LED DRIVER WHITE BCKLGT 8SON

76 U9 1 iCE5LP4K iCE5LP4K_SWG36 CUSTOMER SUPPLIED

iCE5LP-4K-SWG36 Lattice iCE40 Ultra family is an ultra-low power FPGA and sensor manager

77 U10 1 NOR-FLASH M25P80_SO8N — M25P80-VMN6TP Micron IC FLASH 8MBIT 75MHZ 8SO

78 U11 1 4-BIT_TRANSLATOR 12DSBGA_TXB0104 — TXB0104YZTR Texas Instruments IC XLATR VOLT-LVL 4B ESD 12DSBGA

79 U12 1 2-BIT_TRANSLATOR 8DSBGA_TXB0102 — TXB0102YZPR Texas Instruments IC 2BIT V-TRANS-LATR W/ESD 8DSBGA

80 U13 1 MIC5320 MIC5320_6MLF — MIC5320-PGYMT TR Micrel Inc IC REG LDO 3 V/1.8 V 0.15A 6TMLF

81 U14 1 TPS7A7200 TPS7A7200_16QFN — TPS7A7200RGTT Texas Instruments IC REG LDO FIX/ADJ 2A 16QFN

82 U15 1 1-BIT_TRANSLATOR 6SON_SN74AUP1T34 — SN74AUP1T34DSFR Texas Instruments IC V-LEVEL XLATR UNIDIR 6SON

83 U16 1 MIC5504 MIC5504_4TDFN — MIC5504-1.2YMT TZ Micrel Inc IC REG LDO 1.2 V 0.3A 4TDFN

84 Y1 1 12MHz 403C35D12M00000_4SMD

— 403C35D12M00000 Abracon Corp CRYSTAL 12MHZ 18 pF SMD

85 Y2 1 27.000MHz OSC_ASCSM — ASCSM-27.000MHZ-LR-T

Abracon OSC XO 27.000MHZ CMOS SMD

86 WEARABLE SOLU-TION MAIN BOARD PCB

1 — — — 305-PD-15-0069 PACTRON —

87 LCD Display 1 www.vcdisplays.com - David Fontano / [email protected]

LH154Q01-TD01 LG http://vcdisplays.com

88 Battery 1 http://www.ebay.com S107-19 or 652030 Syma 3.7 V 240mAh Li-Po Battery for SYMA S026 RC Remote Quadcopter - bag & tag item

89 Magnet 8 http://www.ama-zon.com

??? MyMagnetMan MyMagnetMan® 1/4" x 1/16" (6.35 x 1.58mm) 3M-467 Adhesive Rare Earth Neodymium Disc Magnets for Crafts


http://www.ebay.com/itm/251766536585?_trksid=p2057872.m2749.l2649&ssPageName=STRK%3AMEBIDX%3AIT

http://www.amazon.com/gp/product/B00IPT537I/ref=oh_aui_detailpage_o04_s00?ie=UTF8&psc=1

http://vcdisplays.com/index.php/inventory/lg-display/lh154q01-td01-detail

33


Appendix D. Sensor Board Bill of MaterialsFigure 22. Sensor Board Bill of Materials


1 C1 1 10uF C0805 — C2012X5R1C106K085AC TDK CAP CER 10 µF 16 V 10% X5R 0805

2 C2,C3,C4,C6,C7,C9,C10,C16,C17,C18,C19,C20


3 C5,C12 2 0.01uF C0402 — GRM155R61C103KA01D Murata CAP CER 10000 pF 16 V 10% X5R 0402

4 C8 1 4.7uF C0603 — EMK107ABJ475KA-T Taiyo Yuden CAP CER 4.7 µF 16 V 10% X5R 0603

5 C11,C13 2 2.2uF C0402 — C1005X5R1C225K050BC TDK CAP CER 2.2 µF 16 V 10% X5R 0402

6 C14,C15 2 8pF C0402 — GRM1555C1E8R0CA01D Murata CAP CER 8 pF 25 V NP0 0402

7 C21 1 10uF C0603 — C1608X5R0J106K080AB TDK CAP CER 10 µF 6.3 V 10% X5R 0603

8 C22 1 22uF C0603 — C1608X5R0J226M080AC TDK CAP CER 22 µF 6.3 V 20% X5R 0603

9 C23 1 1uF C0402 — C1005X5R1C105K050BC TDK CAP CER 1 µF 16 V 10% X5R 0402

10 J2 1 2X3 SOCKET 2X3_SOCKET_SMD — NPPC032KFMS-RC Sullins CONN FEMALE 6POS DL .1" GOLD SMD

11 J3 1 2X5 SOCKET 2X5_SOCKET_SMD — NPPC052KFMS-RC Sullins CONN FMALE 10POS DL .1" GOLD SMD

12 J4 1 1X2 Header 1X2_HDR_SMD BREAKAWAY PART


13 J5 1 2X2 SOCKET 2X2_SOCKET_SMD — M20-7870246 Harwin Inc 02+02 DIL SMT SKT

14 L1 1 0.47uH L2016 — 1286AS-H-R47M Toko Inductor 0.47uH DFE201612C series

15 R1,R12,R15,R25,R26,R27

6 10K R0402 — ERJ-2RKF1002X Panasonic RES 10K Ohm 1/10W 1% 0402 SMD

16 R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R13,R14,R16,R17,R19,R21,R23

17 0 R0402 — ERJ-2GE0R00X Panasonic RES 0.0 Ohm 1/10W 0402 SMD

17 R18,R20 2 DNL R0402 DNL — — —

18 R22 1 0.001 R1206 — CSNL1206FT1L00 Stackpole RES SMD 0.001 Ohm 1% 1W 1206

19 R24 1 1K R0402 — ERJ-2RKF1001X Panasonic RES 1K Ohm 1/10W 1% 0402 SMD

20 TP1,TP2,TP3,TP4,TP5,TP6,TP7,TP8,TP9,TP10,TP11,TP14,TP15,TP16

14 TEST POINT TEST_POINT DNL — — —

21 TP12,TP13 2 80_MIL_PAD TP_80MIL DNL — — —

22 TP17,TP18 2 T POINT R 30_mil_pad DNL — — —

23 U1 1 FAN48610 FAN48610 — FAN48610UC50X Fairchild IC REG BOOST SYNC 5 V 1A 9WLCSP

24 U2 1 AFE4403 AFE4403_36DSBGA — AFE4403YZPT TI IC AFE FRONT END 36DSBGA

25 U3 1 LPS25H LPS25H_10HCLGA — LPS25HTR STMicroelectronics IC MEMS PRESSURE SENSOR 10HCLGA

26 U4 1 LSM330DLC LSM330DLC_28LGA — LSM330DLCTR STMicroelectronics ACCELEROMETER/GYROSCOPE 28LGA

27 U5 1 SeeedBLE SeeedBLE http://www.seeedstu-

dio.com

113050012 Seeed Low cost ARM cortex-m0 based module for Bluetooth module

28 U6 1 SFH7050 SFH7050 — SFH7050 OSRAM Biomonitoring Sensor for heart rate monitor-ing, Pulse oximetry and proximity

29 U7 1 TMP112 TMP112_SOT563 — TMP112AIDRLT TI IC TEMP SENSOR DGTL 5 V SOT563

30 Y1 1 8MHz NX3225GD_8MHZ — NX3225GD-8MHZ-STD-CRA-3

NDK CRYSTAL 8MHZ 8 pF SMD

31 WEARABLE SOLUTION SENSOR BOARD PCB

1 — — — 305-PD-15-0028 PACTRON —

http://www.seeedstudio.com/depot/Seeed-Micro-BLE-Module-w-CortexM0-Based-nRF51822-SoC-p-1975.html?cPath=19_21

http://www.seeedstudio.com/depot/Seeed-Micro-BLE-Module-w-CortexM0-Based-nRF51822-SoC-p-1975.html?cPath=19_21

EB100 - iCE40 Ultra Wearable Development Platform User Guide

Documents

Transcript of EB100 - iCE40 Ultra Wearable Development Platform User Guide