E2V –About us - Home - Technical...

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Transcript of E2V –About us - Home - Technical...

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Founded in 1947

Annual sales of $370m

1650 employees

500+ engineers & scientists

Operational facilities in

Europe, the US and Asia

E2V – About us

We partner with our customers to improve,

save and protect people’s lives

Our innovations lead developments in

communications, automation, discovery,

healthcare and the environment

Our business is built on our core technologies

of RF & microwave, and semiconductor based

products and solutions. Our strategy is to move

from a component to a sub-system scope of

supply, with long term service.

e2v is member of the FTSE4Good Index and we

were awarded Platinum Standard for our

global corporate responsibility activities by

Business in The Community (BiTC)0

50

100

150

200

EMEA Americas Asia Pac

Revenue ($m)

by region

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RF Power Imaging Semiconductors

Electron devices and sub-

systems generating,

amplifying & precision

controlling RF power

• High power microwave and RF

generators

• Compact broadband microwave

power modules

• Compact ordnance technologies

CCD & CMOS sensors, focal

plane arrays, cameras & sub-

systems

• Space-qualified supply chain

management

• High sensitivity ‘electron

multiplying’ technology

• High speed industrial sensors and

cameras

• From visible to x-ray, ultraviolet

and IR thermal imaging

Hi-rel semiconductors for

space, aerospace, defence &

industrial applications

• Micro-processors, data

converters and memories

• Extended availability of obsolete

and end-of-life ICs

• SLiM™ obsolescence

management programme

• Up-screening, assembly,

packaging and test services

E2V capabilities

Advanced technology and vital services for critical systems

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OUR VISION:To be the partner of choice for

Professional & High Performance

semiconductor components and

sub-systems

OUR MISSION:

To make our customers’ systems safer,

secure and more differentiated by

delivering tailored high performance

semiconductor sub-systems signal &

data processing solutions

E2V Vision and Mission

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Your partner of choicee2v’s flexible business model

Utilizing our world-class IC expertise, we optimize cost of

ownership and time-to-market through standard and

tailored solutions at the level our customers require…

Hi-Rel Semiconductors

Portfolio

Chipsets(Firmware available)

Modules & Boards(Firmware available)

Operation &

Manufacturing services

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Our markets and customers

S P A C EC I V I L A E R O S P A C E D E F E N C E

S C I E N T I F I CI N D U S T R I A L

Products

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Our Products/Services/Solutions

� Broadband Data Converters

o ADC (Sampling rate > 1Gsps)

o DAC (Sampling rate > 3Gsps)

� Micro Controller Units

o Freescale partnership

� Logic (TI, NSC, ST,)

� PROMs

� UVPROM (QP Semi, Atmel)

� SRAM (QP Semi, Cypress Semi)

� PLD (Cypress Semi)

� EPROM (QP Semi, Atmel)

� Peregrine- Space RF Products

� GaN FET’s (GaN Systems)

� Memory

o DDR2/3 (Micron, ISSI)

o MRAM (Everspin)

� Packaging

o Re-balling

o Die

o Different package footprints

� Wafer: Bumping/Singulation/Back Grind

� Multi Chip Modules/Package (MCM/MCP)

� Interposers (Translation)

� Package on Package (PoP)

� Modules/ Cards with Standard or custom

connectivity

� SLiM (Semiconductor Life Cycle Management)

� Design/Development

o Obsolescence redesigns

o ASIC’s (including Rad Hard)

o Test Vectors

Semiconductor Products Services/Solutions

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Trusted and Secure Manufacturing for Classified programs

e2v Certifications

� DLA Laboratory Suitability to

MIL-STD-883

� MIL-PRF-38535 QML Certification

� Class Q and Class V

� MIL-PRF-38534 Certification

� AS9100 / ISO9001 Certification

� Active member of JEDEC JC-13 Committee

� DMEA Trusted Supplier

9WE PARTNER WITH OUR CUSTOMERS TO IMPROVE, SAVE AND PROTECT PEOPLE’S LIVES

E2V SC Product Overview

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CURRENT QP PRODUCT

OFFERINGS

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8-bit Microcontrollers

80C31BHwith RAM

87C514K EPROM

87C51RB16K EPROM

87C51RC32K EPROM

87C528K EPROM

87C528K OTP EPROM

87C752A/D, PWM

80C31BHwith RAM

87C514K EPROM

87C51RB16K EPROM

87C51RC32K EPROM

87C528K EPROM

87C528K OTP EPROM

24 MHz

16 MHz

12 MHz

87C752A/D, PWM

89C528K Flash

Microcontrollers based on the industry-standard 8051 architecture. All products are available in hermetic packages including ceramic DIP, LCC, and JLCC.

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SRAM

16K x 4 2K x 8 32K x 8 2K x 16 4K x 16 8K x 16

7C162A45,35,25,20ns

7C199100,70,55,45,35,25,20,17,15,12ns

7C199100,70,55,45,35,25,20,15,12ns

Low Power

7C13255,45,35ns

7C13655,45,35ns

713370,55,45,35ns

713390,70,55ns

702470,55,45,35ns

702570,55,45,35ns

SRAM

Dual-

Port

SRAM

SRAM products are available in hermetic packages including ceramic DIP, LCC, and Flatpack

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CMOS PROMs

512 x 8 1K x 8 2K x 8 4K x 8 32K x 8 64K x 8

7C225A

OTP

UVErase

All e2v QP Semi programmable products have the die manufacturer's name marked in a three-letter code on

the back side of the package in order to select the appropriate programming algorithm.

7C235A 7C245A7C2717C274

7C287

7C281A7C282A

Registered Registered

7C292A7C291A

Registered

7C292A7C291A

7C245A

Registered

8K x 8

7C2617C2637C264

7C2617C2637C264

7C2717C274

7C287

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Bipolar PROMs

32 x 8 256 x 4 1K x 4 512 x 8 2K x 4 2K x 8

All e2v QP Semi programmable products have the die manufacturer's name marked in a three-letter code on

the back side of the package in order to select the appropriate programming algorithm.

82S12682S126A

82S141 82S181/A

82S13782S137A

1K x 8

82S185/A 82S191/AJust Released

Production

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EPROMs

8K x 8 16K x 8 32K x 8 64K x 8 64K x 16 256K x 8

27C64

All e2v QP Semi programmable products have the die manufacturer's name marked in a three-letter code on

the back side of the package in order to select the appropriate programming algorithm.

27C128 27C256 27C1024 27C020

28C64

28C64

128K x 8

27C01027C512

512K x 8

27C040

Byte Write and Page Mode

Byte Write onlyEle

ctr

icall

y

Era

sab

le

UV

Era

sab

le

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FIFO

512 x 9 1K x 9 4K x 9 8K x 9 16K x 9 64K x 9

7C42025,30,40,50,65,80ns

32K x 9

7C42125,30,40,50,65,80ns

7C42430,40,50,65,80,120ns

7C42530,40,50,65,80,120ns

7C43220,30,40,50,65,80,120ns

7C43320,30,40,50,65,80,120ns

7C460A30,50,80ns

7C462A20,30,50ns

7C464A15,20,25,40ns

7C466A15,25ns

FIFOs

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Analog

QP1631Perif. Driver

QP1632Perif. Driver

QP1634Perif. Driver

QP26LS30Line Driver

QP26LS31Line Driver

QP26LS32Line Receiver

QP26LS33Line Receiver

LM126QP584V RefVoltage

Regulator

Data

Converters

Interface

MC1650

Potential

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Analog

QP741 LM111QP5534ALow Noise

QP747

Op Amp

Quad

Op Amp

Dual

Op Amp

Single

Voltage

Comparator

QP710Diff

529Hi Speed Diff

QP2111Dual Diff

521Dual Diff

LM139Quad

LM108

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Programmable Logic

16 Inputs 20 Inputs 22 Inputs

8 Outputs

10 Outputs

16R8OTP,UV,Elect.Erasable

QPV750UV Erasable

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Programmable Logic

12 24

QPV2500Low Power

Electrically Erasable

UV Erasable

32 64 128 192

QPV2500

Macrocells

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e2v Logic Roadmap

ECL

Logic

54AC32

54AC161

54AC174

54ACT74

54ACT109

54ACT112

54ACT175

AC

Logic

10H515

10H525

Roadmap

2015

5V emitter-coupled logic (ECL)

5V CMOS logic process L50C

54ACT373

54ACT138

54AC138

54AC14

54ACT251

54ACT257

54AC273

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Logic Family: Re-Designs

e2v is ready to support your long-term Logic needs

Release in 2015 SMD# Description

54AC32 5962-87614012A, 5962-8761401CA, 5962-8761401DA Quad 2-Input OR Gate

54AC161 5962-89561012A, 59628956101EA, 59628956101FA Synchronous Pre-settable Binary Counter

54AC174 5962-87626012A, 5962-8762601EA, 5962-8762601FA Hex D-type Flip Flop with Clear

54ACT74 5962-8752501B2A, 5962-8752501BCA, 5962-8752501BDA Dual D-Type Positive Edge-Triggered Flip-Flop

54ACT109 5962-88534012A, 5962-8853401EA, 5962-8853401FA Dual JK Positive Edge-Triggered Flip-Flop

54ACT112 5962-8995001B2A, 5962-8995001BEA, 5962-8995001BFA Dual JK Negative Edge-Triggered Flip-Flop

54ACT175 5962-89693012A, 5962-8969301EA, 5962-8969301FA Quad D Flip-Flop

54ACT373 5962-87556012A, 5962-8755601RA, 5962-8755601SA Octal Transparent Latch with TRI-STATE Outputs

54ACT138 5962-87554012A, 5962-8755401B2A, 5962-8755401BEA 3 to 8 line decoder inverter (Operating range = 4.5V to 5.5V)

54AC138 5962-87622012A, 5962-8762201EA, 5962-8762201FA 3 to 8 line decoder inverter (Operating range = 2V to 6V)

54ACT273 5962-89735012A, 5962-8973501RA, 5962-8973501SA Octal D-type Flip-Flop with Clear

54AC14 5962-87624012A, 5962-8762401CA, 5962-8762401DA Hex Schmitt inverter

54ACT251 5962-89689012A, 5962-8968901EA, 5962-8968901FA 8-Input Multiplexer with TRI-STATE Output

54ACT257 5962-89599012A, 5962-8959901EA, 5962-8959901FA Quad 2-Input Multiplexer with TRI-STATE Outputs

54AC273 5962-87756012A, 5962-8775601RA, 5962-8775601SA Octal D Flip-Flop

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Since developing the world’s first microwave capable data converter over 20 years

ago, we have led innovation in data conversion technology, offering the lowest noise

vs. performance microwave capable ADCs and DACs on the market

ADCs and DACsMW frequency capable data solutions

ADCs• Latency as low as 5 ns

• Up to 4 channels at microwave

frequencies

• 12 & 10-bit solutions

DACs• Signal generation of up to 7 GHz

• Latency as low as 1 ns

• Full scale step response times as

low as 40ps

e2v.com/DACe2v.com/ADC

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e2v ADCs

Device Name Resolution Rate Channels Package

EV12AD500 12-bit 1.5 GSps 2 CBGA255

EV12AD550A 12-bit 1.5 GSps 2 CCGA323

EV12AS350A 12-bit 5.4GSps 1 EBGA380

EV12AS200A 12-bit 1.5 GSps 1 FPBGA196

EV12AS200 12-bit 1.5 GSps 1 FPBGA196

AT84AS001 12-bit 500 MHz 1 EBGA192

EV10AQ190A 10-bit 1.25 GSps / 2.5 GSps/ 5 GSps 4 EBGA380

EV10AS180A 10-bit 1.5 GSps 1 CICGA255

EV10AS150B 10-bit 2.6 GSps 1 EBGA317

EV10AS152A 10-bit 3 GSps 1 EBGA317

EV10AS150A 10-bit 2.5 GSps 1 EBGA317

AT84AS008 10-bit 2.2 GSps 1 CBGA 152 / CI-CGA 152

AT84AS004 10-bit 2 GSps 1 EBGA317

AT84AS00310-bit 1.5 GSps 1 EBGA317

TS83102G0 10-bit 2 GSps 1 CBGA 152

TS83102G0MGS 10-bit 2 GSps 1 CI-CGA 152

EV8AQ160 8-bit 1.25 GSps / 2.5 GSps / 5 GSps 4 EBGA380

EV8AQ165 8-bit 1.25 GSps / 2.5 GSps / 5 GSps 4 EBGA380

AT84AD004B 8-bit 500 MHz / 1 GSps 2 LQFP144

AT84AD001C 8-bit 1 GSps / 2 GSps 2 LQFP144

AT84AD001B 8-bit 1 GSps / 2 GSps 2 LQFP144

TS8388B 8-bit 1 GSps 1 CQFP68 / CBGA68

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E2v DMUXs & DACs

Device Name Resolution Rates Channels Package

AT84CS001 10-bit 2.2 GSPS 2 EBGA240 RoHS

EV10CS140 10-bit 3 GSPS 1 EBGA240 RoHS

TS81102G0 8/10-bit 1.5 GSPS 1 TBGA240

TS81102G0FS 8/10-bit 2 GSPS 1 TBGA240 / CQFP196

TS86101G2 10-bit 1.2 GSPS 1 CBGA255 / CICGA255

Device Name Resolution Rate Channels Package

EV12DS460 12-bit 7 GSps 1 fpBGA 196

EV12DS400A 12-bit 4.5 GSps 1 fpBGA 196

EV12DS400A 12-bit 4.5 GSps 1 fpBGA 196 - Military temp

EV12DS130A/B 12-bit 3 GSps 1 LGA255 / CICGA255 / CCGA255

EV12DS130A/B 12-bit 3 GSps 1 FPBGA196

EV10DS130A/B 10-bit 3 GSps 1 LGA255 / CICGA255 / CCGA255

EV10DS130A/B 10-bit 3 GSps 1 FPBGA196

DMUX Products

DAC Products

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INTRO:We are the global partner for

Peregrine’s RF integrated circuits and

DC-DC power management solutions,

based on Peregrine’s UltraCMOS®

technology, for space applications…

OUR SOLUTIONS:

• RF Switches

• Digital Step Attenuators

• Prescalers

• Phase Locked Loops

Peregrine UltraCMOS™ RFHi-rel RF solutions for Space applications

e2v.com/peregrine

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Product Family Portfolio

RF Switches

Mixers / Upconverters

Digital Step Attenuators

Phase Shifters

Core Chips

Phase Locked Loops

Prescalers

DC-DC Converters

LNAs

Product Families

DTCs

Product in ProductionProduct Sampling or in

Development

L S C X Ku Ka

e2v proprietary

Freq Bands

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Peregrine RF Switches & DSAs

Peregrine UltraCMOS™ RF Switches

Peregrine UltraCMOS™ Digital Step Attenuator (DSA)

PE9542x Block Diagram PE9354 Block Diagram EVK Boad

DSA Block Diagram EVK Board EVK GUI

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Peregrine UltraCMOS™ Prescalers

PE97240

Low Noise

PLL Synth

Active

Loop

Filter

PE9309

Divide-by-4

Prescaler

VCO

13GHz

Freq out

High frequency application example

3.25GHz 13GHz

Block Diagram

Typical Application

EVK Board

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Peregrine UltraCMOS™ PLLs

Part No. Type Ø Det

Output

Programming

Mode

Max. Input Operating Frequency Prescaler Normalized

Ø Noise

(dBc/Hz)

Vdd (V)

RF

(GHz)

REF

(MHz)

Compare

(MHz)

Min. Max.

PE9601 Integer-N CP Serial, Parallel,

Hardwire

2.2 100 20 10/11 -210 2.85 3.15

PE9701 Integer-N CP Serial, Parallel,

Hardwire

3.0 100 20 10/11 -210 2.85 3.15

PE9702 Integer-N PD Serial, Parallel,

Hardwire

3.0 100 20 10/11 -210 2.85 3.15

PE97022 Integer-N PD Serial, Parallel,

Hardwire

3.5 100 50 10/11 -216 2.85 3.45

PE9704 Integer-N PD Serial, Hardwire 3.0 100 20 10/11 -210 2.85 3.15

PE97042 Integer-N PD Serial, Hardwire 3.5 100 50 10/11 -216 2.85 3.45

PE9763 Fractional-N CP or

PD

Serial, Hardwire 3.2 100 20 10/11 -210 2.85 3.15

PE97632 Fractional-N PD Serial Hardwire 3.5 100 50 10/11 -216 2.85 3.45

PE97240 Integer-N PD Serial, Hardwire 4.0

5.0

100 100 5/6

10/11

-230

-228

2.6 2.8

PE97640 Fractional-N PD+CP Serial, Hardwire 4.0

5.0

100 50 5/6

10/11

-225

-223

2.6 2.8

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Peregrine UltraCMOS PLLs (Cont)

EVK Board EVK GUI

Loop Filter Calculation Spreadsheets

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Peregrine UltraCMOS™ DC-DC POLs

Family of DC-DC Buck Regulators

PE99155 (10A)

Monolithic

Synchronous Buck

Regulator

Input Voltage 4.6V – 6V

Output Voltage 1V – 3.6V

<1% initial accuracy

SYNC function 100KHz – 5

MHz

4.6 – 6V

PE99151 (2A)

Monolithic

Synchronous Buck

Regulator

Input Voltage : 4.6V – 6V

Output Voltage: 1V – 3.6V

<1% initial accuracy

SYNC function: 100KHz – 5

MHz

4.6 – 6V

PE99153 (6A)

Monolithic

Synchronous Buck

Regulator

Input Voltage: 4.6V – 6V

Output Voltage: 1V – 3.6V

<1% initial accuracy

SYNC function 100KHz – 5

MHz

4.6 – 6 V

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Peregrine UltraCMOS™ DC-DC POLs

EA

INM

EA

INP

VIN

AG

ND

VR

EF

Current ThresholdComparator

OSC

Control

Logic

Current Sense

SY

NC

Power

Good

SYNCOb

PGOOD

OUT

Reference

CurrentRSEL

ISET

RSET

ICOMP

GIREF

GICOMP

SSCAP

Error

Amplifier

EAOUT

SDb

Soft Start

GND

1.000V

agnd

Block Diagram

EVK Board

Component Calculation Spreadsheet

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DC-DC Typical Application

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DC-DC: SEE Test Results from TAMU

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GaN Power Product Offerings

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Peregrine GaN FET Driver

PE99101

* Required for symmetry only

*

*

Features• TID = 100krad (Si)

• SEL Immune

• High- and Low-side FET drivers

• Dead-time control

• Fast propagation delay, 8 ns

• Tri-state enable mode

• Sub-nanosecond rise and fall time

• 1A/2A peak source/sink current

• Package – Flip chip die and 16 pin ceramic LGA

Applications• DC–DC conversions

• AC–DC conversions

• Wireless power

• Class D amplifiers

16-Ball Flip-Chip

2.04mm X 1.64mm

16-Lead, 3mm x 3mm,

Ceramic

Land Grid Array

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GaN FET and GaN Driver Power Solutions

GaN FETs

• Breakthrough new power GaN FETs for

Hi-Rel applications with high current and

voltage options

Peregrine UltraCMOS™ PE99101 GaN Driver

• Tailored solutions to e2v / GaN Systems

FETs

Temp Range

• -55°C to 125°C

• Custom temperature ranges available

EVG100E30

100V /30A

EVG100E15

100V /30A

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GaN FETs in DC-DC Converters

� DC-DC converters are found in many Hi-Rel applications. They are the most efficient

way to convert from one DC voltage to a different DC voltage.

� Modern technologies demand increasing power, smaller size and lower power

consumption.

o GaN FETs enable higher current at high frequency and high efficiency, single-stage conversion, energy

savings at light load and fast transient response

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• GaN has superior performance to SiC, at 3x lower Cost

• GaN E-HEMT paralleling and Gate Driver much easier than SiC

Parameter Symbol Units SJ MOSFET Si IGBT SiCe2v GaN

Systems

Device Type , P/N: - -

CoolMOS™

(IPL65R070C7)

650V

Trenchstop™

(IKW30N60H3

)

600V

Wolfspeed

C3M0065090J

900V

E-HEMT

(GS665508)

650V

Switching Energy EON / EOFF mJ Not Specified 940 / 440 47 / 17 29 / 8

FOM (650V) QG*RDSON nC*mΩ 4,480 10,725 1,976 357

Reverse Recovery QRR nC 10,000 320 135 Zero

Specification Comparison: GaN vs. SiC

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Product Specification Comparison

Parameter Symbol Units SJ MOSFET Si IGBTe2v GaN

Systems

Device Type , P/N: - -CoolMOS™

(IPL65R070C7)

Trenchstop™

(IKW30N60H3)

E-HEMT

(GS665508)

Blocking Voltage BVDSS V 650 600 650

Continuous Current ΙDS A 28 30 30

RON (650V , 25A) RDSON mΩ 70 65 (VCE/ΙC) 55

Input Capacitance CISS pF 3,020 1,630 200

FOM (650V) QG*RDSON nC*mΩ 4,480 10,725 357

VGS Transient Limit VGS V < 20 < 20 + 10V

Package Inductance LSOURCE nH 2 12 0.2

Reverse Recovery QRR nC 10,000 320 Zero

EPC

eGaN™

200

20

(< 200V only)

(< 200Vonly)

(< 200V only)

< 6V

(< 200V only)

Zero

Choosing GaN systems/ e2v

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We have over 30 years’ experience supplying

hi-rel semiconductor products based on

commercial PowerPC and 68k architectures

that have been qualified, screened and

repackaged to satisfy the most severe

environmental conditions, including space.

Microprocessor solutionsHigh performance, high reliability, Integrated & Host processors

Integrated processor families include:•68k

•PC8XX PowerQUICC I

•603e PowerQUICC II

•e300 PowerQUICC II Pro

•e500 PowerQUICC III

•e600

•e5500 QorIQ

•e6500 QorIQ

e2v.com/processors

Host processor families include:•G2 (300 MHz)

•G3 (350-400 MHz)

•G5 (500-1500 MHz)

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Memory Products

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Memory solutionsHigh performance, high reliability, Integrated & Host processors

INTRO:e2v supports extended environment

operational requirements for many types of

Commercial-Off-The-Shelf (COTS) memories.

Memory offerings also include additional quality

testing as required by the customer and other

options such as burn-in, temperature cycling,

and various extended temperature ranges.

OUR SOLUTIONS:Memory types include DDR, PROM, FIFO,

MRAM, SRAM, Stacked & Flash.

TEMP RANGES:

Commercial temp

0°C to 90°C

Industrial temp

-40°C to 105°C

Military temp

-55°C to 125°C

Custom temperature ranges available

e2v.com/memory

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Memory Markets

Micron

Stacked

EP/SnPb

Extended Temp

Space

MRAM

Mil Temp

Stacked

Space

Other

SRAM

EEPROM

FRAM

Space

Memory Solutions

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e2v Memory value added

� Expanding support for Micron’s Product longevity

Program (PLP)

� Partnership with Integrated Silicon Solution Inc. (ISSI)

� EVERSPIN partnership on MRAM products

� e2v can provide additional services such as:

o Leaded Re-balling service (non-RoHS)

o Extended temperature ranges up to -55°C to 125°C

o Additional screening and qualifications

o Package-On-Package Module (POP)

o Space Efficiency

o Enhances Memory Density

� Customized ordering optionso DLA Vendor ID (VID)

o Standard e2v part number

o Customer SCD

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MRAM Memory

Information form JPL report

Magnetic Field Immunity

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e2v HiRel extended Temp Memory

� Support for extended temp offering with ISSI memories

o -40ºC to 125ºC

o -55ºC to 125ºC

� Extended temp partnership

� e2v part number

o e2v own the sale engagement

o Full product support

ISSI

memoriesExtended Temp

Characterization

Extended Temp

Prod release

e2v Part #

& Support

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INTRO:Qormino™, the smart, small and

powerful processing solution that combines

NXP QorIQ™ T series processors with RAM

memory on e2v’s custom substrate.

The Qormino™ line’s cutting edge memory

package offers 50% size savings compared to

traditional alternatives, offering:

•High performance vs. reduced board size

•Reduced time-to-market

•15+ years availability

Integrated processor and memory

solutionsThe new embedded processing solution from e2v, Qormino™

e2v.com/qormino

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Proposed 1GB DDR3 MCM2

7.0

mm

15.625mm

527pin MAX Φ0.53mm

0.8mm

0.8

mm

Module outline : 15.625 x 27.0mm t=TBDBall pitch : 0.8mm Pitch

Ball size : Φ0.53mmBall matrix : 527pin MAXNote : BGA corner should be in NC pin.

Signal line should be placed in the 527pin center.

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Proposed 4GB DDR3 MCM5

2.1

mm

27.0mm0.8mm

0.8

mm

25pin Φ0.53mm

483pin Φ0.53mm

0.8mm

0.8

mm

Module outline : 52.1 x 27.0mm t=TBDBall pitch : 0.8mm PitchBall size : Φ0.53mmBall matrix : 483pin + 25pin x 4

Note : 25pin should be in VCC, GND or NC pin.

BGA corner should be in NC pin.

Signal line should be placed in the 483pin center.

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4GByte (512M x 72) DDR3L

ModuleBGA Package: 15mm x 20mm x 1.5mm, 391-Ball, 0.8mm Pitch, 0.5mm Ball Height

• Available as 64Meg x 72 x 8 banks x 1 Channel or 64Meg x 40 x 8 banks x 2 Channels

• VDD=VDDQ=1.35V.

• Backwards compatible with 1.5V.

• Center-terminated I/O.

• Nominal and dynamic on-die termination for data, strobe, and mask signals.

• High-TCE organic laminate interposer for improved glass stability over wide operating

temperature (-55 to 125C).

• Available with SnPb or SAC solder balls.

• Available in the following speed grades:

• DDR3-1333

• DDR3-1600

• DDR3-1866

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4GByte (512M x 72) DDR3L

ModulePackage Outline Drawing

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4GByte (512M x 72) DDR3L

Module

55

8GByte (1024M x 64) DDR3L

ModuleBGA Package: 16mm x 22mm x 1.7mm, 273-Ball, 1.0mm Pitch, 0.35mm Ball Height

• Available as 64Meg x 64 x 8 banks x 1 Rank or 64Meg x 32 x 8 banks x 2 Ranks.

• VDD=VDDQ=1.35V.

• Backwards compatible with 1.5V.

• JEDEC Standard Ball-Out.

• Center-terminated I/O.

• Nominal and dynamic on-die termination for data, strobe, and mask signals.

• High-TCE organic laminate interposer for improved glass stability over wide operating

temperature (-55 to 125C).

• Available with SnPb or SAC solder balls.

• Available in the following speed grades:

• DDR3-1333

• DDR3-1600

• DDR3-1866

56

8GByte (1024M x 64) DDR3L

ModulePackage Outline Drawing

57WE PARTNER WITH OUR CUSTOMERS TO IMPROVE, SAVE AND PROTECT PEOPLE’S LIVES

E2V Signal Chain Solutions

58

Example of a Signal Chain

Solution

� e2v, Peregrine and Gan Systems in your system

DAC

FPGA

/

ASICADC

DC Supply

FPGA

/

ASIC

Frequency Synthesis Module

TX RF RX RF

LO

DC/DC

Converters

Sampling clockSampling clock LO

Power rails Power rails

Tx Module Rx Module

Power conditioning module

Secondary voltage regulators

59

Example of a Ku Band Signal

Chain Solution

FPGA

/

ASIC FPGA

/

ASIC

TX RF RX RF

LO 3 GHz

Fclk=3GHz

LO

3.4 V

Tx Module Rx Module

EV12DS130

3.3 V5 V

PE99153 PE99153 PE99153

Power supply

DC converter

PE97022

VCO

Ref

Osc.VCO

LO

PExxxxx

Vin_max = 6 V

PA

LNA

PE91902

EV12AD550

2ndary regul.

1ary regul.

PE91901

LNA

12-19GHz 12-19GHz

60WE PARTNER WITH OUR CUSTOMERS TO IMPROVE, SAVE AND PROTECT PEOPLE’S LIVES

e2v Integrated Solution Products (ISP)

Hector RiveraSr. Business Development ManagerHigh Reliability Semiconductor Solutions

[email protected]

61

e2v/ApisSys Key Product Applications

Electronic Warfare:

ECM – DRFM : E2V-AV104

ESM – RWR : E2V-AV107,

E2V-AV121

LIDAR – LADAR: E2V-AV101

Companion Products:

E2V-AV108, E2V-AV109, E2V-AV112

Radar – Phase Array:Phase Array - AESA : E2V-AV113,

E2V-AV107, E2V-AV118, E2V-AV119,

E2V-AV121

SAR Radar : E2V-AV121

Wide Band Radar Transmitter –

Receiver : E2V104, E2V-AV118,

E2V-AV119

Broadband Communication:

E2V104, E2V-AV118, E2V-AV119

http://www.e2v-us.com/signal-processing-solutions/

e2v Signal Processing Solutions web site:

62

Broadband system Products

Quick reference selection table

Products Form Factor FPGA Description

AF101 FMC HPC FMC Test Board

AF202 FMC HPC Wide band Receiver; 2 channel 12-bit, 1.5 Gsps ADC in a FMC form factor

AF204 FMC HPC

Wide band Transceiver; Single Channel 12-bit 3 Gsps DAC or Dual Channels 12-bit

1.5 Gsps FMC

AV101 3U OPENVPX

Virtex 6- LX195T or LX204 or

SX315 Wide-band Receiver; 1 channel 10-bit 10Gsps ADC

AV104 3U OPENVPX Virtex 7 - 485T or 690T Receiver: 2 channels 10-bit 3 Gsps ADC, 1 channel 12-bit 3 Gsps DAC

AV107 3U OPENVPX Virtex 7 - 415T or 690T Phase -Array Radar - Receiver EW- ESM; 4 Channel 2.5 Gsps 12 bit ADC

AV108 3U OPENVPX Xilinx ZYNQ 7030 or 7045 Single Board Computer

AV109 3U OPENVPX Virtex 7 - 415T or 690T

3U VPX Virtex® 7 FPGA with Triple QSFP + interfaces board for wideband

communication and signal processing

AV112 3U OPENVPX Virtex 7 - 690T or 980T

3U VPX Virtex® 7 FPGA with single QSFP + interfaces board for wideband

communication and signal processing

AV113 3U OPENVPX Virtex 7 - 415T or 690T Phase-Array Radar- Receiver, EW-ESM COMINT MIMO

AR102 3U VPX RTM 3U VPX Rear Transition Module for AV products

AR103 3U VPX RTM 3U VPX Rear Transition Module for AV108

AC101 3U VPX 3U VPX Open Frame Development Chassis

AC102 3U VPX 3U VPX 5 Slots Desktop Chassis

63

Environmental Conditions

Air Standard

(AS)

Air Rugged

(AR)

Conduction Standard

(CS)

Conduction Rugged

(CR)

VITA47 EAC4 EAC6 ECC3 ECC4

Operating

Temperature*

0°C to +55°C -40°C to +70°C -40°C to +70°C -40°C to +85°C

StorageTemperature -40°C to +85°C -40°C to +85°C -50°C to +100°C -55°C to +105°C

Vibration** 100Hz to 1000Hz:

PSD=0.04g2/Hz

100Hz to 1000Hz:

PSD=0.04g2/Hz

100Hz to 1000Hz:

PSD=0.1g2/Hz

100Hz to 1000Hz:

PSD=0.1g2/Hz

Shocks 20g, 11 ms, half-sine 20g, 11 ms, half-sine 40g, 11 ms, half-sine 40g, 11 ms, half-sine

Operating Relative

humidity

0% to 95%

non-condensing

0% to 95%

non-condensing

0% to 95%

non-condensing

0% to 95%

non-condensing

Operating Altitude 0 to 10,000 ft

with adequate cooling

0 to 30,000 ft

with adequate cooling

0 to 30,000 ft 0 to 60,000 ft

Conformal Coating No Optional

(default acrylic AVR80)

Yes

(default acrylic AVR80)

Yes

(default acrylic AVR80)

•* For Air Standard and Air Rugged, airflow required at sea level will be defined later (default 10 - 20 CFM).

•For Conduction Standard and Conduction Rugged, temperature is measured at card edge.

•** 5Hz to 100Hz: power spectral density (PSD) increasing 3 dB/octave, 1000Hz - 2000Hz: PSD decreasing 6 dB/octave.

64

INTRO:

We provide a range of digitizers, for

demanding applications that require

high speed and high resolution, from

the newly joined SP Devices.

Many products utilize SP Devices’

patented ADX technology resulting in

an unmatched combination of sampling rate,

resolution, and dynamic range.

OUR SOLUTIONS:•Extension modules

•Design tools

•OEM Design Services

Digitizers from SP DevicesDeveloped on world-leading, patented IP

e2v.com/digitizers

65

System and Demo Inclusions

66