Dewey Benson Honeywell - NASA Benson Honeywell. ... MAU Module (Dual Slot I/O Card) Avionics have...

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NASA GRC Propulsion Controls & Diagnostics Workshop 9 December 2009 Cleveland, Ohio Dewey Benson Honeywell

Transcript of Dewey Benson Honeywell - NASA Benson Honeywell. ... MAU Module (Dual Slot I/O Card) Avionics have...

Page 1: Dewey Benson Honeywell - NASA Benson Honeywell. ... MAU Module (Dual Slot I/O Card) Avionics have been integrating multiple suppliers’ equipment into a distributed system for years.

NASA GRC

Propulsion Controls & Diagnostics Workshop

9 December 2009

Cleveland, Ohio

Dewey Benson

Honeywell

Page 2: Dewey Benson Honeywell - NASA Benson Honeywell. ... MAU Module (Dual Slot I/O Card) Avionics have been integrating multiple suppliers’ equipment into a distributed system for years.

Honeywell Proprietary

Considerations for Distributed Engine Control

Key Technologies

Putting it all together – a system architecture

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1 Air Valves (LPT) (HPT)

Turbine Case Cooling Valves

Air/Oil Cooler

Permanent Magnet Alternator / Generator

Air Turbine Starter

Start Bleed Valve

Turbine Vane Blade Cooling Air Valve

Cowl Anti-Ice

Fuel Metering Unit

Supplemental Control Unit10

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1 Air Valves (LPT) (HPT)

Turbine Case Cooling Valves

Air/Oil Cooler

Permanent Magnet Alternator / Generator

Air Turbine Starter

Start Bleed Valve

Turbine Vane Blade Cooling Air Valve

Cowl Anti-Ice

Fuel Metering Unit

Supplemental Control Unit

Electronic Engine Control/FADEC

Health Monitoring Diagnostic System

Thrust Reverser Actuation System and

Shutoff Valves

Hydraulic Pump

Variable Bleed Actuator System

Inlet Guide Vane Actuation System

Fuel/Oil Heat Exchanger System

Lube and Scavenge Pump

Fuel Flow Metering Valve and Dividers

Surface Cooler

Nozzle Actuation

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Electronic Engine Control/FADEC

Health Monitoring Diagnostic System

Thrust Reverser Actuation System and

Shutoff Valves

Hydraulic Pump

Variable Bleed Actuator System

Inlet Guide Vane Actuation System

Fuel/Oil Heat Exchanger System

Lube and Scavenge Pump

Fuel Flow Metering Valve and Dividers

Surface Cooler

Nozzle Actuation

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Moving the electronics from single box here

To multiple nodes here

Presentation Outline

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Lessons Learned• MAC modules successfully re-used across multiple applications• Network partitioning and composibility demonstrated• Great development schedule gains from systematic solutions to redundancy management• Dispatch Drives Fault-Tolerance => more fault tolerance is better.• Network hub required to assure system integrity

Hub is not conducive to physically distributed control system

Generation 1: Modular Aerospace Control ( MAC)

Distributed Engine Controls – Gen 1 Experience

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Lane A – Sensors and Actuators

HostProcessor

Bus InterfaceController

Power & I/OConditioning

Bus InterfaceController

HostProcessor

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HostProcessor

Power & I/OConditioning

Lane B – Sensors and Actuators

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Hub A Hub B

• Born out of NASA funded research to

investigate modular certification

• Distributed, dual-lane configuration

• Based on TTP/C

• Smart sensor and actuation ‘nodes’

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DevelopmentHigher cost for the first applicationLower cost for each new applicationFaster development and qualification time New systems would be composed of mostly existing modules

UpgradesFaster, cheaper upgrades – easily modify or add new funcitionalityObsolescence will cost less - only modules affected are redesigned

MaintenanceBetter fault isolationQuicker turn-around-timeLower maintenance costLower spares provisioning

Lower WeightDrastic reduction in wiring harness weight

Lower

Distributed Controls – Gen 1 Experience

Page 5: Dewey Benson Honeywell - NASA Benson Honeywell. ... MAU Module (Dual Slot I/O Card) Avionics have been integrating multiple suppliers’ equipment into a distributed system for years.

Key TechnologiesNetwork Availability & Criticality Drives network and

system designHigh Temperature Electronics Cost vs QuantityDistributed computation Drives module designIntegrating smart sensors & actuators from different

manufacturers

Resources ArchitectureMore computational power is needed to support:

►Model-based Controls

►Predictive Health Management (PHM)

More sensors used to support PHMMore actuation needed to support advanced engine cycles

The Challenges

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message message

message

node 1 node 2 node 3

The Integrity

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BRAIN Allows Integrity + Robustness Geographic brother’s keeper guardian action

Every node compares data forwarded from neighbor with data forwarded on skip link

Enables independence without separate silicon

Enables low complexity sensors and actuators

TT-GbE is Time Triggered Gigabit Ethernet 1 Gigabit copper or 10 Gigabit optical network

Deploying on NASA CEV program for Orion Vehicle

An aerospace-specific subset of Ethernet

TT-GbE is a scaleable, highly deterministic, fault-tolerant Ethernet

Compatible with avionics standard ARINC 664

Concurrent Availability + Integrity Without Hub

Key Technology – Networks

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Distributed Controls - The Avionics Experience

MAU Module

(Dual Slot I/O Card)

Avionics have been integrating multiple suppliers’

equipment into a distributed system for years.

System Integration Through A ‘Virtual Backplane’TM

Page 8: Dewey Benson Honeywell - NASA Benson Honeywell. ... MAU Module (Dual Slot I/O Card) Avionics have been integrating multiple suppliers’ equipment into a distributed system for years.

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21 Air Conditioning

21 Pressurization

24 Primary Power

24 Secondary Distribution

26 Fire Detection

26 Fire Suppression

27 Flight Controls

28 Fuel Gauging Embedded

28 Fuel Management

29 Hydraulics

30 Ice and Rain Protection

32 Anti-skid Braking

32 Nosewheel Steering

32 Landing Gear Control / Proximity System

33 Lighting

38 Water and Waste

49 APU Control

49 APU Door Control

52 Door Monitoring

74 Ignition

77 Engine Vibration Monitoring

78 Thrust Reversers

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21 Air Conditioning

21 Pressurization

24 Primary Power

24 Secondary Distribution

26 Fire Detection

26 Fire Suppression

27 Flight Controls

28 Fuel Gauging Embedded

28 Fuel Management

29 Hydraulics

30 Ice and Rain Protection

32 Anti-skid Braking

32 Nosewheel Steering

32 Landing Gear Control / Proximity System

33 Lighting

38 Water and Waste

49 APU Control

49 APU Door Control

52 Door Monitoring

74 Ignition

77 Engine Vibration Monitoring

78 Thrust Reversers

80 Starting

Module Host Software Host

Application provider / Integration participants- Smiths Industries- BF Goodrich- ELDEC- ABSC- Hydro-Aire- Messier-Dowty Electronics- Liebherr- Vibro-Meter- Hamilton-Sundstrand- Kidde- Whitaker- Kieser- Moog- Vickers- Parker- Multiple Honeywell Sites

The Avionics Experience - Integration of Multiple Suppliers

Distributed Controls –

Do Not Fear

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Issues• High temp electronics have been the “show stopper” in past attempts:

• Lack of available parts to make a full distributed node

• Difficulty of getting non-volatile memory to work at high temp

• Cost of solutions

• User community wants the same cost as low temp electronics

• Compact size desired

Trade-offs• Standard silicon solutions versus Silicon-On-Insulator (or Sapphire) or SiC

• Build up solutions from discrete parts or develop custom chips (ASICs)

• Temperature capability versus reliability

Specific application needs could dictate different solutions

Key Technology – High Temp Electronics

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2 Million Device Hours Worth Of Life Test Data

Standard Catalog Products:HTOP01 Dual Precision Op Amp HT1104 Quad Operational AmplifierHT1204 Quad Analog SwitchHTPLREG Voltage Regulators HT83C51 8-bit Micro ControllerHT6256 256Kbit SRAM (32K x 8)HT506 Analog Multiplexer (16:1)HT507 Analog Multiplexer (8:2)HTCCG Crystal Clock GeneratorHTNFET N-channel power FET

Custom Capabilities:• Gate Arrays

• MCM (Multi-Chip Modules)

• High Temperature Design Services

Products in Development:• HTA/D Converter (12 and 18 bit)

• HTEEPROM

• HTFPGA

• Reconfigurable Processor for Data Acquisition (RPDA)

High Temperature Part Availability Is Limited Compared to Bulk Si

Significant new parts developed from DOE funding

Key to flexibility:

Only High Temperature Non-volatile memory

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Need collaboration to overcome high development costs

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Take-awaysHow To Get The Most Out Of High Temperature Electronics

• Come at the solution from top and bottom

• Users need to define a cost point that still yields benefits

• Consensus design for high temp end products (node, data concen., etc)

• Develop accurate estimate around consensus designs

• Identify a flexible architecture – few chips cover all end products

• Incorporate into as few parts as possible to minimize cost Custom ASICs

• Users, suppliers, and gov’t share cost to develop high temp nodes

• Shared access to resulting products

• Use DOE Deep Trek program as model

Page 12: Dewey Benson Honeywell - NASA Benson Honeywell. ... MAU Module (Dual Slot I/O Card) Avionics have been integrating multiple suppliers’ equipment into a distributed system for years.

First Attempt At High Temperature Electronics

• Tested at 200C

• Microcontroller w/ BIT

• 1553 Interface

• PWM Torque Motor Drive

• Position Sensor Interface

• 0.57 lbs

• 1.2 x 2.3 x 3.4 inches

Non-Volatile Memory problem solved

Hi-T Electronics Consortium being formed to solve cost

High Temperature Servoactuator Electronic Interface Unit (EIU)

Circa 1999, Funded by Air Force Research Labs

Detractors in 1999 were cost and inflexibility due to lack of non-volatile memory

Page 13: Dewey Benson Honeywell - NASA Benson Honeywell. ... MAU Module (Dual Slot I/O Card) Avionics have been integrating multiple suppliers’ equipment into a distributed system for years.

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Airframe Switches.

IMA (front)

Generic Computational

Resources.

Networked via Gbs Time-

Triggerd Ethernet

IMA (rear)

Generic Computational

Resources.

Networked via Gbs Time-

Triggered Ethernet

Distributed On Engine

Components Networked

Via Fault-Tolerant

Ethernet 10mbs

BRAIN

10Mbs

Ethernet

BRAIN

10Mbs

Ethernet

BRAIN

Gbs -> 10mbs

Ethernet Interfacing Via

Normal Switching Action

Generic High

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Computational

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Cross-engine

Data Exchange

Via

Gbs Ethernet

• Shared computing resources

• Shared power supplies

• Distributed control

• Integrated Model-based controls

+ Vehicle Health Management

Putting It All Together – A Distributed Architecture

Page 14: Dewey Benson Honeywell - NASA Benson Honeywell. ... MAU Module (Dual Slot I/O Card) Avionics have been integrating multiple suppliers’ equipment into a distributed system for years.

Most challenges are well understood and demonstrated: Distributed control

Smart nodes

Distributed computation

High integrity, high availability networks

What’s left? Define a common architecture

Define a common reusable, scalable set of parts

Move high temp electronics across the goal line!

Build and demonstrate an end system

Summary

Page 15: Dewey Benson Honeywell - NASA Benson Honeywell. ... MAU Module (Dual Slot I/O Card) Avionics have been integrating multiple suppliers’ equipment into a distributed system for years.

Verification of Adaptive Control Techniques

Integrated Engine and Flight Controls

Engine Health Management Contribution to Flight Management Real-time flight assessment and fault accommodation

Continuous thrust available and fuel efficiency

Alternate flight plan solutions (i.e. return, divert, etc)

Combined Fault Accommodation of Flight/Engine ControlsControl reconfiguration to maximize flight envelope

Recognition of unstable configurations

Invoke extreme measures to regain stable configuration (e.g. overthrust)

Autonomous Civilian FlightSingle pilot cockpit No pilot capability

www.wondershare.com

Other Research Priorities