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19-Oct-2005 Design Trends in deep-submicron CMOS with example of GPS-Receiver Dr. Srinivasan Venkatraman Texas Instruments Inc., Dallas, Tx.

Transcript of Design Trends in deep-submicron CMOS with example … · Design Trends in deep-submicron CMOS with...

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19-Oct-2005

Design Trends in deep-submicron CMOS with example of GPS-Receiver

Dr. Srinivasan VenkatramanTexas Instruments Inc., Dallas, Tx.

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• In the late 1950s, a new aircraft carrier had 350,000 electronic components, requiring millions of hand-soldered connections – "tyranny of numbers" (Jack Kilby)

- Transforming Nature- Michael E. Gorman, University of Virginia

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Today…

•Shrinking geometries enable more than 10-Million devices per die.–New problems and issues.–New Opportunities for innovation

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Deep-Submicron CMOS-Opportunities

• Shrinking geometries ? more transistors.• Smaller devices ? Higher ft & faster

transistors.• More transistors ? Complex digital

processing and more digital content.• More integration ? The economic drive

of lowering the cost of electronics.

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Deep-Submicron CMOS - Issues• Smaller geometry ? Lower supply voltage.• Smaller devices ? More 1/f noise.• Smaller devices ? More leakage.• Higher digital gate density ? Larger portion

of silicon is taken by analog circuits (Need to shrink, to gain economic edge).

• More integration ? Isolation issues between various sub-modules of the system.

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System-on-chip - Examples• Network processors• Graphics Processors• Bluetooth tranceivers• WLAN transceivers• GPS receivers• GSM transceivers

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System design –Changing paradigms

• What works in regular system design may-not work for SoC.

• The building blocks available are slightly different –– Eg: Transmission lines & stubs are not available easily

on an IC.– Using SAW filters is an expensive option, mainly due to

off-chip interface, pins & board space.

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GPS Receiver architecture

LNA

mixer

Jammerrejectfilter

polyphase

VGA SigmadeltaADC

Digital IFfilter & AGC

LO-I

LO-Q

Chipinput

SYNTH DIV DIVVCO

256MHz 16MHzOSCTCXO

OSC

Antenna

Ceramicfilter

Matchingnetwork

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Front-end

BIAS

RF_in

LO-IM

MIXER_I

MIXER_Q

I-IF-out

Q-IF-out

LNA

Biasing not shown

LO-IP LO-IM

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IF chain signal processing• Deep-submicron process not suitable

for accurate analog filtering

20dBSNR

coarse or nogain step

wider filter Excess noise and variable power level

higherSNR

fine gain stepAccurate filter Fixed power levelVariable signal Level at IF input

Accurate analog processing

Relaxed analog processing

Variable signal Level at IF input

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Jammer reject filter

bias

inp inm

op

bias

bias

om

bias

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PolyPhase Filter

IP

IM

QM

QP

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Passive continuous time delta-sigma ADC

refp

inmou

t

quantizerinp

refm re

fm

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Digital filter architecture

Delta Sigma Modulator

4rth

order Comb

11 tap Half Band

48 tap FIR

261.888M samples/s

65.472 M samples/s

32.736 M samples/s13 tap FIR 16.368 M

samples/s

4 2 2

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Synthesizer architecture

Num. ofPrescaler cycles in one compare

multiplication (M)

F-compare

? -acc

?

?

-

+

DIV 4/5

Main digital divider (M) DIV 5 timer

Midpoint offset

Varacter

DIV 2

Digital tuning loop

Main dividers

Loopfilter

PFDCharge pump

Type-II analog loop

VCO

Capacitor array

• Type-II analog integer-N PLL• Type-I digital tuning loop for PVT calibration of VCO Freq.

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VCO

digital tune

vtune

bias

• LC tank with metal-spiral and MOS varactor

• Switched capacitor (MIM) array to augment the tuning range

• Cross-coupled MOS gain stage for negative resistance

• Self-tracking bias to minimize supply pull on VCO frequency

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Challenges• Low Supply Voltage (1.4 volts). • SoC integration of RF + Base-band.• Achieve high-linearity of RF front-end.• Choice of pin-out to minimize package coupling.• Floor-plan to minimize influence of digital noise on RF

circuits.• Isolation of supplies and grounds (power supply coupling).• IR drop analysis and isolation of high-activity regions.• Minimize power-supply spikes and use de-coupling

capacitors to provide switching current.• Judicious use of guard rings to isolate noise.

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Receiver response

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De-sense with out-of-band jammers

2.05

2.10

2.15

2.20

2.25

2.30

2.35

2.40

2.45

1850 1860 1870 1880 1890 1900 1910

Blocker Frequency [MHz]

NF

[dB

]

WCDMA/CDMA1900

Blocker OFF

• Noise figure without any jammer is 2.05 dB • With -31dBm jammer at 1850MHz the Noise figure goes up to 2.3 dB• With stronger LO drive (elevated supply) the desense is < 0.1dB

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Phase noise at LO/4

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Measured Performance

1.8 dBNoise Figure38 dBGain

5dBmIIP3 (@ 1576MHz and 1576.5MHz)

38dBDynamic RangeADC

0.1dBPCS band jammerdesense

-11 dBS11

LNA + IRM

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Performance Continued…

12.8 mm2Die Area

100msLock Time

2 degIntegrated rms Phase error

-113dBc/HzPhase noise at 1MHz-88dBc/HzPhase noise at 100KHz

60mA @ 1.4VPower18dBImage rejection

FULL RECEIVER-60dBcReference Spur

SYNTHESIZER

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Single-Tone Response of Receiver

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Spot Noise-Figure of Receiver

2.823.683.543.062.26NF at ADC output (dB)

1.51

8.87

500

1.51

2.63

250

1.51

2.59

0

1.51

2.49

-250

1.51Front-end NF (dB)

8.43

-500

NF (dB) at Baseband

Basebandfreq.(kHz)

• NF at ADC output is degraded due to high speed digital output• NF from base-band is better as digital test buffers are off• NF within the narrow bandwidth of base-band filter is good• Indicates substrate coupling does not degrade the RF performance

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ADC

IF

VCOPLL

LNAMixer

LDO

Base-bandCore

Memory

Memory

ARM

digitalfilter

GPS Receiver –Texas Instruments13 mm2 –0.09 µM CMOS (2005)

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Single-chip GPS receiver ST-Microelectronics23 mm2 – 0.18 µM CMOS (2004)

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Single-chip GPS Receiver - Sony Corporation40 mm2 - 0.18 µM CMOS (2004)

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Conclusion

• It is possible to get high-performance SoC for complex functions.

• Effective isolation methods are necessary before such SoC products can be widely used.

• Shifting analog gain and processing into digital domain is still necessary for SoCs.

• Regular 90nm CMOS process can still be used, provided design innovations address the shortcomings.

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Open Problems• Power dissipation and power-density is high.• Thermal issues – too much heat generation.• Isolation issues – Getting enough isolation is still a

black-magic art. Modeling & design methods need to improve, so that it can be routinely achieved.

• New architectures that use wider bandwidth (faster transistors, but lower capacitance and area are needed).

• Driving interfaces takes power – be it air-interface or off-chip interfaces. RF power amplification needs to be effectively addressed.

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References• A 23mm2 Single-Chip 0.180µm CMOS GPS Receiver with

28mW- 4.1 mm2 Radio and CPU/DSP/RAM/ROM• G.Gramegna, M.Losi, P.Mattos, S.Das, M.Franciotta,

N.G.Bellantone, M.Vaiana, V.Mandara, M.Paparo.• IEEE CICC 2004,

• A Complete Single-Chip GPS Receiver With 1.6-V 24-mW Radio in 0.18-m CMOS

• Takahide Kadoyama, Norihito Suzuki, Member, IEEE, Noboru Sasho, Hiroshi Iizuka, Ikuho Nagase, Hideaki Usukubo, and Masayuki Katakura, Member, IEEE

• IEEE JSSC, VOL. 39, NO. 4, APRIL 2004