Design of an Adhesion Tester for High Temperature Superconductors By Cory Spicer
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Design of an Adhesion Tester for High Temperature Superconductors By Cory Spicer Advised by Professor Bucinell Introduction High temperature superconductors are approaching widespread use in power transmission devices, and promise substantial improvements over current systems, both economically and technologically. However, performance of manufactured HTS products can vary greatly, and more research and characterization is still needed. One identifying feature of a modern YBCuO superconductor is the lamination strength between layers in the material, and a reliable method of accurately determining the adhesive strength of samples is required. This project focused on developing a Stud Pull Adhesion tester to determine this adhesive strength on second generation (2G) HTS samples from Superpower, Inc.. Substrate ~ 80nm alumina Superconductor Stabilizer ~ 10nm IB A D M gO ~ 30nm STO ~ 30nm Hom o-epiM gO ~ 7nm yttria Substrate ~ 80nm alumina Superconductor Stabilizer ~ 10nm IB A D M gO ~ 30nm STO ~ 30nm Hom o-epiM gO ~ 7nm yttria Layered construction of second generation HTS Material (NIST) Materials and Methods A prototype adhesion tester which was built at NIST was used as a starting point from which to refine the design and adapt it for local use. The entire existing design was put into SolidWorks, and extensive modifications were made, along with newly designed parts. Then, finite element software was used to analyze the strength of each design component, and any necessary changes were implemented. Final engineering drawings of the full set of parts (containing around a dozen pieces in three assemblies) were produced, and the part was slotted for production in the Union machine shop. Fully Assembled NIST Prototype Transverse Tension on a 2G HTS Material Results COMSMOS Works finite element modeling showed that none of the steel pieces of the device would fail under a 600 pound load, which is more than twice as high as the typical failure load for the initial NIST data. In addition, a more detailed investigation of the interface between the sample, the anvils, and the adhesives used to connect them was performed using COSMOS. This analysis indicated that purely transverse loads would not cause stress concentrations across the surface of the sample. Examples of various finite element analyses using COSMOS Works (left, center) and COSMOS (right). esign Features igned for loads up to 600 pounds, corresponding to stresses up to 65 MPa pted to fit into the load frame in Professor Bucinell’s lab options for securing lower anvil: plate or universal joint ils made of Hastelloy C276, remainder made of AISI 8630 alloy steel Top Section Universal Joint Bottom Section Flat Plate Bottom Section Acknowledgements -Professor Bucinell, Project Advisor -Jody Reeves, Superpower, Inc. -Jack Ekin and Danko van der Laan, NIST
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Design of an Adhesion Tester for High Temperature Superconductors By Cory Spicer Advised by Professor Bucinell. Introduction - PowerPoint PPT Presentation
Transcript of Design of an Adhesion Tester for High Temperature Superconductors By Cory Spicer
Design of an Adhesion Tester for High Temperature SuperconductorsBy Cory Spicer
Advised by Professor Bucinell
Introduction High temperature superconductors are approaching widespread use in power transmission devices, and promise substantial improvements over current systems, both economically and technologically. However, performance of manufactured HTS products can vary greatly, and more research and characterization is still needed. One identifying feature of a modern YBCuO superconductor is the lamination strength between layers in the material, and a reliable method of accurately determining the adhesive strength of samples is required. This project focused on developing a Stud Pull Adhesion tester to determine this adhesive strength on second generation (2G) HTS samples from Superpower, Inc..
Substrate~ 80nm alumina
Superconductor Stabilizer
~ 10nm IBAD MgO
~ 30nm STO~ 30nm Homo-epi MgO
~ 7nm yttria
Substrate~ 80nm alumina
Superconductor Stabilizer
~ 10nm IBAD MgO
~ 30nm STO~ 30nm Homo-epi MgO
~ 7nm yttria
Layered construction of second generation HTS Material (NIST)
Materials and Methods A prototype adhesion tester which was built at NIST was used as a starting point from which to refine the design and adapt it for local use. The entire existing design was put into SolidWorks, and extensive modifications were made, along with newly designed parts. Then, finite element software was used to analyze the strength of each design component, and any necessary changes were implemented. Final engineering drawings of the full set of parts (containing around a dozen pieces in three assemblies) were produced, and the part was slotted for production in the Union machine shop.
Fully Assembled NIST PrototypeTransverse Tension on a 2G HTS Material
Results COMSMOS Works finite element modeling showed that none of the steel pieces of the device would fail under a 600 pound load, which is more than twice as high as the typical failure load for the initial NIST data. In addition, a more detailed investigation of the interface between the sample, the anvils, and the adhesives used to connect them was performed using COSMOS. This analysis indicated that purely transverse loads would not cause stress concentrations across the surface of the sample.
Examples of various finite element analyses using COSMOS Works (left, center) and COSMOS (right).
Final Design Features - Designed for loads up to 600 pounds, corresponding to stresses up to 65 MPa - Adapted to fit into the load frame in Professor Bucinell’s lab
- Two options for securing lower anvil: plate or universal joint
- Anvils made of Hastelloy C276, remainder made of AISI 8630 alloy steel
Top Section Universal Joint Bottom Section Flat Plate Bottom Section
Acknowledgements
-Professor Bucinell, Project Advisor
-Jody Reeves, Superpower, Inc.
-Jack Ekin and Danko van der Laan, NIST
