Cx3 10 Hardware Ops Overview

CX3 Model 10 SystemsHardware and Operational

OverviewJanuary 23, 2007

This document describes the hardware, powerup and powerdownsequences, and status indicators for CX3 model 10 systems, which aremembers of the CX3 UltraScale™ series of storage systems.

Major topics are:

Storage-system major components.................................................. 2Storage processor enclosure (SPE3) ................................................. 4Disk-array enclosures (DAE3Ps) ..................................................... 7Standby power supplies (SPSs)....................................................... 13Powerup and powerdown sequence ............................................... 14Status lights (LEDs) and indicators ................................................. 18

1

Storage-system major components

The storage system consists of:

A storage processor enclosure (SPE3) and a standby power supply(SPS)

One Fibre Channel disk-array enclosure (DAE) with a minimumof five disk drives

Optional DAEs

Optional second SPS

DAE3P

SPE3

SPS

EMC3464

Figure 1 Storage system

The high-availability features for the storage system include:

Redundant storage processors (SPs)

Standby power supplies (SPS)

Redundant power/cooling modules

The SPE3 is a highly available storage enclosure with redundant powerand cooling. It is 1U high (a U is a NEMA unit; each unit is 1.75 inches)and includes two storage processors (SPs). Table 1 gives the numberof Fibre Channel and iSCSI I/O front-end ports and Fibre Channelback-end disk ports supported by each CX3 model 10 system.

2 Hardware and Operational Overview

Table 1 Front-end and back-end ports

Storage system Fibre Channelfront-end I/O ports

iSCSIfront-end I/O ports

Fibre Channelback-end disk ports

CX3-10c 2 2 1

The storage system supports 4 Gb/s Fibre Channel operation from itsfront-end host I/O ports through its back-end disk ports. The host I/Ofront-end ports can operate at up to 4 Gb/s and the back-end portscan operate at 2 or 4 Gb/s. The storage system senses the speed ofthe incoming host I/O and sets the speed of the front-end ports to thelowest speed it senses. The speed of each back-end port is determinedby the speed of the DAEs connected to it.

The storage system requires at least five disks and works in conjunctionwith one or more disk-array enclosures (DAEs) to provide terabytes ofhighly available disk storage. A DAE is a basic disk enclosure withoutan SP. SPE3 systems include a 4 Gb/s point-to-point DAE3P, whichsupports up to 15 Fibre Channel disks. Each DAE3P connects to theSPE3 or another DAE with simple FC-AL serial cabling.

The storage system supports a total of 60 disks on its single back-endbus. You can place the disk enclosures in the same cabinet as the SPE,or in one or more separate cabinets. High-availability features arestandard.

Hardware and Operational Overview 3

Storage processor enclosure (SPE3)

The SPE3 components include:

A sheet-metal enclosure with a midplane and front bezel

Two storage processors (SPs)

Four power supply/system cooling modules (referred to aspower/cooling modules)

Figure 2 shows the SPE3 components. Details on each componentfollow the figure. If the enclosure provides slots for two identicalcomponents, the component in slot A is called component-name A. Thesecond component is called component-name B. For increased clarity, thefollowing figures depict the SPE3 outside of the rack cabinet. YourSPE3 may be installed in a rackmount cabinet.

EMC3454

B

A

TLA

S/N

xxxx

xxxx

SPS B SPS A

Storage processor B Storage processor APower/cooling modules

Front Rear

Figure 2 SPE3 outside the cabinet — front and rear views

Midplane

The midplane distributes power and signals to all the enclosurecomponents. The power/cooling modules and storage processors (SPs)plug directly into midplane connectors.

Front bezel

The front bezel has a key lock and two latch release buttons. Pressingthe latch release buttons releases the bezel from the enclosure.

Storage processors (SPs)

The SP is the SPE3’s intelligent component and acts as the controlcenter. Each SP includes:


A single-processor CPU module comprised of:

1 GB of DDR DIMM (double data rate, dual in-line memorymodule) memory

Two small-form factor pluggable (SFP) shielded Fibre Channelconnectors (optical SFP) for server I/O (connection to an FCswitch or server HBA)

One SFP shielded Fibre Channel connector (copper SFP) fordisk connection (BE 0)

One serial port for connection to a standby power supply (SPS)– micro DB9 connector

One 10/100 Ethernet LAN port for management – RJ45connector

One serial port for RS-232 connection to a service console –micro DB9 connector

One 10/100 Ethernet LAN port for service – RJ45 connector

For a CX3-10c – One I/O module with two 10/100–gigabit Ethernetports (RJ45 connector) for iSCSI I/O to a network switch or serverNIC or HBA

Figure 3 shows the locations of the connectors on the rear of the SPs.

+ -

BE 0 2 Fibre 3 Fibre

0 iSCSI 1 iSCSI

iSCSI ports

AC cord

CL3667

Back-end Fibre Channel port

Front-end Fibre Channel ports

Power and fault LEDs

Service only Management LAN

SPS port

Figure 3 Connectors on the rear of a CX3-10c SP

Power/cooling modules

Each of the four power/cooling modules integrate one independentpower supply and one blower into a single module. The powersupply in each module is an auto-ranging, power-factor-corrected,multi-output, offline converter.


The four power/cooling modules (A0, A1, B0, and B1) are located infront of the SPs. A0 and A1 share load currents and provide powerand cooling for SP A, and B0 and B1 share load currents and providepower and cooling for SP B. A0 and B0 share a line cord, and A1 andB1 share a line cord.

An SP or power/cooling module with power-related faults doesnot adversely affect the operation of any other component. Ifone power/cooling module fails, the others take over. If bothpower/cooling modules for an SP fail, write caching is disabled.

SPE3 field-replaceable units (FRUs)

The following are field-replaceable units (FRUs) that you can replacewhile the SPE3 is powered up:

CPU modules

Memory modules (DIMMs)

I/O modules

Small form-factor pluggable (SFP) modules, which plug into theFibre Channel front-end port slots


You or your service provider can replace a failed power/coolingmodule or SFP module. A service provider must replace the otherFRUs if they fail.


Disk-array enclosures (DAE3Ps)

DAE3P UltraPoint™ (sometimes called point-to-point) disk-arrayenclosures are highly available, high-performance, high-capacitystorage-system components that use a Fibre Channel Arbitrated Loop(FC-AL) as the interconnect interface. A disk enclosure connects toanother DAE3P or an SPE3 and is managed by storage-system softwarein RAID (redundant array of independent disks) configurations.The enclosure is only 3U (5.25 inches) high, but can include 15 harddisk drive/carrier modules. Its modular, scalable design allows foradditional disk storage as your needs increase.

A DAE3P includes either high-performance Fibre Channel diskmodules or economical SATA (Serial Advanced TechnologyAttachment, “SATA II”) disk modules. You can integrate and connectFC and SATA enclosures within a storage system, but you cannot mixSATA and Fibre Channel components within a DAE3P. The enclosureoperates at either 2 or 4 Gb/s bus speed (2 Gb/s components, includingdisks, cannot operate on a 4 Gb/s bus). Simple serial cabling provideseasy scalability. You can interconnect disk enclosures to form a largedisk storage system; the number and size of buses depends on thecapabilities of your storage processor. Highly available configurationsrequire at least one pair of physically independent loops (for example,A and B sides of bus 0, sharing the same dual-port disks). Otherconfigurations use two, three, four, or more buses. You can place thedisk enclosures in the same cabinet, or in one or more separate cabinets.High-availability features are standard.

The DAE3P includes the following components:

A sheet-metal enclosure with a midplane and front bezel

Two FC-AL link control cards (LCCs) to manage disk modules

As many as 15 disk modules

Two power supply/system cooling modules (referred to aspower/cooling modules)

Any unoccupied disk module slot has a filler module to maintain airflow.

The power supply and system cooling components of thepower/cooling modules function independently of each other, but the


assemblies are packaged together into a single field-replaceable unit(FRU).

The LCCs, disk modules, power supply/system cooling modules,and filler modules are field-replaceable units (FRUs), which can beadded or replaced without hardware tools while the storage systemis powered up.

Figure 4 shows the disk enclosure components. Where the enclosureprovides slots for two identical components, the components are calledcomponent-name A or component-name B, as shown in the illustrations.

For increased clarity, the following figures depict the disk enclosure outsideof the rack or cabinet. Your disk enclosure may be installed in a rackmountcabinet.

!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

Power LED(green or blue)

Fault LED(amber)Power/cooling module B Link control card B

Fault LED(amber)

Disk activityLED (green)

Power/cooling module A Link control card AEMC3437

Figure 4 DAE3P outside the cabinet — front and rear views

As shown in Figure 5, an enclosure address (EA) indicator is located oneach LCC. (The EA is sometimes referred to as an enclosure ID.) Eachlink control card (LCC) includes a bus (loop) identification indicator.The storage processor initializes bus ID when the operating systemloads.


!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

0 1 2 3

4 5 6 7

0 1 2 3

4 5 6 7

Bus IDEnclosureaddress

#

EA selection(press here tochange EA)

EMC3210

Figure 5 Disk enclosure bus (loop) and address indicators

The enclosure address is set at installation. Disk module IDs arenumbered left to right (looking at the front of the unit) and arecontiguous throughout a storage system: enclosure 0 contains modules0-14; enclosure 1 contains modules 15-29; enclosure 2 includes 30-44,and so on.

Midplane

A midplane between the disk modules and the LCC and power/coolingmodules distributes power and signals to all components in theenclosure. LCCs, power/cooling modules, and disk drives – theenclosure’s field-replaceable units (FRUs) – plug directly into themidplane.

Front bezel

The front bezel has a locking latch and an electromagnetic interference(EMI) shield. You must remove the bezel to remove and install drivemodules. EMI compliance requires a properly installed front bezel.

Link control cards (LCCs)

An LCC supports and controls one Fibre Channel bus and monitorsthe DAE3P.


!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

EMC3226

Expansion linkactive LED

Primary linkactive LED

Fault LED (amber)

Power LED (green)

!

EXP PRI

EXP PRI

Figure 6 LCC connectors and status LEDs

A blue link active LED indicates a DAE3P enclosure operating at 4 Gb/s. Thelink active LED(s) is green in DAE3Ps operating at 2 Gb/s.

The LCCs in a DAE3P connect to other Fibre Channel devices(processor enclosures, other DAEs) with twin-axial copper cables. Thecables connect LCCs in a storage system together in a daisy-chain(loop) topology.

Internally, each DAE3P LCC uses FC-AL protocols to emulate a loop;it connects to the drives in its enclosure in a point-to-point fashionthrough a switch. The LCC independently receives and electricallyterminates incoming FC-AL signals. For traffic from the system’sstorage processors, the LCC switch passes the input signal fromthe primary port (PRI) to the drive being accessed; the switch thenforwards the drive’s output signal to the expansion port (EXP), wherecables connect it to the next DAE in the loop. (If the target drive is notin the LCC’s enclosure, the switch passes the input signal directly tothe EXP port.) At the unconnected expansion port (EXP) of the lastLCC, the output signal (from the storage processor) is looped back tothe input signal (to the storage processor). For traffic directed to thesystem’s storage processors, the switch passes input signals from theexpansion port directly to the output signal of the primary port.

Each LCC independently monitors the environmental statusof the entire enclosure, using a microcomputer-controlled FRU(field-replaceable unit) monitor program. The monitor communicates


status to the server, which polls disk enclosure status. LCC firmwarealso controls the LCC port bypass circuits and the disk-module statusLEDs.

LCCs do not communicate with or control each other.

Captive screws on the LCC lock it into place to ensure properconnection to the midplane. You can add or replace an LCC while thedisk enclosure is powered up.

Disk modules

Each disk module consists of one disk drive in a carrier. You canvisually distinguish between module types by their different latchand handle mechanisms and by type, capacity, and speed labels oneach module. An enclosure can include Fibre Channel or SATA diskmodules, but not both types. You can add or remove a disk modulewhile the DAE3P is powered up, but you should exercise special carewhen removing modules while they are in use. Drive modules areextremely sensitive electronic components.

Disk drivesThe DAE3P supports Fibre Channel disk drives that conform to FC-ALspecifications and 2 or 4 Gb/s Fibre Channel interface standards, andsupports dual-port FC–AL interconnects through the two LCCs. ADAE3P supports 2 Gb/s drives only if the entire back-end bus that containsthe drives is operating at 2 Gb/s. SATA disk drives conform to Serial ATAII Electrical Specification 1.0 and include dual-port SATA interconnects;a paddle card on each drive converts the assembly to Fibre Channeloperation. The disk module slots in the enclosure accommodate 2.54cm (1-in) by 8.75 cm (3.5-in) disk drives.

Drive carrierThe disk drive carriers are metal and plastic assemblies that providesmooth, reliable contact with the enclosure slot guides and midplaneconnectors. Each carrier has a handle with a latch and spring clips.The latch holds the disk module in place to ensure proper connection


with the midplane. Disk drive activity/fault LEDs are integrated intothe carrier.


The power/cooling modules are located above and below the LCCs.The units integrate independent power supply and dual-blowercooling assemblies into a single module.

Each power supply is an auto-ranging, power-factor-corrected,multi-output, offline converter with its own line cord. Each supplysupports a fully configured DAE3P and shares load currents with theother supply. The drives and LCCs have individual soft-start switchesthat protect the disk drives and LCCs if they are installed while thedisk enclosure is powered up. A FRU (disk, LCC, or power/coolingmodule) with power-related faults does not adversely affect theoperation of any other FRU.

The enclosure cooling system includes two dual-blower modules.If one blower fails, the others will speed up to compensate. If twoblowers in a system (both in one power/cooling module, or one in eachmodule) fail, the DAE3P goes offline within two minutes.


Standby power supplies (SPSs)

A 1U, 1000-watt DC SPS provides backup power for storage processorA and LCC A on the first (enclosure 0, bus 0) DAE adjacent to it. Anoptional second SPS provides the same service for SP B and LCC B. TheSPSs allow write caching – which prevents data loss during a powerfailure – to continue. A faulted or not fully charged SPS disables thewrite cache. Each SPS rear panel has one AC inlet power connectorwith power switch, AC outlets for the SPE3 and the first DAE (EA 0,bus 0) respectively, and one phone-jack type connector for connectionto an SP. Figure 7 shows the SPS connectors.

EMC2292

ACpowerconnector

Powerswitch

SPinterfaceSPE

ActiveLED(green)

ReplacebatteryLED(amber)

On batteryLED(amber)

FaultLED(amber)

Figure 7 1000 W SPS connectors

A service provider can replace an SPS while the storage system ispowered up.


Powerup and powerdown sequence

The SPE3 and DAE3P do not have power switches.

Powering up the storage system

1. Verify the following:

❑ Master switch/circuit breakers for each cabinet/rack powerstrip are off.

❑ The power cord for SP A is plugged into the SPS and the powercord retention bails are in place.

❑ The power cord for SP B is plugged into the nearest powerdistribution unit on a different circuit feed than the SPS. (Insystems with two SPSs, plug SP B into its corresponding SPS.)

❑ The serial connection between SP A and the SPS is in place. (Insystems with two SPSs, each SP has a serial connection to itscorresponding SPS.)

❑ The power cord for LCC A on the first DAE3P (EA 0, bus 0) isplugged into the SPS and the power cord retention bails arein place.

❑ The power cord for LCC B is plugged into the nearest powerdistribution unit on a different circuit feed than the SPS. (Insystems with two SPSs, each LCC plugs into its correspondingSPS.)

❑ The power cords for the SPSs and any other DAE3Ps areplugged into the cabinet’s power strips.

❑ The power switches on the SPSs are in the on position.

❑ Any other devices in the cabinet are correctly installed andready for powerup.

2. Turn on the master switch/circuit breakers for each cabinet/rackpower strip.

In standard EMC cabinets, master switches are on the power distributionpanels (PDPs), as shown in Figure 8.


ON I

OFF O

ON I

OFF O

ON I

OFF O

ON I

OFF O

ON I

OFF O

ON I

OFF O

ON I

OFF O

ON I

OFF O

ON I

OFF O

ON I

OFF O

ON I

OFF O

ON I

OFF O

! !

! !

!

EXP PRI

EXP PRI

#

!

EXP PRI

EXP PRI

# A

B

! !

! !

!

EXP PRI

EXP PRI

#

!

EXP PRI

EXP PRI

# A

B

! !

! !

!

EXP PRI

EXP PRI

#

!

EXP PRI

EXP PRI

# A

B

! !

! !

!

EXP PRI

EXP PRI

#

!

EXP PRI

EXP PRI

# A

B

! !

! !

!

EXP PRI

EXP PRI

#

!

EXP PRI

EXP PRI

# A

B

! !

! !

!

EXP PRI

EXP PRI

#

!

EXP PRI

EXP PRI

# A

B

! !

! !

!

EXP PRI

EXP PRI

#

!

EXP PRI

EXP PRI

# A

B

! !

! !

!

EXP PRI

EXP PRI

#

!

EXP PRI

EXP PRI

# A

B

Master switch Master switch

Master switch Master switch

Power source A

Power source C Power source D

Power source B

CL3641

SPS switch

SPS switch

Figure 8 PDP master switches and power sources in the 40U cabinet

The storage system can take 10 to 15 minutes to complete a typicalpowerup. If the storage system was installed in a cabinet at your site(field-installed system), the first powerup will require several rebootsand can take 30 to 45 minutes. Amber warning LEDs flash during thepower on self-test (POST) and then go off. The front fault LED and the


SPS recharge LEDs commonly stay on for several minutes while theSPSs are charging.

If amber LEDs on the front or back of the storage system remainon for more than 15 minutes (45 minutes for the first powerup of afield-installed system), make sure the storage system is correctly cabled,and then refer to the troubleshooting flowcharts on the CLARiiON Toolspage on the EMC Powerlink website (http://Powerlink.EMC.com). Ifyou cannot determine any reasons for the fault, contact your authorizedservice provider.

Powering down the storage system

1. Stop all I/O activity to the SPE. If the server connected to the SPE isrunning the Linux or UNIX operating system, back up critical dataand then unmount the file systems.

Stopping I/O allows the SP to destage cache data, and may takesome time. The length of time depends on criteria such as the sizeof the cache, the amount of data in the cache, the type of data inthe cache, and the target location on the disks, but it is typicallyless than one minute. We recommend that you wait five minutesbefore proceeding.

2. After five minutes, use the power switch on each SPS to turn offpower. Storage processors and DAE LCCs connected to the SPSpower down within two minutes.

! CAUTION

Never unplug the power supplies to shut down an SPE.Bypassing the SPS in that manner prevents the storage systemfrom saving write cache data to the vault drives, and resultsin data loss. You will lose access to data, and the storageprocessor log displays an error message similar to the following:

Enclosure 0 Disk 5 0x90a (Can’t Assign - Cache Dirty)0 0xafb40 0x14362c

Contact your service provider if this situation occurs.


http://powerlink.emc.com

http://Powerlink.EMC.com

3. For CX3 model 10 systems with a single SPS, wait two minutesand then unplug the power cables for SP B on the SPE3 and LCCB on DAE 0, bus 0.

This turns off power to the SPE and the first DAE (EA 0, bus 0). You donot need to turn off power to the other connected DAEs.


Status lights (LEDs) and indicators

Status lights made up of light emitting diodes (LEDs) on the SPE3,its FRUs, the SPSs, and the DAE3P and their FRUs indicate thecomponent’s current status.

Storage processor enclosure (SPE3) LEDs

This section describes status LEDs visible from the front and the rearof the SPE3.

SPE3 front status LEDs

Figure 9 and Figure 10 show the location of the SPE3 status LEDs thatare visible from the front of the enclosure. Table 2 describes these LEDs.

DAE3P

SPE3

SPS

EMC3428

Power LEDFault LED

Power LEDFault LED

Figure 9 SPE3 front status LEDs (bezel in place)

EMC3427

Power/cooling LEDs

TLA

S/N

xxxx

xxxx

Fault LED Power LED

Figure 10 SPE3 front status LEDs (bezel removed)


Table 2 Meaning of the SPE3 front status LEDs

LED Quantity State Meaning

Off SPE3 is powered down.Power 1

Solid green SPE3 is powered up.

Off SPE3 is operating normally.Fault 1

Solid amber A fault condition exists in the SPE3. If the fault is not obvious from anotherfault LED on the front, look at the rear of the enclosure.

Off Power/cooling module is not powered up.

Solid green Power/cooling module is powered and operating normally.

Solid amber Power/cooling module is faulted.

Power/cooling fault(see note)

1 per module

Blinking amber Fault condition exists external to the power/cooling module.

Note: Light is visible only with the bezel removed.

SPE3 rear status LEDs

Figure 11 shows the status LEDs that are visible from the rear of theSPE3. Table 3 describes these LEDs.

SP ASP B

EMC3466

B

A

Fibre channel link LEDs

Power &fault LEDs

Rear

Fibre channel link LEDs

Power &fault LEDs

I/O modulefault LED

I/O modulefault LED

Figure 11 SPE3 rear status LEDs

Table 3 Meaning of the SPE3 rear status LEDs


Off SP is powered up and operating normally.

Solid amber SP is faulted.

SP fault 1 per SP

Blinking amber SP is in process of powering up.

Off I/O module is powered up and operating normally.I/O module fault 1 per I/O module

Solid amber I/O module is faulted.



Off No link because of one of the following conditions: thecable is disconnected, the cable is faulted or it is not asupported type.

Solid green 1 Gb/s or 2 Gb/s link speed.

Solid blue 4 Gb/s link speed.

BE port link 1 per back-end FibreChannel port

Blinking green then blue Cable fault.

Off No link because of one of the following conditions: thehost is down, the cable is disconnected, an SFP is not inthe port slot, the SFP is faulted or it is not a supportedtype.

Solid green 1 Gb/s or 2 Gb/s link speed.

Solid blue 4 Gb/s link speed.

FE port link 1 per front-end FibreChannel port

Blinking green then blue SFP or cable fault.


DAE3P status LEDs

This section describes the following status LEDs and indicators:

Front DAE3P and disk modules status LEDs

Enclosure address and bus ID indicators

LCC and power/cooling module status LEDs

Front DAE3P and disk modules status LEDs

Figure 12 and Figure 13 show the location of the DAE3P and diskmodule status LEDs that are visible from the front of the enclosure.Table 4 describes these LEDs.

DAE3P

SPE3

SPS

EMC3428

Power LEDFault LED

Power LEDFault LED

Figure 12 Front DAE3P and disk modules status LEDs (bezel in place)


EMC3422

Power LED(Green or Blue)

Fault LED(Amber)

Fault LED(Amber)

Disk Activity LED(Green)

Figure 13 Front DAE3P and disk modules status LEDs (bezel removed)


Table 4 Meaning of the front DAE3P and disk module status LEDs


Off DAE3P is not powered up.

Solid green DAE3P is powered up and back-end bus is running at 2Gb/s.

DAE power 1

Solid blue DAE3P is powered up and back-end bus is running at 4Gb/s.

DAE fault 1 Solid amber On when any fault condition exists; if the fault is notobvious from a disk module LED, look at the back of theenclosure.

Off Slot is empty or contains a filler module or the disk ispowered down by command, for example, as the result ofa temperature fault.

Solid green Drive has power but is not handling any I/O activity (theready state).

Blinking green, mostly on Drive is spinning and handling I/O activity.

Blink green at a constantrate

Drive is spinning up or spinning down normally.

Disk activity 1 per disk module

Blinking green, mostly off Drive is powered up but not spinning; this is a normal partof the spin-up sequence, occurring during the spin-updelay of a slot.

Disk fault 1 per disk module Solid amber On when the disk module is faulty, or as an indicationto remove the drive.

Enclosure address and bus ID indicators

Figure 14 shows the location of the enclosure address and bus IDindicators that are visible from the rear of the enclosure. In this example,the DAE3P is enclosure 2 on bus (loop) 1; note that the indicators forLCC A and LCC B always match. Table 5 describes these indicators.


!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

0 1 2 3

4 5 6 7

0 1 2 3

4 5 6 7

Bus IDEnclosureaddress

#

EAselection

0123

4567

0123

4567Bus IDEnclosure

address

#

EAselection

EMC3178

Figure 14 Location of enclosure address and bus ID indicators

Table 5 Meaning of enclosure address and bus ID indicators


Enclosure address 8 Green Displayed number indicates enclosure address.

Bus ID 8 Blue Displayed number indicates bus ID. Blinking bus IDindicates invalid cabling; LCC A and LCC B are notconnected to the same bus; or, the maximum number ofDAEs allowed on the bus is exceeded.

Power/cooling module status LEDs

Figure 15 shows the location of the status LEDs for the powersupply/system cooling modules (referred to as power/cooling modules).Table 6 describes these LEDs.


!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

!!

Power LED (green)Power fault LED (amber)Blower fault LED (amber)

EMC3179

!!

Power LED (green)Power fault LED (amber)Blower fault LED (amber)

Figure 15 Power/cooling module status LEDs

Table 6 Meaning of power/cooling module status LEDs

LEDs Quantity State Meaning

Power supply active 1 per supply Green On when the power supply is operating.

Power supply fault(see note)

1 per supply Amber On when the power supply is faulty or is not receiving ACline voltage. Flashing when either a multiple blower orambient over-temperature condition has shut off power tothe system.

Blower fault (seenote)

1 per cooling module Amber On when a single blower in the power supply is faulty.

Note: The DAE3P continues running with a single power supply and three of its four blowers. Removing a power/cooling moduleconstitutes a multiple blower fault condition, and will power down the enclosure unless you replace a blower within two minutes.

LCC status LEDs

Figure 16 shows the location of the status LEDs for a link control card(LCC). Table 7 describes these LEDs.


!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

EMC3184

Expansion linkactive LED (2 Gb/s - green4 Gb/s - blue)

Primary linkactive LED (green or blue)

Fault LED (amber)

Power LED (green)

!

EXP PRI

EXP PRI

Expansion linkactive LED

Primary linkactive LED

Fault LED (amber)

Power LED (green)

!

EXPPRI

EXPPRI

Figure 16 LCC status LEDs

Table 7 Meaning of LCC status LEDs

Light Quantity State Meaning

LCC power 1 per LCC Green On when the LCC is powered up.

LCC fault 1 per LCC Amber On when either the LCC or a Fibre Channel connectionis faulty. Also on during power on self test (POST).

Green On when 2 Gb/s primary connection is active.Primary link active 1 per LCC

Blue On when 4 Gb/s primary connection is active.

Green On when 2 Gb/s expansion connection is active.Expansion linkactive

1 per LCC

Blue On when 4 Gb/s expansion connection is active.

SPS status LEDs

Figure 17 shows the location of SPS status LEDs that are visible fromrear. Table 8 describes these LEDs.


EMC3421

ActiveLED(green)

ReplacebatteryLED(amber)

On batteryLED(amber)

FaultLED(amber)

Figure 17 1000 W SPS status LEDs

Table 8 Meaning of 1000 W SPS status LEDs


Active 1 per SPS Green When this LED is steady, the SPS is ready and operating normally. Whenthis LED flashes, the batteries are being recharged. In either case, theoutput from the SPS is supplied by AC line input.

On battery 1 per SPS Amber The AC line power is no longer available and the SPS is supplying outputpower from its battery. When battery power comes on, and no other onlineSPS is connected to the SPE, the file server writes all cached data to disk,and the event log records the event. Also on briefly during the battery test.

Replace battery 1 per SPS Amber The SPS battery is not fully charged and may not be able to serve its cacheflushing function. With the battery in this state, and no other online SPSconnected to the SPE, the storage system disables write caching, writingany modified pages to disk first. Replace the SPS as soon as possible.

Fault 1 per SPS Amber The SPS has an internal fault. The SPS may still be able to run online, butwrite caching cannot occur. Replace the SPS as soon as possible.


Copyright© 2006-2007 EMC Corporation. All Rights Reserved.

EMC believes the information in this publication is accurate as of its publication date. Theinformation is subject to change without notice.

THE INFORMATION IN THIS PUBLICATION IS PROVIDED AS IS. EMC CORPORATIONMAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WITH RESPECT TOTHE INFORMATION IN THIS PUBLICATION, AND SPECIFICALLY DISCLAIMS IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.

Use, copying, and distribution of any EMC software described in this publication requires anapplicable software license.

For the most up-to-date listing of EMC product names, see EMC Corporation Trademarks onEMC.com.

All other trademarks used herein are the property of their respective owners.


Cx3 10 Hardware Ops Overview

Documents

Transcript of Cx3 10 Hardware Ops Overview