Charge collection in irradiated pixel sensors V. Chiochia a, C.Amsler a, D.Bortoletto c, L.Cremaldi...
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Transcript of Charge collection in irradiated pixel sensors V. Chiochia a, C.Amsler a, D.Bortoletto c, L.Cremaldi...
Charge collection in Charge collection in irradiated pixel sensorsirradiated pixel sensors
V. Chiochiaa, C.Amslera, D.Bortolettoc, L.Cremaldid, S.Cucciarellie, A.Dorokhova,b*, C.Hörmanna,b, M.Koneckie, D.Kotlinskib, K.Prokofieva,b, C.Regenfusa, T.Roheb, D.Sandersd, S.Sonc, T.Speera, D.Kimf, M.Swartzf
a Physik Institut der Universität Zürich-Irchel, 8057, Zürich, Switzerlandb Paul Scherrer Institut, 5232, Villingen PSI, Switzerland
c Purdue University, Task G, West Lafayette, IN 47907, USAd Department of Physics and Astronomy, Mississippi State University, MS 39762, USA
e Institut für Physik der Universität Basel, Basel, Switzerlandf Johns Hopkins University, Baltimore, MD, USA
* Now at: Institut de Recherches Subatomiques, F67037 Strasbourg, France
Beam test measurements and simulationBeam test measurements and simulation
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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OutlineOutline
1.1. The CMS pixel detector and data reconstructionThe CMS pixel detector and data reconstruction
2.2. Analysis ingredients: beam test data and detector simulationAnalysis ingredients: beam test data and detector simulation
3.3. Physical modelling of radiation damage:Physical modelling of radiation damage:a)a) Models with a constant effective doping concentrationModels with a constant effective doping concentration
b)b) EVL models (V.Eremin, E.Verbitskaya, Z.Li)EVL models (V.Eremin, E.Verbitskaya, Z.Li)
c)c) Advanced double junction models (V.C., M.Swartz)Advanced double junction models (V.C., M.Swartz)
4.4. Conclusions Conclusions
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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The CMS pixel detectorThe CMS pixel detector• 3-d tracking with 66 million channels • Barrel layers at radii = 4.3cm, 7.2cm and 11.0cm• Pixel cell size: 100x150 µm2
• Fluence 3(1)x1014 neq/cm2 year, inner layer for high(low) luminosity• Modules are unit cells of the system (1% of X0)• 704 barrel modules / 96 barrel half modules / 672 endcap modules • ~15k front end chips and ~1m2 of silicon
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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The LHC radiation environmentThe LHC radiation environment
Fluence per year at full luminosity
• 4 cm layer 3x1014 n/cm2/yr• Fluence decreases quadratically
with the radius• Pixel detectors = 4-15 cm mostly
pion irradiation• Strip detectors = 20-110 cm
mostly neutron irradiation
ppinelastic = 80 mb
L = 1034 cm-2s-1
ppinelastic = 80 mb
L = 1034 cm-2s-1
What is the sensors response after few years of operation?
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Impact on reconstructionImpact on reconstruction
Sensor irradiation
Charge Carriers Trapping
Asymmetric pixel clusters
Example: Long clusters along
the z-coordinate at high
Variation of the electric field profile
Lorentz deflection
Example:Non-linear charge sharing
in the r- plane
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Prototype sensors for beam testsPrototype sensors for beam tests
• p-sprayp-spray design with biasing grid and punch design with biasing grid and punch through structures (CiS, Germany)through structures (CiS, Germany)
• 125x125 125x125 mm22 cell size cell size• 22x32 pixel matrix, 285 22x32 pixel matrix, 285 μμm thick <111> m thick <111>
DOFZ wafer, DOFZ wafer, nn-in--in-nn type type• Samples irradiated with 21 GeV protons at Samples irradiated with 21 GeV protons at
the CERN PS facilitythe CERN PS facility
• Fluences: Fluences: eqeq=(0.47,2.0,5.9)x10=(0.47,2.0,5.9)x101414 n neqeq/cm/cm22
• AnnealedAnnealed for three days at 30 for three days at 30º Cº C• Bump bonded at room temperature to non Bump bonded at room temperature to non
irradiated front-end chips with irradiated front-end chips with non zero-non zero-suppressed readoutsuppressed readout, stored at -20, stored at -20ºCºC
125 m2
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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2004 Beam test setup2004 Beam test setup
CERN Prevessin siteH2 area
3T Helmoltz magnet
beam:150 GeV B field
pixel sensorsupport
Silicon strip beam telescope:50 μm readout pitch,~1 μm resolution
Cooling circuitT =-30 ºC or -10ºC
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Charge collection measurementCharge collection measurement
Charge collection was studied with the cluster profiles in a row of pixels illuminated by a 15º beam and no magnetic field
Charge collection was studied with the cluster profiles in a row of pixels illuminated by a 15º beam and no magnetic field
½ year LHC low luminosity
2 years LHC low luminosity
n+side p-side
chargetrapping
chargetrapping
2 years LHC high luminosity
Temperature = -25 ºC and -10ºCeq = (0, 0.5, 2, 6)x1014 n/cm2
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Detector simulationDetector simulation
Chargedeposit
Chargetransport
Trapping
Trapping times from
literature
Electronicresponse +
data formatting
ROC+FED response
ROOTAnalysis
Double trapsmodels
(DESSIS)
3-D Electric field mesh
ISE TCAD 9.0ISE TCAD 9.0
PIXELAVPIXELAV
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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The classic pictureThe classic picture
• After irradiation the sensor bulk becomes more acceptor-like
• The effective doping concentration is constant (and negative) across the sensor thickness
• The p-n junction moves to the pixel implants side
• Based on C-V measurements!
after type inversion
Neff<0
-
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Models with constant NModels with constant Neffeff
AA model based on a type-inverted device with constant Nmodel based on a type-inverted device with constant Neffeff
across the bulk does not describe the measured charge collection profilesacross the bulk does not describe the measured charge collection profiles
= 6x1014 n/cm2
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Two traps modelsTwo traps models
EConduction
EValence
Electrontraps
Holetraps
Eremin-Verbitskaya-Li Model (EVL)Eremin-Verbitskaya-Li Model (EVL)
NA and ND are fixed to TCT measurements
215Ah
Ae
Dh
De cm10σσσσ
1.12 eVdonor D
hDeD σ,σ ,NEV+0.48 eV
acceptor
Ah
AeA σ,σ ,NEC-0.525 eV
Given these parameters the charge carriers dynamics is governed by the Shockley-Read-Hall statistics
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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The double peak electric fieldThe double peak electric field
n+p junction
np+ junction
-HV
a) Current density
b) Carrier concentration
c) Effective doping concentration
d) Electric field
dopantsAADD
dopantsAA
ADD
Deff
ρfNfNe
ρfNefNeρ
p-like
n-like
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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EVL modelsEVL models
100% observedleakage current=1.5x10-15 cm2
30% observedleakage current=0.5x10-15 cm2
The EVLThe EVL model based on double traps can produce large tails model based on double traps can produce large tails but description of the data is still unsatisfactorybut description of the data is still unsatisfactory
1=6x1014 n/cm21=6x1014 n/cm2
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Advanced EVL modelsAdvanced EVL models
• The recipe: 1. Relax the assumption on the cross sections
2. Let the parameters (NA, ND, A/De, A/D
h) vary
3. Keep the traps energy levels (EA, ED) to the EVL values
• Constraints to the model:1. Charge collection profiles (at different Vbias and eq)2. Trapping rates 3. Generated leakage current
DDhheqhhh
AAeeeqeee
NσvΦβ1/τΓ
NσvΦβ1/τΓ
DDhheqhhh
AAeeeqeee
NσvΦβ1/τΓ
NσvΦβ1/τΓ
e/h from literature
eq known within 10%
e/h from literature
eq known within 10%
t
τ
1expQ(t)Q
e/hh0e,he,
t
τ
1expQ(t)Q
e/hh0e,he,
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Best fit: Best fit: 11=6x10=6x101414 n/cm n/cm22
Data--- Simulation
Data--- Simulation
1=6x1014 n/cm2
NA/ND=0.40h/e=0.25
1=6x1014 n/cm2
NA/ND=0.40h/e=0.25
profiles field E
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Temperature dependenceTemperature dependence
• Charge collection profiles depend on temperature
• T-dependent recombination in TCAD and T-dependent variables in PIXELAV (e/h, e/h, ve/h)
• The model can predict the variation of charge collection due to the temperature change
T=-10ºCT=-10ºC T=-25ºCT=-25ºC
1=6x1014 n/cm21=6x1014 n/cm2
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Scaling to lower fluences (1)Scaling to lower fluences (1)
2=2x1014 n/cm2
NA/ND=0.68
h/e=0.25
Dh/D
e=1.00
2=2x1014 n/cm2
NA/ND=0.68
h/e=0.25
Dh/D
e=1.00
)(Φδ)N(1R)(ΦNR)(ΦN
)(Φδ)N(1R)(ΦNR)(ΦN2
RR/ΦΦR ; )(ΦΓR)(ΦΓ
1DΓ1DD2D
1AΓ1AA2A
DA12Γ1e/hΓ2e/h
Preserve linear scalingof e/h and of the current
with eq
Not shown: Linear scaling of trap densities does not describe the data!!
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Scaling to lower fluences (2)Scaling to lower fluences (2)
• Near the ‘type-invesion’ point: the double peak structure is still visible in the data!
• Profiles are not described by thermodynamically ionized acceptors alone
• At these low bias voltages the drift times are comparable to the preamp shaping time (simulation may be not reliable)
3=0.5x1014 n/cm2
NA/ND=0.75
h/e=0.25
Dh/D
e=1.00
3=0.5x1014 n/cm2
NA/ND=0.75
h/e=0.25
Dh/D
e=1.00
field E
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Scaling summaryScaling summary• Donors concentration increases faster than acceptors
• NA/ND increases for decreasing fluences
• Electric field peak at the p+ backplane increases with irradiation
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Lorentz angle vs depthLorentz angle vs depth
• Lorentz angle and electric field extracted from the test beam measurements
• The Lorentz angle is not constant across the sensor thickness
Lorentz angle Electric field
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Conclusions (1)Conclusions (1)
1. A simulation based on a constant effective doping (or “type inverted”) across the sensor bulk does not describe the measured charge collection profiles
2. A effective model based on two defect levels can be tuned to describe the observed charge collection profiles
3. Trapping of the leakage current produces an electric field profile with two maxima at the detector implants. Is it time to leave the classical notion of ‘partial depletion’?
4. The model can: • account for the expected leakage current and, within the uncertainties,
for free carriers trapping
• predict the temperature dependence of charge collection
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Conclusions (2)Conclusions (2)
5. In reality the chemistry of Si defects is more complicated and there are several trap states
6. The levels in this model have no physical reality and have to be considered as an ‘effective sum’ of multiple charged states
7. The simulation is a very nice tool for predicting the behavior of our pixel sensors during the operation in CMS. The hit reconstruction algorithms need to be fine tuned to cope with radiation effects
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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ReferencesReferences
• V. Eremin, E. Verbitskaya, and Z. Li, “V. Eremin, E. Verbitskaya, and Z. Li, “The origin of double peak electric field The origin of double peak electric field distribution in heavily irradiated silicon detectorsdistribution in heavily irradiated silicon detectors”, ”, Nucl. Instr. Meth.Nucl. Instr. Meth. A476A476, pp. 556-, pp. 556-564 (2002)564 (2002)
• M.Swartz, “M.Swartz, “CMS Pixel simulationsCMS Pixel simulations”, ”, Nucl.Instr.MethNucl.Instr.Meth. A511, 88 (2003). A511, 88 (2003)
• V.Chiochia, M.Swartz et al., “V.Chiochia, M.Swartz et al., “Simulation of Heavily Irradiated Silicon Pixel Sensors Simulation of Heavily Irradiated Silicon Pixel Sensors and Comparison with Test Beam Measurementsand Comparison with Test Beam Measurements”, accepted for publication on ”, accepted for publication on IEEE Trans.Nucl.SciIEEE Trans.Nucl.Sci., eprint:physics/0411143., eprint:physics/0411143
• A.Dorokhov et al., A.Dorokhov et al.,
• ISE TCAD 9.0: http://www.synopsys.com/products/acmgr/ise/dessis_ds.html
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Backup slidesBackup slides
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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CMS pixel sensor designCMS pixel sensor design
n+
p+
n- bulk
Si3N4
passivation
Si3N4
Alnitride
Indium-Bump
p+pspray
Alnitride + LTO
GoldGoldNickel
Titanium
punch-throughbiasing
Bump-bondcontact
n+/Alopening
cross section
metal line
Vendor: CiS, Erfurt - www.cismst.de
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Test beam setupTest beam setup
Magnetic field = 3 Tor
pixel sensorpixel sensor
• Four modules of silicon strip detectors
• Beam telescope resolution ~ 1 m
• Sensors enclosed in a water cooled box (down to -30ºC)
• No zero suppression, unirradiated readout chip
• Setup placed in a 3T Helmoltz magnet
PIN diode trigger
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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ISE TCAD simulationISE TCAD simulation
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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PIXELAV simulation PIXELAV simulation
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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SRH statisticsSRH statistics
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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SRH generation currentSRH generation current
V. Chiochia – Charge collection in irradiated pixel sensors10th European Symposium on Semiconductor Detectors - Wildbad Kreuth, June 12 -16, 2005
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Lorentz angle vs biasLorentz angle vs bias
• ‘Effective’ Lorentz angle as function of the bias voltage
• Strong dependence with the bias voltage (electric field)
• Weak dependence on irradiation
• This is a simplified picture!!
Magnetic field = 4 T