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Brizon Inc www.brizon.net yuxinhu@brizon.net Slide 2 Products: Microelectronic Application CMP Slurry additive CMP cleaning solutions Wafer storage buffer solution Smart Curable Products Flexible Screen Applications LED Applications High Temperature Resistance And low IR emission A pplications Slide 3 Products for the Semiconductor Industry: BriteClean-0+ : CMP cleaning process BriteClean-1 : CMP cleaning process Improves post process surface cleanliness for particles and surface residues. Improves next layer of deposition Protects both metal and oxide surfaces Improves wafer rinseability BriteClean-ACP : Slurry Additives Stabilize Slurry and Improve CMP efficiency Reduce and/or Eliminate macro- and micro-scratches Improve uniformity of material removal Slide 4 Background of Briteclean Innovative Technology Longer shelf life - over two years Much easier control processes and environments Much more efficient for the cleaning process One process fit more applications One Process with Briteclean(s) Can Clean all Alumina NiFeCo, Cu abrasives CeO abrasives Colloidal SiO 2 Et al Slide 5 Components Non-ionic surfactants Mixed surfactanized metal inhibitors and antioxidant agents Additional metal inhibitors and antioxidant agent Chelating agent Particle removing agent Slide 6 Hydrophilic Metal inhibitor head Aliphatic Hydrophobic tail Anti-oxidant Hydrophobic Head Ethoxylated Hydrophilic Tail + Briteclean-0+ Briteclean-1 Briteclean-0+:Briteclean-1 = 1:1 In 50X aqueous dilution Briteclean-0+:Briteclean-1 = 1:1 Bulk solution Phase separation Slide 7 Microelectronic application - CMP Briteclean 0+Briteclean - 1Briteclean-ACP Pre/Post Cleaning Process YES Slurry Additives YES Storage/Buffer NO YES Application Need to mix with BC-1 or BC-ACP Need to mix with BC-0+ Alone Usage 2% - 5% 1% - 4% Slide 8