Stock Code:6187.TTStock Code:6187.TT

Auto Equipments Auto Equipments

Solution ProviderSolution Provider

Auto Equipments Auto Equipments

Solution ProviderSolution Provider

PUBLIC1

DisclaimerDisclaimer

This report and released message contains information about

corporate prospects, financial updates and sales forecasts,

established on the basis of internal resources and external

reference sharing. The actual performance may be different from

expressed or implied predictions due to uncontrollable and/or

unpredictable risks.unpredictable risks.

All prospects reflect Allring-tech expectations toward the future,

and may be subject to change and Allring-tech reserves the right

to alter, update and change relevant information from time to

time without prior notice.

PUBLIC 2

Established May 24, 1996

Capital NTD 842 Million (USD 27 Million)

Business

Automation equipment supplier for

Semiconductor test & package, Passive

Component manufacturing and LED back-end

Company ProfileCompany Profile

Component manufacturing and LED back-end

industries

Employee 206 (AUG, 2016)

Chairman Larry Lu

Address No.1 Luke 10th Rd. ,Lujhu,Kaohsiung,Taiwan

Website www.allring-tech.com.tw

PUBLIC 3

Global Operation SiteGlobal Operation SiteHeadquarters:

Kaohsiung/Taiwan

Subsidiary：Kunshan/Jiangsu

PUBLIC 4

Industry Industry OverviewOverview

Electronic Device

Compact Size/Multiple

Sub-system

Modularization

Advance

Package

Component

Miniaturization

PUBLIC 5

Advance PackageAdvance Package

Packaging Type Figure Manufacturer Application

SIP(system in package)

Page7,8

OSATASE

Smart phone

IoTMobile

USIModule house

Hon HaiPegatron

AACComponent

AACLargan

WLP(wafer level package)

InFOPage

9 FoundryTSMC

Smart PhoneCoWoS TSMC

Flip chip 2D/3D Page10 OSAT

ASESmart Phone

IoTMobile

SpilAmkorJCET

Powertech

PUBLIC 6

System in Package (System in Package (SiPSiP))

PUBLIC 7

Basic Types of Basic Types of SiPSiP

Source: TRI

PUBLIC 8

FlipFlip--chip & waferchip & wafer--level packaginglevel packaging

PUBLIC

Source: TRI

9

2.5D & 3D IC Packaging2.5D & 3D IC Packaging

PUBLIC 10

Human ResourcesHuman Resources-- R&D Background R&D Background

40%

60%

20%

Hardware

Software80%

Motion Programming

Visual System

PUBLIC 11

Micro

Control

Technology

Visual

System

Technology

LED Sorting Machine

LED Taping Machine

Underfill

BGA Ball Mounter

Load Unload Equipment

Die Sorter

Core CompetenceCore Competence

LED

High Speed

Precise

Alignment

Precise

Fabrication

TechnologyPrecise Liquid

Dispensing Technology

1st Breaking Machine

Rotary Plating Machine

Cutting Machine

Power Inductor Dispenser Machine

Underfill

Dispenser PC

IC

Automation & AOI Equipment

Power Inductor Wire Winding Machine

PUBLIC 12

INK- Jet Printer

Linear Pump

Dispensing

Control

0.1mg ±5%

Jetting

Pump

Piezoelectric Jetting Pump

Dispensing Pump (Valve) LineDispensing Pump (Valve) Line--UpsUps

1 10 100 1,000 10,000 100,000 1,000,000

Linear Pump

CPS

1mg ±5%

10mg ±5%

Spray Pump

Screw PumpAir pulse dispenser

simplified/basic/advanced

Viscosity

PUBLIC 13

Visual System TechnologyVisual System Technology

Optical

System

Design

Visual System

System

Integration

Algorithm

Development

Friendly

Interface

2D/3D

Measurement

Visual System

Technology

PUBLIC14

Numbers of PatentsNumbers of Patents

Market Segment Granted Pending

Semiconductor 51 28

Passive Component 58 29

LED 12 22LED 12 22

FPD 7 0

Other 9 2

PCB 0 5

TOTAL 137 86

PUBLIC 15

Custom BaseCustom Base

PUBLIC 16

RevenueRevenue BreakdownBreakdown

PUBLIC 17

2014SEMI 6.04 40% 6.17 41% 5.81 63%PASSIVE 3.84 25% 4.62 30% 1.69 19%LED 2.77 18% 2.64 18% 0.47 5%OTHER 2.54 17% 1.64 11% 1.19 13%TOTAL 15.19 100% 15.07 100% 9.16 100%

NT$100M

2015 2016H1

Financial Highlights

6.8 7.0

8.7

11.4

6.6

13.6

8.7 8.0

11.2

15.2 15.1

9.2

3.19 3.41

30

36

33

37 37

38

38 37

38

39

41

44

14

19

14

20

14 15

19

16

26

36

46

5.00

8.00

11.00

14.00

17.00 (%)

PUBLIC 18

2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016H1

Sales(NT$100mn) 6.8 7.0 8.7 11.4 6.6 13.6 8.7 8.0 11.2 15.2 15.1 9.2

EPS(NT$) 1.51 1.14 2.11 3.19 1.77 3.41 -3.52 -1.68 1.52 2.5 2.76 1.58

GM(%) 30 36 33 37 37 38 38 37 38 39 41 44

OPM(%) 8 13 14 19 14 20 11 3 12 14 15 19

1.51 1.14

2.11

3.19

1.77

3.41

(3.52) (1.68)

1.52 2.50 2.76

1.58

8

13 14 14

11

3

12 14 15

(4)

6

16

-4.00

-1.00

2.00

Financial Highlights

PUBLIC 19

Financial Highlights

17.7

14.4 14.4

34.4

123.8

55.3 24.4

37.3 27.4

81.9

0

50

100

150

20

30

40

50 (%) (%)

PUBLIC 20

13.6

-10.2 -4.9

7.0 11.0 10.9

5.2

-18.5 -10.4

9.6

14.4 14.4

8.0

-200

-150

-100

-50

(20)

(10)

0

10

2010 2011 2012 2013 2014 2015 2016H1

ROA(%) ROE(%) Debt to Equity(%)

Q & A

PUBLIC 21