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Transcript of ATLAS Italia / CSN1 Referee – IBL G. Darbo – INFN / Genova Roma, 14 June 2010 o IBL Insertable...
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 June 2010o
IBLInsertable B-
Layer
ATLAS Italia / RefereeRoma, July 14th 2010G. Darbo – C. Meroni
INFN / GE – MIOn behalf of INFN IBL
Agenda:http://indico.cern.ch/conferenceDisplay.py?confId=100499
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 20102
OutlineStatus of the IBL project
• With focus on INFN related activities
Status of the Technical Design Report (TDR)• Schedule• Consolidation of the Physics & Performance case for IBL
Interim-Memorandum of Understanding• Cost, resources, sharing
Richieste finanziarie e attività 2011
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 20103
Material from Raphael/NealThe present 7 m long section of the beam-pipe will be cut (flange too big to pass inside the existing pixel) and extracted in situ.The new beam-pipe with the IBL inserted at its place.
ISTIBL Support Tube
Alignment wirers
PP1 Collar
IBL Detector
IBL Staves
Sealing service ring
IBL Specs / Params
• 14 staves, <R> = 33.25 mm.• CO2 cooling, T < 15ºC @ 0.2
W/cm2
• X/X0 < 1.5 % (B-layer is 2.7 %)
• 50 µm x 250 µm pixels• 1.8º overlap in ϕ, <2% gaps
in Z • 32/16 single/double FE-I4
modules per stave• Radiation dose 5x1015
neq/cm2
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 20104
LHC Plans & IBL MilestonesIBL Milestones
• FEI4 submission : 6/2010. • sensor choice 6/2011.• FEI4 Version 2 eng. Run 9/2011. • first prod module 11/2012 • last prod module 9/2013.• Stave loading completed (incl. 3 months cont) 6/2014 • End of integration (incl. 3 months cont) 5/2015• IBL installation 5/2015 – early 2015 Installation possible,
but no contingency.
LHC plans (ATLAS “interpretation”)• Have a phase I and II• Phase I when 30÷50 fb-1
• Accumulate 300÷400 fb-1 on phase I• Agreed with CERN management to
have phase I shutdown in 2016 (unofficial yet).
IBL design specification (Lint, L)• Life dose @ integrated of 500 fb-1
• R/O: peak L=3x1034 @ LVL1=100kHZ
LHC
Ref. M. Nessi
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 20105
FE-I4 (GE)FE-I4 submitted on July 1st at 14:00 (GMT)
• More than 2 years of engineering work for a team of >15 Engineers/physicist• Largest HEP chip ever! 20.2x19.0 mm2, 87 million transistors!• IBM accepted all the waivers, tomorrow the WRB at IBM will discuss the waivers and tell us the risk.• Fabrication time is 10-12 weeks. An expected delivery date will be provided 1-2 weeks after
submission. 60 Known Good Dies / wafer.
Money contributions collected following interim-MoU share.
• Engineering run cost > 500kCH• 16 8-inch wafer expected
FE-I4 FINAL LAYOUT 87M TRANSISTORS!
19.0 mm
20.2 mm
Engineering Team:At Bonn Tomasz Hemperek, Michael Karagounis, and Andre Kruth; at CPPM Denis Fougeron, Fabrice Gensolen, and Mohsine Menouni; at Genova Roberto Beccherle; at LBNL Julien Fleury (visiting from LAL), Dario Gnani, and Abderrezak Mekkaoui; and at NIKHEF Vladimir Gromov, Ruud Kluit, Jan David Schipper, and Vladimir Zivkovic.
Students:David Arutinov (Bonn), Bob Zheng and Frank Jensen (LBNL)
Physicists:Marlon Barbero, Maurice Garcia-Sciveres
60 KGD / Wafer16 Wafers
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 20106
Module Prototype Program & Test Beam (GE, PI, TN, UD)
Sensors and IBL activities merging• Test beam coordination & analysis between IBL and Sensor R&D• EUDET telescope used by Planar, 3D and Diamond sensors: 3 µm resolution!• Common order and plans for FE-I4 prototype modules, bump-bonding at IZM.
• INFN contribution to the cost: 9k€• GE, TN and UD focusing on 3D, PI part of the planar prototyping
• Once sensor technology will be decided, INFN will contribute to production
Residual from EUDET extrapolation to 50µm pitch pixels (single hit clusters).FBK-Irradiated 3E sensors (*)
Flat top:High telescope resolution
50µm
IBLPlanar S
ensors
PI
3D SensorsGE, TN, UD
Diamond Sensors
Preliminary
Test beam Coordination within IBL WG1
ATLA
S
Collab
ora
tion
s f
or
sLH
C R
&D
∞
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 20107
3D Sensor – Recent results(*)
3D sensors from FBK irradiated to 1015 – 5 x 1015 neq/cm2
• Karlsruhe: 26 MeV protons• Ljubljana: reactor neutrons
Lab & Test Beam measurements (*)• Very good efficiency at 80 V @ 1015
neq/cm2 (preliminary)
Not full 3D devices…• Full 3D in development at FBK
(*) Credits: June 2010 beam and lab tests name listM. Borri, M. Boscardin, L. Bosisio, V. Cindro, G.F. Dalla Betta, G. Darbo, C. Da Via, B. DeWilde, Su Dong, C. Gallrapp, C. Gemme, H. Gjersdal, P. Grenier, S. Grinstein, P. Hansson F. Hugging, A. La Rosa, A. Micelli, C. Nellist, S. Parker, H. Pernegger, O. Rohne, A. Rovani, K. Sjobaek, K. Tsiskaidze, J. Janssen, J.W. Tsung, N. Wermes.
Angle = 0º - Eff. = 99.0%
Angle = 15º - Eff. = 99.9%
p-irradiated devices (dose = 1015 neq/cm2)
Lorentz Angle @ B = 1.6 T)
Planar: ΘL = -7.4º ± 0.4
3D: ΘL = 0º
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 20108
FBK – 3D Sensors for IBLIBL Design (slim and active edge):
• 3D sensor with slim edge (200µm) and full through columns. DRIE (Deep Reaction Ionizing Etching) is stopped by a 0.7µm membrane. In process 200 and 230 µm thick wafer batches. Expected wafers Oct.2010
• Active edge, with support wafer. Wafer end of the year.
• Wafer floorplan has 8xFE-I4, 9xFE-I3, CMS, ...
Planar Sensor
3D Sensor
700nm DRIE stopping membrane
FBK 3D wafer for IBL
FBK DRIE:200÷230 µm x 12µm
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 20109
Indium Bump Bonding (MI, GE)
4 Pixels shorted
6 Pixels shorted
8 Pixels shorted
164 Pixels shorted
Dummy sensor Dummy FE
Indium BB at Selex (technology option, SiAg at IZM baseline)
• Selex qualified for small FE-I3 need to change the process to FE-I4
• First attempt with dummy was partially succesfuls
• Need to upgrade the flip-chip head and change pressure/temperature of the process
• Test with scan chains -> with FE-I4 if successful.
X-ray of FE-I4 size dummy bumped to dummy sensor
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201010
ROD (BO + GE)Redesign the ROD (Read-out Driver) architecture starting from the Pixel design:
• Reason: components obsolescence, bottle neck of the Architecture, complexity in debugging due to mixed DSP / FPGA environment.
Smart Idea:• Move the embedded processing used for calibration (4 DSP/Board) to
standard PC: use GB-ethernet
Responsibilities:• BO the ROD board,
FPGA, PowerPC Programming
• GE electrical-BOC to connect to FE-I4 modules without opto-link (debug the initial system)
INFN responsibility
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201011
Flex Hybrid Design (GE)Stave flex (technology / test demonstrator)
• Final layout made at GE submitted to CERN PCB workshop: in production
• 5 Cu layers and 1 Al layer (for LV)• Total thickness = 0.45mm• (Designed) Impedance = 80Ohm
Several additional designs• Single layer module flex, test boards, • Simulation of the full chain
undergoing at GE
EOS
Wing
Bus (10mm wide)
Simulation of transmission: CLK/DT-IN (40 MHz, multipoint)
Simulation of transmission: DT-OUT (160 Mbps, multipoint)
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201012
PP2 Redesign (MI)
IBL needs new Power Distribution System:• Increase of current per channel worst case (up to ~ 4A)• Solution: use two LDO (low drop outputs) / channel with current limit
Controller board• to improve the existing design (new FPGA)• Collaboration between Milano and Barcellona• FPGA: same ACTEL family but need to qualify
for radiation tolerance
Regulator Board
Controller Board
PP2 Crate
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201013
Stave Design (MI)STAVE CARACTERISTICS SIMULATION RESULTS
Pipe ID/OD[mm]
Omega Thickness
[µm]
Foam Density[g/cm3]
Coolant X/X0 [%] Thermal Figure of Merit (Γ)
[ºC•cm2/W]Bare
Stave with Coolant
Full layer (+ Module
+ Flex)
CF pipe, heavy foam 2.4 / 3.0 150 0.55 C3F8 0.48 1.056 17.25
CF pipe, light foam 2.4 / 3.0 150 0.25 CO2 0.36 0.956 18.56
Ti 3mm pipe, light foam 2.8 / 3.0 300 0.25 C3F8 0.66 1.276 2.79
Ti 2mm pipe, light foam 2.0 / 2.2 300 0.25 CO2 0.57 1.166 3.22
Design baseline defined:• Ti cooling pipe with CO2 cooling.Prototyping and test• Many prototypes made • Status: finalizing base line design• Major technical contributions from MI and
~1/3 of the project under financial responsibility of INFN
Baseline
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201014
TDRIBL Technical Design Report Status
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201015
TDR: Status & ScheduleMotivation for delay in TDR printout:
• LHC machine plans after Chamonix, luminosity profile, machine shut-downs impacted on IBL TDR.
Need of better documentation of Physics performance for the TDR ATLAS EB "IBL physics and performance taskforce”(M. Elsing, A. Andreazza)
• The TF will reinforce the efforts to ensure the completion of the IBL performance studies for the IBL TDR by end of August.
TDR draft (Schedule)• First draft circulated to selected readers,
comments received, being implemented.• Second review by experts: mid July.• TDR draft ready for distribution to IBL
Collaboration: 2nd week of August• Final TDR ready: 4th week of August• Submission to LHCC: 1st week of September
Iourii GusakovExisting B-layer
IBL (Staves)
Ed Moise
IBL (Staves)
IBL in the Physics Simulation & in the Engineering CAD Rendering
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201016
Physics & Performance TFconsolidate and extend present studies
• single particle performance (pions and muons) • tracks in jets (100 and 500 GeV di-jets, top, WH) • primary vertexing with high lumi. Pileup • b-tagging, especially redo high-pt jets studies
study different pileup scenarios• zero, 1034, 2*1034 and 3*1034 luminosity • estimate efficiency and fake rate vs lumi• demonstrate how IBL helps for robust tracking in jets, with fakes, …
add emulation of Pixel/SCT readout problems • study robustness of tracking and how IBL recovers performance
Status• IBL geometry existing, motecarlo production ongoing• Checking results on single tracks, tuning jets and vertexing• TDR editing… keep deadline!!!
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201017
IBL Performance (TF Results)Simulation shows:
• Clear improvement in impact parameter resolution (plot 1)
• Specially in the region pT<10 GeV, that in ATLAS is dominated by multiple scattering
• 50% improvement of rejection power in b-tagging (plot 2)
• Performance are stable even if existing b-layer is off (plot 3).
Plot 1(top events)
Plot 1Light jets rej.
Plot 3IP resol.
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201018
MOUInterim-Memorandum of Understanding
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201019
Memorandum of Understanding
IBL Memorandum of Understanding (MoU) • Between The ATLAS COLLABORATION, and Funding Agencies/Institutions of
the ATLAS Collaboration constructing the IBL (for the ATLAS construction was between Institutes and CERN).
• The MoU comprises all of the actions needed to construct and commission the IBL. The operation and maintenance of IBL is not a part of the present MoU and will be included, following its completion, within the M&O MoU framework. (IBL once delivered will be part of the Pixel Detector)
• Annexes define: work sharing and responsibility, cost contribution, project organization and management structure.
IBL interim MoU – Why an interim MoU?• Ad Interim MoU until sensor technology is chosen (Planar Silicon / 3D Silicon /
Diamond) - Decision on sensor technology (Spring 2011) – Sensor R&D and IBL communities work in tight collaboration to finalise a design matching IBL specification.
• Consolidate interest of Institutes and availability of funds
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201020
Development of Interim-MoU
IBL (interim)-MoU Status:• “IBL Kick-off” meeting (8/7/2009)
• Institutes express their interest in the IBL based on project WBS (Workpackage Breakdown Structure).
• Institute Board created with the Institutes interested in the project• Extended Pixel IB (Meetings: 1/03/2010 and 18/06/2010)• Defined sharing of work, cost amongst Institutes/Funding Agencies (i-MoU annexes)• All project is covered by resources – need x-check with Funding Agencies (FA)
• Status• Collecting feedback from FA on funding and general project support• Going to sign the interim-MoU?
INFN (BO, GE, MI, UD)• Quite active in the project, very good synergy and collaboration keeps up INFN visibility.
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201021
Institutes and Contributions to IBL
Note: the numbers in the table "are not final, nor are the suggested financial contributions yet firm, but are meant for a common overall discussion.”
Technology options refer to supplementary costs that are sensor technology specific and will be known before the definite MoU takes effect.
42 Institutes in the interim-MoU (few others are “observers” ).14 Countries + CERN
9.7 MCH total project cost
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201022
INFN Contribution to IBLTotal IBL cost:• 9741 kCH
Total INFN contribution:• 1400 kCH (14.4 %)• 1047 kCH CORE• 354 kCH M&O-A in-kind
~100 kCH presently on M&O-A could be deducted from INFN if cables (assigned as work responsibility) becomes in-kind contribution.
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201023
INFN Contribution to MoU Items
Resources and deliverables are summarized in the two tables
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201024
RICHIESTE FINANZIARIE
2011 – Programma attività INFN, richieste finanziarie, responsabilità, milestones
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201025
BOLOGNA
Attività 2011:• Sviluppo PCB prototipo ROD.• Sviluppo firmware FPGA e software PowerPC del ROD
• porting software da DSP (old Pixel ROD) a PowerPC• Test bench per sviluppo software TDAQ del ROD (Crate e Single Board
Computer – SBC)
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201026
GENOVA
Attività 2011• Sviluppo prototipo funzionale Flex Hybrid per lo stave e per il modulo• Disegno versione 2 del FE-I4 (sottomissione Autunno 2011)• Catena alta tensione: Test della catena completa di alta tensione con PS, cavi a PP1,
Flex hybrid, sensore• Si sta discutendo di installare I cavi nell Shut Down 2012/13 – sono su M&O-A,
potrebbero essere presi in-kind (stima ~40÷50 kCH).• Sviluppo prototipo & test dei moduli: in vista della produzione (2012) del 50% del totale• Sviluppo scheda BOC (back of crate card) elettrico per leggere moduli con ROD senza
opto-link (per QC RoD, test-beam, system test, produzione moduli…). In collaborazione con BO e gruppi tedeschi (BOC)
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201027
MILANO
Attività Milano 2011:• Prototipaggio e preproduzione stave• Modifiche schede regolatori PP2 (differenti specifiche FE-I4: VDD , IDD ),
scheda controller PP2 (nuova FPGA da qualificare con irraggiamento), backplane
• Sviluppo bump-bonding con Selex (alternativa technologica alla IZM)
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201028
TRENTO (Dot.1 PD)
Attività 2011:• Simulazione sensori in 2 D e 3D• layout sensori 3D (slim e active edge), layout maschere bump-bonding• Test strutture su wafer sensori 3D: prima e dopo irraggiamenti
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201029
UDINE
Attività 2011:• Sviluppo sensori 3D insieme a UD e TN (fase di prototipaggio), • Bump-bonding di FE-I4 con sensori 3D• Test-beam, irraggiamenti sensori 3D• Pre-produzione sensori (tecnologia da decidere a metà 2011)
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201030
Sommario Richieste e Responsabilità IBL
Responsabilità nel progetto IBL:• Giovanni Darbo: IBL Project Leader L1
https://twiki.cern.ch/twiki/bin/view/Atlas/InnerDetectorOrganisation
• Danilo Giugni Stave WG Coordinator L2https://espace.cern.ch/atlas-ibl/Shared%20Documents/IBL_Organization.v1.2.pdf
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201031
Milestones INFNMilestones – ATLAS IBL:
• IBL -Test beam di rivelatori con chip FE-I4 30/4
• IBL - Scelta baseline per i sensori 31/7
• BL - produzione e test prototipo ROD/BOC 31/10
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201032
ConclusionsIBL planned to be completed by 2015
• CERN/Experiments agree on a shutdown in 2016
TDR is progressing and documenting the technical design of the IBL• Deadline for submission to LHCC early September
iMoU ready to sign• Some Countries/Institutes already did.
INFN balanced between money contribution and visibility of activities, but
• Competition is high … and many want a seat on boat!
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201033
BACKUP SLIDES
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201034
IBL Project Status in PillsAll the aspect of the IBL project are pretty well covered:
• Some in advanced design or prototype phase, as mentioned sensor and FE-I4
Just to mention a few• Stave: baseline CO2 cooling & Ti-pipe, TM measurements & FEA simulation well on its
way.• Stave/module flex-hybrid: multi-layer and stacked single layer prototyping.• Internal services: design, simulation, prototyping• Off-detector R/O: architecture defined, detailing board design and firmware• Power chain: upgrade study of the PP2 regulator. Simulation & design, waiting FE-I4
for selecting power scheme. Sensor decision impacts HV selection.• Integration in SR1, installation mockup in bld. 180: designs, prototypes, getting parts• Stave loading: ideas, testing, looking at jigs• Layout: global supports, beam-pipe flanges, IST• 2012 shutdown: preparatory activities in the pit for IBL• Installation: guiding pipe, insertion/extraction table, ALARA• Cooling: cooling plant parameters, TM studies and prototypes for beam-pipe bakeout
For most updated overview checkout June IBL Workshop at hold Geneva Univ.:• http://indico.cern.ch/conferenceTimeTable.py?confId=93635#20100616.detailed
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201035
IBL LayoutBaseline layout decided
• 14 Staves, “reverse turbine” (there were two main options in Barcelona)
Beam-pipe reduction:• Inner R: 29 25 mm
Very tight clearance:• “Hermetic” to straight tracks
in Φ (1.8º overlap)• No overlap in Z: minimize
gap between sensor active area.
Layout parameters:• IBL envelope: 9 mm in R• 14 staves.• <R> = 33 mm.• Z = 60 cm (active length).• η = 2.5 coverage.
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201036
Extraction/InsertionProgresses on many areas:
• Installation mock-up (Geneva & CERN ) in bld 180• Extraction/Insertion “table” (LPSC Grenoble)• Long Guiding Tube (Brandeis)• Integration and Envelopes definition (CERN Atlas TC)• Beam-pipe split flanges (CERN Vacuum group)• ALARA (CERN Atlas TC)
InstallationMock-up in bld.180
ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 201037
IBL TDREditors: M.Capeans (CERN), K. Einsweiler (LBNL)
Chapter Editors: G.Darbo, T.Flick, M.Garcia-Sciveres, C.Gemme, H.Pernegger, O.Rohne, R.Vuillermetand quite many Contributors to different chapters: A.Andreazza, O.Beltramello, A.Catinaccio, I.Dawson, D.Ferrere,
KK.Gan, D.Giugni, Y.Gousakov, N.Hartman, I.Hinchliffe, F. Huegging, S.Kersten, N.Massol, P.Morettini, D.Muenstermann, L.Nicolas, M.Raymond, S.Rozanov, D.Su, W.Trischuk, C.da Via, E.Vigeolas and S.Wenig
Chapters’ Structure:1. Overview – IBL history, lifetime and failure issues, requirements, physics2. Modules – sensors (3 technologies), FE electronics, integration (bump-bonding, “mini- Flex”)3. Staves - mechanical concept for the stave, module loading, cooling and thermal issues, electrical
integration, internal services4. Integration - mounting staves with beampipe, services integration, final surface testing5. Control, Readout, and Integration - power supplies, opto-links, off-detector readout electronics,
external services, cooling plant, DCS, integration with the present detector DAQ/DCS6. Installation – beampipe extraction, mock-up, IBL transport and installation, connection and testing7. Commissioning – calibration, early data-taking plan with random triggers, charge injection, cosmic ray
data-taking8. Prototyping, Production Testing, System Testing 9. Critical Integration Issues – cooling, bakeout, powering, detector weight, material budget10. Project Management and Organization
Draft has 200 pages (too long?).Circulated to selected readers (many comments received):
Attilio Andreazza, Andrea Catinaccio, Allan, Nigel Hessey, Tim Jones , Leonardo Rossi, Steinar Stapnes, Georg Viehhauser, Norbert Wermes