ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250... · 2018. 11. 12. ·...
Transcript of ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250... · 2018. 11. 12. ·...
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References: • M. Smith, Application Specific Integrated
Circuits, Chap. 16• Cadence Virtuoso User Manual
ASIC Physical DesignTop-Level Chip Layout
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Top-level IC design process Typically done before individual circuit block layouts Top-level netlists usually created before any layout
Create top-level schematic “Components” are functional blocks and I/O pads Blocks include IP and user-created modules
Create a chip “floor plan” from the schematic Place functional blocks and I/O pads Connections shown as overflows
Route top-level connections (automatic or interactive) Eliminate overflows, DRC errors, shorts Create layouts of user-designed modules
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Chip floorplan I/O pads
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Modulo-7 counter in pad frame
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Floorplanning (Smith text chap. 15, 16) Floorplanning: arrange major blocks prior to detailed layout
to optimize chip area input is a netlist of circuit blocks (hierarchical) after system “partitioning” into multiple ICs
estimate layout areas, shapes, etc. Flexible blocks – shape can be changed Fixed block – shape/size fixed
do initial placement of blocks (keep highly-connected blocks close)
decide location of I/O pads, power, clock
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Floorplan a cell-based IC (Fig. 16.6)- may have to fit into “die cavity” in a package
Initialrandomfloorplan
Heavycongestionbelow B
Blocks moved to improvefloorplan
Reducedcongestionafterchanges
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Congestion analysis (Fig. 16.7)
Change A & C to reduce congestion
Congestion map
Trial floorplans
Channeldensity
Initial 2:1.5die aspectratio
Altered to 1:1 aspectratio
A & B resized to reduce congestion
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Routing a T junction
Preferred Constraining
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Define channel routing order
•Make “cuts” (slice in two) to separate blocks•Slicing tree, corresponding to sequence of cuts,determines routing order for channels
- route in inverse order of cuts
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Non-slicing structure
Cyclic constraintprevents channelrouting
Cannot find slicing floorplanwithout increasingchip area
Slicing floorplanpossible, but inefficient in useof chip area
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Power distribution
Option a:m1 for VSSm2 for VDD---------Potentialproblems inrouting channel
Uses special power pads, wires, routingOption b:m1 parallel tolongest side---------------Easier routingbut more vias
Many layerchanges/viasif VDD/VSSon different layers
Array of viacontacts forVDD/VSSBuses.
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Clock distribution (minimize skew)
Often use“clock tree”structure
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MOSIS SCMOS Pad Library Includes 6 pad types: Input & output pads with buffers VDD & GND pads with ESD Analog IO pad with ESD Analog reference pad with ESD
Assemble into a “frame” in which pads butt against each other Allows VDD & GND wires to form a continuous ring Special “spacer” and “corner” pads complete the ring
ADK tools will generate a pad frame from a schematic
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MOSISTSMC 0.35umHi-ESD Pad Frame
(l) lambda=0.30um
543214039383736
Tiny ChipPin #’s
26 27 28 29 30 31 32 33 34 35
16171819202122232425
15 14 13 12 11 10 9 8 7 6
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MOSISTSMC 0.35umHi-ESD Pad Frame
Physical layout
Corner pad(passes VDD/GND)
VDD/GNDwires form continuousring throughthe pad frame
Spacer padif no signal
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MOSIS I/O Pad Schematic
Bonding Pad
Inputs to logic ckts
Outputsfrom logic ckts
Outputenable
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Simplified pad circuit
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MOSIS 1.6 um bidirectional pad
Source:Weste,“CMOSVLSIDesign”
To Core
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ASIC frame + core in Virtuoso
Process:
1. Create “core” block
2. Create pad frame
3. Connect them
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Top-level bottom-up design process Generate block layouts and for each block: Import the GDSII (or DEF) stream into a Virtuoso library Import the Verilog netlist into the library Perform DRC and LVS on each block until “clean” Create a schematic symbol from the netlist in the library
Create a block diagram/schematic in Virtuoso “Composer” Create a library for the top-level circuit block and create a
schematic view Instantiate schematic symbols from the library Interconnect with nets and add pins Check and save
Create a layout from the schematic diagram
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Top-level block schematic in “Composer”
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Before module and I/O placement
Blocks initiallyoutsideboundary
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After placing modules and pins
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Power routing between blocks
Connectpowerrings
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Nets shown as “overflows”
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Routed circuit block
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Block symbol (to connect to I/O pads)
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Pad frame with signal wires
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Zoomed view of pad frame
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Schematic: block + pad frame
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Placement of frame and core
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Power/ground routed manually
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Before signal routing
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After routing – final layout