ANNUAL GENERAL MEETING

May 1, 2017

1

May 2017

Safe Harbor Statement

This presentation contains statements about management's future expectations, plans and prospects of ourbusiness that constitute forward-looking statements, which are found in various places throughout the pressrelease, including, but not limited to, statements relating to expectations of orders, net sales, product shipments,backlog, expenses, timing of purchases of assembly equipment by customers, gross margins, operating resultsand capital expenditures. The use of words such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”,“may”, “plan”, “predict”, “project”, “forecast”, “will”, “would”, and similar expressions are intended to identifyforward looking statements, although not all forward looking statements contain these identifying words. Thefinancial guidance set forth under the heading “Outlook” contains such forward looking statements. While theseforward looking statements represent our judgments and expectations concerning the development of ourbusiness, a number of risks, uncertainties and other important factors could cause actual developments andresults to differ materially from those contained in forward looking statements, including any inability to maintaincontinued demand for our products; failure of anticipated orders to materialize or postponement or cancellation oforders, generally without charges; the volatility in the demand for semiconductors and our products and services;failure to adequately decrease costs and expenses as revenues decline; loss of significantcustomers; lengthening of the sales cycle; acts of terrorism and violence; inability to forecast demand andinventory levels for our products; the integrity of product pricing and protection of our intellectual property inforeign jurisdictions; risks, such as changes in trade regulations, currency fluctuations, political instability and war,associated with substantial foreign customers, suppliers and foreign manufacturing operations; potential instabilityin foreign capital markets; the risk of failure to successfully manage our diverse operations; those additional riskfactors set forth in Besi's annual report for the year ended December 31, 2016; any inability to attract and retainskilled personnel; and other key factors that could adversely affect our businesses and financial performancecontained in our filings and reports, including our statutory consolidated statements. We expressly disclaimany obligation to update or alter our forward-looking statements whether as a result of new information, futureevents or otherwise.

2

May 2017

Agenda

I. Company Overview

II. Market

III. Strategy

IV. Financial Review

V. Outlook & Summary

3

May 2017

I. COMPANY OVERVIEW

4

May 2017

Year Ended December 31, (€ millions, except share data) 2014 2015 2016

Revenue 378.8 349.2 375.4

Orders 407.6 348.3 373.8

Gross margin 44% 49% 51%

EBITDA 82.1 73.0 89.8

Pretax income 71.3 57.1 73.6

Net income 71.1 49.0 65.3

EPS (diluted) 1.87 1.27 1.70

Net margin 19% 14% 17%

Net cash 118.0 136.5 168.1

Summary Historical Financials

• 2016 Results:• Renewed revenue growth (+7.5%):

• Asian capacity build• New advanced packaging capacity• More investment in smart phone

features and sensors• Continued growth of automotive• Industry conditions turned + in H2

• Strong profit development (+33.3%):• Market position and efficiencies drive

gross margin to 51%• Operating initiatives keep expense

growth in check

• Net cash +€ 31.6 million (23.2%)• Supports shareholder friendly capital

allocation policy• € 125 million Convertible Notes helps

fund future growth

5

May 2017

Which Have Helped Drive Growth in Shareholder Returns

6

13.1%

42.0%

125.4%

0.2%

70.5%

4.3%

5.2%

4.0%

8.1%

6.5%

17.4%

47.2%

129.4%

8.3%

76.9%

0%

20%

40%

60%

80%

100%

120%

140%

2012 2013 2014 2015 2016

Besi Shareholder Total Return

Price Dividend659.1%

170.4%

0%

100%

200%

300%

400%

500%

600%

700%

Besi PHLX Semiconductor(SOX)

Total Cumulative ReturnBesi vs. SOX Index

• €186.0 million of dividends and share repurchases paid since 2011• Substantial share price outperformance vs. benchmark index

May 2017

And Resulted In A Higher Stock Market Valuation

7

May 2017

Besi’s Performance Has Also Translated Into Higher Dividends For Shareholders

0.22 0.33

1.50

0.73

0.42 0.43

1.89

1.29

1.74

4.3%

5.2%

4.0%

8.1%

6.5%

5.5%

0.0%

2.0%

4.0%

6.0%

8.0%

10.0%

12.0%

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

1.80

2.00

2011 2012 (b) 2013 2014 2015 (b) 2016 (b)*

Div

iden

d Y

ield

Div

iden

d (€

)

Dividend EPS (basic) Total Dividend Yield (a)

1.20

1.74

0.30

a) Based on year end stock price. b) Includes special dividend of € 0.08, € 0.20 and € 0.35 in 2012, 2015 and 2016, respectively

* Includes € 1.74 proposed for approval at May 1, 2017 AGM

71% 77% 79% 93%Payout Ratio: 100%

Since 2011, € 5.29/Share Paid in Dividends*

30%

8

May 2017

4.3%

2.1%1.9%

1.8% 1.7%

1.4% 1.3%

0.6%

0.0% 0.0% 0.0% 0.0% 0.0% 0.0% 0.0%0.0%

0.5%

1.0%

1.5%

2.0%

2.5%

3.0%

3.5%

4.0%

4.5%

Dividend Yield as of April 20, 2017

And The Highest Dividend Yield Amongst Peers

Source: Reuters April 20, 2017

9

May 2017

Besi’s Market Cap Has Grown to €1.7 Billion Currently. Shareholder Base Has Diversified

Market Profile

Share Ownership

0

100

200

300

400

2013 2014 2015 2016

Average Daily Volume(Shares 000s)

60%

42%

0%

20%

40%

60%

80%

2011 2016

Top 10 Shareholders(% of shares outstanding)

• BESI• Euronext Midcap AMX

Symbol/ Index

• € 1,659 MM ($1,777 MM)

Market Cap*

• Pay out 40-80% of net income per annum

Dividend Policy

• As of April 20, 2017• Source: Besi estimates

NL30%

US20%

UK14%

Europe ex. NL

17%

Other19%

By Geography

10

May 2017

II. MARKET

11

May 2017

Assembly Equipment Market Trends

• VLSI forecasts that current market upturn will continue through 2018• Underlying semiconductor production trends favorable

3.1

3.9

3.33.7

4.1 4.2

-21.9%

27.8%

-16.3%

12.5%9.3%

3.5%

-30%

-20%

-10%

0%

10%

20%

30%

40%

0.0

1.0

2.0

3.0

4.0

5.0

2013 2014 2015 2016E 2017E 2018E

(US

$ bi

llion

s)Assembly Equipment Market

Market Size YoY Growth Rate

Source: VLSI January 2017

254.9

378.8 349.2

375.4

79.0 110.2-6.9%

48.6%

-7.8%7.5%

39.5%

-50%

0%

50%

100%

150%

0

100

200

300

400

2013 2014 2015 2016 Q1-16 Q1-17

(€ m

illio

ns)

Besi RevenueRevenue YoY Growth Rate

12

May 2017

Internet of Tomorrow Drives New Innovation Cycle

SoC

Connectivity

5G

Internet of Tomorrow

Will Drive Innovation in Many

End User Applications

Requiring Increased

Functionality and Leading Edge

Advanced Packaging Solutions

Mobile Revolution Digital Society

13

May 2017

Growth in Internet Connected Devices Requires Changes in Process/Equipment

Today => TomorrowFront End

Transistor scaling

Lithography

New structures 3D

Back End Assembly

More contacts

Smaller pitches

Thinner/densermore complex packages

Stacked structures 3D

WLP/FOWLP packages

From simple Wire Bond to BGA/Flip Chip to complex 3D structures with TSVs,microbumps and thin dies

to WLP/FOWLP packageswithout substrate interposer

14

May 2017

And Is Reflected in Besi End User Application Trends

Source: Company Estimates

• Mobile internet devices are 30% of revenue

• Automotive has grown to 18%

• Computer/PCs holding up due to high end server market

• Service/spare parts has increased to 15%

30%

24%

18%

10%

3%

15%

0%

5%

10%

15%

20%

25%

30%

35%

2016

15

May 2017

Besi Revenue Growth Drivers

Revenue Growth Drivers

World tooling up

for new tech cycle <20

nanoIncreased

smart phone functionality

Emerging process

deployment WLP and

TCB

New device applications

IoT, AI, wearables, driverless

carsWire bond/flip

chip conversion

Solar cell plating

transition from silver to copper

Increased % of Chinese market and

Asian supply chains

Higher % of mainstream assembly equipment

applications

16

May 2017

III. STRATEGY

17

May 2017

Strategic Planning Review 2017- 2021

• TCB, ultra thin die, eWLB die bonding • Large area, ultra thin, wafer level molding• Solar and battery plating

Maintain best in class tech leadership. Expand capabilities for:

• Increase mainstream penetration with high quality mid-range products• Increase % of global semiconductor supply chains• Expand presence in China and share of wallet• Expand software and process support in Asia to better support installed base

Increase market presence and share in addressable markets

• Continue West-East personnel transfer. Target 75% Asian headcount• Continue to reduce euro based costs• Target more local production. Shorten cycle times• Accelerate common platform/parts development• Optimize Asian supply chain

Achieve a more scalable, flexible and lower cost manufacturing model

• Emphasis on wafer level processing

Acquire companies with complementary technologies and products

18

May 2017

TCB/TSV and Fan Out WLP Are Emerging Process Technologies

Enabling technology for high end memory and optical applications

Next step beyond Flip Chip

TCB/TSV (Substrate Based) Fan Out WLP (Wafer Level)

Fan Out Advantages :• Wafer scale. Eliminates expensive substrate• No wire bonding • More cost effective than TSV in many applications by

factor of 2x

Leading market position :• Installed base of 60 systems in production• Estimated 75% market share• Principal Competition: Shibaura and Shinkawa

32 Stacked Die Capability

Besi TCB Advantage• 32 die stack at <5 micron accuracy

(current market: 4-8 die stack)• High accuracy over large area placement• Highly stable• Industry leading throughput• Compact form factor

Leading market position• Installed base of 40 systems in production• Estimated 50% market share of active systems • Highest penetration of memory and GPU markets• Principal competition: Toray, ASM PT, Shinkawa

Preferred process for high data transfer and optical devices in IoT, mobile and power

19

May 2017

Asian Production Transfer Has Helped Reduce Break Even Revenue Levels

Asian Production Has Significantly Expanded

Leading to Lower Fixed European + NA Headcount

And Reduced Break Even Revenue Levels

-139

396

708 396

847

43%

98%

0.0%

20.0%

40.0%

60.0%

80.0%

100.0%

120.0%

-

100

200

300

400

500

600

700

800

900

2010

2016

Shi

pmen

ts

China Other Asian % Direct

741 508

802 1,041

1,543 1,549

-

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2011

2016

Hea

dcou

nt

Europe/NA Fixed HC Asia Fixed HC

270

194

-

50

100

150

200

250

300

2011

2016

(€ m

illio

ns)

20

May 2017

Expansion of Besi Chinese Operations

33

139

0

30

60

90

120

150

2015 2016

Uni

ts

Unit Shipments Besi China

+321%

2016

2015

China30%

Other Besi70%

China Customer Revenue as % of Total Revenue

China23%

Other Besi77%

21

May 2017

Workforce Has Become More Asia Centric, Scalable and Flexible

1,543 1,475

1,404 1,489 1,489

1,549

52%54%

57%60%

64%

67%

48%46%

43%40%

36%

33%30%

40%

50%

60%

70%

0

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2011 2012 2013 2014 2015 2016

Hea

dcou

nt

Europe/NA Fixed HC Asia Fixed HC Asia % Europe/NA %

Fixed Headcount

Total Headcount

• Asia now represents 67% of total fixed headcount

• Revenue scalability via Asian temp workers

• European and NA fixed headcount continues to decline:• -31.4% since 2011• -5.9% vs. 2015

676 603 591 540 508

799 801 898 949 1,041

65 55

143 50 120

1,5391,458

1,6321,539

1,670

0.0%

1.0%

2.0%

3.0%

4.0%

5.0%

6.0%

7.0%

8.0%

9.0%

10.0%

0

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2,000

2012 2013 2014 2015 2016T

emp

% o

f Tot

al

Hea

dcou

nt

Europe/NA Fixed HC Asia Fixed HC Temporary HC Temp % of Total

22

May 2017

China and Singapore Operations Have Expanded Significantly in Past Two Years

81 82 87 81 77

676 603 591 540 508

6866 72 121 163

234236 294 314 371

416417

445 433430

1,4751,404

1,489 1,4891,549

0

400

800

1,200

1,600

2,000

2012 2013 2014 2015 2016

Total Fixed Headcount by Country

Other Europe/NA Singapore China Malaysia

23

May 2017

IV. FINANCIAL REVIEW

24

May 2017

Revenue Growth and Operational Progress in 2016 Yield Increased Profits

2525

2016/2015

€ 349.2 € 375.4

14.0%17.4%

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

0 €

50 €

100 €

150 €

200 €

250 €

300 €

350 €

400 €

2015 2016

Net

mar

gin

%

€ m

illio

nsRevenue Net Income

Gross Margin

OPEX

Headcount

Effective Tax Rate

14.3%

1,539

€ 112.5 MM

48.8%

+130

-3.1 points

+3.4%

+2.2 points

+7.5%

+3.4 points

€ 65.3€ 49.0

11.2%

1,669

€ 116.3 MM

51.0%

May 2017

Revenue & Gross Margin

Baseline Opex Net Income

Key Financial Metrics 2014 - 2016

26

379

349

375

43.8%

48.8%

51.0%

30%

36%

42%

48%

54%

60%

66%

330

335

340

345

350

355

360

365

370

375

380

385

2014 2015 2016

Revenue Gross Margin

86.8 93.5 96.7

7.1

19.0 19.6

93.9

112.5 116.3

0

20

40

60

80

100

120

140

2014 2015 2016

Base Opex Other Operating Expenses

64.5

46.9

65.2

€ 6.6

€ 2.1

€ 0.1

71.1

49.0

65.3

18.8%

14.0%

17.4%

-5%

0%

5%

10%

15%

20%

25%

30%

35%

40%

45%

(3)

7

17

27

37

47

57

67

77

2014 2015 2016AdjustmentsAdjusted Net IncomeNet Margin

* Adjusted to exclude: Upward revaluation of tax loss carry forwards, restructuring charges and net restructuring benefit

Gro

ss M

argi

n

€ in

mill

ions

€ in

mill

ions

€ in

mill

ions

May 2017

Liquidity Trends

Besi has significantly increased cash flow generation over past 5 years• Increased profits, faster cycle times, Asian

supply chain transfer

2016 vs. 2015• Cash flow from ops of € 98.7 million, up

14.1% vs. 2015• € 67.8 million utilized for dividends and

share repurchases in 2016, +11.3% vs. 2015• New 1 million buyback program initiated in

October 2016• 293,076 shares repurchased through

March 31, 2017 at € 33.42 per share

161.6

113.7

132.8

157.8 169.8

132.1

153.3

304.8

28.5 22.3 23.8 21.4 21.4 21.4 21.4

136.7133.1

91.4

109.0

136.5 148.4

110.7

131.9

168.1

0

50

100

150

200

250

300

350

Q1-15 Q2-15 Q3-15 Q4-15 Q1-16 Q2-16 Q3-16 Q4-16

(eur

o in

mill

ions

)

Cash and Deposits Debt Net Cash

€ 56.9 MMDividend

2014

€ 45.4 MMDividend

2015

27

May 2017

41% 39% 38% 33% 28% 25% 19% 16% 14% 13% 13% 12% 11% 10% 6% 2% 2% 1%0%

40%

80%

Net

Cas

h / M

arke

t Cap

Year End Net Cash/Market Cap

593 549

378 326

252 210 168 160 122 97 85 67 49 31 -

100 200 300 400 500 600 700

Net

Cas

h (€

mill

ions

)Year End Net Cash (€)

Net Cash Position vs. Peers

28

Source: Bloomberg, Capital IQ (April 20, 2017)

May 2017

Key Financial Highlights Q1-2017

Besi Reports Significant Q1-17 Revenue and Net Inco me GrowthOrders Increase by 162.4% vs. Q4-16

Strong H1-17 Business Outlook

• € 110.2 million :• +18.4% vs. Q4-16• +39.5% vs. Q1-16

Revenue

• € 239.8 million :• +162.4% vs. Q4-16• +130.9% vs. Q1-16

Orders

• € 24.3 million:• +45.5% vs. Q4-16• +203.8% vs. Q1-16

Net Income

• Net cash of € 175.7 million• +€ 27.3 million (+18.4%) vs. Q1-16

Liquidity

29

May 2017

Besi Has Achieved Best in Class Profit Metrics

ASM Pacific Suss K&S Besi

26.3%13.6%13.3%-3.1%

19.4%7.7% 17.2%4.2%

23.9%14.4% 17.1%8.7%

Worst Peer

7.5%

33.0%

8.7%

2.8%

4.2%

-3.1%

1.7

17.4%10.2% 10.3%

2.8%

7.5% 24.3%9.8% 19.6%

BESI

Inventory Turn

CF from Ops/ Revenue

Return on Equity

Net Margin

EBITDA Margin

Gross Margin

Revenue Growth

BestPeer

24.3%

51.0%

23.9%

17.4%

19.4%

26.3%

4.3

ASM Pacific Suss K&S Besi

3.4 4.3 2.3 1.7

Trailing Twelve Months ended December 31, 2016Data Source: Bloomberg

30

51.0%45.6%37.6%33.0%

May 2017

V. OUTLOOK & SUMMARY

31

May 2017

Q2-17 Guidance

Revenue Gross Margin

Operating Expenses

Q1-17 Q2-17 Q1-17 Q2-17

Q1-17 Q2-17

€ 110.2 55.7%

€ 30.5

54%-

56%

40%to

50%

10%to

15%

32

May 2017

Summary

Leading semi assembly equipment supplier with #1

or #2 positions in fastest growing segments

Technology leader. Best in class product portfolio

Gaining market share in advanced packaging

Scalability and profitability of business model greatly

enhanced in cyclical industry

Significant upside potential.New technology cycle,

expanded use of advanced packaging, execution of

operating initiatives

Committed to enhancing shareholder value.

Attractive capital allocation program

33