Angers - Franceemc/20130502P1.pdf · EMC HK Chapter Technical Seminar May 2, 2013 Angers - France...

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The past, present and future of EMC in integrated circuits: standards and trends

Mohamed Ramdani (Col. Etienne Sicard)Professor

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ESEO-EMC – Angers, [email protected]

http://eseo-emc.fr/people/mohamed-ramdani

Mohamed Ramdani - EMC HK Chapter Technical Seminar - May 2, 2013

EMC HK Chapter Technical SeminarMay 2, 2013

Angers - France

• 300 km SW of Paris, in the Loire Valley• 160,000 inhabitants (17th city in France)

while c. 283,000 live in its metropolitan area.

Mohamed Ramdani- EMC HK Chapter Technical Seminar - May 2, 2013 2

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ESEO- Angers

• ESEO : Graduate School of Engineering• Electronics, Computer Science, Telecommunication, Networking

F d d i 1956

Mohamed Ramdani - EMC HK Chapter Technical Seminar - May 2, 2013 3

• Founded in 1956• 4300 alumni (09/2011)• Graduation rate: 180 students/year

• 10 minutes from Angers railway station (direct tramway)• Nice river view (La Maine)

Summary

I. PAST

II. PRESENT

III. EVOLUTION OF ICS AND CONSEQUENCE ON EMC

IV. MEASUREMENT OF IC EMISSION AND SUSCEPTIBILITY

V. MODELS FOR EMC SIMULATION

VI. FUTURE - WHAT IS NEXT ?


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I. PAST


PastAIR FORCE WEAPON LABORATORY, USASCEPTRE SOFTWARE


•Effects of the electromagnetic fields trigged by nuclear explosions on electronic devices used in missile launch sites. •Simulation software developed at IBM (Sedore, 1965)•Correlate simulations and experimental measurements obtained on an electromagnetic impulse test-bench.

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Past

In 1975, Richardson --- microwave energy to transistor. The rectified signal changes the quiescent operating point and the current gain of the transistor

In 1978, McDonnellDouglas Astronautics---- information on the susceptibility of ICs to


susceptibility of ICs tohigh-power RF andmicrowaveenergy.

Past

IEEE TRANS ON EMC, 1979SPECIAL ISSUE ON RF INTERFERENCE IN ICS

• Rising risk of interference between ICs and electromagnetic sources

• Very High Frequency (30 MHz -300 MHz)

• Visionary editorial about future problemsdue to higher speed and integration


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Past

IEEE TRANS ON EMC, 1998TECHNOLOGY COMPARISONS (M.P. ROBINSON)

Robinson (Univ. York) compared the radiated emissions produced by different familiesof logic circuits. Significant behavioral differences were observed


Past

FIRST WORKSHOP DEDICATED TO EMC OF ICS (1999)

Next event:Dec. 2013 in NARA , Japanwww.emccompo.org


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Recent past

Richard PERDRIAU - EMC HK Chapter Technical Seminar - May 2, 2013 11

Ben Dhia, Ramdani and Sicard compile the first book only dealing with EMC at integrated circuit level.

The book includes a description of measurement, model standards, techniques for low emission and susceptibility

II. PRESENT


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Present: EMC margin

Acceptable noise level

LINK BETWEEN MARGIN AND APPLICATIONS

Ioff/Ion MOS 32-nmAcceptable noise level

Process variations

Measurement error

Security

32-nm

Immunity vs. ageing (LTOL)


Domain Life time Margin

Aeronautics 30 years 40 dB

Automotive 15 years 20 dB

Mobile phone 1 year 0 dB

Margin depends on applicationAgeing

Required noise level

Environment

Present: the Ic as antenna

EMC of ICs issues

3 MHz

BandHF

Wavelength

100m

3 GHzSHF

0.1m

300 MHzUHF

1m

30 GHzxHF

10mm

30 MHzVHF

10m

Frequency 300 GHz


λ/4 25m 25mm0.25m 2.5mm2.5m

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Present: IC technology scale down

180nm 130nm 45nm90nm 32nm 22nm

Complexity

Packaging

180nm

50M

130nm

100M

45nm

500M

90nm

250M

32nm

1G 2G


2002

Core1 A

2004

Core+ DSP3 A

2008

Multicore, DSPs, RFMemoriesSensor30 A

Embedded blocks transient current

2006

Core DSPseMem10 A

2010

Multicore, Multi DSP Reconf FPGAMulti RFMemoriesSensors100 A

2012

Present:Technology scale down


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EMC: nightmare ?

EMC IS THE 3RD CAUSE OF REDESIGN

DESIGNArchitectural Design

Design EntryDesign Architect

FABRICATION

Version n°Version n°


EMC Measurements

NO GO GO

Compliance ?

IV. MEASUREMENT OF IC EMISSION & SUSCEPTIBILITY


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Measurement of emission

IEC 61 967IEC 61967-2(TEM : 1 GHz)

IEC 61967-3/6(Near-field Scan 5 GHz)

IEC 61967-4(1/150 Ω 1 GHz)(TEM : 1 GHz) (Near-field Scan, 5 GHz) (1/150 Ω, 1 GHz)

IEC 61967-8(Mini-stripline)

IEC 61967-7(Mode Strirred Chamber :

Ext : IEC 61967-2(GTEM 18 GHz)

Mohamed RamdaniEMC HK Ch t T h i l S i M 2 2013

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(Mini stripline) (Mode Strirred Chamber : 18 GHz)

(GTEM 18 GHz)

Measurement of immunity

IEC STANDARDS FOR SUSCEPTIBILITY

IEC 62132-3 IEC 62132-4 IEC 62132-2(Bulk Current Inj. 1 GHz) (Direct Power Inj.1 GHz) (TEM/GTEM)

IEC 62132-8 IEC 62132-6 : IEC 62132-9(NFS 10 GH )


(Ministrip 5 GHz) (LIHA : 10 GHz) (NFS 10 GHz)

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Measurement of immunity

SUSCEPTIBILITY CHARACTERIZATION : DPI

OscilloscopeSignal generator

Device under test

10W Amplifier

or

Good signal

Failure signalPrinted Circuit Board

Device under test

DoutCoupling

Capacitance DUT


PC Monitoring

or Failure signalPower increase loop until failure

Frequency loop 1 MHz – 3 GHz



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V. MODELS FOR EMC SIMULATION


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Models for EMC simulation

EMC VALIDATED BEFORE FABRICATION

DESIGN ToolsDESIGN

Architectural Design

Design EntryDesign Architect

EMC Simulations

Design GuidelinesTraining


FABRICATION

EMC compliant

EMC SimulationsCompliance ?

GO

NO

A family of models

MODEL COMPLEXITY

Level

E i t 100 V(f), 100 Z(f)Equipment

Board

Component

V, Z

ICEM

Dipoles

101 R,L,C,I

101 dipoles

10 V(f), 10 Z(f)


Complexity

Physicalspice

106 R,L,C,I

LEECS102 R,L,C,I

x-highhighlow medium

Expo PowerSI

104 R,L,C,I

Confidentiality

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A family of models

IEC 62 433 – EMISSION (ICEM) AND IMMUNITY (ICIM) MODELS

1. ICEM-CE - Conducted RF emission

2. ICEM-RE - Radiated RF emission

4. ICIM-CI - Conducted RF immunity

4. ICIM-RI - Radiated RF immunity


ICEM model

IEC 62433-2 – ICEM CE – EMISSION IN CONDUCTED MODE

PDN

IC model

IT IT ET ETICEM-CE Block A IA

IT

IAPDN

(including package)

IA PDNof PCB

PDN(including package)

IBCIBC

IT IT

IT IT

IT IT

IT IT

ET ET

ET ETICEM-CE Block B

Example : Digital core


IA

IA = Internal Activity

PDN = Power Distribution Network

IT = Internal Terminal

ET = External Terminal

PDN(including package)

IBCIBC

IT IT

IT IT

IT IT

IT IT

IT IT

ET ET

ET ET

ET ET

ICEM-CE Block C

Example : Analog core

Example : I/O buffers

PackagePDN

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Immunity model

IEC 62433-4 – “ICIM CONDUCED IMMUNITY”

Most important is the injection system

Functionnal model

Coupling path

modelRF generator

modelSusceptibility criterion

Internal Behavior (IB)

DUT input structure model

Perturbation source

Extraction of

Injection model

Injection device model

Power limit

Voltage threshold


Behaviour of sensitive & non-linear parts

Passive DecouplingNetwork (PDN)

Extraction of power injection

PCB model threshold

Overcurrent

SNR degradation

LSB degradation….

Immunity model


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Case study: Cesame chip

RC filtering Worksbothfor Emission

Susceptibility level

and immunity

Isolated Core

RC Core


Normal Core

Isolated Core

Frequency (MHz)

VII. FUTURE - WHAT IS NEXT ?


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SHIFT TO 10-100 GHZ

100

(Parasitic Emission dBµV)

Consumer electronics, telecoms to use this band soon (or now…)

40

60

80

100

Emission envelop

Customer pressure

Customer concerns


0

20

10MHz 100MHz 1GHz 10GHz 100 GHz

SHIFT TO 10-100 GHZ

• [s] Measurement is available (but t l t )

0,00

0,01

0 5 10 15 20t(ns)I(A)

costs a lot…)

The GTEM concept could be extended to 100 GHz

On-chip sampling has ft limitation (100 GHz in 32 nm)

NORM : I_Vss (t)

-0,08

-0,07

-0,06

-0,05

-0,04

-0,03

-0,02

-0,01 0 5 10 15 20t(ns)

Passive scanners


Freescale/Insa patent « Cube probe, in partnership with Univ. Carleton Canada

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Future

NEW IEC STANDARDS FOR ICS

Bandwidth Type 2005 2010 2015 2020

< 3 GHzEmission model

ConductedEmission62433-2

Sol. ExistPDN, IA

Ind. use ICEM-CE

Radiated Emission62433-3

Sol. exist Sol. Exist –Radiated dipole

Ind. use ICEM-RE

Bandwidth Type 2005 2010 2015 2020


< 3 GHzImmunity model

ConductedImmunity62433-4

Sol. exist DraftICIM-CI

Ind. UseICIM-CI

Radiated Immunity62433-5

Sol. exist Sol. Exist –Radiated dipole

Ind. UseICIM-RI

AND WHY NOT ….

0 dBµV designscancel all fields 0 external di/dt

supply

RFI, ESD, EOS, EFT

De-synchronized parts

zero susceptibility designsClamp, filterProtect, shield by design, materialsDefensive core

Critical sensor

Critical decision

Detector


Reduce frequencyReduced VDDSmart capa managementRedundancy

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Conclusion

• Higher complexity and frequencies, technology scale down make EMC more and more challenging

• EMC investigated late in the design flow

• Mature standard measurement methods dedicated to ICs

• New standards for EMC modeling at IC level

• Good prediction of emission and susceptibility up to 2 GHz

• Golden rules for improved EMC validated

• In the future, 10-100 GHz EMC effects will be addressed

• A lot of room for invention, progresses in low emission and high immunity


Angers - Franceemc/20130502P1.pdf · EMC HK Chapter Technical Seminar May 2, 2013 Angers - France...

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