Analytical Modeling and Simulation of MEMS Microstructure-Microcantilever Using FEM

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    International Journal of Exploring Emerging Trends in Engineering (IJEETE)

    Vol. 01, Issue 01, Sept, 2014 WWW.IJEETE.COM

    All Rights Reserved 2014 IJEETE Page 21

    Analytical Modeling and Simulation of MEMS Microstructure-

    Microcantilever Using FEM

    1Anuj Kumar Goel,2Dr. H.P.Sinha,3Dr. Dushyant Gupta

    1M.M.Engineering College,MMU , Mullana ,Haryana2M.M.Engineering College,MMU , Mullana ,Haryana3Guru Jambheshwar University, Hisar, Haryana

    ABSTRACT-MEMS Devices ranges in size

    from a few micrometers to millimeters. MEMS

    provide very good scope for sensing physical,

    chemical and biomedical parameters in an

    efficient way which could be integrated with

    VLSI chips. MEMS utilize the mechanical

    properties of several elements such as

    cantilever, beams, combdrive, membrane,

    reservoirs and channels etc. In order to

    optimally utilize the properties of these micro

    mechanical elements, the mechanical behavior

    of elements in presence of parameters has to be

    study in detail. This paper presents the design

    simulations of MEMS based micro-cantilever

    made up of single crystal silicon using FEM

    (COMSOL Multiphysics).The simulations

    results into the stress and displacement

    measurements of the cantilever.

    Keywords MEMS, FEM, Microcantilevers.

    I. INTRODUCTION

    Now days, MEMS based Micro cantilevers has

    been proven as an outstanding platform for

    extremely sensitive chemical and biological

    sensors [1]. In the past decade micro cantilevers

    has become so popular due to its high sensitivityselectivity, ease of fabrication and flexibility of

    on chip circuits. Also it has become interesting

    due to convenience to calibrate, readily

    deployable into integrated electromechanical

    system and does not require external detection

    devices [2-5]. Many previous researches

    reported attempts made to improve the

    cantilever sensitivity using piezoresistive

    microcantilevers comprise of a polysilicon

    piezoresistor integrated with silicon/ silicon-

    nitride cantilever [6-7]. These researches

    provided thorough understanding and strong

    foundation on silicon- based microcantilevers.

    This paper demonstrates the finite element

    method to obtain the optimal performance of Sibased microcantilevers sensor by optimizing the

    geometrical dimension of cantilever. COMSOL

    Multiphysics, a commercial finite elementanalysis tool for MEMS was used to develop a

    finite element model of the microcantilever.

    II. DESIGN PARAMETERS

    A cantilever is a beam anchored at only one

    end. The beam carries the load to the support

    where it is resisted by moment and stress. A

    Cantilever structure consists of greater length as

    compare to its width with optimal thickness.

    Two equations are key to understand thebehavior of MEMS cantilevers. The first is

    Stoney's formula, which relates cantilever end

    deflection zto applied stress :

    (1)

    Where d and L are the cantilever beam

    thickness and length, respectively; E and are

    the elastic modulus and the Poisson ratio of the

    cantilever material. Very sensitive optical and

    capacitive methods have been developed to

    measure changes in the static deflection of

    cantilever beams. The second is the formula

    relating the cantilever spring constant to

    the cantilever dimensions and material

    constants:

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    International Journal of Exploring Emerging Trends in Engineering (IJEETE)

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    (2)

    where F is the point load applied at the end of

    the cantilever, and z is the resulting end

    deflection, E is the Youngs modulus of

    elasticity for the cantilever material and w, d, L

    are the width, thickness, and length of the

    cantilever, respectively.

    The movement of the cantilever is effected by

    its length, width, thickness and various

    properties of the material used to make the

    structure. The geometric shape, as well as the

    material used to build the cantilever

    determines the cantilever's stiffness. The

    analysis is done on the structure havingfollowing material properties which is shown

    in table 1.

    Table 1:Material properties of Silicon

    S.No. Material Properties Values

    1. Youngs Modulus 0.2GPa

    2. Density 2330

    3. Poissons ratio 0.33

    The Micro cantilever designed using FEM(COMSOL Multiphysics) as shown in Fig. 1.

    Figure 1:Microcantilever model in COMSOL

    Also Silicon dioxide, Polysilicon and Silicon

    nitride was used as Microcantilever materials

    having properties and dimensions as given in

    table 2:

    Table 2:Material properties of different materials

    S.

    No.

    Materia

    l

    Propert

    ies

    Dimen-

    sions PolyS

    i.

    1.

    Youngs

    Modulus

    Length

    60E-6,Width10E-6,Thickne

    ss 1.5E-6

    160E9 250E9 70E9

    2. Density 2320 3100 2200

    3.Poissons ratio 0.22 0.23 0.17

    III. SIMULATION RESULTS

    The simulations of micro cantilevers with

    varying the dimensions are performed.

    Simulations are also performed with use ofdifferent materials for micro cantilevers. The

    simulated models of Micro cantilevers are

    shown in fig. (2-5).

    Figure 2:Simulated model of Microcantilever1

    Figure 3:Simulated model of Microcantilever2

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    Figure 4:Simulated model of Microcantilever3

    The simulated results with varying dimensions

    of microcantilevers are shown in table.

    Table 3:Increase in resultant stress with increase in

    length of Microcantilever

    S.No. Dimensions Stress (Pa)

    1. 1000*100 50.44

    2. 800*100 44.703

    3. 600*100 31.022

    Figure 5:Simulated model of Micro cantilever 4

    Micracantilevers are also designed with

    different materials. The simulation results with

    varying materials are shown in table

    Table 4:Increase in resultant stress with material

    S.No. Material Stress (Pa)

    1. Polysilicon 34.29

    2. SiliconNitride 34.117

    3. Silicondioxide 34.727

    IV. CONCLUSION

    MEMS based Microcantilever has been

    designed with varying dimensions and with

    different materials.

    With increase in length of beams the respective

    displacement is increased. With asmaterial maximum displacement is achieved as

    compare to Polysilicon and Siliconnitride.

    V. REFERENCES

    [1] Robert Littrell et.al. (2012) Modelling and

    Characterization of cantilever based MEMS

    piezoelectric sensors and actuators, Journal of

    Microelectromechanical SystemsVol.21No.2pp.406-413.

    [2] Antoine Ferreira et.al. (2011) A Survay of

    Modeling and Control Techniques for Micro

    and Nano Electromechanical Systems, IEEE

    Transactions on Systems, man, and Cybernatics

    Part C: Applications and Reviews Vol.41 No.3

    pp.350-364.

    [3] Zabilzham et.al. (2004) dynamic Simulation

    of a resonant MEMS Magnetometer inSimulink, Sensors and Actuators A115 pp.392-

    400.

    [4] Ankit jain et.al. (2012) A Physics based

    Predictive Modeling Framework for Dielectric

    Charging and Creep in RF MEMS Capacitive

    Switches and varactors, Journal of

    Microelectromechanical Systems Vol.21 No.2

    pp. 420-430.

    [5] I.Gill et.al. (2011) Characterization andModeling of switchable stop-band filters based

    on RF MEMS and complementary Splitring

    resonators. Microelectronics Engineering 88

    pp.1-5.

    [6] Robert Littrell et.al. (2012) Modelling and

    Characterization of cantilever based MEMS

    piezoelectric sensors and actuators, Journal of

    Microelectromechanical Systems Vol.21, No.2,

    pp.406-413.

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    International Journal of Exploring Emerging Trends in Engineering (IJEETE)

    Vol. 01, Issue 01, Sept, 2014 WWW.IJEETE.COM

    All Rights Reserved 2014 IJEETE Page 24

    [7] Antoine Ferreira et.al. (2011) A Survay of

    Modeling and Control Techniques for Micro

    and Nano Electromechanical Systems, IEEE

    Transactions on Systems, man, and Cybernatics

    Part C: Applications and Reviews Vol.41 No.3

    pp.350-364.

    [8] Zabilzham et.al. (2004) dynamic Simulation

    of a resonant MEMS Magnetometer in

    Simulink, Sensors and Actuators A115 pp.392-

    400.

    [9] Ankit jain et.al. (2012) A Physics based

    Predictive Modeling Framework for Dielectric

    Charging and Creep in RF MEMS Capacitive

    Switches and varactors, Journal of

    Microelectromechanical Systems Vol.21 No.2

    pp. 420-430.

    [10] I.Gill et.al. (2011) Characterization and

    Modeling of switchable stop-band filters based

    on RF MEMS and complementary Splitring

    resonators. Microelectronics Engineering 88

    pp.1-5.

    [11] Francisc Attila Boloni et.al. (2011)

    Stochastic Modeling of the pull-in voltage in a

    MEMS beam structure. IEEE Transactions onMagnetics Vol.47 No.5 pp.974-977.

    [12] Shivappa Goravar et.al. (2010)

    Probabilistic Analysis of a comb drive actuator.

    IEEE Sensors Journal Vol.10 No.4 pp.877-882.

    [13] E. M. Abdel-Rahman et.al. (2002)

    Characterization of the mechanical behavior of

    an electrostatically actuated microbeam. Journal

    of Micromechanics and Microengineering, 12

    pp.759766.

    [14] R. C. Ackerberg. (1969) On a nonlinear

    differential equation of electrohydrodynamics.

    Proc. Roy. Soc. A, 312 pp.129140.

    [15] L. Azrar et.al. (2002) Nonlinear forced

    vibrations of plates by an asymptotic numerical

    method. Journal of Sound and Vibration,

    252(4):657674.

    AUTHORS BIBLOGRAPHY

    Anuj Goel was born in

    Haryana, India in 1983.He is

    presently pursuing Ph.D. from

    M.M. University,India and alsoworking as Assistant Professor

    in ECE Department, MMEC,

    M. M. University, Mullana, India. His research

    interests include MEMS Modelling, VLSI

    Design etc.