Analog and Interface Product Selector...
Transcript of Analog and Interface Product Selector...
Analog and Interface Product Selector GuideThermal Management • Motor Driver • Power Management Interface and Networking Peripherals • Linear and Mixed Signal CO and Smoke Detector ICs
Analog and Interface
www.microchip.com/analog
www.microchip.com/analog2
Table of Contents
Thermal ManagementTemperature Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Logic Output Temperature Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Voltage Output Temperature Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Serial Output Temperature Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Serial Output Temperature Sensors with Remote Diode Monitors . . . . . 5
Sensor Conditioning ICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Open-Loop Fan Controllers and Fan Fault Detectors . . . . . . . . . . . . . . . . . . . . . . . 6Closed-Loop Fan Controllers with SMBus/I2C Interface . . . . . . . . . . . . . . . . . . . . . 6
Motor DriversStepper Motors, DC Motors and 3-Phase BLDC Motors . . . . . . . . . . . . . . . . 7
Power ManagementVoltage References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Single Output Linear Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Multiple Output Linear Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Linear Regulators–LDO Controller and SIM Card . . . . . . . . . . . . . . . . . . . . . . . . . 15DDR Termination Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15High-Voltage Linear Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Single Output Switching Regulators (Buck) . . . . . . . . . . . . . . . . . . . . . . . . . . 16Single Output Switching Regulators (Boost) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Multiple Output Switching Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Combination Switching Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Inductorless Offline Switching Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19PWM Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Hybrid PWM Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Power Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Charge Pump DC-to-DC Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Inverting or Doubling Charge Pumps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Regulated Charge Pumps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
CPU/System Supervisors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Power MOSFET Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Low-Side Power MOSFET Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25High-Side Power MOSFET Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27Synchronous Power MOSFET Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Battery Chargers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28Hot Swap Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Power Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
USB Port Power Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30Current Limit USB Protection Switches . . . . . . . . . . . . . . . . . . . . . . . . . . 30Load Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Display and LED DriversElectroluminescent Backlight Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
16-Segment Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Offline Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Single Lamp Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Dual Lamp Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
LED Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Automotive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34General Purpose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Backlight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Linear . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Linear Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Sequential Linear . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36Camera Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
High-Voltage InterfaceDriver Arrays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Source-Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Amplifiers and MEMS Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38MOSFETS - Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Depletion-Mode N-Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38Enhancement Mode N-Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38Enhancement Mode P-Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39N-Channel (Enhancement Mode MOSFET Arrays) . . . . . . . . . . . . . . . . . . . . . 40Complimentary (Enhancement Mode MOSFET Arrays) . . . . . . . . . . . . . 40
Applications Specific . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Liquid Lens Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Complimentary MOSFET Level Translator and Driver . . . . . . . . . . . . . . . . . . . 41High-Side Current Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Fault Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Relay Driver and Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
LinearOp Amps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Zero-Drift Operational Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45Programmable Gain Amplifiers (PGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46Selectable Gain Amplifiers (SGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46Instrumentation Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46Comparators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Mixed SignalSuccessive Approximation Register (SAR) A/D Converters . . . . . . . . . . . . . . . . . . 47Delta-Sigma A/D Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48Pipelined A/D Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48Energy Metering and Power Monitoring ICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48Energy Measurement AFEs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49Current/DC Power Measurement ICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49Dual-Slope A/D Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49Binary and BCD A/D Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49Display A/D Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50Digital Potentiometers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50Frequency-to-Voltage/Voltage-to-Frequency Converters . . . . . . . . . . . . . . . . . . . . 51D/A Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Interface and NetworkingController Area Network (CAN) Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52LIN Transceiver Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53Ethernet Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Ethernet Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53USB to Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53Ethernet Transceivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54Ethernet Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Passive Access Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54Infrared Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54Serial Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55Wi-Fi® Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55Bluetooth® Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55IEEE 802 .15 .4 zigbee® RF Transceiver Products . . . . . . . . . . . . . . . . . . . . . . . . . . 56Sub-GHz Transceivers/Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56Sub-GHz Transmitters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56Sub-GHz Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57MCU Transmitters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57USB Bridge Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57USB Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
USB Hub Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57USB-C™ Power and Charging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57USB Transceivers/Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57USB Flash Media Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58USB Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Real-Time Clock/Calendar (RTCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
CO and Smoke Detector ICsPhotoelectric Smoke Detector ICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58Ionization Smoke Detector ICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58Ionization Smoke Detector Front Ends . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59CO Detectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59Piezoelectric Horn Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
UltrasoundHigh-Voltage Analog Multiplexers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59Ultrasound MOSFET Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60Ultrasound TR Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60Arbitrary Wafeform Generators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60Ultrasound Transmitters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Featured Analog Development ToolsThermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61Linear . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61Mixed Signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Note: New products to this edition are reflected in bold.
Analog and Interface Product Selector Guide 3
Analog and Interface Solutions
Are You Looking for Complete Analog and Interface Design Solutions?Microchip’s integrated analog technology, peripherals and features are engineered to meet today’s demanding design require-ments . Our broad spectrum of analog products addresses thermal management, power management, battery management, mixed-signal, linear, interface and safety and security solutions . Combined with Microchip’s Intelligent Analog microcontrollers, our extensive analog portfolio can be used in thousands of high-performance design applications in the automotive, communications (wireless), consumer, computing and industrial control markets .
Our broad portfolio of standalone analog and interface devices offers highly inte-grated solutions that combine various analog functions in space-saving packages and support a variety of bus interfaces . Many of these devices support functionality that enhances the analog features currently available on PIC® MCUs .
Want a Business Partner, Not Just a Vendor?Successful companies recognize the value of a strategic supplier relationship to help them deliver innovative products to market quickly . They trust their suppliers to furnish quality components for current design opportunities as well as technology road maps and innovative solutions to stay ahead of tomorrow’s design trends . Microchip provides low-risk product development, lower total system cost and faster time to market to more than 80,000 of these successful companies worldwide . Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality.
Are Quality and Delivery a Concern?Microchip’s quality systems are certified according to the International Organization for Standards/Technical Specification (ISO/TS)-16949:2002 requirements . This demonstrates that our quality systems meet the most stringent industry quality-management system standards, resulting in high-quality semiconductor products . Direct control over manufacturing resources allows shortened design and production cycles . By owning the wafer fabrication facilities and the majority of the test and assembly operations, and by employing proprietary statistical process control techniques, Microchip has been able to achieve and maintain high production yields .
Need Additional Support and Resources?Microchip is committed to supporting its customers by helping design engineers develop products faster and more efficiently. You can access three main service areas at www .microchip .com . The Design Support area provides a fast way to get questions an-swered. The Sample and Buy area offers evaluation samples of any Microchip device. microchipDIRECT provides 24-hour pricing, ordering, inventory and credit for convenient purchasing of all Microchip devices and development tools . This site also features on-line programming capabilities. Finally, the Training area offers opportunities to expand your knowledge with Microchip’s online web seminars and hands-on courses at our worldwide Technical Training Centers. Our seminars and training classes are designed to fit your schedule and offer an overview of many product, development tool and application topics. Visit www .microchip .com/training for class content and schedules .
Have you ever encountered a technical dilemma at a critical point in your design development and your supplier was not available to answer your questions? Microchip’s 24/7 global technical support line offers you technical support resources any time help is needed . Because some technical problems require hands-on assistance in order to be resolved quickly, Microchip has also developed a global team of field applications engineers and field sales engineers who provide local assistance.
Microchip’s Standalone Analog and Interface Portfolio
Linear Mixed SignalPower Management
Amplifiers
Comparators
Interface
CAN, CAN FD, LIN
HV Interface
USB and I/O Expanders
Ethernet
Wireless
Real-Time Clock/Calendar
DC/DC Converters
PWM Controllers
Battery Chargers
Power Modules
Power MOSFET Drivers
Power MOSFETs
Motor Drivers
System Supervisors Voltage Detectors
Power Switches
Hot Swap Power Controllers
DDR and SCSI Terminators
Display/LED Drivers
A/D Converters
Clock and Timing
Oscillators
Clock Generators
Clock and Data DistributionUltrasound
Ultrasound Products
CO and Smoke Detector ICs
Smoke Detector ICs
Piezoelectric Horn Drivers
Thermal Management
Temperature Sensors
Fan Control and Management
Current/DC Power Measurement ICs
Power Monitoring and Metering
DACs and Digital Potentiometers
Voltage References
www.microchip.com/analog4
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mab
le tri
p po
ints
8-pi
n PD
IP, 8
-pin
SO
ICTC
624
±1±5
−40
to +
125
+2.7
to +
4.5
300
Dual
outp
ut, r
esist
or-p
rogr
amm
able
trip
poin
ts8-
pin
PDIP
, 8-p
in S
OIC
MCP
9501
±1±4
−40
to +
125
+2.7
to +
5.5
40Ac
tive-
High
, Pus
h-Pu
ll Out
put,
Risin
g Te
mpe
ratu
re S
witc
h5-
pin
SOT-
23M
CP95
02±1
±4−4
0 to
+12
5+2
.7 to
+5.
540
Activ
e-Lo
w, O
pen
Drain
Out
put,
Risin
g Te
mpe
ratu
re S
witc
h5-
pin
SOT-
23M
CP95
03±1
±4−4
0 to
+12
5+2
.7 to
+5.
540
Activ
e-Hi
gh, P
ush-
Pull O
utpu
t, Fa
lling
Tem
pera
ture
Sw
itch
5-pi
n SO
T-23
MCP
9504
±1±4
−40
to +
125
+2.7
to +
5.5
40Ac
tive-
Low
, Ope
n Dr
ain O
utpu
t, Fa
lling
Tem
pera
ture
Sw
itch
5-pi
n SO
T-23
MCP
9509
±0.5
NS−4
0 to
+12
5+2
.7 to
+5.
550
Resis
tor-p
rogr
amm
able
tem
pera
ture
sw
itch
5-pi
n SO
T-23
MCP
9510
±0.5
NS−4
0 to
+12
5+2
.7 to
+5.
580
Resis
tor-p
rogr
amm
able
tem
pera
ture
sw
itch
6-pi
n SO
T-23
Volta
ge O
utpu
t Tem
pera
ture
Sen
sors
MCP
9700
±1±4
−40
to +
125
+2.3
to +
5.5
12Li
near
Act
ive T
herm
istor
® IC,
Tem
pera
ture
slo
pe: 1
0 m
V/°C
3-pi
n TO
-92,
5-p
in S
C-70
, 3-p
in S
OT-
23M
CP97
01±1
±4−4
0 to
+12
5+3
.1 to
+5.
512
Linea
r Act
ive T
herm
istor
IC, T
empe
ratu
re s
lope
: 19.
53 m
V/°C
, cro
ss to
MAX
6612
3-pi
n TO
-92,
5-p
in S
C-70
, 3-p
in S
OT-
23M
CP97
00A
±1±2
−40
to +
125
+2.3
to +
5.5
12Li
near
Act
ive T
herm
istor
IC, T
empe
ratu
re s
lope
: 10
mV/
°C3-
pin
TO-9
2, 5
-pin
SC-
70, 3
-pin
SO
T-23
MCP
9701
A±1
±2−4
0 to
+12
5+3
.1 to
+5.
512
Linea
r Act
ive T
herm
istor
IC, T
empe
ratu
re s
lope
: 19.
53 m
V/°C
, cro
ss to
MAX
6612
3-pi
n TO
-92,
5-p
in S
C-70
, 3-p
in S
OT-
23TC
1046
±0.5
±2−4
0 to
+12
5+2
.7 to
+4.
460
High
pre
cisio
n te
mpe
ratu
re-to
-vol
tage
con
verte
r, 6.
25 m
V/°C
3-pi
n SO
T-23
BTC
1047
±0.5
±2−4
0 to
+12
5+2
.7 to
+4.
460
High
pre
cisio
n te
mpe
ratu
re-to
-vol
tage
con
verte
r, 10
mV/
°C3-
pin
SOT-
23B
TC10
47A
±0.5
±2−4
0 to
+12
5+2
.5 to
+5.
560
High
pre
cisio
n te
mpe
ratu
re-to
-vol
tage
con
verte
r, 10
mV/
°C3-
pin
SOT-
23B
Seria
l Out
put T
empe
ratu
re S
enso
rs
MCP
9800
±0.5
±1−5
5 to
+12
5+2
.7 to
+5.
540
0SM
Bus/
I2 C c
ompa
tible
inte
rface
, 0.0
625°
C to
0.5
°C a
dj. r
esol
utio
n, P
ower
-sav
ing
one-
shot
tem
pera
ture
m
easu
rem
ent
5-pi
n SO
T-23
MCP
9801
±0.5
±1−5
5 to
+12
5+2
.7 to
+5.
540
0SM
Bus/
I2 C c
ompa
tible
inte
rface
, 0.0
625°
C to
0.5
°C a
dj. r
esol
utio
n, P
ower
-sav
ing
one-
shot
tem
pera
ture
m
easu
rem
ent,
mul
ti-dr
op c
apab
ility
8-pi
n M
SOP,
8-p
in S
OIC
MCP
9802
±0.5
±1−5
5 to
+12
5+2
.7 to
+5.
540
0SM
Bus/
I2 C c
ompa
tible
inte
rface
with
tim
e ou
t, 0.
0625
°C to
0.5
°C a
dj. r
esol
utio
n,
Pow
er-s
avin
g on
e-sh
ot te
mpe
ratu
re m
easu
rem
ent
5-pi
n SO
T-23
MCP
9803
±0.5
±1−5
5 to
+12
5+2
.7 to
+5.
540
0SM
Bus/
I2 C c
ompa
tible
inte
rface
with
tim
e ou
t, 0.
0625
°C to
0.5
°C a
dj. r
esol
utio
n,
Pow
er-s
avin
g on
e-sh
ot te
mpe
ratu
re m
easu
rem
ent,
Mul
ti-dr
op c
apab
ility
8-pi
n M
SOP,
8-p
in S
OIC
MCP
9804
±0.2
5±1
−40
to +
125
+2.7
to +
5.5
400
User
pro
gram
mab
le te
mpe
ratu
re lim
its w
ith a
lert o
utpu
t, 1°
C te
mp.
acc
urac
y fro
m −
40°C
to +
125°
C8-
pin
MSO
P, 8
-pin
2 ×
3 D
FN
MCP
9805
±0.5
±1(2
)−2
0 to
+12
5+3
.0 to
+3.
640
0JE
DEC-
com
patib
le re
gist
er s
et, S
MBu
s/I2 C
com
patib
le in
terfa
ce, P
rogr
amm
able,
Shu
t-dow
n m
odes
and
EV
ENT
outp
ut8-
pin
TSSO
P, 8
-pin
2 ×
3 D
FN
MCP
9808
±0.2
5±0
.5−4
0 to
+12
5+2
.7 to
+5.
540
00.
5°C
tem
pera
ture
acc
urac
y fro
m −
10°C
to +
100°
C8-
pin
2 ×
3 DF
N, 8
-pin
MSO
PM
CP98
43±0
.5±1
(2)
−20
to +
125
+3.0
to +
3.6
500
Com
plian
t to
JEDE
C TS
E300
0B3
spec
ificat
ion
8-pi
n TS
SOP,
8-p
in 2
× 3
DFN,
8-p
in 2
× 3
TDFN
MCP
9824
3±1
±3−4
0 to
+12
5+3
.0 to
+3.
650
0Se
rial o
utpu
t tem
pera
ture
sen
sor w
ith in
tegr
ated
EEP
ROM
(TSE
2002
B3)
8-pi
n TS
SOP,
8-p
in 2
× 3
DFN,
8-p
in 2
× 3
TDFN
MCP
9824
4±0
.5±3
−40
to +
125
+1.7
to +
3.6
500
Seria
l out
put t
empe
ratu
re s
enso
r com
plian
t to
TSE2
004a
8-pi
n 2
× 3
TDFN
MCP
9844
±0.5
±3−4
0 to
+12
5+1
.7 to
+3.
650
0Se
rial o
utpu
t tem
pera
ture
sen
sor w
ith in
tegr
ated
EEP
ROM
(TSE
2004
a)8-
pin
2 ×
3 TD
FNTC
77±0
.5±1
−55
to +
125
+2.7
to +
5.5
400
SPI-c
ompa
tible
inte
rface
, 0.0
625°
C te
mpe
ratu
re re
solu
tion
5-pi
n SO
T-23
A, 8
-pin
SO
ICTC
72±0
.5±1
−55
to +
125
+2.6
5 to
+5.
540
0SP
I-com
patib
le int
erfa
ce, P
ower
-sav
ing o
ne-s
hot t
empe
ratu
re m
easu
rem
ent,
0.25
°C te
mpe
ratu
re re
solut
ion8-
pin
MSO
P, 8
-pin
3 ×
3 D
FNTC
74±0
.5±2
−40
to +
125
+2.7
to +
5.5
350
SMBu
s/I2 C
-com
patib
le in
terfa
ce, 1
°C te
mpe
ratu
re re
solu
tion
5-pi
n SO
T-23
A, 5
-pin
TO
-220
TCN7
5A±0
.5±2
−40
to +
125
+2.7
to +
5.5
500
SMBu
s/I2 C
-com
patib
le in
terfa
ce, p
ower
-sav
ing
one-
shot
tem
pera
ture
mea
sure
men
t, m
ulti-
drop
cap
abilit
y,
0.06
25°C
to 0
.5°C
adj
usta
ble
tem
pera
ture
reso
lutio
n8-
pin
MSO
P, 8
-pin
SO
IC
EMC1
001
±0.5
±1.5
−25
to +
125
3.0–
3.6
501.
5°C
SMBu
s/I2 C
am
bien
t with
two
alerts
6-pi
n SO
T
AT30
TS74
±1±2
−55
to +
125
+1.7
to +
5.5
125
SMBu
s/I2 C
com
patib
le in
terfa
ce, 0
.062
5°C
to 0
.5°C
adj
. res
olut
ion,
pow
er-s
avin
g on
e-sh
ot te
mpe
ratu
re
mea
sure
men
t8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 3
UDF
N,
4-ba
ll WLC
SP, 5
-bal
l WLC
SP
AT30
TS75
A±0
.5±1
−55
to +
125
+1.7
to +
5.5
125
SMBu
s/I2 C
com
patib
le in
terfa
ce, 0
.062
5°C
to 0
.5°C
adj
. res
olut
ion,
pow
er-s
avin
g on
e-sh
ot te
mpe
ratu
re
mea
sure
men
t8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 3
UDF
N
AT30
TS75
0A±0
.5±1
−55
to +
125
+1.7
to +
5.5
125
SMBu
s/I2 C
com
patib
le int
erfa
ce, n
onvo
ltatile
regis
ters
to re
tain
user
-con
figur
ed o
r pre
-defi
ned
powe
r-up
defa
ults
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
2 ×
3 U
DFN
Not
e 1:
The
se d
evice
s us
e an
ext
erna
l tem
pera
ture
sen
sor.
Accu
racy
of t
he to
tal s
olut
ion
is a
func
tion
of th
e ac
cura
cy o
f the
ext
erna
l sen
sor.
2: M
axim
um a
ccur
acy
mea
sure
d at
85°
C.
Analog and Interface Product Selector Guide 5
THER
MAL
MAN
AGEM
ENT:
Tem
pera
ture
Sen
sors
(Con
tinue
d)
Part
#Ty
pica
l Ac
cura
cy
(°C)
Max
imum
Ac
cura
cy
@ 2
5°C
(°C
)
Max
imum
Te
mpe
ratu
re
Rang
e (°C
)Vc
c Ra
nge
(V)
Max
imum
Su
pply
C
urre
nt (µ
A)Fe
atur
esPa
ckag
es
Seria
l Out
put T
empe
ratu
re S
enso
rs (C
ontin
ued)
AT30
TSE7
52A
±0.5
±1−5
5 to
+12
5+1
.7 to
+5.
512
5SM
Bus/
I2 C c
ompa
tible
inte
rface
, non
volta
tile re
gist
ers
to re
tain
use
r-con
figur
ed o
r pre
-defi
ned
pow
er-u
p de
faul
ts,
inte
grat
ed 2
KB
seria
l EEP
ROM
8-pi
n SO
IC, 8
-pin
MSO
P,
8-pi
n 2
× 3
UDFN
AT30
TSE7
54A
±0.5
±1−5
5 to
+12
5+1
.7 to
+5.
512
5SM
Bus/
I2 C c
ompa
tible
inte
rface
, non
volta
tile re
gist
ers
to re
tain
use
r-con
figur
ed o
r pre
-defi
ned
pow
er-u
p de
faul
ts,
inte
grat
ed 4
KB
seria
l EEP
ROM
8-pi
n SO
IC, 8
-pin
MSO
P,
8-pi
n 2
× 3
UDFN
AT30
TSE7
58A
±0.5
±1−5
5 to
+12
5+1
.7 to
+5.
512
5SM
Bus/
I2 C c
ompa
tible
inte
rface
, non
volta
tile re
gist
ers
to re
tain
use
r-con
figur
ed o
r pre
-defi
ned
pow
er-u
p de
faul
ts,
inte
grat
ed 8
KB
seria
l EEP
ROM
8-pi
n SO
IC, 8
-pin
MSO
P,
8-pi
n 2
× 3
UDFN
AT30
TSE0
02B
±1±3
−40
to +
125
+2.7
to +
3.6
500
JEDE
C (J
C42.
4) S
O-D
IMM
SPD
+ T
S co
mpl
iant,
SMBu
s/I2 C
com
patib
le in
terfa
ce, i
nteg
rate
d 2
KB s
erial
EEP
ROM
8-pi
n 2
× 3
UDFN
AT30
TSE0
04A
±0.5
±3−4
0 to
+12
5+1
.7 to
+3.
650
0JE
DEC
JC42
.4 (T
SE20
04av
) DIM
M S
PD +
TS
com
plian
t, SM
Bus/
I2 C c
ompa
tible
inter
face
, inte
grat
ed 4
KB
seria
l EEP
ROM
8-pi
n 2
× 3
UDFN
THER
MAL
MAN
AGEM
ENT
PRO
DU
CTS
: Te
mpe
ratu
re S
enso
rs (C
ontin
ued)
Part
##
of R
emot
e Te
mp.
Se
nsor
s
Typ.
Accu
racy
(°C
)
Max
imum
Ac
cura
cy
@ 2
5°C
(°C
)
Max
imum
Te
mp.
Ran
ge
(°C)
Ambi
ent
Tem
p.
Sens
orAl
ert/
THER
MH
ardw
are
Shut
dow
nVc
c Ra
nge
(V)
Typ.
Supp
ly
Cur
rent
(µ
A)D
escr
iptio
n an
d Ad
ditio
nal F
eatu
res
Pack
ages
Seria
l Out
put T
empe
ratu
re S
enso
rs w
ith R
emot
e D
iode
Mon
itors
MIC
184
1±1
.0±2
.0−5
5 to
+12
51
1–
2.7–
5.5
340
Loca
l/Rem
ote
Ther
mal
Supe
rviso
r8-
pin
SOIC
, 8-p
in M
SOP
MIC
280
1±1
.0±2
.0−5
5 to
+12
51
1–
3.0–
3.6
230
Prec
ision
Itty
Bitty
® The
rmal
Supe
rviso
r6-
pin
SOT
MIC
281
1±1
.0±3
.0−5
5 to
+12
50
1–
3.0–
3.6
230
Low
-Cos
t Itty
Bitty
The
rmal
Sens
or6-
pin
SOT
MIC
284
1±1
.0±2
.0−5
5 to
+12
51
2–
2.7–
5.5
350
Two-
Zone
The
rmal
Supe
rviso
r with
CRI
T O
utpu
t8-
pin
SOIC
, 8-p
in M
SOP
MIC
384
2±1
.0±2
.0−5
5 to
+12
51
1–
2.7–
5.5
350
Thre
e-Zo
ne T
herm
al Su
perv
isor
8-pi
n SO
IC, 8
-pin
MSO
PM
CP99
021
±0.2
5±1
.0−4
0 to
+12
51
2–
3.0–
3.6
450
Low
er T
empe
ratu
re D
ual T
empe
ratu
re S
enso
r8-
pin
WDF
NM
CP99
032
±0.2
5±1
.0−4
0 to
+12
51
2–
3.0–
3.6
450
Low
er T
empe
ratu
re T
riple
Tem
pera
ture
Sen
sor
10-p
in 3
× 3
VDF
NM
CP99
043
±0.2
5±1
.0−4
0 to
+12
51
2–
3.0–
3.6
450
Low
er T
empe
ratu
re Q
uad
Tem
pera
ture
Sen
sor
10-p
in 3
× 3
VDF
NEM
C103
32
±1.0
±3−4
0 to
+12
51
2–
3.0–
3.6
50Tr
iple
SMBu
s/I2 C
Sen
sor w
ith R
esist
ance
Erro
r Cor
rect
ion
(REC
)8-
pin
MSO
PEM
C104
32
±0.5
±1.0
−40
to +
125
1–
–3.
0–3.
610
5Tr
iple
SMBu
s/I2 C
Sen
sor w
ith R
EC, B
eta
Com
pens
atio
n an
d Ho
tter o
f Tw
o Zo
nes
8-pi
n M
SOP
EMC1
046
5±0
.25
±1.0
−40
to +
125
1–
–3.
0–3.
639
5Se
xtup
le SM
Bus/
I2 C S
enso
r with
REC
, Bet
a Co
mpe
nsat
ion
and
Hotte
st o
f The
rmal
Zone
s10
-pin
MSO
PEM
C104
76
±0.2
5±1
.0−4
0 to
+12
51
––
3.0–
3.6
395
Sept
uple
SMBu
s/I2 C
Sen
sor w
ith R
EC, B
eta
Com
pens
atio
n an
d Ho
ttest
of T
herm
al Zo
nes
10-p
in M
SOP
EMC1
053
2±0
.5±1
.0−4
0 to
+12
51
––
3.0–
3.6
105
Trip
le SM
Bus/
I2 C S
enso
r with
REC
and
Hot
ter o
f Two
Zon
es8-
pin
MSO
PEM
C106
32
±0.5
±1.0
−40
to +
125
1–
3.0–
3.6
105
Trip
le SM
Bus/
I2 C S
enso
r with
Hot
ter o
f Tw
o Zo
nes
8-pi
n M
SOP
EMC1
072
1±0
.25
±1.0
−40
to +
125
12
–3.
0–3.
643
0Du
al SM
Bus/
I2 C S
enso
r with
Sele
ctab
le Ad
dres
s8-
pin
MSO
PEM
C107
32
±0.2
5±1
.0−4
0 to
+12
51
2–
3.0–
3.6
430
Trip
le SM
Bus/
I2 C S
enso
r with
Sele
ctab
le Ad
dres
s10
-pin
MSO
PEM
C107
43
±0.2
5±1
.0−4
0 to
+12
51
2–
3.0–
3.6
430
Qua
d SM
Bus/
I2 C S
enso
r with
Sele
ctab
le Ad
dres
s10
-pin
MSO
PEM
C118
21
±0.2
5±1
.0−4
0 to
+12
51
2–
3.0–
3.6
200
Dual
Chan
nel 1
.8V
SMBu
s/I2 C
Tem
pera
ture
Sen
sor w
ith R
EC, B
eta
Com
pens
atio
n8-
pin
TDFN
, 8-p
in D
FNEM
C118
32
±0.2
5±1
.0−4
0 to
+12
51
2–
3.0–
3.6
200
Trip
le Ch
anne
l 1.8
V SM
Bus/
I2 C T
empe
ratu
re S
enso
r with
REC
, Bet
a Co
mpe
nsat
ion
10-p
in D
FNEM
C118
43
±0.2
5±1
.0−4
0 to
+12
51
2–
3.0–
3.6
200
Qua
d Ch
anne
l 1.8
V SM
Bus/
I2 C T
empe
ratu
re S
enso
r with
REC
, Bet
a Co
mpe
nsat
ion
10-p
in D
FN
EMC1
186
1±0
.25
±1.0
−40
to +
125
11
13.
0–3.
620
0Du
al Ch
anne
l 1.8
V SM
Bus/
I2 C S
enso
r with
REC
, Bet
a Co
mpe
nsat
ion
and
Resis
tor-S
etta
ble
Hard
war
e Th
erm
al Sh
utdo
wn
8-pi
n TD
FN
EMC1
187
2±0
.25
±1.0
−40
to +
125
11
13.
0–3.
620
0Tr
iple
Chan
nel 1
.8V
SMBu
s/I2 C
Sen
sor w
ith R
EC, B
eta
Com
pens
atio
n an
d Re
sisto
r-Se
ttabl
e Ha
rdw
are
Ther
mal
Shut
dow
n10
-pin
DFN
EMC1
188
3±0
.25
±1.0
−40
to +
125
11
13.
0–3.
620
0Q
uad
Chan
nel 1
.8V
SMBu
s/I2 C
Sen
sor w
ith R
EC, B
eta
Com
pens
atio
n an
d Re
sisto
r-Se
ttabl
e Ha
rdw
are
Ther
mal
Shut
dow
n10
-pin
DFN
EMC1
412
1±0
.25
±1.0
−40
to +
125
12
–3.
0–3.
643
0Du
al SM
Bus/
I2 C S
enso
r with
REC
, Bet
a Co
mpe
nsat
ion
and
Selec
tabl
e Ad
dres
s8-
pin
TDFN
, 8-p
in M
SOP
EMC1
413
2±0
.25
±1.0
−40
to +
125
12
–3.
0–3.
643
0Tr
iple
SMBu
s/I2 C
Sen
sor w
ith R
EC, B
eta
Com
pens
atio
n an
d Se
lecta
ble
Addr
ess
10-p
in D
FN, 1
0-pi
n M
SOP
EMC1
414
3±0
.25
±1.0
−40
to +
125
12
–3.
0–3.
643
0Q
uad
SMBu
s/I2 C
Sen
sor w
ith R
EC, B
eta
Com
pens
atio
n an
d Se
lecta
ble
Addr
ess
10-p
in M
SOP,
10-
pin
DFN
EMC1
422
1±0
.25
±1.0
−40
to +
125
11
13.
0–3.
643
0Du
al SM
Bus/
I2 C S
enso
r with
REC
, Bet
a Co
mpe
nsat
ion
and
Resis
tor-S
etta
ble
Hard
war
e Th
erm
al Sh
utdo
wn
8-pi
n M
SOP
EMC1
423
2±0
.25
±1.0
−40
to +
125
11
13.
0–3.
643
0Tr
iple
SMBu
s/I2 C
Sen
sor w
ith R
EC, B
eta
Com
pens
atio
n an
d Re
sisto
r-Set
tabl
e Ha
rdw
are
Ther
mal
Shut
dow
n10
-pin
MSO
P
EMC1
424
3±0
.25
±1.0
−40
to +
125
11
13.
0–3.
643
0Q
uad
SMBu
s/I2 C
Sen
sor w
ith R
EC, B
eta
Com
pens
atio
n an
d Re
sisto
r-Set
tabl
e Ha
rdw
are
Ther
mal
Shut
dow
n10
-pin
MSO
P
EMC1
428
7±0
.25
±1.0
−40
to +
125
11
13.
0–3.
645
0O
ctal
SMBu
s/I2 C
Sen
sor R
EC, B
eta
Com
pens
atio
n an
d Re
sisto
r-Set
tabl
e Ha
rdw
are
Ther
mal
Shut
dow
n an
d Ho
ttest
of T
herm
al Zo
nes
16-p
in Q
FN
EMC1
438
7±0
.25
±1.0
−40
to +
125
11
13.
0–3.
645
0O
ctal
SMBu
s/I2 C
Sen
sor R
EC, B
eta
Com
pens
atio
n an
d Re
sisto
r-Set
tabl
e Ha
rdw
are
Ther
mal
Shut
dow
n an
d Ho
ttest
of T
herm
al Zo
nes
16-p
in Q
FN
Not
e 1:
The
se d
evice
s us
e an
ext
erna
l tem
pera
ture
sen
sor.
Accu
racy
of t
he to
tal s
olut
ion
is a
func
tion
of th
e ac
cura
cy o
f the
ext
erna
l sen
sor.
2: M
axim
um a
ccur
acy
mea
sure
d at
85°
C.
3: T
CN75
idle
curre
nt is
250
mA.
Thi
s de
vice
also
has
a So
ftwar
e Sh
utdo
wn
mod
e th
at re
duce
s su
pply
curre
nt to
< 1
mA.
www.microchip.com/analog6
THER
MAL
MAN
AGEM
ENT:
Sen
sor C
ondi
tioni
ng IC
s
Part
#Ty
pica
l Tc
Accu
racy
Typi
cal T
h
Accu
racy
Max
. Tem
p.
Rang
e (°C
)Vc
c Ra
nge
(V)
Max
. Sup
ply
Cur
rent
(µA)
Feat
ures
Pack
ages
MCP
9600
11
−40
to +
125
+2.7
to +
5.5
500
Fully
inte
grat
ed th
erm
ocou
ple
EMF
to te
mpe
ratu
re c
onve
rter.
Supp
orts
ther
moc
oupl
e K,
J, T
, N, S
, E B
and
R5
× 5
MQ
FN
THER
MAL
MAN
AGEM
ENT:
Ope
n-Lo
op F
an C
ontro
llers
and
Fan
Fau
lt D
etec
tors
Part
#D
escr
iptio
n#
of
Tem
p.
Mon
itors
Typi
cal
Accu
racy
(°C
)
Max
imum
Ac
cura
cy
@ 2
5°C
(°C
)
Max
imum
Te
mpe
ratu
re
Rang
e (°C
)Vc
c Ra
nge
(V)
Max
imum
Su
pply
C
urre
nt (µ
A)Fe
atur
esPa
ckag
es
EMC2
101
Sing
le SM
Bus
I2 C F
an
Man
ager
2±0
.5±1
−40
to +
125
+3.0
to +
3.6
1,00
0Fa
n Co
ntro
ller w
ith h
igh-
frequ
ency
PW
M d
river
, pro
gram
mab
le fa
n sp
eed
tabl
e an
d ale
rt8-
pin
MSO
P, 8
-pin
SO
IC
EMC2
300
Trip
le SM
Bus
I2 C F
an
Man
ager
3±0
.25
±3−0
to +
70+3
.0 to
+3.
63,
000
Fan
Cont
rolle
r with
hig
h-fre
quen
cy P
WM
driv
er, p
rogr
amm
able
fan
spee
d ta
ble,
vol
tage
mon
itors
, aler
t16
-pin
SSO
P
EMC6
D103
STr
iple
SMBu
s I2 C
Fan
M
anag
er3
±0.2
5±3
−0 to
+70
+3.0
to +
3.6
3,00
0Fa
n Co
ntro
ller w
ith h
igh-
frequ
ency
PW
M d
river
, pro
gram
mab
le fa
n sp
eed
tabl
e, v
olta
ge m
onito
rs, a
lert
24-p
in S
SOP1
TC64
2Fa
n M
anag
er1
Note
1No
te 1
−40
to +
85+3
.0 to
+5.
51,
000
FanS
ense
™ F
an M
onito
r, M
inim
um fa
n sp
eed
cont
rol
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
PTC
642B
Fan
Man
ager
1No
te 1
Note
1−4
0 to
+85
+3.0
to +
5.5
400
FanS
ense
Fan
Mon
itor,
Min
imum
fan
spee
d co
ntro
l, Fa
n au
to-re
star
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
TC64
6Fa
n M
anag
er1
Note
1No
te 1
−40
to +
85+3
.0 to
+5.
51,
000
FanS
ense
Fan
Mon
itor,
Auto
-shu
tdow
n8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
TC64
6BFa
n M
anag
er1
Note
1No
te 1
−40
to +
85+3
.0 to
+5.
540
0Fa
nSen
se F
an M
onito
r, Au
to-s
hutd
own,
Fan
aut
o-re
star
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
TC64
7Fa
n M
anag
er1
Note
1No
te 1
−40
to +
85+3
.0 to
+5.
51,
000
FanS
ense
Fan
Mon
itor,
Min
imum
fan
spee
d co
ntro
l8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
TC64
7BFa
n M
anag
er1
Note
1No
te 1
−40
to +
85+3
.0 to
+5.
540
0Fa
nSen
se F
an M
onito
r, M
inim
um fa
n sp
eed
cont
rol,
Fan
auto
-rest
art
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
PTC
648
Fan
Man
ager
1No
te 1
Note
1−4
0 to
+85
+3.0
to +
5.5
1,00
0O
verte
mpe
ratu
re a
lert,
Auto
-shu
tdow
n8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
TC64
8BFa
n M
anag
er1
Note
1No
te 1
−40
to +
85+3
.0 to
+5.
540
0O
verte
mpe
ratu
re a
lert,
Auto
-shu
tdow
n, F
an a
uto-
rest
art
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
PTC
649
Fan
Man
ager
1No
te 1
Note
1−4
0 to
+85
+3.0
to +
5.5
1,00
0Fa
nSen
se F
an M
onito
r, Au
to-s
hutd
own
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
PTC
649B
Fan
Man
ager
1No
te 1
Note
1−4
0 to
+85
+3.0
to +
5.5
400
FanS
ense
Fan
Mon
itor,
Auto
-shu
tdow
n, F
an a
uto-
rest
art
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
PTC
650
Fan
Man
ager
1±1
±3−4
0 to
+12
5+2
.8 to
+5.
590
Ove
rtem
pera
ture
aler
t8-
pin
MSO
PTC
651
Fan
Man
ager
1±1
±3−4
0 to
+12
5+2
.8 to
+5.
590
Ove
rtem
pera
ture
aler
t, Au
to-s
hutd
own
8-pi
n M
SOP
TC65
2Fa
n M
anag
er1
±1±3
−40
to +
125
+2.8
to +
5.5
90Fa
nSen
se F
an M
onito
r, O
verte
mpe
ratu
re a
lert
8-pi
n M
SOP
TC65
3Fa
n M
anag
er1
±1±3
−40
to +
125
+2.8
to +
5.5
90Fa
nSen
se F
an M
onito
r, O
verte
mpe
ratu
re a
lert,
Auto
-shu
tdow
n8-
pin
MSO
PTC
654
Dual
SMBu
s Fa
n M
anag
er1
Note
1No
te 1
−40
to +
85+3
.0 to
+5.
532
0Fa
nSen
se F
an M
onito
r, RP
M d
ata
10-p
in M
SOP
TC65
5Du
al SM
Bus
Fan
Man
ager
1No
te 1
Note
1−4
0 to
+85
+3.0
to +
5.5
320
FanS
ense
Fan
Mon
itor,
RPM
dat
a, O
verte
mpe
ratu
re a
lert
10-p
in M
SOP
TC66
4Si
ngle
SMBu
s Fa
n M
anag
er1
Note
1No
te 1
−40
to +
85+3
.0 to
+5.
532
0Fa
nSen
se F
an M
onito
r, RP
M d
ata
10-p
in M
SOP
TC66
5Si
ngle
SMBu
s Fa
n M
anag
er1
Note
1No
te 1
−40
to +
85+3
.0 to
+5.
532
0Fa
nSen
se F
an M
onito
r, RP
M d
ata,
Ove
rtem
pera
ture
aler
t10
-pin
MSO
PTC
670
Pred
ictive
Fan
Fau
lt De
tect
or1
N/A
N/A
−40
to +
85+3
.0 to
+5.
515
0Fa
nSen
se F
an M
onito
r, Pr
ogra
mm
able
thre
shol
d6-
pin
SOT-
23N
ote
1: T
hese
dev
ices
use
an e
xter
nal t
empe
ratu
re s
enso
r. Ac
cura
cy o
f the
tota
l sol
utio
n is
a fu
nctio
n of
the
accu
racy
of t
he e
xter
nal s
enso
r.
THER
MAL
MAN
AGEM
ENT:
Clo
sed-
Loop
Fan
Con
trolle
rs w
ith S
MBu
s/I2 C
Inte
rface
Part
##
of F
an
Driv
ers
PWM
/Li
near
C
ontro
l
# of
Rem
ote
Tem
p.
Mon
itors
Ambi
ent
Tem
p.
Sens
or
Typi
cal
Accu
racy
(°C
)
Max
imum
Ac
cura
cy
@ 2
5°C
(°C
)
Max
imum
Te
mpe
ratu
re
Rang
e (°C
)Vc
c Ra
nge
(V)
SMBu
s Al
ert
Syst
em
Shut
dow
nVo
ltage
M
onito
rsD
escr
iptio
nPa
ckag
es
EMC2
112
1Li
near
31
±0.2
5±1
.00
to +
85+3
.3 a
nd +
5Ye
sYe
sNo
RPM
-Bas
ed F
an C
ontro
ller w
ith H
ardw
are
Ther
mal
Shut
dow
n20
-pin
QFN
EMC2
103-
11
PWM
11
±0.5
±1.0
−40
to +
125
+3.0
to +
3.6
Yes
Yes
NoRP
M-B
ased
Fan
Con
trolle
r with
Har
dwar
e Th
erm
al Sh
utdo
wn
12-p
in Q
FNEM
C210
3-2
1PW
M3
1±0
.5±1
.0−4
0 to
+12
5+3
.0 to
+3.
6Ye
sYe
sNo
RPM
-Bas
ed F
an C
ontro
ller w
ith H
ardw
are
Ther
mal
Shut
dow
n16
-pin
QFN
EMC2
103-
41
PWM
31
±0.5
±1.0
−40
to +
125
+3.0
to +
3.6
Yes
Yes
NoRP
M-B
ased
Fan
Con
trolle
r with
Har
dwar
e Th
erm
al Sh
utdo
wn
and
EEPR
OM
load
able
16-p
in Q
FN
EMC2
104
2PW
M4
1±0
.25
±1.0
−40
to +
85+3
.0 to
+3.
6Ye
sYe
sYe
sDu
al RP
M-B
ased
PW
M F
an C
ontro
ller w
ith H
ardw
are
Ther
mal
Shut
dow
n20
-pin
QFN
EMC2
105
1Li
near
41
±0.2
5±1
.0−4
0 to
+85
+3.3
and
+5.
0Ye
sYe
sYe
sRP
M-B
ased
Hig
h-Si
de F
an C
ontro
ller w
ith H
ardw
are
Ther
mal
Shut
dow
n20
-pin
QFN
EMC2
106
2PW
M &
Li
near
41
±0.2
5±1
.0−4
0 to
+85
+3.3
and
+5.
0Ye
sYe
sYe
sRP
M-B
ased
Hig
h Si
de F
an C
ontro
ller w
ith H
ardw
are
Ther
mal
Shut
dow
n28
-pin
QFN
EMC2
113
1PW
M3
1±0
.5±1
.0−4
0 to
+12
5+3
.0 to
+3.
6Ye
sYe
sNo
Sing
le RP
M-B
ased
Fan
Con
trolle
r with
Mult
iple
Tem
pera
ture
Zon
es
and
Hard
ware
The
rmal
Shut
down
16-p
in Q
FN
EMC2
301
1PW
MN/
AN/
AN/
AN/
A−4
0 to
+12
5+3
.0 to
+3.
6Ye
sNo
N/A
Sing
le RP
M-B
ased
PW
M F
an S
peed
Con
trolle
r8-
pin
MSO
PEM
C230
22
PWM
N/A
N/A
N/A
N/A
−40
to +
125
+3.0
to +
3.6
Yes
NoN/
ADu
al RP
M-B
ased
PW
M F
an S
peed
Con
trolle
r10
-pin
MSO
PEM
C230
33
PWM
N/A
N/A
N/A
N/A
−40
to +
125
+3.0
to +
3.6
Yes
NoN/
ATr
iple
RPM
-Bas
ed P
WM
Fan
Spe
ed C
ontro
ller
12-p
in Q
FNEM
C230
55
PWM
N/A
N/A
N/A
N/A
−40
to +
125
+3.0
to +
3.6
Yes
NoN/
APe
nta
RPM
-Bas
ed P
WM
Fan
Spe
ed C
ontro
ller
16-p
in Q
FN
Analog and Interface Product Selector Guide 7
MO
TOR
DR
IVER
SM
OTO
R D
RIVE
RS:
Step
per M
otor
s, D
C M
otor
s an
d 3-
Phas
e BL
DC
Mot
ors
Part
#M
otor
Ty
peIn
put
Volta
ge
Rang
e (V
)
Inte
rnal
/Ex
tern
al
FETs
Out
put
Cur
rent
(m
A)C
ontro
l Sch
eme
Mot
or
Spee
d O
utpu
tPr
otec
tions
Tem
pera
ture
O
pera
ting
Ra
nge
(°C)
Feat
ures
Pack
ages
ATA6
826C
DC M
otor
7 to
40
Inte
rnal
1000
SPI
N/A
Shor
t Circ
uit,
Ove
rtem
pera
ture
, Po
wer
Sup
ply
Fail
−40
to +
125
3 ha
lf br
idge
out
puts
, No
shoo
t-thr
ough
, Ver
y lo
w
quies
cent
cur
rent
<2
µASO
14
ATA6
831C
DC M
otor
7 to
40
Inte
rnal
1000
SPI
N/A
Shor
t Circ
uit,
Ove
rtem
pera
ture
, Po
wer
Sup
ply
Fail
−40
to +
125
3 ha
lf br
idge
out
puts
, No
shoo
t-thr
ough
, Ver
y lo
w
quies
cent
cur
rent
<2
µA, P
WM
inpu
t18
-pin
4 ×
4 Q
FN
ATA6
832C
DC M
otor
7 to
40
Inte
rnal
1000
SPI
N/A
Shor
t Circ
uit,
Ove
rtem
pera
ture
, Po
wer
Sup
ply
Fail
−40
to +
150
3 ha
lf br
idge
out
puts
, No
shoo
t-thr
ough
, Ver
y lo
w
quies
cent
cur
rent
<2
µA, P
WM
inpu
t18
-pin
4 ×
4 Q
FN
ATA6
836C
DC
Mot
or7
to 4
0In
tern
al65
0SP
IN
/ASh
ort C
ircui
t, O
vert
empe
ratu
re,
Pow
er S
uppl
y Fa
il−4
0 to
+12
56
half
brid
ge o
utpu
ts, N
o sh
oot-
thro
ugh,
Ver
y lo
w
quie
scen
t cur
rent
<2
µASO
28
ATA6
838C
DC M
otor
7 to
40
Inte
rnal
950
SPI
N/A
Shor
t Circ
uit,
Ove
rtem
pera
ture
, Po
wer
Sup
ply
Fail
−40
to +
125
6 ha
lf br
idge
out
puts
, No
shoo
t-thr
ough
, Ver
y lo
w
quies
cent
cur
rent
<2
µA24
-pin
5 ×
5 Q
FN
ATA6
823C
DC M
otor
7 to
20
Exte
rnal
100
PWM
, DIR
N/A
Shor
t Circ
uit,
Ove
rtem
pera
ture
, Ove
r/Un
der V
olta
ge,
Char
gepu
mp
Fail
−40
to +
125
Dead
tim
e ad
just,
Char
ge p
ump
supp
ly fo
r ext
erna
l ba
ttery
reve
rse
prot
ectio
n NM
OS,
LDO
3V3
/5V,
Wind
ow
Wat
chdo
g, L
IN T
RX, S
leep
mod
e <4
5µA
32-p
in 7
× 7
QFN
ATA6
824C
DC M
otor
7 to
20
Exte
rnal
100
PWM
, DIR
N/A
Shor
t Circ
uit,
Ove
rtem
pera
ture
, Ove
r/Un
der V
olta
ge,
Char
gepu
mp
Fail
−40
to +
150
Dead
tim
e ad
just
, Cha
rge
pum
p su
pply
for e
xter
nal
batte
ry re
vers
e pr
otec
tion
NMO
S, L
DO 3
V3/5
V,
Win
dow
Wat
chdo
g, H
V in
terfa
ce32
-pin
7 ×
7 T
QFP
ATA6
843
3-Ph
ase
Brus
hles
s M
otor
5.5
to 3
2Ex
tern
al10
0Di
rect
PW
MN/
ASh
ort C
ircui
t, O
verte
mpe
ratu
re, O
ver/
Unde
r Vol
tage
, Ch
arge
pum
p Fa
il−4
0 to
+12
5Ch
arge
pum
p su
pply
for e
xter
nal b
atte
ry re
vers
e pr
otec
tion
NMO
S, D
ead
time
adju
st, L
DO 3
V3/5
V,
Win
dow
Wat
chdo
g, L
IN T
RX, S
leep
mod
e <4
5µA
48-p
in 7
× 7
QFN
ATA6
844
3-Ph
ase
Brus
hles
s M
otor
5.5
to 3
2Ex
tern
al10
0Di
rect
PW
MN/
ASh
ort C
ircui
t, O
verte
mpe
ratu
re, O
ver/
Unde
r Vol
tage
, Ch
arge
pum
p Fa
il−4
0 to
+15
0Ch
arge
pum
p su
pply
for e
xter
nal b
atte
ry re
vers
e pr
otec
tion
NMO
S, D
ead
time
adju
st, L
DO 3
V3/5
V,
Win
dow
Wat
chdo
g, L
IN T
RX, S
leep
mod
e <4
5 µA
48-p
in 7
× 7
QFN
MCP
8025
3-Ph
ase
Brus
hles
s M
otor
6.0
to 1
9.0
Exte
rnal
500
Dire
ct P
WM
NoO
verc
urre
nt, O
verv
olta
ge,
Unde
rvol
tage
, Ove
rtem
pera
ture
, 48V
Lo
ad D
ump
Prot
ectio
n, S
hort
Circ
uit,
Shoo
t Thr
ough
−40
to +
150
Slee
p M
ode,
LIN
Tra
nsce
iver,
AZ O
utpu
t, Ad
j. Bu
ck
Regu
lator
, LO
D, O
p Am
p, O
verc
urre
nt C
ompa
rato
r, Fa
ult O
utpu
t, Th
erm
al W
arni
ng, S
elect
able
Dead
Tim
e an
d Bl
ankin
g Ti
me
40-p
in 5
× 5
QFN
, 48
-pin
7 ×
7 T
QFP
MCP
8026
3-Ph
ase
Brus
hles
s M
otor
6.0
to 2
8.0
Exte
rnal
500
Dire
ct P
WM
NoO
verc
urre
nt, O
verv
olta
ge,
Unde
rvol
tage
, Ove
rtem
pera
ture
, 48V
Lo
ad D
ump
Prot
ectio
n, S
hort
Circ
uit,
Shoo
t Thr
ough
−40
to +
150
Slee
p M
ode,
LIN
Tra
nsce
iver,
AZ O
utpu
t, Ad
j. Bu
ck
Regu
lator
, LO
D, O
p Am
p, O
verc
urre
nt C
ompa
rato
r, Fa
ult O
utpu
t, Th
erm
al W
arni
ng, S
elect
able
Dead
Tim
e an
d Bl
ankin
g Ti
me
40-p
in 5
× 5
QFN
, 48
-pin
7 ×
7 T
QFP
MCP
8063
3-Ph
ase
Brus
hles
s M
otor
2.0
to 1
4.0
Inte
rnal
750
Sens
orles
s Si
nuso
idal
Freq
uenc
y G
ener
ator
Ove
rtem
pera
ture
, Mot
or L
ock-
up,
Ove
rcur
rent
, Ove
rvol
tage
−40
to +
125
3-Ph
ase
BLDC
180
° Sin
usoi
dal S
enso
rless
Fan
Mot
or
Drive
r, O
verc
urre
nt L
imita
tion,
Out
put S
witc
hing
Fr
eque
ncy
at 2
3 kH
zTh
erm
ally
Enha
nced
8-
pin
4 ×
4 DF
N
MTS
62C1
9AO
ne B
ipol
ar
Step
per M
otor
or
Two
DC M
otor
s10
.0 to
40
.0In
tern
al75
0Di
rect
PW
M In
put,
Curre
nt L
imit
Cont
rol,
Micr
oste
ppin
gNo
Ove
rtem
pera
ture
, Un
der V
olta
ge−4
0 to
+10
5Du
al Fu
ll-Br
idge
Mot
or D
river
for S
tepp
er M
otor
s, P
in
com
patib
le w
ith A
llegr
o 62
1924
-pin
SO
IC
MTS
2916
AO
ne B
ipol
ar
Step
per M
otor
or
Two
DC M
otor
s10
.0 to
40
.0In
tern
al75
0Di
rect
PW
M In
put,
Curre
nt L
imit
Cont
rol,
Micr
oste
ppin
gNo
Ove
rtem
pera
ture
, Un
der V
olta
ge−4
0 to
+10
5Du
al Fu
ll-Br
idge
Mot
or D
river
for S
tepp
er M
otor
s, P
in
com
patib
le w
ith A
llegr
o 29
1624
-pin
SO
IC
MTD
6501
C3-
Phas
e Br
ushle
ss
Mot
or2.
0 to
14.
0In
tern
al80
0Se
nsor
less
Sinu
soid
alFr
eque
ncy
Gen
erat
orO
verte
mpe
ratu
re, M
otor
Loc
k-up
, O
verc
urre
nt, O
verv
olta
ge−3
0 to
+95
3-Ph
ase
BLDC
180
° Sin
usoi
dal S
enso
rless
Fan
M
otor
Driv
er, O
verc
urre
nt lim
itatio
n, O
utpu
t Sw
itchi
ng
Freq
uenc
y at
20
kHz
Ther
mall
y En
hanc
ed
8-pi
n SO
P
MTD
6501
D3-
Phas
e Br
ushle
ss
Mot
or2.
0 to
14.
0In
tern
al50
0Se
nsor
less
Sinu
soid
alFr
eque
ncy
Gen
erat
orO
verte
mpe
ratu
re, M
otor
Loc
k-up
, O
verc
urre
nt, O
verv
olta
ge−3
0 to
+95
3-Ph
ase
BLDC
180
° Sin
usoi
dal S
enso
rless
Fan
Mot
or
Drive
r, Bo
ost M
ode,
Ove
rcur
rent
limita
tion,
Out
put
Switc
hing
Fre
quen
cy a
t 20
kHz
10-p
in M
SOP
MTD
6501
G3-
Phas
e Br
ushle
ss
Mot
or2.
0 to
14.
0In
tern
al80
0Se
nsor
less
Sinu
soid
alFr
eque
ncy
Gen
erat
orO
verte
mpe
ratu
re, M
otor
Loc
k-up
, O
verc
urre
nt, O
verv
olta
ge−3
0 to
+95
3-Ph
ase
BLDC
180
° Sin
usoi
dal S
enso
rless
Fan
M
otor
Driv
er, O
verc
urre
nt lim
itatio
n, O
utpu
t Sw
itchi
ng
Freq
uenc
y at
23
kHz
Ther
mall
y En
hanc
ed
8-pi
n SO
P
MTD
6502
B3-
Phas
e Br
ushle
ss
Mot
or2.
0 to
5.5
Inte
rnal
750
Sens
orles
s Si
nuso
idal
Freq
uenc
y G
ener
ator
Ove
rtem
pera
ture
, Mot
or L
ock-
up,
Ove
rcur
rent
, Ove
rvol
tage
−40
to +
125
3-Ph
ase
BLDC
Sin
usoi
dal S
enso
rless
Fan
Mot
or
Drive
r, Di
rect
ion
cont
rol,
Ove
rcur
rent
limita
tion,
Out
put
Switc
hing
Fre
quen
cy a
t 30
kHz
10-p
in 3
× 3
TDF
N
MTD
6508
3-Ph
ase
Brus
hles
s M
otor
2.0
to 5
.5In
tern
al75
0Se
nsor
less
Sinu
soid
alFr
eque
ncy
Gen
erat
orO
verc
urre
nt, O
verv
olta
ge,
Ove
rtem
pera
ture
, Mot
or L
ock-
up−4
0 to
+12
5
180°
Sin
usoi
dal S
enso
rless
Driv
e, D
irect
ion
Cont
rol,
Prog
ram
mab
le BE
MF
Coeffi
cient
Ran
ge, O
utpu
t Sw
itchi
ng F
requ
ency
at 3
0 kH
z, P
rogr
amm
able
Star
t-up
RPM
and
Slew
Rat
e, S
elect
able
Star
t-up
Stre
ngth
and
Ph
ase
Targ
et R
egul
atio
n
10-p
in 3
× 3
UDF
N,
16-p
in 4
× 4
UQ
FN
MTD
6505
3-Ph
ase
Brus
hless
M
otor
2.0
to 5
.5In
tern
al75
0Se
nsor
less
Sinu
soid
alFr
eque
ncy
Gen
erat
orO
verc
urre
nt, O
verv
olta
ge,
Ove
rtem
pera
ture
, Mot
or L
ock-
up−4
0 to
+12
518
0° S
inus
oida
l Sen
sorle
ss D
rive,
Dire
ctio
n Co
ntro
l, Pr
ogra
mm
able
BEM
F Co
efficie
nt R
ange
, Out
put
Switc
hing
Fre
quen
cy a
t 30
kHz
10-p
in 3
× 3
UDF
N
www.microchip.com/analog8
POW
ER M
ANAG
EMEN
TPO
WER
MAN
AGEM
ENT:
Vol
tage
Ref
eren
ces
Part
#Vi
n M
ax
(V)
Out
put V
olta
ge
(V)
Max
. Loa
d C
urre
nt (m
A)In
itial
Acc
urac
y (m
ax.%
)Te
mpe
ratu
re
Coe
ffici
ent (
ppm
/°C
)M
axim
um S
uppl
y C
urre
nt (µ
A @
25°
C)
Pack
ages
MCP
1501
5.5
1.02
4, 1
.250
, 1.8
, 2.0
48, 2
.5, 3
.0, 3
.3, 4
.096
20
±0.0
850
350
8-pi
n 2
× 2
WDF
N, 6
-pin
SO
T-23
, 8-p
in S
OIC
MCP
1525
5.5
2.5
±2±1
5010
03-
pin
TO-9
2, 3
-pin
SO
T-23
BM
CP15
415.
54.
096
±2±1
5010
03-
pin
TO-9
2, 3
-pin
SO
T-23
BLM
4040
C15
2.5,
4.0
96, 5
.015
±0.5
100
65–8
53-
pin
SOT-
23LM
4040
D15
2.5,
4.0
96, 5
.015
±115
065
–85
3-pi
n SO
T-23
LM40
41C
151.
225,
Adj
. (1.
24–1
0V)
12±0
.510
070
3-pi
n SO
T-23
LM40
41D
151.
225,
Adj
. (1.
24–1
0V)
12±1
150
703-
pin
SOT-
23M
IC40
403
10Ad
just
able
15±1
–70
8-pi
n SO
T-14
3
POW
ER M
ANAG
EMEN
T: S
ingl
e O
utpu
t Lin
ear R
egul
ator
s
Part
#O
utpu
t C
urre
nt (m
A)Vi
n M
in
(V)
Vin M
ax
(V)
Vou
t (V)
Volta
ge D
rop
Typi
cal (
mV)
IGN
D
Typi
cal (
μA)
Out
put
Accu
racy
(%)
PSRR
1 k
Hz
(dB)
Feat
ures
Pack
ages
MIC
5231
103.
512
2.75
, 3.0
, 3.3
, 5.0
150
650
nA±2
50Hi
gh In
put V
olta
ge, S
mall
Pac
kage
5-pi
n SO
T-23
MIC
5232
102.
77
1.2,
2.5
, 2.8
, 3.3
100
1.8
uA±2
557V
inpu
t5-
pin
TSO
T, 6
-pin
VDF
NM
AQ52
8025
4.5
120
Adj.
1100
31 μ
A±2
80Ul
tra-H
igh
Inpu
t Vol
tage
, Loa
d Du
mp
8-pi
n SO
IC
MIC
5280
254.
512
0Ad
j.11
0031
μA
±280
High
Inpu
t Vol
tage
, Loa
d Du
mp,
Rev
erse
Ba
ttery
Pro
tect
ion
8-pi
n SO
IC
MIC
5281
256
120
3.3,
5.0
, Adj
.20
006
μA±3
90Hi
gh In
put V
olta
ge, L
oad
Dum
p8-
pin
MSO
PM
AQ52
8125
612
03.
3, 5
.0, A
dj.
2000
6 μA
±390
High
Inpu
t Vol
tage
, Loa
d Du
mp
8-pi
n M
SOP
MAQ
5282
506
120
3.3,
5.0
, Adj
.20
006
μA±3
90Hi
gh In
put V
olta
ge, H
igh
PSRR
8-pi
n M
SOP
MIC
5282
506
120
3.3,
5.0
, Adj
.20
006
μA±3
90Hi
gh In
put V
olta
ge, L
oad
Dum
p8-
pin
MSO
PTC
1014
502.
76
1.8,
2.5
, 2.7
, 2.8
, 2.8
5, 3
.0, 3
.3, 3
.6, 4
.0, 5
.085
50 μ
A±0
.564
Ultra
Low
Dro
pout
5-pi
n SO
T-23
TC10
5450
2.7
61.
8, 2
.5, 2
.7, 2
.8, 2
.85,
3.0
, 3.3
, 3.6
, 4.0
, 5.0
8550
μA
±0.5
64Ul
tra L
ow D
ropo
ut5-
pin
SOT-
23TC
1070
502.
76
1.23
–5.5
8550
μA
±0.5
64Ul
tra L
ow D
ropo
ut5-
pin
SOT-
23TC
1072
502.
76
2.5,
2.7
, 2.8
, 2.8
5, 3
.0, 3
.3, 3
.6, 4
.0, 5
.085
50 μ
A±0
.564
Ultra
Low
Dro
pout
6-pi
n SO
T-23
TC12
2350
2.7
62.
5, 2
.7, 2
.8, 3
.0, 3
.3, 3
.6, 4
.0, 5
.085
50 μ
A±0
.564
Ultra
Low
Dro
pout
5-pi
n SO
T-23
TC20
1450
2.7
61.
8, 2
.7, 2
.8, 3
.0, 3
.345
50 μ
A±0
.455
Ultra
Low
Dro
pout
5-pi
n SO
T-23
TC20
5450
2.7
61.
8, 2
.7, 2
.8, 3
.0, 3
.345
55 μ
A±0
.450
Ultra
Low
Dro
pout
5-pi
n SO
T-23
MCP
1790
706
303.
0, 3
.3, 5
.070
070
μA
±0.2
90Hi
gh In
put
3-pi
n SO
T-22
3, 3
-pin
DDP
AKM
CP17
9170
630
3.0,
3.3
, 5.0
700
70 μ
A±0
.290
High
Inpu
t5-
pin
DDPA
K, 5
-pin
SO
T-22
3M
IC52
0380
2.5
162.
6, 2
.8, 3
.0, 3
.3, 3
.6, 3
.8, 4
.0, 4
.5, 5
.030
018
0 μA
±360
High
Inpu
t Vol
tage
, Sm
all P
acka
ge4-
pin
SOT-
143,
5-p
in S
OT-
23M
IC52
1380
2.5
162.
5, 2
.6, 2
.7, 2
.8, 3
.0, 3
.3, 3
.6, 5
.0
280
180
μA±3
60Hi
gh In
put V
olta
ge, S
mall
Pac
kage
5-pi
n SC
70TC
1016
802.
76
1.8,
2.7
, 2.8
, 3.0
150
53 μ
A±0
.558
Low
Dro
put
5-pi
n SC
-70,
5-p
in S
OT-
23LP
2951
100
230
4.8,
5.0
, Adj
.38
010
0 μA
±0.5
70Hi
gh In
put V
olta
ge, H
igh
PSRR
8-pi
n SO
IC, 8
-pin
PDI
P
MIC
5200
100
2.5
263.
0, 3
.3, 4
.8, 5
.023
013
0 μA
±170
Low
Dro
pout
8-pi
n M
SOP,
3-p
in S
OT-
223,
8-
pin
SOIC
MIC
5233
100
2.3
361.
8, 2
.5, 3
.0, 3
.3, 5
.0, A
dj.
270
18 μ
A±1
50Hi
gh In
put V
olta
ge, R
ever
se B
atte
ry a
nd
Curre
nt P
rote
ctio
n3-
pin
SOT-
223,
5-p
in S
OT-
23
MIC
5253
100
2.7
5.5
1.5,
1.8
, 1.8
5, 2
.5, 2
.6, 2
.7, 2
.8, 2
.9, 3
.0, 3
.1,
3.2,
3.3
165
75 μ
A±0
.570
Low
Dro
pout
5-pi
n SC
70
MIC
5270
100
−2−1
6(−
)3.0
, (−)
4.1,
(−)5
.0, A
dj.
500
35 μ
A±2
50Ne
gativ
e LD
O5-
pin
SOT-
23M
IC52
7110
0−3
.3−1
6(−
)3.0
, (−)
4.1,
(−)5
.0, A
dj.
500
25 μ
A±2
50Ne
gativ
e LD
O5-
pin
SOT-
23TC
1015
100
2.7
61.
8, 2
.5, 2
.7, 2
.8, 2
.85,
3.0
, 3.3
, 3.6
, 4.0
, 5.0
180
50 μ
A±0
.564
Low
Dro
put
5-pi
n SO
T-23
TC10
5510
02.
76
1.8,
2.5
, 2.7
, 2.8
, 2.8
5, 3
.0, 3
.3, 3
.6, 4
.0, 5
.018
050
μA
±0.5
64Lo
w D
ropu
t5-
pin
SOT-
23TC
1071
100
2.7
61.
23–5
.518
050
μA
±0.5
64Lo
w D
ropu
t5-
pin
SOT-
23TC
1073
100
2.7
62.
5, 2
.7, 2
.8, 2
.85,
3.0
, 3.3
, 3.6
, 4.0
, 5.0
180
50 μ
A±0
.564
Low
Dro
put
6-pi
n SO
T-23
Analog and Interface Product Selector Guide 9
POW
ER M
ANAG
EMEN
T: S
ingl
e O
utpu
t Lin
ear R
egul
ator
s (C
ontin
ued)
Part
#O
utpu
t C
urre
nt (m
A)Vi
n M
in
(V)
Vin M
ax
(V)
Vou
t (V)
Volta
ge D
rop
Typi
cal (
mV)
IGN
D
Typi
cal (
μA)
Out
put
Accu
racy
(%)
PSRR
1 k
Hz
(dB)
Feat
ures
Pack
ages
TC12
2410
02.
76
2.5,
2.7
, 2.8
, 3.0
, 3.3
, 3.6
, 4.0
, 5.0
180
50 μ
A±0
.564
Low
Dro
put
5-pi
n SO
T-23
TC20
1510
02.
76
1.8,
2.7
, 2.8
, 3.0
, 3.3
9055
μA
±0.4
55Lo
w D
ropu
t5-
pin
SOT-
23TC
2055
100
2.7
61.
8, 2
.7, 2
.8, 3
.0, 3
.390
55 μ
A±0
.450
Low
Dro
put
5-pi
n SO
T-23
TC59
100
–−1
0−8
380
3 μA
±0.5
50Ne
gativ
e LD
O3-
pin
SOT-
23A
TC11
8812
02.
76
1.8,
2.8
, 2.8
4, 3
.15
130
50 μ
A±0
.580
High
PSR
R5-
pin
SOT-
23TC
1189
120
2.7
61.
8, 2
.8, 2
.84,
3.1
513
050
μA
±0.5
80Hi
gh P
SRR
5-pi
n SO
T-23
MCP
1810
150
2.5
5.5
1.2,
1.8
, 2.5
, 3.0
, 3.3
, 4.2
380
0.02
μA
±125
Ultra
Low
Iq2
× 2
VDFN
MAQ
5283
150
612
03.
3, 5
.0, A
dj.
1800
8 μA
±375
High
Inpu
t Vol
tage
, Hig
h PS
RR8-
pin
SOIC
MIC
2951
150
230
3.3,
5.0
320
120
μA±1
67Lo
ad D
ump,
Rev
erse
Bat
tery
Pro
tect
ion
8-pi
n M
SOP,
8-p
in S
OIC
, 8-p
in P
DIP
MIC
5205
150
2.5
162.
5, 2
.7, 2
.8, 2
.85,
2.9
, 3.0
, 3.1
, 3.2
, 3.3
, 3.6
, 3.8
, 4.
0, 5
.0, A
dj.
165
80 μ
A±1
75Hi
gh In
put V
olta
ge, S
mall
Pac
kage
5-pi
n SO
T-23
MIC
5206
150
2.5
162.
5, 2
.7, 3
.0, 3
.2, 3
.3, 3
.6, 3
.8, 4
.0, 5
.0, A
dj.
165
1.3m
A±1
75Hi
gh In
put V
olta
ge, S
mall
Pac
kage
8-pi
n M
SOP,
5-p
in S
OT-
23
MIC
5225
150
2.3
161.
5, 1
.8, 2
.5, 2
.7, 3
.0, 3
.3, 5
.0, A
dj.
310
29 μ
A±0
.535
High
Inpu
t Vol
tage
, Sm
all P
acka
ge,
Reve
rse
Curre
nt P
rote
ctio
n5-
pin
SOT-
23
MIC
5234
150
2.3
30Ad
j.32
020
μA
±1–
High
Inpu
t Vol
tage
, Loa
d Du
mp,
Rev
erse
Ba
ttery
and
Cur
rent
Pro
tect
ion
8-pi
n SO
IC
MIC
5235
150
2.3
241.
5, 1
.8, 2
.5, 2
.7, 3
.0, 3
.3, 5
.0, A
dj.
310
18 μ
A±1
35Hi
gh In
put V
olta
ge, R
ever
se B
atte
ry a
nd
Curre
nt P
rote
ctio
n5-
pin
SOT-
23
MIC
5236
150
2.3
302.
5, 3
.0, 3
.3, 5
.0, A
dj.
300
20 μ
A±1
55Hi
gh In
put V
olta
ge, L
oad
Dum
p, R
ever
se
Batte
ry a
nd C
urre
nt P
rote
ctio
n8-
pin
MSO
P, 8
-pin
SO
IC
MIC
5238
150
1.5
61.
0, 1
.1, 1
.331
023
μA
±550
Low
Dro
pout
5-pi
n TS
OT,
5-p
in S
OT-
23
MIC
5247
150
2.7
61.
5, 1
.6, 1
.8, 1
.85,
2.0
, 2.1
, 2.2
, 2.4
150
85 μ
A±1
60Lo
w D
ropo
ut5-
pin
TSO
T, 6
-pin
VDF
N, 5
-pin
SO
T-23
MIC
5248
150
2.7
61.
2–
100
μA±3
60Lo
w D
ropo
ut6-
pin
VDFN
, 5-p
in S
OT-
23M
IC52
5215
02.
76
1.8,
2.5
, 2.8
, 2.8
5, 3
.0, 4
.75
135
90 μ
A±1
60Lo
w D
ropo
ut6-
pin
VDFN
, 5-p
in S
OT-
23
MIC
5255
150
2.7
62.
5, 2
.6, 2
.7, 2
.75,
2.8
, 2.8
5, 2
.9, 3
.0, 3
.1, 3
.2,
3.3,
3.5
135
90 μ
A±1
60Lo
w D
ropo
ut5-
pin
TSO
T, 6
-pin
VDF
N, 5
-pin
SO
T-23
MIC
5256
150
2.7
61.
5, 1
.8, 2
.5, 2
.6, 2
.7, 2
.8, 2
.85,
2.9
, 3.0
, 3.1
, 3.3
135
90 μ
A±1
60Lo
w D
ropo
ut5-
pin
TSO
T, 5
-pin
SO
T-23
MIC
5258
150
2.7
61.
2–
85 μ
A±3
–Lo
w D
ropo
ut5-
pin
SOT-
23
MIC
5265
150
2.7
5.5
1.5,
1.8
, 1.8
5, 2
.5, 2
.6, 2
.7, 2
.8, 2
.85,
2.9
, 3.0
, 3.
1, 3
.2, 3
.321
075
μA
±264
Low
Dro
pout
5-pi
n TS
OT,
6-p
in U
DFN
MIC
5268
150
2.7
61.
2–
110
μA±3
–Lo
w D
ropo
ut5-
pin
SOT-
23M
IC52
8315
06
120
3.3,
5.0
, Adj
.18
008
μA±3
75Hi
gh In
put V
olta
ge, L
oad
Dum
p8-
pin
SOIC
, 8-p
in V
DFN
MIC
5295
150
2.3
243.
0, 3
.3, 5
.0, A
dj.
310
18 μ
A±1
50Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
5-pi
n TO
-252
MIC
5301
150
2.3
5.5
1.3,
1.5
, 1.8
, 2.1
, 2.5
, 2.6
, 2.8
, 2.8
5, 2
.9, 3
.0, 3
.3,
4.6,
Adj
.40
85 μ
A±2
75Ul
tra L
ow D
ropo
ut5-
pin
TSO
T, 6
-pin
UDF
N, 6
-pin
W
DFN
MIC
5302
15
02.
35.
51.
3, 1
.5, 1
.8, 2
.1, 2
.5, 2
.6, 2
.8, 2
.85,
2.9
, 3.0
, 3.
3, 4
.650
85 μ
A±2
65Ul
tra L
ow D
ropo
ut4-
pin
UDFN
MIC
5304
150
2.3
5.5
3.15
/1.8
5, 3
.15/
1.87
5, 3
.2/1
.885
24 μ
A±0
.565
Ultra
Low
Dro
pout
6-pi
n UD
FN
MIC
5305
150
2.25
5.5
1.5,
1.8
, 2.0
, 2.5
, 2.6
, 2.7
, 2.8
, 2.8
5, 2
.9, 3
.0, 3
.3,
4.6,
4.7
5, A
dj.
6090
μA
±185
Ultra
Low
Dro
pout
5-pi
n TS
OT,
6-p
in U
DFN,
6-p
in
VDFN
MIC
5306
150
2.25
5.5
1.8,
2.5
, 2.6
4516
μA
±162
Ultra
Low
Dro
pout
5-pi
n TS
OT
MIC
5308
150
1.6
5.5
1.2,
1.5
, 1.8
, Adj
.45
23 μ
A±2
90Ul
tra L
ow D
ropo
ut, U
ltra
High
PSR
R6-
pin
TSO
T, 6
-pin
UDF
N
MIC
5317
150
2.5
61.
0, 1
.2, 1
.5, 1
.8, 2
.5, 2
.8, 3
.0, 3
.315
532
μA
±280
High
PSR
R5-
pin
TSO
T, 4
-pin
UDF
N, 5
-pin
SO
T-23
MIC
5365
150
2.5
5.5
1.5,
1.8
, 2.0
, 2.5
, 2.6
, 2.7
, 2.8
, 2.8
5, 2
.9, 3
.0, 3
.315
532
μA
±280
High
PSR
R5-
pin
SC70
, 5-p
in T
SOT,
4-p
in U
DFN
MIC
5366
150
2.5
5.5
1.5,
1.8
, 2.0
, 2.5
, 2.6
, 2.7
, 2.8
, 2.8
5, 2
.9, 3
.0, 3
.315
532
μA
±280
High
PSR
R5-
pin
SC70
, 4-p
in U
DFN
MIC
5376
150
2.5
5.5
2.8
120
29 μ
A±2
60Lo
w D
ropo
ut5-
pin
SC70
, 4-p
in U
DFN
www.microchip.com/analog10
POW
ER M
ANAG
EMEN
T: S
ingl
e O
utpu
t Lin
ear R
egul
ator
s (C
ontin
ued)
Part
#O
utpu
t C
urre
nt (m
A)Vi
n M
in
(V)
Vin M
ax
(V)
Vou
t (V)
Volta
ge D
rop
Typi
cal (
mV)
IGN
D
Typi
cal (
μA)
Out
put
Accu
racy
(%)
PSRR
1 k
Hz
(dB)
Feat
ures
Pack
ages
MIC
5377
150
2.5
5.5
Adj.
120
29 μ
A±2
60Lo
w D
ropo
ut5-
pin
SC70
, 8-p
in U
QFN
MIC
5378
150
2.5
5.5
Adj.
120
29 μ
A±2
60Lo
w D
ropo
ut5-
pin
SC70
, 8-p
in U
QFN
MCP
1711
150
1.4
61.
1–5.
0 6
700.
6 μA
±1–
Ultra
Low
Iq, C
aples
s4-
pin
UQFN
, 5-p
in S
OT-
23
MCP
1754
150
3.6
161.
8–5.
030
056
μA
±0.4
72Hi
gh P
erfo
rman
ce8-
pin
DFN,
5-p
in S
OT-
223,
5-
pin
SOT-
23
MCP
1754
S15
03.
616
1.8–
5.0
300
56 μ
A±0
.272
High
Per
form
ance
3-pi
n SO
T-89
, 3-p
in S
OT-
23A,
3-
pin
SOT-
223,
8-p
in D
FN
MCP
1804
150
228
1.8–
1830
050
μA
±250
High
Inpu
t3-
pin
SOT-
89, 5
-pin
SO
T-89
, 3-
pin
SOT-
223,
5-p
in S
OT-
23TC
1017
150
2.7
61.
8, 2
.6, 2
.7, 2
.8, 2
.85,
2.9
, 3.0
, 3.3
, 4.0
285
53 μ
A±0
.558
Low
Dro
pout
5-pi
n SC
-70,
5-p
in S
OT-
23
TC11
8515
02.
76
1.8,
2.5
, 2.7
, 2.8
, 2.8
5, 3
.0, 3
.3, 3
.6, 4
.0, 5
.027
050
μA
±0.5
64Lo
w D
ropo
ut5-
pin
SOT-
23TC
1186
150
2.7
61.
8, 2
.5, 2
.7, 2
.8, 2
.85,
3.0
, 3.3
, 3.6
, 4.0
, 5.0
270
50 μ
A±0
.564
Low
Dro
pout
5-pi
n SO
T-23
TC11
8715
02.
76
1.23
–5.5
270
50 μ
A±0
.564
Low
Dro
pout
5-pi
n SO
T-23
TC21
8515
02.
76
1.8,
2.7
, 2.8
, 3.0
, 3.3
140
55 μ
A±0
.455
High
Acc
urac
y5-
pin
SOT-
23TC
2186
150
2.7
61.
8, 2
.7, 2
.8, 3
.0, 3
.314
055
μA
±0.4
50Hi
gh A
ccur
acy
5-pi
n SO
T-23
M
IC52
0718
02.
516
1.8,
2.5
, 2.8
, 2.9
, 3.0
, 3.1
, 3.2
, 3.3
, 4.0
, 5.0
, Adj
.16
580
μA
±375
High
Inpu
t Vol
tage
, Sm
all P
acka
ge5-
pin
TSO
T, 5
-pin
SO
T-23
MIC
5201
200
2.5
263.
0, 3
.3, 4
.8, 5
.0, A
dj.
270
130
μA±2
75Lo
w D
ropo
ut8-
pin
MSO
P, 3
-pin
SO
T-22
3,
8-pi
n SO
ICM
IC53
67
200
2.5
5.5
1.2,
1.5
, 3.3
180
29 μ
A±2
65Lo
w D
ropo
ut6-
pin
UDFN
MIC
5368
20
02.
55.
51.
2, 1
.5, 3
.318
029
μA
±165
Low
Dro
pout
6-pi
n UD
FNM
IC94
300
200
1.8
3.6
Inpu
t Fol
low
er17
013
8 μA
–0
Ripp
leBlo
cker
4-pi
n UD
FNM
IC94
310
200
1.8
3.6
1.2,
1.5
, 1.8
, 1.8
5, 2
.5, 2
.7, 2
.8, 2
.85,
3.0
, 3.3
4017
0 μA
±185
Ripp
leBlo
cker
4-pi
n UD
FN, 5
-pin
SO
T-23
MIC
2954
250
230
5.0,
Adj
.37
514
0 μA
±1–
Load
Dum
p3-
pin
SOT-
223,
3-p
in T
O-2
20,
8-pi
n SO
IC
MCP
1700
250
2.3
61.
8, 2
.5, 3
.0, 3
.3, 5
.030
01.
6 μA
±0.4
44Lo
w Iq
3-pi
n TO
-92,
3-p
in S
OT-
89,
3-pi
n SO
T-23
, 6-p
in D
FN
MCP
1702
250
2.7
13.2
1.2,
1.5
, 1.8
, 2.5
, 2.8
, 3.0
, 3.3
, 4.0
, 5.0
625
2 μA
±0.4
44Lo
w Iq
3-pi
n TO
-92,
3-p
in S
OT-
89,
3-pi
n SO
T-23
A
MCP
1703
A25
02.
716
1.2–
5.5
625
2 μA
±0.4
35Hi
gh In
put,
Low
Iq3-
pin
SOT-
89, 3
-pin
SO
T-23
A,
3-pi
n SO
T-22
3, 8
-pin
DFN
MAQ
5300
300
2.3
5.5
1.5,
1.8
, 2.5
, 2.8
, 2.8
5, 3
.0, 3
.310
085
μA
±265
Low
Dro
pout
6-pi
n VD
FNM
IC52
49
300
2.7
61.
5, 1
.8, 2
.5, 2
.8, 2
.85,
3.0
, 3.3
340
85 μ
A±1
65Hi
gh P
SRR
8-pi
n M
SOP
MIC
5259
300
2.7
61.
5, 1
.8, 2
.1, 2
.5, 2
.8, 2
.85,
3.0
, 3.3
300
105
μA±0
.570
Low
Dro
pout
5-pi
n TS
OT,
6-p
in V
DFN
MIC
5303
30
02.
35.
51.
5, 1
.8, 2
.1, 2
.5, 2
.6, 2
.8, 2
.85,
2.9
, 3.0
, 3.3
100
85 μ
A±2
65Ul
tra L
ow D
ropo
ut4-
pin
UDFN
MIC
5307
30
02.
45.
51.
5, 1
.8, 2
.8, 3
.012
020
μA
±162
Low
Dro
pout
5-pi
n TS
OT
MIC
5309
300
1.7
5.5
1.2,
1.5
, 1.8
, Adj
.10
023
μA
±290
Ultra
Hig
h PS
RR6-
pin
TSO
T, 6
-pin
UDF
NM
IC53
18
300
2.3
61.
5, 1
.8, 2
.5, 2
.8, 3
.3, A
dj.
110
85 μ
A±2
75Hi
gh P
SRR
5-pi
n TS
OT,
6-p
in U
DFN
MIC
5323
300
2.65
5.5
1.8,
2.8
, 3.3
, Adj
.12
090
μA
±280
High
PSR
R5-
pin
TSO
T, 6
-pin
UDF
NM
IC53
27
300
2.3
5.5
1.8,
2.8
180
24 μ
A±0
.560
High
PSR
R4-
pin
UDFN
MIC
5337
300
2.3
5.5
1.8,
2.8
180
24 μ
A±0
.565
High
PSR
R4-
pin
UDFN
MIC
5353
30
02.
66
1.8,
2.5
, 2.6
, 2.8
, 3.0
, 3.3
, Adj
.16
090
μA
±260
Low
Dro
pout
6-pi
n UD
FNM
IC53
6330
02.
55.
51.
2, 2
.1, 2
.8, 3
.322
538
μA
±280
High
PSR
R6-
pin
UDFN
MIC
5364
300
2.5
5.5
1.2,
2.1
, 2.8
, 3.3
225
38 μ
A±2
80Hi
gh P
SRR
6-pi
n UD
FNM
IC55
0130
02.
55.
51.
2, 1
.8, 2
.8, 3
.0, 3
.316
038
μA
±260
Low
Dro
pout
4-pi
n UD
FN, 5
-pin
SO
T-23
MIC
5502
300
2.5
5.5
1.2,
1.8
, 2.8
, 3.0
, 3.3
160
38 μ
A±2
60Lo
w D
ropo
ut4-
pin
UDFN
MIC
5503
300
2.5
5.5
1.2,
1.8
, 2.8
, 3.0
, 3.3
160
38 μ
A±2
60Lo
w D
ropo
ut4-
pin
UDFN
MIC
5504
300
2.5
5.5
1.2,
1.8
, 2.8
, 3.0
, 3.1
, 3.3
160
38 μ
A±2
60Lo
w D
ropo
ut4-
pin
UDFN
, 5-p
in S
OT-
23M
IC55
1230
02.
55.
51.
2, 1
.8, 2
.8, 3
.316
038
μA
±265
Low
Dro
pout
6-pi
n UD
FNM
IC55
1430
02.
55.
51.
2, 1
.8, 2
.8, 3
.0, 3
.316
038
μA
±265
Low
Dro
pout
6-pi
n UD
FN
Analog and Interface Product Selector Guide 11
POW
ER M
ANAG
EMEN
T: S
ingl
e O
utpu
t Lin
ear R
egul
ator
s (C
ontin
ued)
Part
#O
utpu
t C
urre
nt (m
A)Vi
n M
in
(V)
Vin M
ax
(V)
Vou
t (V)
Volta
ge D
rop
Typi
cal (
mV)
IGN
D
Typi
cal (
μA)
Out
put
Accu
racy
(%)
PSRR
1
kHz
(dB)
Feat
ures
Pack
ages
MCP
1755
300
3.6
161.
8–5.
530
068
μA
±0.8
580
High
Inpu
t, Lo
w D
ropo
ut3-
pin
SOT-
223,
8-p
in D
FN,
5-pi
n SO
T-22
3, 5
-pin
SO
T-23
MCP
1755
S30
03.
616
1.8–
5.5
300
68 μ
A±0
.85
80Lo
w D
ropo
ut3-
pin
SOT-
223,
8-p
in D
FNM
CP18
2430
02.
16
0.8,
1.2
, 1.8
, 2.5
, 3.0
, 3.3
, 5.0
200
120
μA±0
.455
High
Acc
urac
y5-
pin
SOT-
223
,5-p
in S
OT-
23M
CP18
24S
300
2.1
60.
8, 1
.2, 1
.8, 2
.5, 3
.0, 3
.3, 5
.020
012
0 μA
±0.4
55Hi
gh A
ccur
acy
3-pi
n SO
T-22
3,TC
1107
300
2.7
62.
5, 2
.7, 2
.8, 3
.0, 3
.3, 5
.024
050
μA
±0.5
60Lo
w D
ropo
ut8-
pin
MSO
P, 8
-pin
SO
IC 1
50m
ilTC
1108
300
2.7
62.
5, 2
.7, 2
.8, 3
.0, 3
.3, 5
.024
050
μA
±0.5
60Lo
w D
ropo
ut3-
pin
SOT-
223
TC11
7330
02.
76
3.3,
5.0
, 2.5
, 2.7
, 2.8
, 3.0
240
50 μ
A±0
.560
Low
Dro
pout
8-pi
n M
SOP,
8-p
in S
OIC
150
mil
TC11
7430
02.
76
1.23
–5.5
270
50 μ
A±0
.560
Low
Dro
pout
8-pi
n M
SOP,
8-p
in S
OIC
150
mil
TC12
6930
02.
76
2.5,
2.8
, 3.0
, 3.3
, 5.0
240
50 μ
A±0
.550
Low
Dro
pout
8-pi
n M
SOP
TC13
0030
02.
76
2.5,
2.7
, 2.8
, 2.8
5, 3
.0, 3
.321
080
μA
±0.5
60Lo
w D
ropo
ut8-
pin
MSO
P
MIC
2920
140
02
263.
3, 4
.8, 5
.0, 1
240
014
0 μA
±170
Load
Dum
p, R
ever
se B
atte
ry P
rote
ctio
n5-
pin
TO-2
20, 5
-pin
DDP
AK,
8-pi
n SO
ICM
IC29
202
400
226
Adj.
400
140
μA±1
70Lo
ad D
ump,
Rev
erse
Bat
tery
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
2920
440
02
265.
0, A
dj.
400
140
μA±1
70Lo
ad D
ump,
Rev
erse
Bat
tery
Pro
tect
ion
8-pi
n SO
IC, 8
-pin
PDI
PM
IC29
20A
400
226
3.3,
4.8
, 5.0
, 12
400
140
μA±1
70Lo
ad D
ump,
Rev
erse
Bat
tery
Pro
tect
ion
3-pi
n SO
T-22
3, 3
-pin
TO
-220
MIC
5325
400
1.7
5.5
1.2,
1.5
, 1.8
, 3.3
, 3.6
110
35 μ
A±2
65Lo
w N
oise
6-pi
n UD
FNM
IC47
050
50
01
3.6
1.2,
1.8
, Adj
.44
6 μA
±0.5
50Ul
tra L
ow D
ropo
ut6-
pin
UDFN
, 6-p
in V
DFN
MIC
4705
350
01
3.6
Adj.
446
μA±2
55Ul
tra L
ow D
ropo
ut8-
pin
UDFN
MIC
5209
500
2.5
161.
8, 2
.5, 3
.0, 3
.3, 3
.6, 4
.2, 5
.0, A
dj.
350
8 m
A±1
75Hi
gh In
put V
olta
ge, S
mall
Pac
kage
8-pi
n SO
IC, 3
-pin
SO
T-22
3,
8-pi
n VD
FN, 5
-pin
DDP
AKM
IC52
1650
02.
512
2.5,
3.3
, 3.6
, 5.0
300
8 m
A±1
75Hi
gh In
put V
olta
ge, S
mall
Pac
kage
8-pi
n M
SOP,
5-p
in S
OT-
23
MIC
5219
500
2.5
122.
5, 2
.6, 2
.7, 2
.8, 2
.85,
2.9
, 3.0
, 3.1
, 3.3
, 3.6
, 5.
0, A
dj.
350
12 m
A±1
75Hi
gh In
put V
olta
ge, S
mall
Pac
kage
8-pi
n M
SOP,
6-p
in U
DFN,
6-p
in
VDFN
, 5-p
in S
OT-
23M
IC52
3750
02.
516
2.5,
3.3
, 5.0
300
8 m
A±3
75Hi
gh In
put V
olta
ge, R
ever
se B
atte
ry P
rote
ctio
n3-
pin
TO-2
63, 3
-pin
TO
-220
MIC
5239
500
2.3
301.
5, 1
.8, 2
.5, 3
.0, 3
.3, 5
.0, A
dj.
350
23 μ
A±1
50Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
8-pi
n M
SOP,
8-p
in S
OIC
, 3-p
in
SOT-
223
MIC
5319
500
2.5
5.5
1.37
5, 1
.8, 1
.85,
2.5
, 2.6
, 2.7
, 2.8
, 2.8
5, 2
.9,
3.0,
3.3
, 5.0
, Adj
.20
090
μA
±170
High
PSR
R5-
pin
TSO
T, 6
-pin
VDF
N
MIC
5524
500
2.5
5.5
1.2,
1.8
, 2.8
, 3.0
, 3.3
260
38 μ
A±2
65Lo
w N
oise
4-pi
n UD
FNM
IC55
2850
02.
55.
53.
326
038
μA
±270
Low
Dro
pout
6-pi
n UD
FN, 6
-pin
X2D
FNM
IC94
305
500
1.8
3.6
Inpu
t Fol
low
er17
015
0 μA
–0
Ripp
leBlo
cker
6-pi
n UD
FNM
IC94
325
500
1.8
3.6
Adj.
100
170
μA±1
85Ri
ppleB
lock
er6-
pin
UDFN
MIC
9434
550
01.
83.
61.
2, 1
.5, 1
.8, 2
.8, 3
.310
017
0 μA
±185
Ripp
leBlo
cker
6-pi
n UD
FNM
IC94
355
500
1.8
3.6
1.2,
1.5
, 1.8
, 2.8
, 3.3
100
170
μA±1
85Ri
ppleB
lock
er6-
pin
UDFN
MCP
1725
500
2.3
60.
8, 1
.2, 1
.8, 2
.5, 3
.0, 3
.3, 5
.021
012
0 μA
±0.5
60Lo
w D
ropo
ut8-
pin
DFN,
8-p
in S
OIC
150
mil
MCP
1825
500
2.1
60.
8, 1
.2, 1
.8, 2
.5, 3
.0, 3
.3, 5
.021
012
0 μA
±0.5
60Lo
w D
ropo
ut5-
pin
TO-2
20, 5
-pin
DDP
AK,
5-pi
n SO
T-22
3
MCP
1825
S50
02.
16
0.8,
1.2
, 1.8
, 2.5
, 3.0
, 3.3
, 5.0
300
120
μA±0
.560
Low
Dro
pout
3-pi
n TO
-220
, 3-p
in S
OT-
223,
3-
pin
DDPA
K
TC12
6250
02.
76
2.5,
2.8
, 3.0
, 3.3
, 5.0
350
80 μ
A±0
.564
Low
Dro
pout
3-pi
n TO
-220
, 3-p
in S
OT-
223,
3-
pin
DDPA
K
TC12
6350
02.
76
2.5,
2.8
, 3.0
, 3.3
, 5.0
350
80 μ
A±0
.564
Low
Dro
pout
5-pi
n TO
-220
, 5-p
in D
DPAK
, 8-
pin
SOIC
150
mil
MIC
2937
175
04.
326
3.3,
5.0
, 12
370
160
μA±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
2937
275
04.
326
Adj.
370
160
μA±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
2937
A75
04.
326
3.3,
5.0
, 12
370
160
μA±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
3-pi
n TO
-263
, 3-p
in T
O-2
20M
IC37
7575
02.
256
1.5,
1.6
5, 1
.8, 2
.5, 3
.0, 3
.3, A
dj.
280
6.5
mA
±160
Reve
rse
Curre
nt P
rote
ctio
n8-
pin
MSO
PM
IC39
7575
02.
2516
1.65
, 1.8
, 2.5
, 3.0
, 3.3
, 5.0
, Adj
.30
07.
5 m
A±1
55Re
vers
e Cu
rrent
Pro
tect
ion
8-pi
n M
SOP
www.microchip.com/analog12
POW
ER M
ANAG
EMEN
T: S
ingl
e O
utpu
t Lin
ear R
egul
ator
s (C
ontin
ued)
Part
#O
utpu
t C
urre
nt
(mA)
Vin M
in
(V)
Vin m
Ax
(V)
Vou
t (V)
Volta
ge D
rop
Typi
cal (
mV)
IGN
D
Typi
cal (
μA)
Out
put
Accu
racy
(%)
PSRR
1
kHz
(dB)
Feat
ures
Pack
ages
TC12
6480
02.
76
1.8,
2.5
, 3.0
, 3.3
450
80 μ
A±0
.564
Low
Dro
pout
3-pi
n TO
-220
, 3-p
in S
OT-
223
3-pi
n DD
PAK
TC12
6580
02.
76
1.8,
2.5
, 3.0
, 3.3
450
80 μ
A±0
.564
Low
Dro
pout
5-pi
n TO
-220
, 5-p
in DD
PAK,
8-p
in SO
IC 1
50m
il
TC21
1780
02.
76
1.8,
2.5
, 3.0
, 3.3
600
80 μ
A±0
.555
Low
Dro
pout
3-pi
n SO
T-22
3, 3
-pin
DDP
AK
MIC
3710
010
002.
256
1.5,
1.6
5, 1
.8, 2
.5, 3
.328
040
0 μA
±150
Reve
rse
Batte
ry a
nd C
urre
nt P
rote
ctio
n3-
pin
SOT-
223
MIC
3710
110
002.
256
1.5,
1.6
5, 1
.8, 2
.1, 2
.5, 3
.328
040
0 μA
±150
Reve
rse
Batte
ry a
nd C
urre
nt P
rote
ctio
n8-
pin
SOIC
MIC
3710
210
002.
256
Adj
280
400
μA±1
50Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
8-pi
n SO
IC, 5
-pin
SPA
K
MIC
3910
010
002.
2516
1.8,
2.5
, 3.3
, 5.0
410
6.5
mA
±155
Reve
rse
Batte
ry a
nd C
urre
nt P
rote
ctio
n3-
pin
SOT-
223
MIC
3910
110
002.
2516
1.8,
2.5
, 3.3
, 5.0
410
6.5
mA
±155
Reve
rse
Batte
ry a
nd C
urre
nt P
rote
ctio
n8-
pin
SOIC
MIC
3910
210
002.
2516
Adj.
410
6.5
mA
±155
Reve
rse
Batte
ry a
nd C
urre
nt P
rote
ctio
n8-
pin
SOIC
MIC
4710
010
001
3.6
0.8,
1.0
, 1.2
, Adj
.80
350
μA±0
.580
Ultra
Low
Dro
pout
8-pi
n M
SOP,
8-p
in V
DFN
MIC
6910
1
1000
1.65
5.5
1.8
215
11 m
A±2
55Lo
w D
ropo
ut10
-pin
VDF
N
MIC
6910
3
1000
1.65
5.5
Adj.
215
11 m
A±2
55Lo
w D
ropo
ut10
-pin
VDF
N
MCP
1726
1000
2.3
60.
8, 1
.2, 1
.8, 2
.5, 3
.3, 5
.050
013
0 μA
±0.5
54Lo
w D
ropo
ut8-
pin
DFN,
8-p
in S
OIC
150
mil
MCP
1826
1000
2.3
60.
8, 1
.2, 1
.8, 2
.5, 3
.0, 3
.3, 5
.022
512
0 μA
±0.5
60Lo
w D
ropo
ut5-
pin
TO-2
20, 5
-pin
DDP
AK, 5
-pin
SO
T-22
3
MCP
1826
S10
002.
36
0.8,
1.2
, 1.8
, 2.5
, 3.0
, 3.3
, 5.0
225
120
μA±0
.560
Low
Dro
pout
3-pi
n TO
-220
, 3-p
in S
OT-
223,
3-p
in D
DPAK
MIC
2940
A12
502
263.
3, 5
.0, 1
240
035
mA
±1–
Load
Dum
p, R
ever
se C
urre
nt P
rote
ctio
n3-
pin
TO-2
63, 3
-pin
TO
-220
MIC
2941
A12
502
26Ad
j.40
035
mA
±1–
Load
Dum
p, R
ever
se C
urre
nt P
rote
ctio
n5-
pin
TO-2
20, 5
-pin
DDP
AK
MIC
2915
015
002.
2526
3.3,
5.0
, 12
350
22 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
3-pi
n TO
-263
, 3-p
in T
O-2
20
MIC
2915
115
002.
2526
3.3,
5.0
, 12
350
22 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
2915
215
002.
2526
Adj.
350
22 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
5-pi
n TO
-252
, 5-p
in T
O-2
20, 5
-pin
DDP
AK
MIC
3713
915
002.
256
1.8,
2.5
500
17 m
A±1
50Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
Plea
se c
all fo
r pac
kage
info
rmat
ion
MIC
3715
015
002.
256
1.5,
1.6
5, 1
.8, 2
.5, 3
.332
517
mA
±145
Reve
rse
Batte
ry a
nd C
urre
nt P
rote
ctio
n3-
pin
SPAK
MIC
3715
115
002.
256
1.5,
1.6
5, 1
.8, 2
.5, 3
.332
517
mA
±145
Reve
rse
Batte
ry a
nd C
urre
nt P
rote
ctio
n5-
pin
SPAK
MIC
3715
215
002.
256
Adj.
325
17 m
A±1
45Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
8-pi
n SO
IC, 5
-pin
SPA
K
MIC
3715
315
002.
256
Adj.
325
17 m
A±1
45Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
8-pi
n SO
IC
MIC
3915
015
002.
2516
1.65
, 1.8
, 2.5
375
17 m
A±1
53Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
3-pi
n TO
-263
, 3-p
in T
O-2
20
MIC
3915
115
002.
2516
1.65
, 1.8
, 2.5
375
17 m
A±1
53Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
3915
115
002.
256
Adj.
365
110
mA
±145
Low
Dro
pout
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
3915
215
002.
2516
Adj.
375
17 m
A±1
53Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
5-pi
n TO
-252
, 5-p
in D
DPAK
MIC
4715
015
001.
46.
5Ad
j.28
015
mA
±155
Low
Dro
pout
5-pi
n TO
-252
MIC
4915
015
001.
46.
50.
9, 1
.2, 1
.5, 1
.8, A
dj.
280
15 m
A±1
57Lo
w D
ropo
ut8-
pin
MSO
P, 5
-pin
SPA
K
MIC
5915
0
1500
13.
8Ad
j.10
012
.5 m
A±1
60Ul
tra L
ow D
ropo
ut8-
pin
SOIC
MIC
6115
015
001.
13.
61.
0, A
dj.
757.
6 m
A±1
50Ul
tra L
ow D
ropo
ut, S
oft S
tart
10-p
in M
SOP,
10-
pin
VDFN
MCP
1727
1500
2.3
60.
8, 1
.2, 1
.8, 2
.5, 3
.0, 3
.3, 5
.033
012
0 μA
±0.5
60Lo
w D
ropo
ut8-
pin
DFN,
8-p
in S
OIC
150
mil
MCP
1827
1500
2.3
60.
8, 1
.2, 1
.8, 2
.5, 3
.0, 3
.3, 5
.033
012
0 μA
±0.5
60Lo
w D
ropo
ut5-
pin
TO-2
20, 5
-pin
DDP
AK
MCP
1827
S15
002.
36
0.8,
1.2
, 1.8
, 2.5
, 3.0
, 3.3
, 5.0
330
120
μA±0
.560
Low
Dro
pout
3-pi
n TO
-220
, 3-p
in D
DPAK
MIC
4920
020
001.
46.
51.
0, 1
.8, A
dj.
400
15 m
A±1
83Lo
w D
ropo
ut5-
pin
SPAK
MIC
6820
020
001.
655.
51.
2, 1
.5, 1
.8, 2
.5, 3
.3, A
dj30
042
mA
±160
Low
Dro
pout
, Sof
t Sta
rt10
-pin
VDF
N
MIC
3725
225
003
6Ad
j.55
040
mA
±250
Reve
rse
Curre
nt P
rote
ctio
n5-
pin
SPAK
, 5-p
in D
DPAK
Analog and Interface Product Selector Guide 13
POW
ER M
ANAG
EMEN
T: S
ingl
e O
utpu
t Lin
ear R
egul
ator
s (C
ontin
ued)
Part
#O
utpu
t C
urre
nt
(mA)
Vin M
in
(V)
Vin m
Ax
(V)
Vou
t (V)
Volta
ge D
rop
Typi
cal (
mV)
IGN
D
Typi
cal (
μA)
Out
put
Accu
racy
(%)
PSRR
1
kHz
(dB)
Feat
ures
Pack
ages
MIC
2930
030
002.
2526
3.3,
5.0
, 12
370
37 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
3-pi
n TO
-263
, 3-p
in T
O-2
20
MIC
2930
130
002.
2526
3.3,
5.0
, 12
370
37 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
2930
230
002.
2526
Adj.
370
37 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
2930
2A30
003
16Ad
j.45
060
mA
±1–
Reve
rse
Batte
ry a
nd C
urre
nt P
rote
ctio
n5-
pin
TO-2
52, 5
-pin
DDP
AK
MIC
2930
2H30
002.
2526
Adj.
370
37 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
5-pi
n DD
PAK
MIC
2930
330
002.
2526
Adj.
370
37 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
2931
030
002.
316
3.3,
5.0
600
60 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
3-pi
n TO
-263
, 3-p
in T
O-2
20
MIC
2931
230
002.
316
Adj.
600
60 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
3530
230
002.
256
Adj.
370
20 m
A±1
50Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
5-pi
n TO
-252
MIC
3730
030
002.
256
1.5,
1.6
5, 1
.8, 2
.5, 3
.330
027
mA
±150
Reve
rse
Curre
nt P
rote
ctio
n3-
pin
SPAK
MIC
3730
130
002.
256
1.5,
1.8
, 2.5
, 3.3
300
27 m
A±1
50Re
vers
e Cu
rrent
Pro
tect
ion
8-pi
n SO
IC, 5
-pin
SPA
K
MIC
3730
230
002.
256
Adj.
300
27 m
A±1
50Re
vers
e Cu
rrent
Pro
tect
ion
5-pi
n SP
AK, 5
-pin
DDP
AK
MIC
3730
330
002.
256
Adj.
300
27 m
A±1
50Re
vers
e Cu
rrent
Pro
tect
ion
8-pi
n SO
IC, 8
-pin
VDF
N
MIC
3930
030
002.
2516
1.8,
2.5
385
45 m
A±1
–Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
3-pi
n TO
-263
, 3-p
in T
O-2
20
MIC
3930
130
002.
2516
1.8,
2.5
385
45 m
A±1
–Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
3930
230
002.
2516
Adj.
385
45 m
A±1
–Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
5-pi
n DD
PAK
MIC
4730
030
001.
46.
5Ad
j.23
025
mA
±1–
Low
Dro
pout
5-pi
n TO
-252
MIC
4930
030
001.
46.
50.
9, 1
.2, 1
.5, 1
.8, A
dj.
280
25 m
A±1
–Lo
w D
ropo
ut5-
pin
SPAK
MIC
5930
0
3000
13.
81.
2V, A
dj.
205
30 m
A±1
65Lo
w D
ropo
ut8-
pin
SOIC
, 5-p
in D
DPAK
MIC
6130
030
001.
13.
61.
0, A
dj.
150
7.6
mA
±155
Low
Dro
pout
, Sof
t Sta
rt10
-pin
MSO
P, 1
0-pi
n VD
FN
MIC
6930
130
001.
655.
51.
227
532
mA
±255
Low
Dro
pout
8-pi
n SO
IC, 5
-pin
SPA
K, 5
-pin
DDP
AK
MIC
6930
230
001.
655.
5Ad
j.27
532
mA
±255
Low
Dro
pout
5-pi
n SP
AK, 5
-pin
DDP
AK
MIC
6930
330
001.
655.
5Ad
j.27
532
mA
±255
High
Cur
rent
8-pi
n SO
IC, 1
2-pi
n VD
FN
MIC
6840
0
4000
1.65
5.5
1.8,
Adj
.36
090
mA
±250
Low
Dro
pout
, Sof
t Sta
rt16
-pin
VQ
FN
MIC
6840
140
001.
655.
5Ad
j.36
090
mA
±250
Low
Dro
pout
, Sof
t Sta
rt16
-pin
VQ
FN
MIC
2950
050
002.
2526
3.3,
5.0
, 12
370
70 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
3-pi
n TO
-220
MIC
2950
150
002.
2526
3.3,
5.0
, 12
370
70 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
2950
250
002.
2526
Adj.
370
70 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
2950
350
002.
2526
Adj.
370
70 m
A±1
–Lo
ad D
ump,
Rev
erse
Cur
rent
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
2951
050
002.
316
3.3,
5.0
700
100
mA
±1–
Load
Dum
p, R
ever
se C
urre
nt P
rote
ctio
n3-
pin
TO-2
20
MIC
2951
250
002.
316
Adj.
700
100
mA
±1–
Load
Dum
p, R
ever
se C
urre
nt P
rote
ctio
n5-
pin
TO-2
20
MIC
3750
150
002.
36
1.5,
1.6
5, 1
.8, 2
.5, 3
.333
057
mA
±1–
Reve
rse
Curre
nt P
rote
ctio
n7-
pin
SPAK
MIC
3750
250
002.
36
Adj.
330
57 m
A±1
–Re
vers
e Cu
rrent
Pro
tect
ion
7-pi
n SP
AK, 5
-pin
DDP
AK
MIC
3950
050
002.
2516
1.8,
2.5
400
70 m
A±1
30Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
3-pi
n TO
-263
, 3-p
in T
O-2
20
MIC
3950
150
002.
2516
1.8,
2.5
400
70 m
A±1
30Re
vers
e Ba
ttery
and
Cur
rent
Pro
tect
ion
5-pi
n TO
-220
, 5-p
in D
DPAK
MIC
4950
050
001.
46
0.9,
1.2
, Adj
.29
055
mA
±175
Low
Dro
pout
7-pi
n SP
AK
MIC
6950
250
001.
655.
5Ad
j.25
054
mA
±152
High
Cur
rent
7-pi
n SP
AK
MIC
2971
275
002.
316
Adj.
700
250
mA
±2–
High
Cur
rent
5-pi
n TO
-220
MIC
2975
175
002.
526
3.3,
5.0
425
120
mA
±1–
Load
Dum
p, R
ever
se C
urre
nt P
rote
ctio
n5-
pin
TO-2
47
MIC
2975
275
002.
526
Adj.
425
120
mA
±1–
Load
Dum
p, R
ever
se C
urre
nt P
rote
ctio
n5-
pin
TO-2
47
www.microchip.com/analog14
POW
ER M
ANAG
EMEN
T: M
ultip
le O
utpu
t Lin
ear R
egul
ator
s
Part
#Pr
oduc
t Typ
eIo
ut #
1Io
ut #
2Io
ut #
3Io
ut #
4Vi
n M
in. (
V)Vi
n M
ax. (
V)Vo
ut (
V)Vo
ltage
Dro
p Ty
p. (m
V)IG
ND
Typ
. (μ
A)PS
RR 1
kHz
(dB)
Pack
ages
MIC
2210
Dual
LDO
s15
0 m
A30
0 m
A–
–2.
255.
5Pl
ease
Ref
er to
Dat
ashe
et12
0/14
048
/60
μA60
10-p
in V
DFN
MIC
2211
Dual
LDO
s15
0 m
A30
0 m
A–
–2.
255.
5Pl
ease
Ref
er to
Dat
ashe
et12
0/14
048
/60
μA60
10-p
in V
DFN
MIC
2212
Dual
LDO
s15
0 m
A30
0 m
A–
–2.
255.
5Pl
ease
Ref
er to
Dat
ashe
et12
0/14
048
/60
μA60
10-p
in V
DFN
MIC
2213
Dual
LDO
s15
0 m
A30
0 m
A–
–2.
255.
5Pl
ease
Ref
er to
Dat
ashe
et12
0/14
048
/60
μA60
10-p
in V
DFN,
16-
pin
VQFN
MIC
2214
Dual
LDO
s15
0 m
A30
0 m
A–
–2.
255.
5Pl
ease
Ref
er to
Dat
ashe
et12
0/14
048
/60
μA60
10-p
in V
DFN,
16-
pin
VQFN
MIC
2215
Mul
ti-Ch
anne
l LDO
s25
0 m
A25
0 m
A25
0 m
A–
2.25
5.5
Plea
se R
efer
to D
atas
heet
100
110
μA70
16-p
in V
QFN
MIC
2219
Dual
LDO
s15
0 m
A30
0 m
A–
–2.
255.
5Pl
ease
Ref
er to
Dat
ashe
et12
048
μA
6010
-pin
VDF
NM
IC52
02Du
al LD
Os
100
mA
100
mA
––
2.5
26Pl
ease
Ref
er to
Dat
ashe
et22
517
0 μA
758-
pin
SOIC
MIC
5208
Dual
LDO
s50
mA
50 m
A–
–2.
516
Plea
se R
efer
to D
atas
heet
250
180
μA–
8-pi
n M
SOP
MIC
5210
Dual
LDO
s15
0 m
A15
0 m
A–
–2.
516
Plea
se R
efer
to D
atas
heet
165
80 μ
A75
8-pi
n M
SOP
MIC
5211
Dual
LDO
s80
mA
80 m
A–
–2.
516
Plea
se R
efer
to D
atas
heet
250
90 μ
A60
6-pi
n SO
T-23
MIC
5212
Dual
LDO
s50
0 m
A50
0 m
A–
–4
16Pl
ease
Ref
er to
Dat
ashe
et35
01.
5mA
758-
pin
SOIC
MIC
5264
Dual
LDO
s15
0 m
A15
0 m
A–
–2.
75.
5Pl
ease
Ref
er to
Dat
ashe
et21
075
μA
6410
-pin
VDF
NM
IC53
10Du
al LD
Os
150
mA
150
mA
––
2.3
5.5
Plea
se R
efer
to D
atas
heet
3585
μA
708-
pin
UDFN
, 8-p
in V
DFN
MIC
5311
Dual
LDO
s30
0 m
A30
0 m
A–
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et12
028
μA
6010
-pin
VDF
NM
IC53
12Du
al LD
Os
300
mA
300
mA
––
2.5
5.5
Plea
se R
efer
to D
atas
heet
120
28 μ
A60
10-p
in V
DFN
MIC
5315
Du
al LD
Os
300
mA
300
mA
––
1.7
5.5
Plea
se R
efer
to D
atas
heet
8530
μA
6510
-pin
UDF
NM
IC53
16
Dual
LDO
s30
0 m
A30
0 m
A–
–1.
75.
5Pl
ease
Ref
er to
Dat
ashe
et85
30 μ
A65
12-p
in U
DFN
MIC
5320
Dual
LDO
s15
0 m
A15
0 m
A–
–2.
35.
5Pl
ease
Ref
er to
Dat
ashe
et35
85 μ
A65
6-pi
n TS
OT,
6-p
in U
DFN,
6-p
in W
DFN
MIC
5321
Dual
LDO
s15
0 m
A15
0 m
A–
–2.
35.
5Pl
ease
Ref
er to
Dat
ashe
et35
85 μ
A75
6-pi
n TS
OT,
6-p
in U
DFN,
6-p
in W
DFN
MIC
5322
Du
al LD
Os
150
mA
150
mA
––
2.3
5.5
Plea
se R
efer
to D
atas
heet
3515
0 μA
756-
pin
UDFN
MIC
5330
Dual
LDO
s30
0 m
A30
0 m
A–
–2.
35.
5Pl
ease
Ref
er to
Dat
ashe
et75
85 μ
A70
8-pi
n VD
FNM
IC53
31Du
al LD
Os
300
mA
300
mA
––
2.3
5.5
Plea
se R
efer
to D
atas
heet
120
40 μ
A65
8-pi
n UD
FNM
IC53
32Du
al LD
Os
300
mA
300
mA
––
2.3
5.5
Plea
se R
efer
to D
atas
heet
120
40 μ
A65
8-pi
n UD
FNM
IC53
33Du
al LD
Os
300
mA
300
mA
––
2.3
5.5
Plea
se R
efer
to D
atas
heet
120
40 μ
A65
10-p
in U
DFN
MIC
5335
Dual
LDO
s30
0 m
A30
0 m
A–
–2.
35.
5Pl
ease
Ref
er to
Dat
ashe
et75
90 μ
A65
6-pi
n UD
FNM
IC53
38
Dual
LDO
s30
0 m
A30
0 m
A–
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et22
038
μA
556-
pin
UDFN
MIC
5339
Du
al LD
Os
300
mA
300
mA
––
2.5
5.5
Plea
se R
efer
to D
atas
heet
220
38 μ
A55
6-pi
n UD
FNM
IC53
50
Dual
LDO
s30
0 m
A50
0 m
A–
–2.
65.
5Pl
ease
Ref
er to
Dat
ashe
et75
/125
95 μ
A50
8-pi
n UD
FNM
IC53
55Du
al LD
Os
500m
A50
0 m
A–
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et35
038
μA
558-
pin
MSO
PM
IC53
56Du
al LD
Os
500m
A50
0 m
A–
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et35
038
μA
558-
pin
MSO
P, 8
-pin
VDF
NM
IC53
57Du
al LD
Os
500m
A50
0 m
A–
–2.
65.
5Pl
ease
Ref
er to
Dat
ashe
et13
095
μA
708-
pin
MSO
PM
IC53
70Du
al LD
Os
150m
A15
0 m
A–
–2.
35.
5Pl
ease
Ref
er to
Dat
ashe
et15
532
μA
606-
pin
UDFN
MIC
5371
Dual
LDO
s15
0mA
150
mA
––
2.5
5.5
Plea
se R
efer
to D
atas
heet
155
32 μ
A60
6-pi
n UD
FNM
IC53
73M
ulti-
Chan
nel L
DOs
200m
A20
0 m
A20
0 m
A–
1.7
5.5
Plea
se R
efer
to D
atas
heet
170
32 μ
A55
16-p
in U
QFN
MIC
5374
Mul
ti-Ch
anne
l LDO
s20
0 m
A20
0 m
A20
0 m
A1
mA
1.7
5.5
Plea
se R
efer
to D
atas
heet
170
42 μ
A55
16-p
in U
QFN
MIC
5380
Dual
LDO
s15
0 m
A15
0 m
A–
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et15
532
μA
6010
-pin
UQ
FNM
IC53
81Du
al LD
Os
150
mA
150
mA
––
2.5
5.5
Plea
se R
efer
to D
atas
heet
155
32 μ
A60
10-p
in U
QFN
MIC
5383
Mul
ti-Ch
anne
l LDO
s20
0 m
A20
0 m
A20
0 m
A–
1.7
5.5
Plea
se R
efer
to D
atas
heet
170
32 μ
A55
16-p
in U
QFN
MIC
5384
Mul
ti-Ch
anne
l LDO
s20
0 m
A20
0 m
A20
0 m
A1
mA
1.7
5.5
Plea
se R
efer
to D
atas
heet
170
42 μ
A55
16-p
in U
QFN
MIC
5385
M
ulti-
Chan
nel L
DOs
150
mA
150
mA
150
mA
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et18
032
μA
708-
pin
UDFN
MIC
5387
M
ulti-
Chan
nel L
DOs
150
mA
150
mA
150
mA
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et18
032
μA
706-
pin
UDFN
MIC
5388
Dual
LDO
s20
0 m
A20
0 m
A–
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et17
532
μA
736-
pin
WLC
SP
Analog and Interface Product Selector Guide 15
POW
ER M
ANAG
EMEN
T: M
ultip
le O
utpu
t Lin
ear R
egul
ator
s (C
ontin
ued)
Part
#Pr
oduc
t Typ
eIo
ut #
1Io
ut #
2Io
ut #
3Io
ut #
4Vi
n M
in. (
V)Vi
n M
ax. (
V)Vo
ut (
V)Vo
ltage
Dro
p Ty
p. (m
V)IG
ND
Typ
. (μ
A)PS
RR 1
kHz
(dB)
Pack
ages
MIC
5389
Dual
LDO
s20
0 m
A20
0 m
A–
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et17
532
μA
736-
pin
WLC
SP
MIC
5392
Dual
LDO
s15
0 m
A15
0 m
A–
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et15
557
μA
606-
pin
UDFN
, 6-p
in X
2DFN
MIC
5393
Dual
LDO
s15
0 m
A15
0 m
A–
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et15
557
μA
606-
pin
X2DF
N
MIC
5396
Dual
LDO
s30
0 m
A30
0 m
A–
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et16
037
μA
608-
pin
UDFN
, 8-p
in X
2DFN
MIC
5397
Dual
LDO
s30
0 m
A30
0 m
A–
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et16
037
μA
608-
pin
UDFN
, 8-p
in X
2DFN
MIC
5398
Dual
LDO
s30
0 m
A30
0 m
A–
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et16
037
μA
608-
pin
X2DF
N
MIC
5399
Dual
LDO
s30
0 m
A30
0 m
A–
–2.
55.
5Pl
ease
Ref
er to
Dat
ashe
et16
037
μA
608-
pin
UDFN
, 8-p
in X
2DFN
MIC
6822
0Du
al LD
Os
2.0A
2.0A
––
1.65
5.5
Plea
se R
efer
to D
atas
heet
300
15 m
A40
20-p
in V
DFN
TC13
07Si
ngle
LDO
s15
0 m
A15
0 m
A15
0 m
A15
0 m
A2.
76
Plea
se R
efer
to D
atas
heet
200
220
μA60
16-p
in Q
SOP
TC13
01A
Sing
le LD
Os
300
mA
150
mA
––
2.7
6Pl
ease
Ref
er to
Dat
ashe
et10
410
3 μA
588-
pin
MSO
P, 8
-pin
DFN
TC13
01B
Sing
le LD
Os
300
mA
150
mA
––
2.7
6Pl
ease
Ref
er to
Dat
ashe
et10
411
4 μA
588-
pin
MSO
P, 8
-pin
DFN
TC13
02A
Sing
le LD
Os
300
mA
150
mA
––
2.7
6Pl
ease
Ref
er to
Dat
ashe
et10
410
3 μA
588-
pin
MSO
P, 8
-pin
DFN
TC13
02B
Sing
le LD
Os
300
mA
150
mA
––
2.7
6Pl
ease
Ref
er to
Dat
ashe
et10
411
4 μA
588-
pin
MSO
P, 8
-pin
DFN
POW
ER M
ANAG
EMEN
T: L
inea
r Reg
ulat
ors
– LD
O C
ontro
ller a
nd S
IM C
ard
Part
#Pr
oduc
t Typ
eVi
n M
in. (
V)Vi
n M
ax. (
V)Vo
ut (
V)IG
ND
Typ
. (μA
)Vr
ef (V
)Ve
n (V
)In
tern
al C
harg
e Pu
mp
Exte
rnal
N-C
h.
MO
SFET
Pack
ages
MIC
5156
LDO
Con
trolle
rs3
363.
3, 5
.0, A
dj.
2.7
1.23
52.
4–
Yes
8-pi
n SO
IC, 8
-pin
PDI
P
MIC
5157
LDO
Con
trolle
rs3
363.
3, 5
.0, 1
24.
51.
235
2.4
Yes
Yes
14-p
in P
DIP,
14-
pin
SOIC
150
mil
MIC
5158
LDO
Con
trolle
rs3
365.
0, A
dj.
4.5
1.23
52.
4Ye
sYe
s14
-pin
PDI
P, 1
4-pi
n SO
IC 1
50m
il
MIC
5159
LDO
Con
trolle
rs1.
655.
51.
8, 3
.0, A
dj.
101.
235
1.2
–Ye
s6-
pin
SOT-
23
MIC
5190
LDO
Con
trolle
rs0.
95.
5Ad
j. do
wn
to 0
.5V
150.
50.
8–
Yes
10-p
in M
SOP,
10-
pin
VDFN
MIC
5191
LDO
Con
trolle
rs1
5.5
Adj.
dow
n to
1.0
V15
10.
8–
Yes
10-p
in M
SOP,
10-
pin
VDFN
MIC
4555
SIM
Car
d Lv
l Shi
fter w
ith 5
0 m
A LD
O2.
75.
51.
8, 3
.341
/79
––
––
16-p
in V
QFN
POW
ER M
ANAG
EMEN
T: D
DR
Term
inat
ion
Regu
lato
rs
Part
#Io
ut
Vin M
in. (
V)Vi
n M
ax. (
V)Vo
ut (
V)PW
R G
ood
VTT
Accu
racy
Exte
rnal
Tr
ansis
tor
Sync
Buc
kFr
eque
ncy
Feat
ures
Pack
ages
MIC
5162
±7A
1.35
61/
2 of
Vin
–±5
mV
ü–
–10
-pin
MSO
PM
IC51
63
±7A
0.75
61/
2 of
Vin
–±5
mV
ü–
–Lo
w V
olta
ge10
-pin
MSO
PM
IC51
64
±7A
1.35
61/
2 of
Vin
ü±5
mV
ü–
–10
-pin
MSO
PM
IC51
65
±7A
0.75
61/
2 of
Vin
ü±5
mV
ü–
–Lo
w V
olta
ge10
-pin
MSO
PM
IC51
66±3
A0.
93.
61/
2 of
Vin
ü±4
0 m
V–
––
Inte
grat
ed F
ETs
3 ×
3 DF
NM
IC51
67±6
A2.
65.
5Ad
j. do
wn
to 0
.35V
ü±1
2 m
V–
ü1
MHz
Inte
grat
ed S
ync
Buck
4 ×
4 DF
N
POW
ER M
ANAG
EMEN
T: H
igh-
Volta
ge L
inea
r Reg
ulat
ors
Part
#In
put t
o O
utpu
t Vol
tage
D
iffer
entia
l (M
in.)
Inpu
t to
Out
put V
olta
ge
Diff
eren
tial (
Max
.)O
utpu
t Vol
tage
(V)M
ax O
utpu
t Cur
rent
(m
A)Ty
pica
l Lin
e Re
gula
tion
(%/V
)Ty
pica
l Loa
d Re
gula
tion
(%/m
A)Pa
ckag
es
LR8
1245
01.
2–44
010
0.00
30.
153-
Lead
TO
-252
, 3-L
ead
TO-9
2, 3
-Lea
d SO
T-89
LR12
1210
01.
2–88
500.
003
0.06
3-Le
ad T
O-2
52, 8
-Lea
d SO
IC, 3
-Lea
d TO
-92
LR64
515
450
103
0.00
010.
508-
Lead
SO
IC, 3
-Lea
d TO
-92,
3-L
ead
TO-2
20, 3
-Lea
d SO
T-89
LR74
525
450
202
0.00
010.
503-
Lead
TO
-92,
3-L
ead
SOT-
89
www.microchip.com/analog16
POW
ER M
ANAG
EMEN
T: S
ingl
e O
utpu
t Sw
itchi
ng R
egul
ator
s (B
uck)
Part
#In
put
Volta
ge
Rang
e (V
)O
utpu
t Vol
tage
(V)
Ope
ratin
g Ju
nctio
n Te
mpe
ratu
re
Rang
e (°C
)
Switc
hing
Fr
eque
ncy
(kH
z)
Out
put
Cur
rent
(m
A)Fe
atur
esPa
ckag
es
MCP
1601
2.7
to 5
.50.
9V to
Vin
−40
to +
8575
050
0UV
LO, A
uto-
switc
hing
, LDO
8-pi
n M
SOP
MCP
1602
2.7
to 5
.50.
8 to
4.5
−40
to +
8520
0050
0PF
M, P
WM
aut
o-sw
itchi
ng, U
VLO
, sof
t sta
rt, p
ower
goo
d in
dica
tor
10-p
in M
SOP,
10-
pin
3 ×
3 DF
NM
CP16
032.
7 to
5.5
0.8
to 4
.0−4
0 to
+85
2000
500
Ove
rtem
pera
ture
and
ove
rcur
rent
pro
tect
ion
5-pi
n TS
OT-
23, 8
-pin
2 ×
3 D
FNM
CP16
122.
7 to
5.5
0.8
to 5
.5−4
0 to
+85
1400
1000
Ove
rall e
fficien
cy >
94%
, Sof
t sta
rt, o
verte
mpe
ratu
re a
nd o
verc
urre
nt p
rote
ctio
n8-
pin
MSO
P, 8
-pin
3 ×
3 D
FNM
IC22
45
2.7
to 5
.5Ad
j.−4
0 to
+12
54,
000
500
LDO
Sta
ndby
Mod
e an
d Lo
w Q
cur
rent
10-p
in 3
× 3
MLF
MIC
2303
02.
7 to
5.5
1.0,
1.2
, 1.5
, 1.8
, Adj
.−4
0 to
+12
58,
000
400
Hype
rLig
ht L
oad®
mod
e6-
pin
1.6
× 1.
6 M
LFM
IC23
031
2.7
to 5
.51.
0, 1
.2, 1
.5, 1
.8, A
dj.
−40
to +
125
4,00
0 40
0 Hy
perL
ight
Loa
d m
ode
6-pi
n 1.
6 ×
1.6
MLF
MIC
2305
02.
7 to
5.5
1.0,
1.2
, 1.8
, 3.3
−40
to +
125
4,00
0 60
0 Hy
perL
ight
Loa
d m
ode
8-pi
n 2
× 2
MLF
MIC
2305
12.
7 to
5.5
1–1.
2, 1
–1.8
, 1.1
5–1.
4,
0.95
–1.2
5−4
0 to
+12
54,
000
600
Hype
rLig
ht L
oad
mod
e8-
pin
2 ×
2 M
LF
MIC
2315
02.
7 to
5.5
1.0,
1.2
, 1.3
5, 1
.8, 3
.3−4
0 to
+12
54,
000
2,00
0 Hy
perL
ight
Loa
d m
ode
8-pi
n 2
× 2
MLF
MIC
2315
32.
7 to
5.5
1.8,
Adj
.−4
0 to
+12
54,
000
2,00
0 Po
wer
Goo
d, H
yppe
rLig
ht L
oad
mod
e10
-pin
2.5
× 2
.5 M
LFM
IC23
155
2.7
to 5
.51.
8, A
dj.
−40
to +
125
3,00
0 2,
000
Pow
er G
ood,
Hyp
perL
ight
Loa
d m
ode
10-p
in 2
.5 ×
2.5
MLF
MIC
2330
32.
7 to
5.5
Adj.
−40
to +
125
4,00
0 3,
000
Pow
er G
ood,
Hyp
perL
ight
Loa
d m
ode
12-p
in 3
× 3
DFN
MIC
2320
12.
7 to
5.5
Adj.
−40
to +
125
2,00
0 2,
000
Pow
er G
ood
12-p
in 3
× 3
DFN
MIC
2202
2.3
to 5
.5Ad
j.−4
0 to
+12
51,
600–
2,50
060
0 10
-pin
MSO
P, 1
0-pi
n 3
× 3
MLF
MIC
2204
2.3
to 5
.5Ad
j.−4
0 to
+12
52,
000
600
10-p
in M
SOP,
10-
pin
3 ×
3 M
LFM
IC22
673
to 5
.5Ad
j.−4
0 to
+12
540
0–1,
500
2,00
0 Po
wer
Goo
d12
-pin
3 ×
3 M
LFM
IC22
072.
7 to
5.5
Adj.
−40
to +
125
2,00
0 3,
000
Pow
er G
ood
12-p
in 3
× 3
MLF
MIC
2208
2.7
to 5
.5Ad
j.−4
0 to
+12
51,
000
3,00
0 Po
wer
Goo
d12
-pin
3 ×
3 M
LFM
IC22
200
2.6
to 5
.5Ad
j.−4
0 to
+12
580
0–1,
200
3,00
0 Po
wer
Goo
d12
-pin
3 ×
3 M
LFM
IC22
400
2.6
to 5
.5Ad
j.−4
0 to
+12
530
0–4,
000
4,00
0 Po
wer
Goo
d12
-pin
3 ×
3 M
LFM
IC22
601
2.6
to 5
.5Ad
j.−4
0 to
+12
54,
000
6,00
0 Po
wer
Goo
d24
-pin
4 ×
4 M
LFM
IC22
602
2.6
to 5
.5Ad
j.−4
0 to
+12
51,
000
6,00
0 Po
wer
Goo
d24
-pin
4 ×
4 M
LFM
IC22
700
2.6
to 5
.5Ad
j.−4
0 to
+12
51,
000
7,00
0 Po
wer
Goo
d24
-pin
4 ×
4 M
LFM
IC22
950
2.6
to 5
.5Ad
j.−4
0 to
+12
540
0–2,
000
10,0
00
Pow
er G
ood
32-p
in 5
× 5
MLF
MCP
1631
14.
4 to
30.
02.
0 to
24.
0−4
0 to
+12
550
010
00PF
M/P
WM
ope
ratio
n, e
nabl
e fu
nctio
n8-
pin
MSO
P, 8
-pin
2 ×
3 T
DFN
MCP
1631
24.
4 to
30.
02.
0 to
24.
0−4
0 to
+12
550
010
00PW
M o
pera
tion,
ena
ble
func
tion
8-pi
n M
SOP,
8-p
in 2
× 3
TDF
NM
CP16
301
4.0
to 3
02.
0 to
15
−40
to +
8550
060
0In
tegr
ated
N-c
hann
el, U
VLO
, Sof
t sta
rt, o
verte
mpe
ratu
re p
rote
ctio
n6-
pin
SOT-
23M
IC24
045
4.5
to 1
90.
64 to
5.2
5−4
0 to
+12
531
0–12
0050
00I2 C
Pro
gram
mab
le, 4
.5V–
19V
Inpu
t, 5A
Ste
p-Do
wn
Conv
erte
r20
-pin
3 ×
3 Q
FNM
CP24
048
4.5
to 1
90.
7 to
3.3
−40
to +
125
310–
1200
4000
0I2 C
Pro
gram
mab
le, 4
.5V–
19V
Inpu
t, 5A
Ste
p-Do
wn
Conv
erte
r20
-pin
3 ×
3 Q
FNTC
105
2.2
to 1
03.
0, 3
.3, 5
.0−4
0 to
+85
300
1000
Low
pow
er s
hutd
own
mod
e5-
pin
SOT-
23A
MIC
2404
64.
5 to
19
0.7
to 3
.3−4
0 to
+12
540
0–79
050
00In
tern
al so
ft-st
art a
nd th
erm
al sh
utdo
wn
prot
ectio
n20
-pin
3 ×
3 Q
FNM
IC24
051
4.5
to 1
9Ad
j.−4
0 to
+12
560
060
00Po
wer
Goo
d, S
oft S
tart,
Arc
hite
ctur
e Re
gulat
ion
Sche
me
28-p
in 5
× 6
QFN
MIC
2405
24.
5 to
19
Adj.
−40
to +
125
600
6000
Pow
er G
ood,
Sof
t Sta
rt, H
yper
Ligh
t Loa
d m
ode
28-p
in 5
× 6
QFN
MIC
2405
34.
5 to
19
Adj.
−40
to +
125
600
9000
Pow
er G
ood,
Sof
t Sta
rt, A
rchi
tect
ure
Regu
latio
n Sc
hem
e28
-pin
5 ×
6 Q
FNM
IC24
054
4.5
to 1
9Ad
j.−4
0 to
+12
560
090
00Po
wer
Goo
d, S
oft S
tart,
Hyp
erLi
ght L
oad
mod
e28
-pin
5 ×
6 Q
FNM
IC24
055
4.5
to 1
9Ad
j.−4
0 to
+12
560
012
000
Pow
er G
ood,
Sof
t Sta
rt, A
rchi
tect
ure
Regu
latio
n Sc
hem
e28
-pin
5 ×
6 Q
FNM
IC24
056
4.5
to 1
9Ad
j.−4
0 to
+12
560
012
000
Pow
er G
ood,
Sof
t Sta
rt, H
yper
Ligh
t Loa
d m
ode
28-p
in 5
× 6
QFN
MIC
2660
14.
5 to
28
Adj.
−40
to +
125
600
6000
Pow
er G
ood,
Sof
t Sta
rt, H
yper
Spe
ed C
ontro
l®ar
chite
ctur
e28
-pin
5 ×
6 Q
FNM
IC26
603
4.5
to 2
8Ad
j.−4
0 to
+12
560
060
00Po
wer
Goo
d, S
oft S
tart,
Hyp
erLi
ght L
oad
mod
e28
-pin
5 ×
6 Q
FNM
IC26
603Z
4.5
to 2
8Ad
j.−4
0 to
+12
560
060
00Po
wer
Goo
d, S
oft S
tart,
Hyp
erLi
ght L
oad
mod
e28
-pin
5 ×
6 Q
FNM
IC26
901
4.5
to 2
8Ad
j.−4
0 to
+12
560
090
00Po
wer
Goo
d, S
oft S
tart,
Hyp
er S
peed
Con
trol a
rchi
tect
ure
28-p
in 5
× 6
QFN
MIC
2690
34.
5 to
28
Adj.
−40
to +
125
600
9000
Pow
er G
ood,
Sof
t Sta
rt, H
yper
Ligh
t Loa
d m
ode
28-p
in 5
× 6
QFN
MIC
2695
04.
5 to
26
Adj.
−40
to +
125
300
1200
0So
ft St
art,
Arch
itect
ure
Regu
latio
n Sc
hem
e: H
yper
Spe
ed C
ontro
l arc
hitec
ture
, The
rmal
Shut
dow
n28
-pin
5 ×
6 Q
FN
Analog and Interface Product Selector Guide 17
POW
ER M
ANAG
EMEN
T: S
ingl
e O
utpu
t Sw
itchi
ng R
egul
ator
s (B
uck)
(Con
tinue
d)
Part
#In
put
Volta
ge
Rang
e (V
)O
utpu
t Vol
tage
(V)
Ope
ratin
g Ju
nctio
n Te
mpe
ratu
re
Rang
e (°C
)
Switc
hing
Fr
eque
ncy
(kH
z)
Out
put
Cur
rent
(m
A)Fe
atur
esPa
ckag
es
MIC
2760
04.
5 to
36
Adj.
−40
to +
125
300
7000
Soft
Star
t, Ar
chite
ctur
e Re
gulat
ion
Sche
me:
Hyp
er S
peed
Con
trol a
rchit
ectu
re, T
herm
al Sh
utdo
wn
28-p
in 5
× 6
QFN
MIC
4680
4 to
34
3.3,
5.0
, Adj
.−4
0 to
+12
520
01,
300
8-pi
n SO
ICM
IC46
814
to 3
0Ad
j.−4
0 to
+12
540
02,
000
8-pi
n SO
ICM
IC46
824
to 3
4Ad
j.−4
0 to
+12
520
02,
000
8-pi
n SO
ICM
IC46
844
to 3
0Ad
j.−4
0 to
+12
520
02,
000
8-pi
n SO
ICM
IC46
854
to 3
0Ad
j.−4
0 to
+12
520
03,
000
7-pi
n SP
AKM
IC28
510
4.5
to 7
5Ad
j.−4
0 to
+12
510
0–50
040
00So
ft St
art,
Arch
itect
ure
Regu
latio
n Sc
hem
e: H
yper
Spe
ed C
ontro
l arc
hitec
ture
, The
rmal
Shut
dow
n28
-pin
5 ×
6 Q
FNM
IC28
511-
14.
6 to
60
Adj.
−40
to +
125
200–
680
3000
Pow
er G
ood,
Sof
t Sta
rt, H
yper
Ligh
t Loa
d® m
ode
24-p
in 3
× 4
FCQ
FNM
IC28
511-
24.
6 to
60
Adj.
−40
to +
125
200–
680
3000
Pow
er G
ood,
Sof
t Sta
rt, H
yper
Spe
ed C
ontro
l arc
hite
ctur
e24
-pin
3 ×
4 F
CQFN
MIC
2851
44.
5 to
75
0.6
to 3
2−4
0 to
+12
527
0–80
050
00Ad
j. So
ft St
art,
Pow
er G
ood,
Inte
rnal
Com
pens
atio
n, E
nabl
e, P
re-b
ias S
tart
Up32
-pin
6 ×
6 V
QFN
MIC
2851
54.
5 to
75
0.6
to 3
2−4
0 to
+12
527
0–80
050
00Ad
j. So
ft St
art,
Pow
er G
ood,
Inte
rnal
Com
pens
atio
n, E
nabl
e, P
re-b
ias S
tart
Up32
-pin
6 ×
6 V
QFN
MIC
2851
2-1
4.6
to 7
0Ad
j.−4
0 to
+12
520
0–68
020
00Po
wer
Goo
d, S
oft S
tart,
Hyp
erLi
ght L
oad
mod
e24
-pin
3 ×
4 F
CQFN
MIC
2851
2-2
4.6
to 7
0Ad
j.−4
0 to
+12
520
0–68
020
00Po
wer
Goo
d, S
oft S
tart,
Hyp
er S
peed
Con
trol a
rchi
tect
ure
24-p
in 3
× 4
FCQ
FNM
IC28
513-
14.
6 to
45
Adj.
−40
to +
125
200–
680
4000
Pow
er G
ood,
Sof
t Sta
rt, H
yper
Spe
ed C
ontro
l arc
hite
ctur
e24
-pin
3 ×
4 F
CQFN
MIC
2851
3-2
4.6
to 4
5Ad
j.−4
0 to
+12
520
0–68
040
00Po
wer
Goo
d, S
oft S
tart,
Hyp
er S
peed
Con
trol a
rchi
tect
ure
24-p
in 3
× 4
FCQ
FNM
IC49
302.
7 to
5.5
Adj.
−40
to +
125
3300
3000
Pow
er G
ood,
Saf
e St
art,
Ther
mal
Shut
dow
n an
d Cu
rrent
Lim
it10
-pin
3 ×
4 D
FNM
IC49
502.
7 to
5.5
Adj.
−40
to +
125
3300
5000
Pow
er G
ood,
Saf
e St
art,
Ther
mal
Shut
dow
n an
d Cu
rrent
Lim
it8-
pin
SOIC
, 10-
pin
3 ×
4 DF
N
POW
ER M
ANAG
EMEN
T: S
ingl
e O
utpu
t Sw
itchi
ng R
egul
ator
s (B
oost
)
Part
#In
put V
olta
ge
Rang
e (V
)O
utpu
t Vo
ltage
(V)
Ope
ratin
g Ju
nctio
n Te
mpe
ratu
re
Rang
e (°C
)
Switc
hing
Fr
eque
ncy
(kH
z)
Out
put
Switc
h C
urre
nt (m
A)Fe
atur
esPa
ckag
es
MCP
1623
/40.
65 to
6.0
2.0
to 5
.5−4
0 to
+85
500
425
Inte
grat
ed s
ynch
rono
us b
oost
regu
lator
, 0.6
5V s
tart-
up v
olta
ge, s
oft s
tart,
true
load
disc
onne
ct6-
pin
SOT-
23, 8
-pin
(2 ×
3) D
FN
MCP
1642
B/D
0.65
to 6
.01.
8 to
5.5
−40
to +
8510
0018
00In
tegr
ated
syn
chro
nous
boo
st re
gulat
or, 0
.65V
sta
rt-up
vol
tage
, sof
t sta
rt, e
nabl
e, p
ower
goo
d ou
tput
, tru
e lo
ad d
iscon
nect
or i
nput
-to-o
utpu
t byp
ass
optio
n8-
pin
MSO
P, 8
-pin
(2 ×
3) D
FN
MCP
1625
1/2
0.82
to 5
.51.
8 to
5.5
−40
to +
8550
065
0Tr
ue lo
ad d
iscon
nect
shu
tdow
n (M
CP16
251)
/Inpu
t to
outp
ut b
ypas
s sh
utdo
wn
(MCP
1625
2)6-
pin
SOT-
23, 8
-pin
(2 ×
3) D
FNM
CP16
40/B
/C/
D0.
65 to
62.
0 to
5.5
−40
to +
8550
080
0In
tegr
ated
syn
chro
nous
boo
st re
gulat
or, 0
.65V
sta
rt-up
vol
tage
, Sof
t sta
rt, T
rue
load
disc
onne
ct o
r inp
ut-
to-o
utpu
t byp
ass
optio
n6-
pin
SOT-
23, 8
-pin
(2 ×
3) D
FN
MCP
1643
0.5
0.6
to 5
.0−4
0 to
+85
1000
1800
True
load
disc
onne
ct, S
hutd
own
8-pi
n M
SOP,
8-p
in (2
× 3
) DFN
MCP
1663
/42.
4 to
5.5
Up to
32
−40
to +
8550
018
00Hi
gh-e
fficien
cy (u
p to
92%
), fix
ed-fr
eque
ncy,
non-
sync
hron
ous,
300
mV
feed
back
for L
ED d
riving
(MCP
1664
)5-
pin
SOT-
23, 8
-pin
(2 ×
3) T
DFN
MCP
1661
/22.
4 to
5.5
5.5
to 3
2−4
0 to
+85
500
1300
Non-
sync
hron
ous,
Sof
t sta
rt, E
nabl
e, 3
00 m
V fe
edba
ck fo
r LED
driv
ing
(MCP
1662
)6-
pin
SOT-
23, 8
-pin
(3 ×
3) T
DFN
MIC
2141
2.5
to 5
.5Up
to 3
7−4
0 to
+85
330
1000
Micr
opow
er b
ost c
onve
rter w
ith c
ontro
l sig
nal in
put t
o pr
opor
tiona
lly a
djus
t out
put v
olta
ge5-
pin
SOT-
23M
IC26
192.
2 to
16
Up to
22
−40
to +
125
1200
350
1.2
MHz
PW
M b
oost
con
verte
r with
OVP
6-pi
n Th
in S
OT-
23M
IC22
902.
4 to
16
Up to
16
−40
to +
125
1200
750
2 m
m ×
2 m
m P
WM
boo
st re
gulat
or w
ith in
tern
al Sc
hottk
y di
ode
2 ×
2 M
LFM
IC26
05/0
63
to 4
0Up
to 6
5−4
0 to
+12
512
00/2
000
800
0.5A
, 1.2
MHz
/2 M
Hz w
ide
inpu
t ran
ge b
oost
with
inte
grat
ed s
witc
h an
d Sc
hottk
y di
ode
2 ×
2 M
LFM
IC21
452.
5 to
5.5
Up to
32
−40
to +
8545
090
0Hi
gh-e
fficien
cy 2
.5W
boo
st c
onve
rter
8-pi
n M
SOP,
3 ×
3 M
LFM
IC25
70/1
2.5
to 1
0Up
to 3
0−4
0 to
+85
2011
00Tw
o-ce
ll/sin
gle-
cell s
witc
hing
regu
lator
8-pi
n SO
IC, 8
-pin
MSO
PM
IC22
882.
5 to
10
Up to
34
−40
to +
125
1200
1200
1A 1
.2 M
Hz P
WM
boo
st c
onve
rter i
n Th
in S
OT-
23 a
nd 2
mm
× 2
mm
MLF
5-pi
n SO
T-23
, 2 ×
2 M
LFM
IC31
722.
5 to
10
Up to
34
−40
to +
8510
012
5010
0 kH
z 1.
25A
switc
hing
regu
lator
s8-
pin
SOIC
, 8-p
in D
IPM
IC22
95/9
62.
5 to
10
Up to
34
−40
to +
125
1200
/600
1700
High
pow
er d
ensit
y 1.
2A b
oost
regu
lator
5-pi
n SO
T-23
, 2 ×
2 M
LFM
IC26
01/0
20.
9 to
15
Up to
36
−40
to +
125
1200
/200
017
001.
2A, 1
.2 M
Hz/2
MHz
wid
e in
put r
ange
inte
grat
ed s
witc
h bo
ost r
egul
ator
2 ×
2 M
LFM
IC22
50/5
14.
5 to
20
Up to
32/
27−4
0 to
+12
5Va
riabl
e20
00Hi
gh-e
fficien
cy lo
w E
MI b
oost
regu
lator
5-pi
n SO
T-23
, 2 ×
2 M
LFM
IC21
724.
5 to
20
Up to
40
−40
to +
8510
020
0010
0 kH
z 1.
25A
switc
hing
regu
lator
8-pi
n DI
P, 8
-pin
SO
ICM
IC22
532.
8 to
6.5
Up to
35
−40
to +
125
1000
3500
3.5A
1 M
Hz h
igh-
efficie
ncy
boos
t reg
ulat
or w
ith O
VP a
nd s
ofts
tart
3 ×
3 M
LFM
IC21
712.
5 to
6Up
to 6
−40
to +
8510
040
0010
0 kH
z 2.
5A s
witc
hing
regu
lator
TO22
0, T
O26
3M
IC28
75/7
62.
5 to
6Up
to 6
−40
to +
125
2000
4800
4.8A
ISW
, syn
chro
nous
boo
st re
gulat
or w
ith b
i-dire
ctio
nal lo
ad d
iscon
nect
2 ×
2 Th
in M
LF
www.microchip.com/analog18
POW
ER M
ANAG
EMEN
T: M
ultip
le O
utpu
t Sw
itchi
ng R
egul
ator
s
Part
#D
escr
iptio
nIn
put
Volta
ge
Rang
e (V
)
Num
ber
of
Out
puts
Out
put V
olta
ge (V
)O
pera
ting
Tem
pera
ture
Ra
nge
(°C)
Con
trol
Sche
me
Switc
hing
Fr
eque
ncy
(kH
z)O
utpu
t Cur
rent
(mA)
Feat
ures
Pack
ages
MIC
4742
2 M
Hz D
ual 2
A In
tegr
ated
Sw
itch
Buck
Re
gulat
or2.
9 to
5.5
2DC
/DC:
0.6
to 5
.5−4
0 to
+12
5PW
M
Mod
e20
00DC
to D
C: 2
,000
/2,0
00 m
A16
-pin
3 ×
3 M
LF, S
SOP
MIC
4744
4 M
Hz D
ual 2
A In
tegr
ated
Sw
itch
Buck
Re
gulat
or2.
9 to
5.5
2DC
/DC:
0.6
to 5
.5−4
0 to
+12
5PW
M
Mod
e40
00DC
to D
C: 2
,000
/2,0
00 m
A16
-pin
3 ×
3 M
LF, S
SOP
MIC
4782
1.8M
Hz
Dual
2A In
tegr
ated
Sw
itch
3 to
6
2DC
/DC:
0.6
1 to
6−4
0 to
+12
5PW
M
Mod
e18
00DC
to D
C: 2
,000
/2,0
00 m
A3
× 3
MLF
MIC
2238
2.5
MHz
Dua
l Pha
se P
WM
Buc
k Re
gulat
or2.
5 to
5.5
21.
28/1
.28,
1.8
/1.2
, 1.
8/1.
545,
1.8
/1.5
75,
1.8/
3.3,
1.8
/1.6
, 2.5
/1.2
, 3.
3/1.
2, 3
.3/3
.3, A
dj./A
dj.
−40
to +
125
PWM
M
ode
2500
0DC
to D
C: 8
00/8
00 m
AAu
tom
atic
switc
hing
into
light
load
mod
e of
ope
ratio
n3
× 3
MLF
MIC
2325
04
MHz
Dua
l Syn
chro
nous
Buc
k Re
gulat
or2.
7 to
5.5
20.
9/1.
1, 1
.2/1
.0, 1
.2/1
.6,
1.2/
1.8,
1.2
/2.8
, 1.2
/3.3
, 1.
575/
1.8,
2.6
/3.3
, Adj
./Adj
.−4
0 to
+12
5PW
M
Mod
e40
00DC
to D
C: 4
00/4
00 m
AW
ith H
yper
Ligh
t Loa
d®m
ode
2 ×
2 M
LF,
2.5
× 2.
5 M
LF
MIC
2325
44
MHz
Dua
l 400
mA
Sync
hron
ous
Buck
Re
gulat
or2.
5 to
5.5
21.
0/1.
8−4
0 to
+12
5PW
M
Mod
e40
00DC
to D
C: 4
00/4
00 m
AW
ith L
ow In
put V
olta
ge a
nd H
yper
Ligh
t Lo
ad m
ode
2 ×
2 M
LF
MIC
2345
03
MHz
, PW
M, 2
A Tr
iple
Buck
Reg
ulat
or2.
7 to
5.5
3DC
/DC:
0.6
2 to
3.3
−40
to +
125
PWM
M
ode
3000
DC to
DC:
2,
000/
2,00
0/2,
000
mA
With
Hyp
erLi
ght L
oad
mod
e an
d Po
wer
G
ood
5 ×
5 Q
FN
MIC
2442
02.
5A D
ual O
utpu
t PW
M S
ynch
rono
us B
uck
Regu
lator
4.5
to 1
52
DC/D
C: 0
.7 to
10.
5−4
0 to
+12
5PW
M
Mod
e10
00DC
to D
C: 2
,500
/2,5
00 m
APo
wer
Goo
d an
d So
ft St
art,
180°
out
of
phas
e op
erat
ion
4 ×
4 Q
FN
MIC
2442
12.
5A D
ual O
utpu
t PW
M S
ynch
rono
us B
uck
Regu
lator
4.5
to 1
52
DC/D
C: 0
.7 to
10.
5−4
0 to
+12
5PW
M
Mod
e50
0DC
to D
C: 2
,500
/2,5
00 m
APo
wer
Goo
d an
d So
ft St
art,
180°
out
of
phas
e op
erat
ion
4 ×
4 Q
FN
MIC
2540
02A
Dua
l Out
put P
WM
Syn
chro
nous
Buc
k Re
gulat
or4.
5 to
13.
22
DC/D
C: 0
.7 to
9.4
−40
to +
125
PWM
M
ode
1000
DC to
DC:
2,0
00/2
,000
mA
180°
out
of p
hase
ope
ratio
n4
× 4
QFN
MIC
2315
83
MHz
PW
M D
ual 2
A Bu
ck R
egul
ator
with
O
utpu
t Aut
o Di
scha
rge
+ B1
53
to 5
.52
DC/D
C: 1
to 3
.3−4
0 to
+12
5PW
M
Mod
e30
00DC
to D
C: 2
,000
/2,0
00 m
AHy
perL
ight
Loa
d m
ode,
Pow
er G
ood
and
Out
put A
uto-
Disc
harg
e 3
× 4
MLF
MIC
2315
93
MHz
PW
M D
ual 2
A Bu
ck R
egul
ator
3
to 5
.52
DC/D
C: 1
to 3
.3−4
0 to
+12
5PW
M
Mod
e30
00DC
to D
C: 2
,000
/2,0
00 m
AHy
perL
ight
Loa
d m
ode
and
Pow
er G
ood
3 ×
4 M
LF
MIC
2345
13
MHz
, 2A
Trip
le Sy
nchr
onou
s Bu
ck
Regu
lator
2.
7 to
5.5
3DC
/DC:
1 to
3.3
−40
to +
125
PWM
M
ode
3000
DC to
DC:
2,
000/
2,00
0/2,
000
mA
Hype
rLig
ht L
oad
mod
e an
d Po
wer
Goo
d4
× 4
QFN
MIC
2230
Dual
Sync
hron
ous
Step
-Dow
n DC
/DC
Regu
lator
2.5
to 5
.52
1.28
/1.6
5, 1
.8/1
.2,
1.8/
1.54
5, 1
.8/1
.575
, 1.
8/3.
3, 1
.8/1
.6, 2
.5/1
.2,
3.3/
1.2,
3.3
/3.3
, Adj
./Adj
.−4
0 to
+12
5PW
M
Mod
e25
00DC
to D
C: 8
00/8
00 m
APo
wer
Goo
d an
d So
ft St
art
3 ×
3 M
LF
MIC
2309
9St
ep-U
p/St
ep-D
own
Regu
lator
s w
ith
Batte
ry M
onito
ring
0.85
to 1
.62
DC/D
C Bo
ost:
1.8
to 3
.3,
DC/D
C Bu
ck 1
to V
out
1−4
0 to
+12
5PW
M
Mod
e10
0 Bo
ost,
1000
Buc
kDC
to D
C Bu
ck:
30m
A,
DC/D
C Bo
ost 2
00 m
AAA
/AAA
Bat
tery
Mon
itorin
g 2.
5 ×
2.5
QFN
MIC
2225
2 M
Hz D
C/DC
Con
verte
r with
LDO
2.
7 to
5.5
2DC
/DC:
1.0
to 4
.5
LDO
: 0.8
to 3
.3−4
0 to
+12
5PW
M
Mod
e20
00DC
to D
C Bu
ck:
600
mA,
LD
O: 3
00 m
AIn
depe
nden
t ena
ble,
>95
% e
fficien
cy2
× 2
MLF
MIC
2306
04
MHz
DC/
DC R
egul
ator
and
LDO
Re
gulat
or
2.7
to 5
.52
DC/D
C: 1
.0 to
4.5
LD
O: 0
.8 to
3.3
−40
to +
125
PWM
M
ode
4000
DC to
DC
Buck
: 60
0 m
A,
LDO
: 300
mA
Flex
ible
sequ
encin
g fe
atur
e2.
5 ×
2.5
MLF
MIC
2800
2 M
Hz D
C/DC
Con
verte
r with
Tw
o Li
near
Re
gulat
ors.
PO
R/Po
wer
Goo
d pi
n an
d LO
WQ
Mod
e2.
7 to
5.5
3DC
/DC:
1.8
to 3
.3
LDO
s: 0
.8 to
3.6
−40
to +
125
PWM
M
ode
2000
DC to
DC
Buck
: 60
0 m
A,
LDO
: 300
/300
mA
POR/
Pow
er G
ood
pin
and
LOW
Q m
ode
3 ×
3 M
LF
MIC
2810
2 M
Hz D
C/DC
Reg
ulat
or w
ith T
wo
Line
ar
Regu
lator
s. L
DO1
has
a se
para
te V
in p
in
and
can
eithe
r pos
t-reg
ulat
e th
e DC
/DC
conv
erte
r or b
e co
nnec
t dire
ctly
to th
e m
ain
inpu
t sup
ply.
POR/
Pow
er G
ood
Pin.
2.7
to 5
.53
DC/D
C: 1
.8 to
3.3
LD
Os:
0.8
to 3
.6−4
0 to
+12
5PW
M
Mod
e20
00DC
to D
C Bu
ck:
600
mA,
LD
O: 3
00/3
00 m
ALD
O1
has
a se
para
te V
IN p
in a
nd c
an
eithe
r pos
t-reg
ulat
e th
e DC
/DC
conv
erte
r 3
× 3
MLF
MIC
2811
2 M
Hz 6
00 m
A DC
/DC
Regu
lator
s w
ith
Trip
le 30
0 m
A LD
Os
2.7
to 5
.54
DC/D
C: 1
.0 to
2.0
LD
Os:
0.8
to 3
.6−4
0 to
+12
5PW
M
Mod
e20
00DC
to D
C Bu
ck:
600
mA,
LD
O: 3
00/3
00/3
00 m
ALD
O1
and
LDO
2 ha
ve s
epar
ate
Vin
3 ×
3 M
LF
MIC
2821
2 M
Hz 6
00 m
A DC
/DC
Regu
lator
s w
ith
Trip
le 30
0 m
A LD
Os
2.7
to 5
.54
DC/D
C: 1
.0 to
2.0
LD
Os:
0.8
to 3
.6−4
0 to
+12
5PW
M
Mod
e20
00DC
to D
C Bu
ck:
600
mA,
LD
O: 3
00/3
00/3
00 m
AIn
depe
nden
t ena
ble
for a
ll fou
r reg
ulat
ors.
3 ×
3 M
LF
MIC
2826
Qua
d O
utpu
t PM
IC w
ith H
yper
Light
Loa
d M
ode
DC/D
C, T
hree
LDO
s an
d I2 C
Con
trol
2.7
to 5
.54
DC/D
C: 1
.0 to
1.8
LD
Os:
0.8
to 3
.3−4
0 to
+12
5PW
M
Mod
e40
00DC
to D
C Bu
ck:
500
mA,
LD
O: 1
50/1
50/1
50 m
AI2 C
Con
trol a
nd D
ynam
ic Vo
ltage
Sca
ling
3 LD
Os
2.5
× 2.
5 M
LF
MIC
2827
Trip
le O
utpu
t PM
IC w
ith H
yper
Ligh
t Loa
d M
ode
DC-D
C, T
wo
LDO
s an
d I²C
Con
trol
2.7
to 5
.53
DC/D
C: 1
.0 to
1.8
LD
Os:
0.8
to 3
.3−4
0 to
+12
5PW
M
Mod
e40
00DC
to D
C Bu
ck:
500
mA,
LD
O: 1
50/1
50 m
AI2 C
Con
trol a
nd D
ynam
ic Vo
ltage
Sca
ling
3 LD
Os
2.5
× 2.
5 M
LF
Analog and Interface Product Selector Guide 19
POW
ER M
ANAG
EMEN
T: M
ultip
le O
utpu
t Sw
itchi
ng R
egul
ator
s (C
ontin
ued)
Part
#D
escr
iptio
nIn
put
Volta
ge
Rang
e (V
)
Num
ber
of
Out
puts
Out
put V
olta
ge (V
)O
pera
ting
Tem
pera
ture
Ra
nge
(°C)
Con
trol
Sche
me
Switc
hing
Fr
eque
ncy
(kH
z)O
utpu
t Cur
rent
(mA)
Feat
ures
Pack
ages
MIC
7400
Confi
gura
ble
Five
-Cha
nnel
Buck
Reg
ulat
or
Plus
One
-Boo
st
2.4
to 5
.56
1.8V
, 1.1
V, 1
.8V,
1.0
5V,
1.25
V, 1
2V o
r Con
figur
able
−40
to +
125
PWM
M
ode
2000
Boo
st,
1300
Buc
ksDC
to D
C Bu
cks:
3,0
00 m
A,
DC/D
C Bo
ost 2
00 m
AHi
ghly
inte
grat
ed c
onfig
urab
le, fe
atur
ing
five
buck
regu
lator
s, o
ne b
oost
regu
lator
an
d gl
obal
pow
er g
ood
indi
cato
r 4.
5 ×
4.5
QFN
MIC
7401
Confi
gura
ble
Five
-Cha
nnel
Buck
Reg
ulat
or
Plus
One
-Boo
st w
ith H
yper
Ligh
t Loa
d m
ode,
I2 C C
ontro
l, an
d En
able
2.4
to 5
.56
1.8V
, 1.1
V, 1
.8V,
1.0
5V,
1.25
V, 1
2V o
r Con
figur
able
−40
to +
125
PWM
M
ode
2000
Boo
st,
1300
Buc
ksDC
to D
C Bu
cks:
3,0
00 m
A,
DC/D
C Bo
ost 2
00 m
AHi
ghly
integ
rate
d co
nfigu
rabl
e, fe
atur
ing fiv
e bu
ck re
gulat
ors,
one
boo
st re
gulat
or, g
lobal
pow
er g
ood
indica
tor a
nd e
nabl
e pi
n4.
5 ×
4.5
QFN
POW
ER M
ANAG
EMEN
T: C
ombi
natio
n Sw
itchi
ng R
egul
ator
s
Part
#D
escr
iptio
nIn
put V
olta
ge
Rang
e (V
)O
utpu
t Vol
tage
(V)
Ope
ratin
g Te
mp.
Ra
nge
(°C)
Con
trol
Sche
me
Switc
hing
Fr
eque
ncy
(kH
z)Ty
pica
l Act
ive
Cur
rent
(mA)
Out
put C
urre
nt (m
A)Fe
atur
esPa
ckag
es
TC13
03Sy
nchr
onou
s Bu
ck R
egul
ator
, LDO
w
ith P
ower
Goo
d2.
7 to
5.5
DC/D
C: 0
.8 to
4.5
LD
O: 1
.5 to
3.3
−40
to +
85PF
M/P
WM
2000
65/6
00DC
/DC:
500
mA
LDO
: 30
0 m
APF
M/P
WM
aut
o-sw
itchi
ng,
Pow
er g
ood
outp
ut10
-pin
MSO
P, 1
0-pi
n 3
× 3
DFN
TC13
04Sy
nchr
onou
s Bu
ck R
egul
ator
, LDO
2.7
to 5
.5DC
/DC:
0.8
to 4
.5
LDO
: 1.5
to 3
.3−4
0 to
+85
PFM
/PW
M20
0065
/600
DC/D
C: 5
00 m
A LD
O:
300
mA
PFM
/PW
M a
uto-
switc
hing
, Po
wer
seq
uenc
ing
10-p
in M
SOP,
10-
pin
3 ×
3 DF
N
TC13
13Sy
nchr
onou
s Bu
ck R
egul
ator
, LDO
2.7
to 5
.5DC
/DC:
0.8
to 4
.5
LDO
: 1.5
to 3
.3−4
0 to
+85
PFM
/PW
M20
0065
/600
DC/D
C: 5
00 m
A LD
O:
300
mA
PFM
/PW
M a
uto-
switc
hing
10-p
in M
SOP,
10-
pin
3 ×
3 DF
N
POW
ER M
ANAG
EMEN
T: I
nduc
torle
ss O
fflin
e Sw
itchi
ng R
egul
ator
s
Part
#Vi
n (V
ac)
Adju
stab
le V
ou
t (V)
Fixe
d Vo
ut (
V)Io
ut M
ax. (
mA)
Load
Reg
ulat
ion
(%/m
A)Pa
ckag
es
SR08
680
–285
9.0–
503.
310
00.
025
8-Le
ad S
OIC
with
Hea
t Slu
gSR
087
80–2
859.
0–50
510
00.
017
8-Le
ad S
OIC
with
Hea
t Slu
gSR
1080
–285
6.0–
286.
0, 1
2, 2
460
–8-
Lead
SO
IC
POW
ER M
ANAG
EMEN
T: P
WM
Con
trolle
rs
Part
#Su
ppor
ted
Topo
logi
esSu
ppor
ted
Out
puts
Inpu
t Vol
tage
Ra
nge
(V)
Out
put
Volta
ge (V
)O
pera
ting
Freq
uenc
y (H
z)O
pera
ting
Tem
p.
Rang
e (°C
)Fe
atur
esPa
ckag
es
MIC
2101
Sync
. Buc
k1
4.5
to 3
80.
8 to
24
200k
to 6
00k
−40
to +
125
Hype
rLig
ht L
oad®
mod
e, E
xter
nal C
lock
Syn
c, P
ower
Goo
d, S
oft S
tart,
In
tern
al Co
mpe
nsat
ion
and
Volta
ge B
ias16
-pin
3 ×
3 M
LF®
MIC
2102
Sync
. Buc
k1
4.5
to 3
80.
8 to
24
200k
to 6
00k
−40
to +
125
Pow
er G
ood,
Sof
t Sta
rt, In
tern
al Co
mpe
nsat
ion
and
Volta
ge B
ias16
-pin
3 ×
3 M
LF
MIC
2103
Sync
. Buc
k1
4.5
to 7
50.
8 to
24
200k
to 6
00k
−40
to +
125
Hype
rLig
ht L
oad
mod
e, E
xter
nal C
lock
syn
c, P
ower
Goo
d, S
oft S
tart,
In
tern
al Co
mpe
nsat
ion
and
Volta
ge B
ias16
-pin
3 ×
3 M
LF
MIC
2104
Sync
. Buc
k1
4.5
to 7
50.
8 to
24
200k
to 6
00k
−40
to +
125
Pow
er G
ood,
Sof
t Sta
rt, In
tern
al Co
mpe
nsat
ion
and
Volta
ge B
ias16
-pin
3 ×
3 M
LF
MIC
2111
BSy
nc. B
uck
13.
3 to
5.5
0.6
to 3
.64
200k
to 2
M−4
0 to
+12
5Po
wer
Goo
d, S
oft S
tart,
Inte
rnal
Volta
ge B
ias,
Enab
le Pi
n, C
urre
nt
Lim
it/Sh
ort C
ircui
t Pro
tect
ion
3 ×
3 Q
FN
MIC
2124
Sync
. Buc
k1
3.0
to 1
80.
8 to
12
300k
−40
to +
125
Soft
Star
t, In
tern
al Vo
ltage
Bias
10-p
in M
SOP
MIC
2130
Sync
. Buc
k1
8.0
to 4
00.
7 to
24
150k
or 4
00k
−40
to +
125
Pow
er G
ood,
Sof
t Sta
rt, In
tern
al Vo
ltage
Bias
16-p
in e
-TSS
OP,
16-
pin
4 ×
4 M
LFM
IC21
31Sy
nc. B
uck
18.
0 to
40
0.7
to 2
415
0k o
r 400
k−4
0 to
+12
5Po
wer
Goo
d, S
oft S
tart,
Inte
rnal
Volta
ge B
ias16
-pin
e-T
SSO
P, 1
6-pi
n 4
× 4
MLF
MIC
2150
Sync
. Buc
k2
4.5
to 1
4.5
0.7
to 5
.550
0k−4
0 to
+12
5Po
wer
Goo
d, S
oft S
tart,
Inte
rnal
Volta
ge B
ias24
-pin
4 ×
4 M
LFM
IC21
51Sy
nc. B
uck
24.
5 to
14.
50.
7 to
5.5
300k
−40
to +
125
Pow
er G
ood,
Sof
t Sta
rt, In
tern
al Vo
ltage
Bias
24-p
in 4
× 4
MLF
MIC
2155
Sync
. Buc
k1
4.5
to 1
4.5
0.7
to 3
.650
0k−4
0 to
+12
5Ex
tern
al Cl
ock
Sync
, Pow
er G
ood,
Sof
t Sta
rt32
-pin
5 ×
5 M
LFM
IC21
64Sy
nc. B
uck
13.
0 to
28
0.8
to 5
.530
0k, 6
00k,
1M
−40
to +
125
Soft
Star
t, In
tern
al Co
mpe
nsat
ion
and
Volta
ge B
ias10
-pin
MSO
PM
IC21
64C
Sync
. Buc
k1
3.0
to 2
80.
8 to
5.5
270k
−40
to +
125
Soft
Star
t, In
tern
al Co
mpe
nsat
ion
and
Volta
ge B
ias10
-pin
MSO
P
MIC
2165
Sync
. Buc
k1
4.5
to 2
80.
8 to
5.5
600k
−40
to +
125
Hype
r Spe
ed C
ontro
l® arc
hite
ctur
e, P
ower
Goo
d, S
oft S
tart,
Inte
rnal
Volta
ge B
ias10
-pin
MSO
P
MIC
2166
Sync
. Buc
k1
4.5
to 2
80.
8 to
5.5
600k
−40
to +
125
Pow
er G
ood,
Sof
t Sta
rt, In
tern
al Co
mpe
nsat
ion
and
Volta
ge B
ias10
-pin
MSO
PM
IC21
68Sy
nc. B
uck
13.
0 to
14.
50.
8 to
5.5
1.0M
−40
to +
125
Soft
Star
t, In
tern
al Co
mpe
nsat
ion
and
Volta
ge B
ias10
-pin
MSO
PM
IC21
69Sy
nc. B
uck
13.
0 to
14.
50.
8 to
5.5
500k
−40
to +
125
Soft
Star
t, In
tern
al Vo
ltage
Bias
10-p
in M
SOP
MIC
2169
ASy
nc. B
uck
13.
0 to
14.
50.
8 to
5.5
500k
−40
to +
125
Soft
Star
t, In
tern
al Vo
ltage
Bias
10-p
in M
SOP
www.microchip.com/analog20
POW
ER M
ANAG
EMEN
T: P
WM
Con
trolle
rs (C
ontin
ued)
Part
#Su
ppor
ted
Topo
logi
esSu
ppor
ted
Out
puts
Inpu
t Vol
tage
Ra
nge
(V)
Out
put
Volta
ge (V
)O
pera
ting
Freq
uenc
y (H
z)O
pera
ting
Tem
p.
Rang
e (°C
)Fe
atur
esPa
ckag
es
MIC
2169
BSy
nc. B
uck
13.
0 to
14.
50.
8 to
5.5
500k
−40
to +
125
Soft
Star
t, In
tern
al Vo
ltage
Bias
10-p
in M
SOP
MIC
2176
Sync
. Buc
k1
4.5
to 7
50.
8 to
24
100k
, 200
k, o
r 300
k−4
0 to
+12
5So
ft St
art,
Inte
rnal
Com
pens
atio
n an
d Vo
ltage
Bias
10-p
in M
SOP
MIC
2182
Sync
. Buc
k1
4.5
to 3
21.
25 to
6.0
300k
−40
to +
85Sk
ip M
ode,
Ext
erna
l Clo
ck S
ync,
Sof
t Sta
rt, In
tern
al Vo
ltage
Bias
16-p
in S
OP.
16-
pin
SSO
PM
IC21
83Sy
nc. B
uck
12.
9 to
14
1.3
to 1
220
0k/4
00k
−40
to +
125
Exte
rnal
Cloc
k Sy
nc, S
oft S
tart,
Inte
rnal
Volta
ge B
ias16
-pin
SO
P. 1
6-pi
n Q
SOP
MIC
2125
Sync
. Buc
k1
4.5
to 2
80.
6 to
24
200k
to 7
50k
−40
to +
125
Hype
rLig
ht L
oad
mod
e, P
ower
Goo
d, S
oft S
tart
(7 m
s), I
nter
nal
Volta
ge B
ias, E
nabl
e Pi
n, C
urre
nt L
imit/
Shor
t Circ
uit P
rote
ctio
n16
-pin
3 ×
3 M
LF
MIC
2126
Sync
. Buc
k1
4.5
to 2
80.
6 to
24
200k
to 7
50k
−40
to +
125
Pow
er G
ood,
Sof
t Sta
rt (7
ms)
, Int
erna
l Vol
tage
Bias
, Ena
ble
Pin,
Cu
rrent
Lim
it/Sh
ort C
ircui
t Pro
tect
ion
16-p
in 3
× 3
MLF
MIC
2128
Sync
. Buc
k1
4.5
to 7
50.
6 to
30
200k
to 8
00k
−40
to +
125
Prog
ram
mab
le so
ft-st
art/f
requ
ency
/cur
rent
-lim
it, In
tern
al co
mpe
nsat
ion
and
volta
ge b
ias
16-p
in 3
× 3
MLF
MIC
2127
ASy
nc. B
uck
14.
5 to
75
0.6
to 3
020
0k to
800
k−4
0 to
+12
5Li
ght l
oad
oper
atio
n, P
rogr
amm
able
frequ
ency
,Cur
rent
Lim
it,
Switc
h ov
er L
DO16
-pin
3 ×
3 M
LF
MIC
2184
Asyn
c. B
uck
12.
9 to
14
1.3
to 1
220
0k/4
00k
−40
to +
125
Exte
rnal
Cloc
k Sy
nc, S
oft S
tart,
Inte
rnal
Volta
ge B
ias16
-pin
SO
P. 1
6-pi
n Q
SOP
MIC
2185
Boos
t, SE
PIC,
Cuk
12.
9 to
14
3.3
to 5
.520
0k/4
00k
−40
to +
85Sk
ip M
ode,
Ext
erna
l Clo
ck S
ync,
Sof
t Sta
rt, In
tern
al Vo
ltage
Bias
16-p
in S
OIC
, 16-
pin
QSO
PM
IC21
86Bo
ost,
SEPI
C, F
lybac
k1
2.9
to 1
43.
3 to
5.5
100/
200/
400k
−40
to +
85Sk
ip M
ode,
Ext
erna
l Clo
ck S
ync,
Sof
t Sta
rt, In
tern
al Vo
ltage
Bias
16-p
in S
OP.
16-
pin
QSO
PM
IC21
93Sy
nc. B
uck
12.
9 to
14
3.3
to 5
.540
0k−4
0 to
+12
5In
tern
al Vo
ltage
Bias
, UVL
O8-
pin
SOIC
MIC
2194
Asyn
c. B
uck
12.
9 to
14
3.3
to 5
.540
0k−4
0 to
+12
5In
tern
al vo
ltage
Bias
, UVL
O, C
urre
nt L
imit/
Shor
t Circ
uit P
rote
ctio
n8-
pin
SOIC
MIC
2196
Boos
t, SE
PIC
12.
9 to
14
3.3
to 5
.540
0k−4
0 to
+12
5In
tern
al vo
ltage
Bias
, UVL
O, C
urre
nt L
imit/
Shor
t Circ
uit P
rote
ctio
n8-
pin
SOIC
MIC
2198
Sync
. Buc
k1
4.5
to 3
20.
8 to
6.0
500k
−40
to +
125
Inte
rnal
volta
ge B
ias, U
VLO
, Cur
rent
Lim
it/Sh
ort C
ircui
t Pro
tect
ion
12-p
in 4
× 4
MLF
MIC
2199
Buck
14.
5 to
32
0.8
to 6
.030
0k−4
0 to
+12
5In
tern
al vo
ltage
Bias
, UVL
O, C
urre
nt L
imit/
Shor
t Circ
uit P
rote
ctio
n12
-pin
4 ×
4 M
LF
MIC
3808
Push
-Pul
l, Ha
lf Br
idge
, Ful
l Br
idge
18.
3 to
15
–Ad
j. to
1M
−40
to +
85So
ft St
art,
Inte
rnal
Volta
ge B
ias, U
VLO
, Cur
rent
Lim
it/Sh
ort C
ircui
t Pr
otec
tion
8-pi
n SO
P, 8
-pin
MSO
P
MIC
3809
Push
-Pul
l, Ha
lf Br
idge
, Ful
l Br
idge
14.
1 to
15
–Ad
j. to
1M
−40
to +
85So
ft St
art,
Inte
rnal
Volta
ge B
ias, U
VLO
, Cur
rent
Lim
it/Sh
ort C
ircui
t Pr
otec
tion
8-pi
n SO
P, 8
-pin
MSO
P
MIC
3838
Push
-Pul
l, Ha
lf Br
idge
, Ful
l Br
idge
18.
3 to
15
–Ad
j. to
1M
−40
to +
85So
ft St
art,
Inte
rnal
Volta
ge B
ias, U
VLO
, Cur
rent
Lim
it/Sh
ort C
ircui
t Pr
otec
tion
10-p
in M
SOP
MIC
3839
Push
-Pul
l, Ha
lf Br
idge
, Ful
l Br
idge
14.
1 to
15
–Ad
j. to
1M
−40
to +
85So
ft St
art,
Inte
rnal
Volta
ge B
ias, U
VLO
, Cur
rent
Lim
it/Sh
ort C
ircui
t Pr
otec
tion
10-p
in M
SOP
MIC
38C4
2Fo
rwar
d, F
lybac
k1
15.5
to 2
0–
Adj.
to 5
00k
−40
to +
85Fo
rwar
d,Fl
ybac
k Su
ppor
ted
Topo
logi
es8-
pin
PDIP
, 14-
pin
PDIP
, 8-p
in M
SOP,
8-
pin
SOIC
, 14-
pin
SOIC
MIC
38C4
3Fo
rwar
d, F
lybac
k1
9.0
to 2
0–
Adj.
to 5
00k
−40
to +
85Fo
rwar
d,Fl
ybac
k Su
ppor
ted
Topo
logi
es8-
pin
PDIP
, 14-
pin
PDIP
, 8-p
in M
SOP,
8-
pin
SOIC
, 14-
pin
SOIC
MIC
38C4
4Fo
rwar
d, F
lybac
k1
15.5
to 2
0–
Adj.
to 5
00k
−40
to +
85Fo
rwar
d,Fl
ybac
k Su
ppor
ted
Topo
logi
es8-
pin
PDIP
, 14-
pin
PDIP
, 8-p
in M
SOP,
8-
pin
SOIC
, 14-
pin
SOIC
MIC
38C4
5Fo
rwar
d, F
lybac
k1
9.0
to 2
0–
Adj.
to 5
00k
−40
to +
85Fo
rwar
d,Fl
ybac
k Su
ppor
ted
Topo
logi
es8-
pin
PDIP
, 14-
pin
PDIP
, 8-p
in M
SOP,
8-
pin
SOIC
, 14-
pin
SOIC
MIC
38HC
42Fo
rwar
d, F
lybac
k1
15.5
to 2
0–
Adj.
to 5
00k
−40
to +
85Fo
rwar
d,Fl
ybac
k Su
ppor
ted
Topo
logi
es8-
pin
PDIP
, 14-
pin
PDIP
, 8-p
in S
OIC
, 14
-pin
SO
IC
MIC
38HC
44Fo
rwar
d, F
lybac
k1
15.5
to 2
0–
Adj.
to 5
00k
−40
to +
85Fo
rwar
d,Fl
ybac
k Su
ppor
ted
Topo
logi
es8-
pin
PDIP
, 14-
pin
PDIP
, 8-p
in S
OIC
, 14
-pin
SO
IC
MIC
38HC
45Fo
rwar
d, F
lybac
k1
9.0
to 2
0–
Adj.
to 5
00k
−40
to +
85Fo
rwar
d,Fl
ybac
k Su
ppor
ted
Topo
logi
es8-
pin
PDIP
, 14-
pin
PDIP
, 8-p
in S
OIC
, 14
-pin
SO
ICM
IC91
30Fo
rwar
d, F
lybac
k1
9.0
to 1
80–
Adj.
to 1
.5M
−40
to +
125
Forw
ard,
Flyb
ack
Supp
orte
d To
polo
gies
, Ext
erna
l Clo
ck S
ync
16-p
in S
OIC
, 16-
pin
QSO
PM
IC91
31Fo
rwar
d, F
lybac
k1
9.0
to 1
80–
Adj.
to 1
M−4
0 to
+12
5Fo
rwar
d,Fl
ybac
k Su
ppor
ted
Topo
logi
es, E
xter
nal C
lock
Syn
c16
-pin
SO
IC, 1
6-pi
n Q
SOP
MCP
1630
Flyb
ack,
Boo
st, S
EPIC
, Cuk
13.
0 to
5.5
–Sy
nc. t
o 1M
−40
to +
125
Exte
rnal
Cloc
k Sy
nc, C
urre
nt L
imit/
Shor
t Circ
uit P
rote
ctio
n8-
pin
2x3
DFN,
8-p
in M
SOP
MCP
1630
VFl
ybac
k, B
oost
, SEP
IC, C
uk1
3.0
to 5
.5–
Sync
. to
1M−4
0 to
+12
5Ex
tern
al Cl
ock
Sync
, Cur
rent
Lim
it/Sh
ort C
ircui
t Pro
tect
ion
8-pi
n 2x
3 DF
N, 8
-pin
MSO
P
MCP
1631
Flyb
ack,
Boo
st, S
EPIC
, Cuk
13.
0 to
5.5
–Sy
nc. t
o 2M
−40
to +
125
Exte
rnal
Cloc
k Sy
nc, C
urre
nt L
imit/
Shor
t Circ
uit P
rote
ctio
n20
-pin
TSS
OP,
20-
pin
SSO
P, 2
0 pi
n 4
× 4
QFN
MCP
1631
VFl
ybac
k, B
oost
, SEP
IC, C
uk1
3.0
to 5
.5–
Sync
. to
2M−4
0 to
+12
5Ex
tern
al Cl
ock
Sync
, Cur
rent
Lim
it/Sh
ort C
ircui
t Pro
tect
ion
20-p
in T
SSO
P, 2
0-SS
OP,
20-
pin
4 ×
4 Q
FNM
CP16
31HV
Flyb
ack,
Boo
st, S
EPIC
, Cuk
13.
5 to
16
–Sy
nc. t
o 2M
−40
to +
125
Exte
rnal
Cloc
k Sy
nc, C
urre
nt L
imit/
Shor
t Circ
uit P
rote
ctio
n20
-pin
TSS
OP,
20-
SSO
PM
CP16
31VH
VFl
ybac
k, B
oost
, SEP
IC, C
uk1
3.5
to 1
6–
Sync
. to
2M−4
0 to
+12
5Ex
tern
al Cl
ock
Sync
, Cur
rent
Lim
it/Sh
ort C
ircui
t Pro
tect
ion
20-p
in T
SSO
P, 2
0-SS
OP
MCP
1632
Flyb
ack,
Boo
st, S
EPIC
, Cuk
13.
0 to
6–
300k
/600
k−4
0 to
+12
5So
ft St
art,
Inte
rnal
Volta
ge B
ias, U
VLO
, Cur
rent
Lim
it/Sh
ort C
ircui
t Pr
otec
tion
8-pi
n M
SOP,
8-p
in 2
× 3
DFN
MCP
1903
5Sy
nc. B
uck
14.
5 to
30
–30
0k/6
00k
−40
to +
125
Pow
er G
ood,
Sof
t Sta
rt, In
tern
al Vo
ltage
Bias
, UVL
O, C
urre
nt
Lim
it/Sh
ort C
ircui
t Pro
tect
ion
10-p
in 3
× 3
DFN
Analog and Interface Product Selector Guide 21
POW
ER M
ANAG
EMEN
T: H
ybrid
PW
M C
ontro
llers
– D
igita
lly E
nhan
ced
Pow
er A
nalo
g
Part
#In
put V
olta
ge
Rang
e (V
)O
utpu
t Vol
tage
(V
)To
polo
gies
Su
ppor
ted
Cha
nnel
sPr
ogra
m M
emor
y Si
ze (k
Wor
ds)
RAM
(b
ytes
)G
PIO
Prod
uct f
eatu
res
inte
grat
ed M
CU
, LD
O, M
OSF
ET d
river
s, 1
0-bi
t AD
C, t
emp
sens
or,
user
-con
figur
able
ope
ratio
n an
d:Pa
ckag
es
MCP
1911
04.
5 to
32
0.5
to 9
0% *
Vin
Sync
. Buc
k1
425
611
Confi
gura
ble
and
dyna
mica
lly c
hang
eabl
e in
tern
al an
alog
com
pens
atio
n ne
twor
k24
-pin
4 ×
4 Q
FN
MCP
1911
14.
5 to
32
0.5
to 9
0% *
Vin
Sync
. Buc
k1
425
614
Confi
gura
ble
and
dyna
mica
lly c
hang
eabl
e in
tern
al an
alog
com
pens
atio
n ne
twor
k an
d a
debu
g in
terfa
ce28
-pin
5 ×
5 Q
FN
MCP
1911
44.
5 to
42
Depe
nden
t on
topo
logy
Boos
t, Fl
ybac
k,
SEPI
C, C
uk1
425
68
Exce
llent
regu
latio
n fo
r con
stan
t cur
rent
app
licat
ions
24-p
in 4
× 4
QFN
MCP
1911
54.
5 to
42
Depe
nden
t on
topo
logy
Boos
t, Fl
ybac
k,
SEPI
C, C
uk1
425
612
Exce
llent
regu
latio
n fo
r con
stan
t cur
rent
app
licat
ions
and
a d
ebug
inte
rface
28-p
in 5
× 5
QFN
MCP
1911
64.
5 to
42
Depe
nden
t on
topo
logy
Boos
t, Fl
ybac
k,
SEPI
C, C
uk1
833
68
Impr
oved
cur
rent
regu
latio
n ac
cura
cy, a
dditio
nal c
ode
spac
e (c
ompa
red
to M
CP19
114
or
MCP
1911
5)24
-pin
4 ×
4 Q
FN
MCP
1911
74.
5 to
42
Depe
nden
t on
topo
logy
Boos
t, Fl
ybac
k,
SEPI
C, C
uk1
833
612
Impr
oved
cur
rent
regu
latio
n ac
cura
cy, a
dditio
nal c
ode
spac
e (c
ompa
red
to M
CP19
114
or
MCP
1911
5) a
nd a
deb
ug in
terfa
ce28
-pin
5 ×
5 Q
FN
MCP
1911
84.
5 to
40
0.5
to 9
0% *
Vin
Sync
. Buc
k1
425
611
Confi
gura
ble
and
dyna
mica
lly c
hang
eabl
e in
tern
al an
alog
com
pens
atio
n ne
twor
k24
-pin
4 ×
4 Q
FN
MCP
1911
94.
5 to
40
0.5
to 9
0% *
Vin
Sync
. Buc
k1
425
614
Confi
gura
ble
and
dyna
mica
lly c
hang
eabl
e in
tern
al an
alog
com
pens
atio
n ne
twor
k an
d a
debu
g in
terfa
ce28
-pin
5 ×
5 Q
FN
MCP
1912
24.
5 to
40
0.3
to 1
6Sy
nc. B
uck
14
256
12Em
ulat
ed a
vera
ge c
urre
nt m
ode
cont
rol,
prog
ram
mab
le ga
in fe
edba
ck a
mpl
ifier,
mul
tipha
se
oper
atio
n, im
prov
ed re
gulat
ion
accu
racy
and
cur
rent
mea
sure
men
t acc
urac
y (C
ompa
red
to
MCP
1911
0/1/
8/9)
24-p
in 4
× 4
QFN
MCP
1912
34.
5 to
40
0.3
to 1
6Sy
nc. B
uck
14
256
16Em
ulat
ed a
vera
ge c
urre
nt m
ode
cont
rol,
prog
ram
mab
le ga
in fe
edba
ck a
mpl
ifier,
mul
tipha
se
oper
atio
n, im
prov
ed re
gulat
ion
accu
racy
and
cur
rent
mea
sure
men
t acc
urac
y (C
ompa
red
to
MCP
1911
0/1/
8/9)
and
a d
ebug
inte
rface
28-p
in 5
× 5
QFN
MCP
1912
44.
5 to
42
Depe
nden
t on
topo
logy
Boos
t, Fl
ybac
k,
SEPI
C, C
uk1
425
68
Dual
inde
pend
ent v
olta
ge a
nd c
urre
nt c
ontro
l loop
s all
ow s
eam
less
trans
itions
from
con
stan
t vo
ltage
to c
onst
ant c
urre
nt re
gulat
ion
24-p
in 4
× 4
QFN
MCP
1912
54.
5 to
42
Depe
nden
t on
topo
logy
Boos
t, Fl
ybac
k,
SEPI
C, C
uk1
425
612
Dual
inde
pend
ent v
olta
ge a
nd c
urre
nt c
ontro
l loop
s all
ow s
eam
less
trans
itions
from
con
stan
t vo
ltage
to c
onst
ant c
urre
nt re
gulat
ion
and
a de
bug
inte
rface
28-p
in 5
× 5
QFN
MCP
1921
44.
5 to
42
Depe
nden
t on
topo
logy
Boos
t, Fl
ybac
k,
SEPI
C, C
uk2
833
68
Dual
chan
nels,
whi
ch c
an b
e co
nfigu
red
to c
ontro
l tw
o ou
tput
s, o
r one
bi-d
irect
iona
l sys
tem
28-p
in 5
× 5
QFN
MCP
1921
54.
5 to
42
Depe
nden
t on
topo
logy
Boos
t, Fl
ybac
k,
SEPI
C, C
uk2
833
612
Dual
chan
nels,
whi
ch c
an b
e co
nfigu
red
to c
ontro
l tw
o ou
tput
s, o
r one
bi-d
irect
iona
l sys
tem
and
a
debu
g in
terfa
ce32
-pin
5 ×
5 Q
FN
POW
ER M
ANAG
EMEN
T: P
ower
Mod
ules
Part
#In
put V
olta
ge
Rang
e (V
)O
utpu
t Vol
tage
(V)
Ope
ratin
g Te
mp.
Ra
nge
(°C)
Con
trol
Sche
me
Switc
hing
Fr
eque
ncy
(kH
z)Vo
ut M
ax.
(V)
Out
put
Cur
rent
(A)
Feat
ures
Pack
ages
MIC
2830
4-1
4.5
to 7
0Ad
j.−4
0 to
+12
5CO
T60
024
3Hy
perL
ight
Loa
d® Mod
e, P
ower
Goo
d, S
oft S
tart
64-p
in 1
2 ×
12 Q
FNM
IC28
304-
24.
5 to
70
Adj.
−40
to +
125
COT
600
243
Hype
r Spe
ed C
ontro
l® Arc
hite
ctur
e, P
ower
Goo
d, S
oft S
tart
64-p
in 1
2 ×
12 Q
FNM
IC45
205-
14.
5 to
26
Adj.
−40
to +
125
COT
200–
600
5.5
6Hy
perL
ight
Loa
d M
ode,
Pow
er G
ood,
Sof
t Sta
rt52
-pin
8 ×
8 Q
FNM
IC45
205-
24.
5 to
26
Adj.
−40
to +
125
COT
200–
600
5.5
6Hy
per S
peed
Con
trol A
rchi
tect
ure,
Pow
er G
ood,
Sof
t Sta
rt52
-pin
8 ×
8 Q
FNM
IC45
208-
14.
5 to
26
Adj.
−40
to +
125
COT
200–
600
5.5
10Hy
perL
ight
Loa
d M
ode,
Pow
er G
ood,
Sof
t Sta
rt52
-pin
10
× 10
QFN
MIC
4520
8-2
4.5
to 2
6Ad
j.−4
0 to
+12
5CO
T20
0–60
05.
510
Hype
r Spe
ed C
ontro
l Arc
hite
ctur
e, P
ower
Goo
d, S
oft S
tart
52-p
in 1
0 ×
10 Q
FNM
IC45
212-
14.
5 to
26
Adj.
−40
to +
125
COT
200–
600
5.5
14Hy
perL
ight
Loa
d M
ode,
Pow
er G
ood,
Sof
t Sta
rt64
-pin
12
× 12
QFN
MIC
4521
2-2
4.5
to 2
6Ad
j.−4
0 to
+12
5CO
T20
0–60
05.
514
Hype
r Spe
ed C
ontro
l Arc
hite
ctur
e, P
ower
Goo
d, S
oft S
tart
64-p
in 1
2 ×
12 Q
FNM
IC33
030
2.7
to 5
.51.
2, 1
.8, A
dj.
−40
to +
125
PWM
8,
000
3.6
0.4
Hype
rLig
ht L
oad
Mod
e10
-pin
2.5
× 2
.0 M
LF®
MIC
3305
02.
7 to
5.5
1.0,
1.2
, 1.8
, 3.3
, Adj
.−4
0 to
+12
5PW
M
4,00
03.
30.
6Hy
perL
ight
Loa
d M
ode
12-p
in 3
× 3
MLF
MIC
3315
32.
7 to
5.5
1.2,
Adj
.−4
0 to
+12
5PW
M
4,00
03.
61.
2Hy
perL
ight
Loa
d M
ode,
Pow
er G
ood,
Sof
t Sta
rt14
-pin
3 ×
3.5
MLF
MIC
3385
2.7
to 5
.51.
5, A
dj.
−40
to +
125
PWM
8,
000
5.5
0.6
Low
Q14
-pin
3 ×
3.5
MLF
MIC
2830
3-1
4.5
to 5
0Ad
j.−4
0 to
+12
5CO
T60
024
3Hy
perL
ight
Loa
d M
ode,
Pow
er G
ood,
Sof
t Sta
rt64
-pin
12
× 12
QFN
MIC
2830
3-2
4.5
to 5
0Ad
j.−4
0 to
+12
5CO
T60
024
3Hy
per S
peed
Con
trol A
rchi
tect
ure,
Pow
er G
ood,
Sof
t Sta
rt64
-pin
12
× 12
QFN
MIC
4511
6-1
4.5
to 2
0Ad
j.−4
0 to
+12
5CO
T60
017
6Hy
perL
ight
Loa
d M
ode,
Pow
er G
ood,
Sof
t Sta
rt52
-pin
8 ×
8 Q
FNM
IC45
116-
24.
5 to
20
Adj.
−40
to +
125
COT
600
176
Hype
r Spe
ed C
ontro
l Arc
hite
ctur
e, P
ower
Goo
d, S
oft S
tart
52-p
in 8
× 8
QFN
MIC
4540
44.
5 to
19
Selec
tabl
e−4
0 to
+12
5Fi
xed
400–
790
3.3
5Po
wer
Goo
d, S
oft S
tart
64-p
in 6
× 1
0 Q
FN
www.microchip.com/analog22
POW
ER M
ANAG
EMEN
T: C
harg
e Pu
mp
DC
-to-
DC
Con
verte
rs
Part
#C
onfig
urat
ion
Inpu
t Vol
tage
Ra
nge
(V)
Out
put
Volta
ge (V
)Ty
pica
l Out
put
Cur
rent
(mA)
Switc
hing
Fr
eque
ncy
(kH
z)
Supp
ly C
urre
nt (I
s,
float
ing
outp
ut µ
A,
25°C
)
Out
put R
esis
tanc
e (Ω
, at t
ypic
al o
utpu
t cu
rrent
, 25°
C)
Pow
er
Con
vers
ion
Effici
ency
(%)
Feat
ures
Pa
ckag
es
Inve
rting
or D
oubl
ing
Cha
rge
Pum
ps
TC68
2In
verte
d do
ublin
g2.
4 to
5.5
−2*V
in10
1218
514
092
% a
t 2.5
mA
–8-
pin
SOIC
and
8-p
in P
DIP
TC12
40A
Doub
ling
2.5
to 5
2*Vi
n20
8055
012
94%
at 5
mA
Shut
dow
n6-
pin
SOT-
23
TC76
60S
Inve
rting
or d
oubl
ing
1.5
to 1
2−V
in o
r 2* V
in20
10 o
r 45
8060
98%
at 1
mA
Boos
t pin
incr
ease
s sw
itchi
ng fr
eque
ncy
8-pi
n SO
IC a
nd 8
-pin
PDI
P
TC76
60H
Inve
rting
or d
oubl
ing
1.5
to 1
0−V
in o
r 2* V
in20
120
1000
5585
% a
t 10
mA
High
-vol
tage
osc
illato
r8-
pin
SOIC
and
8-p
in P
DIP
TC76
62B
Inve
rting
or d
oubl
ing
1.5
to 1
5−V
in o
r 2* V
in20
10 o
r 35
8065
96%
at 1
mA
Boos
t pin
incr
ease
s sw
itchi
ng fr
eque
ncy
8-pi
n SO
IC a
nd 8
-pin
PDI
P
TC76
62A
Inve
rting
or d
oubl
ing
3 to
18
−Vin
or 2
* Vin
4012
190
5097
% a
t 7.5
mA
No lo
w-v
olta
ge te
rmin
al re
quire
d8-
pin
PDIP
TC96
2In
verti
ng o
r dou
blin
g3
to 1
8−V
in o
r 2* V
in80
12 o
r 24
190
3597
% a
t 7.5
mA
Boos
t pin
incr
ease
s sw
itchi
ng fr
eque
ncy
16-p
in S
OIC
, 8-p
in P
DIP
Regu
late
d C
harg
e Pu
mps
MCP
1256
Regu
lated
1.8
to 3
.63.
310
065
023
00N/
A85
% a
t 50
mA
Soft
star
t, sh
utdo
wn,
pow
er g
ood
signa
l an
d sle
ep m
ode
10-p
in M
SOP
and
10-p
in
3 ×
3 DF
N
MCP
1257
Regu
lated
1.8
to 3
.63.
310
065
023
00N/
A85
% a
t 50
mA
Soft
star
t, sh
utdo
wn,
low
bat
tery
war
ning
sig
nal,
and
sleep
mod
e10
-pin
MSO
P an
d 10
-pin
3
× 3
DFN
MCP
1258
Regu
lated
1.8
to 3
.63.
310
065
023
00N/
A85
% a
t 50
mA
Soft
star
t, sh
utdo
wn,
pow
er g
ood
signa
l an
d by
pass
mod
e10
-pin
MSO
P an
d 10
-pin
3
× 3
DFN
MCP
1259
Regu
lated
1.8
to 3
.63.
310
065
023
00N/
A85
% a
t 50
mA
Soft
star
t, sh
utdo
wn,
low
bat
tery
war
ning
sig
nal,
and
bypa
ss m
ode
10-p
in M
SOP
and
10-p
in
3 ×
3 DF
N
MCP
1252
Regu
lated
2.0
to 5
.53.
3, 5
.0, o
r ad
just
able
150
650
60N/
A81
% a
t 10
mA
Shut
dow
n, p
ower
goo
d, re
gulat
ed o
utpu
t, ad
just
able
vers
ion
8-pi
n M
SOP
MCP
1253
Regu
lated
2.0
to 5
.53.
3, 5
.0, o
r ad
just
able
150
1000
60N/
A81
% a
t 10
mA
Shut
dow
n, p
ower
goo
d, re
gulat
ed o
utpu
t, ad
just
able
vers
ion
8-pi
n M
SOP
POW
ER M
ANAG
EMEN
T: C
PU/S
yste
m S
uper
viso
rs
Part
#Ty
peW
atch
dog
Tim
erM
anua
l Re
set
Pow
er
Fail
Ope
ratin
g Te
mp.
Ran
ge
(°C)
Vcc
Rang
e (V
)N
omin
al R
eset
Vol
tage
(V)
Rese
t Typ
eO
utpu
tTy
pica
l Res
et
Puls
e W
idth
(m
s)
Typi
cal
Supp
ly
Cur
rent
(μA)
Pack
ages
MCP
100
Supe
rviso
r–
––
−40
to +
851.
0–5.
52.
7, 3
, 3.1
5, 4
.5, 4
.6, 4
.75,
4.8
5Ac
tive
Low
Push
-Pul
l35
045
3-pi
n SO
T-23
, 3-p
in T
O-9
2M
CP10
1 Su
perv
isor
––
–−4
0 to
+85
1.0–
5.5
2.7,
3, 3
.15,
4.5
, 4.6
, 4.7
5, 4
.85
Activ
e Hi
ghPu
sh-P
ull
350
453-
pin
SOT-
23, 3
-pin
TO
-92
MCP
102
Supe
rviso
r–
––
−40
to +
125
1.0–
5.5
1.95
(I-T
emp)
, 2.4
, 2.7
, 3, 3
.15,
4.5
, 4.
75Ac
tive
Low
Push
-Pul
l12
01
3-pi
n SC
-70,
3-p
in SO
T-23
, 8-
pin
SOIC
150
mil,
3-pi
n TO
-92
MCP
103
Supe
rviso
r–
––
−40
to +
125
1.0–
5.5
1.95
(I-T
emp)
, 2.4
, 2.7
, 3, 3
.15,
4.5
, 4.
75Ac
tive
Low
Push
-Pul
l12
01
3-pi
n SC
-70,
3-p
in S
OT-
23
MCP
120
Supe
rviso
r–
––
−40
to +
851.
0–5.
52.
7, 3
, 3.1
5, 4
.5, 4
.6, 4
.75,
4.8
5Ac
tive
Low
Ope
n-Dr
ain35
045
3-pi
n SO
T-23
, 8-p
in S
OIC
150
m
il, 3-
pin
TO-9
2
MCP
121
Supe
rviso
r–
––
−40
to +
125
1.0–
5.5
1.95
(I-T
emp)
, 2.4
, 2.7
, 3, 3
.15,
4.5
, 4.
75Ac
tive
Low
Ope
n-Dr
ain12
01
3-pi
n SC
-70,
3-p
in S
OT-
23,
8-pi
n SO
IC 1
50 m
il, 3-
pin
TO-9
2
MCP
130
Supe
rviso
r–
––
−40
to +
851.
0–5.
52.
7, 3
, 3.1
5, 4
.5, 4
.6, 4
.75,
4.8
5Ac
tive
Low
Ope
n-Dr
ain35
045
3-pi
n SO
T-23
, 8-p
in S
OIC
150
m
il, 3-
pin
TO-9
2
MCP
131
Supe
rviso
r–
––
−40
to +
125
1.0–
5.5
1.95
(I-T
emp)
, 2.4
, 2.7
, 3, 3
.15,
4.5
, 4.
75Ac
tive
Low
Ope
n-Dr
ain12
01
3-pi
n SC
-70,
3-p
in S
OT-
23,
8-pi
n SO
IC 1
50 m
il, 3-
pin
TO-9
2
MCP
1316
Su
perv
isor
üü
–−4
0 to
+12
51.
0–5.
52.
9, 4
.6,
(2.0
-2.4
V=I-T
emp,
2.4
-4.7
=Ext
) Ac
tive
Low
Push
-Pul
l20
01
5-pi
n SO
T-23
MCP
1316
M
Supe
rviso
rü
ü–
−40
to +
125
1.0–
5.5
2.9,
4.6
, (2
.0-2
.4V=
I-Tem
p, 2
.4-4
.7=E
xt)
Activ
e Lo
wO
pen-
Drain
200
15-
pin
SOT-
23
MCP
1317
Su
perv
isor
üü
–−4
0 to
+12
51.
0–5.
52.
9, 4
.6,
(2.0
-2.4
V=I-T
emp,
2.4
-4.7
=Ext
) Ac
tive
High
Push
-Pul
l20
01
5-pi
n SO
T-23
MCP
1318
Su
perv
isor
ü–
–−4
0 to
+12
51.
0–5.
52.
9, 4
.6,
(2.0
-2.4
V=I-T
emp,
2.4
-4.7
=Ext
) A
ctive
Low
/Hig
h or
Hig
h/Lo
wDu
al O
utpu
t Ope
n-Dr
ain a
nd/o
r Pus
h-Pu
ll20
01
5-pi
n SO
T-23
Analog and Interface Product Selector Guide 23
POW
ER M
ANAG
EMEN
T: C
PU/S
yste
m S
uper
viso
rs (C
ontin
ued)
Part
#Ty
peW
atch
dog
Tim
erM
anua
l Re
set
Pow
er
Fail
Ope
ratin
g Te
mp.
Ran
ge
(°C)
Vcc
Rang
e (V
)N
omin
al R
eset
Vol
tage
(V)
Rese
t Typ
eO
utpu
tTy
pica
l Res
et
Puls
e W
idth
(m
s)
Typi
cal
Supp
ly
Cur
rent
(μA)
Pack
ages
MCP
1318
M
Supe
rviso
rü
––
−40
to +
125
1.0–
5.5
2.9,
4.6
, (2
.0-2
.4V=
I-Tem
p, 2
.4-4
.7=E
xt)
Act
ive L
ow/H
igh
or H
igh/
Low
Dual
Out
put O
pen-
Drain
and
/or P
ush-
Pull
200
15-
pin
SOT-
23
MCP
1319
Su
perv
isor
–ü
–−4
0 to
+12
51.
0–5.
52.
9, 4
.6,
(2.0
-2.4
V=I-T
emp,
2.4
-4.7
=Ext
) A
ctive
Low
/Hig
h or
Hig
h/Lo
wDu
al O
utpu
t Ope
n-Dr
ain a
nd/o
r Pus
h-Pu
ll20
01
5-pi
n SO
T-23
MCP
1319
M
Supe
rviso
r–
ü–
−40
to +
125
1.0–
5.5
2.9,
4.6
, (2
.0-2
.4V=
I-Tem
p, 2
.4-4
.7=E
xt)
Act
ive L
ow/H
igh
or H
igh/
Low
Dual
Out
put O
pen-
Drain
and
/or P
ush-
Pull
200
15-
pin
SOT-
23
MCP
1320
Su
perv
isor
üü
–−4
0 to
+12
51.
0–5.
52.
9, 4
.6, (
2.0–
2.4V
=I-T
emp,
2.
4–4.
7=Ex
t) Ac
tive
Low
Ope
n-Dr
ain20
01
5-pi
n SO
T-23
MCP
1321
Su
perv
isor
ü–
–−4
0 to
+12
51.
0–5.
52.
9, 4
.6, (
2.0–
2.4V
=I-T
emp,
2.
4–4.
7=Ex
t) A
ctive
Low
/Hig
h or
Hig
h/Lo
wDu
al O
utpu
t Ope
n-Dr
ain a
nd/o
r Pus
h-Pu
ll20
01
5-pi
n SO
T-23
MCP
1322
Su
perv
isor
–ü
–−4
0 to
+12
51.
0–5.
52.
9, 4
.6, (
2.0–
2.4V
=I-T
emp,
2.
4–4.
7=Ex
t) A
ctive
Low
/Hig
h or
Hig
h/Lo
wDu
al O
utpu
t Ope
n-Dr
ain a
nd/o
r Pus
h-Pu
ll20
01
5-pi
n SO
T-23
MCP
809
Supe
rviso
r–
––
−40
to +
851.
0–5.
52.
7, 3
.0, 3
.15,
4.5
, 4.6
, 4.7
5, 4
.85
Activ
e Lo
wPu
sh-P
ull
350
453-
pin
SOT-
23M
CP81
0 Su
perv
isor
––
–−4
0 to
+85
1.0–
5.5
2.7,
3.0
, 3.1
5, 4
.5, 4
.6, 4
.75,
4.8
5Ac
tive
High
Push
-Pul
l35
045
3-pi
n SO
T-23
TC12
32
Supe
rviso
rü
ü–
−40
to +
854.
5–5.
54.
5, 4
.75
Act
ive L
ow/H
igh
or H
igh/
Low
Dual
Out
put O
pen-
Drain
and
/or P
ush-
Pull
610
508-
pin
PDIP
, 16-
pin
SOIC
300
m
il, 8-
pin
SOIC
150
mil
TC12
70A
Supe
rviso
r–
ü–
−40
to +
125
1.0–
5.5
2.7,
3, 3
.15,
4.5
, 4.7
5Ac
tive
Low
Push
-Pul
l28
07
4-pi
n SO
T-14
3, 5
-pin
SO
T-23
TC12
70AN
Su
perv
isor
–ü
–−4
0 to
+12
51.
0–5.
52.
7, 3
, 3.1
5, 4
.5, 4
.75
Activ
e Lo
wO
pen-
Drain
280
74-
pin
SOT-
143,
5-p
in S
OT-
23TC
1271
A Su
perv
isor
–ü
–−4
0 to
+12
51.
0–5.
52.
7, 3
, 3.1
5, 4
.5, 4
.75
Activ
e Hi
ghPu
sh-P
ull
280
74-
pin
SOT-
143,
5-p
in S
OT-
23
TC12
72A
Supe
rviso
r–
––
−40
to +
125
1.0–
5.5
4.50
, 4.2
5, 3
.89,
3.0
0, 2
.85,
2.5
5,
2.25
Activ
e Lo
wPu
sh-P
ull
140
123-
pin
SOT-
23
TC32
M
Supe
rviso
rü
––
−40
to +
854.
5–5.
54.
25Ac
tive
Low
Ope
n-Dr
ain50
050
3-pi
n TO
-92,
3-p
in S
OT-
223
TCM
809
Supe
rviso
r–
––
−40
to +
125
1.0–
5.5
4.50
, 4.2
5, 3
.89,
3.0
0, 2
.85,
2.5
5,
2.25
Activ
e Lo
wPu
sh-P
ull
140
123-
pin
SC-7
0, 3
-pin
SO
T-23
TCM
810
Supe
rviso
r–
––
−40
to +
125
1.0–
5.5
4.50
, 4.2
5, 3
.89,
3.0
0, 2
.85,
2.5
5,
2.25
Activ
e Hi
ghPu
sh-P
ull
140
123-
pin
SC-7
0, 3
-pin
SO
T-23
MIC
705
Supe
rviso
rü
üü
−40
to +
851.
5–5.
54.
65Ac
tive
Low
Push
-Pul
l14
030
8-pi
n SO
ICM
IC70
6Su
perv
isor
üü
ü−4
0 to
+85
1.5–
5.5
4.4
Activ
e Lo
wPu
sh-P
ull
140
308-
pin
SOIC
MIC
707
Supe
rviso
r–
–ü
−40
to +
851.
5–5.
54.
65 A
ctive
Low
/Hig
h or
Hig
h/Lo
wPu
sh-P
ull
140
308-
pin
SOIC
MIC
708
Supe
rviso
r–
–ü
−40
to +
851.
5–5.
54.
4 A
ctive
Low
/Hig
h or
Hig
h/Lo
wPu
sh-P
ull
140
308-
pin
SOIC
MIC
803
Supe
rviso
r–
––
−40
to +
125
1.0–
5.5
2.63
, 2.9
3, 3
.00,
3.0
8, 4
.00,
4.1
0,
4.38
, 4.6
3Ac
tive
Low
Ope
n-Dr
ain20
/140
/110
05
3-pi
n SO
T23,
3-p
in S
C70
MIC
809
Supe
rviso
r–
––
−40
to +
851.
4–5.
52.
63, 2
.93,
3.0
8, 4
.00,
4.3
8, 4
.63
Activ
e Lo
wPu
sh-P
ull
140
53-
pin
SOT2
3, 3
-pin
SC7
0M
IC80
9-5
Supe
rviso
r–
ü–
−40
to +
125
1.4–
5.5
2.93
Activ
e Lo
wPu
sh-P
ull
300
3-pi
n SO
T23,
3-p
in S
C70
MIC
810
Supe
rviso
r–
––
−40
to +
851.
4–5.
52.
63, 2
.93,
3.0
8, 4
.00,
4.3
8, 4
.63
Act
ive L
ow/H
igh
or H
igh/
Low
Push
-Pul
l14
05
3-pi
n SO
T23,
3-p
in S
C70
MIC
811
Supe
rviso
r–
ü–
−40
to +
851.
4–5.
52.
63, 2
.93,
3.0
8, 4
.00,
4.3
8, 4
.63
Activ
e Lo
wPu
sh-P
ull
140
5SO
T143
MIC
812
Supe
rviso
r–
ü–
−40
to +
851.
4–5.
52.
63, 2
.93,
3.0
8, 4
.00,
4.3
8, 4
.63
Act
ive L
ow/H
igh
or H
igh/
Low
Push
-Pul
l14
05
SOT1
43
MIC
1810
Supe
rviso
r–
––
−40
to +
851.
5–5.
54.
12, 4
.37,
4.6
2Ac
tive
Low
Push
-Pul
l10
05
3-pi
n SO
T23
MIC
1815
Supe
rviso
r–
––
−40
to +
851.
5–5.
52.
55, 2
.88
Activ
e Lo
wPu
sh-P
ull
100
53-
pin
SOT2
3
MIC
1232
Supe
rviso
rü
––
−40
to +
854.
5–5.
54.
37, 4
.62
Act
ive L
ow/H
igh
or H
igh/
Low
Push
-Pul
l25
018
8-pi
n SO
IC, 8
-pin
PDI
P
MIC
1832
Supe
rviso
rü
ü–
−40
to +
851.
4–5.
52.
55, 2
.88
Act
ive L
ow/H
igh
or H
igh/
Low
Push
-Pul
l25
015
8-pi
n SO
IC, 8
-pin
PDI
P
MIC
2755
Supe
rviso
r–
ü–
−40
to +
851.
5–5.
51.
24Ac
tive
Low
Ope
n-Dr
ain70
02
8-pi
n M
SOP
MIC
2775
Supe
rviso
r–
ü–
−40
to +
851.
5–5.
51.
69, 2
.25,
2.3
4, 2
.53,
2.6
7, 2
.81,
2.
93, 3
.09,
4.4
3, 4
.68
Act
ive L
ow/H
igh
or H
igh/
Low
Push
-Pul
l14
05
5-pi
n SO
T23
MIC
2776
NSu
perv
isor
–ü
–−4
0 to
+85
1.5–
5.5
0.3
Activ
e Lo
wO
pen-
Drain
140
35-
pin
SOT2
3
www.microchip.com/analog24
POW
ER M
ANAG
EMEN
T: C
PU/S
yste
m S
uper
viso
rs (C
ontin
ued)
Part
#Ty
peW
atch
dog
Tim
erM
anua
l Re
set
Pow
er
Fail
Ope
ratin
g Te
mp.
Ran
ge
(°C)
Vcc
Rang
e (V
)N
omin
al R
eset
Vol
tage
(V)
Rese
t Typ
eO
utpu
tTy
pica
l Res
et
Puls
e W
idth
(ms)
Typi
cal
Supp
ly
Cur
rent
(μA)
Pack
ages
MIC
2776
HSu
perv
isor
–ü
–−4
0 to
+85
1.5–
5.5
0.3
Activ
e Hi
ghPu
sh-P
ull
140
35-
pin
SOT2
3M
IC27
76L
Supe
rviso
r–
ü–
−40
to +
851.
5–5.
50.
3Ac
tive
Low
Push
-Pul
l14
03
5-pi
n SO
T23
MIC
2778
Supe
rviso
r–
––
−40
to +
851.
5–5.
51.
24 w
ith a
djus
tabl
e hy
ster
esis
Activ
e Lo
wO
pen-
Drain
140
15-
pin
SOT2
3M
IC27
79H
Supe
rviso
r–
––
−40
to +
851.
5–5.
51.
24 w
ith a
djus
tabl
e hy
ster
esis
Activ
e Hi
ghPu
sh-P
ull
140
15-
pin
SOT2
3M
IC27
79L
Supe
rviso
r–
––
−40
to +
851.
5–5.
51.
24 w
ith a
djus
tabl
e hy
ster
esis
Activ
e Lo
wPu
sh-P
ull
140
15-
pin
SOT2
3M
IC27
85Su
perv
isor
–ü
–−4
0 to
+85
1.5–
5.5
1.62
Activ
e Lo
wPu
sh-P
ull
0.02
55
6-pi
n 1.
2 ×
1.2
QFN
MIC
6315
Supe
rviso
r–
ü–
−40
to +
851.
4–5.
52.
63, 2
.93,
3.0
0, 3
.08,
4.0
0, 4
.10,
4.
38, 4
.63
Activ
e Lo
wO
pen-
Drain
20/1
40/1
100
54-
pin
SOT1
43
MIC
8114
Supe
rviso
r–
ü–
−40
to +
851.
0–5.
53.
08Ac
tive
Low
Push
-Pul
l79
05
4-pi
n SO
T143
MIC
8115
Supe
rviso
r–
ü–
−40
to +
851.
0–5.
53.
08Ac
tive
Low
Push
-Pul
l11
005
4-pi
n SO
T143
MIC
826
Supe
rviso
rü
ü–
−40
to +
125
1.0–
5.5
1.66
5, 2
.188
, 2.3
15, 2
.625
, 2.9
25,
3.07
5, 4
.375
, 4.6
25 A
ctive
Low
/Hig
h or
Hig
h/Lo
wPu
sh-P
ull
140
46-
pin
1.6
× 1.
6 DF
N
MIC
706P
/R/
S/T
Supe
rviso
rü
üü
−40
to +
851.
5–5.
52.
63, 2
.93,
3.0
8Ac
tive
Low
Push
-Pul
l14
030
8-pi
n SO
IC
MIC
708P
/R/
S/T
Supe
rviso
r–
–ü
−40
to +
851.
5–5.
52.
63, 2
.93,
3.0
8 A
ctive
Low
/Hig
h or
Hig
h/Lo
wPu
sh-P
ull
140
308-
pin
SOIC
TC51
De
tect
or–
––
−40
to +
850.
7–10
2.94
, 2.6
5, 2
.16
(1.6
-6V)
Activ
e Lo
wO
pen-
Drain
502
3-pi
n SO
T-23
A
TC54
De
tect
or–
––
−40
to +
850.
7–10
4.21
, 4.1
2, 2
.94,
2.8
4, 2
.65,
2.0
6,
1.37
(1.4
-6V)
Activ
e Lo
wCM
OS
Push
-Pul
l or
Ope
n dr
ain0
13-
pin
SOT-
89, 3
-pin
TO-9
2,
5-pi
n SO
T-23
, 3-p
in SO
T-23
A
MCP
111
Dete
ctor
––
–−4
0 to
+12
51.
0–5.
51.
87(It
emp)
, 2.2
9, 2
.59,
2.8
6, 2
.87,
3.
03, 4
.31,
4.5
6Ac
tive
Low
Ope
n-Dr
ain0
13-
pin
SC-7
0, 3
-pin
SO
T-89
, 3-
pin
SOT-
23, 3
-pin
TO
-92
MCP
112
Dete
ctor
––
–−4
0 to
+12
51.
0–5.
51.
87(It
emp)
, 2.2
9, 2
.59,
2.8
6, 2
.87,
3.
03, 4
.31,
4.5
6Ac
tive
Low
Push
-Pul
l0
13-
pin
SC-7
0, 3
-pin
SO
T-89
, 8-
pin
PDIP
, 3-p
in S
OT-
23,
3-pi
n TO
-92
TC52
De
tect
or–
––
−40
to +
851.
5–10
4.41
, 2.6
5 (1
.5-5
V)Ac
tive
Low
Ope
n-Dr
ain0
35-
pin
SOT-
23
TC53
De
tect
or–
––
−40
to +
851.
5–10
2.84
, 2.6
5, 2
.16
(1.6
-6V,
7V)
Activ
e Lo
wCM
OS
Push
-Pul
l or
Ope
n dr
ain0
25-
pin
SOT-
23
MIC
2772
Dual
–ü
–−4
0 to
+85
1.0–
5.5
2.93
, 3.0
8, 4
.38,
4.6
3Ac
tive
Low
Ope
n-Dr
ain20
/140
/110
010
8-pi
n 2
× 2
MLF
MIC
2774
NDu
al–
ü–
−40
to +
851.
5–5.
51.
69, 2
.25,
2.3
4, 2
.53,
2.6
7, 2
.81,
2.
93, 3
.09,
4.4
3, 4
.68
Activ
e Lo
wO
pen-
Drain
140
3.5
5-pi
n SO
T23
MIC
2774
HDu
al–
ü–
−40
to +
851.
5–5.
51.
69, 2
.25,
2.3
4, 2
.53,
2.6
7, 2
.81,
2.
93, 3
.09,
4.4
3, 4
.68
Activ
e Hi
ghPu
sh-P
ull
140
3.5
5-pi
n SO
T23
MIC
2774
LDu
al–
ü–
−40
to +
851.
5–5.
51.
69, 2
.25,
2.3
4, 2
.53,
2.6
7, 2
.81,
2.
93, 3
.09,
4.4
3, 4
.68
Activ
e Lo
wPu
sh-P
ull
140
3.5
5-pi
n SO
T23
MIC
2777
Dual
––
–−4
0 to
+85
1.5–
5.5
1.69
, 2.2
5, 2
.34,
2.5
3, 2
.67,
2.81
, 2.
93, 3
.09,
4.4
3, 4
.68
Act
ive L
ow/H
igh
or H
igh/
Low
Push
-Pul
l14
03.
55-
pin
SOT2
3
MIC
2782
Push
Bu
tton
–Du
al–
−40
to +
851.
5–5.
5Cu
stom
opt
ions
Activ
e Lo
wO
pen-
Drain
500/
1000
/200
02.
26-
pin
0.8
× 1.
2 CS
P
MIC
2790
Push
Bu
tton
–ü
–−4
0 to
+12
51.
5–5.
50.
4 A
ctive
Low
/Hig
h or
Hig
h/Lo
wDu
al O
utpu
t Ope
n-Dr
ain a
nd/o
r Pus
h-Pu
ll1.
0540
8-pi
n 2
× 2
DFN
MIC
2791
Push
Bu
tton
–ü
–−4
0 to
+12
51.
5–5.
50.
4 A
ctive
Low
/Hig
h or
Hig
h/Lo
wDu
al O
utpu
t Ope
n-Dr
ain a
nd/o
r Pus
h-Pu
ll1.
0540
6-pi
n 1.
6 ×
1.6
DFN
MIC
2793
Push
Bu
tton
–ü
–−4
0 to
+12
51.
5–5.
50.
4 A
ctive
Low
/Hig
h or
Hig
h/Lo
wDu
al O
utpu
t Ope
n-Dr
ain a
nd/o
r Pus
h-Pu
ll1.
0540
8-pi
n 2
× 2
DFN
Analog and Interface Product Selector Guide 25
POW
ER M
ANAG
EMEN
T: P
ower
MO
SFET
Driv
ers
Part
#D
river
sC
onfig
urat
ion
Peak
Out
put
Cur
rent
(s
ourc
e/si
nk, A
)
Max
imum
Su
pply
Vo
ltage
(V)
Out
put
Resi
stan
ce
(sou
rce/
sink
, Ω)
Prop
agat
ion
Del
ay
(Td1
/Td2
, ns)
Rise
/Fal
l Ti
me
(T
r/Tf,
ns)
Cap
aciti
ve L
oad
Driv
eFe
atur
esPa
ckag
es
Low
-Sid
e Po
wer
MO
SFET
Driv
ers
MCP
1401
Sing
leIn
verti
ng0.
5/0.
518
12/1
035
/35
19/1
547
0 pF
in 1
9 ns
Small
foot
prin
t5-
pin
SOT-
23M
CP14
A005
1Si
ngle
Inve
rting
0.5/
0.5
186.
5/4.
540
/31
51/3
910
00 p
F in
40
nsEn
able
pin,
sm
all fo
otpr
int
6-pi
n SO
T-23
, 6-p
in 2
× 2
DFN
MCP
14A0
052
Sing
leNo
n-in
verti
ng0.
5/0.
518
6.5/
4.5
40/3
151
/39
1000
pF
in 4
0 ns
Enab
le pi
n, s
mall
foot
prin
t6-
pin
SOT-
23, 6
-pin
2 ×
2 D
FNM
CP14
02Si
ngle
Non-
inve
rting
0.5/
0.5
1812
/10
35/3
519
/15
470
pF in
19
nsSm
all fo
otpr
int
5-pi
n SO
T-23
TC14
10N
Sing
leNo
n-in
verti
ng0.
5/0.
516
16/1
630
/30
25/2
550
0 pF
in 2
5 ns
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
PDI
PTC
1411
NSi
ngle
Non-
inve
rting
1.0/
1.0
168/
830
/30
25/2
510
00 p
F in
25
ns8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in P
DIP
MIC
4416
Sing
leNo
n-In
verti
ng1.
2/1.
218
3.5/
3.5
42/4
23.
5/3.
510
00 p
F in
24
ns
SOT-
143
MIC
4417
Sing
leIn
verti
ng1.
2/1.
218
3.5/
3.5
37/3
73.
5/3.
510
00 p
F in
24
ns
SOT-
143
TC14
26Du
alIn
verti
ng1.
2/1.
216
12/8
75/7
525
/35
1000
pF
in 3
8 ns
8-pi
n SO
IC, 8
-pin
PDI
PTC
1427
Dual
Non-
inve
rting
1.2/
1.2
1612
/875
/75
25/3
510
00 p
F in
38
ns8-
pin
SOIC
, 8-p
in P
DIP
TC14
28Du
alCo
mpl
imen
tary
1.2/
1.2
1612
/875
/75
25/3
510
00 p
F in
38
ns8-
pin
SOIC
, 8-p
in P
DIP
MIC
4467
Qua
dIn
verti
ng1.
2/1.
218
5/5
35/5
55/
547
0 pF
in 1
4 ns
Latc
h-up
Pro
tect
ed; I
nput
to
–5V
16-p
in W
SOIC
, 14-
pin
PDIP
MIC
4468
Qua
dNo
n-in
verti
ng1.
2/1.
218
5/5
35/5
55/
547
0 pF
in 1
4 ns
Latc
h-up
Pro
tect
ed; I
nput
to
–5V
16-p
in W
SOIC
, 14-
pin
PDIP
MIC
4469
Qua
dCo
mpl
imen
tary
1.2/
1.2
185/
535
/55
5/5
470
pF in
14
nsLa
tch-
up P
rote
cted
; Inp
ut to
–5
V. S
MD
(Milit
ary)
16-p
in W
SOIC
, 14-
pin
PDIP
, 14-
pin
CerD
IP
TC44
67Q
uad
Inve
rting
1.2/
1.2
1810
/10
40/4
015
/15
470
pF in
15
ns16
-pin
SO
IC, 1
4-pi
n PD
IPTC
4468
Qua
dNo
n-in
verti
ng1.
2/1.
218
10/1
040
/40
15/1
547
0 pF
in 1
5 ns
16-p
in S
OIC
, 14-
pin
PDIP
TC44
69Q
uad
Com
plim
enta
ry1.
2/1.
218
10/1
040
/40
15/1
547
0 pF
in 1
5 ns
16-p
in S
OIC
, 14-
pin
PDIP
MCP
14A0
151
Sing
leIn
verti
ng1.
5/1.
518
17/1
041
/32
18.5
/17
1000
pF
in 1
1.5
nsLo
w In
put T
hres
hold
and
En
able
Pin
6-pi
n SO
T-23
, 6-p
in 2
× 2
DFN
MCP
14A0
152
Sing
leNo
n-in
verti
ng1.
5/1.
518
17/1
041
/32
18.5
/17
1000
pF
in 1
1.5
nsLo
w In
put T
hres
hold
and
En
able
Pin
6-pi
n SO
T-23
, 6-p
in 2
× 2
DFN
MCP
1415
Sing
leIn
verti
ng1.
5/1.
518
6/4
41/4
820
/20
470
pF in
13
nsSm
all fo
otpr
int
5-pi
n SO
T-23
MCP
1416
Sing
leNo
n-in
verti
ng1.
5/1.
518
6/4
41/4
820
/20
470
pF in
13
nsSm
all fo
otpr
int
5-pi
n SO
T-23
MIC
4414
Sing
leNo
n-in
verti
ng1.
5/1.
518
3.5/
3.5
12/1
212
/12
1000
pF
in 1
2 ns
Very
sm
all fo
otpr
int
1.2
× 1.
2 Q
FN
MIC
4415
Sing
leIn
verti
ng1.
5/1.
518
3.5/
3.5
12/1
212
/12
1000
pF
in 1
2 ns
Very
sm
all fo
otpr
int
1.2
× 1.
2 Q
FN
TC46
26Si
ngle
Inve
rting
1.5/
1.5
610
/835
/45
33/2
710
00 p
F in
40
nsBo
oste
d dr
ive v
olta
ge16
-pin
SO
IC, 8
-pin
PDI
PTC
4627
Sing
leNo
n-in
verti
ng1.
5/1.
56
10/8
35/4
533
/27
1000
pF
in 4
0 ns
Boos
ted
drive
vol
tage
16-p
in S
OIC
, 8-p
in P
DIP
TC44
04Si
ngle
Inve
rting
1.5/
1.5
187/
740
/60
40/4
010
00 p
F in
30
ns8-
pin
SOIC
, 8-p
in P
DIP
TC44
05Si
ngle
Non-
inve
rting
1.5/
1.5
187/
740
/60
40/4
010
00 p
F in
30
ns8-
pin
SOIC
, 8-p
in P
DIP
MCP
14A0
153
Dual
Inve
rting
1.5/
1.5
184.
5/3
32/2
411
/10
1000
pF
in 1
1.5
ns
Low
Inpu
t Thr
esho
ld a
nd
Enab
le Pi
n8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 3
DFN
MCP
14A0
154
Dual
Non-
inve
rting
1.5/
1.5
184.
5/3
32/2
411
/10
1000
pF
in 1
1.5
ns
Low
Inpu
t Thr
esho
ld a
nd
Enab
le Pi
n8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 3
DFN
MCP
14A0
155
Dual
Com
plim
enta
ry1.
5/1.
518
4.5/
332
/24
11/1
010
00 p
F in
11.
5 ns
Lo
w In
put T
hres
hold
and
En
able
Pin
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
2 ×
3 D
FN
TC44
26A
Dual
Inve
rting
1.5/
1.5
187/
730
/30
25/2
510
00 p
F in
25
ns8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in P
DIP,
8-p
in 6
× 5
DFN
-STC
4427
ADu
alNo
n-in
verti
ng1.
5/1.
518
7/7
30/3
025
/25
1000
pF
in 2
5 ns
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
PDI
P, 8
-pin
6 ×
5 D
FN-S
TC44
28A
Dual
Com
plim
enta
ry1.
5/1.
518
7/7
30/3
025
/25
1000
pF
in 2
5 ns
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
PDI
P, 8
-pin
6 ×
5 D
FN-S
MIC
4426
Dual
Inve
rting
1.5/
1.5
1810
/10
17/2
318
/15
1000
pF
in 1
8 ns
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
PDI
P, 8
-pin
Cer
DIP
MIC
4427
Dual
Non-
inve
rting
1.5/
1.5
1810
/10
17/2
318
/15
1000
pF
in 1
8 ns
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
PDI
P, 8
-pin
Cer
DIP
MIC
4428
Dual
Com
plim
enta
ry1.
5/1.
518
10/1
017
/23
18/1
510
00 p
F in
18
ns8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in P
DIP,
8-p
in C
erDI
PM
IC41
26Du
alIn
verti
ng1.
5/1.
520
10/1
037
/40
13/1
510
00 p
F in
13
ns8-
pin
eSO
IC, 8
-pin
eM
SOP-
8, 3
× 3
www.microchip.com/analog26
POW
ER M
ANAG
EMEN
T: P
ower
MO
SFET
Driv
ers
(Con
tinue
d)
Part
#D
river
sC
onfig
urat
ion
Peak
Out
put
Cur
rent
(s
ourc
e/si
nk, A
)
Max
imum
Su
pply
Vo
ltage
(V)
Out
put
Resi
stan
ce
(sou
rce/
sink
, Ω)
Prop
agat
ion
Del
ay
(Td1
/Td2
, ns)
Rise
/Fal
l Ti
me
(T
r/Tf,
ns)
Cap
aciti
ve L
oad
Driv
eFe
atur
esPa
ckag
es
Low
-Sid
e Po
wer
MO
SFET
Driv
ers
(Con
tinue
d)M
IC41
27Du
alNo
n-in
verti
ng1.
5/1.
520
10/1
037
/40
13/1
510
00 p
F in
13
ns8-
pin
eSO
IC, 8
-pin
eM
SOP-
8, 3
× 3
MIC
4128
Dual
Com
plim
enta
ry1.
5/1.
520
10/1
037
/40
13/1
510
00 p
F in
13
ns8-
pin
eSO
IC, 8
-pin
eM
SOP-
8, 3
× 3
MCP
14E6
Dual
Inve
rting
2.0/
2.0
185/
545
/45
12/1
510
00 p
F in
15
nsEn
able
pin
8-pi
n SO
IC, 8
-pin
PDI
P, 8
-pin
6 ×
5 D
FNM
CP14
E7Du
alNo
n-in
verti
ng2.
0/2.
018
5/5
45/4
512
/15
1000
pF
in 1
5 ns
Enab
le pi
n8-
pin
SOIC
, 8-p
in P
DIP,
8-p
in 6
× 5
DFN
MCP
14E8
Dual
Com
plim
enta
ry2.
0/2.
018
5/5
45/4
512
/15
1000
pF
in 1
5 ns
Enab
le pi
n8-
pin
SOIC
, 8-p
in P
DIP,
8-p
in 6
× 5
DFN
TC14
12Si
ngle
Inve
rting
2.0/
2.0
164/
435
/35
18/1
810
00 p
F in
18
ns8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in P
DIP
TC14
12N
Sing
leNo
n-In
verti
ng2.
0/2.
016
4/4
35/3
518
/18
1000
pF
in 1
8 ns
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
PDI
P
MIC
4478
Dual
Non-
Inve
rting
2.5/
2.5
326/
316
0/70
120/
451,
000p
F in
45
ns
8-pi
n SO
IC
MIC
4479
Dual
Inve
rting
2.5/
2.5
326/
316
0/70
120/
451,
000p
F in
45
ns
8-pi
n SO
IC
MIC
4480
Dual
Com
plim
enta
ry2.
5/2.
532
6/3
160/
7012
0/45
1,00
0pF
in 4
5 ns
8-
pin
SOIC
TC44
23A
Dual
Inve
rting
3.0/
3.0
182.
2/2.
840
/41
12/1
218
00 p
F in
12
ns8-
pin
SOIC
, 16-
pin
SOIC
, 8-p
in P
DIP,
8-p
in 6
× 5
DFN
TC44
24A
Dual
Non-
Inve
rting
3.0/
3.0
182.
2/2.
840
/41
12/1
218
00 p
F in
12
ns8-
pin
SOIC
, 16-
pin
SOIC
, 8-p
in P
DIP,
8-p
in 6
× 5
DFN
TC44
25A
Dual
Com
plim
enta
ry3.
0/3.
018
2.2/
2.8
40/4
112
/12
1800
pF
in 1
2 ns
8-pi
n SO
IC, 1
6-pi
n SO
IC, 8
-pin
PDI
P, 8
-pin
6 ×
5 D
FN
MCP
14E9
Dual
Inve
rting
3.0/
3.0
184/
445
/45
14/1
718
00 p
F in
17
nsEn
able
pin
8-pi
n SO
IC, 8
-pin
PDI
P, 8
-pin
6 ×
5 D
FN
MCP
14E1
0Du
alNo
n-In
verti
ng3.
0/3.
018
4/4
45/4
514
/17
1800
pF
in 1
7 ns
Enab
le pi
n8-
pin
SOIC
, 8-p
in P
DIP,
8-p
in 6
× 5
DFN
MC
P14E
11Si
ngle
Inve
rtin
g3.
0/3.
018
2.2/
1.5
15/1
813
/12
1000
pF
in 1
3 ns
Low
Inpu
t Thr
esho
ld
and
Enab
le P
in8-
pin
MSO
P, 8
-pin
SO
IC, 8
-pin
2 ×
2 W
DFN
TC14
13N
Sing
leNo
n-In
verti
ng3.
0/3.
016
2.7/
2.7
35/3
520
/20
1800
pF
in 2
0 ns
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
PDI
P
MAQ
4123
Dual
Inve
rting
3.0/
3.0
205/
540
/60
11/1
11,
800
pF in
11
ns8-
pin
eSO
IC, 4
× 4
MAQ
4124
Dual
Non-
Inve
rting
3.0/
3.0
205/
540
/60
11/1
11,
800
pF in
11
ns8-
pin
eSO
IC
MAQ
4125
Dual
Com
plim
enta
ry3.
0/3.
020
5/5
40/6
011
/11
1,80
0 pF
in 1
1 ns
8-pi
n eS
OIC
MIC
4123
Dual
Inve
rting
3.0/
3.0
205/
544
/59
11/1
11,
800
pF in
11
ns8-
pin
eSO
IC, 4
× 4
MIC
4124
Dual
Non-
Inve
rting
3.0/
3.0
205/
544
/59
11/1
11,
800
pF in
11
ns8-
pin
eSO
IC, 4
× 4
MIC
4125
Dual
Com
plim
enta
ry3.
0/3.
020
5/5
44/5
911
/11
1,80
0 pF
in 1
1 ns
8-pi
n eS
OIC
, 4 ×
4
MIC
4423
Dual
Inve
rting
3.0/
3.0
185/
533
/38
23/2
51,
800
pF in
23n
s8-
pin
SOIC
, 16-
pin
WSO
IC, 8
-pin
PDI
P
MIC
4424
Dual
Non-
Inve
rting
3.0/
3.0
185/
533
/38
23/2
51,
800
pF in
23n
s8-
pin
SOIC
, 16-
pin
WSO
IC, 8
-pin
PDI
P, 8
-pin
Cer
DIP
MIC
4425
Dual
Com
plim
enta
ry3.
0/3.
018
5/5
33/3
823
/25
1,80
0 pF
in 2
3ns
8-pi
n SO
IC, 1
6-pi
n W
SOIC
, 8-p
in P
DIP
MIC
4223
Dual
Inve
rting
4.0/
4.0
1830
/16
25/3
515
/15
2000
pF
in 1
5 ns
Enab
le pi
n8-
pin
SOIC
, 8-p
in e
MSO
P
MIC
4224
Dual
Non-
Inve
rting
4.0/
4.0
1830
/16
25/3
515
/15
2000
pF
in 1
5 ns
Enab
le pi
n8-
pin
SOIC
, 8-p
in e
MSO
P
MIC
4225
Dual
Com
plim
enta
ry4.
0/4.
018
30/1
625
/35
15/1
520
00 p
F in
15
nsEn
able
pin
8-pi
n SO
IC, 8
-pin
eM
SOP
MCP
14E3
Dual
Inve
rting
4.0/
4.0
182.
5/2.
546
/50
15/1
822
00 p
F in
15
nsEn
able
pin
8-pi
n SO
IC, 8
-pin
PDI
P, 8
-pin
6 ×
5 D
FN
MCP
14E4
Dual
Non-
Inve
rting
4.0/
4.0
182.
5/2.
546
/50
15/1
822
00 p
F in
15
nsEn
able
pin
8-pi
n SO
IC, 8
-pin
PDI
P, 8
-pin
6 ×
5 D
FN
MCP
14E5
Dual
Com
plim
enta
ry4.
0/4.
018
2.5/
2.5
46/5
015
/18
2200
pF
in 1
5 ns
Enab
le pi
n8-
pin
SOIC
, 8-p
in P
DIP,
8-p
in 6
× 5
DFN
MCP
1403
Dual
Inve
rting
4.5/
4.5
182.
2/2.
840
/40
15/1
822
00 p
F in
15
ns8-
pin
SOIC
, 16-
pin
SOIC
, 8-p
in P
DIP,
8-p
in 6
× 5
DFN
MCP
1404
Dual
Non-
Inve
rting
4.5/
4.5
182.
2/2.
840
/40
15/1
822
00 p
F in
15
ns8-
pin
SOIC
, 16-
pin
SOIC
, 8-p
in P
DIP,
8-p
in 6
× 5
DFN
MCP
1405
Dual
Com
plim
enta
ry4.
5/4.
518
2.2/
2.8
40/4
015
/18
2200
pF
in 1
5 ns
8-pi
n SO
IC, 1
6-pi
n SO
IC, 8
-pin
PDI
P, 8
-pin
6 ×
5 D
FN
MCP
14A0
451
Sing
leIn
verti
ng4.
5/4.
518
2.2/
2.6
23/2
6.5
14/1
422
00 p
F in
9.5
ns
Low
Log
ic In
put,
Enab
le8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 2
DFN
MCP
14A0
452
Sing
leNo
n-In
verti
ng4.
5/4.
518
2.2/
2.6
23/2
6.5
14/1
422
00 p
F in
9.5
ns
Low
Log
ic In
put,
Enab
le8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 2
DFN
MIC
4120
Sing
leNo
n-In
verti
ng6.
0/6.
020
5/5
45/5
012
/13
2200
pF
in 1
2 ns
8-pi
n eS
OIC
, 3 ×
3
MIC
4129
Sing
leIn
verti
ng6.
0/6.
020
5/5
45/5
012
/13
2200
pF
in 1
2 ns
8-pi
n eS
OIC
, 3 ×
3
Analog and Interface Product Selector Guide 27
POW
ER M
ANAG
EMEN
T: P
ower
MO
SFET
Driv
ers
(Con
tinue
d)
Part
#D
river
sC
onfig
urat
ion
Peak
Out
put
Cur
rent
(s
ourc
e/si
nk, A
)
Max
imum
Su
pply
Vo
ltage
(V)
Out
put
Resi
stan
ce
(sou
rce/
sink
, Ω)
Prop
agat
ion
Del
ay
(Td1
/Td2
, ns)
Rise
/Fal
l Tim
e (T
r/Tf,
ns)
Cap
aciti
ve L
oad
Driv
eFe
atur
esPa
ckag
es
Low
-Sid
e Po
wer
MO
SFET
Driv
ers
(Con
tinue
d)
MIC
4420
Sing
leNo
n-In
verti
ng6.
0/6.
018
2.8/
2.5
18/4
812
/13
2200
pF
in 1
2 ns
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
PDI
P, 5
-pin
TO
-220
, 8-p
in C
erDI
P
MIC
4429
Sing
leIn
verti
ng6.
0/6.
018
2.8/
2.5
18/4
812
/13
2200
pF
in 1
2 ns
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
PDI
P, 5
-pin
TO
-220
MIC
44F1
8Si
ngle
Non-
Inve
rting
6.
0/6.
013
2/2
15/1
310
/10
1000
pF
In 1
0 ns
Enab
le pi
n8-
pin
eMSO
P, 2
× 2
QFN
MIC
44F1
9Si
ngle
Inve
rting
6.
0/6.
013
2/2
15/1
310
/10
1000
pF
In 1
0 ns
Enab
le pi
n8-
pin
eMSO
P, 2
× 2
QFN
MIC
44F2
0Si
ngle
Inve
rting
6.
0/6.
013
2/2
15/1
310
/10
1000
pF
In 1
0 ns
Enab
le pi
n8-
pin
eMSO
P, 2
× 2
QFN
MCP
1406
Sing
leIn
verti
ng6.
0/6.
018
2.1/
1.5
40/4
020
/20
2500
pF
in 2
0 ns
8-pi
n SO
IC, 8
-pin
PDI
P, 8
-pin
6 ×
5 D
FN
MCP
1407
Sing
leNo
n-In
verti
ng6.
0/6.
018
2.1/
1.5
40/4
020
/20
2500
pF
in 2
0 ns
8-pi
n SO
IC, 8
-pin
PDI
P, 8
-pin
6 ×
5 D
FN
MCP
14A0
601
Sing
leIn
verti
ng6.
0/6.
018
2.0/
2.3
29/2
915
/15
2500
pF
in 1
0 ns
Low
Log
ic In
put,
Enab
le8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 3
DFN
MCP
14A0
602
Sing
leNo
n-In
verti
ng6.
0/6.
018
2.0/
2.3
29/2
915
/15
2500
pF
in 1
0 ns
Low
Log
ic In
put,
Enab
le8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 3
DFN
TC44
21A
Sing
leIn
verti
ng9.
0/9.
018
1.25
/0.8
38/4
228
/26
4700
pF
in 1
5 ns
8-pi
n SO
IC, 8
-pin
PDI
P, 8
-pin
6 ×
5 D
FN
TC44
22A
Sing
leNo
n-In
verti
ng9.
0 / 9
.018
1.25
/ 0.
838
/42
28/2
647
00 p
F in
15
ns8-
pin
SOIC
, 8-p
in P
DIP,
8-p
in 6
× 5
DFN
MIC
4421
ASi
ngle
Inve
rting
9.0
/ 9.0
180.
8/0.
615
/35
20/2
410
,000
pF
in 2
4 ns
8-pi
n PD
IP, 8
-pin
SO
IC, 5
-pin
TO
-220
MIC
4422
ASi
ngle
Non-
Inve
rting
9.0
/ 9.0
180.
8/0.
615
/35
20/2
410
,000
pF
in 2
4 ns
8-pi
n PD
IP, 8
-pin
SO
IC, 5
-pin
TO
-220
MIC
4451
Sing
leIn
verti
ng12
.0/1
2.0
180.
8/0.
625
/40
20/2
410
,000
pF
in 2
4 ns
8-pi
n PD
IP, 8
-pin
SO
IC, 5
-pin
TO
-220
MIC
4452
Sing
leNo
n-In
verti
ng12
.0/1
2.0
180.
8/0.
625
/40
20/2
410
,000
pF
in 2
4 ns
8-pi
n PD
IP, 8
-pin
SO
IC, 5
-pin
TO
-220
TC44
51Si
ngle
Inve
rting
12.0
/12.
018
1.0/
0.9
44/4
430
/32
10,0
00 p
F in
21
ns8-
pin
SOIC
, 8-p
in P
DIP,
8-p
in 6
× 5
DFN
TC44
52Si
ngle
Non-
Inve
rting
12.0
/12.
018
1.0/
0.9
44/4
430
/32
10,0
00 p
F in
21
ns8-
pin
SOIC
, 8-p
in P
DIP,
8-p
in 6
× 5
DFN
MC
P14A
0302
Sing
leN
on-In
vert
ing
3.0/
3.0
182.
2/1.
515
/18
13/1
21,
000
pF in
13
nsLo
w In
put T
hres
hold
an
d En
able
Pin
8-pi
n M
SOP,
8-p
in S
OIC
, 8-p
in 2
× 2
W
DFN
Hig
h-Si
de P
ower
MO
SFET
Driv
ers
TC44
31Hi
gh-S
ide
Sing
leIn
verti
ng3.
0/1.
530
7/7
62/7
825
/33
1000
pF
in 1
5 ns
30V,
hig
h-sid
e dr
iver
8-pi
n SO
IC, 8
-pin
PDI
P
TC44
32Hi
gh-S
ide
Sing
leNo
n-in
verti
ng3.
0/1.
530
7/7
62/7
825
/33
1000
pF
in 1
5 ns
30V,
hig
h-sid
e dr
iver
8-pi
n SO
IC, 8
-pin
PDI
P
TC44
03Fl
oatin
g Lo
ad
Drive
rNo
n-in
verti
ng1.
5/1.
518
2.8/
3.5
33/3
823
/25
1800
pF
in 2
5 ns
Floa
ting
load
driv
er8-
pin
PDIP
MIC
5011
High
-Sid
e or
Lo
w S
ide
Sing
leNo
n-In
verti
ng95
0 μA
*32
N/A
N/A
25 μ
s/4
μs10
00 p
F in
60
µsLe
ss th
an 1
µA
in S
tand
by
Mod
e8-
pin
SOIC
, 8-p
in P
DIP
MIC
5013
High
-Sid
e or
Lo
w S
ide
Sing
leNo
n-In
verti
ng22
5 μA
*32
N/A
N/A
60 μ
s/4
μs10
00 p
F in
60µ
sW
ith o
ver-c
urre
nt
shut
dow
n an
d a
faul
t flag
8-pi
n SO
IC, 8
-pin
PDI
P
MIC
5014
High
-Sid
e or
Lo
w S
ide
Sing
leNo
n-In
verti
ng80
0 μA
*30
N/A
N/A
90 μ
s/6
μs10
00 p
F in
90
µsW
ithst
ands
60V
tran
sient
an
d Re
vers
e ba
ttery
pr
otec
ted
to –
20V
8-pi
n SO
IC, 8
-pin
PDI
P
MIC
5015
High
-Sid
e or
Lo
w S
ide
Sing
leIn
verti
ng80
0 μA
*30
N/A
N/A
90 μ
s/6
μs10
00 p
F in
90
µsW
ithst
ands
60V
tran
sient
an
d Re
vers
e ba
ttery
pr
otec
ted
to –
20V
8-pi
n SO
IC, 8
-pin
PDI
P
MIC
5018
High
-Sid
e or
Lo
w S
ide
Sing
leNo
n-In
verti
ng10
μA*
9N/
AN/
A75
0 μs
/10
μs3,
000
pF in
2.1
ms
Small
Pac
kage
SOT-
143
MIC
5019
High
-Sid
e or
Lo
w S
ide
Sing
leNo
n-In
verti
ng10
μA*
9N/
AN/
A44
0 μs
/5.5
6 μs
3,00
0 pF
in 1
.34
ms
Ultra
Sm
all 1
.2 ×
1.2
mm
DF
N4-
pin
DFN
MIC
5021
High
-Sid
e or
Lo
w S
ide
Sing
leNo
n-In
verti
ng56
00 μ
A*36
N/A
500/
800
400n
s/40
0ns
1,50
0 pF
in 4
00 n
s 10
0 kH
z op
erat
ion
guar
ante
ed o
ver f
ull
tem
pera
ture
and
ope
ratin
g vo
ltage
rang
e8-
pin
SOIC
, 8-p
in P
DIP
MIC
5060
High
-Sid
e or
Lo
w S
ide
Sing
leNo
n-In
verti
ng80
0 μA
*30
N/A
N/A
90 μ
s/6
μs10
00 p
F in
60
µsW
ithst
ands
60V
tran
sient
an
d Re
vers
e ba
ttery
pr
otec
ted
to –
20V
8-pi
n M
LF
www.microchip.com/analog28
POW
ER M
ANAG
EMEN
T: P
ower
MO
SFET
Driv
ers
(Con
tinue
d)
Part
#D
river
sC
onfig
urat
ion
Peak
Out
put
Cur
rent
(s
ourc
e/si
nk, A
)
Max
imum
Su
pply
Vol
tage
(V
)
Out
put
Resi
stan
ce
(sou
rce/
sink
, Ω)
Prop
agat
ion
Del
ay
(Td1
/Td2
, ns)
Rise
/Fal
l Tim
e (T
r/Tf,
ns)
Cap
aciti
ve L
oad
Driv
eFe
atur
esPa
ckag
es
Sync
hron
ous
Pow
er M
OSF
ET D
river
s
MCP
1462
8Ha
lf Br
idge
Driv
er
Dual
Inpu
ts2.
0/3.
55.
5
(36V
Boo
t Pin
)1/
1
(0.5
on
low
sid
e)15
/22
10/1
033
00 p
F in
10
nsCo
ntin
uous
or d
iscon
tinuo
us
oper
atio
n8-
pin
SOIC
, 8-p
in
3 ×
3 DF
N
MCP
1470
0Ha
lf Br
idge
Driv
er
Dual
Inpu
ts2.
0/3.
55.
5
(36V
Boo
t Pin
)1/
1
(0.5
on
low
sid
e)15
/22
10/1
033
00 p
F in
10
nsAl
low
s ex
tern
al de
ad ti
me
cont
rol
8-pi
n SO
IC, 8
-pin
3
× 3
DFN
MIC
4100
Half
Brid
ge D
river
Du
al In
puts
2.0/
2.0
16 (1
00V
Boot
Pi
n)2.
5/2.
027
/27
10/1
010
00 p
F in
27
ns8-
pin
SOIC
MIC
4101
Half
Brid
ge D
river
Du
al In
puts
2.0/
2.0
16 (1
00V
Boot
Pi
n)2.
5/2.
031
/31
10/1
010
00 p
F in
27
ns8-
pin
SOIC
MIC
4102
Half
Brid
ge D
river
Si
gnle
PWN
3.0/
2.0
16 (1
00V
Boot
Pi
n)1.
5/2.
060
/75
10/6
1000
pF
in 2
7 ns
Adap
tive
Dead
Tim
e an
d An
ti-Sh
oot-
Thro
ugh
Circ
uitry
8-
pin
SOIC
MIC
4103
Ha
lf Br
idge
Driv
er
Dual
Inpu
ts3.
0/2.
016
(100
V Bo
ot
Pin)
1.5/
2.0
24/2
410
/610
00 p
F in
27
ns8-
pin
SOIC
MIC
4104
Ha
lf Br
idge
Driv
er
Dual
Inpu
ts3.
0/2.
016
(100
V Bo
ot
Pin)
1.5/
2.0
24/2
410
/610
00 p
F in
27
ns8-
pin
SOIC
MIC
4600
Half
Brid
ge D
river
Du
al In
puts
, Si
ngle
PWM
1.0/
1.0
28V
2.0/
1.5
26/5
515
/13.
510
00 p
F in
26
nsIn
tern
al 5V
LDO
3 ×
3 Q
FN
MIC
4604
Ha
lf Br
idge
Driv
er
Dual
Inpu
ts1.
0/1.
016
V (8
5V B
oot
Pin)
4.4/
4.0
33/3
4 20
/20
1000
pF
in 3
1ns
Small
2.5
× 2
.5 m
m D
FN
8-pi
n SO
IC, 8
-pin
2.
5 ×
2.5
DFN
MIC
4605
Half
Brid
ge D
river
Du
al In
puts
, Si
ngle
PWM
1.0/
1.0
16V
(85V
Boo
t Pi
n)10
/635
/35
20/2
010
00 p
F in
35
nsAd
aptiv
e De
ad T
ime
and
Anti-
Shoo
t-Th
roug
h Ci
rcui
try
8-pi
n SO
IC, 8
-pin
2.
5 ×
2.5
DFN
MIC
4606
Full B
ridge
Driv
erDu
al In
puts
, Si
ngle
PWM
1.0/
1.0
16V
(85V
Boo
t Pi
n)10
/635
/35
20/2
010
00 p
F in
35
nsAd
aptiv
e De
ad T
ime
and
Anti-
Shoo
t-Th
roug
h Ci
rcui
try
4 ×
4 Q
FN
MIC
4607
3 Ph
ase
Drive
rDu
al In
puts
, Si
ngle
PWM
1.0/
1.0
16V
(85V
Boo
t Pi
n)10
/635
/35
20/2
010
00 p
F in
35
nsAd
aptiv
e De
ad T
ime
and
Anti-
Shoo
t-Th
roug
h Ci
rcui
try
4 ×
5 Q
FN, 2
4-pi
n TS
SOP
MIC
4608
Half
Brid
ge D
river
Du
al In
puts
, Si
ngle
PWM
1.0/
1.0
20V
(600
V Bo
ot P
in)
8/9.
245
0/45
031
/31
1150
pF
in 3
5 ns
600V
Ope
ratio
n, S
tate
PIN
14-p
in S
OIC
MIC
4609
3 Ph
ase
Drive
rDu
al In
puts
1.0/
1.0
20V
(600
V Bo
ot P
in)
8/9.
260
0/60
022
/20
1150
pF
in 3
5 ns
600V
Ope
ratio
n28
-wid
e SO
IC
*Cha
rge
pum
p cu
rrent
POW
ER M
ANAG
EMEN
T: B
atte
ry C
harg
ers
Part
#M
ode
Cel
l Typ
e#
of
Cel
lsVc
c Ra
nge
(V)
Cel
l Vol
tage
(V)
Max
imum
C
harg
ing
Cur
rent
(mA)
Max
. Vol
tage
Re
gula
tion
(%)
Int/E
xt
FET
Feat
ures
Pack
ages
MCP
7311
3Li
near
Li-io
n/Li
-Pol
ymer
14
to 1
64.
1, 4
.2, 4
.35,
4.4
1100
±0.5
Int
6.5V
Ove
rvol
tage
Pro
tect
ion
10-p
in 3
× 3
DFN
MCP
7311
4Li
near
Li-io
n/Li
-Pol
ymer
14
to 1
64.
1, 4
.2, 4
.35,
4.4
1100
±0.5
Int
5.8V
Ove
rvol
tage
Pro
tect
ion
10-p
in 3
× 3
DFN
MCP
7312
3Li
near
LiFe
PO4
14
to 1
63.
611
00±0
.5In
t6.
5V O
verv
olta
ge P
rote
ctio
n, L
iFeP
O4
char
ging
10-p
in 3
× 3
DFN
MCP
7321
3Li
near
Li-io
n/Li
-Pol
ymer
24
to 1
68.
2, 8
.4, 8
.7, 8
.811
00±0
.6In
t13
V O
verv
olta
ge P
rote
ctio
n10
-pin
3 ×
3 D
FN
MCP
7322
3Li
near
LiFe
PO4
24
to 1
67.
211
00±0
.6In
t13
V O
verv
olta
ge P
rote
ctio
n, L
iFeP
O4
char
ging
10-p
in 3
× 3
DFN
MCP
7382
6Li
near
Li-Io
n/Li
-Pol
ymer
14.
5 to
5.5
4.1,
4.2
N/A
±1.0
Ext
Small
size
, cha
rge
curre
nt s
et b
y ex
tern
al FE
T6-
pin
SOT-
23
MCP
7382
7Li
near
Li-Io
n/Li
-Pol
ymer
14.
5 to
5.5
4.1,
4.2
N/A
±1.0
Ext
Mod
e in
dica
tor,
Char
ge c
urre
nt m
onito
r, Ch
arge
cur
rent
set
by
exte
rnal
FET
8-pi
n M
SOP
MCP
7382
8Li
near
Li-Io
n/Li
Pol
ymer
14.
5 to
5.5
4.1,
4.2
N/A
±1.0
Ext
Tem
pera
ture
mon
itor,
Char
ge c
urre
nt s
et b
y ex
tern
al FE
T8-
pin
MSO
P
MCP
7384
1Li
near
Li-Io
n/Li
-Pol
ymer
14.
5 to
12
4.1,
4.2
N/A
±0.5
Ext
Safe
ty c
harg
e tim
ers,
Tem
pera
ture
mon
itor,
Char
ge c
urre
nt s
et b
y ext
erna
l FET
10-p
in M
SOP
MCP
7384
1Li
near
Li-Io
n/Li
-Pol
ymer
14.
5 to
12
4.1,
4.2
N/A
±0.5
Ext
Safe
ty c
harg
e tim
ers,
Tem
pera
ture
mon
itor,
Char
ge c
urre
nt s
et b
y
exte
rnal
FET
10-p
in M
SOP
MCP
7384
2Li
near
Li-Io
n/Li
-Pol
ymer
28.
7 to
12
8.2,
8.4
N/A
±0.5
Ext
Safe
ty c
harg
e tim
ers,
Tem
pera
ture
mon
itor,
Char
ge c
urre
nt s
et b
y
exte
rnal
FET
10-p
in M
SOP
Analog and Interface Product Selector Guide 29
POW
ER M
ANAG
EMEN
T: B
atte
ry C
harg
ers
(Con
tinue
d)
Part
#M
ode
Cel
l Typ
e#
of
Cel
lsVc
c Ra
nge
(V)
Cel
l Vol
tage
(V)
Max
imum
C
harg
ing
Cur
rent
(mA)
Max
. Vol
tage
Re
gula
tion
(%)
Int/E
xt
FET
Feat
ures
Pack
ages
MCP
7384
3Li
near
Li-Io
n/Li
-Pol
ymer
14.
5 to
12
4.1,
4.2
N/A
±0.5
Ext
Safe
ty c
harg
e tim
ers,
Cha
rge
curre
nt s
et b
y ex
tern
al FE
T8-
pin
MSO
P
MCP
7384
4Li
near
Li-Io
n/Li
-Pol
ymer
28.
7 to
12
8.2,
8.4
N/A
±0.5
Ext
Safe
ty c
harg
e tim
ers,
Cha
rge
curre
nt s
et b
y ex
tern
al FE
T8-
pin
MSO
P
MCP
7381
1Li
near
Li-Io
n/Li
-Pol
ymer
13.
7 to
6.0
4.2
500
±1.0
Int
Selec
tabl
e ch
arge
cur
rent
(100
mA,
500
mA)
, Cha
rge
enab
le in
put
5-pi
n SO
T-23
MCP
7381
2Li
near
Li-Io
n/Li
Pol
ymer
13.
7 to
6.0
4.2
500
±1.0
Int
Prog
ram
mab
le ch
arge
cur
rent
(100
mA,
500
mA)
, Cha
rge
enab
le in
put
5-pi
n SO
T-23
MCP
7383
0/L
Line
arLi
-Ion/
Li-P
olym
er1
3.75
to 6
.04.
210
00/2
00±0
.75
Int
Soft-
star
t, Ch
arge
ena
ble
pin
6-pi
n 2
× 2
TDFN
MCP
7383
1Li
near
Li-Io
n/Li
-Pol
ymer
13.
7 to
6.0
4.2,
4.3
5, 4
.4, 4
.550
0±0
.75
Int
UVLO
, The
rmal
regu
latio
n, P
rogr
amm
able
char
ge c
urre
nt, T
ri-st
ate
STAT
pin
5-pi
n SO
T-23
, 8-
pin
2 ×
3 DF
N
MCP
7383
2Li
near
Li-Io
n/Li
-Pol
ymer
13.
7 to
6.0
4.2,
4.3
5, 4
.4, 4
.550
0±0
.75
Int
UVLO
, The
rmal
regu
latio
n, P
rogr
amm
able
char
ge c
urre
nt,
Ope
n-dr
ain S
TAT
pin
5-pi
n SO
T-23
, 8-
pin
2 ×
3 DF
N
MCP
7385
3Li
near
Li-Io
n/Li
-Pol
ymer
14.
5 to
5.5
4.1,
4.2
500
±0.5
Int
USB
cont
rol,
Safe
ty c
harg
e tim
ers,
Tem
pera
ture
mon
itor,
Ther
mal
regu
latio
n16
-pin
4 ×
4 Q
FN
MCP
7385
5Li
near
Li-Io
n/Li
-Pol
ymer
14.
5 to
5.5
4.1,
4.2
500
±0.5
Int
USB
cont
rol,
Safe
ty c
harg
e tim
ers,
The
rmal
regu
latio
n10
-pin
3 ×
3 D
FN
MCP
7383
3Li
near
Li-Io
n/Li
-Pol
ymer
13.
7 to
6.0
4.2,
4.3
5, 4
.4, 4
.510
00±0
.75
Int
UVLO
, The
rmal
regu
latio
n, T
herm
istor
inpu
t, LD
O T
est m
ode,
Mul
tiple
Vreg
ou
tput
s, S
afet
y tim
er, P
ower
goo
d ou
tput
10-p
in 3
× 3
DFN
, 10
-pin
MSO
P
MCP
7383
4Li
near
Li-Io
n/Li
-Pol
ymer
13.
7 to
6.0
4.2,
4.3
5, 4
.4, 4
.510
00±0
.75
Int
UVLO
, The
rmal
regu
latio
n, T
herm
istor
inpu
t, LD
O T
est m
ode,
Mul
tiple
Vreg
ou
tput
s, S
afet
y tim
er, T
imer
ena
ble
inpu
t10
-pin
3 ×
3 D
FN,
10-p
in M
SOP
MCP
7383
7Li
near
Li-Io
n/Li
-Pol
ymer
13.
7 to
6.0
4.2,
4.3
5, 4
.4, 4
.510
00±0
.75
Int
Dual
inpu
t (US
B, D
C in
put f
rom
ada
pter
) aut
o-sw
itchi
ng, U
VLO
, The
rmal
regu
latio
n, T
herm
istor
inpu
t, Po
wer
goo
d ou
tput
10-p
in 3
× 3
DFN
, 10
-pin
MSO
P
MCP
7383
8Li
near
Li-Io
n/Li
Pol
ymer
13.
7 to
6.0
4.2,
4.3
5, 4
.4, 4
.510
00±0
.75
Int
Dual
inpu
t (US
B, D
C in
put f
rom
ada
pter
) aut
o-sw
itchi
ng, U
VLO
, The
rmal
regu
latio
n, T
imer
ena
ble
inpu
t10
-pin
3 ×
3 D
FN,
10-p
in M
SOP
MCP
7387
1Li
near
Li-Io
n/Li
-Pol
ymer
13.
75 to
6.0
4.1,
4.2
, 4.3
5, 4
.415
00 (A
/C
Adap
ter)
500
(USB
)±0
.5In
tSi
mul
tane
ous
char
ging
of l
oad
and
batte
ry, L
oad-
depe
nden
t cha
rgin
g, M
ultip
le pr
ogra
mm
able
char
ge c
urre
nts
20-p
in 4
× 4
QFN
, 20
-pin
SSO
P
POW
ER M
ANAG
EMEN
T: H
ot S
wap
Con
trolle
rs
Part
#N
umbe
r of
Out
puts
Inpu
t Vol
tage
Ran
ge
(V)
Latc
h O
ffAu
to R
etry
OVL
OU
VLO
Num
ber o
f Pow
er
Goo
dD
escr
iptio
nPa
ckag
es
MIC
2085
1+2
.3 to
+16
.5ü
–Ad
just
able
Adju
stab
le–
Pin-
Pin
equi
valen
t to
LTC1
642
16-p
in Q
SOP
MIC
2086
1+2
.3 to
+16
.5ü
–Ad
just
able
Adju
stab
le1
Activ
e Hi
ghEx
tra c
ompa
rato
r, cr
owba
r out
, and
CL
disc
harg
e ca
pabi
lity20
-pin
QSO
P
MIC
2582
1+2
.3 to
+13
.2ü
––
Adju
stab
le–
Pin-
Pin
equi
valen
t to
LTC1
422,
dua
l-lev
el fa
ult d
etec
tion
8-pi
n SO
IC
MIC
2583
1+2
.3 to
+13
.2ü
––
Adju
stab
le1
Activ
e Hi
ghDu
al lev
el fa
ult d
etec
tion,
CL
disc
harg
e ca
pabi
lity16
-pin
QSO
P
MIC
2583
R1
+2.3
to +
13.2
–ü
–Ad
just
able
1 Ac
tive
High
Dual
level
faul
t det
ectio
n, C
L di
scha
rge
capa
bility
16-p
in Q
SOP
MIC
2310
1+1
0.8
to +
13.2
üü
Adju
stab
leAd
just
able
1 Ac
tive
High
/Low
Cons
tant
pow
er-li
mit
240-
VA c
ontro
ller
24-p
in T
SSO
P
MIC
2584
2Ch
1: +
2.3
to +
13.2
Ch
2: +
1.0
to +
13.2
ü–
Adju
stab
leAd
just
able
2 Ac
tive
High
Out
put v
olta
ge tr
ackin
g w
ith d
ual-l
evel
faul
t tra
ckin
g16
-pin
TSS
OP
MIC
2587
1+1
0 to
+80
ü–
–Ad
just
able
1 Ac
tive
High
/Low
Pin-
pin
equi
valen
t to
LTC1
641-
18-
pin
SOIC
MIC
2587
R1
+10
to +
80–
ü–
Adju
stab
le1
Activ
e Hi
gh/L
owPi
n-pi
n eq
uiva
lent t
o LT
C164
1-2
8-pi
n SO
IC
MIC
2588
1−1
9 to
−80
ü–
Adju
stab
leAd
just
able
1 Ac
tive
High
/Low
Pin-
pin
equi
valen
t to
LTC1
640,
LT1
640A
, LT4
250
8-pi
n SO
IC
MIC
2594
1−1
9 to
−80
ü–
Adju
stab
leAd
just
able
1 Ac
tive
High
/Low
MIC
2588
with
pro
gram
mab
le UV
LO h
yste
resis
8-pi
n SO
IC
MIC
2595
1−1
9 to
−80
ü–
Adju
stab
leAd
just
able
3 Ac
tive
High
/Low
Stag
gere
d po
wer
goo
d pr
ovid
es lo
ad s
eque
ncin
g, p
rogr
amm
able
UVLO
hys
tere
sis14
-pin
SO
IC
MIC
2595
R1
−19
to −
80–
üAd
just
able
Adju
stab
le3
Activ
e Hi
gh/L
owSt
agge
red
pow
er g
ood
prov
ides
load
seq
uenc
ing,
pro
gram
mab
le UV
LO h
yste
resis
14-p
in S
OIC
www.microchip.com/analog30
POW
ER M
ANAG
EMEN
T: P
ower
Sw
itche
s
Part
#D
escr
iptio
nU
SB P
ort P
ower
Sw
itch
(55
mΩ
)H
igh-
Spee
d U
SB 2
.0 S
witc
hBa
ttery
Cha
rger
Em
ulat
ion
Profi
le8
Resi
stor
Set
C
urre
nt L
imits
Cha
rgin
g In
dica
tor
Out
put
Atta
ch
Det
ectio
n O
utpu
tC
urre
nt
Mea
sure
men
tPo
wer
Al
loca
tion
Inte
rface
Pack
ages
USB
Por
t Pow
er C
ontro
llers
UCS1
001-
1US
B Po
rt Po
wer
Con
trolle
r with
Ch
arge
r Em
ulat
ion
11
9Up
to 2
.4A
ü–
––
Disc
rete
I/O
20-p
in 4
× 4
QFN
UCS1
001-
2US
B Po
rt Po
wer
Con
trolle
r with
Ch
arge
r Em
ulat
ion
11
9Up
to 2
.4A
–ü
––
Disc
rete
I/O
20-p
in 4
× 4
QFN
UCS1
001-
3US
B Po
rt Po
wer
Con
trolle
r with
Ch
arge
r Em
ulat
ion
11
9Up
to 2
.4A
ü–
––
Disc
rete
I/O
20-p
in 4
× 4
QFN
UCS1
001-
4US
B Po
rt Po
wer
Con
trolle
r with
Ch
arge
r Em
ulat
ion
11
9Up
to 2
.4A
–ü
––
Disc
rete
I/O
20-p
in 4
× 4
QFN
UCS1
002-
1Pr
ogra
mm
able
USB
Port
Pow
er
Cont
rolle
r with
Cha
rger
Em
ulat
ion
11
9 +
1 pr
ogra
mm
able
Up to
2.4
Aü
–ü
üI2
C/SM
Bus
20-p
in 4
× 4
QFN
UCS1
002-
2Pr
ogra
mm
able
USB
Port
Pow
er
Cont
rolle
r with
Cha
rger
Em
ulat
ion
11
9 +
1 pr
ogra
mm
able
Up to
2.4
Aü
–ü
üI2 C
/SM
Bus
20-p
in 4
× 4
QFN
UCS1
003-
1Pr
ogra
mm
able
USB
Port
Pow
er
Cont
rolle
r with
Cha
rger
Em
ulat
ion
11
9 +
1 pr
ogra
mm
able
Up to
3A
–ü
üü
I2 C/S
MBu
s20
-pin
4 ×
4 Q
FN
UCS1
003-
2Pr
ogra
mm
able
USB
Port
Pow
er
Cont
rolle
r with
Cha
rger
Em
ulat
ion
11
9Up
to 3
Aü
––
–Di
scre
te I/
O20
-pin
4 ×
4 Q
FN
UCS1
003-
3Pr
ogra
mm
able
USB
Port
Pow
er
Cont
rolle
r with
Cha
rger
Em
ulat
ion
11
9Up
to 3
A–
ü–
–Di
scre
te I/
O20
-pin
4 ×
4 Q
FN
UCS8
1003
Prog
ram
mab
le US
B Po
rt Po
wer
Co
ntro
ller A
utom
otive
11
9 +
1 pr
ogra
mm
able
Up to
3A
–ü
üü
I2 C/S
MBu
s28
-pin
5 ×
5 Q
FN
Cur
rent
Lim
it U
SB P
rote
ctio
n Sw
itche
s
Part
#C
hann
els
Vin R
ange
(V)
Fixe
d C
urre
nt L
imit
(Min
.)Ad
j. C
urre
nt
Lim
it (M
ax.)
Rds(
on)
(mΩ
)C
urre
nt
Lim
ited/
Latc
hed
Reve
rse
Bloc
king
Enab
le L
ogic
ULV
OTh
erm
al
Prot
ectio
nFa
ult
Flag
Cur
rent
M
easu
rem
ent
Pack
ages
UC
S211
4D
ual
2.9–
5.5
3.0A
3.4A
18ü
üAc
tive
Low
, Act
ive
Hig
hü
üü
ü20
-pin
3 ×
3 Q
FN
UCS2
113
Dual
2.9–
5.5
3.0A
3.4A
40ü
üAc
tive
Low,
Act
ive H
igh
üü
üü
20-p
in 4
× 4
QFN
UCS2
112
Dual
2.9–
5.5
3.0A
3.4A
40ü
üAc
tive
Low,
Act
ive H
igh
üü
üü
20-p
in 4
× 4
QFN
MIC
2003
/13
Sing
le2.
5–5.
550
0 m
A, 8
00 m
A, 1
.2A
–70
ü–
–ü
ü–
–5-
pin
SOT2
3, 2
× 2
MIC
2004
/14
Sing
le2.
5–5.
550
0 m
A, 8
00 m
A, 1
.2A
–70
ü–
Activ
e Hi
ghü
ü–
–5-
pin
SOT2
3, 2
× 2
MIC
2005
/15
Sing
le2.
5–5.
550
0 m
A, 8
00 m
A, 1
.2A
–70
ü–
Activ
e Hi
ghü
üü
–5-
pin
SOT2
3, 6
-pin
SO
T23,
2
× 2
MIC
2005
ASi
ngle
2.5–
5.5
500
mA
–17
0ü
–Ac
tive
Low,
Act
ive H
igh
üü
ü–
5-pi
n SO
T23,
6-p
in S
OT2
3
MIC
2009
ASi
ngle
2.5–
5.5
–90
0 m
A17
0ü
–Ac
tive
Low,
Act
ive H
igh
üü
––
6-pi
n SO
T23
MIC
2005
LSi
ngle
2.5–
5.5
500
mA,
800
mA,
1.2
A–
70ü
–Ac
tive
Low
üü
ü–
5-pi
n SO
T23
MIC
2007
/17
Sing
le2.
5–5.
5–
2.0A
100
ü–
Activ
e Hi
ghü
ü–
–6-
pin
SOT2
3, 2
× 2
MIC
2008
/18
Sing
le2.
5–5.
5–
2.0A
70ü
–Ac
tive
High
üü
––
6-pi
n SO
T23,
2 ×
2
MIC
2009
/19
Sing
le2.
5–5.
5–
2.0A
70ü
–Ac
tive
High
üü
ü–
6-pi
n SO
T23,
2 ×
2
MIC
2025
-1Si
ngle
2.7–
5.5
500
mA
–14
0ü
üAc
tive
High
üü
ü–
8-pi
n SO
IC, 8
-pin
MSO
P
MIC
2025
-2Si
ngle
2.7–
5.5
500
mA
–14
0ü
üAc
tive
Low
üü
ü–
8-pi
n SO
IC, 8
-pin
MSO
P
MIC
2026
-1Du
al2.
7–5.
550
0 m
A–
90ü
üAc
tive
High
üü
ü–
8-pi
n SO
IC, 8
-pin
PDI
P
MIC
2026
-2Du
al2.
7–5.
550
0 m
A–
90ü
üAc
tive
Low
üü
ü–
8-pi
n SO
IC, 8
-pin
PDI
P
*Red
uced
Heig
ht P
acka
ge
Analog and Interface Product Selector Guide 31
POW
ER M
ANAG
EMEN
T: P
ower
Sw
itche
s (C
ontin
ued)
Part
#C
hann
els
Vin R
ange
(V)
Fixe
d C
urre
nt L
imit
(Min
.)Ad
j. C
urre
nt L
imit
(Max
.)Rd
s(o
n)
(mΩ
)C
urre
nt
Lim
ited/
Latc
hed
Reve
rse
Bloc
king
Enab
le L
ogic
ULV
OTh
erm
al
Prot
ectio
nFa
ult
Flag
Cur
rent
M
easu
rem
ent
Pack
ages
Cur
rent
Lim
it U
SB P
rote
ctio
n Sw
itche
s (C
ontin
ued)
MIC
2026
A-1
Dual
2.7–
5.5
500
mA
–10
0ü
üAc
tive
High
üü
ü–
8-pi
n SO
IC
MIC
2026
A-2
Dual
2.7–
5.5
500
mA
–10
0ü
üAc
tive
Low
üü
ü–
8-pi
n SO
IC
MIC
2027
-1Q
uad
2.7–
5.5
500
mA
–15
0ü
üAc
tive
High
üü
ü–
16-p
in S
OIC
, 16-
pin
WSO
IC
MIC
2027
-2Q
uad
2.7–
5.5
500
mA
–15
0ü
üAc
tive
Low
üü
ü–
16-p
in S
OIC
, 16-
pin
WSO
IC
MIC
2033
Sing
le2.
5–5.
547
5 m
A, 5
17 m
A, 7
60
mA,
950
mA,
1.1
4A–
125
ü–
Activ
e Lo
w,
Activ
e Hi
ghü
üü
–6-
pin
SOT-
23, 6
-pin
DFN
*
MIC
2039
Sing
le2.
5–5.
5–
2.5A
75ü
–Ac
tive
Low,
Ac
tive
High
üü
ü–
6-pi
n SO
T-23
, 2 ×
2*
MIC
2040
-1Si
ngle
0.8–
5.5
–1.
5A75
üü
Activ
e Hi
ghü
üü
–10
-pin
MSO
P
MIC
2040
-2Si
ngle
0.8–
5.5
–1.
5A75
üü
Activ
e Lo
wü
üü
–10
-pin
MSO
P
MIC
2041
-1Si
ngle
0.8–
5.5
–1.
5A75
Latc
hed
üAc
tive
High
üü
ü–
10-p
in M
SOP
MIC
2041
-2Si
ngle
0.8–
5.5
–1.
5A75
Latc
hed
üAc
tive
Low
üü
ü–
10-p
in M
SOP
MIC
2042
-1Si
ngle
0.8–
5.5
–3.
0A60
üü
Activ
e Hi
ghü
üü
–8-
pin
SOIC
, 14-
pin
TSSO
P
MIC
2042
-2Si
ngle
0.8–
5.5
–3.
0A60
üü
Activ
e Lo
wü
üü
–8-
pin
SOIC
, 14-
pin
TSSO
P
MIC
2043
-1Si
ngle
0.8–
5.5
–3.
0A60
Latc
hed
üAc
tive
High
üü
ü–
8-pi
n SO
IC, 1
4-pi
n TS
SOP
MIC
2043
-2Si
ngle
0.8–
5.5
–3.
0A60
Latc
hed
üAc
tive
Low
üü
ü–
8-pi
n SO
IC, 1
4-pi
n TS
SOP
MIC
2044
-1Si
ngle
0.8–
5.5
–6.
0A30
üü
Activ
e Hi
ghü
üü
–16
-pin
TSS
OP
MIC
2044
-2Si
ngle
0.8–
5.5
–6.
0A30
üü
Activ
e Lo
wü
üü
–16
-pin
TSS
OP
MIC
2045
-1Si
ngle
0.8–
5.5
–6.
0A30
Latc
hed
üAc
tive
High
üü
ü–
16-p
in T
SSO
P
MIC
2045
-2Si
ngle
0.8–
5.5
–6.
0A30
Latc
hed
üAc
tive
Low
üü
ü–
16-p
in T
SSO
P
MIC
2075
-1Si
ngle
2.7–
5.5
500
mA
–14
0ü
üAc
tive
High
üü
ü–
8-pi
n SO
IC, 8
-pin
MSO
P
MIC
2075
-2Si
ngle
2.7–
5.5
500
mA
–14
0ü
üAc
tive
Low
üü
ü–
8-pi
n SO
IC, 8
-pin
MSO
P
MIC
2076
-1Du
al2.
7–5.
550
0 m
A–
90ü
üAc
tive
High
üü
ü–
8-pi
n SO
IC, 8
-pin
PDI
P
MIC
2076
-2Du
al2.
7–5.
550
0 m
A–
90ü
üAc
tive
Low
üü
ü–
8-pi
n SO
IC, 8
-pin
PDI
P
MIC
2076
A-1
Dual
2.7–
5.5
500
mA
–10
0ü
üAc
tive
High
üü
ü–
8-pi
n SO
IC
MIC
2076
A-2
Dual
2.7–
5.5
500
mA
–10
0ü
üAc
tive
Low
üü
ü–
8-pi
n SO
IC
MIC
2077
-1Q
uad
2.7–
5.5
500
mA
–15
0ü
üAc
tive
High
üü
ü–
16-p
in S
OIC
, 16-
pin
WSO
IC
MIC
2077
-2Q
uad
2.7–
5.5
500
mA
–15
0ü
üAc
tive
Low
üü
ü–
16-p
in S
OIC
, 16-
pin
WSO
IC
MIC
2095
-1Si
ngle
2.5–
5.5
500
mA
–17
0ü
üAc
tive
High
üü
ü–
16-p
in 1
.6 ×
1.6
TM
LF
MIC
2095
-2Si
ngle
2.5–
5.5
500
mA
–17
0ü
üAc
tive
Low
üü
ü–
16-p
in 1
.6 ×
1.6
TM
LF
MIC
2097
-1Si
ngle
2.5–
5.5
–1.
1A17
0ü
üAc
tive
High
üü
ü–
16-p
in 1
.6 ×
1.6
TM
LF
MIC
2097
-2Si
ngle
2.5–
5.5
–1.
1A17
0ü
üAc
tive
Low
üü
ü–
16-p
in 1
.6 ×
1.6
TM
LF
MIC
2098
-1Si
ngle
2.5–
5.5
900
mA
–17
0ü
üAc
tive
High
üü
ü–
16-p
in 1
.6 ×
1.6
TM
LF
MIC
2098
-2Si
ngle
2.5–
5.5
900
mA
–17
0ü
üAc
tive
Low
üü
ü–
16-p
in 1
.6 ×
1.6
TM
LF
MIC
2099
-1Si
ngle
2.5–
5.5
–1.
1A17
0ü
üAc
tive
High
üü
ü–
16-p
in 1
.6 ×
1.6
TM
LF
MIC
2099
-2Si
ngle
2.5–
5.5
–1.
1A17
0ü
üAc
tive
Low
üü
ü–
16-p
in 1
.6 ×
1.6
TM
LF
MIC
2505
Sing
le2.
7–7.
52.
0A–
30ü
üAc
tive
High
–ü
ü–
8-pi
n SO
IC, 8
-pin
PDI
P
MIC
2505
-1Si
ngle
2.7–
7.5
2.0A
–30
üü
Activ
e Hi
gh–
üü
–8-
pin
SOIC
MIC
2505
-2Si
ngle
2.7–
7.5
2.0A
–30
üü
Activ
e Lo
w–
üü
–8-
pin
SOIC
*Red
uced
Heig
ht P
acka
ge
www.microchip.com/analog32
POW
ER M
ANAG
EMEN
T: P
ower
Sw
itche
s (C
ontin
ued)
Part
#C
hann
els
Vin R
ange
(V)
Fixe
d C
urre
nt L
imit
(Min
.)Ad
j. C
urre
nt L
imit
(Max
.)Rd
s(o
n)
(mΩ
)C
urre
nt
Lim
ited/
Latc
hed
Reve
rse
Bloc
king
Enab
le L
ogic
ULV
OTh
erm
al
Prot
ectio
nFa
ult
Flag
Cur
rent
M
easu
rem
ent
Pack
ages
Cur
rent
Lim
it U
SB P
rote
ctio
n Sw
itche
s (C
ontin
ued)
MIC
2506
Dual
2.7–
7.5
1.0A
–75
üü
Activ
e Hi
gh–
üü
–8-
pin
SOIC
, 8-p
in P
DIP
MIC
2544
-1Si
ngle
2.7–
5.5
–1.
5A80
üü
Activ
e Hi
gh–
üü
–8-
pin
SOIC
, 8-p
in M
SOP
MIC
2544
-2Si
ngle
2.7–
5.5
–1.
5A80
üü
Activ
e Lo
w–
üü
–8-
pin
SOIC
, 8-p
in M
SOP
MIC
2544
A-1
Sing
le2.
7–5.
5–
1.5A
80ü
üAc
tive
High
–ü
ü–
8-pi
n SO
IC, 8
-pin
MSO
P
MIC
2544
A-2
Sing
le2.
7–5.
5–
1.5A
80ü
üAc
tive
Low
–ü
ü–
8-pi
n SO
IC, 8
-pin
MSO
P
MIC
2545
A-1
Sing
le2.
7–5.
5–
3.0A
35ü
üAc
tive
High
–ü
ü–
8-pi
n SO
IC, 8
-pin
PDI
P,
14-p
in T
SSO
P
MIC
2545
A-2
Sing
le2.
7–5.
5–
3.0A
35ü
üAc
tive
Low
–ü
ü–
8-pi
n SO
IC, 8
-pin
PDI
P,
14-p
in T
SSO
P
MIC
2546
-1Du
al2.
7–5.
5–
1.5A
80ü
üAc
tive
High
–ü
ü–
16-p
in S
OIC
, 16-
pin
TSSO
P
MIC
2546
-2Du
al2.
7–5.
5–
1.5A
80ü
üAc
tive
Low
–ü
ü–
16-p
in S
OIC
, 16-
pin
TSSO
P
MIC
2547
-1Du
al2.
7–5.
5–
1.5A
80ü
üAc
tive
High
–ü
ü–
16-p
in S
OIC
, 16-
pin
TSSO
P
MIC
2547
-2Du
al2.
7–5.
5–
1.5A
80ü
üAc
tive
Low
–ü
ü–
16-p
in S
OIC
, 16-
pin
TSSO
P
MIC
2548
-1Si
ngle
2.7–
5.5
–1.
5A80
üü
Activ
e Hi
gh–
üü
–8-
pin
SOIC
, 8-p
in M
SOP
MIC
2548
-2Si
ngle
2.7–
5.5
–1.
5A80
üü
Activ
e Lo
w–
üü
–8-
pin
SOIC
, 8-p
in M
SOP
MIC
2548
A-1
Sing
le2.
7–5.
5–
1.5A
80ü
üAc
tive
High
–ü
ü–
8-pi
n SO
IC, 8
-pin
MSO
P
MIC
2548
A-2
Sing
le2.
7–5.
5–
1.5A
80ü
üAc
tive
Low
–ü
ü–
8-pi
n SO
IC, 8
-pin
MSO
P
MIC
2549
A-1
Sing
le2.
7–5.
5–
3.0A
35ü
üAc
tive
High
–ü
ü–
8-pi
n SO
IC, 8
-pin
PDI
P,
14-p
in T
SSO
P
MIC
2549
A-2
Sing
le2.
7–5.
5–
3.0A
35ü
üAc
tive
Low
–ü
ü–
8-pi
n SO
IC, 8
-pin
PDI
P,
14-p
in T
SSO
P*R
educ
ed H
eight
Pac
kage
Load
Sw
itche
sPa
rt #
Cha
nnel
sVi
n R
ange
(V)
Max
. Sw
itch
Cur
rent
Rds(
on) (
mΩ
)So
ft St
art (
μs)
Load
Dis
char
ge (Ω
)En
able
Log
icIn
put P
ull-U
p Re
sist
orRe
vers
e Bl
ocki
ngPa
ckag
es
MIC
9403
0Si
ngle
2.7–
13.5
1.0
750
––
Activ
e Lo
w–
ü4-
pin
SOT1
43
MIC
9403
1Si
ngle
2.7–
13.5
1.0
750
––
Activ
e Lo
wü
ü4-
pin
SOT1
43
MIC
9404
0Si
ngle
1.7–
5.5
3.0
28–
–Ac
tive
High
––
4-pi
n 1.
2 ×
1.2
MLF
MIC
9404
1Si
ngle
1.7–
5.5
3.0
28–
250
Activ
e Hi
gh–
–4-
pin
1.2
× 1.
2 M
LF
MIC
9404
2Si
ngle
1.7–
5.5
3.0
2810
0–
Activ
e Hi
gh–
–4-
pin
1.2
× 1.
2 M
LF
MIC
9404
3Si
ngle
1.7–
5.5
3.0
28–
250
Activ
e Hi
gh–
–4-
pin
1.2
× 1.
2 M
LF
MIC
9404
4Si
ngle
1.7–
5.5
3.0
2890
0–
Activ
e Hi
gh–
–4-
pin
1.2
× 1.
2 M
LF
MIC
9404
5Si
ngle
1.7–
5.5
3.0
2890
020
0Ac
tive
High
––
4-pi
n 1.
2 ×
1.2
MLF
MIC
9405
0Si
ngle
1.8–
5.5
1.8
125
––
Activ
e Lo
w–
ü4-
pin
SOT1
43
MIC
9405
1Si
ngle
1.8–
5.5
1.8
125
––
Activ
e Lo
wü
ü4-
pin
SOT1
43
MIC
9405
2Si
ngle
1.8–
5.5
2.0
70–
–Ac
tive
Low
––
6-pi
n SC
70
MIC
9405
3Si
ngle
1.8–
5.5
2.0
70–
–Ac
tive
Low
ü–
6-pi
n SC
70
MIC
9406
0Si
ngle
1.7–
5.5
2.0
77–
–Ac
tive
High
––
6-pi
n SC
70, 1
.2 ×
1.6
MIC
9406
1Si
ngle
1.7–
5.5
2.0
77–
200
Activ
e Hi
gh–
–6-
pin
SC70
, 1.2
× 1
.6
MIC
9406
2Si
ngle
1.7–
5.5
2.0
7780
0–
Activ
e Hi
gh–
–6-
pin
SC70
, 1.2
× 1
.6*R
educ
ed H
eight
Pac
kage
Analog and Interface Product Selector Guide 33
POW
ER M
ANAG
EMEN
T: P
ower
Sw
itche
s (C
ontin
ued)
Part
#C
hann
els
Vin R
ange
(V)
Max
. Sw
itch
Cur
rent
Rds(
on) (
mΩ
)So
ft St
art (
μs)
Load
Dis
char
ge (Ω
)En
able
Log
icIn
put P
ull-U
p Re
sist
orRe
vers
e Bl
ocki
ngPa
ckag
esLo
ad S
witc
hes
(Con
tinue
d)
MIC
9406
3Si
ngle
1.7–
5.5
2.0
7780
020
0Ac
tive
High
––
6-pi
n SC
70, 1
.2 ×
1.6
MIC
9406
4Si
ngle
1.7–
5.5
2.0
7711
5–
Activ
e Hi
gh–
–6-
pin
SC70
, 1.2
× 1
.6
MIC
9406
5Si
ngle
1.7–
5.5
2.0
7711
520
0Ac
tive
High
––
6-pi
n SC
70, 1
.2 ×
1.6
MIC
9407
0Si
ngle
1.7–
5.5
1.2
120
––
Activ
e Hi
gh–
–6-
pin
SC70
, 1.2
× 1
.6
MIC
9407
1Si
ngle
1.7–
5.5
1.2
120
–20
0Ac
tive
High
––
6-pi
n SC
70, 1
.2 ×
1.6
MIC
9407
2Si
ngle
1.7–
5.5
1.2
120
800
–Ac
tive
High
––
6-pi
n SC
70, 1
.2 ×
1.6
MIC
9407
3Si
ngle
1.7–
5.5
1.2
120
800
200
Activ
e Hi
gh–
–6-
pin
SC70
, 1.2
× 1
.6
MIC
9408
0Si
ngle
1.7–
5.5
2.0
67–
–Ac
tive
High
––
4-pi
n 0.
85 ×
0.8
5 TM
LF
MIC
9408
1Si
ngle
1.7–
5.5
2.0
67–
250
Activ
e Hi
gh–
–4-
pin
0.85
× 0
.85
TMLF
MIC
9408
2Si
ngle
1.7–
5.5
2.0
6780
0–
Activ
e Hi
gh–
–4-
pin
0.85
× 0
.85
TMLF
MIC
9408
3Si
ngle
1.7–
5.5
2.0
6780
025
0Ac
tive
High
––
4-pi
n 0.
85 ×
0.8
5 TM
LF
MIC
9408
4Si
ngle
1.7–
5.5
2.0
6712
0–
Activ
e Hi
gh–
–4-
pin
0.85
× 0
.85
TMLF
MIC
9408
5Si
ngle
1.7–
5.5
2.0
6712
025
0Ac
tive
High
––
4-pi
n 0.
85 ×
0.8
5 TM
LF
MIC
9409
0Si
ngle
1.7–
5.5
1.2
130
––
Activ
e Hi
gh–
–6-
pin
SC70
, 1.2
× 1
.2
MIC
9409
1Si
ngle
1.7–
5.5
1.2
130
–25
0Ac
tive
High
––
6-pi
n SC
70, 1
.2 ×
1.2
MIC
9409
2Si
ngle
1.7–
5.5
1.2
130
790
–Ac
tive
High
––
6-pi
n SC
70, 1
.2 ×
1.2
MIC
9409
3Si
ngle
1.7–
5.5
1.2
130
790
250
Activ
e Hi
gh–
–6-
pin
SC70
, 1.2
× 1
.2
MIC
9409
4Si
ngle
1.7–
5.5
1.2
130
120
–Ac
tive
High
––
6-pi
n SC
70, 1
.2 ×
1.2
MIC
9409
5Si
ngle
1.7–
5.5
1.2
130
120
250
Activ
e Hi
gh–
–6-
pin
SC70
, 1.2
× 1
.2
MIC
9416
1Si
ngle
1.7–
5.5
3.0
15.5
2700
–Ac
tive
High
–ü
1.5
× 1
WLC
SP
MIC
9416
2Si
ngle
1.7–
5.5
3.0
15.5
6020
0Ac
tive
High
–ü
1.5
× 1
WLC
SP
MIC
9416
3Si
ngle
1.7–
5.5
3.0
15.5
60–
Activ
e Hi
gh–
ü1.
5 ×
1 W
LCSP
MIC
9416
4Si
ngle
1.7–
5.5
3.0
15.5
2700
200
Activ
e Hi
gh–
ü1.
5 ×
1 W
LCSP
MIC
9416
5Si
ngle
1.7–
5.5
3.0
15.5
2700
–Ac
tive
High
–ü
1.5
× 1
WLC
SP
MIC
9541
0Si
ngle
0.5–
5.5
7.0
6.6
1100
2300
Activ
e Hi
gh–
–10
-pin
1.2
× 2
.0 Q
FN
MIC
9406
6Du
al1.
7–5.
52
85–
–Ac
tive
High
––
8-pi
n 2
× 2
MLF
MIC
9406
7Du
al1.
7–5.
52
85–
200
Activ
e Hi
gh–
–8-
pin
2 ×
2 M
LF
MIC
9406
8Du
al1.
7–5.
52
8580
0–
Activ
e Hi
gh–
–8-
pin
2 ×
2 M
LF
MIC
9406
9Du
al1.
7–5.
52
8580
020
0Ac
tive
High
––
8-pi
n 2
× 2
MLF
*Red
uced
Heig
ht P
acka
ge
www.microchip.com/analog34
DIS
PLAY
AN
D L
ED D
RIV
ERS
DIS
PLAY
AN
D L
ED D
RIVE
RS:
Elec
trolu
min
esce
nt B
ackl
ight
Driv
ers
Part
#Ty
peIn
put V
olta
ge
Low
(V)
Inpu
t Vol
tage
H
igh
(V)
Nom
inal
Out
put
Volta
ge (V
)M
ax. S
witc
h Re
sist
ance
(Ω)
Out
put R
egul
atio
nM
ax. L
amp
Size
per
Dev
ice
(in2 )
Pack
ages
16-S
egm
ent D
river
sHV
509
16-S
egm
ent D
river
s2
5.5
±50
to ±
200
––
6.5
32-p
in V
QFN
HV52
816
-Seg
men
t Driv
ers
1.7
5.5
±50
to ±
200
––
6.5
32-p
in V
QFN
Offl
ine
Driv
ers
HV80
9O
ffline
Driv
er50
200
±50
to ±
200
––
100
8-pi
n SO
IC, 8
-pin
SO
IC 1
50 m
ilSi
ngle
Lam
p D
river
sHV
816
Sing
le La
mp
Drive
r2.
75.
5±1
80–
Yes
4216
-pin
QFN
HV82
3Si
ngle
Lam
p Dr
iver
29.
5±9
06
Yes
238-
pin
SOIC
150
mil
HV82
5Si
ngle
Lam
p Dr
iver
11.
6±5
615
No3
8-pi
n M
SOP,
8-p
in S
OIC
150
mil
HV83
0Si
ngle
Lam
p Dr
iver
29.
5±1
004
Yes
258-
pin
SOIC
150
mil
HV83
3Si
ngle
Lam
p Dr
iver
1.8
6.5
±90
4Ye
s12
8-pi
n M
SOP
HV85
0Si
ngle
Indu
ctor
less
Lam
p Dr
iver
34.
2±7
0–
Yes
1.5
8-pi
n M
SOP
HV85
2Si
ngle
Indu
ctor
less
Lam
p Dr
iver
2.4
5±8
0–
Yes
1.5
10-p
in W
DFN,
8-p
in M
SOP
HV85
3Si
ngle
Indu
ctor
less
Lam
p Dr
iver
3.2
5±8
0–
Yes
1.5
10-p
in W
DFN,
8-p
in M
SOP
HV85
7Si
ngle
Lam
p Dr
iver
1.8
5±9
56
Yes
58-
pin
WDF
N, 8
-pin
MSO
PHV
857L
Sing
le La
mp
Drive
r1.
85
±95
6Ye
s5
8-pi
n W
DFN,
8-p
in M
SOP
HV85
9Si
ngle
Lam
p Dr
iver
1.8
5±1
056
Yes
58-
pin
WDF
N, 8
-pin
MSO
PHV
860
Sing
le La
mp
Drive
r2.
54.
5±1
106
Yes
512
-pin
WQ
FNM
IC48
26Si
ngle
Lam
p Dr
iver
1.8
5.5
±80
7Ye
s3
8-pi
n M
SOP
MIC
4827
Sing
le La
mp
Drive
r1.
85.
5±9
07
Yes
38-
pin
MSO
PM
IC48
30Si
ngle
Lam
p Dr
iver
1.8
5.5
±90
7Ye
s4
8-pi
n M
SOP,
8-p
in V
DFN
MIC
4832
Sing
le La
mp
Drive
r1.
85.
5±1
107
Yes
38-
pin
MSO
P, 8
-pin
VDF
ND
ual L
amp
Driv
ers
HV86
1Du
al La
mp
Drive
rs2.
54.
5±9
07
Yes
516
-pin
WQ
FNM
IC48
33Du
al La
mp
Drive
rs2.
35.
8±1
1012
Yes
412
-pin
VDF
N
DIS
PLAY
AN
D L
ED D
RIVE
RS:
LED
Driv
ers
Part
#Ap
plic
atio
nTo
polo
gyIn
put V
olta
ge (V
)O
uput
Cur
rent
Dim
min
gPa
ckag
esAu
tom
otiv
e (A
EC-Q
100
Cer
tified
) LED
Driv
ers
AT99
17Au
toBo
ost,
Sepi
c5.
3–40
Exte
rnal
FET
PWM
/Lin
ear
24- p
in T
SSO
PAT
9919
Auto
Buck
4.5–
40Ex
tern
al FE
TPW
M8-
pin
DFN
AT99
32Au
toBo
ost-B
uck
(Cuk
)5.
3–40
Exte
rnal
FET
PWM
/Lin
ear
24-p
in T
SSO
PAT
9933
Auto
Boos
t-Buc
k (C
uk)
9.0–
75Ex
tern
al FE
TPW
M8-
pin
SOIC
MAQ
3203
Auto
Buck
4.5-
42Ex
tern
al FE
TPW
M8-
pin
SOIC
Gen
eral
Pur
pose
LED
Driv
ers
Part
#To
polo
gyIn
put V
olta
ge (V
)D
imm
ing
Iq T
yp. (
mA)
Switc
hing
Fre
quen
cy (H
z)Sw
itchi
ng M
OSF
ETD
ither
edIL
ED A
ccur
acy
Vfb
(V)
Pack
ages
HV98
01A
Buck
15–4
504-
Leve
l Sw
itch
1.0
100K
Exte
rnal
FET
–N/
A0.
2516
-pin
SO
IC 1
50 m
il, 8-
pin
SOIC
150
mil
HV98
03B
Buck
7–13
.2PW
M/L
inea
r1.
510
0KEx
tern
al FE
T–
±2%
0.28
8-pi
n SO
IC 1
50 m
ilHV
9805
2-St
age
102–
265
–2.
537
0K0.
7A F
ET–
N/A
1.25
10-p
in M
SOP
HV98
100
Buck
-Boo
st9.
5–17
.5–
0.2
320K
Exte
rnal
FET
–±5
%0.
26-
pin
SOT-
23HV
9810
1Bu
ck-B
oost
9.5–
17.5
–0.
232
0KEx
tern
al FE
T–
±5%
0.2
6-pi
n SO
T-23
HV98
61A
Buck
15–4
50PW
M/L
inea
r1.
510
0KEx
tern
al FE
T–
±3%
0.27
16-p
in S
OIC
150
mil,
8-pi
n SO
IC 1
50 m
ilHV
9910
BBu
ck8–
450
PWM
/Lin
ear
1.0
100K
Exte
rnal
FET
–±5
%0.
2516
-pin
SO
IC 1
50 m
il, 8-
pin
SOIC
150
mil
Analog and Interface Product Selector Guide 35
DIS
PLAY
AN
D L
ED D
RIVE
RS:
LED
Driv
ers
(Con
tinue
d)Pa
rt #
Topo
logy
Inpu
t Vol
tage
(V)
Dim
min
gIq
Typ
. (m
A)Sw
itchi
ng F
requ
ency
(Hz)
Switc
hing
MO
SFET
Dith
ered
ILED
Acc
urac
yVf
b (V
)Pa
ckag
esG
ener
al P
urpo
se L
ED D
river
s (C
ontin
ued)
HV99
10C
Buck
15–4
50PW
M/L
inea
r1.
010
0KEx
tern
al FE
T–
±5%
0.25
16-p
in S
OIC
150
mil,
8-pi
n SO
IC 1
50 m
ilHV
9918
Buck
4.5–
40PW
M
1.5
2M0.
7A F
ET–
±5%
0.23
8-pi
n W
DFN
HV99
19B
Buck
4.5–
40PW
M
1.5
2MEx
tern
al FE
T–
±5%
0.23
8-pi
n W
DFN
HV99
21Bu
ck20
–400
–0.
210
0K20
mA
–N/
AN/
A3-
pin
TO-9
2, 3
-pin
SO
T-89
HV99
22Bu
ck20
–400
–0.
210
0K50
mA
–N/
AN/
A3-
pin
TO-9
2, 3
-pin
SO
T-89
HV99
23Bu
ck20
–400
–0.
210
0K30
mA
–N/
AN/
A3-
pin
TO-9
2, 3
-pin
SO
T-89
HV99
25Bu
ck20
–400
PWM
0.3
100K
20–5
0 m
A–
N/A
0.47
8-pi
n SO
ICHV
9930
Cuk
8–20
0PW
M1.
0Va
riabl
eEx
tern
al FE
T–
N/A
0.12
8-pi
n SO
IC 1
50 m
ilHV
9931
Buck
8–45
0PW
M1.
010
0KEx
tern
al FE
T–
N/A
7.5
8-pi
n SO
IC 1
50 m
ilM
IC32
01
Buck
6–20
PWM
1.2
Hyst
to 1
.0M
1A F
ET–
±5%
28-
pin
SOIC
MIC
3202
Buck
6–37
PWM
1.2
Hyst
to 1
.0M
1A F
ETü
±5%
28-
pin
SOIC
MIC
3202
-1Bu
ck6–
37PW
M1.
2Hy
st to
1.0
M1A
FET
–±5
%2
8-pi
n SO
ICM
IC32
03
Buck
4.5–
42PW
M1.
0Hy
st to
1.5
MEx
tern
al FE
Tü
±5%
28-
pin
SOIC
MIC
3203
-1Bu
ck4.
5–42
PWM
1.0
Hyst
to 1
.5M
Exte
rnal
FET
–±5
%2
Plea
se c
all fo
r pac
kage
info
rmat
ion
MIC
3205
Buck
4.5–
40PW
M1.
3Hy
st to
1M
Exte
rnal
FET
–±5
%2
10-p
in V
DFN
MIC
3230
Bo
ost
6–45
PWM
3.2
100K
–1.0
MEx
tern
al FE
T–
±3%
0.25
16-p
in T
SSO
P, 1
2-pi
n VD
FNM
IC32
31
Boos
t6–
45PW
M3.
210
0K–1
.0M
Exte
rnal
FET
ü±3
%0.
2516
-pin
TSS
OP,
12-
pin
VDFN
MIC
3232
Bo
ost
6–45
PWM
3.2
400K
Exte
rnal
FET
–±3
%0.
2510
-pin
MSO
P
Back
light
LED
Driv
ers
Part
#To
polo
gyIn
put V
olta
ge (V
)D
imm
ing
Iq T
yp. (
mA)
Out
put C
urre
ntIn
t. D
iode
Vfb
(V)
Freq
uenc
yPa
ckag
esHV
9803
Buck
7–13
.2PW
M/L
inea
r1.
5Ex
tern
al FE
TN/
A0.
810
0K8-
pin
SOIC
150
mil
HV99
11Bo
ost,
SEPI
C, B
uck-
Boos
t9–
250
PWM
/Lin
ear
N/A
Exte
rnal
FET
N/A
0.45
100K
16-p
in S
OIC
150
mil
HV99
12Bo
ost,
SEPI
C, B
uck-
Boos
t9–
100
PWM
/Lin
ear
N/A
Exte
rnal
FET
N/A
0.45
100K
16-p
in S
OIC
150
mil
HV99
61Bu
ck8–
450
PWM
/Lin
ear
3.5
Exte
rnal
FET
N/A
0.27
100K
8-pi
n SO
IC 1
50 m
il, 16
-pin
SO
IC 1
50m
ilHV
9963
Boos
t, SE
PIC,
Buc
k-Bo
ost
8–40
PWM
/Lin
ear
N/A
Exte
rnal
FET
N/A
N/A
100K
16-p
in S
OIC
150
mil
HV99
67B
Buck
8–60
PWM
/Lin
ear
N/A
1A F
ETN/
A0.
2410
0K8-
pin
MSO
P, 8
-pin
WDF
NHV
9980
Buck
100–
160
PWM
/Lin
ear
3.0
0.07
A FE
TN/
AN/
A50
0K24
-pin
SO
IC 3
00 m
ilHV
9985
Boos
t, SE
PIC,
Buc
k10
–40
PWM
/Lin
ear
1.5
Exte
rnal
FET
N/A
N/A
500K
40-p
in V
QFN
MIC
2282
Boos
t0.
9–15
N/A
0.12
1A B
JTN/
A0.
2220
K8-
pin
MSO
PM
IC22
87Bo
ost
2.5–
10PW
M/A
nalo
g2.
52A
BJT
N/A
0.09
51.
2M5-
pin
TSO
T, 8
-pin
VDF
NM
IC22
87C
Boos
t2.
5–10
PWM
/Ana
log
2.5
2A B
JTN/
A0.
095
1.2M
5-pi
n TS
OT,
8-p
in V
DFN
MIC
2289
Boos
t2.
5–10
PWM
/Ana
log
2.5
2A B
JTYe
s0.
095
1.2M
6-pi
n TS
OT,
8-p
in V
DFN
MIC
2289
CBo
ost
2.5–
10PW
M/A
nalo
g2.
52A
BJT
Yes
0.09
51.
2M6-
pin
TSO
TM
IC22
91Bo
ost
2.5–
10PW
M/A
nalo
g2.
82A
BJT
N/A
0.09
51.
2M5-
pin
TSO
T, 8
-pin
VDF
NM
IC22
92Bo
ost
2.5–
10PW
M/A
nalo
g2.
52A
BJT
Yes
0.09
51.
6M8-
pin
VDFN
MIC
2292
CBo
ost
2.5–
10PW
M/A
nalo
g2.
52A
BJT
Yes
0.09
51.
6M8-
pin
VDFN
MIC
2293
Boos
t2.
5–10
PWM
/Ana
log
2.5
2A B
JTYe
s0.
095
2.0M
8-pi
n VD
FNM
IC22
93C
Boos
t2.
5–10
PWM
/Ana
log
2.5
2A B
JTYe
s0.
095
2.0M
8-pi
n VD
FNM
IC22
97Bo
ost
2.5–
10PW
M/A
nalo
g4
3A B
JTN/
A0.
260
0K10
-pin
VDF
NM
IC22
98Bo
ost
2.5–
10PW
M/A
nalo
g15
6A B
JTN/
A0.
21.
0M12
-pin
VDF
NM
IC22
99Bo
ost
2.5–
10PW
M/A
nalo
g15
8A B
JTN/
A0.
22.
0M12
-pin
VDF
NM
IC32
23Bo
ost
4.5–
20PW
M2.
110
A FE
TN/
A0.
21.
0M16
-pin
TSS
OP
MIC
3263
Boos
t6–
40PW
M6.
52A
BJT
N/A
2.36
400K
–1.8
M24
-pin
VQ
FNM
IC32
87Bo
ost
2.8–
6.5
PWM
/Ana
log
2.1
1A B
JTN/
A0.
251.
2M5-
pin
TSO
T, 6
-pin
TSO
T, 8
-pin
VDF
NM
IC32
89Bo
ost
2.5–
6.5
1-W
ire1.
42A
BJT
Yes
0.25
1.2M
6-pi
n TS
OT,
8-p
in V
DFN
www.microchip.com/analog36
DIS
PLAY
AN
D L
ED D
RIVE
RS:
LED
Driv
ers
(Con
tinue
d)
Part
#In
put V
olta
ge (V
)#
of W
hite
LED
sD
imm
ing
Iq T
yp. (
mA)
V D
ropo
ut L
ED @
20
mA
ILED
Mat
chin
gEx
t. LD
Os
Vdro
pou
tIQ
LDO
Com
men
tsPa
ckag
esLi
near
LED
Driv
ers
MIC
2841
A
3–5.
54
@ 2
0 m
APW
M (2
00 H
z–50
0 kH
z)1.
440
mV
±1.5
%–
––
DAM
™10
-pin
UDF
NM
IC28
42A
3–
5.5
4 @
20
mA
1-W
ire, 4
8-St
eps
1.4
40 m
V±1
.5%
––
–DA
M10
-pin
UDF
NM
IC28
43A
3–
5.5
6 @
20
mA
PWM
(200
Hz–
500
kHz)
1.4
40 m
V±1
.5%
––
–DA
M10
-pin
UDF
NM
IC28
44A
3–
5.5
6 @
20
mA
1-W
ire, 4
8-St
eps
1.4
40 m
V±1
.5%
––
–DA
M10
-pin
UDF
NM
IC28
46A
3–
5.5
6 @
20
mA
1-W
ire, 4
8-St
eps
1.4
40 m
V±1
.5%
215
035
DAM
14-p
in V
QFN
MIC
2860
-2D
3–5.
52
@ 3
0.2
mA
1-W
ire, 3
2-St
eps
0.7
52 m
V±0
.5%
––
–6-
pin
SC70
, 6-p
in S
OT-
23M
IC28
60-2
P 3–
5.5
2 @
30.
2 m
APW
M d
own
to 2
50Hz
0.7
52 m
V±0
.5%
––
–6-
pin
SC70
, 6-p
in S
OT-
23M
IC48
113–
5.5
6 @
50
mA
PWM
(200
Hz–
500
kHz)
1.7
100
mV
@ 5
0 m
A±1
.0%
––
–DA
M10
-pin
MSO
PM
IC48
123–
5.5
6 @
100
mA
PWM
(200
Hz–
500
kHz)
3.2
190
mV
@ 1
00 m
A±1
.0%
––
–DA
M10
-pin
eM
SOP
MIC
4801
3–5.
51
@ 6
00 m
APW
M (2
00 H
z–50
0 kH
z)2.
213
0 m
V @
400
mA
N/A
––
–±1
% A
ccur
acy
8-pi
n SO
ICM
IC48
023–
5.5
1 @
800
mA
PWM
(200
Hz–
500
kHz)
4.1
280
mV
@ 8
00 m
AN/
A–
––
±1%
Acc
urac
y8-
pin
eSO
IC
Line
ar R
egul
ator
s
Part
#In
put V
olta
ge (V
)O
utpu
t Vol
tage
(V)
Out
put C
urre
nt (m
A)D
imm
ing
Para
llela
ble
Pack
ages
Feat
ures
CL2
5.0–
905.
0–90
20Ex
tern
al FE
TYe
s3-
pin
TO-2
52, 3
-pin
TO
-92,
3-p
in S
OT-
89–
CL25
5.0–
905.
0–90
25Ex
tern
al FE
TYe
s3-
pin
TO-9
2, 3
-pin
SO
T-89
–CL
220
5.0–
220
5.0–
220
20Ex
tern
al FE
TYe
s3-
pin
TO-2
52, 3
-pin
TO
-220
–CL
320
6.5–
904.
0–90
20PW
MYe
s8-
bit S
OIC
with
Hea
t Slu
gO
TP, s
epar
ate
ENAB
LE p
inCL
325
6.5–
904.
0–90
25PW
MYe
s8-
bit S
OIC
with
Hea
t Slu
gO
TP, s
epar
ate
ENAB
LE p
inCL
330
6.5–
904.
0–90
30PW
MYe
s8-
bit S
OIC
with
Hea
t Slu
gO
TP, s
epar
ate
ENAB
LE p
inCL
520
4.75
–90
1.0–
9020
–Ye
s3-
pin
TO-2
52, 3
-pin
TO
-92
–CL
525
4.75
–90
1.0–
9025
–Ye
s3-
pin
TO-2
52, 3
-pin
TO
-92
–CL
66.
5–90
4.0–
9010
0No
Yes
3-pi
n TO
-252
, 3-p
in T
O-2
20Re
vers
e po
larity
pro
tect
ion,
OTP
CL7
6.5–
904.
0–90
100
PWM
Yes
8-pi
n SO
IC w
ith H
eat S
lug
Reve
rse
polar
ity p
rote
ctio
n, O
TP
Dis
play
LED
Driv
ers
Part
#In
put V
olta
ge (V
)Si
nk C
urre
nt (m
A)Se
gmen
tsLE
Ds
Des
crip
tion
Pack
ages
MIC
5400
4.75
–5.5
30N/
A2
bank
s of
8Dr
iving
Lar
ge L
ED A
rray
in S
igns
28
-pin
SO
ICM
M54
504.
75–1
115
34N/
A7-
Segm
ent L
ED D
river
with
EN
40-p
in P
DIP,
44-
pin
PLCC
MM
5451
4.75
–11
1535
N/A
7-Se
gmen
t LED
Driv
er40
-pin
PDI
P, 4
4-pi
n PL
CC
Sequ
entia
l Lin
ear L
ED D
river
s
Part
#Vi
n (V
)Vo
ut (
V)O
utpu
t Cur
rent
(mA)
Dim
min
gPa
ralle
labl
eFe
atur
esPa
ckag
esCL
8800
90–2
7570
–350
115
Exte
rnal
Dim
mer
Yes
6-St
age
33-p
in Q
FN
CL88
0190
–275
70–3
5020
0Ex
tern
al Di
mm
erYe
s4-
Stag
e33
-pin
QFN
CL8
8020
90–1
3570
–190
115
Exte
rnal
Dim
mer
Yes
4-Ta
p8-
pin
SOIC
EP
Cam
era
Flas
h LE
D D
river
s
Part
#In
put V
olta
ge (V
)#
of L
ED C
hann
els
Max
. LED
Cur
rent
(mA)
Stan
dby
Cur
rent
(mA)
Switc
h Fr
eque
ncy
(MH
z)Pe
ak E
ffici
ency
(%)
Cur
rent
Acc
urac
y (%
)In
terfa
cePa
ckag
esM
IC28
702.
7–5
215
000.
902
94±1
0I2 C
16-p
in T
QFN
MIC
2871
2.7–
5.5
112
000.
232
94±5
Sing
le-W
ire14
-pin
LDF
NM
IC28
732.
7–5.
51
1200
0.17
292
±8Si
ngle-
Wire
9-pi
n W
LCSP
MIC
2874
2.7–
5.5
112
000.
174
92±8
Sing
le-W
ire9-
pin
WLC
SP
Analog and Interface Product Selector Guide 37
HIG
H-V
OLT
AGE
INTE
RFA
CE
HIG
H-V
OLT
AGE
INTE
RFAC
E: D
river
Arra
ys
Part
#O
utpu
t C
hann
els
Vou
t Ope
ratin
g (V
) Tra
nsie
ntVo
ut O
pera
ting
(V) S
usta
ined
Inpu
t St
ruct
ure
Des
crip
tion
Sink HV
5122
3225
022
5Se
rial
Seria
l to
para
llel c
onve
rter w
ith o
utpu
t ena
ble
and
stro
be
HV52
2232
250
225
Seria
lSe
rial t
o pa
ralle
l con
verte
r with
out
put e
nabl
e an
d st
robe
HV
5522
3223
022
0Se
rial
Seria
l to
para
llel c
onve
rter w
ith la
tche
s, p
olar
ity, a
nd b
lankin
g HV
5523
3223
022
0Se
rial
Seria
l to
para
llel c
onve
rter w
ith la
tche
s, p
olar
ity, a
nd b
lankin
g HV
5530
3231
530
0Se
rial
Seria
l to
para
llel c
onve
rter w
ith la
tche
s, p
olar
ity, a
nd b
lankin
g HV
5622
3223
022
0Se
rial
Seria
l to
para
llel c
onve
rter w
ith la
tche
s, p
olar
ity, a
nd b
lankin
g HV
5623
3225
022
0Se
rial
Seria
l to
para
llel c
onve
rter w
ith la
tche
s, p
olar
ity, a
nd b
lankin
g HV
5630
3231
530
0Se
rial
Seria
l to
para
llel c
onve
rter w
ith la
tche
s, p
olar
ity, a
nd b
lankin
g M
IC58
004
5050
Para
llel
4.4
MHz
(min
.) Da
ta a
t 5V,
Hig
her a
t 12V
; TTL
/CM
OS/
PMO
S Lo
gic;
Inte
grat
ed c
lamp
diod
es; C
LR/S
trobe
/Ena
ble
Out
MIC
5801
850
50Pa
ralle
l4.
4 M
Hz (m
in.)
Data
at 5
V, H
ighe
r at 1
2V; T
TL/C
MO
S/PM
OS
Logi
c; In
tegr
ated
clam
p di
odes
; CLR
/Stro
be/E
nabl
e O
utM
IC58
218
5035
Seria
lSi
mila
r to
MIC
5801
, Add
s th
erm
al Sh
utdo
wn,
UVL
O, O
CPM
IC58
228
8050
Seria
l8-
bit S
Rs (C
asca
dabl
e), O
pera
ble
with
spl
it su
pply
(to −
20V)
, 3.3
MHz
(min
.) Da
ta a
t 5V,
TTL
/CM
OS/
PMO
S/NM
OS
Logi
cM
IC58
418
5035
Seria
l8-
bit S
Rs (C
asca
dabl
e), O
pera
ble
with
spl
it su
pply
(to −
20V)
, 3.3
MHz
(min
.) Da
ta a
t 5V,
Hig
her a
t 12V
, TTL
/CM
OS/
PMO
S/NM
OS
Logi
c
MIC
5842
880
50Se
rial
8-bi
t SRs
(Cas
cada
ble)
, Ope
rabl
e w
ith s
plit
supp
ly (to
−20
V), 3
.3 M
Hz (m
in.)
Data
at 5
V, H
ighe
r at 1
2V, L
ow P
ower
Log
ic: T
TL/C
MO
S/PM
OS/
NMO
S; In
tern
al Pu
ll Up/
Dow
n Re
s's
MIC
58P0
18
8080
Para
llel
8-bi
t SRs
(Cas
cada
ble)
, Ope
rabl
e w
/Spl
it Su
pply
(to −
20V)
, 3.3
MHz
(min.
) Dat
a at
5V,
High
er a
t 12V
, Low
Pow
er L
ogic:
TTL
/CM
OS/
PMO
S/NM
OS;
Inte
rnal
Pull U
p/Do
wn
Res'
sM
IC58
P42
880
50Se
rial
Sim
ilar t
o M
IC58
42, a
dds
ther
mal
shut
dow
n, U
VLO
, OCP
MIC
59P5
08
8080
Para
llel
Sim
ilar t
o M
IC58
P01,
with
add
ed e
rror fl
ag o
utpu
tM
IC59
P60
880
50Se
rial
Sim
ilar t
o M
IC58
P42,
with
add
ed e
rror fl
ag o
utpu
tSo
urce
HV57
009
6495
85Se
rial
Curre
nt c
ontro
lled
drive
r with
latc
hes
and
blan
king,
two
32-b
it sh
ift re
gist
ers
MIC
2981
/82
850
35Pa
ralle
l8-
Ch. d
river
with
par
allel
I/Os;
TTL
/CM
OS/
PMO
S Lo
gic;
Inte
grat
ed c
lamp
diod
es; V
in<1
2VM
IC58
918
5035
Seria
l8-
bit S
Rs (C
asca
dabl
e), O
pera
ble
with
spl
it su
pply
(to −
20V)
, 5 M
Hz (m
in.) D
ata
at 5
V, In
tegr
ated
clam
p di
odes
; TTL
/CM
OS/
PMO
S/NM
OS
Logi
c; S
trobe
and
out
put e
nabl
eSo
urce
-Sin
kHV
3418
6420
018
0Se
rial
Seria
l to
para
llel c
onve
rter w
ith la
tche
s, p
olar
ity, a
nd b
lankin
g HV
507
6432
030
0Se
rial
Seria
l to
para
llel c
onve
rter w
ith la
tche
s, p
olar
ity, a
nd b
lankin
g HV
508
260
45Pa
ralle
lH-
Brid
ge o
utpu
t with
two
outp
ut v
olta
ge le
vel s
elect
ions
and
pol
arity
; Spe
cially
targ
eted
as
LCD
shut
ter d
river
HV51
38
275
250
Seria
lSe
rial t
o pa
ralle
l con
verte
r with
latc
hes,
pol
arity
, and
blan
king
HI-Z
and
sho
rt cir
cuit
dete
ct
HV51
832
9080
Seria
lSe
rial t
o pa
ralle
l con
verte
r with
latc
hes,
ena
ble,
and
stro
be; S
pecia
lly ta
rget
ed a
s va
cuum
-fluo
resc
ent d
isplay
driv
eHV
5308
3290
80Se
rial
Seria
l to
para
llel c
onve
rter w
ith la
tche
s, a
nd o
utpu
t ena
ble
HV54
0832
9080
Seria
lSe
rial t
o pa
ralle
l con
verte
r with
latc
hes,
and
out
put e
nabl
e HV
574
8090
80Se
rial
Seria
l to
para
llel c
onve
rter w
ith la
tche
s, p
olar
ity, a
nd b
lankin
g HV
5770
864
9080
Seria
lPo
larity
, and
blan
king
with
four
16-
bit s
hift
regi
ster
s HV
5790
864
9080
Seria
lLa
tche
s, b
lankin
g, p
olar
ity, a
nd s
ingl
e sh
ift re
gist
er
HV58
1220
9080
Seria
lSe
rial t
o pa
ralle
l con
verte
r with
latc
hes,
blan
king
and
stro
be
HV58
296
8580
Seria
l96
-Cha
nnel,
with
hig
h-vo
ltage
CM
OS
Out
puts
, 80V
HV58
312
890
80Se
rial
128-
Chan
nel,
with
hig
h-vo
ltage
CM
OS
Out
puts
, 80V
HV66
3270
60Se
rial
Seria
l to
para
llel c
onve
rter w
ith la
tche
s, p
olar
ity a
nd b
lankin
gHV
6810
1090
80Se
rial
Seria
l to
para
llel c
onve
rter w
ith d
ata
latch
es a
nd c
hann
el po
larity
sele
ctHV
7022
3425
023
0Se
rial
Seria
l to
para
llel c
onve
rter w
ith d
irect
ion,
ena
ble,
and
pol
ary
selec
t; pa
rticu
larly
usef
ul fo
r ACT
FEL
disp
lays
HV72
2440
260
240
Seria
lSe
rial t
o pa
ralle
l con
verte
r with
latc
hes,
and
out
put e
nabl
e HV
7620
3222
520
0Se
rial
Seria
l to
para
llel c
onve
rter w
ith la
tche
s, c
hann
el po
larity
sele
ct, a
nd b
lankin
gHV
9308
3290
80Se
rial
Seria
l to
para
llel c
onve
rter l
atch
es a
nd o
utpu
t ena
ble,
CW
dire
ctio
nal s
hift
HV94
0832
9080
Seria
lSe
rial t
o pa
ralle
l con
verte
r lat
ches
and
out
put e
nabl
e; C
CW d
irect
iona
l shi
ftHV
9808
3290
80Se
rial
Seria
l to
para
llel c
onve
rter l
atch
es, p
olar
ity, a
nd o
utpu
t ena
ble;
CCW
dire
ctio
nal s
hift
www.microchip.com/analog38
HIG
H-V
OLT
AGE
INTE
RFAC
E: A
mpl
ifier
s an
d M
EMS
Driv
ers
Part
#O
utpu
t Cha
nnel
sSl
ew R
ate
(V/μ
s)C
lose
d Lo
op G
ain
(V/V
)Fe
edba
ck R
esis
tanc
e (M
Ω)
Sour
ce C
urre
nt (M
ax. μ
A)Si
nk C
urre
nt (M
ax. μ
A)O
utpu
t Cap
aciti
ve L
oad
(Max
. pF)
Pack
ages
HV25
432
350
1230
030
010
010
0-pi
n M
QFP
HV25
632
272
1271
571
530
0010
0-pi
n M
QFP
HV25
732
272
1250
050
030
0010
0-pi
n M
QFP
HV26
44
966
.75.
330
0030
0015
24-p
in T
SSO
P
HIG
H-V
OLT
AGE
INTE
RFAC
E: M
OSF
ETs
– In
terfa
cePa
rt #
BVd
sx M
in. (
V)Rd
s(o
n) M
ax. (
Ω)
Vgs(
off
) Min
. (V)
Vgs(
off
) Max
. (V)
Pack
ages
Dep
letio
n-M
ode
N-C
hann
elLN
D01
91.
4−0
.8−3
5-pi
n SO
T-23
DN15
0990
6−1
.8−3
.53-
pin
SOT-
89, 5
-pin
SO
T-23
DN26
2525
03.
5−1
.5−2
.18-
pin
VDFN
, 3-p
in D
PAK
DN35
2525
06
−1.5
−3.5
3-pi
n SO
T-89
DN25
3030
012
−1−3
.53-
pin
TO-9
2, 3
-pin
SO
T-89
DN35
3535
010
−1.5
−3.5
3-pi
n SO
T-89
DN25
3535
025
−1.5
−3.5
3-pi
n TO
-92,
3-p
in T
O-2
20DN
3135
350
35−1
.5−3
.53-
pin
SOT-
89, 3
-pin
SO
T-23
DN25
4040
025
−1.5
−3.5
3-pi
n TO
-92,
3-p
in S
OT-
89, 3
-pin
TO
-220
DN35
4545
020
−1.5
−3.5
3-pi
n TO
-92,
3-p
in S
OT-
89DN
3145
450
60−1
.5−3
.53-
pin
SOT-
89DN
2450
500
10−1
.5−3
.53-
pin
DPAK
, 3-p
in S
OT-
89LN
D150
500
1000
−1−3
3-pi
n TO
-92,
3-p
in S
OT-
89, 3
-pin
SO
T-23
LND2
5050
010
00−1
−33-
pin
SOT-
23DN
3765
650
8−1
.5−3
.53-
pin
DPAK
DN24
7070
042
−1.5
−3.5
3-pi
n DP
AK
Enha
ncem
ent-
Mod
e N
-Cha
nnel
Part
#BV
dss
Min
. (V)
Rds(
on) M
ax. (
Ω)
Cis
s M
ax. (
pF)
Vgs(
th) M
ax. (
V)Pa
ckag
esTN
2501
182.
511
01.
03-
pin
SOT-
89TN
0702
201.
320
01.
03-
pin
TO-9
2VN
0300
301.
219
02.
53-
pin
TO-9
2TN
0604
400.
819
01.
63-
pin
TO-9
2TN
2504
401.
012
51.
63-
pin
SOT-
89TN
0104
402.
070
1.6
3-pi
n TO
-92,
3-p
in S
OT-
89VN
0104
403.
065
2.4
3-pi
n TO
-92
VN32
0550
0.3
300
2.4
3-pi
n TO
-92,
3-p
in S
OT-
89TN
0606
601.
515
02.
03-
pin
TO-9
2TN
2106
602.
550
2.0
3-pi
n TO
-92,
3-p
in S
OT-
232N
6660
603.
050
2.0
3-pi
n TO
-39
TN01
0660
3.0
602.
03-
pin
TO-9
2VN
0106
603.
065
2.4
3-pi
n TO
-92
VN06
0660
3.0
502.
03-
pin
TO-9
2VN
2106
604.
050
2.4
3-pi
n TO
-92
2N70
0060
5.0
603.
03-
pin
TO-9
2
2N70
0260
7.5
502.
53-
pin
SOT-
23
2N70
0860
7.5
502.
53-
pin
TO-9
2
VN22
22L
607.
560
2.5
3-pi
n TO
-92
Analog and Interface Product Selector Guide 39
HIG
H-V
OLT
AGE
INTE
RFAC
E: M
OSF
ETs
– In
terfa
ce (C
ontin
ued)
Part
#BV
dss
Min
. (V)
Rds(
on) M
ax. (
Ω)
Cis
s M
ax. (
pF)
Vgs(
th) M
ax. (
V)Pa
ckag
esEn
hanc
emen
t-M
ode
N-C
hann
el (C
ontin
ued)
VN08
0880
4.0
502.
03-
pin
TO-9
2VN
0109
903.
065
2.4
3-pi
n TO
-92
2N66
6190
4.0
502.
03-
pin
TO-3
9VN
2210
100
0.4
500
2.4
3-pi
n TO
-92,
3-p
in T
O-3
9TN
0610
100
1.5
150
2.0
3-pi
n TO
-92
TN25
1010
01.
512
52.
03-
pin
SOT-
89TN
0110
100
3.0
602.
03-
pin
TO-9
2VN
2110
100
4.0
502.
43-
pin
SOT-
23VN
1206
120
6.0
125
2.0
3-pi
n TO
-92
TN06
2020
06.
015
01.
63-
pin
TO-9
2VN
2224
240
1.3
350
3.0
3-pi
n TO
-92
TN25
2424
06.
012
52.
03-
pin
SOT-
89VN
2406
240
6.0
125
2.0
3-pi
n TO
-92
VN24
1024
010
.012
52.
03-
pin
TO-9
2TN
2124
240
15.0
502.
03-
pin
SOT-
23TN
2425
250
3.5
200
2.0
3-pi
n SO
T-89
TN53
2525
07.
011
02.
03-
pin
TO-9
2, 3
-pin
SO
T-89
, 3-p
in S
OT-
23TN
2130
300
25.0
502.
43-
pin
SOT-
23TN
2435
350
6.0
200
0.8
(min
)3-
pin
SOT-
89TN
5335
350
15.0
110
2.0
3-pi
n SO
T-89
, 3-p
in S
OT-
23TN
2640
400
5.0
225
2.0
3-pi
n DP
AK, 3
-pin
TO
-92,
8-p
in S
OIC
150
mil
TN25
4040
012
.012
52.
03-
pin
TO-9
2, 3
-pin
SO
T-89
VN40
1240
012
.011
01.
83-
pin
TO-9
2VN
2450
500
13.0
150
4.0
3-pi
n TO
-92,
3-p
in S
OT-
89VN
0550
500
60.0
554.
03-
pin
TO-9
2VN
2460
600
20.0
150
4.0
3-pi
n TO
-92,
3-p
in S
OT-
89En
hanc
emen
t-M
ode
P-C
hann
elLP
0701
−16.
51.
525
0−1
.03-
pin
TO-9
2, 8
-pin
SO
IC 1
50 m
ilTP
2502
−20
2.0
125
−2.4
3-pi
n SO
T-89
VP32
03−3
00.
630
0−3
.53-
pin
TO-9
2, 3
-pin
SO
T-89
TP06
04−4
02.
015
0−2
.43-
pin
TO-9
2TP
2104
−40
6.0
60−2
.03-
pin
TO-9
2, 3
-pin
SO
T-23
VP01
04−4
08.
060
−3.5
3-pi
n TO
-92
VP22
06−6
00.
945
0−3
.53-
pin
TO-9
2, 3
-pin
TO
-39
VP01
06−6
08.
060
−3.5
3-pi
n TO
-92
VP21
06−6
012
.060
−3.5
3-pi
n TO
-92
VP08
08−8
05.
015
0−4
.53-
pin
TO-9
2VP
0109
−90
8.0
60−3
.53-
pin
TO-9
2TP
2510
−100
3.5
125
−2.4
3-pi
n SO
T-89
VP21
10−1
0012
.060
−3.5
3-pi
n SO
T-23
TP06
20−2
0012
.015
0−2
.43-
pin
TO-9
2TP
2520
−200
12.0
125
−2.0
3-pi
n SO
T-89
TP25
22−2
2012
.012
5−2
.43-
pin
SOT-
89TP
5322
−220
12.0
110
−2.4
3-pi
n SO
T-89
, 3-p
in S
OT-
23TP
2424
−240
8.0
200
−2.4
3-pi
n SO
T-89
TP24
35−3
5015
.020
0−2
.43-
pin
SOT-
89
www.microchip.com/analog40
HIG
H-V
OLT
AGE
INTE
RFAC
E: M
OSF
ETs
– In
terfa
ce (C
ontin
ued)
Part
#BV
dss
Min
. (V)
Rds(
on) M
ax. (
Ω)
Cis
s Ty
p. (p
F)Vg
s(th
) Max
. (V)
Pack
ages
Enha
ncem
ent-
Mod
e P-
Cha
nnel
(Con
tinue
d)TP
2635
−350
15.0
300
−2.0
3-pi
n TO
-92
TP25
35−3
5025
.012
5−2
.43-
pin
TO-9
2TP
5335
−350
30.0
110
−2.4
3-pi
n SO
T-23
TP26
40−4
0015
.030
0−2
.03-
pin
TO-9
2, 8
-pin
SO
IC 1
50 m
ilTP
2540
−400
25.0
125
−2.4
3-pi
n TO
-92,
3-p
in S
OT-
89VP
2450
−500
30.0
190
−3.5
3-pi
n TO
-92,
3-p
in S
OT-
89VP
0550
−500
125.
070
−4.5
3-pi
n TO
-92
TN25
0118
2.5
110
1.0
3-pi
n SO
T-89
TN07
0220
1.3
200
1.0
3-pi
n TO
-92
VN03
0030
1.2
190
2.5
3-pi
n TO
-92
TN06
0440
0.8
190
1.6
3-pi
n TO
-92
TN25
0440
1.0
125
1.6
3-pi
n SO
T-89
TN01
0440
2.0
701.
63-
pin
TO-9
2, 3
-pin
SO
T-89
VN01
0440
3.0
652.
43-
pin
TO-9
2VN
3205
500.
330
02.
43-
pin
TO-9
2, 3
-pin
SO
T-89
TN06
0660
1.5
150
2.0
3-pi
n TO
-92
TN21
0660
2.5
502.
03-
pin
TO-9
2, 3
-pin
SO
T-23
2N66
6060
3.0
502.
03-
pin
TO-3
9TN
0106
603.
060
2.0
3-pi
n TO
-92
VN01
0660
3.0
652.
43-
pin
TO-9
2VN
0606
603.
050
2.0
3-pi
n TO
-92
VN21
0660
4.0
502.
43-
pin
TO-9
22N
7000
605.
060
3.0
3-pi
n TO
-92
2N70
0260
7.5
502.
53-
pin
SOT-
232N
7008
607.
550
2.5
3-pi
n TO
-92
VN22
22L
607.
560
2.5
3-pi
n TO
-92
VN08
0880
4.0
502.
03-
pin
TO-9
2VN
0109
903.
065
2.4
3-pi
n TO
-92
2N66
6190
4.0
502.
03-
pin
TO-3
9VN
2210
100
0.4
500
2.4
3-pi
n TO
-92,
3-p
in T
O-3
9N
-Cha
nnel
(Enh
ance
men
t-M
ode
MO
SFET
Arra
ys)
TD99
4424
06
652
8-pi
n SO
IC
Com
plim
enta
ry (E
nhan
cem
ent-
Mod
e M
OSF
ET A
rrays
)Pa
rt #
BVd
ss N
-Cha
nnel
(V)
BVd
ss P
-Cha
nnel
(V)
Rds(
on) N
-Cha
nnel
Max
. (Ω
)Rd
s(o
n) P
-Cha
nnel
Max
. (Ω
)Vg
s(th
) Max
. (V)
Det
ails
Pack
ages
TC15
5050
0−5
0060
.012
5.0
4.0
N- a
nd P
-Cha
nnel
Pair
8-pi
n SO
IC
TC23
2020
0−2
007.
012
.02.
0N-
and
P-C
hann
el Pa
ir8-
pin
SOIC
TC62
1515
0−1
504.
07.
02.
0N-
and
P-C
hann
el Pa
ir8-
pin
SOIC
TC63
2020
0−2
007.
08.
02.
0N-
and
P-C
hann
el Pa
ir8-
pin
SOIC
, 8-le
ad V
DFN
(4 x
4 m
m)
TC63
2120
0−2
007.
08.
02.
0N-
and
P-C
hann
el Pa
ir8-
lead
VDFN
(6 x
5 m
m)
TC79
2020
0−2
007.
08.
02.
02
N- a
nd P
-Cha
nnel
Pairs
12-p
in V
DFN
TC80
2020
0−2
008.
09.
53.
06
N- a
nd P
-Cha
nnel
Pairs
56-p
in V
QFN
TC82
2020
0−2
005.
36.
52.
02
N- a
nd P
-Cha
nnel
Pairs
12-p
in V
DFN
Analog and Interface Product Selector Guide 41
HIG
H-V
OLT
AGE
INTE
RFAC
E: A
pplic
atio
n Sp
ecifi
c
Part
#D
C/D
CIn
put V
olta
ge
Min
. (V)
Inpu
t Vol
tage
Max
. (V)
Out
put V
olta
ge M
in.
(Vrm
s)O
utpu
t Vol
tage
Max
. (V
rms)
Load
Min
. (pF
)Lo
ad M
ax. (
pF)
Pack
ages
Liqu
id L
ens
Driv
erHV
892
Inte
rnal
Char
ge P
ump
2.65
5.5
1060
100
200
10-p
in W
DFN
Com
plim
enta
ry M
OSF
ET L
evel
Tra
nsla
tor a
nd D
river
Part
##
of C
hann
els
Inpu
t Vol
tage
Low
(V)
Inpu
t Vol
tage
Hig
h (V
)O
utpu
t Vol
tage
Low
(V)
Out
put V
olta
ge H
igh
(V)
Inpu
t to
Out
put I
sola
tion
(V)
Pack
ages
HT04
402
3.15
5.5
610
±400
10-p
in V
DFN,
8-p
in S
OIC
150
mil
HT07
401
3.15
5.5
4.5
8.5
±400
8-pi
n SO
IC 1
50 m
il
Hig
h-Si
de C
urre
nt M
onito
r
Part
#Vi
n (V
)G
ain
Rise
and
Fal
l Tim
e (μ
s)Vs
ense
Max
. (m
V)Q
uies
cent
Cur
rent
Max
. (μA
)Pa
ckag
esHV
7800
8.0–
450
Fixe
d, 1
0.7–
2.0
500
505-
pin
SOT-
23
HV78
018.
0–45
0Fi
xed,
50.
7–2.
050
050
5-pi
n SO
T-23
HV78
028.
0–45
0Ad
just
able
0.7–
1.4
500
508-
pin
MSO
P
Faul
t Pro
tect
ion
Part
#Vo
ltage
(V)
# of
Cha
nnel
sRo
n (Ω
)Vo
ff (V
)Pa
ckag
esFP
0100
100
14.
54.
53-
pin
SOT-
89
Rela
y D
river
and
Con
trolle
r
Part
#Vi
n M
in.
(V)
Vin M
ax.
(V)
Iin M
ax.
(mA)
Osc
illat
or
Freq
uenc
y M
in.
(kH
z)
Osc
illat
or
Freq
uenc
y M
ax. (
kHz)
Osc
illat
or
Freq
uenc
y fs
ync
Min
. (kH
z)M
ax O
utpu
t D
uty
Cyc
le (%
)Ty
pica
l Cur
rent
Se
nse
Pull-
In (V
)Ty
pica
l Cur
rent
Se
nse
Hol
dEx
tern
al A
djus
tabl
e Re
gula
tor O
utpu
t Vo
ltage
(V)
Exte
rnal
Adj
usta
ble
Regu
lato
r Out
put
Cur
rent
(mA)
Pack
ages
HV99
0110
450
220
140
150
99.5
0.88
3Ad
just
able
2.0–
5.5
0–1.
014
-pin
SO
IC
LIN
EAR
LIN
EAR:
Op
Amps
Part
##
Per
Pack
age
GBW
PIq
Ty
pica
l (µ
A)Vo
s M
ax
(mV)
Typi
cal I
nput
Bi
as C
urre
nt
(pA)
Inpu
t Vol
tage
N
oise
Den
sity
(n
V/rtH
z)O
pera
ting
Volta
ge (V
)Te
mpe
ratu
re
Rang
e (°C
)Fe
atur
esPa
ckag
es
MCP
6441
19
kHz
0.45
4.5
119
0(1)
1.8
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
5-pi
n SO
T-23
(S) , 5
-pin
SC-
70(S
)
MCP
6442
29
kHz
0.45
4.5
119
0(1)
1.8
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
2 ×
3 T
DFN
MCP
6444
49
kHz
0.45
4.5
119
0(1)
1.8
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
14-p
in S
OIC
, 14-
pin
TSSO
P
MCP
6031
110
kHz
0.9
0.15
116
5(1)
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
2 ×
3 DF
N, 5
-pin
SOT-
23
MCP
6032
210
kHz
0.9
0.15
116
5(1)
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n SO
IC, 8
-pin
MSO
P
MCP
6033
110
kHz
0.9
0.15
116
5(1)
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Chip
sele
ct8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 3
DFN
MCP
6034
410
kHz
0.9
0.15
116
5(1)
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
14-p
in S
OIC
, 14-
pin
TSSO
P
MCP
6041
114
kHz
0.6
31
170(1
)1.
4 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP,
5-p
in S
OT-
23(S
)
MCP
6042
214
kHz
0.6
31
170(1
)1.
4 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
MCP
6043
114
kHz
0.6
31
170(1
)1.
4 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t, Ch
ip s
elect
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P, 6
-pin
SO
T-23
(S)
MCP
6044
414
kHz
0.6
31
170(1
)1.
4 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t14
-pin
PDI
P, 1
4-pi
n SO
IC, 1
4-pi
n TS
SOP
MIC
7111
125
kHz
207
111
01.
8 to
11
−40
to +
85Ra
il-to
-Rail
Inpu
t/Out
put
5-pi
n SO
T-23
Lege
nd:
S =
Stan
dard
Pin
out;
R =
Reve
rse
Pino
ut; U
= A
ltern
ative
Pin
out
Not
e 1:
Valu
es a
re ty
pica
l at 1
kHz
2:
Valu
es a
re ty
pica
l at 1
0 kH
z
www.microchip.com/analog42
LIN
EAR:
Op
Amps
(Con
tinue
d)
Part
##
Per
Pack
age
GBW
PIq
Ty
pica
l (µ
A)
Vos
Max
(m
V)
Typi
cal I
nput
Bi
as C
urre
nt
(pA)
Inpu
t Vol
tage
N
oise
Den
sity
(n
V/rtH
z)O
pera
ting
Volta
ge (V
)Te
mpe
ratu
re
Rang
e (°C
)Fe
atur
esPa
ckag
es
MCP
6421
190
kHz
4.4
11
95(1
)1.
8 to
5.5
−40
to +
125
Rail-t
o-Ra
il Inp
ut/O
utpu
t, En
hanc
ed E
MI R
eject
ion
5-pi
n SO
T-23
(S) , 5
-pin
SC-
70(S
)
MCP
6422
290
kHz
4.4
11
95(1
)1.
8 to
5.5
−40
to +
125
Rail-t
o-Ra
il Inp
ut/O
utpu
t, En
hanc
ed E
MI R
eject
ion
8-pi
n SO
IC, 8
-pin
MSO
PM
CP64
244
90 k
Hz4.
41
195
(1)
1.8
to 5
.5−4
0 to
+12
5Ra
il-to-
Rail I
nput
/Out
put,
Enha
nced
EM
I Reje
ctio
n14
-pin
SO
IC, 1
4-pi
n TS
SOP
MCP
6141
110
0 kH
z0.
63
117
0(1)
1.4
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
G >
10 s
tabl
e5-
pin
SOT-
23(S
) , 8-p
in P
DIP,
8-p
in S
OIC
, 8-p
in M
SOP
MCP
6142
210
0 kH
z0.
63
117
0(1)
1.4
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
G >
10 s
tabl
e8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
MCP
6143
110
0 kH
z0.
63
117
0(1)
1.4
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
G >
10 s
tabl
e, C
hip
selec
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP,
6-p
in S
OT-
23(S
) M
CP61
444
100
kHz
0.6
31
170(1
)1.
4 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t, G
>10
sta
ble
14-p
in P
DIP,
14-
pin
SOIC
, 14-
pin
TSSO
PM
CP60
61
155
kHz
190.
251
38(1
)2.
5 to
6.0
−40
to +
85Ra
il-to
-Rail
Out
put
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
TSS
OP,
5-p
in S
OT2
3(S)
MCP
607
215
5 kH
z19
0.25
138
(1)
2.5
to 6
.0−4
0 to
+85
Rail-
to-R
ail O
utpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in T
SSO
PM
CP60
81
155
kHz
190.
251
38(1
)2.
5 to
6.0
−40
to +
85Ra
il-to
-Rail
Out
put,
Chip
sele
ct
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
TSS
OP
MCP
609
415
5 kH
z19
0.25
138
(1)
2.5
to 6
.0−4
0 to
+85
Rail-
to-R
ail O
utpu
t14
-pin
PDI
P, 1
4-pi
n SO
IC, 1
4-pi
n TS
SOP
MCP
616
119
0 kH
z19
0.15
1500
032
(1)
2.3
to 5
.5−4
0 to
+85
Rail-
to-R
ail O
utpu
t, PN
P in
put
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
PM
CP61
72
190
kHz
190.
1515
000
32(1
)2.
3 to
5.5
−40
to +
85Ra
il-to
-Rail
Out
put,
PNP
inpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
MCP
618
119
0 kH
z19
0.15
1500
032
(1)
2.3
to 5
.5−4
0 to
+85
Rail-
to-R
ail O
utpu
t, Ch
ip s
elect
, PNP
inpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
MCP
619
419
0 kH
z19
0.15
1500
032
(1)
2.3
to 5
.5−4
0 to
+85
Rail-
to-R
ail O
utpu
t, PN
P in
put
14-p
in P
DIP,
14-
pin
SOIC
, 14-
pin
TSSO
P
MCP
6231
130
0 kH
z20
51
52(1
)1.
8 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP,
8-p
in 2
× 3
TDF
N,
5-pi
n SC
-70(U
) , 5-p
in S
OT-
23(S
, R, U
)
MCP
6232
230
0 kH
z20
5 1
52(1
)1.
8 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP,
8-p
in 2
× 3
TDF
NM
CP62
344
300
kHz
205
152
(1)
1.8
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
14-p
in P
DIP,
14-
pin
SOIC
, 14-
pin
TSSO
PM
CP60
511
385
kHz
300.
151
34(2
)1.
8 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
SOIC
, 8-p
in 2
× 3
DFN
, 5-p
in S
OT-
23(S
)M
CP60
522
385
kHz
300.
151
34(2
)1.
8 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
SOIC
, 8-p
in 2
× 3
DFN
MCP
6054
438
5 kH
z30
0.15
134
(2)
1.8
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
14-p
in S
OIC
, 14-
pin
TSSO
PM
IC86
11
400
kHz
4.6
1020
–2.
43 to
5.2
5−4
0 to
+85
Rail-
to-R
ail O
utpu
t 5-
pin
SC-7
0M
IC86
32
450
kHz
4.2
6.0
10–
2.0
to 5
.25
−40
to +
85Ra
il-to
-Rail
Out
put
8-pi
n SO
T-23
LMC7
101
150
0 kH
z50
06
137
2.7
to 1
2−4
0 to
+85
Rail-
to-R
ail In
put/O
utpu
t 5-
pin
SOT-
23M
IC73
001
500
kHz
1000
90.
537
2.2
to 1
0−4
0 to
+85
Rail-
to-R
ail In
put/O
utpu
t, Hi
gh O
utpu
t Driv
e5-
pin
SOT-
23, 8
-pin
MSO
P
MCP
6241
155
0 kH
z50
51
45(1
)1.
8 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP,
8-p
in 2
× 3
TDF
N,
5-pi
n SC
-70(U
) , 5-p
in S
OT-
23(S
,R, U
)
MCP
6242
255
0 kH
z50
51
45(1
)1.
8 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
MCP
6244
455
0 kH
z50
51
45(1
)1.
8 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t14
-pin
PDI
P, 1
4-pi
n SO
IC, 1
4-pi
n TS
SOP
MCP
6061
173
0 kH
z60
0.15
125
(2)
1.8
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n SO
IC, 8
-pin
2 ×
3 D
FN, 5
-pin
SO
T-23
(S)
MCP
6062
273
0 kH
z60
0.15
125
(2)
1.8
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n SO
IC, 8
-pin
2 ×
3 D
FNM
CP60
644
730
kHz
600.
151
25(2
)1.
8 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t14
-pin
SO
IC, 1
4-pi
n TS
SOP
MIC
7122
275
0 kH
z80
09
137
2.2
to 1
5−4
0 to
+85
Rail-
to-R
ail In
put/O
utpu
t 8-
pin
MSO
PM
CP60
011
1 M
Hz10
04.
51
28(1
)1.
8 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t5-
pin
SOT-
23(S
, R, U
) , 5-p
in S
C-70
(R)
MCP
6002
21
MHz
100
4.5
128
(1)
1.8
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P, 8
-pin
2 ×
3 D
FNM
CP60
044
1 M
Hz10
04.
51
28(1
)1.
8 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t14
-pin
PDI
P, 1
4-pi
n SO
IC, 1
4-pi
n TS
SOP
MCP
6401
11
MHz
454.
51
28(1
)1.
8 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t5-
pin
SOT-
23(S
, R, U
) , 5-p
in S
C-70
(R)
MCP
6402
21
MHz
454.
51
28(1
)1.
8 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
SOIC
, 8-p
in 2
× 3
TDF
NM
CP64
044
1 M
Hz45
4.5
128
(1)
1.8
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
14-p
in S
OIC
, 14-
pin
TSSO
P
MC
P641
11
1 M
Hz
471
138
(1)
1.7
to 5
.5−4
0 to
+12
5R
ail-t
o-R
ail I
nput
/Out
put,
En
hanc
ed E
MI R
ejec
tion
5-pi
n SO
T-23
(S) ,
5-pi
n SC
-70(S
)
MCP
6L01
11
MHz
855
224
(2)
1.8
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
5-pi
n SO
T-23
(S, R
, U) , 5
-pin
SC-
70(S
)
MCP
6L02
21
MHz
855
224
(2)
1.8
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n SO
IC, 8
-pin
MSO
PM
CP6L
044
1 M
Hz85
52
24(2
)1.
8 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t14
-pin
SO
IC, 1
4-pi
n TS
SOP
Lege
nd:
S =
Stan
dard
Pin
out;
R =
Reve
rse
Pino
ut; U
= A
ltern
ative
Pin
out
Not
e 1:
Valu
es a
re ty
pica
l at 1
kHz
2:
Valu
es a
re ty
pica
l at 1
0 kH
z
Analog and Interface Product Selector Guide 43
LIN
EAR:
Op
Amps
(Con
tinue
d)
Part
##
per
Pack
age
GBW
PIq
Typ
ical
(µ
A)Vo
s M
ax
(mV)
Typi
cal I
nput
Bi
as C
urre
nt
(pA)
Inpu
t Vol
tage
N
oise
Den
sity
(n
V/rtH
z)O
pera
ting
Volta
ge (V
)Te
mpe
ratu
re
Rang
e (°C
)Fe
atur
esPa
ckag
es
MCP
6071
11.
2 M
Hz11
00.
151
19(2
)1.
8 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
SOIC
, 8-p
in 2
× 3
DFN
, 5-p
in S
OT-
23(S
)
MCP
6072
21.
2 M
Hz11
00.
151
19(2
)1.
8 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
SOIC
, 8-p
in 2
× 3
DFN
MCP
6074
41.
2 M
Hz11
00.
151
19(2
)1.
8 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t14
-pin
SO
IC, 1
4-pi
n TS
SOP
MCP
6H01
11.
2 M
Hz13
53.
510
35(1
)Si
ngle
Supp
ly: 3
.5 to
16
Du
al Su
pply:
±1.
75 to
±8
−40
to +
125
Rail-
to-R
ail O
utpu
t8-
pin
SOIC
, 8-p
in 2
× 3
TDF
N, 5
-pin
SO
T-23
(S) ,
5-pi
n SC
-70(S
)
MCP
6H02
21.
2 M
Hz13
53.
510
35(1
)Si
ngle
Supp
ly: 3
.5 to
16
Du
al Su
pply:
±1.
75 to
±8
−40
to +
125
Rail-
to-R
ail O
utpu
t8-
pin
SOIC
, 8-p
in 2
× 3
TDF
N
MCP
6H04
41.
2 M
Hz13
53.
510
35(1
)Si
ngle
Supp
ly: 3
.5 to
16
Du
al Su
pply:
±1.
75 to
±8
−40
to +
125
Rail-
to-R
ail O
utpu
t14
-pin
SO
IC, 1
4-pi
n TS
SOP
MCP
6271
12
MHz
170
31
20(1
)2.
0 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
PDIP
, 8-p
in SO
IC, 8
-pin
MSO
P, 5
-pin
SOT-
23(S
, R)
MCP
6272
22
MHz
170
31
20(1
)2.
0 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
MCP
6273
12
MHz
170
31
20(1
)2.
0 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t, Ch
ip s
elect
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P, 6
-pin
SO
T-23
(S)
MCP
6274
42
MHz
170
31
20(1
)2.
0 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t14
-pin
PDI
P, 1
4-pi
n SO
IC, 1
4-pi
n TS
SOP
MCP
6275
22
MHz
150
3 1
20(1
)2.
0 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t, Du
al co
nnec
ted,
Chi
p se
lect
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P
MCP
6471
12
MHz
100
1.5
127
(1)
2.0
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
5-pi
n SO
T-23
(S) , 5
-pin
SC-
70(S
)
MCP
6472
22
MHz
100
1.5
127
(1)
2.0
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
2 ×
3 T
DFN
MCP
6474
42
MHz
100
1.5
127
(1)
2.0
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
14-p
in S
OIC
, 14-
pin
TSSO
PM
CP6L
711
2 M
Hz15
04
119
(2)
2.0
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n SO
IC(S
) , 8-p
in M
SOP(S
) , 5-p
in S
OT-
23(S
, R)
MCP
6L72
22
MHz
150
41
19(2
)2.
0 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
SOIC
, 8-p
in M
SOP
MCP
6L74
42
MHz
150
41
19(2
)2.
0 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t14
-pin
SO
IC, 1
4-pi
n TS
SOP
MIC
6211
12.
5 M
Hz12
007
5000
0–
4.0
to 3
2−4
0 to
+85
–5-
pin
SOT-
23
MCP
6H71
12.
7 M
Hz48
04
1028
(1)
Sing
le Su
pply:
3.5
to 1
2
Dual
Supp
ly: ±
1.75
to ±
6−4
0 to
+12
5Ra
il-to
-Rail
Out
put
8-pi
n SO
IC, 8
-pin
2 ×
3 T
DFN
MCP
6H72
22.
7 M
Hz48
04
1028
(1)
Sing
le Su
pply:
3.5
to 1
2
Dual
Supp
ly: ±
1.75
to ±
6−4
0 to
+12
5Ra
il-to
-Rail
Out
put
8-pi
n SO
IC, 8
-pin
2 ×
3 T
DFN
MCP
6H74
42.
7 M
Hz48
04
1028
(1)
Sing
le Su
pply:
3.5
to 1
2
Dual
Supp
ly: ±
1.75
to ±
6−4
0 to
+12
5Ra
il-to
-Rail
Out
put
14-p
in S
OIC
, 14-
pin
TSSO
P
MCP
601
12.
8 M
Hz23
02
129
(1)
2.7
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Out
put
8-pi
n PD
IP, 8
-pin
SOIC
, 8-p
in TS
SOP,
5-p
in SO
T-23
(S, R
)
MCP
602
22.
8 M
Hz23
02
129
(1)
2.7
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Out
put
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
TSS
OP
MCP
603
12.
8 M
Hz23
02
129
(1)
2.7
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
Chip
sele
ct8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in T
SSO
P, 6
-pin
SO
T-23
(S)
MCP
604
42.
8 M
Hz23
02
129
(1)
2.7
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Out
put
14-p
in P
DIP,
14-
pin
SOIC
, 14-
pin
TSSO
PM
CP6L
11
2.8
MHz
200
31
21(2
)2.
7 to
6.0
−40
to +
125
Rail-
to-R
ail O
utpu
t8-
pin
SOIC
(S) , 8
-pin
MSO
P(S) , 5
-pin
SO
T-23
(S, R
)
MCP
6L2
22.
8 M
Hz20
03
121
(2)
2.7
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Out
put
8-pi
n SO
IC, 8
-pin
MSO
PM
CP6L
44
2.8
MHz
200
31
21(2
)2.
7 to
6.0
−40
to +
125
Rail-
to-R
ail O
utpu
t14
-pin
SO
IC, 1
4-pi
n TS
SOP
MIC
862
23.
0 M
Hz31
610
-2.
0 to
5.2
5−4
0 to
+85
Rail-
to-R
ail O
utpu
t 8-
pin
SOT-
23M
CP62
861
3.5
MHz
540
1.5
15.
4(2)
2.2
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
Low
noi
se5-
pin
SOT-
23(S
, R)
MIC
860
14.
0 M
Hz33
2020
-2.
43 to
5.2
5−4
0 to
+85
Rail-
to-R
ail O
utpu
t 5-
pin
SC-7
0M
CP64
811
4 M
Hz24
01.
51
23(1
)2.
2 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t5-
pin
SOT-
23(S
) , 5-p
in S
C-70
(S)
MCP
6482
24
MHz
240
1.5
123
(1)
2.2
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
2 ×
3 T
DFN
MCP
6484
44
MHz
240
1.5
123
(1)
2.2
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
14-p
in S
OIC
, 14-
pin
TSSO
PM
CP62
811
5 M
Hz44
53
116
(1)
2.2
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n PD
IP, 8
-pin
SOIC
, 8-p
in M
SOP,
5-p
in SO
T-23
(S, R
)
MCP
6282
25
MHz
445
31
16(1
)2.
2 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
MCP
6283
15
MHz
445
31
16(1
)2.
2 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t, Ch
ip s
elect
8-pi
n PD
IP, 8
-pin
SOIC
, 8-p
in M
SOP,
6-p
in SO
T-23
(S, R
)
MCP
6284
45
MHz
445
31
16(1
)2.
2 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t14
-pin
PDI
P, 1
4-pi
n SO
IC, 1
4-pi
n TS
SOP
Lege
nd:
S =
Stan
dard
Pin
out;
R =
Reve
rse
Pino
ut; U
= A
ltern
ative
Pin
out
Not
e 1:
Valu
es a
re ty
pica
l at 1
kHz
2:
Valu
es a
re ty
pica
l at 1
0 kH
z
www.microchip.com/analog44
LIN
EAR:
Op
Amps
(Con
tinue
d)
Part
##
per
Pack
age
GBW
PIq
Typ
ical
(µ
A)Vo
s M
ax
(mV)
Typi
cal I
nput
Bi
as C
urre
nt
(pA)
Inpu
t Vol
tage
N
oise
Den
sity
(n
V/rtH
z)O
pera
ting
Volta
ge (V
)Te
mpe
ratu
re
Rang
e (°C
)Fe
atur
esPa
ckag
es
MCP
6285
25
MHz
400
31
16(1
)2.
2 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t, Du
al co
nnec
ted,
Chi
p se
lect
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P
MCP
6H81
15.
5 M
Hz70
04
1023
(1)
Sing
le Su
pply:
3.5
to 1
2
Dual
Supp
ly: ±
1.75
to ±
6−4
0 to
+12
5Ra
il-to
-Rail
Out
put
8-pi
n SO
IC, 8
-pin
2 ×
3 T
DFN
MCP
6H82
25.
5 M
Hz70
04
1023
(1)
Sing
le Su
pply:
3.5
to 1
2
Dual
Supp
ly: ±
1.75
to ±
6−4
0 to
+12
5Ra
il-to
-Rail
Out
put
8-pi
n SO
IC, 8
-pin
2 ×
3 T
DFN
MCP
6H84
45.
5 M
Hz70
04
1023
(1)
Sing
le Su
pply:
3.5
to 1
2
Dual
Supp
ly: ±
1.75
to ±
6−4
0 to
+12
5Ra
il-to
-Rail
Out
put
14-p
in S
OIC
, 14-
pin
2 ×
3 TD
FN
MCP
6491
17.
5 M
Hz53
01.
51
19(1
)2.
4 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t5-
pin
SOT-
23(S
) , 5-p
in S
C-70
(S)
MCP
6492
27.
5 M
Hz53
01.
51
19(1
)2.
4 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 3
TDF
NM
CP64
944
7.5
MHz
530
1.5
119
(1)
2.4
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
14-p
in S
OIC
, 14-
pin
TSSO
P
MCP
6021
110
MHz
1000
0.5
18.
7(2)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
1/2
Vcc
Vref
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
TSS
OP,
8-p
in M
SOP,
5-
pin
SOT-
23(S
, R)
MCP
6022
210
MHz
1000
0.5
18.
7(2)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
TSS
OP
MCP
6023
110
MHz
1000
0.5
18.
7(2)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Chip
sele
ct,
1/2
Vcc
Vref
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
TSS
OP
MCP
6024
410
MHz
1000
0.5
18.
7(2)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
14-p
in P
DIP,
14-
pin
SOIC
, 14-
pin
TSSO
PM
CP62
911
10 M
Hz10
003
18.
7(2)
2.4
to 6
.0−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n PD
IP, 8
-pin
SOIC
, 8-p
in M
SOP,
5-p
in SO
T-23
(S, R
)
MCP
6292
210
MHz
1000
31
8.7(2
)2.
4 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
MCP
6293
110
MHz
1000
31
8.7(2
)2.
4 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t, Ch
ip s
elect
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P, 6
-pin
SO
T-23
(S)
MCP
6294
410
MHz
1000
31
8.7(2
)2.
4 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t14
-pin
PDI
P, 1
4-pi
n SO
IC, 1
4-pi
n TS
SOP
MCP
6295
210
MHz
1100
31
8.7(2
)2.
4 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t, Du
al co
nnec
ted,
Chi
p se
lect
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P
MCP
6H91
110
MHz
2000
410
23(1
)Si
ngle
Supp
ly: 3
.5 to
12
Dual
Supp
ly: ±
1.75
to ±
6−4
0 to
+12
5Ra
il-to
-Rail
Out
put
8-pi
n SO
IC, 8
-pin
2 ×
3 T
DFN
MCP
6H92
210
MHz
2000
410
23(1
)Si
ngle
Supp
ly: 3
.5 to
12
Dual
Supp
ly: ±
1.75
to ±
6−4
0 to
+12
5Ra
il-to
-Rail
Out
put
8-pi
n SO
IC, 8
-pin
2 ×
3 T
DFN
MCP
6H94
410
MHz
2000
410
23(1
)Si
ngle
Supp
ly: 3
.5 to
12
Dual
Supp
ly: ±
1.75
to ±
6−4
0 to
+12
5Ra
il-to
-Rail
Out
put
14-p
in S
OIC
, 14-
pin
TSSO
P
MCP
6L91
110
MHz
850
41
9.4(2
)2.
4 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
SOIC
(S) , 8
-pin
MSO
P(S) , 5
-pin
SO
T-23
(S, R
)
MCP
6L92
210
MHz
850
41
9.4(2
)2.
4 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
SOIC
, 8-p
in M
SOP
MCP
6L94
410
MHz
850
41
9.4(2
)2.
4 to
6.0
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t14
-pin
SO
IC, 1
4-pi
n TS
SOP
MCP
621
120
MHz
2500
0.2
513
(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
Chip
sele
ct,
mCa
l Tec
hnol
ogy
8-pi
n SO
IC, 8
-pin
2 ×
3 T
DFN
MCP
621S
120
MHz
2500
0.2
513
(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
mCa
l Tec
hnol
ogy
5-pi
n SO
T-23
(S)
MCP
622
220
MHz
2500
0.2
513
(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
mCa
l Tec
hnol
ogy
8-pi
n SO
IC, 8
-pin
3 ×
3 D
FN
MCP
623
120
MHz
2500
0.2
513
(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
Chip
sele
ct,
mCa
l Tec
hnol
ogy
6-pi
n SO
T-23
(S)
MCP
624
420
MHz
2500
0.2
513
(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
mCa
l Tec
hnol
ogy
14-p
in S
OIC
, 14-
pin
TSSO
P
MCP
625
220
MHz
2500
0.2
513
(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
Chip
sele
cts,
m
Cal T
echn
olog
y10
-pin
MSO
P, 1
0-pi
n 3
× 3
DFN
MCP
629
420
MHz
2500
0.2
513
(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,C
hip
selec
ts,
mCa
l Tec
hnol
ogy
16-p
in 4
× 4
QFN
MCP
631
124
MHz
2500
84
10(3
)2.
5 to
5.5
−40
to +
125
Rail-
to-R
ail O
utpu
t8-
pin
SOIC
, 8-p
in 2
× 3
TDF
N, 5
-pin
SO
T-23
(S)
MCP
632
224
MHz
2500
84
10(3
)2.
5 to
5.5
−40
to +
125
Rail-
to-R
ail O
utpu
t8-
pin
SOIC
, 8-p
in 3
× 3
DFN
MCP
633
124
MHz
2500
84
10(3
)2.
5 to
5.5
−40
to +
125
Rail-
to-R
ail O
utpu
t, Ch
ip s
elect
8-pi
n SO
IC, 6
-pin
SO
T-23
Lege
nd:
S =
Stan
dard
Pin
out;
R =
Reve
rse
Pino
ut; U
= A
ltern
ative
Pin
out
Not
e 1:
Valu
es a
re ty
pica
l at 1
kHz
2:
Valu
es a
re ty
pica
l at 1
0 kH
z 3:
Valu
es a
re ty
pica
l at 1
MHz
Analog and Interface Product Selector Guide 45
LIN
EAR:
Op
Amps
(Con
tinue
d)
Part
##
per
Pack
age
GBW
PIq
Typ
ical
(µ
A)Vo
s M
ax
(mV)
Typi
cal I
nput
Bi
as C
urre
nt
(pA)
Inpu
t Vol
tage
N
oise
Den
sity
(n
V/rtH
z)O
pera
ting
Volta
ge (V
)Te
mpe
ratu
re
Rang
e (°C
)Fe
atur
esPa
ckag
es
MCP
634
424
MHz
2500
84
10(3
)2.
5 to
5.5
−40
to +
125
Rail-
to-R
ail O
utpu
t14
-pin
SO
IC, 1
4-pi
n TS
SOP
MCP
635
224
MHz
2500
84
10(3
)2.
5 to
5.5
−40
to +
125
Rail-
to-R
ail O
utpu
t, Ch
ip s
elect
s10
-pin
MSO
P, 1
0-pi
n 3
× 3
DFN
MCP
639
424
MHz
2500
84
10(3
)2.
5 to
5.5
−40
to +
125
Rail-
to-R
ail O
utpu
t, Ch
ip s
elect
s16
-pin
4 ×
4 Q
FN
MCP
651
150
MHz
6000
0.2
67.
5(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
Chip
sele
ct,
mCa
l Tec
hnol
ogy
8-pi
n SO
IC, 8
-pin
2 ×
3 T
DFN
MCP
651S
150
MHz
6000
0.2
67.
5(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
mCa
l Tec
hnol
ogy
5-pi
n SO
T-23
(S)
MCP
652
250
MHz
6000
0.2
67.
5(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
mCa
l Tec
hnol
ogy
8-pi
n SO
IC, 8
-pin
3 ×
3 D
FN
MCP
653
150
MHz
6000
0.2
67.
5(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
Chip
sele
ct,
mCa
l Tec
hnol
ogy
6-pi
n SO
T-23
(S)
MCP
654
450
MHz
6000
0.2
67.
5(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
mCa
l Tec
hnol
ogy
14-p
in S
OIC
, 14-
pin
TSSO
P
MCP
655
250
MHz
6000
0.2
67.
5(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
Chip
sele
cts,
m
Cal T
echn
olog
y10
-pin
MSO
P, 1
0-pi
n 3
× 3
DFN
MCP
659
450
MHz
6000
0.2
67.
5(3)
2.5
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Out
put,
Chip
sele
cts,
m
Cal T
echn
olog
y16
-pin
4 ×
4 Q
FN
MCP
660
360
MHz
6000
86
6.8(
3)2.
5 to
5.5
−40
to +
125
Rail-
to-R
ail O
utpu
t14
-pin
SO
IC, 1
4-pi
n TS
SOP
MCP
661
160
MHz
6000
86
6.8(
3)2.
5 to
5.5
−40
to +
125
Rail-
to-R
ail O
utpu
t8-
pin
SOIC
, 8-p
in 2
× 3
TDF
N, 5
-pin
SO
T-23
(S)
MCP
662
260
MHz
6000
86
6.8(
3)2.
5 to
5.5
−40
to +
125
Rail-
to-R
ail O
utpu
t8-
pin
SOIC
, 8-p
in 3
× 3
DFN
MCP
663
160
MHz
6000
86
6.8(
3)2.
5 to
5.5
−40
to +
125
Rail-
to-R
ail O
utpu
t, Ch
ip s
elect
8-pi
n SO
IC, 6
-pin
SO
T-23
MCP
664
460
MHz
6000
86
6.8(
3)2.
5 to
5.5
−40
to +
125
Rail-
to-R
ail O
utpu
t14
-pin
SO
IC, 1
4-pi
n TS
SOP
MCP
665
260
MHz
6000
86
6.8(
3)2.
5 to
5.5
−40
to +
125
Rail-
to-R
ail O
utpu
t, Ch
ip s
elect
s10
-pin
MSO
P, 1
0-pi
n 3
× 3
DFN
MCP
669
460
MHz
6000
86
6.8(
3)2.
5 to
5.5
−40
to +
125
Rail-
to-R
ail O
utpu
t, Ch
ip s
elect
s16
-pin
4 ×
4 Q
FN
MIC
920
180
MHz
550
526
0000
105.
0 to
18
−40
to +
85Hi
gh O
utpu
t Driv
e, H
igh
Slew
Rat
e5-
pin
SC-7
0, 5
-pin
SO
T-23
Lege
nd:
S =
Stan
dard
Pin
out;
R =
Reve
rse
Pino
ut; U
= A
ltern
ative
Pin
out
Not
e 1:
Valu
es a
re ty
pica
l at 1
kHz
2:
Valu
es a
re ty
pica
l at 1
0 kH
z 3:
Valu
es a
re ty
pica
l at 1
MHz
LIN
EAR:
Zer
o-D
rift O
pera
tiona
l Am
plifi
ers
Part
##
per
Pack
age
GBW
PIq
Max
(m
A)Vo
s M
ax
(µV)
Vos
Drif
t Max
(µ
V/°C
)O
pera
ting
Volta
ge (V
)Te
mpe
ratu
re
Rang
e (°C
)Fe
atur
esPa
ckag
es
MCP
6V11
180
kHz
0.01
18
0.05
1.6
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
5-pi
n SO
T-23
(S, U
) , 5-p
in S
C-70
(U)
MCP
6V12
280
kHz
0.01
18
0.05
1.6
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n 2
× 3
TDFN
, 8-p
in M
SOP
MCP
6V14
480
kHz
0.01
18
0.05
1.6
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
14-p
in T
SSO
P
MCP
6V31
130
0 kH
z0.
034
80.
051.
8 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t5-
pin
SOT-
23(S
, U) , 5
-pin
SC-
70(U
)
MCP
6V32
230
0 kH
z0.
034
80.
051.
8 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
2 ×
3 TD
FN, 8
-pin
MSO
P
MCP
6V34
430
0 kH
z0.
034
80.
051.
8 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t14
-pin
TSS
OP
TC76
521
0.4
MHz
35
0.05
5 to
16
0 to
+70
Sing
le an
d Sp
lit Su
pply,
Low
Noi
se8-
pin
PDIP
, 14-
pin
PDIP
MCP
6V61
11
MHz
0.13
80.
015
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Enha
nced
EM
I Reje
ctio
n5-
pin
SOT-
23(S
, U) , 5
-pin
SC-
70(U
)
MCP
6V62
21
MHz
0.13
80.
015
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Enha
nced
EM
I Reje
ctio
n8-
pin
2 ×
3 TD
FN, 8
-pin
MSO
P
MCP
6V64
41
MHz
0.13
80.
015
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Enha
nced
EM
I Reje
ctio
n14
-pin
TSS
OP
MCP
6V01
11.
3 M
Hz0.
42
0.05
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n SO
IC, 8
-pin
2 ×
3 T
DFN
MCP
6V02
21.
3 M
Hz0.
42
0.05
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n SO
IC, 8
-pin
4 ×
4 D
FN
MCP
6V03
11.
3 M
Hz0.
42
0.05
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Chip
sele
ct8-
pin
SOIC
, 8-p
in 2
× 3
TDF
N
MCP
6V06
11.
3 M
Hz0.
43
0.05
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n SO
IC, 8
-pin
2 ×
3 T
DFN
www.microchip.com/analog46
LIN
EAR:
Zer
o-D
rift O
pera
tiona
l Am
plifi
ers
(Con
tinue
d)
Part
##
per
Pack
age
GBW
PIq
Max
(m
A)Vo
s M
ax
(µV)
Vos
Drif
t Max
(µ
V/°C
)O
pera
ting
Volta
ge (V
)Te
mpe
ratu
re
Rang
e (°C
)Fe
atur
esPa
ckag
es
MCP
6V07
21.
3 M
Hz0.
43
0.05
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put
8-pi
n SO
IC, 8
-pin
4 ×
4 D
FN
MCP
6V08
11.
3 M
Hz0.
43
0.05
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Chip
sele
ct8-
pin
SOIC
, 8-p
in 2
× 3
TDF
N
TC91
3A/B
21.
5 M
Hz1.
115
0.15
/0.3
07
to 1
60
to +
70Si
ngle
and
Split
Supp
ly8-
pin
PDIP
, 8-p
in S
OIC
TC76
501
2 M
Hz3.
55
0.05
4.5
to 1
60
to +
70Si
ngle
and
Split
Supp
ly8-
pin
PDIP
, 14-
pin
PDIP
MCP
6V26
12
MHz
0.8
20.
052.
3 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t 8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 3
TDF
N
MCP
6V27
22
MHz
0.8
20.
052.
3 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 4
× 4
DFN
MCP
6V28
12
MHz
0.8
20.
052.
3 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t, Ch
ip s
elect
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
2 ×
3 T
DFN
MCP
6V71
12
MHz
0.26
80.
015
2.0
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Enha
nced
EM
I Reje
ctio
n5-
pin
SOT-
23(S
, U) , 5
-pin
SC-
70(U
)
MCP
6V72
22
MHz
0.26
80.
015
2.0
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Enha
nced
EM
I Reje
ctio
n8-
pin
2 ×
3 TD
FN, 8
-pin
MSO
P
MCP
6V74
42
MHz
0.26
80.
015
2.0
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Enha
nced
EM
I Reje
ctio
n14
-pin
TSS
OP
MCP
6V81
15
MHz
0.77
90.
022.
2 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t, En
hanc
ed E
MI R
eject
ion
5-pi
n SO
T-23
(S, U
) , 5-p
in S
C-70
(U)
MCP
6V82
25
MHz
0.77
90.
059
2.2
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Enha
nced
EM
I Reje
ctio
n8-
pin
2 ×
3 TD
FN, 8
-pin
MSO
P
MCP
6V84
45
MHz
0.77
90.
059
2.2
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Enha
nced
EM
I Reje
ctio
n14
-pin
TSS
OP
MCP
6V91
110
MHz
1.6
90.
017
2.4
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Enha
nced
EM
I Reje
ctio
n5-
pin
SOT-
23(S
, U),
5-pi
n SC
-70(
U)
MCP
6V92
210
MHz
1.6
90.
042.
4 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t, En
hanc
ed E
MI R
eject
ion
8-pi
n 2
× 3
TDFN
, 8-p
in M
SOP
MCP
6V94
410
MHz
1.6
90.
042.
4 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t, En
hanc
ed E
MI R
eject
ion
14-p
in T
SSO
P
LIN
EAR:
Pro
gram
mab
le G
ain
Ampl
ifier
s (P
GA)
Part
#C
hann
els
−3dB
BW
(MH
z)Iq
Typ
. (m
A)Vo
s (µ
V)O
pera
ting
Volta
ge (V
)Te
mpe
ratu
re R
ange
(°C
)Fe
atur
esPa
ckag
es
MCP
6S21
12
to 1
21.
127
52.
5 to
5.5
−40
to +
85SP
I, Ei
ght G
ain s
teps
, Sof
twar
e sh
utdo
wn
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P
MCP
6S22
22
to 1
21.
127
52.
5 to
5.5
−40
to +
85SP
I, Ei
ght G
ain s
teps
, Sof
twar
e sh
utdo
wn
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P
MCP
6S26
62
to 1
21.
127
52.
5 to
5.5
−40
to +
85SP
I, Ei
ght G
ain s
teps
, Sof
twar
e sh
utdo
wn
14-p
in P
DIP,
14-
pin
SOIC
, 14-
pin
TSSO
P
MCP
6S28
82
to 1
21.
127
52.
5 to
5.5
−40
to +
85SP
I, Ei
ght G
ain s
teps
, Sof
twar
e sh
utdo
wn
16-p
in P
DIP,
16-
pin
SOIC
MCP
6S91
11
to 1
81.
040
002.
5 to
5.5
−40
to +
125
SPI,
Eigh
t Gain
ste
ps, S
oftw
are
shut
dow
n, V
ref
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P
MCP
6S92
21
to 1
81.
040
002.
5 to
5.5
−40
to +
125
SPI,
Eigh
t Gain
ste
ps, S
oftw
are
shut
dow
n8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
MCP
6S93
21
to 1
81.
040
002.
5 to
5.5
−40
to +
125
SPI,
Eigh
t Gain
ste
ps, S
oftw
are
shut
dow
n, V
ref,
SO10
-pin
MSO
P
LIN
EAR:
Sel
ecta
ble
Gai
n Am
plifi
ers
(SG
A)
Part
#C
hann
els
−3dB
BW
(kH
z)Iq
(µA)
Vos
(mV)
Ope
ratin
g Vo
ltage
(V)
Tem
pera
ture
Ran
ge (°
C)
Gai
n St
eps
(V/V
)Fe
atur
esPa
ckag
es
MCP
6G01
190
011
04.
51.
8 to
5.5
−40
to +
125
1, 1
0, 5
0Tr
i-Sta
te c
ontro
l pin
8-pi
n SO
IC, 8
-pin
MSO
P, 5
-pin
SO
T-23
(S, R
, U)
MCP
6G02
290
011
04.
51.
8 to
5.5
−40
to +
125
1, 1
0, 5
0Tr
i-Sta
te c
ontro
l pin
8-pi
n SO
IC, 8
-pin
MSO
P
MCP
6G03
190
011
04.
51.
8 to
5.5
−40
to +
125
1, 1
0, 5
0Tr
i-Sta
te c
ontro
l pin
, chi
p se
lect
8-pi
n SO
IC, 8
-pin
MSO
P
MCP
6G04
490
011
04.
51.
8 to
5.5
−40
to +
125
1, 1
0, 5
0Tr
i-Sta
te c
ontro
l pin
14-p
in S
OIC
, 14-
pin
TSSO
P
LIN
EAR:
Ins
trum
enta
tion
Ampl
ifier
s Pa
rt #
# Pe
r Pac
kage
Band
wid
th (k
Hz)
Iq M
ax (m
A)M
ax V
os (
µV)
Vos D
rift M
ax (µ
V/°C
)O
pera
ting
Volta
ge (V
)Te
mpe
ratu
re R
ange
(°C)
Feat
ures
Pack
ages
MCP
6N11
150
01.
135
02.
71.
8 to
5.5
−40
to +
125
Rail-
to-R
ail In
put/O
utpu
t, m
Cal T
echn
olog
y8-
pin
SOIC
, 8-p
in 2
× 3
TDF
N
MCP
6N16
150
01.
617
0.06
1.8
to 5
.5−4
0 to
+12
5Ra
il-to
-Rail
Inpu
t/Out
put,
Enab
le Pi
n,
Enha
nced
EM
I Reje
ctio
n8-
pin
MSO
P, 8
-pin
3 ×
3 D
FN
Lege
nd:
S =
Stan
dard
Pin
out;
R =
Reve
rse
Pino
ut; U
= A
ltern
ative
Pin
out
Analog and Interface Product Selector Guide 47
LIN
EAR:
Com
para
tors
Part
##
Per
Pack
age
Vref
(V
)Ty
pica
l Pro
paga
tion
Del
ay (µ
s)Iq
Typ
ical
(µ
A)Vo
s M
ax
(mV)
Ope
ratin
g Vo
ltage
(V)
Tem
pera
ture
Ra
nge
(°C)
Feat
ures
Pack
ages
MCP
6541
1–
41
51.
6 to
5.5
−40
to +
125
Push
-Pul
l, Ra
il-to
-Rail
Inpu
t/Out
put
5-pi
n SO
T-23
(S, R
, U) , 5
-pin
SC-
70(S
, U) ,
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
PM
CP65
422
–4
15
1.6
to 5
.5−4
0 to
+12
5Pu
sh-P
ull,
Rail-
to-R
ail In
put/O
utpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
MCP
6543
1–
41
51.
6 to
5.5
−40
to +
125
Push
-Pul
l, Ra
il-to
-Rail
Inpu
t/Out
put,
Chip
sele
ct8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
MCP
6544
4–
41
51.
6 to
5.5
−40
to +
125
Push
-Pul
l, Ra
il-to
-Rail
Inpu
t/Out
put
14-p
in P
DIP,
14-
pin
SOIC
, 14-
pin
TSSO
P
MCP
6546
1–
41
51.
6 to
5.5
−40
to +
125
Ope
n-dr
ain, 9
V, R
ail-to
-Rail
Inpu
t/Out
put
5-pi
n SO
T-23
(S, R
, U) , 5
-pin
SC-
70(S
, U) ,
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
PM
CP65
472
–4
15
1.6
to 5
.5−4
0 to
+12
5O
pen-
drain
, 9V,
Rail
-to-R
ail In
put/O
utpu
t8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
MCP
6548
1–
41
51.
6 to
5.5
−40
to +
125
Ope
n-dr
ain, 9
V, R
ail-to
-Rail
Inpu
t/Out
put,
Chip
sele
ct8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP
MCP
6549
4–
41
51.
6 to
5.5
−40
to +
125
Ope
n-dr
ain, 9
V, R
ail-to
-Rail
Inpu
t/Out
put
14-p
in P
DIP,
14-
pin
SOIC
, 14-
pin
TSSO
PM
CP65
R41
11.
21/2
.44
2.5
101.
8 to
5.5
−40
to +
125
Push
-Pul
l, Ra
il-to
-Rail
Inpu
t/Out
put,
Vref
6-pi
n SO
T-23
MCP
65R4
61
1.21
/2.4
42.
510
1.8
to 5
.5−4
0 to
+12
5O
pen
Drain
, Rail
-to-R
ail In
put/O
utpu
t, Vr
ef6-
pin
SOT-
23M
CP65
611
–0.
047
100
101.
8 to
5.5
−40
to +
125
Push
-Pul
l, Ra
il-to
-Rail
Inpu
t/Out
put
5-pi
n SO
T-23
(S, R
, U) , 5
-pin
SC-
70(S
)
MCP
6562
2–
0.04
710
010
1.8
to 5
.5−4
0 to
+12
5Pu
sh-P
ull,
Rail-
to-R
ail In
put/O
utpu
t8-
pin
SOIC
, 8-p
in M
SOP
MCP
6564
4–
0.04
710
010
1.8
to 5
.5−4
0 to
+12
5Pu
sh-P
ull,
Rail-
to-R
ail In
put/O
utpu
t14
-pin
SO
IC, 1
4-pi
n TS
SOP
MCP
6566
1–
0.04
710
010
1.8
to 5
.5−4
0 to
+12
5O
pen-
Drain
, Rail
-to-R
ail In
put/O
utpu
t5-
pin
SOT-
23(S
, R, U
) , 5-p
in S
C-70
(S)
MCP
6567
2–
0.04
710
010
1.8
to 5
.5−4
0 to
+12
5O
pen-
Drain
, Rail
-to-R
ail In
put/O
utpu
t8-
pin
SOIC
, 8-p
in M
SOP
MCP
6569
4–
0.04
710
010
1.8
to 5
.5−4
0 to
+12
5O
pen-
Drain
, Rail
-to-R
ail In
put/O
utpu
t14
-pin
SO
IC, 1
4-pi
n TS
SOP
MIC
6270
1–
0.6
300
52.
0 to
36
−40
to +
85O
pen
Colle
ctor
Out
put,
High
-Vol
tage
5-pi
n SO
T-23
MIC
7211
1–
45
102.
2 to
5.0
−40
to +
85Ra
il-to
-Rail
Inpu
t, Pu
sh-P
ull O
utpu
t5-
pin
SOT-
23M
IC72
211
–4
510
2.2
to 5
.0−4
0 to
+85
Rail-
to-R
ail In
put,
Ope
n-Dr
ain O
utpu
t5-
pin
SOT-
23M
IC83
31
1.25
51
–1.
5 to
5.5
−40
to +
85W
indo
wed
Com
para
tor w
ith A
djus
tabl
e Hy
ster
sis5-
pin
SOT-
23
MIC
841
11.
2512
1.5
–1.
5 to
5.5
−40
to +
85W
indo
wed
Com
para
tor w
ith A
djus
tabl
e Hy
ster
sis, P
ush-
Pull a
nd O
pen-
Drain
Out
put O
ptio
ns5-
pin
SC-7
0, 6
-pin
1.6
× 1
.6 T
DFN
MIC
842
11.
2512
1.5
–1.
5 to
5.5
−40
to +
85W
indo
wed
Com
para
tor w
ith H
yste
rsis,
Pus
h-Pu
ll and
O
pen-
Drain
Out
put O
ptio
ns5-
pin
SC-7
0, 4
-pin
1.2
× 1
.6 T
DFN
Lege
nd:
S =
Stan
dard
Pin
out;
R =
Reve
rse
Pino
ut; U
= A
ltern
ative
Pin
out
MIX
ED S
IGN
ALM
IXED
SIG
NAL
: S
ucce
ssiv
e Ap
prox
imat
ion
Regi
ster
(SAR
) A/D
Con
verte
rs
Part
#Re
solu
tion
(bits
)M
axim
um S
ampl
ing
Rate
(k
sam
ples
/sec
)#
of In
put
Cha
nnel
sIn
put T
ype
Inte
rface
Inpu
t Vol
tage
Ra
nge
(V)
Max
. Sup
ply
Cur
rent
(µA)
Max
. IN
L Te
mpe
ratu
re
Rang
e (°C
)Pa
ckag
es
MCP
3021
1022
1Si
ngle-
ende
dI2 C
2.7
to 5
.525
0 ±
1 LS
B−4
0 to
+12
55-
pin
SOT-
23A
MCP
3001
1020
01
Sing
le-en
ded
SPI
2.7
to 5
.550
0 ±
1 LS
B−4
0 to
+85
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P, 8
-pin
TSS
OP
MCP
3002
1020
02
Sing
le-en
ded
SPI
2.7
to 5
.565
0±1
LSB
−40
to +
858-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP,
8-p
in T
SSO
P
MCP
3004
1020
04
Sing
le-en
ded
SPI
2.7
to 5
.555
0±1
LSB
−40
to +
8514
-pin
PDI
P, 1
4-pi
n SO
IC, 1
4-pi
n TS
SOP
MCP
3008
1020
08
Sing
le-en
ded
SPI
2.7
to 5
.555
0±1
LSB
−40
to +
8516
-pin
PDI
P, 1
6-pi
n SO
IC
MCP
3221
1222
1Si
ngle-
ende
dI2 C
2.7
to 5
.525
0±2
LSB
−40
to +
125
5-pi
n SO
T-23
A
MCP
3201
1210
01
Sing
le-en
ded
SPI
2.7
to 5
.540
0±1
LSB
−40
to +
858-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP,
8-p
in T
SSO
P
MCP
3202
1210
02
Sing
le-en
ded
SPI
2.7
to 5
.555
0±1
LSB
−40
to +
858-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP,
8-p
in T
SSO
P
MCP
3204
1210
04
Sing
le-en
ded
SPI
2.7
to 5
.540
0±1
LSB
−40
to +
8514
-pin
PDI
P, 1
4-pi
n SO
IC, 1
4-pi
n TS
SOP
MCP
3208
1210
08
Sing
le-en
ded
SPI
2.7
to 5
.540
0±1
LSB
−40
to +
8516
-pin
PDI
P, 1
6-pi
n SO
IC
MCP
3301
1310
01
Diffe
rent
ialSP
I2.
7 to
5.5
450
±1 L
SB−4
0 to
+85
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P, 8
-pin
TSS
OP
MCP
3302
1310
02
Diffe
rent
ialSP
I2.
7 to
5.5
450
±1 L
SB−4
0 to
+85
14-p
in P
DIP,
14-
pin
SOIC
, 14-
pin
TSSO
P
MCP
3304
1310
04
Diffe
rent
ialSP
I2.
7 to
5.5
450
±1 L
SB−4
0 to
+85
16-p
in P
DIP,
16-
pin
SOIC
www.microchip.com/analog48
MIX
ED S
IGN
AL:
Del
ta-S
igm
a A/
D C
onve
rters
Part
#Re
solu
tion
(bits
)M
axim
um S
ampl
ing
Rate
(sam
ples
/sec
)#
of In
put
Cha
nnel
sIn
terfa
ceSu
pply
Vol
tage
Ra
nge
(V)
Typi
cal S
uppl
y C
urre
nt (µ
A)Ty
pica
l IN
L (p
pm)
Tem
pera
ture
Ra
nge
(°C)
Feat
ures
Pack
ages
MCP
3421
18 to
12
4 to
240
1 Di
ffI2 C
2.7
to 5
.515
510
−40
to +
125
PGA,
Vre
f6-
pin
SOT-
23A
MCP
3422
18 to
12
4 to
240
2 Di
ffI2 C
2.7
to 5
.514
510
−40
to +
125
PGA,
Vre
f8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 3
DFN
MCP
3423
18 to
12
4 to
240
2 Di
ffI2 C
2.7
to 5
.514
510
−40
to +
125
PGA,
Vre
f, Se
lecta
ble
I2 C a
ddre
ssin
g10
-pin
MSO
P, 1
0-pi
n 3
× 3
DFN
MCP
3424
18 to
12
4 to
240
4 Di
ffI2 C
2.7
to 5
.514
510
−40
to +
125
PGA,
Vre
f, Se
lecta
ble
I2 C a
ddre
ssin
g14
-pin
SO
IC, 1
4-pi
n TS
SOP
MCP
3425
16 to
12
15 to
240
1 Di
ffI2 C
2.7
to 5
.515
510
−40
to +
125
PGA,
Vre
f6-
pin
SOT-
23A
MCP
3426
16 to
12
15 to
240
2 Di
ffI2 C
2.7
to 5
.514
510
−40
to +
125
PGA,
Vre
f8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 3
DFN
MCP
3427
16 to
12
15 to
240
2 Di
ffI2 C
2.7
to 5
.514
510
−40
to +
125
PGA,
Vre
f, Se
lecta
ble
I2 C a
ddre
ssin
g10
-pin
MSO
P, 1
0-pi
n 3
× 3
DFN
MCP
3428
16 to
12
15 to
240
4 Di
ffI2 C
2.7
to 5
.514
510
−40
to +
125
PGA,
Vre
f, Se
lecta
ble
I2 C a
ddre
ssin
g14
-pin
SO
IC, 1
4-pi
n TS
SOP
MCP
3550
-50
2213
1 Di
ffSP
I2.
7 to
5.5
120
2−4
0 to
+12
550
Hz
rejec
tion
8-pi
n SO
IC, 8
-pin
MSO
PM
CP35
50-6
022
151
Diff
SPI
2.7
to 5
.514
02
−40
to +
125
60 H
z re
jectio
n8-
pin
SOIC
, 8-p
in M
SOP
MCP
3551
2214
1 Di
ffSP
I2.
7 to
5.5
120
2−4
0 to
+12
5Si
mul
tane
ous
50/6
0 Hz
rejec
tion
8-pi
n SO
IC, 8
-pin
MSO
PM
CP35
5320
601
Diff
SPI
2.7
to 5
.514
02
−40
to +
125
8-pi
n SO
IC, 8
-pin
MSO
P
MIX
ED S
IGNA
L: P
ipel
ined
A/D
Con
verte
rs
Part
#Re
solu
tion
Max
Sam
ple
Rate
(M
sam
ples
/sec
)#
of In
put
Cha
nnel
sIn
put T
ype
Inte
rface
Supp
ly
Volta
ge
(V)
Pow
er
Dis
sipa
tion
(mW
)
Inpu
t C
hann
el
BW (M
Hz)
SNR
(dB)
SFD
R (d
B)In
put
Rang
e (V
p-p)
Feat
ures
Tem
pera
ture
Ra
nge
(°C)
Pack
ages
MCP
37D3
1-20
016
200
1, 2
, 4, 8
Diffe
rent
ialSe
rial D
DR LV
DS o
r Par
allel
CMO
S1.
2, 1
.849
050
074
.790
2.98
Decim
atio
n filt
ers,
dig
ital
dow
n-co
nver
ter
−40
to +
8512
4-pi
n VT
LA,
121-
pin
TFBG
A
MCP
3723
1-20
016
200
1, 2
, 4, 8
Diffe
rent
ialSe
rial D
DR LV
DS o
r Par
allel
CMO
S1.
2, 1
.849
050
074
.790
2.98
Decim
atio
n filt
ers
−40
to +
8512
4-pi
n VT
LA,
121-
pin
TFBG
A
MCP
37D2
0-20
014
200
1Di
ffere
ntial
Seria
l DDR
LVDS
or P
arall
el CM
OS
1.2,
1.8
348
650
67.8
961.
8De
cimat
ion
filter
s, d
igita
l do
wn-
conv
erte
r−4
0 to
+85
124-
pin
VTLA
, 12
1-pi
n TF
BGA
MCP
3722
0-20
014
200
1Di
ffere
ntial
Seria
l DDR
LVDS
or P
arall
el CM
OS
1.2,
1.8
348
650
67.8
961.
8De
cimat
ion
filter
s−4
0 to
+85
124-
pin
VTLA
, 12
1-pi
n TF
BGA
MCP
37D2
1-20
014
200
1, 2
, 4, 8
Diffe
rent
ialSe
rial D
DR LV
DS o
r Par
allel
CMO
S1.
2, 1
.849
050
074
.290
2.98
Decim
atio
n filt
ers,
dig
ital
dow
n-co
nver
ter
−40
to +
8512
4-pi
n VT
LA,
121-
pin
TFBG
A
MCP
3722
1-20
014
200
1, 2
, 4, 8
Diffe
rent
ialSe
rial D
DR LV
DS o
r Par
allel
CMO
S1.
2, 1
.849
050
074
.290
2.98
Decim
atio
n filt
ers
−40
to +
8512
4-pi
n VT
LA,
121-
pin
TFBG
A
MCP
37D1
0-20
012
200
1Di
ffere
ntial
Seria
l DDR
LVDS
or P
arall
el CM
OS
1.2,
1.8
338
650
6796
1.8
Decim
atio
n filt
ers,
dig
ital
dow
n-co
nver
ter,
noise
-sh
apin
g re
quan
tizer
−40
to +
8512
4-pi
n VT
LA,
121-
pin
TFBG
A
MCP
3721
0-20
012
200
1Di
ffere
ntial
Seria
l DDR
LVDS
or P
arall
el CM
OS
1.2,
1.8
338
650
6796
1.8
Decim
atio
n filt
ers,
noi
se-
shap
ing
requ
antiz
er−4
0 to
+85
124-
pin
VTLA
, 12
1-pi
n TF
BGA
MCP
37D1
1-20
012
200
1, 2
, 4, 8
Diffe
rent
ialSe
rial D
DR LV
DS o
r Par
allel
CMO
S1.
2, 1
.846
850
071
.390
2.98
Decim
atio
n filt
ers,
dig
ital
dow
n-co
nver
ter
−40
to +
8512
4-pi
n VT
LA,
121-
pin
TFBG
A
MCP
3721
1-20
012
200
1, 2
, 4, 8
Diffe
rent
ialSe
rial D
DR LV
DS o
r Par
allel
CMO
S1.
2, 1
.846
850
071
.390
2.98
Decim
atio
n filt
ers,
noi
se
shap
ing
requ
antiz
er−4
0 to
+85
124-
pin
VTLA
, 12
1-pi
n TF
BGA
MIX
ED S
IGN
AL:
Ener
gy M
eter
ing
and
Pow
er M
onito
ring
ICs
Part
#D
ynam
ic
Rang
ePo
wer
Sy
stem
Typi
cal
Accu
racy
Inpu
t C
hann
els
ADC
Re
solu
tion
Even
t M
onito
ring
Zero
-Cro
ss
Det
ectio
n Pi
nO
utpu
t Ty
peVd
d (V
)Te
mpe
ratu
re
Rang
e (°C
)Fe
atur
esPa
ckag
es
MCP
39F5
1140
00:1
Sing
le Ph
ase
0.1%
I, V,
Tem
p.24
-bit
5Ye
sUA
RT/
Sing
le-w
ire2.
7 to
3.
6−4
0 to
+12
5Po
wer m
onito
ring
IC w
ith a
ctive
, rea
ctive
and
app
aren
t pow
er, a
ctive
and
reac
tive
ener
gy, P
F, R
MS
curre
nt/v
oltag
e, fr
eque
ncy,
even
t not
ificat
ions,
EEPR
OM, P
WM
out
put
QFN
MCP
39F5
2140
00:1
Sing
le Ph
ase
0.1%
I, V,
Tem
p.24
-bit
4Ye
sI2 C
2.7
to
3.6
−40
to +
125
Powe
r mon
itorin
g IC
with
act
ive, r
eact
ive a
nd a
ppar
ent p
ower
, act
ive a
nd re
activ
e en
ergy
, PF,
RM
S cu
rrent
/volt
age,
freq
uenc
y, ev
ent n
otific
ation
s, E
EPRO
MQ
FN
MCP
39F5
11N
4000
:1Si
ngle
Phas
e0.
5%I1
, I2,
V24
-bit
6Ye
sUA
RT2.
7 to
3.
6−4
0 to
+12
5Du
al-ch
anne
l pow
er m
onito
ring
IC w
ith a
ctive
, rea
ctive
and
app
aren
t pow
er,
activ
e an
d re
activ
e en
ergy
, PF,
RM
S cu
rrent
/vol
tage
, fre
quen
cy, e
vent
no
tifica
tions
, EEP
ROM
, PW
M o
utpu
tQ
FN
MCP
3905
A/
06A
500:
1/
1000
:1Si
ngle
Phas
e0.
10%
I, V
16-b
it–
–Ac
tive
Pow
er
Pulse
4.5
to
5.5
−40
to +
125
Activ
e po
wer
calc
ulat
ion
SSO
P
ATM
90E2
650
00:1
Sing
le Ph
ase
0.1%
I, V,
NN/
A1
Yes
SPI/U
ART/
Pulse
2.8
to
3.6
−40
to +
85Si
ngle-
phas
e en
ergy
met
er IC
with
act
ive, r
eact
ive a
nd a
ppar
ent p
ower
, act
ive a
nd
reac
tive
ener
gy, P
F, R
MS
curre
nt/v
olta
ge, a
nti-t
ampe
ring
SSO
P
ATM
90E3
2AS
6000
:1Po
ly-ph
ase
0.1%
3xI,
3xV
N/A
8Ye
sSP
I/Pul
se2.
8 to
3.
6−4
0 to
+85
Thre
e-ph
ase
ener
gy m
eter
IC w
ith a
ctive
, rea
ctive
and
app
aren
t pow
er a
nd
ener
gy, P
F, R
MS
curre
nt/v
olta
ge, f
requ
ency
, fun
dam
enta
l and
har
mon
ic m
easu
rem
ent,
even
t not
ificat
ions
, tem
pera
ture
sen
sor
TQFP
ATM
90E3
6A60
00:1
Poly-
phas
e0.
1%3x
I, 3x
V, N
N/A
5Ye
sSP
I/Pul
se2.
8 to
3.
6−4
0 to
+85
Thre
e-ph
ase
ener
gy m
eter
IC w
ith a
ctive
, rea
ctive
and
app
aren
t pow
er a
nd
ener
gy, P
F, R
MS
curre
nt/v
olta
ge, f
requ
ency
, DFT
func
tion,
fund
amen
tal a
nd
harm
onic
mea
sure
men
t, ev
ent n
otific
atio
ns, t
empe
ratu
re s
enso
rTQ
FP
Analog and Interface Product Selector Guide 49
MIX
ED S
IGN
AL:
Ener
gy M
easu
rem
ent A
FEs
Part
#D
ynam
ic
Rang
eTy
pica
l Ac
cura
cyAD
C
Cha
nnel
sAD
C
Reso
lutio
nSI
NAD
Gai
n Se
lect
ion
Out
put
Type
Vdd (V
)Te
mpe
ratu
re
Rang
e (°C
)Fe
atur
esPa
ckag
es
MCP
3918
/10
1000
0:1
0.1%
1/2
24-b
it93
.5Up
to 3
2SP
I/2-w
ire2.
7 to
3.6
−40
to +
125
AFE
with
pha
se c
orre
ctio
n, P
rogr
amm
able
data
rate
, 16-
bit C
RC, R
egist
er m
ap lo
ck,
2-w
ire in
terfa
ceSS
OP,
QFN
MCP
3919
1000
0:1
0.1%
324
-bit
93.5
Up to
32
SPI/2
-wire
2.7
to 3
.6−4
0 to
+12
5AF
E w
ith p
hase
cor
rect
ion,
Pro
gram
mab
le da
ta ra
te, 1
6-bi
t CRC
, Reg
ister
map
lock
, 2-
wire
inte
rface
SSO
P, Q
FN
MCP
3912
1000
0:1
0.1%
424
-bit
93.5
Up to
32
SPI
2.7
to 3
.6−4
0 to
+12
5AF
E w
ith p
hase
cor
rect
ion,
Pro
gram
mab
le da
ta ra
te, 1
6-bi
t CRC
, Reg
ister
map
lock
SSO
P, Q
FN
MCP
3913
/14
1000
0:1
0.1%
6/8
24-b
it94
.5Up
to 3
2SP
I2.
7 to
3.6
−40
to +
125
AFE
with
pha
se c
orre
ctio
n, P
rogr
amm
able
data
rate
, 16-
bit C
RC, R
egist
er m
ap lo
ckSS
OP,
UQ
FN
ATSE
NSE1
0130
00:1
0.1%
316
/32-
bit
84Up
to 8
SPI
3.0
to 3
.6−4
0 to
+85
Die
tem
pera
ture
sen
sor
SOIC
ATSE
NSE2
01(H
)30
00:1
0.1%
416
/32-
bit
84Up
to 8
SPI
3.0
to 3
.6−4
0 to
+85
Die
tem
pera
ture
sen
sor
TQFP
ATSE
NSE3
01(H
)30
00:1
0.1%
716
/32-
bit
84Up
to 8
SPI
3.0
to 3
.6−4
0 to
+85
Die
tem
pera
ture
sen
sor
TQFP
MIX
ED S
IGN
AL:
Cur
rent
/DC
Pow
er M
easu
rem
ent I
Cs
Part
##
of
Cur
rent
Se
nsor
sD
escr
iptio
nFu
ll Sc
ale
Rang
e (m
V)C
urre
nt
Mea
sure
men
t M
ax A
ccr (
%)
Effec
tive
Sam
plin
g In
terv
al M
in to
Max
(m
sec)
Bus
Volta
ge
Rang
e (V
)#
of T
emp.
M
onito
rs
(Am
bien
t, Re
mot
e)
Tem
p.
Accu
racy
Ty
p/M
ax (°
C)
Aler
t/TH
ERM
Peak
D
etec
tion
Addr
ess
Sele
ctPa
ckag
e
PAC1
710
1SM
Bus/
I2 C C
urre
nt/D
C Po
wer
Sen
sor
10, 2
0, 4
0, 8
0±1
2.5
to 2
,600
0 to
+ 4
0–
–1
–Ye
s10
-pin
DFN
PAC1
720
2Du
al SM
Bus/
I2 C C
urre
nt/D
C Po
wer
Sen
sor
10, 2
0, 4
0, 8
0±1
2.5
to 2
,600
0 to
+ 4
0–
–1
–Ye
s10
-pin
DFN
PAC1
921
2SM
Bus/
I2 C C
urre
nt/P
ower
Sen
sor w
ith
Analo
g O
utpu
t10
0±1
2.5
to 2
,900
0 to
+ 3
2–
––
–Ye
s10
-pin
DFN
PAC
1934
4SM
Bus/
I2 C C
urre
nt/P
ower
Sen
sor w
ith
Accu
mul
ator
100
±0.9
0.98
to 1
250
to +
32
––
1–
Yes
2.22
5 ×
2.17
mm
W
LCSP
EMC1
701-
11
SMBu
s/I2 C
Cur
rent
/DC
Pow
er S
enso
r with
Te
mpe
ratu
re M
onito
ring
10, 2
0, 4
0, 8
0±1
2.5
to 2
,600
+3 to
+24
1, 0
±0.2
5/±1
2Ha
rdw
are
Yes
12-p
in 4
× 4
QFN
EMC1
701-
21
SMBu
s/I2 C
Cur
rent
/DC
Pow
er S
enso
r with
Te
mpe
ratu
re M
onito
ring
10, 2
0, 4
0, 8
0±1
2.5
to 2
,600
+3 to
+24
1, 0
±0.2
5/±1
2So
ftwar
eYe
s10
-pin
MSO
P
EMC1
702-
11
SMBu
s/I2 C
Cur
rent
/DC
Pow
er S
enso
r with
Tw
o Te
mpe
ratu
re M
onito
rs10
, 20,
40,
80
±12.
5 to
2,6
00+3
to +
241,
1±0
.25/
±12
Hard
war
eYe
s12
-pin
4 ×
4 Q
FN
EMC1
704-
11
SMBu
s/I2 C
Cur
rent
/DC
Pow
er S
enso
r with
Fo
ur T
empe
ratu
re M
onito
rs10
, 20,
40,
80
±12.
5 to
2,6
00+3
to +
241,
3±0
.25/
±12
Softw
are
Yes
14-p
in S
OIC
EMC1
704-
21
SMBu
s/I2 C
Cur
rent
/DC
Pow
er S
enso
r with
Fo
ur T
empe
ratu
re M
onito
rs10
, 20,
40,
80
±12.
5 to
2,6
00+3
to +
241,
3±0
.25/
±12
Hard
war
eYe
s16
-pin
4 ×
4 Q
FN
MIX
ED S
IGN
AL:
Dua
l-Slo
pe A
/D C
onve
rters
Part
#Su
pply
Vo
ltage
(V)
Inpu
t Vol
tage
Ran
geRe
solu
tion
Sam
plin
g Ra
te (C
onv/
s)In
put
Cha
nnel
sD
ata
Inte
rface
Tem
pera
ture
Ra
nge
(°C)
Feat
ures
Pack
ages
TC50
0±4
.5 to
±7.
5Vs
s +
1.5V
to V
dd –
1.5
VUp
to 1
6 bi
ts4
to 1
01
3-W
ire0
to +
70Di
ffere
ntial
inpu
t ran
ge, P
rogr
amm
able
reso
lutio
n/co
nver
sion
time
16-p
in P
DIP,
16-
pin
SOIC
TC50
0A±4
.5 to
±7.
5Vs
s +
1.5V
to V
dd –
1.5
VUp
to 1
7 bi
ts4
to 1
01
3-W
ire0
to +
70Di
ffere
ntial
inpu
t ran
ge, P
rogr
amm
able
reso
lutio
n/co
nver
sion
time
16-p
in P
DIP,
16-
pin
SOIC
TC51
0+4
.5 to
+5.
5Vs
s +
1.5V
to V
dd –
1.5
VUp
to 1
7 bi
ts4
to 1
01
3-W
ire0
to +
70Di
ffere
ntial
inpu
t ran
ge, P
rogr
amm
able
reso
lutio
n/co
nver
sion
time,
Cha
rge
pum
p (−
V) o
utpu
t pin
24-p
in P
DIP,
24-
pin
SOIC
TC51
4+4
.5 to
+5.
5Vs
s +
1.5V
to V
dd –
1.5
VUp
to 1
7 bi
ts4
to 1
04
3-W
ire0
to +
70Di
ffere
ntial
inpu
t ran
ge, P
rogr
amm
able
reso
lutio
n/co
nver
sion
time,
Cha
rge
pum
p (−
V) o
utpu
t pin
28-p
in P
DIP,
28-
pin
SOIC
TC52
0A+4
.5 to
+5.
5–
––
–Se
rial p
ort
0 to
+70
Opt
iona
l ser
ial in
terfa
ce a
dapt
er fo
r TC5
00/5
00A/
510/
514
14-p
in P
DIP,
16-
pin
SOIC
TC71
09±4
.5 to
±5.
5Vs
s +
1.5V
to V
dd –
1.0
V12
bits
plu
s sig
n bi
t2
to 1
01
Para
llel o
r Ser
ial p
ort
−25
to +
85Di
ffere
ntial
inpu
t ran
ge40
-pin
PDI
P, 4
4-pi
n PL
CC, 4
4-pi
n M
QFP
TC71
09A
±4.5
to ±
5.5
Vss
+ 1.
5V to
Vdd
– 1
.0V
12 b
its p
lus
sign
bit
2 to
10
1Pa
ralle
l or S
erial
por
t−2
5 to
+85
Diffe
rent
ial in
put r
ange
40-p
in P
DIP,
44-
pin
PLCC
, 44-
pin
MQ
FP
MIX
ED S
IGN
AL:
Bina
ry a
nd B
CD
A/D
Con
verte
rs
Part
#D
escr
iptio
nSu
pply
Vo
ltage
(V)
Inpu
t Vol
tage
Ran
geRe
solu
tion
(Dig
its)
Reso
lutio
n (C
ount
s)M
ax P
ower
(m
W)
Dat
a In
terfa
ceTe
mpe
ratu
re
Rang
e (°C
)Fe
atur
esPa
ckag
es
TC85
0Bi
nary
A/D
±5Vs
s +
1.5V
to V
dd –
1.5
V15
-bit
±32,
768
358-
bit p
arall
el−2
5 to
+70
High
est c
onve
rsio
n sp
eed
(40
conv
/sec
)44
-pin
PLC
C, 4
0-pi
n PD
IPTC
1443
3BC
D A/
D±4
.5 to
±8
±199
.9 m
V to
1.9
99V
3½±2
,000
20M
UXed
BCD
−40
to +
85Fo
r DM
M, D
PM, D
ata
logg
ers
24-p
in S
OIC
, 24-
pin
PDIP
, 28-
pin
PLCC
TC14
433A
BCD
A/D
±4.5
to ±
8±1
99.9
mV
to 1
.999
V3½
±2,0
0020
MUX
ed B
CD−4
0 to
+85
For D
MM
, DPM
, Dat
a lo
gger
s24
-pin
PDI
P, 2
8-pi
n PL
CC
www.microchip.com/analog50
MIX
ED S
IGN
AL:
Dis
play
A/D
Con
verte
rs
Part
#D
ispl
ay
Type
Supp
ly
Volta
ge (V
)Re
solu
tion
(Dig
its)
Reso
lutio
n (C
ount
s)Po
wer
(m
W)
Tem
pera
ture
Ran
ge
(°C)
Feat
ures
Pack
ages
TC71
06LC
D9
3½±2
,000
10−2
5 to
+85
For D
MM
, DPM
, Dat
a lo
gger
app
licat
ions
40-p
in P
DIP,
44-
pin
PLCC
, 44-
pin
MQ
FPTC
7106
ALC
D9
3½±2
,000
10−2
5 to
+85
For D
MM
, DPM
, Dat
a lo
gger
app
licat
ions
40-p
in P
DIP,
44-
pin
PLCC
, 44-
pin
MQ
FPTC
7107
LED
±53½
±2,0
0010
−25
to +
85Fo
r DM
M, D
PM, D
ata
logg
er a
pplic
atio
ns40
-pin
PDI
P, 4
4-pi
n PL
CC, 4
4-pi
n M
QFP
TC71
07A
LED
±53½
±2,0
0010
−25
to +
85Fo
r DM
M, D
PM, D
ata
logg
er a
pplic
atio
ns40
-pin
PDI
P, 4
4-pi
n PL
CC, 4
4-pi
n M
QFP
TC71
16LC
D9
3½±2
,000
10−2
5 to
+85
Hold
func
tion
40-p
in P
DIP,
44-
pin
PLCC
, 44-
pin
MQ
FPTC
7116
ALC
D9
3½±2
,000
10−2
5 to
+85
Hold
func
tion
40-p
in P
DIP,
44-
pin
PLCC
, 44-
pin
MQ
FPTC
7117
LED
±53½
±2,0
0010
−25
to +
85Ho
ld fu
nctio
n40
-pin
PDI
P, 4
4-pi
n PL
CC, 4
4-pi
n M
QFP
TC71
17A
LED
±53½
±2,0
0010
−25
to +
85Ho
ld fu
nctio
n40
-pin
PDI
P, 4
4-pi
n PL
CC, 4
4-pi
n M
QFP
TC71
26LC
D9
3½±2
,000
0.5
−25
to +
85Lo
w-p
ower
TC7
106
40-p
in P
DIP,
44-
pin
PLCC
, 44-
pin
MQ
FPTC
7126
ALC
D9
3½±2
,000
0.5
−25
to +
85Lo
w-p
ower
TC7
106
40-p
in P
DIP,
44-
pin
PLCC
, 44-
pin
MQ
FPTC
7129
LCD
94½
±20,
000
4.5
0 to
+70
Low
est n
oise
±3
mV
sens
itivity
40-p
in P
DIP,
44-
pin
PLCC
, 44-
pin
MQ
FP
MIX
ED S
IGN
AL:
Dig
ital P
oten
tiom
eter
s
Part
##
of
Taps
Mem
ory
# Pe
r Pa
ckag
eIn
terfa
ceRe
sist
ance
(k
Ohm
s)IN
L (M
ax)
DN
L (M
ax)
Tem
pera
ture
Ra
nge
(°C)
Com
men
tsPa
ckag
es
MCP
4011
64Vo
latile
1Up
/Dow
n2.
1, 5
, 10,
50
0.5
0.5
−40
to +
125
Pote
ntio
met
er m
ode
8-pi
n SO
IC, 8
-pin
MSO
P, 8
-pin
2 ×
3 D
FNM
CP40
1264
Volat
ile1
Up/D
own
2.1,
5, 1
0, 5
00.
50.
5−4
0 to
+12
5Rh
eost
at m
ode
6-pi
n SO
T-23
MCP
4013
64Vo
latile
1Up
/Dow
n2.
1, 5
, 10,
50
0.5
0.5
−40
to +
125
Pote
ntio
met
er to
Vss
6-pi
n SO
T-23
MCP
4014
64Vo
latile
1Up
/Dow
n2.
1, 5
, 10,
50
0.5
0.5
−40
to +
125
Rheo
stat
to V
ss5-
pin
SOT-
23M
CP40
1712
8Vo
latile
1I2 C
5, 1
0, 5
0, 1
000.
50.
25−4
0 to
+12
57-
bit,
Volat
ile, I
2 C d
igita
l pot
entio
met
er6-
pin
SC-7
0M
CP40
1812
8Vo
latile
1I2 C
5, 1
0, 5
0, 1
000.
50.
25−4
0 to
+12
57-
bit,
Volat
ile, I
2 C d
igita
l pot
entio
met
er6-
pin
SC-7
0M
CP40
1912
8Vo
latile
1I2 C
5, 1
0, 5
0, 1
000.
50.
25−4
0 to
+12
57-
bit,
Volat
ile, I
2 C d
igita
l pot
entio
met
er5-
pin
SC-7
0M
CP40
D17
128
Volat
ile1
I2 C5,
10,
50,
100
0.5
0.25
−40
to +
125
7-bi
t, Vo
latile
, I2 C
dig
ital p
oten
tiom
eter
6-pi
n SC
-70
MCP
40D1
812
8Vo
latile
1I2 C
5, 1
0, 5
0, 1
000.
50.
25−4
0 to
+12
57-
bit,
Volat
ile, I
2 C d
igita
l pot
entio
met
er6-
pin
SC-7
0M
CP40
D19
128
Volat
ile1
I2 C5,
10,
50,
100
0.5
0.25
−40
to +
125
7-bi
t, Vo
latile
, I2 C
dig
ital p
oten
tiom
eter
5-pi
n SC
-70
MCP
4021
64No
nvol
atile
1Up
/Dow
n2.
1, 5
, 10,
50
0.5
0.5
−40
to +
125
Pote
ntio
met
er m
ode,
Shu
tdow
n, W
iper
Lock
™ T
echn
olog
y8-
pin
SOIC
, 8-p
in M
SOP,
8-p
in 2
× 3
DFN
MCP
4022
64No
nvol
atile
1Up
/Dow
n2.
1, 5
, 10,
50
0.5
0.5
−40
to +
125
Rheo
stat
mod
e, S
hutd
own,
Wip
erLo
ck T
echn
olog
y6-
pin
SOT-
23M
CP40
2364
Nonv
olat
ile1
Up/D
own
2.1,
5, 1
0, 5
00.
50.
5−4
0 to
+12
5Po
tent
iom
eter
to V
ss, W
iper
Lock
Tec
hnol
ogy
6-pi
n SO
T-23
MCP
4024
64No
nvol
atile
1Up
/Dow
n2.
1, 5
, 10,
50
0.5
0.5
−40
to +
125
Rheo
stat
to V
ss, S
hutd
own,
Wip
erLo
ck T
echn
olog
y5-
pin
SOT-
23M
CP41
4112
8No
nvol
atile
1SP
I5,
10,
50,
100
0.5
0.25
−40
to +
125
Pote
ntio
met
er m
ode,
Shu
tdow
n8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP,
8-p
in 3
× 3
DFN
MCP
4142
128
Nonv
olat
ile1
SPI
5, 1
0, 5
0, 1
000.
80.
25−4
0 to
+12
5Rh
eost
at m
ode,
Shu
tdow
n8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP,
8-p
in 3
× 3
DFN
MCP
4241
128
Nonv
olat
ile2
SPI
5, 1
0, 5
0, 1
000.
50.
25−4
0 to
+12
5Po
tent
iom
eter
mod
e, S
hutd
own,
Wip
erLo
ck T
echn
olog
y14
-pin
PDIP
, 14-
pin
SOIC
, 14-
pin
TSSO
P, 1
6-pi
n 4
× 4
QFN
MCP
4242
128
Nonv
olat
ile2
SPI
5, 1
0, 5
0, 1
000.
80.
25−4
0 to
+12
5Rh
eost
at m
ode,
Shu
tdow
n10
-pin
MSO
P, 1
0-pi
n 3
× 3
DFN
MCP
4131
129
Volat
ile1
SPI
5, 1
0, 5
0, 1
000.
50.
25−4
0 to
+12
5Po
tent
iom
eter
mod
e, S
hutd
own
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P, 8
-pin
3 ×
3 D
FN
MCP
41HV
3112
8Vo
latile
1SP
I5,
10,
50,
100
0.5
0.12
5−4
0 to
+12
57-
bit V
olat
ile d
igita
l pot
entio
met
er w
ith s
pecifi
ed o
pera
tion
from
10V
to 3
6V a
nd S
PI in
terfa
ce14
-pin
TSS
OP,
5 ×
5 Q
FN
MCP
4132
129
Volat
ile1
SPI
5, 1
0, 5
0, 1
000.
80.
25−4
0 to
+12
5Rh
eost
at m
ode,
Shu
tdow
n8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP,
8-p
in 3
× 3
DFN
MCP
4231
128
Volat
ile2
SPI
5, 1
0, 5
0, 1
000.
50.
25−4
0 to
+12
5Po
tent
iom
eter
mod
e, S
hutd
own,
Wip
erLo
ck T
echn
olog
y14
-pin
PDIP
, 14-
pin
SOIC
, 14-
pin
TSSO
P, 1
6-pi
n 4
× 4
QFN
MCP
4232
128
Volat
ile2
SPI
5, 1
0, 5
0, 1
000.
80.
25−4
0 to
+12
5Rh
eost
at m
ode,
Shu
tdow
n10
-pin
MSO
P, 1
0-pi
n 3
× 3
DFN
MCP
4101
025
6Vo
latile
1SP
I10
11
−40
to +
85Po
tent
iom
eter
mod
e, S
hutd
own
8-pi
n PD
IP, 8
-pin
SO
ICM
CP41
050
256
Volat
ile1
SPI
501
1−4
0 to
+85
Pote
ntio
met
er m
ode,
Shu
tdow
n8-
pin
PDIP
, 8-p
in S
OIC
MCP
4110
025
6Vo
latile
1SP
I10
01
1−4
0 to
+85
Pote
ntio
met
er m
ode,
Shu
tdow
n8-
pin
PDIP
, 8-p
in S
OIC
MCP
4151
256
Volat
ile1
SPI
5, 1
0, 5
0, 1
001
0.5
−40
to +
125
Pote
ntio
met
er m
ode,
Shu
tdow
n8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP,
8-p
in 3
× 3
DFN
MCP
41HV
5125
6Vo
latile
1SP
I5,
10,
50,
100
10.
25−4
0 to
+12
58-
bit V
olat
ile d
igita
l pot
entio
mer
with
spe
cified
ope
ratio
n fro
m 1
0V to
36V
and
SPI
inte
rface
.14
-pin
TSS
OP,
5 ×
5 Q
FN
MCP
4152
256
Volat
ile1
SPI
5, 1
0, 5
0, 1
001
0.5
−40
to +
125
Rheo
stat
mod
e, S
hutd
own
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P, 8
-pin
3 ×
3 D
FNM
CP41
6125
6No
nvol
atile
1SP
I5,
10,
50,
100
10.
5−4
0 to
+12
5Po
tent
iom
eter
mod
e, S
hutd
own
8-pi
n PD
IP, 8
-pin
SO
IC, 8
-pin
MSO
P, 8
-pin
3 ×
3 D
FNM
CP41
6225
6No
nvol
atile
1SP
I5,
10,
50,
100
10.
5−4
0 to
+12
5Rh
eost
at m
ode,
Shu
tdow
n8-
pin
PDIP
, 8-p
in S
OIC
, 8-p
in M
SOP,
8-p
in 3
× 3
DFN
MCP
4201
025
6Vo
latile
2SP
I10
11
−40
to +
85Po
tent
iom
eter
mod
e, S
hutd
own
14-p
in P
DIP,
14-
pin
SOIC
, 14-
pin
TSSO
PM
CP42
100
256
Volat
ile2
SPI
100
11
−40
to +
85Po
tent
iom
eter
mod
e, S
hutd
own
14-p
in P
DIP,
14-
pin
SOIC
, 14-
pin
TSSO
PM
CP42
5125
6Vo
latile
2SP
I5,
10,
50,
100
10.
5−4
0 to
+12
5Po
tent
iom
eter
mod
e, S
hutd
own,
Wip
erLo
ck T
echn
olog
y14
-pin
PDIP
, 14-
pin
SOIC
, 14-
pin
TSSO
P, 1
6-pi
n 4
× 4
QFN
MCP
4252
256
Volat
ile2
SPI
5, 1
0, 5
0, 1
001
0.5
−40
to +
125
Rheo
stat
mod
e, S
hutd
own
10-p
in M
SOP,
10-
pin
3 ×
3 DF
NM
CP42
6125
6No
nvol
atile
2SP
I5,
10,
50,
100
10.
5−4
0 to
+12
5Po
tent
iom
eter
mod
e, S
hutd
own,
Wip
erLo
ck T
echn
olog
y14
-pin
PDIP
, 14-
pin
SOIC
, 14-
pin
TSSO
P, 1
6-pi
n 4
× 4
QFN
MCP
4262
256
Nonv
olat
ile2
SPI
5, 1
0, 5
0, 1
001
0.5
−40
to +
125
Rheo
stat
mod
e, S
hutd
own
10-p
in M
SOP,
10-
pin
3 ×
3 DF
NM
CP43
4112
9No
nvol
atile
4SP
I5,
10,
50,
100
0.8
0.37
5−4
0 to
+12
57-
bit,
Volat
ile p
oten
tiom
eter
with
an
SPI in
terfa
ce20
-pin
TSS
OP,
20-
pin
4 ×
4 Q
FNM
CP43
4212
9No
nvol
atile
4SP
I5,
10,
50,
100
0.8
0.37
5−4
0 to
+12
57-
bit,
Volat
ile rh
eost
at w
ith a
n SP
I inte
rface
14-p
in T
SSO
P
Analog and Interface Product Selector Guide 51
MIX
ED S
IGN
AL:
Dig
ital P
oten
tiom
eter
s (C
ontin
ued)
Part
##
of
Taps
Mem
ory
# Pe
r Pa
ckag
eIn
terfa
ceRe
sist
ance
(k
Ohm
s)IN
L (M
ax)
DN
L (M
ax)
Tem
pera
ture
Ra
nge
(°C)
Com
men
tsPa
ckag
es
MCP
4361
257
Nonv
olat
ile4
SPI
5, 1
0, 5
0, 1
001
0.5
−40
to +
125
8-bi
t, No
n-vo
latile
pot
entio
met
er w
ith a
n SP
I inte
rface
20-p
in T
SSO
P, 2
0-pi
n 4
× 4
QFN
MCP
4362
257
Nonv
olat
ile4
SPI
5, 1
0, 5
0, 1
001
0.5
−40
to +
125
8-bi
t, No
n-vo
latile
rheo
stat
with
an
SPI in
terfa
ce14
-pin
TSS
OP
MCP
4331
129
Volat
ile4
SPI
5, 1
0, 5
0, 1
000.
80.
375
−40
to +
125
7-bi
t, Vo
latile
pot
entio
met
er w
ith a
n SP
I inte
rface
20-p
in T
SSO
P, 2
0-pi
n 4
× 4
QFN
MCP
4332
129
Volat
ile4
SPI
5, 1
0, 5
0, 1
000.
80.
375
−40
to +
125
7-bi
t, Vo
latile
rheo
stat
with
an
SPI in
terfa
ce14
-pin
TSS
OP
MCP
4351
257
Volat
ile4
SPI
5, 1
0, 5
0, 1
001
0.5
−40
to +
125
8-bi
t, No
n-vo
latile
pot
entio
met
er w
ith a
n SP
I inte
rface
20-p
in T
SSO
P, 2
0-pi
n 4
× 4
QFN
MCP
4352
257
Volat
ile4
SPI
5, 1
0, 5
0, 1
001
0.5
−40
to +
125
8-bi
t, No
n-vo
latile
rheo
stat
with
an
SPI in
terfa
ce14
-pin
TSS
OP
MCP
4441
129
Nonv
olat
ile4
I2 C5,
10,
50,
100
0.5
0.25
−40
to +
125
Pote
ntio
met
er m
ode,
Wip
erLo
ck™
Tec
hnol
ogy
20-p
in T
SSO
P, 2
0-pi
n 4
× 4
QFN
MCP
4442
129
Nonv
olat
ile4
I2 C5,
10,
50,
101
0.8
0.37
5−4
0 to
+12
5Rh
eost
at m
ode,
Wip
erLo
ck T
echn
olog
y14
-pin
TSS
OP
MCP
4461
257
Nonv
olat
ile4
I2 C5,
10,
50,
102
10.
5−4
0 to
+12
5Po
tent
iom
eter
mod
e, W
iper
Lock
Tec
hnol
ogy
20-p
in T
SSO
P, 2
0-pi
n 4
× 4
QFN
MCP
4462
257
Nonv
olat
ile4
I2 C5,
10,
50,
103
10.
5−4
0 to
+12
5Rh
eost
at m
ode,
Wip
erLo
ck T
echn
olog
y14
-pin
TSS
OP
MCP
4531
128
Volat
ile1
I2 C5,
10,
50,
100
0.5
0.25
−40
to +
125
Pote
ntio
met
er m
ode
8-pi
n M
SOP
MCP
45HV
3112
8Vo
latile
1I2 C
5, 1
0, 5
0, 1
000.
50.
125
−40
to +
125
7-bi
t vola
tile d
igita
l pot
entio
met
er w
ith s
pecifi
ed o
pera
tion
from
10V
to 3
6V a
nd I²
C int
erfa
ce14
-pin
TSS
OP,
5 ×
5 D
FNM
CP45
HV51
256
Volat
ile1
I2 C5,
10,
50,
100
10.
25−4
0 to
+12
57-
bit v
olatile
digi
tal p
oten
tiom
eter
with
spe
cified
ope
ratio
n fro
m 1
0V to
36V
and
I²C
inter
face
14-p
in T
SSO
P, 5
× 5
DFN
MCP
4631
128
Volat
ile2
I2 C5,
10,
50,
100
0.5
0.25
−40
to +
125
Pote
ntio
met
er m
ode
14-p
in T
SSO
P, 1
6-pi
n 4
× 4
QFN
MCP
4541
128
Nonv
olat
ile1
I2 C5,
10,
50,
100
0.5
0.25
−40
to +
125
Pote
ntio
met
er m
ode,
Wip
erLo
ck™
Tec
hnol
ogy
8-pi
n M
SOP
MCP
4641
128
Nonv
olat
ile2
I2 C5,
10,
50,
100
0.5
0.25
−40
to +
125
Pote
ntio
met
er m
ode,
Wip
erLo
ck T
echn
olog
y14
-pin
TSS
OP,
16-
pin
4x4
QFN
MCP
4651
256
Volat
ile2
I2 C5,
10,
50,
100
10.
5−4
0 to
+12
5Po
tent
iom
eter
mod
e14
-pin
TSS
OP,
16-
pin
4 ×
4 Q
FNM
CP45
6125
6No
nvol
atile
1I2 C
5, 1
0, 5
0, 1
001
0.5
−40
to +
125
Pote
ntio
met
er m
ode,
Wip
erLo
ck T
echn
olog
y8-
pin
MSO
PM
CP46
6125
6No
nvol
atile
2I2 C
5, 1
0, 5
0, 1
001
0.5
−40
to +
125
Pote
ntio
met
er m
ode,
Wip
erLo
ck T
echn
olog
y14
-pin
TSS
OP,
16-
pin
4 ×
4 Q
FNM
CP45
3212
8No
nvol
atile
1I2 C
5, 1
0, 5
0, 1
000.
80.
375
−40
to +
125
Rheo
stat
mod
e8-
pin
MSO
P, 8
-pin
3 ×
3 D
FNM
CP46
3212
8Vo
latile
2I2 C
5, 1
0, 5
0, 1
000.
80.
375
−40
to +
125
Rheo
stat
mod
e10
-pin
MSO
P, 1
0-pi
n 3
× 3
DFN
MCP
4542
128
Nonv
olat
ile1
I2 C5,
10,
50,
100
0.8
0.37
5−4
0 to
+12
5Rh
eost
at m
ode,
Wip
erLo
ck T
echn
olog
y8-
pin
MSO
P, 8
-pin
3 ×
3 D
FNM
CP45
5225
6Vo
latile
1I2 C
5, 1
0, 5
0, 1
001
0.5
−40
to +
125
Rheo
stat
mod
e8-
pin
MSO
P, 8
-pin
3 ×
3 D
FNM
CP46
5225
6No
nvol
atile
2I2 C
5, 1
0, 5
0, 1
001
0.5
−40
to +
125
Rheo
stat
mod
e10
-pin
MSO
P, 1
0-pi
n 3
× 3
DFN
MCP
4562
256
Nonv
olat
ile1
I2 C5,
10,
50,
100
10.
5−4
0 to
+12
5Rh
eost
at m
ode,
Wip
erLo
ck T
echn
olog
y8-
pin
MSO
P, 8
-pin
3 ×
3 D
FNM
CP46
6225
6No
nvol
atile
2I2 C
5, 1
0, 5
0, 1
001
0.5
−40
to +
125
Rheo
stat
mod
e, W
iper
Lock
Tec
hnol
ogy
10-p
in M
SOP,
10-
pin
3 ×
3 DF
N
MIX
ED S
IGNA
L: F
requ
ency
-to-
Volta
ge/V
olta
ge-t
o-Fr
eque
ncy
Con
verte
rs
Part
#Fr
eque
ncy
Rang
e (k
Hz)
Full
Scal
e (p
pm F
S/°C
)N
on-li
near
ity (%
FS)
Tem
pera
ture
Ran
ge (°
C)
Pack
ages
TC94
0010
0±4
0±0
.05
−40
to +
8514
-pin
PDI
P, 1
4-pi
n SO
ICTC
9401
100
±40
±0.0
2−4
0 to
+85
14-p
in P
DIP,
14-
pin
SOIC
TC94
0210
0±1
00±0
.25
−40
to +
8514
-pin
PDI
P, 1
4-pi
n SO
IC
MIX
ED S
IGN
AL:
D/A
Con
verte
rsPa
rt #
Reso
lutio
n (B
its)
DAC
Cha
nnel
sIn
terfa
ceM
emor
yVo
ltage
Ref
eren
ceO
utpu
t Set
ting
Tim
e (μ
s)D
NL
(LSB
)IN
L (L
SB)
Max
Ope
ratin
g C
urre
nt (μ
A)Te
mpe
ratu
re R
ange
(°C
)Pa
ckag
esM
CP48
FEB0
18
1SP
IEE
PRO
MVd
d, V
ref,
Vbg
7.8
0.25
0.5
180
−40
to +
125
8-pi
n M
SOP
MCP
48FE
B11
101
SPI
EEPR
OM
Vdd,
Vre
f, Vb
g7.
80.
51.
518
0−4
0 to
+12
58-
pin
MSO
PM
CP48
FEB2
112
1SP
IEE
PRO
MVd
d, V
ref,
Vbg
7.8
16
180
−40
to +
125
8-pi
n M
SOP
MCP
48FE
B02
82
SPI
EEPR
OM
Vdd,
Vre
f, Vb
g7.
80.
250.
538
0−4
0 to
+12
58-
pin
MSO
PM
CP48
FEB1
210
2SP
IEE
PRO
MVd
d, V
ref,
Vbg
7.8
0.5
1.5
380
−40
to +
125
8-pi
n M
SOP
MCP
48FE
B22
122
SPI
EEPR
OM
Vdd,
Vre
f, Vb
g7.
81
638
0−4
0 to
+12
58-
pin
MSO
PM
CP48
FVB0
18
1SP
IVo
latile
Vdd,
Vre
f, Vb
g7.
80.
250.
518
0−4
0 to
+12
58-
pin
MSO
PM
CP48
FVB1
110
1SP
IVo
latile
Vdd,
Vre
f, Vb
g7.
80.
51.
518
0−4
0 to
+12
58-
pin
MSO
PM
CP48
FVB2
112
1SP
IVo
latile
Vdd,
Vre
f, Vb
g7.
81
618
0−4
0 to
+12
58-
pin
MSO
PM
CP48
FVB0
28
2SP
IVo
latile
Vdd,
Vre
f, Vb
g7.
80.
250.
538
0−4
0 to
+12
58-
pin
MSO
PM
CP48
FVB1
210
2SP
IVo
latile
Vdd,
Vre
f, Vb
g7.
80.
51.
538
0−4
0 to
+12
58-
pin
MSO
PM
CP48
FVB2
212
2SP
IVo
latile
Vdd,
Vre
f, Vb
g7.
81
638
0−4
0 to
+12
58-
pin
MSO
PM
CP47
FEB0
18
1I2 C
EEPR
OM
Vdd,
Vre
f, Vb
g6
0.25
0.5
180
−40
to +
125
8-pi
n M
SOP
MCP
47FE
B11
101
I2 CEE
PRO
MVd
d, V
ref,
Vbg
60.
51.
518
0−4
0 to
+12
58-
pin
MSO
PM
CP47
FEB2
112
1I2 C
EEPR
OM
Vdd,
Vre
f, Vb
g6
16
180
−40
to +
125
8-pi
n M
SOP
MCP
47FE
B02
82
I2 CEE
PRO
MVd
d, V
ref,
Vbg
60.
250.
538
0−4
0 to
+12
58-
pin
MSO
PM
CP47
FEB1
210
2I2 C
EEPR
OM
Vdd,
Vre
f, Vb
g6
0.5
1.5
380
−40
to +
125
8-pi
n M
SOP
MCP
47FE
B22
122
I2 CEE
PRO
MVd
d, V
ref,
Vbg
61
638
0−4
0 to
+12
58-
pin
MSO
PM
CP47
FVB0
18
1I2 C
Volat
ileVd
d, V
ref,
Vbg
60.
250.
518
0−4
0 to
+12
58-
pin
MSO
P
www.microchip.com/analog52
MIX
ED S
IGN
AL:
D/A
Con
verte
rs (C
ontin
ued)
Part
#Re
solu
tion
(Bits
)D
AC
Cha
nnel
sIn
terfa
ceM
emor
yVo
ltage
Ref
eren
ceO
utpu
t Set
ting
Tim
e (μ
s)D
NL
(LSB
)IN
L (L
SB)
Max
Ope
ratin
g C
urre
nt (μ
A)Te
mpe
ratu
re
Rang
e (°C
)Pa
ckag
es
MCP
47FV
B11
101
I2 CVo
latile
Vdd,
Vre
f, Vb
g6
0.5
1.5
180
−40
to +
125
8-pi
n M
SOP
MCP
47FV
B21
121
I2 CVo
latile
Vdd,
Vre
f, Vb
g6
16
180
−40
to +
125
8-pi
n M
SOP
MCP
47FV
B02
82
I2 CVo
latile
Vdd,
Vre
f, Vb
g6
0.25
0.5
380
−40
to +
125
8-pi
n M
SOP
MCP
47FV
B12
102
I2 CVo
latile
Vdd,
Vre
f, Vb
g6
0.5
1.5
380
−40
to +
125
8-pi
n M
SOP
MCP
47FV
B22
122
I2 CVo
latile
Vdd,
Vre
f, Vb
g6
16
380
−40
to +
125
8-pi
n M
SOP
MCP
47DA
16
1I2 C
Volat
ileVr
ef6
0.35
0.7
160
−40
to +
125
6-pi
n SO
T23,
6-p
in S
C70
MCP
4706
81
I2 CEE
PRO
MVd
d, V
ref
60.
050.
907
400
−40
to +
125
6-pi
n SO
T23,
6-p
in 2
× 2
DFN
MCP
4716
101
I2 CEE
PRO
MVd
d, V
ref
60.
188
3.62
540
0−4
0 to
+12
56-
pin
SOT2
3, 6
-pin
2 ×
2 D
FNM
CP47
2612
1I2 C
EEPR
OM
Vdd,
Vre
f6
0.75
14.5
400
−40
to +
125
6-pi
n SO
T23,
6-p
in 2
× 2
DFN
MCP
4725
121
I2 CEE
PRO
MVd
d6
0.75
14.5
400
−40
to +
125
6-pi
n SO
T23
MCP
4728
124
I2 CEE
PRO
MVd
d, V
bg6
0.75
1314
00−4
0 to
+12
510
-pin
MSO
PM
CP48
018
1SP
IVo
latile
Vbg
4.5
0.5
140
0−4
0 to
+12
58-
pin
MSO
P, 8
-pin
2 ×
3 D
FN, 8
-pin
SO
IC, 8
-pin
PDI
PM
CP48
1110
1SP
IVo
latile
Vbg
4.5
0.5
3.5
400
−40
to +
125
8-pi
n M
SOP,
8-p
in 2
× 3
DFN
, 8-p
in S
OIC
, 8-p
in P
DIP
MCP
4821
121
SPI
Volat
ileVb
g4.
50.
7512
400
−40
to +
125
8-pi
n M
SOP,
8-p
in 2
× 3
DFN
, 8-p
in S
OIC
, 8-p
in P
DIP
MCP
4802
82
SPI
Volat
ileVb
g4.
50.
51
400
−40
to +
125
8-pi
n M
SOP,
8-p
in 2
× 3
DFN
, 8-p
in S
OIC
, 8-p
in P
DIP
MCP
4812
102
SPI
Volat
ileVb
g4.
50.
53.
540
0−4
0 to
+12
58-
pin
MSO
P, 8
-pin
2 ×
3 D
FN, 8
-pin
SO
IC, 8
-pin
PDI
PM
CP48
2212
2SP
IVo
latile
Vbg
4.5
0.75
1240
0−4
0 to
+12
58-
pin
MSO
P, 8
-pin
2 ×
3 D
FN, 8
-pin
SO
IC, 8
-pin
PDI
PM
CP49
018
1SP
IVo
latile
Vref
4.5
0.5
135
0−4
0 to
+12
58-
pin
MSO
P, 8
-pin
2 ×
3 D
FN, 8
-pin
SO
IC, 8
-pin
PDI
PM
CP49
1110
1SP
IVo
latile
Vref
4.5
0.5
3.5
350
−40
to +
125
8-pi
n M
SOP,
8-p
in 2
× 3
DFN
, 8-p
in S
OIC
, 8-p
in P
DIP
MCP
4921
121
SPI
Volat
ileVr
ef4.
50.
7512
350
−40
to +
125
8-pi
n M
SOP,
8-p
in 2
× 3
DFN
, 8-p
in S
OIC
, 8-p
in P
DIP
MCP
4902
82
SPI
Volat
ileVr
ef4.
50.
51
350
−40
to +
125
8-pi
n M
SOP,
8-p
in 2
× 3
DFN
, 8-p
in S
OIC
, 8-p
in P
DIP
MCP
4912
102
SPI
Volat
ileVr
ef4.
50.
53.
535
0−4
0 to
+12
58-
pin
MSO
P, 8
-pin
2 ×
3 D
FN, 8
-pin
SO
IC, 8
-pin
PDI
PM
CP49
2212
2SP
IVo
latile
Vref
4.5
0.75
1235
0−4
0 to
+12
58-
pin
MSO
P, 8
-pin
2 ×
3 D
FN, 8
-pin
SO
IC, 8
-pin
PDI
P
INTE
RFA
CE
AND
NET
WO
RK
ING
INTE
RFAC
E AN
D N
ETW
ORK
ING
: C
ontro
ller A
rea
Net
wor
k (C
AN) P
rodu
cts
Part
#D
escr
iptio
n an
d Fe
atur
esO
pera
ting
Volta
ge (V
)Te
mpe
ratu
re
Rang
e (°C
)Tx
Bu
ffers
Rx
Buffe
rsFi
lters
Mas
ksIn
terru
pt
Out
put
Pack
ages
ATA6
560
CAN
Tran
sceiv
er w
ith s
tand
-by
and
silen
t mod
e, 5
V I/O
, CAN
FD
read
y, 5
Mbp
s, A
ECQ
100
Gra
de 1
4.5
to 5
.5−4
0 to
+12
5N/
AN/
AN/
AN/
AN/
A8-
pin
DFN,
8-p
in S
OIC
ATA6
561
CAN
Tran
sceiv
er w
ith s
tand
-by
mod
e, c
ompa
tible
with
3.3
V an
d 5V
micr
ocon
trolle
r, CA
N FD
read
y,
5 M
bps,
AEC
Q10
0 G
rade
14.
5 to
5.5
−40
to +
125
N/A
N/A
N/A
N/A
N/A
8-pi
n DF
N, 8
-pin
SO
IC
ATA6
562
CAN
Tran
sceiv
er w
ith s
tand
-by
and
silen
t mod
e, 5
V I/O
, wak
e up
pat
tern
, CAN
FD
read
y, 5
Mbp
s,
AECQ
100
Gra
de 0
, 14.
5 to
5.5
−40
to
+125
/150
N/A
N/A
N/A
N/A
N/A
8-pi
n DF
N, 8
-pin
SO
IC
ATA6
563
CAN
Tran
sceiv
er w
ith s
tand
-by
mod
e, c
ompa
tible
with
3.3
V an
d 5V
micr
ocon
trolle
r, w
ake
up p
atte
rn,
CAN
FD re
ady,
5 M
bps,
AEC
Q10
0 G
rade
0, 1
4.5
to 5
.5−4
0 to
+1
25/1
50N/
AN/
AN/
AN/
AN/
A8-
pin
DFN,
8-p
in S
OIC
ATA6
564
CAN
Tran
sceiv
er w
ith s
ilent
mod
e, c
ompa
tible
with
3.3
V an
d 5V
micr
ocon
trolle
r, w
ake
up p
atte
rn, C
AN
FD re
ady,
5 M
bps,
AEC
Q10
0 G
rade
0, 1
4.5
to 5
.5−4
0 to
+1
25/1
50N/
AN/
AN/
AN/
AN/
A8-
pin
DFN,
8-p
in S
OIC
ATA6
565
Dual
CAN
Tran
sceiv
er w
ith s
tand
-by
mod
e, 5
V I/O
, wak
e up
pat
tern
, CAN
FD
read
y, 5
Mbp
s, A
ECQ
100
Gra
de 0
, 14.
5 to
5.5
−40
to
+125
/150
N/A
N/A
N/A
N/A
N/A
14-p
in D
FN, 1
4-pi
n SO
IC
ATA6
566
CAN
Tran
sceiv
er w
ith s
tand
-by
mod
e, c
ompa
tible
with
3.3
V an
d 5V
micr
ocon
trolle
r, w
ake
up p
atte
rn,
CAN
FD re
ady,
2 M
bps,
AEC
Q10
0 G
rade
0, 1
, sui
tabl
e fo
r the
Jap
anes
e m
arke
t4.
5 to
5.5
−40
to
+125
/150
N/A
N/A
N/A
N/A
N/A
8-pi
n DF
N, 8
-pin
SO
IC
ATA6
570
CAN
Parti
al Ne
twor
king
Tran
sceiv
er w
ith W
ake
pin
and
Win
dow
Wat
chdo
g, c
ompa
tible
with
3.3
V an
d 5V
m
icroc
ontro
ller,
wak
e up
pat
tern
, CAN
FD
read
y, 5
Mbp
s, A
ECQ
100
Gra
de 1
4.55
to 2
8−4
0 to
+12
5N/
AN/
AN/
AN/
AN/
A14
-pin
SO
IC
MCP
2515
Exte
rnal
CAN
2.0B
Con
trolle
r with
SPI
Inte
rface
2.7
to 5
.5−4
0 to
+12
53
26
2Ye
s18
-pin
PDI
P, 1
8-pi
n SO
IC, 2
0-pi
n TS
SOP
MCP
2517
FDEx
tern
al CA
N FD
Con
trolle
r with
SPI
Inte
rface
, ISO
118
98-1
:201
5 Co
mpl
iant,
32-b
it Ti
me
Stam
p,
Supp
orts
CAN
2.0
B an
d CA
N FD
, Hig
hly
Confi
gura
ble
31 F
IFO
s an
d 32
Filte
rs2.
7 to
5.5
−40
to +
150
Up to
32
Up to
32
Up to
32
Up to
32
1 to
314
-pin
SO
IC, 1
4-pi
n VD
FN
MCP
2562
5In
tegr
ated
Hig
h-Sp
eed
CAN
Tran
sceiv
er a
nd C
AN 2
.0B
Cont
rolle
r2.
7 to
5.5
−40
to +
125
32
62
128
-pin
SSO
P, 2
8-pi
n 6
× 6
QFN
Analog and Interface Product Selector Guide 53
INTE
RFAC
E AN
D N
ETW
ORK
ING
: Et
hern
et p
rodu
cts
Prod
uct
Band
wid
thIn
terf
ace
(Ups
trea
m)
Wak
e-O
n-LA
NEE
ETe
mpe
ratu
re*
Pack
ages
Ethe
rnet
Con
trol
lers
ENC2
8J60
10SP
I–
–I
28-p
in S
PDIP
, SSO
P, S
OIC
, QFN
ENC6
24J6
0010
/100
SPI/P
arall
el–
–I
24-p
in T
QFN
, QFN
, 64-
pin
TQFN
LAN9
217
10/1
0016
-bit
Host
Bus
/MII
––
–10
0-pi
n TQ
FPLA
N921
810
/100
32-b
it Ho
st B
us–
–I
100-
pin
TQFP
LAN9
220/
110
/100
16-b
it Ho
st B
us–
–I
56-p
in Q
FNLA
N925
010
/100
SPI,
SQITM
, HBI
üü
I64
-pin
QFN
, 64-
pin
TQFP
-EP
LAN9
420
10/1
0032
-bit
PCI 3
.0–
–I
128-
pin
VTQ
FPLA
N892
1810
/100
32-b
it Ho
st B
us–
–A,
I10
0-pi
n TQ
FPKS
Z885
110
/100
8-/1
6-/3
2-bi
t or S
PIü
–A,
I32
-pin
QFN
, 48-
pin
LQFP
, 128
-pin
PQ
FPKS
Z885
210
/100
8-/1
6-/3
2-bi
tü
üI
64-p
in L
QFP
KSZ8
441
10/1
008-
/16-
/32-
bit o
r SPI
üü
I64
-pin
LQ
FPU
SB to
Eth
erne
tLA
N950
0A10
/100
USB
2.0
ü–
I56
-pin
QFN
LAN9
730
10/1
00US
B 2.
0 (H
SIC)
/MII
––
I56
-pin
QFN
LAN9
512/
13/1
410
/100
USB
2.0
––
I64
-pin
QFN
LAN8
9530
10/1
00US
B 2.
0ü
–A,
I56
-pin
QFN
LAN8
9730
10/1
00HS
ICü
–I
56-p
in Q
FNLA
N750
0G
igab
itUS
B 2.
0ü
–I
56-p
in Q
FNLA
N780
0/01
/50
Gig
abit
USB
3.1/
USB
2.0/
HSIC
üü
A, I
48-p
in S
QFN
, 64-
pin
SQFN
, 66-
pin
SQFN
Ethe
rnet
Tra
nsce
iver
s (P
HYs
)LA
N871
0A10
/100
MII/
RMII
––
I32
-pin
QFN
LAN8
720A
10/1
00RM
II–
–I
24-p
in Q
FNLA
N874
0A10
/100
MII/
RMII
üü
I32
-pin
QFN
LAN8
741A
10/1
00M
II/RM
II–
üI
32-p
in Q
FNLA
N874
2A10
/100
RMII
ü–
I24
-pin
QFN
LAN8
8730
10/1
00M
II/RM
II–
–A,
I32
-pin
QFN
KSZ8
051
10/1
00M
II/RM
II–
–A,
I32
-pin
QFN
KSZ8
061
10/1
00M
II/RM
IIü
üA,
I32
-/48-
pin
QFN
KSZ8
081
10/1
00M
II/RM
II–
–I
24-/3
2-pi
n Q
FN, 4
8-pi
n LQ
FPKS
Z809
110
/100
MII/
RMII
üü
I24
-/32-
pin
QFN
, 48-
pin
LQFP
LAN8
810
Gig
abit
GM
II–
–I
72-p
in Q
FNLA
N882
0G
igab
itRG
MII
––
I56
-pin
QFN
KSZ9
031
Gig
abit
MII/
RMII/
RGM
IIü
–A,
I48
-/64-
pin
QFN
INTE
RFAC
E AN
D N
ETW
ORK
ING
: Et
hern
et p
rodu
cts
Prod
uct
Band
wid
thPo
rts
Inte
rfac
e (U
pstr
eam
)15
88–v
2C
able
Dia
gs10
0 Fx
Te
mpe
ratu
re*
Pack
ages
Ethe
rCAT
® C
ontr
olle
rsLA
N925
210
/100
2/3
SPI,
SQI™
, 8-/1
6-/3
2-bi
t hos
t bus
Cloc
k Sy
nc.
üü
I64
-pin
QFN
, 64-
pin
TQFP
-EP
Ethe
rnet
Sw
itche
sLA
N935
210
/100
2SP
I/SQ
I/HBI
üü
–I
72-p
in Q
FN, 8
0-pi
n TQ
FP-E
PLA
N930
310
/100
3M
II/RM
II/Tu
rbo
MII
––
üI
56-p
in Q
FN, 7
2-pi
n Q
FNLA
N893
0310
/100
3M
II/RM
II/Tu
rbo
MII
––
üA,
I56
-pin
QFN
LAN9
353
10/1
003
MII/
RMII/
Turb
o M
IIü
üü
I64
-pin
QFN
, 64-
pin
TQFP
-EP
LAN9
354
10/1
003
RMII
üü
üI
56-p
in Q
FNLA
N935
510
/100
3M
II/RM
II/Tu
rbo
MII
üü
üI
64-p
in Q
FN, 6
4-pi
n TQ
FP-E
PKS
Z886
310
/100
3M
II/RM
II–
üü
I48
-pin
LQ
FPKS
Z887
310
/100
3M
II/RM
II–
üü
A, I
64-p
in V
QFN
www.microchip.com/analog54
INTE
RFAC
E AN
D N
ETW
ORK
ING
: Et
hern
et p
rodu
cts
Prod
uct
Band
wid
thPo
rts
Inte
rfac
e (U
pstr
eam
)15
88–v
2C
able
Dia
gs10
0 Fx
Te
mpe
ratu
re*
Pack
ages
Ethe
rnet
Sw
itche
sKS
Z846
310
/100
3M
II/RM
IIü
üü
I64
-pin
LQ
FPKS
Z886
410
/100
4M
II/RM
II–
ü–
A, I
64-p
in V
QFN
KSZ8
794
10/1
004
MII/
GM
II/RG
MII
–ü
–I
64-p
in V
QFN
KSZ8
795
10/1
005
GM
II/RG
MII/
MII/
RMII
–ü
–I
80-p
in L
QFP
KSZ8
775
10/1
005
MII/
GM
II/RG
MII
–ü
–I
80-p
in L
QFP
KSZ8
765
10/1
005
MII/
GM
II/RG
MII
–ü
üI
64-p
in Q
FN, 8
0-pi
n LQ
FPKS
Z889
510
/100
5M
II/RM
II–
ü–
I12
8-pi
n LQ
FPKS
Z856
710
/100
3, 5
, 7SG
MII/
RGM
II/M
II/RM
IIü
Link
MD® +
with
sig
nal q
uality
indi
cato
rw
ith S
GM
IIA,
I64
-pin
QFN
, 128
-pin
LQ
FPKS
Z989
7G
igab
it3,
6, 7
SGM
II/RG
MII/
MII/
RMII
–ü
with
SG
MII
I64
-pin
QFN
, 128
-pin
LQ
FPKS
Z956
7G
igab
it3,
7SG
MII/
RGM
II/M
II/RM
II15
88 +
AVB
Link
MD+
with
sig
nal q
uality
indi
cato
rw
ith S
GM
III
64-p
in Q
FN, 1
28-p
in L
QFP
KSZ9
477
Gig
abit
7SG
MII/
RGM
II/M
II/RM
II15
88 +
AVB
+H
DR/D
LRLi
nkM
D+ w
ith s
igna
l qua
lity in
dica
tor
with
SG
MII
I12
8-pi
n LQ
FP
Note
: All p
rodu
cts
abov
e ar
e su
ppor
ted
with
3.3
V op
erat
ing
volta
ge
*A =
Aut
omot
ive te
mpe
ratu
re ra
nge,
I =
Indu
stria
l tem
pera
ture
rang
e
INTE
RFAC
E AN
D N
ETW
ORK
ING
: Se
rial P
erip
hera
ls
Part
#D
escr
iptio
nO
pera
ting
Volta
ge (V
)O
pera
ting
Tem
p.
Rang
e (°C
)Bu
s Ty
peM
ax B
us
Freq
uenc
y (k
Hz)
Feat
ures
Pack
ages
MCP
2300
88-
bit I
/O P
ort E
xpan
der
1.8
to 5
.5−4
0 to
+85
I2 C17
00Th
ree
HW a
ddre
ss p
ins,
HW
inte
rrupt
, 25
mA
sour
ce/s
ink
capa
bility
per
I/O
18-p
in P
DIP,
18-
pin
SOIC
, 20-
pin
SSO
P, 2
0-pi
n 4
× 4
QFN
MCP
23S0
88-
bit I
/O P
ort E
xpan
der
1.8
to 5
.5−4
0 to
+85
SPI
1000
0Tw
o HW
add
ress
pin
s, H
W in
terru
pt, 2
5 m
A so
urce
/sin
k ca
pabi
lity p
er I/
O18
-pin
PDI
P, 1
8-pi
n SO
IC, 2
0-pi
n SS
OP,
20-
pin
4 ×
4 Q
FN
MCP
2300
98-
bit I
/O P
ort E
xpan
der
1.8
to 5
.5−4
0 to
+12
5I2 C
3400
One
HW
add
ress
pin
, HW
inte
rrupt
, 25
mA
sour
ce/s
ink
per I
/O, 1
00 k
Hz,
400
kHz
and
3.4
MHz
I2 C s
uppo
rted
18-p
in P
DIP,
18-
pin
SOIC
, 20-
pin
SSO
P
MCP
23S0
98-
bit I
/O P
ort E
xpan
der
1.8
to 5
.5−4
0 to
+12
5SP
I10
000
HW in
terru
pt, 2
5 m
A so
urce
/sin
k pe
r I/O
18-p
in P
DIP,
18-
pin
SOIC
MCP
2301
616
-bit
I/O P
ort E
xpan
der
2.0
to 5
.5−4
0 to
+85
I2 C40
0Th
ree
HW a
ddre
ss in
puts
, HW
inte
rrupt
, 25
mA
sour
ce/s
ink c
apab
ility
per I
/O28
-pin
PDI
P, 2
8-pi
n SO
IC, 2
8-pi
n SS
OP,
28-
pin
6 ×
6 Q
FN
MCP
2301
716
-bit
I/O E
xpan
der
1.8
to 5
.5−4
0 to
+12
5I2 C
1700
Thre
e HW
add
ress
pin
s, 2
5 m
A sin
k/so
urce
per
I/O
, 100
kHz
, 400
kHz
and
3-
4 M
Hz I2 C
sup
porte
d, In
terru
pt o
utpu
t28
-pin
PDI
P, 2
8-pi
n SO
IC, 2
8-pi
n SS
OP,
28-
pin
QFN
MCP
23S1
716
-bit
I/O E
xpan
der
1.8
to 5
.5−4
0 to
+12
5SP
I10
000
Thre
e HW
add
ress
pin
s, 2
5 m
A sin
k/so
urce
per
I/O
, Int
erru
pt o
utpu
t28
-pin
PDI
P, 2
8-pi
n SO
IC, 2
8-pi
n SS
OP,
28-
pin
QFN
MCP
2301
816
-bit
I/O P
ort E
xpan
der
1.8
to 5
.5−4
0 to
+12
5I2 C
3400
One
HW
add
ress
pin
, 2 H
W in
terru
pts,
25
mA
sour
ce/s
ink
per I
/O,
100
kHz,
400
kHz
and
3.4
MHz
I2 C s
uppo
rted
24-p
in S
SOP,
28-
pin
SOIC
, 28-
pin
SDIP
MCP
23S1
816
-bit
I/O P
ort E
xpan
der
1.8
to 5
.5−4
0 to
+12
5SP
I10
000
Two
HW in
terru
pts,
25
mA
sour
ce/s
ink
per I
/O28
-pin
SO
IC, 2
8-pi
n SD
IP
INTE
RFAC
E AN
D N
ETW
ORK
ING
: W
i-Fi®
Mod
ules
Part
#Ra
dio
Pin
Cou
ntAn
tenn
aFr
eque
ncy
Rang
e (G
Hz)
Sens
itivi
ty
(dBm
)Po
wer
O
utpu
t (d
Bm)
Pow
er
Con
sum
ptio
n (m
A)Sl
eep
MAC
Fea
ture
sPr
otoc
ols
Encr
yptio
nIn
terfa
cePa
ckag
esTx
Rx
RN18
1080
2.11
b/g
37PC
B,
W.F
L2.
412–
2.47
2−9
40
to
+12
245
(+
18 d
Bm)
6412
μA
802.1
1b/g
/n, S
oftA
P,
WPS
IPv4
/IPv6
, TCP
, UDP
, DHC
P, D
NS, I
CMP,
AR
P, H
TTP,
FTP
, SNT
P, S
SL/T
LSW
EP, W
PA-P
SK,
WPA
2-PS
KUA
RT37
/Mod
ule
(26.
7 ×
17.8
mm
)
RN17
2380
2.11
b/g
49RF
PAD
2.41
2–2.
484
−83
0 to
+1
212
0
(0 d
Bm)
404
μA80
2.11
b/g,
Sof
tAP,
W
PS, W
ebsc
anDH
CP,
DN
S, A
RP, I
CM
P, F
TP c
lient
, HTT
P cl
ient
, TC
P, U
DPW
EP, W
PA,
WPA
2, E
APUA
RT49
/Mod
ule
(26.
7 ×
17.8
mm
)
RN17
180
2.11
b/g
49RF
PAD
2.41
2–2.
484
−83
0 to
+1
219
0
(+12
dBm
)38
4 μA
802.
11b/
g, S
oftA
P,
WPS
, Web
scan
DHC
P, D
NS,
ARP
, IC
MP,
FTP
clie
nt, H
TTP
clie
nt, T
CP,
UDP
WEP
, WPA
, W
PA2,
EAP
UART
49/M
odule
(2
6.7
× 17
.8 m
m)
RN13
180
2.11
b/g
44Ch
ip,
U.FL
2.41
2–2.
484
−85
+18
210
(+
18 d
Bm)
404
μA80
2.11
b/g,
Sof
tAP,
W
PS, W
ebsc
anDH
CP,
DN
S, A
RP, I
CM
P, F
TP c
lient
, HTT
P cl
ient
, TC
P, U
DPW
EP, W
PA,
WPA
2, E
APUA
RT44
/Mod
ule
(37.
0 ×
20.0
mm
)
RN17
1XV
802.
11 b
/g49
Wire
, U.
FL,
SMA
2.41
2–2.
484
−83
0 to
+1
219
0
(+12
dBm
)38
4 μA
802.
11b/
g, S
oftA
P,
WPS
, Web
scan
DHC
P, D
NS,
ARP
, IC
MP,
FTP
clie
nt, H
TTP
clie
nt, T
CP,
UDP
WEP
, WPA
, W
PA2,
EAP
UART
2 ×
10/T
hrou
gh h
ole
mod
ule
(2
4.4
× 34
.3 m
m)
MRF
24W
N0M
A80
2.11
b/g
/n37
PCB
2.41
2–2.
484
−94
+18
115
(0
dBm
)60
5 μA
802.1
1b/g
/n, S
oftA
P,
WPS
, Wi-F
i® D
irect
Wi-F
i Con
nect
ion
Man
ager
, Ann
ounc
e, D
NS,
DDNS
, DHC
P, F
TP, H
TTP,
NBN
S, S
NMP,
SN
TP, S
SL, T
CP, U
DP, Z
eroC
onf(2
)
WPA
2-PS
K, W
PA-
PSK,
WEP
, WPA
-2-
ENTE
RPRI
SE4-
wire
SP
I37
/Mod
ule
(26.
7 ×
17.8
mm
)
MRF
24W
N0M
B80
2.11
b/g
/n37
W.F
L2.
412–
2.48
4−9
4+1
811
5
(0 d
Bm)
605
μA80
2.11b
/g/n
, Sof
tAP,
W
PS, W
i-Fi D
irect
Wi-F
i Con
nect
ion
Man
ager
, Ann
ounc
e, D
NS,
DDNS
, DHC
P, F
TP, H
TTP,
NBN
S, S
NMP,
SN
TP, S
SL, T
CP, U
DP, Z
eroC
onf(2
)
WPA
2-PS
K, W
PA-
PSK,
WEP
, WPA
-2-
ENTE
RPRI
SE4-
wire
SP
I37
/Mod
ule
(26.
7 ×
17.8
mm
)
Analog and Interface Product Selector Guide 55
INTE
RFAC
E AN
D N
ETW
ORK
ING
: W
i-Fi®
Mod
ules
Part
#Ra
dio
Pin
Cou
ntAn
tenn
aFr
eque
ncy
Rang
e (G
Hz)
Sens
itivi
ty
(dBm
)Po
wer
O
utpu
t (d
Bm)
Pow
er
Con
sum
ptio
n (m
A)Sl
eep
MAC
Fea
ture
sPr
otoc
ols
Encr
yptio
nIn
terfa
cePa
ckag
esTx
Rx
MRF
24W
G0M
A80
2.11
b/g
36PC
B2.
412–
2.48
4−9
5+1
824
015
60.
1 m
A(1)
802.
11b/
g, W
i-Fi
Dire
ct, S
oftA
P, W
PSW
i-Fi C
onne
ctio
n M
anag
er, A
nnou
nce,
DN
S, D
DNS,
DHC
P, F
TP, H
TTP,
NBN
S,
SNM
P, S
NTP
, SSL
, TCP
, UDP
, Zer
oCon
f(2)
WPA
2-PS
K, W
PA-
PSK,
WEP
, WPA
-2-
ENTE
RPRI
SE4-
wire
SP
I36
/Mod
ule
(21.
0 ×
31.0
mm
)
MRF
24W
G0M
B80
2.11
b/g
36U.
FL2.
412–
2.48
4−9
5+1
824
015
60.
1 m
A(1)
802.
11b/
g, W
i-Fi
Dire
ct, S
oftA
P, W
PSW
i-Fi C
onne
ctio
n M
anag
er, A
nnou
nce,
DN
S, D
DNS,
DHC
P, F
TP, H
TTP,
NBN
S,
SNM
P, S
NTP
, SSL
, TCP
, UDP
, Zer
oCon
f(2)
WPA
2-PS
K, W
PA-
PSK,
WEP
, WPA
2-EN
TERP
RISE
4-w
ire
SPI
36/M
odule
(2
1.0
× 31
.0 m
m)
WIN
C150
0-M
R210
PB80
2.11
b/g
/n28
PCB,
U.
FL2.
412–
2.47
2−9
4+1
8.5
250
5738
0 µA
802.
11b/
g/n,
Sof
tAP,
W
i-Fi D
irect
TCP,
UDP
, DHC
P, A
RP, H
TTP,
SSL
, DNS
WEP
, WPA
, WPA
2 Se
curit
ySP
I, UA
RT,
I2 C28
/mod
ule
(21.
5 ×
14.5
mm
)
SAM
W25
802.
11 b
/g/n
51–
2.41
2–2.
472
−94
+17
250
5738
0 µA
802.
11b/
g/n,
Sof
tAP,
W
i-Fi D
irect
, sta
tion
mod
eDH
CP, D
NS, T
CP/IP
(IPv
4), U
DP, H
TTP,
HT
TPS
WEP
, WPA
/WPA
2 Pe
rson
al, T
LS, S
SLSP
I, UA
RT51
/mod
ule
(33.
86 ×
14.
88 m
m)
Not
e 1:
Ind
icate
s “o
ff” c
urre
nt
Not
e 2:
Sup
porte
d in
the
prov
ided
sta
ck
INTE
RFAC
E AN
D N
ETW
ORK
ING
: Bl
ueto
oth®
Mod
ules
Part
#Bl
ueto
oth
Spec
Mod
ule
Type
No
Shie
ld
Opt
ion
Rx S
ensi
tivity
(d
Bm)
Pow
er O
utpu
t (d
Bm) (
typ.
)Sl
eep
Profi
les
Inte
rface
Pin
Cou
ntAn
tenn
aPa
ckag
es
(Dim
ensi
ons)
BM62
4.2
Ster
eo A
udio
Yes
−90
2–
HFP
, HSP
, A2D
P, A
VRC
P, S
PPUA
RT37
PCB
29 ×
15
× 2.
5 m
mBM
634.
2St
ereo
Aud
ioNo
−89
2–
HFP
, HSP
, A2D
P, A
VRC
P, S
PPUA
RT48
PCB
32 ×
15
× 2.
5 m
mBM
644.
2St
ereo
Aud
ioYe
s−9
015
–H
FP, H
SP, A
2DP,
AVR
CP,
SPP
UART
, I2 C
43PC
B32
× 1
5 ×
2.5
mm
BM20
4.1
Audi
oYe
s−9
14
Syst
em O
ff 2
μAH
FP, H
SP, A
2DP,
AVR
CP,
SPP
, PCA
PAn
alog
audi
o ou
t, m
ic in
, lin
e in
, UAR
T40
PCB
29 ×
15
× 2.
5 m
mBM
234.
1Au
dio
Yes
−91
4Sy
stem
Off
2 μA
HFP
, HSP
, A2D
P, A
VRC
P, S
PP, P
CAP
I2 S D
igita
l aud
io o
ut, m
ic in
, lin
e in
, UAR
T43
PCB
29 ×
15
× 2.
5 m
m
RN48
704.
2BL
EYe
s−9
00
–L2
CAP,
ATT
, GAT
T, G
AP, I
nteg
rate
d Pu
blic
Pro
files
UART
, i2 C
33Ch
ip22
× 1
2 ×
2.4
mm
INTE
RFAC
E AN
D N
ETW
ORK
ING
: Bl
ueto
oth®
Mod
ules
(Con
tinue
d)
Part
#Bl
ueto
oth
Spec
Mod
ule
Type
No
Shie
ld
Opt
ion
Rx S
ensi
tivity
(d
Bm)
Pow
er O
utpu
t (d
Bm) (
typ.
)Sl
eep
Profi
les
Inte
rface
Pin
Cou
ntAn
then
naPa
ckag
es
(Dim
ensi
ons)
RN48
714.
2BL
EYe
s−9
00
–L2
CAP,
ATT
, GAT
T, G
AP, I
nteg
rate
d pu
blic
pro
files
UART
, I2 C
, SPI
16Ch
ip11
.5 ×
9 ×
2.1
mm
RN46
784.
2Da
ta,
Dual-
Mod
eYe
s−9
0 BR
/EDR
−9
2 LE
2De
ep P
ower
Dow
n 13
0 μA
BT
3.0:
GAP
, SPP
, SPD
, RFC
OM
M, L
2CAP
BT
4.2:
GAP
, GAT
T, A
TT, S
MP,
L2C
APUA
RT, I
2 C33
Chip
, RF
Pad
22 ×
12
× 2.
4 m
m
RN52
3.0
Audi
oNo
−85
4N/
AA2
DP, A
VRC
P, S
PP, H
FP/H
SP, i
AP(A
udio)
Ana
log s
peak
er,
micr
opho
ne, I
2 S m
aste
r mod
e,
S/PD
IF, (D
ata)
UAR
T, US
B, G
PIO
50PC
B13
.5 ×
26.
0 m
m
BM70
4.2
Data
, Sin
gle-
Mod
e BL
EYe
s−9
00
Pow
er s
avin
g 1
μAG
AP, G
ATT,
SM
, L2C
AP, I
nteg
rate
d pu
blic
profi
lesUA
RT, I
2 C, S
PI, A
DC, P
WM
, G
PIO
s33
Chip
, RF
Pad
22 ×
12
× 2.
4 m
m
25 ×
12
× 1.
8 m
m
BM71
4.2
Data
, Sin
gle-
Mod
e BL
EYe
s−9
00
Pow
er s
avin
g 1
μAG
AP, G
ATT,
SM
, L2C
AP, I
nteg
rate
d pu
blic
profi
lesUA
RT, I
2 C, S
PI, A
DC, P
WM
, G
PIO
s17
Chip
, RF
Pad
9 ×
11.5
× 2
.1 m
m
6 ×
8 ×
1.6
mm
RN40
204.
1Da
ta, S
ingl
e-M
ode
BLE
No−9
2.5
7Do
rman
t < 7
00 n
A,
deep
slee
p <
5.0
μAG
AP, G
ATT,
SM
, L2C
AP, i
nteg
rate
d pu
blic
pro
files
UART
, PIO
, AIO
, SPI
24PC
B11
.5 ×
19.
5 m
m
BM77
4.0
Data
, Du
al-M
ode
Yes
−80
Clas
sic
−92
LE2
Deep
Pow
er D
own
343
μA
GAP
, SDP
, SPP
, GAT
TUA
RT33
Chip
, RF
Pad
22 ×
12
× 2.
4 m
m
25 ×
12
× 1.
8 m
m
RN46
774.
0Da
ta,
Dual-
Mod
eYe
s−8
0 Cl
assic
−9
2 LE
2De
ep P
ower
Dow
n 34
3 μA
G
AP, S
DP, S
PP, G
ATT
UART
33Ch
ip, R
F Pa
d22
× 1
2 ×
2.4
mm
25
× 1
2 ×
1.8
mm
BM78
4.2
Data
, Du
al-M
ode
Yes
−90
(BR/
EDR)
−9
2 LE
2De
ep P
ower
Dow
n 13
0 μA
BT
3.0:
GAP
, SPP
, SDP
, RFC
OM
M, L
2CAP
BT
4.2:
GAP
, GAT
T, A
TT, S
MP,
L2C
APUA
RT, I
2 C, G
PIO
s33
Chip
, RF
Pad
22 ×
12
× 2.
4 m
m
25 ×
12
× 1.
8 m
m
RN41
2.1
Data
No−8
015
Stan
dby/
Idle
(dee
p sle
ep
enab
led) 2
50 μ
ASP
P, D
UN, H
ID, i
AP, H
CI,
RFC
OM
M, L
2CAP
, SDP
UART
, USB
35Ch
ip13
.4 ×
25.
8 m
m
RN41
XV2.
1Da
taNo
−80
15St
andb
y/Id
le (d
eep
sleep
en
abled
) 250
μA
SPP,
DUN
, HID
, iAP
, HC
I, RF
CO
MM
, L2C
AP, S
DPUA
RT, U
SB35
Chip
, U.F
L24
.4 ×
29.
2 m
m
RN42
2.1
Data
No−8
04
Stan
dby/
Idle
(dee
p sle
ep e
nabl
ed) 2
6 μA
SPP,
DUN
, HID
, iAP
, HC
I, RF
CO
MM
, L2C
AP, S
DPUA
RT, U
SB35
PCB
13.4
× 2
5.8
mm
RN42
XV2.
1Da
taNo
−80
4St
andb
y/Id
le (d
eep
sleep
ena
bled
) 26
μASP
P, D
UN, H
ID, i
AP, H
CI,
RFC
OM
M, L
2CAP
, SDP
UART
, USB
35PC
B, U
.FL
24.4
× 2
9.2
mm
SAM
B11-
MR2
10CA
4.1
BLE
No−9
51.
15 μ
A2
µAL2
CAP,
ATT
, GAT
T, G
AP, I
nteg
rate
d pu
blic
pro
files
UART
, I2 C
, SPI
39Ch
ip22
.88
× 15
.36
mm
BTLC
1000
-M
R110
CA4.
1BL
ENo
−95
1.15
μA
1 µA
L2CA
P, A
TT, G
ATT,
GAP
, Int
egra
ted
publ
ic p
rofile
sUA
RT, I
2 C, S
PI24
Chip
12.7
0 ×
20.1
5 m
m
www.microchip.com/analog56
INTE
RFAC
E AN
D N
ETW
ORK
ING
: IE
EE 8
02.1
5.4
zigb
ee® R
F Tr
ansc
eive
r Pro
duct
s
Part
#Pi
n C
ount
Ante
nna
Freq
uenc
y Ra
nge
(GH
z)Se
nsiti
vity
(d
Bm)
Pow
er O
utpu
t (d
Bm)
RSSI
Tx P
ower
C
onsu
mpt
ion
(mA)
Rx P
ower
C
onsu
mpt
ion
(mA)
Clo
ck
(MH
z)Sl
eep
MAC
MAC
Fe
atur
esEn
cryp
tion
Inte
rface
Pack
ages
MRF
24J4
040
–2.
405
to 2
.48
−95
0Ye
s23
1920
2 μA
Yes
CSM
A-CA
AES1
284-
wire
SPI
40-p
in Q
FNM
RF24
J40M
A12
PCB
2.40
5 to
2.4
8−9
40
Yes
2319
202
μAYe
sCS
MA-
CAAE
S128
4-w
ire S
PI12
/Mod
ule
MRF
24J4
0MD
12PC
B2.
405
to 2
.48
−104
+19
Yes
140
3220
10 μ
AYe
sCS
MA-
CAAE
S128
4-w
ire S
PI12
/Mod
ule
MRF
24J4
0ME
12U.
FL2.
405
to 2
.48
−104
+19
Yes
140
3220
10 μ
AYe
sCS
MA-
CAAE
S128
4-w
ire S
PI12
/Mod
ule
INTE
RFAC
E AN
D N
ETW
ORK
ING
: Su
b-G
Hz
Tran
scei
vers
/Mod
ules
Part
#Pi
n C
ount
Freq
uenc
y Ra
nge
(MH
z)Se
nsiti
vity
(dBm
)Po
wer
Out
put (
dBm
)RS
SITx
Pow
er C
onsu
mpt
ion
(mA)
Rx P
ower
Con
sum
ptio
n (m
A)C
lock
(MH
z)Sl
eep
Inte
rface
Pack
ages
MRF
49XA
16
433
/868
/915
−110
+7Ye
s15
mA
@ 0
dBm
1110
MHz
0.3
μA4-
wire
SPI
16-p
in T
SSO
PM
RF89
XA
32 8
68/9
15/9
50−1
13+1
2.5
Yes
25 m
A @
+10
dBm
312
.8 M
Hz0.
1 µA
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Det
ectio
nRe
vers
e Ba
ttery
Pr
otec
tion
Alar
m
Inte
rcon
nect
Hus
h Ti
mer
Pow
er-u
p Lo
w B
atte
ry T
est
Ope
ratin
g Te
mp.
Ra
nge
(°C)
Pack
ages
RE46
C120
NFPA
Tem
pora
l or C
ontin
uous
Ton
eNo
Yes
Yes
––
–−1
0 to
+60
16-p
in P
DIP
RE46
C121
NFPA
Tem
pora
lNo
Yes
Yes
Yes
––
−10
to +
6016
-pin
PDI
PRE
46C1
22NF
PA T
empo
ral
NoYe
sYe
sYe
sYe
sYe
s−1
0 to
+60
16-p
in P
DIP
RE46
C126
Cont
inuo
us T
one
NoYe
sYe
sYe
s–
–−1
0 to
+60
16-p
in P
DIP
RE46
C127
Cont
inuo
us T
one
NoYe
sYe
sYe
sYe
sYe
s−1
0 to
+60
16-p
in P
DIP
RE46
C128
NFPA
Tem
pora
lNo
Yes
Yes
Yes
–Ye
s−1
0 to
+60
16-p
in P
DIP
RE46
C129
Cont
inuo
us T
one
NoYe
sYe
sYe
s–
Yes
−10
to +
6016
-pin
PDI
P
CO
AN
D S
MO
KE D
ETEC
TOR
ICS:
Ion
izat
ion
Smok
e De
tect
or IC
s (C
ontin
ued)
Part
#H
orn
Driv
er
Alar
m P
atte
rnAl
arm
M
emor
yLo
w B
atte
ry
Det
ectio
nRe
vers
e Ba
ttery
Pr
otec
tion
Alar
m
Inte
rcon
nect
Hus
h Ti
mer
Pow
er-u
p Lo
w B
atte
ry T
est
Ope
ratin
g Te
mp.
Ra
nge
(°C)
Pack
ages
RE46
C152
NFPA
Tem
pora
l or C
ontin
uous
Ton
eNo
Yes
Yes
Yes
Yes
Yes
−10
to +
6016
-pin
PDI
PRE
46C1
62NF
PA T
empo
ral o
r Con
tinuo
us T
one
Yes
Yes
Yes
Yes
Yes
Yes
−10
to +
6016
-pin
PDI
PRE
46C1
63NF
PA T
empo
ral o
r Con
tinuo
us T
one
Yes
Yes
Yes
Yes
Yes
Yes
−10
to +
6016
-pin
PDI
PRE
46C1
80NF
PA T
empo
ral o
r Con
tinuo
us T
one
Yes
Yes
NoYe
sYe
sYe
s−1
0 to
+60
16-p
in P
DIP,
16-
pin
SOIC
Analog and Interface Product Selector Guide 59
CO
AN
D S
MO
KE D
ETEC
TOR
ICS:
Ion
izat
ion
Smok
e De
tect
or F
ront
End
sPa
rt #
Mic
ropr
oces
sor C
ompa
tible
Out
put
Out
put O
ptio
nsTy
pica
l App
licat
ion
Ope
ratin
g Te
mpe
ratu
re R
ange
(°C
)Pa
ckag
esRE
46C1
12Ye
sVo
ut 1
/4 o
f Vdd
or V
out
1/4
of D
etec
t Inp
ut3V
or 3
.3V
Micr
opro
cess
or−1
0 to
+60
8-pi
n PD
IPRE
46C1
14Ye
sVo
ut 1
/2 o
f Vdd
or V
out
1/2
of D
etec
t Inp
ut5V
Micr
opro
cess
or−1
0 to
+60
8-pi
n PD
IPRE
46C3
11Ye
sO
p Am
pIo
niza
tion
Smok
e De
tect
or F
ront
End
−10
to +
608-
pin
PDIP
, 8-p
in S
OIC
RE46
C312
Yes
Op
Amp
Ioni
zatio
n Sm
oke
Dete
ctor
Fro
nt E
nd−1
0 to
+60
8-pi
n PD
IP, 8
-pin
SO
IC
CO
AN
D S
MO
KE D
ETEC
TOR
ICS:
CO
Det
ecto
rs
Part
#O
pera
ting
Volta
ge (V
dc)
Volta
ge
Regu
lato
r (Vd
c)
LED
D
river
Hor
n D
river
Inte
rcon
nect
Low
Ba
ttery
D
etec
tion
Brow
n O
utBo
ost
Regu
lato
rO
p Am
p Vo
s M
ax
(µV)
Op
Amp
lb M
ax
(pA)
Op
Amp
GBW
P (k
Hz)
Op
Amp
Aol (
dB)
Op
Amp
Slew
Rat
e (V
/µS)
Op
Amp
Uni
ty G
ain
Stab
le
Op
Amp
CM
RR M
in
(dB)
Op
Amp
Rail-
to-R
ail
Ope
ratin
g Te
mp.
Ran
ge (°
C)
RE46
C800
2 to
12
3.3
Yes
Yes
Yes
Yes
Yes
Yes
1000
200
1011
50.
003
Yes
80In
/Out
−10
to +
60
CO
AN
D S
MO
KE D
ETEC
TOR
ICS:
Pie
zoel
ectri
c H
orn
Driv
ers
Part
#O
pera
ting
Volta
ge (V
)LE
D D
river
Volta
ge R
egul
ator
(V)
Low
Bat
tery
Det
ectio
nIn
terc
onne
ctPo
wer
Goo
dO
pera
ting
Tem
p. R
ange
(°C
)Pa
ckag
esRE
46C1
006
to 1
6–
––
––
−40
to +
858-
pin
PDIP
, 8-p
in S
OIC
RE46
C101
6 to
16
Yes
––
––
−40
to +
858-
pin
PDIP
, 8-p
in S
OIC
RE46
C104
4 to
8–
––
––
0 to
+50
14-p
in P
DIP,
14-
pin
SOIC
RE46
C105
6 to
12
Yes
3.3
or 5
Yes
––
−40
to +
8514
-pin
PDI
P, 1
4-pi
n SO
ICRE
46C1
072
to 5
Yes
3 or
3.3
Yes
––
0 to
+50
16-p
in P
DIP,
16-
pin
SOIC
RE46
C108
6 to
12
–3.
3 or
5–
––
−40
to +
858-
pin
PDIP
, 8-p
in S
OIC
RE46
C109
6 to
12
–3
Yes
Yes
Yes
−40
to +
8516
-pin
PDI
P, 1
6-pi
n SO
ICRE
46C1
172
to 5
––
––
–0
to +
508-
pin
PDIP
, 8-p
in S
OIC
RE46
C119
6 to
12
–3
Yes
Yes
Yes
−40
to +
8516
-pin
PDI
P, 1
6-pi
n SO
ICRE
46C3
172
to 5
––
––
–−1
0 to
+60
8-pi
n PD
IP, 8
-pin
SO
ICRE
46C3
182
to 5
––
––
–−1
0 to
+60
8-pi
n PD
IP, 8
-pin
SO
IC
ULT
RAS
OU
ND
ULT
RASO
UN
D:
Hig
h-Vo
ltage
Ana
log
Mul
tiple
xers
Part
##
of C
h. a
nd C
onfig
urat
ion
Blee
d Re
sist
orVp
–pRo
n (Ω
)C
sg O
n/O
ff (p
F)Is
w (A
)Fe
atur
esPa
ckag
esHV
2022
08
SPST
No20
0V22
38/1
23
5V–1
2V L
ogic
Inpu
t, 5
MHz
clo
ck fr
eque
ncy
48-L
ead
LQFP
, 28-
Lead
PLC
CHV
2032
08
SPST
No20
0V22
38/1
23
5V–1
2V L
ogic
Inpu
t, 5
MHz
clo
ck fr
eque
ncy
48-L
ead
LQFP
HV23
28
SPST
Yes
200V
2238
/12
35V
–12V
Log
ic In
put,
5 M
Hz c
lock
freq
uenc
y48
-Lea
d LQ
FP, 2
8-Le
ad P
LCC
HV21
98
SPST
No20
0V11
50/2
03
5V–1
2V L
ogic
Inpu
t, 5
MHz
clo
ck fr
eque
ncy
48-L
ead
LQFP
, 28-
Lead
PLC
CHV
2201
8 SP
STNo
200V
2238
/12
33.
3V–5
V Lo
gic
inpu
t, 20
MHz
clo
ck fr
eque
ncy
48-L
ead
LQFP
, 28-
Lead
PLC
CHV
2301
8 SP
STYe
s20
0V22
38/1
23
3.3V
–5V
Logi
c in
put,
20 M
Hz c
lock
freq
uenc
y48
-Lea
d LQ
FP, 2
8-Le
ad P
LCC
HV22
218
SPST
NoVp
p ra
nge
= +1
5V to
+50
V,
Vnn
rang
e =
−190
V to
−22
5V15
70/1
84
3.3V
–5V
Logi
c in
put,
20 M
Hz c
lock
freq
uenc
y48
-Lea
d LQ
FP
HV23
218
SPST
Yes
Vpp
rang
e =
+15V
to +
50V,
Vn
n ra
nge
= −1
90V
to −
225V
1570
/18
43.
3V–5
V Lo
gic
inpu
t, 20
MHz
clo
ck fr
eque
ncy
48-L
ead
LQFP
HV20
96
× 2:
1 M
uxYe
s20
0V22
38/1
23
5V–1
2V L
ogic
Inpu
t, 5
MHz
clo
ck fr
eque
ncy
48-L
ead
LQFP
HV20
822
2 Ba
nks
of 8
cha
nnel
No22
0V22
38/1
23
5V–1
2V L
ogic
Inpu
t, 5
MHz
clo
ck fr
eque
ncy
48-L
ead
LQFP
HV23
82
Bank
s of
8 c
hann
elYe
s22
0V22
38/1
23
5V–1
2V L
ogic
Inpu
t, 5
MHz
clo
ck fr
eque
ncy
48-L
ead
LQFP
HV26
0116
SPS
TNo
200V
2238
/12
33.
3V–5
V Lo
gic
inpu
t, 20
MHz
clo
ck fr
eque
ncy
48-L
ead
LQFP
, 42-
Ball B
umpe
d Di
e (B
D)HV
2701
16 S
PST
No20
0V22
38/1
23
3.3V
–5V
Logi
c in
put,
20 M
Hz c
lock
freq
uenc
y48
-Lea
d LQ
FP, 4
2-Ba
ll Bum
ped
Die
(BD)
HV26
0516
SPS
TNo
200V
2213
/10
33.
3V–5
V Lo
gic
inpu
t, 20
MHz
clo
ck fr
eque
ncy
48-L
ead
LQFP
, 42-
Ball B
umpe
d Di
e (B
D)HV
2705
16 S
PST
Yes
200V
2213
/10
33.
3V–5
V Lo
gic
inpu
t, 20
MHz
clo
ck fr
eque
ncy
48-L
ead
LQFP
, 42-
Ball B
umpe
d Di
e (B
D)HV
2631
2 Ba
nks
of 8
cha
nnel
No22
0V22
38/1
22
3.3V
–5V
Logi
c in
put,
20 M
Hz c
lock
freq
uenc
y48
-Lea
d LQ
FPHV
2731
2 Ba
nks
of 8
cha
nnel
Yes
220V
2238
/12
23.
3V–5
V Lo
gic
inpu
t, 20
MHz
clo
ck fr
eque
ncy
48-L
ead
LQFP
www.microchip.com/analog60
ULT
RASO
UN
D:
Hig
h-Vo
ltage
Ana
log
Mul
tiple
xers
(Con
tinue
d)
Part
##
of C
hann
els
and
Con
figur
atio
nBl
eed
Resi
stor
Vp–p
Ron (Ω
)C
sg O
n/O
ff (p
F)Is
w (A
)Fe
atur
esPa
ckag
es
HV27
338
SPDT
Yes
200V
2238
/12
23.
3V–5
V Lo
gic
inpu
t, 20
MHz
clo
ck fr
eque
ncy
48-L
ead
LQFP
HV26
618
× 3:
1 M
uxNo
200V
2230
/92
3.3V
–5V
Logi
c in
put,
20 M
Hz c
lock
freq
uenc
y48
-Lea
d LQ
FPHV
2761
8 ×
3:1
Mux
Yes
200V
2230
/92
3.3V
–5V
Logi
c in
put,
20 M
Hz c
lock
freq
uenc
y48
-Lea
d LQ
FPHV
2662
24 S
PST
No20
0V22
12/9
23.
3V–5
V Lo
gic
inpu
t, 20
MHz
clo
ck fr
eque
ncy
64-B
all V
FBG
AHV
2762
24 S
PST
Yes
200V
2212
/92
3.3V
–5V
Logi
c in
put,
20 M
Hz c
lock
freq
uenc
y64
-Ball
VFB
GA
HV28
082
Bank
s of
16
SPDT
No20
0V22
23/9
33.
3V–5
V Lo
gic,
A/B
bar
Con
trol p
in56
-Lea
d Q
FNHV
2809
2 Ba
nk o
f 16
No20
0V22
23/9
33.
3V -5
V Lo
gic,
A/B
bar
+ E
N Co
ntro
l pin
s56
-Lea
d Q
FNHV
2801
16 ×
2:1
Mux
No20
0V22
23/9
33.
3V–5
V Lo
gic
inpu
t, 20
MHz
clo
ck fr
eque
ncy
64-L
ead
QFN
HV29
0116
× 2
:1 M
uxYe
s20
0V22
23/9
33.
3V–5
V Lo
gic
inpu
t, 20
MHz
clo
ck fr
eque
ncy
64-L
ead
QFN
HV28
0232
SPS
TNo
200V
2213
/10
33.
3V–5
V Lo
gic
inpu
t, 20
MHz
clo
ck fr
eque
ncy
9 ×
9 VF
BGA
HV29
0232
SPS
TYe
s20
0V22
13/1
03
3.3V
–5V
Logi
c in
put,
20 M
Hz c
lock
freq
uenc
y9
× 9
VFBG
A
ULT
RASO
UN
D:
Ultr
asou
nd M
OSF
ET D
river
s
Part
##
of
Cha
nnel
sIn
put V
olta
ge
Min
. (V)
Inpu
t Vol
tage
M
ax. (
V)O
uput
Vol
tage
Bi
pola
r (V)
Out
put V
olta
ge
Uni
pola
r (V)
Out
put R
ise/
Fall
Tim
ePe
ak
Cur
rent
Appl
icat
ion
Circ
uit
Pack
ages
MD1
210
21.
25.
0NA
0–12
6 ns
/6 n
s±2
APa
ir w
ith 1
× T
C632
04
× 4
mm
12-
lead
QFN
MD1
211
21.
85.
0NA
0–12
10 n
s/10
ns
±2A
Pair
with
1 ×
TC6
320
8-Le
ad S
OIC
MD1
213
21.
85.
0±5
0–12
6 ns
/6 n
s±2
APa
ir w
ith 1
× T
C632
04
× 4
mm
12-
lead
QFN
MD1
711
121.
83.
3NA
0–12
8 ns
/8 n
s±2
APa
ir w
ith 6
× T
C632
0 to
form
a 2
-Cha
nnel
5-Le
vel P
ulse
r7
× 7
mm
48-
Lead
LQ
FP,
7 ×
7 m
m 4
8-Le
ad Q
FN
MD1
712
121.
83.
3NA
0–12
8 ns
/8 n
s±2
APa
ir w
ith 6
× T
C632
0 to
form
a 2
-Cha
nnel
5-Le
vel P
ulse
r7
× 7
mm
48-
Lead
LQ
FP,
7 ×
7 m
m 4
8-Le
ad Q
FNM
D171
512
1.8
3.3
NA0–
126.
5 ns
/6.5
ns
±2A
Pair
with
1 ×
TC8
020
to fo
rm a
2-C
hann
el 5-
Leve
l Pul
ser
6 ×
6 m
m 4
0-Le
ad Q
FN
MD1
716
121.
83.
3NA
0–12
6.5
ns/6
.5 n
s±2
APa
ir w
ith 1
× T
C802
0 to
form
a 3
-Cha
nnel
3-Le
vel P
ulse
r6
× 6
mm
40-
Lead
QFN
MD1
810
41.
85
±50–
126
ns/6
ns
±2A
Pair
with
2 ×
TC6
320
to fo
rm a
1-C
hann
el 4-
Leve
l Pul
ser/2
Cha
nnel
2 Le
vel
Pulse
r/1 C
hann
el 3
Leve
l Pul
ser
4 ×
4 m
m 1
6-Le
ad Q
FN
MD1
811
41.
85
±50–
126
ns/6
ns
±2A
Pair
with
2 ×
TC6
320
to fo
rm a
2-C
hann
el 2-
Leve
l Pul
ser
4 ×
4 m
m 1
6-Le
ad Q
FN
MD1
812
51.
85
±50–
126
ns/6
ns
±2A
Pair
with
1 ×
TC6
320
and
1 ×
TC23
20 to
form
a 1
-Cha
nnel
3-Le
vel P
ulse
r4
× 4
mm
16-
Lead
QFN
M
D181
35
1.8
5±5
0–12
6 ns
/6 n
s±2
APa
ir w
ith 1
× T
C632
0 an
d 1
× TC
2320
to fo
rm a
1-C
hann
el 3-
Leve
l Pul
ser
4 ×
4 m
m 1
6-Le
ad Q
FN
MD1
820
41.
85
±50–
127
ns/7
ns
±2A
Pair
with
2 ×
TC6
320
to fo
rm a
1-C
hann
el 4-
Leve
l Pul
ser/2
-Cha
nnel
2 Le
vel
Pulse
r/1 C
hann
el 3
Leve
l Pul
ser
4 ×
4 m
m 1
6-Le
ad Q
FN
MD1
821
41.
85
±50–
127
ns/7
ns
±2A
Pair
with
2 ×
TC6
320
to fo
rm a
2-C
hann
el 2-
Leve
l Pul
ser
4 ×
4 m
m 1
6-Le
ad Q
FN
MD1
822
41.
85
±50–
127
ns/7
ns
±2A
Pair
with
2 ×
TC6
320
to fo
rm a
1-C
hann
el 3L
evel
Pulse
r4
× 4
mm
16-
Lead
QFN
ULT
RASO
UN
D:
Ultr
asou
nd T
R Sw
itche
sPa
rt #
# of
Cha
nnel
sN
oise
(per
√H
z)Fe
atur
esPa
ckag
esM
D010
01/
20.
7 nV
/√Hz
±100
V Ul
traso
und
T/R
Switc
hes
SOT-
89, 4
× 4
8-p
in D
FNM
D010
14
0.8
nV/√
Hz±1
00V
Ultra
soun
d T/
R Sw
itche
s w
ith C
lamp
Diod
e5
× 5
18-p
in D
FNM
D010
54
0.8
nV/√
Hz±1
30V
Ultra
soun
d T/
R Sw
itche
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trary
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put
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Pack
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MD2
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250
MHz
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, 7-b
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M, 1
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5 ×
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7 ×
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±100
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× 11
mm
Analog and Interface Product Selector Guide 61
Featured Analog Development Tools
Thermal Management Products
For a complete list of development tools, please visit www.microchip.com/development tools.
MCP9600 Evaluation Board (ADM00665)The MCP9600 Evaluation Board is used to digitize the Thermocouple EMF voltage to degree Celsius with ±1.5°C accuracy. You can easily evaluate all device features using a Type K thermocouple. The device also supports Types J, T, N, E, B, S and R. Each of these types are evaluated by replacing the Type K Thermo-couple connector with the corresponding connectors (not included) .
Thermocouple Reference Design (TMPSNSRD-TCPL1)This reference design demonstrates how to instrument a thermocouple and accurately sense temperature over the entire thermocouple measurement range . This solution uses the MCP3421 18-bit Analog-to-Digital Converter (ADC) to measure voltage across the thermocouple .
Power Management ProductsMCP8025 TQFP BLDC Motor Driver Evaluation Board (ADM00600)This board demonstrates our MCP8025 3-phase BLDC motor gate driver with power module used in a BLDC motor drive application . When used with an MCU, the MCP8025 will provide the necessary drive signals for a 3-phase BLDC motor . The MCP8025 contains the high-side and low-side drivers for external N-channel MOSFETs . A dsPIC33EP256MC504 processor is used to supply the PWM inputs to the MCP8025 as well as handle the high-speed analog-to-digital conversion required for 50 kHz PWM operation . The MCP8025 UART interface is used to configure the MCP8025 device and to send fault information to the dsPIC® DSC .
MCP19111 Evaluation Board (ADM00397)The MCP19111 is a digitally-enhanced PWM controller . It combines a pure-analog PWM controller with a su-pervisory MCU making it a fast, cost-effective and configurable power conversion solution. The MCP19111 is ideal for standard power conversion, LED drivers and battery charging applications . This board demonstrates how the device operates in a synchronous buck topology over a wide input voltage and load range .
MCP16251 and MCP1640B Synchronous Boost Converters Evaluation Board (ADM00458)This board demonstrates the MCP16251/MCP1640B in two boost-converter applications with multiple output voltages and was developed to help reduce product design cycle time . Three common output volt-ages can be selected: 2 .0V, 3 .3V and 5 .0V .
Linear ProductsMCP6V01 Thermocouple Auto-Zeroed Reference Design Board (MCP6V01RD-TCPL)The MCP6V01 design board demonstrates how to use a difference amplifier system to measure Electromo-tive Force (EMF) voltage at the cold junction of thermocouple to accurately measure temperature of the thermocouple bead . This can be done by using the MCP6V01 auto-zeroed op amp because of its ultra-low offset voltage (Vos) and high Common Mode Rejection Ratio (CMRR) .
MCP6N16 Evaluation Board (ADM00640)This board is designed to provide an easy and flexible platform when evaluating the MCP6N16, a zero-drift instrumentation amplifier designed for low-voltage operation featuring rail-to-rail input and output performance . The board is populated with the MCP6N16-100, which is optimized for gains for 100V/V or higher .
MCP6421 EMIRR Evaluation Board (ADM00443)The MCP6421 EMIRR Evaluation Board is intended to support the Electromagnetic Interference Rejection Ratio (EMIRR) measurement and to show the Electromagnetic Interference (EMI) rejection capability of the MCP6421 op amp .
www.microchip.com/analog62
Featured Analog Development Tools
Mixed Signal Products
For a complete list of development tools, please visit www.microchip.com/development tools.
MCP37X3X-200 16-bit 200 Msps ADC VTLA Evaluation Board (ADM00505)This board provides the opportunity to evaluate the performance of the MCP37X3X-200 device family . With the on-board MCP37D31-200 16-bit 200 Msps pipelined ADC, it allows you to evaluate the functionality of the 16-bit 200 Msps ADCs and the digital signal processing features . With the help of a compatible data capture card, the evaluation board can provide you with performance analysis features through the PC GUI .
PAC1921 High-Side Power and Current Monitor Evaluation Board (ADM00592)The PAC1921 is a dedicated power monitoring device with a configurable analog output. This device is unique in that all power-related information is available on the 2-wire/I2C-compatible interface and power, current or voltage is available on the analog output . This evaluation board provides you with the means to exercise device functionality while connected either to target systems or while utilizing on-board sources .
MCP39F511 Power Monitor Demonstration Board (ARM00667)The MCP39F511 Power Monitor Demonstration Board is a fully functional single-phase power monitor and energy monitoring system . The system calculates and displays active power, reactice power, RMS current, RMS voltage, active energy (both import and export) and four quadrant reactive energy . The Power Monitor Utility Software enables you to easily experiment with all system configuration settings such as zero-cross detection, PWM output frequencies, event configurations and calibration setup.
Interface ProductsUCS81003 Evaluation Board (ADM00561)This board provides the ability to evaluate the features of the UCS81003 Automotive USB Port Power Con-troller with Charger Emulation. It allows the UCS81003 to be tested in different configurations by populat-ing jumpers on specific header locations. The Evaluation Board contains the MCP2221 USB to I2C bridge,
which allows communication via USB between the UCS81003 and the GUI running on the PC .
LAN9252 EtherCAT® Slave Controller Evaluation Kit with HBI PDI Interface (EVB-LAN9252-HBI)This kit is a standalone platform to develop an EtherCAT slave device. It offers flexibility to explore different host bus interfaces such as 8-bit and 16-bit parallel bus, SPI and SQI™ .
LAN874X 10/100 Ethernet Transceiver with EEE and Wake-On-LAN (EVB8740)The EVB8740 is a PHY evaluation board for our LAN874X family, which integrates Energy Efficient Ethernet and Wake-on-LAN features . It interfaces to a MAC controller via a standard MII or RMII interface .
USB3740 Hi-Speed USB 2 .0 2-Port Switch (EVB-USB3740)The EVB-USB3740 is used to evaluate our USB3740 USB 2 .0 compliant 2-port switch . Some applications require a single USB port to be shared with other functions . The USB3740 is a small and simple 2-port switch providing system design flexibility.
Analog and Interface Product Selector Guide 63
Featured Analog Development Tools
For a complete list of development tools, please visit www.microchip.com/development tools.
UTC2000 Basic USB Type-C™ Controller Evaluation Kit (EVK-UTC2000)The EVK-UTC2000 is a complete kit to evaluate our UTC2000 basic USB-C controller. It includes a downstream-facing port dongle which can connect to any standard host, an upstream-facing port board to mimic a USB-C device, as well as a USB-C cable .
USB5734 USB 3 .1 Gen1 Controller Hub Evaluation Board (EVB-USB5734)This board is a demonstration and evaluation platform that provides the necessary requirements and interface options for evaluating the USB5734 Smart Hub on a 4-layer RoHS-compliant PCB . This will allow you to gain an understanding of the product and accelerate integration into your design .
USB5926 USB 3 .1 Gen1 Smart Hub with 2:1 USB-C MUX Evaluation Board (EVB-USB5926)This board demonstrates implementation of USB Type-C ports using Microchip’s UTC2000 CC pin interface controller and the USB5926’s built-in 2:1 Muxes . The board supports two downstream facing USB Type-C ports along with an upstream facing USB Type-C port . The USB5926 also supports two additional down-stream Type A ports for legacy purposes .
MCP2515 CAN Bus Monitor Demo Board (MCP2515DM-BM)The MCP2515 CAN Bus Monitor Demo board kit contains two identical boards that can be connected together to create a simple two-node Controller Area Network (CAN) bus, which can be controlled and/or monitored via the included PC interface . The board(s) can also be connected to an existing CAN bus .
USB to UART Converter Evaluation Board (MCP2200EV-VCP)The MCP2200EV-VCP is a USB-to-RS232 development and evaluation board for the MCP2200 USB-to-UART device . The board allows for easy demonstration and evaluation of the MCP2200 . The accompany-ing software allows the special device features to be configured and controlled. The board is powered from USB and has a test point associated with each GPIO pin . In addition, two of these pins are connected to LEDs which can be used to indicate USB-to-UART traffic when the associated pins are configured as TxLED and RxLED pins respectively .
Interface Products (Continued)
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SupportMicrochip is committed to supporting its customers in de-veloping products faster and more efficiently. We maintain a worldwide network of field applications engineers and technical support ready to provide product and system assistance . For more information, please visit www .microchip .com:• Technical Support: www .microchip .com/support• Evaluation samples of any Microchip device:
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10/10/17
The Microchip name and logo, the Microchip logo, dsPIC, Hyper Speed Control, HyperLight Load, MPLAB and PIC are registered trademarks and PICtail, PICkit and SQI are trademarks of Microchip Technology Incorporated in the U .S .A . and other countries . All other trademarks mentioned herein are property of their respective companies. © 2017, Microchip Technology Incorporated . All Rights Reserved . 10/17 DS20001060AQ