12-Bit, 5MHz Sampling ANALOG-TO-DIGITAL CONVERTER

FEATURES HIGH SFDR: 82dB at NYQUIST HIGH SNR: 69dB LOW POWER: 115mW LOW DLE: 0.25LSB FLEXIBLE INPUT RANGE OVER-RANGE INDICATOR

APPLICATIONS IF AND BASEBAND DIGITIZATION

CCD IMAGING SCANNERS

TEST INSTRUMENTATION

DESCRIPTIONThe ADS803 is a high-speed, high dynamic range, 12-bitpipelined Analog-to-Digital (A/D) converter. This converterincludes a high-bandwidth track-and-hold that gives excel-lent spurious performance up to and beyond the Nyquist rate.This high-bandwidth, linear track-and-hold minimizes har-monics and has low jitter, leading to excellent SNR perfor-mance. The ADS803 is also pin-compatible with the 10MHzADS804 and the 20MHz ADS805.

The ADS803 provides an internal reference and can beprogrammed for a 2Vp-p input range for the best spuriousperformance and ease of driving. Alternatively, the 5Vp-p inputrange can be used for the lowest input referred noise of

0.09LSBs rms giving superior imaging performance. There isalso a capability to set the input range in between the 2Vp-pand 5Vp-p input ranges or to use an external reference. TheADS803 also provides an over-range indicator flag to indicatean input range that exceeds the full-scale input range of theconverter. This flag can be used to reduce the gain of the front-end gain-ranging circuitry.

The ADS803 employs digital error-correction techniques toprovide excellent differential linearity for demanding imagingapplications. Its low distortion and high SNR give the extramargin needed for communications, medical imaging, video,and test instrumentation applications. The ADS803 is avail-able in an SSOP-28 package.

12-BitPipelined

ADC

Reference andMode Select

Reference Ladderand Driver

Timing Circuitry

ErrorCorrection

Logic

3-StateOutputsT & H

D0

D11

•••

CLK+VS

ADS803

VDRV

OESEL REFBVREFREFT

INVIN

IN

CMOVR

ADS803

SBAS074B – JANUARY 1997 – REVISED SEPTEMBER 2002

www.ti.com

Copyright © 1997, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.

ADS803E

ADS8032SBAS074Bwww.ti.com

+VS ....................................................................................................... +6VAnalog Input ........................................................... (–0.3V) to (+VS +0.3V)Logic Input ............................................................. (–0.3V) to (+VS +0.3V)Case Temperature ......................................................................... +100°CJunction Temperature .................................................................... +150°CStorage Temperature ..................................................................... +150°C

ABSOLUTE MAXIMUM RATINGS(1)

ELECTRICAL CHARACTERISTICSAt TA = full specified temperature range, VS = +5V, specified input range = 1.5V to 3.5V, single-ended input and sampling rate = 5MHz, unless otherwise specified.

ADS803E

PARAMETER CONDITIONS MIN TYP MAX UNITS

RESOLUTION 12 Tested Bits

SPECIFIED TEMPERATURE RANGE –40 +85 °C

CONVERSION CHARACTERISTICSSample Rate 10k 5M Samples/sData Latency 6 Clk Cycles

ANALOG INPUTSingle-Ended Input Range 1.5 3.5 VStandard Optional Single-Ended Input Range 0 5 VCommon-Mode Voltage 2.5 VStandard Optional Common-Mode Voltage 1 VInput Capacitance 20 pFTrack-Mode Input Bandwidth –3dBFS Input 270 MHz

DYNAMIC CHARACTERISTICSDifferential Linearity Error (Largest Code Error)

f = 500kHz ±0.25 ±0.75 LSBNo Missing Codes TestedSpurious-Free Dynamic Range(1)

f = 2.48MHz (–1dB input) 74 82 dBFS(2)

2-Tone Intermodulation Distortion(3) 74 dBcf = 1.8M and 1.9M (–7dBFS each tone)

Signal-to-Noise Ratio (SNR)f = 2.48MHz (–1dB input) 66.5 69 dB

Signal-to-(Noise + Distortion) (SINAD)f = 2.48MHz (–1dB input) 65 68 dB

Effective Number of Bits at 2.48MHz(4) 11 BitsInput Referred Noise 0V to 5V Input 0.09 LSBs rms

1.5V to 3.5V Input 0.23 LSBs rmsIntegral Nonlinearity Error

f = 500kHz ±1 ±2 LSBAperture Delay Time 1 nsAperture Jitter 4 ps rmsOver-Voltage Recovery Time 1.5 • FS Input 2 nsFull-Scale Step Acquisition Time 50 ns

SPECIFIEDPACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT

PRODUCT PACKAGE-LEAD DESIGNATOR(1) RANGE MARKING NUMBER MEDIA, QUANTITY

ADS803E SSOP-28 DB –40°C to +85°C ADS803E ADS803E Rails, 48

" " " " " ADS803E/1K Tape and Reel, 1000

NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.

PACKAGE/ORDERING INFORMATION

ELECTROSTATICDISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-ments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handlingand installation procedures can cause damage.

ESD damage can range from subtle performance degrada-tion to complete device failure. Precision integrated circuitsmay be more susceptible to damage because very smallparametric changes could cause the device not to meet itspublished specifications.

NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”may cause permanent damage to the device. Exposure to absolute maximumconditions for extended periods may affect device reliability.

ADS803 3SBAS074B www.ti.com

ELECTRICAL CHARACTERISTICS (Cont.)At TA = full specified temperature range, VS = +5V, specified input range = 1.5V to 3.5V, single-ended input and sampling rate = 5MHz, unless otherwise specified.

ADS803E

PARAMETER CONDITIONS MIN TYP MAX UNITS

DIGITAL INPUTSLogic Family CMOS CompatibleConvert Command Start Conversion Rising Edge of Convert ClockHigh Level Input Current (VIN = 5V)(5) 100 µALow Level Input Current (VIN = 0V) ±10 µAHigh Level Input Voltage +3.5 VLow Level Input Voltage +1.0 VInput Capacitance 5 pF

DIGITAL OUTPUTSLogic Family CMOS/TTL Compatible VLogic Coding Straight Offset BinaryLow Output Voltage (IOL = 50µA) 0.1 VLow Output Voltage (IOL = 1.6mA) 0.4 VHigh Output Voltage (IOH = 50µA) +4.5 VHigh Output Voltage (IOH = 0.5mA) +2.4 V3-State Enable Time OE = L 20 40 ns3-State Disable Time OE = H 2 10 nsOutput Capacitance 5 pF

ACCURACY (5Vp-p Input Range) fS = 2.5MHzZero Error (Referred to –FS) At 25°C 0.2 ±1.5 %FSZero Error Drift (Referred to –FS) ±5 ppm/°CGain Error(6) At 25°C ±2.0 %FSGain Error Drift(6) ±15 ppm/°CGain Error(7) At 25°C ±1.5 %FSGain Error Drift(7) ±15 ppm/°CPower-Supply Rejection of Gain ∆VS = ±5% 60 82 dBReference Input Resistance 1.6 kΩInternal Voltage Reference Tolerance (VREF = 2.5V) At 25°C ±35 mVInternal Voltage Reference Tolerance (VREF = 1.0V) At 25°C ±14 mV

POWER-SUPPLY REQUIREMENTSSupply Voltage: +VS Operating +4.7 +5.0 5.3 VSupply Current: +IS Operating 23 27 mAPower Dissipation Operating 115 135 mWThermal Resistance, θJA

SSOP-28 50 °C/W

NOTES: (1) Spurious-Free Dynamic Range refers to the magnitude of the largest harmonic. (2) dBFS means dB relative to full-scale. (3) 2-tone intermodulationdistortion is referred to the largest fundamental tone. This number will be 6dB higher if it is referred to the magnitude of the 2-tone fundamental envelope. (4) Effectivenumber of bits (ENOB) is defined by (SINAD – 1.76)/6.02. (5) Internal 50kΩ pull-down resistor. (6) Includes internal reference. (7) Excludes internal reference.

ADS8034SBAS074Bwww.ti.com

PIN CONFIGURATIONPIN DESIGNATOR DESCRIPTION

1 OVR Over-Range Indicator2 B1 Data Bit 1 (MSB)3 B2 Data Bit 24 B3 Data Bit 35 B4 Data Bit 46 B5 Data Bit 57 B6 Data Bit 68 B7 Data Bit 79 B8 Data Bit 810 B9 Data Bit 911 B10 Data Bit 1012 B11 Data Bit 1113 B12 Data Bit 12 (LSB)14 CLK Convert Clock Input15 OE Output Enable16 +VS +5V Supply17 GND Ground18 SEL Input Range Select19 VREF Reference Voltage Select20 REFB Bottom Reference21 CM Common-Mode Voltage22 REFT Top Reference23 IN Complementary Analog Input24 GND Analog Ground25 IN Analog Input (+)26 GND Analog Ground27 +VS +5V Supply28 VDRV Output Driver Voltage

PIN DESCRIPTIONS

Top View SSOP

6 Clock Cycles

Data Invalid

tDtL tHtCONV

N – 6 N – 5 N – 4 N – 3 N – 2 N – 1 N N + 1Data Out

Clock

Analog InN

t2

N + 1 N + 2N + 3 N + 4

N + 5 N + 6N + 7

t1

TIMING DIAGRAM

SYMBOL DESCRIPTION MIN TYP MAX UNITS

tCONV Convert Clock Period 200 1 • 105(ns) nstL Clock Pulse LOW 96 99 nstH Clock Pulse HIGH 96 99 nstD Aperture Delay 3 nst1 Data Hold Time, CL = 0pF 3.9 nst2 New Data Delay Time, CL = 15pF max 12 ns

OVR

B1

B2

B3

B4

B5

B6

B7

B8

B9

B10

B11

B12

CLK

VDRV

+VS

GND

IN

GND

IN

REFT

CM

REFB

VREF

SEL

GND

+VS

OE

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

ADS803

ADS803 5SBAS074B www.ti.com

TYPICAL CHARACTERISTICSAt TA = full specified temperature range, VS = +5V, specified input range = 1.5V to 3.5V, and single-ended input and sampling rate = 5MHz, unless otherwise specified.

SPECTRAL PERFORMANCE

Frequency (MHz)

Am

plitu

de (

dB)

0 0.5 1.0 1.5 2.0 2.5

0

–20

–40

–60

–80

–100

–120

fIN = 500kHz

SPECTRAL PERFORMANCE

Frequency (MHz)

Am

plitu

de (

dB)

0 0.5 1.0 1.5 2.0 2.5

0

–20

–40

–60

–80

–100

–120

fIN = 2.48MHz

FREQUENCY SPECTRUM

Frequency (MHz)

Mag

nitu

de (

dBF

SR

)

0 0.5 1.0 1.5 2.0 2.5

0

–20

–40

–60

–80

–100

–120

f1 = 1.8MHz at –7dBf2 = 1.9MHz at –7dBIMD (3) = –74dBc

DIFFERENTIAL LINEARITY ERROR

Output Code

DLE

(LS

B)

0 1024 2048 3072 4096

1.0

0.5

0

–0.5

–1.0

fIN = 500kHz

INTEGRAL LINEARITY ERROR

Output Code

ILE

(LS

B)

0 1024 2048 3072 4096

4.0

2.0

0

–2.0

–4.0

fIN = 500kHz100

80

60

40

20

0

SWEPT POWER SFDR

SF

DR

(dB

FS

, dB

c)

–60 –50 –40 –30 –20 –10 0

Input Amplitude (dBFS)

dBFS

dBc

fIN = 2.48MHz

ADS8036SBAS074Bwww.ti.com

TYPICAL CHARACTERISTICS (Cont.)At TA = full specified temperature range, VS = +5V, specified input range = 1.5V to 3.5V, and single-ended input and sampling rate = 5MHz, unless otherwise specified.

DYNAMIC PERFORMANCE vs INPUT FREQUENCY

SF

DR

, SN

R (

dBF

S)

85

80

75

70

65

600.1 1

Frequency (MHz)

10

SFDR

SNR

DYNAMIC PERFORMANCE vs INPUT FREQUENCY(Differential Input, VIN = 5Vp-p)

SF

DR

, SN

R (

dBF

S)

85

80

75

70

65

600.1 1

Frequency (MHz)

10

SFDR

SNR

0.40

0.30

0.20

0.10

DIFFERENTIAL LINEARITY ERRORvs TEMPERATURE

DLE

(LS

B)

–50 –25 0 25 50 75 100

Temperature (°C)

fIN = 500kHz

fIN = 2.48MHz

85

80

75

70

SPURIOUS-FREE DYNAMIC RANGEvs TEMPERATURE

SF

DR

(dB

FS

)

–50 –25 0 25 50 10075

Temperature (°C)

fIN = 500kHz

fIN = 2.48MHz

72

70

68

66

64

SIGNAL-TO-NOISE RATIO ANDSIGNAL-TO-(NOISE + DISTORTION) vs TEMPERATURE

SIN

AD

, SN

R (

dBF

S)

–50 –25 0 25 50 75 100

Temperature (°C)

fIN = 2.48MHzfIN = 2.48MHz

fIN = 500kHz

fIN = 500kHz

SNR

SINAD

117

116

115

114

POWER DISSIPATION vs TEMPERATURE

Pow

er (

mW

)

–50 –25 0 25 50 10075

Temperature (°C)

ADS803 7SBAS074B www.ti.com

TYPICAL CHARACTERISTICS (Cont.)At TA = full specified temperature range, VS = +5V, specified input range = 1.5V to 3.5V, and single-ended input and sampling rate = 5MHz, unless otherwise specified.

800k

600k

400k

200k

0

OUTPUT NOISE HISTOGRAM(DC Input, VIN = 2Vp-p)

Cou

nts

N – 2 N – 1 N N + 1 N + 2

Code

800k

600k

400k

200k

0

OUTPUT NOISE HISTOGRAM(DC Input, VIN = 5Vp-p Range)

Cou

nts

N – 2 N – 1 N N + 1 N + 2

Code

APPLICATION INFORMATIONDRIVING THE ANALOG INPUT

The ADS803 allows its analog inputs to be driven eithersingle-ended or differentially. The focus of the followingdiscussion is on the single-ended configuration. Typically, itsimplementation is easier to achieve and the rated specifica-tions for the ADS803 are characterized using the single-ended mode of operation.

AC-COUPLED INPUT CONFIGURATION

Given in Figure 1 is the circuit example of the most commoninterface configuration for the ADS803. With the VREF pinconnected to the SEL pin, the full-scale input range is defined

to be 2Vp-p. This signal is ac-coupled in single-ended formto the ADS803 using the low-distortion voltage-feedbackamplifier OPA642. As is generally necessary for single-supply components, operating the ADS803 with a full-scaleinput signal swing requires a level-shift of the amplifier’szero-centered analog signal to comply with the A/D converter’sinput range requirements. Using a DC blocking capacitorbetween the output of the driving amplifier and the converter’sinput, a simple level-shifting scheme can be implemented. Inthis configuration, the top and bottom references (REFT andREFB) provide an output voltage of +3V and +2V, respec-tively. Here, two resistor pairs (2 • 2kΩ) are used to create acommon-mode voltage of approximately +2.5V to bias theinputs of the ADS803 (IN, IN) to the required DC voltage.

FIGURE 1. AC-Coupled Input Configuration for 2Vp-p Input Swing and Common-Mode Voltage at +2.5V Derived from InternalTop and Bottom Reference.

OPA642

VIN+VIN

0V

–VIN RF402Ω

RG402Ω

ADS803

RS24.9Ω

2kΩ2kΩ

2kΩ

2kΩ

100pF

0.1µF

0.1µF2Vp-p

IN

IN

(+2V)REFB

(+1V)VREF

SEL

REFT(+3V)

+5V –5V

+2.5VDC

ADS8038SBAS074Bwww.ti.com

FIGURE 2. DC-Coupled, Single-Ended Input Configuration with DC-Level Shift.

An advantage of ac-coupling is that the driving amplifier stilloperates with a ground-based signal swing. This will keep thedistortion performance at its optimum since the signal swingstays within the linear region of the op amp and sufficientheadroom to the supply rails can be maintained. Considerusing the inverting gain configuration to eliminate CMR in-duced errors of the amplifier. The addition of a small seriesresistor (RS) between the output of the op amp and the inputof the ADS803 will be beneficial in almost all interface configu-rations. This will decouple the op amp’s output from thecapacitive load and avoid gain peaking, which can result inincreased noise. For best spurious and distortion performance,the resistor value should be kept below 50Ω. Furthermore, theseries resistor together with the 100pF capacitor, establish apassive low-pass filter, limiting the bandwidth for the widebandnoise thus help improving the SNR performance.

DC-COUPLED WITHOUT LEVEL SHIFT

In some applications the analog input signal may already bebiased at a level which complies with the selected inputrange and reference level of the ADS803. In this case, it isonly necessary to provide an adequately low source imped-ance to the selected input, IN or IN. Always consider widebandop amps, since their output impedance will stay low over awide range of frequencies. For those applications requiringthe driving amplifier to provide a signal amplification (with again ≥ 3), consider using the decompensated voltage-feed-back op amp OPA643.

DC-COUPLED WITH LEVEL SHIFT

Several applications may require that the bandwidth of thesignal path includes DC, in which case the signal has to beDC-coupled to the A/D converter. In order to accomplishthis, the interface circuit has to provide a DC-level shift. Thecircuit presented in Figure 2 employs an op amp, A1, to sumthe ground centered input signal with a required DC offset.

OPA691VIN

+VS

2Vp-p

0

+1V

–1V

RF

RIN

NOTE: RF = RIN, G = –1

+VS

ADS803

RS24.9Ω

2kΩ

100pF

10µF+

+2.5V

R2R1

2kΩ

IN

IN

REFB(+1V)VREF SEL

REFT

0.1µF

0.1µF

The ADS803 typically operates with a +2.5V common-modevoltage, which is established at the center tap of the ladderand connected to the IN input of the converter. Amplifier A1operates in inverting configuration. Here, resistors R1 andR2 set the DC bias level for A1. Due to the op amp’s noisegain of +2V/V (assuming RF = RIN), the DC offset voltageapplied to its noninverting input has to be divided down to+1.25V, resulting in a DC output voltage of +2.5V.DC voltage differences between the IN and IN inputs of theADS803 will effectively produce an offset, which can becorrected for by adjusting the values of resistors R1 and R2.The bias current of the op amp may also result in anundesired offset. The selection criteria of the appropriate opamp should include the input bias current, output voltageswing, distortion, and noise specification. Note that in thisexample the overall signal phase is inverted. To re-estab-lish the original signal polarity it is always possible tointerchange the IN and IN connections.

SINGLE-ENDED-TO-DIFFERENTIALCONFIGURATION (TRANSFORMER COUPLED)

In order to select the best suited interface circuit for theADS803, the performance requirements must be known. Ifan ac-coupled input is needed for a particular application, thenext step is to determine the method of applying the signal;either single-ended or differentially. The differential inputconfiguration may provide a noticeable advantage of achiev-ing good SFDR performance based on the fact that in thedifferential mode, the signal swing can be reduced to half ofthe swing required for single-ended drive. Secondly, bydriving the ADS803 differentially, the even-order harmonicswill be reduced. See Figure 3 for the schematic of thesuggested transformer coupled interface circuit. The resistoracross the secondary side (RT) should be set to get an inputimpedance match (e.g., RT = n2 • RG).

ADS803 9SBAS074B www.ti.com

VIN IN

IN CM

22Ω

22Ω

100pF

RT

100pF

+4.7µF 0.1µF

ADS803

1:n0.1µF

RG

REFERENCE OPERATION

Integrated into the ADS803 is a bandgap reference circuitincluding logic that provides either a +1V or +2.5V referenceoutput by simply selecting the corresponding pin-strap con-figuration. Different reference voltages can be generated bythe use of two external resistors, which will set a differentgain for the internal reference buffer. For more design flexibil-ity, the internal reference can be shut off and an externalreference voltage used. Table I provides an overview of thepossible reference options and pin configurations.

FIGURE 3. Transformer-Coupled Input

INPUTFULL-SCALE REQUIRED

MODE RANGE VREF CONNECT TO

Internal 2Vp-p +1V SEL VREF

Internal 5Vp-p +2.5V SEL GND

Internal 2V ≤ FSR < 5V 1V < VREF < 2.5V R1 VREF and SEL

FSR = 2 x VREF VREF = 1 + (R1/R2) R2 SEL and GND

External 1V < FSR < 5V 0.5V < VREF < 2.5V SEL +VS

VREF Ext. VREF

TABLE I. Selected Reference Configuration Examples.

A simple model of the internal reference circuit is shown inFigure 4. The internal blocks are a 1V-bandgap voltagereference, buffer, the resistive reference ladder, and thedrivers for the top and bottom reference that supply thenecessary current to the internal nodes. As shown, theoutput of the buffer appears at the VREF pin. The full-scaleinput span of the ADS803 is determined by the voltage atVREF, according to Equation 1:

Full-Scale Input Span = 2 • VREF (1)

Note that the current drive capability of this amplifier is limited toapproximately 1mA and should not be used to drive low loads.The programmable reference circuit is controlled by the voltageapplied to the select pin (SEL). Refer to Table I for an overview.

FIGURE 4. Equivalent Reference Circuit.

800Ω

800Ω

REFB

CMReference

Driver

Bandgapand Logic

REFT

VREF

SEL

1VDC

Resistor Networkand Switches

DisableSwitch

to A/D

to A/DADS803

ADS80310SBAS074Bwww.ti.com

3.5V

1.5V

IN

IN

+1V

SELVREF

+2.5V ext.

ADS803

VIN

VIN

5V

0V

IN

IN

+2.5V

SELVREF

ADS803

FIGURE 8. Internal Reference with 1.5V to 3.5V Input Range.

FIGURE 9. Internal Reference with 1V to 4V Input Range.

FIGURE 7. Internal Reference with 0V to 5V Input Range.

The top reference (REFT) and the bottom reference (REFB)are brought out mainly for external bypassing. For properoperation with all reference configurations, it is necessary toprovide solid bypassing to the reference pins in order to keepthe clock feedthrough to a minimum. Figure 5 shows therecommended decoupling network.

4V

1V

IN

INSELVREF

+2.5V ext.

VREF = 1V 1 +R1

R2

FSR = 2 • VREF

ADS803

R15kΩ

+1.5VR2

10kΩ

FIGURE 5. Recommended Reference Bypassing Scheme.

ADS803

CMREFB

0.1µF

0.1µF

VREF

0.1µF

10µF+

0.1µF

REFT

0.1µF

10µF+

FIGURE 6. Alternative Circuit to Generate CM Voltage.

IN

IN

REFT

R1

CMV

R2

0.1µF

0.1µF

ADS803

REFB

In addition, the common-mode voltage (CMV) may be used asa reference level to provide the appropriate offset for the drivingcircuitry. However, care must be taken not to appreciably loadthis node, which is not buffered and has a high impedance. Analternate method of generating a common-mode voltage isgiven in Figure 6. Here, two external precision resistors (toler-ance 1% or better) are located between the top and bottomreference pins. The common-mode level will appear at themidpoint. The output buffers of the top and bottom referenceare designed to supply approximately 2mA of output current.

SELECTING THE INPUT RANGE AND REFERENCE

Figures 7 through 9 show a selection of circuits for the mostcommon input ranges when using the internal reference ofthe ADS803. All examples are for single-ended inputs andoperate with a nominal common-mode voltage of +2.5V.

EXTERNAL REFERENCE OPERATION

Depending on the application requirements, it might beadvantageous to operate the ADS803 with an external refer-ence. This may improve the DC accuracy if the external

ADS803 11SBAS074B www.ti.com

FIGURE 10. External Reference, Input Range 0.5V to 4.5V(4Vp-p), with +2.5V Common-Mode Voltage.

reference circuitry is superior in its drift and accuracy. To usethe ADS803 with an external reference, the user mustdisable the internal reference, as shown in Figure 10. Byconnecting the SEL pin to +VS, the internal logic will shutdown the internal reference. At the same time, the output ofthe internal reference buffer is disconnected from the VREF

pin, which must now be driven with the external reference.Note that a similar bypassing scheme should be maintainedas described for the internal reference operation.

Therefore, this edge should have the lowest possible jitter.The jitter noise contribution to total SNR is given by thefollowing equation. If this value is near your system require-ments, input clock jitter must be reduced.

JitterSNR rms signal to rms noise=ƒ

201

2log

π IN At

where: ƒIN is Input Signal FrequencytA is rms Clock Jitter

Particularly in undersampling applications, special consider-ation should be given to clock jitter. The clock input should betreated as an analog input in order to achieve the highestlevel of performance. Any overshoot or undershoot of theclock signal may cause degradation of the performance.When digitizing at high sampling rates, the clock should havea 50% duty cycle (tH = tL), along with fast rise and fall timesof 2ns or less.

DIGITAL OUTPUTS

The digital outputs of the ADS803 are designed to becompatible with both high speed TTL and CMOS logicfamilies. The driver stage for the digital outputs is suppliedthrough a separate supply pin, VDRV, which is not con-nected to the analog supply pins. By adjusting the voltage onVDRV, the digital output levels will vary respectively. There-fore, it is possible to operate the ADS803 on a +5V analogsupply while interfacing the digital outputs to 3V logic.

It is recommended to keep the capacitive loading on the datalines as low as possible (≤ 15pF). Larger capacitive loadsdemand higher charging currents as the outputs are chang-ing. Those high current surges can feed back to the analogportion of the ADS803 and influence the performance. Ifnecessary, external buffers or latches may be used, whichprovide the added benefit of isolating the ADS803 from anydigital noise activities on the bus coupling back high-fre-quency noise. In addition, resistors in series with each dataline may help maintain the ac performance of the ADS803.Their use depends on the capacitive loading seen by theconverter. Values in the range of 100Ω to 200Ω will limit theinstantaneous current the output stage has to provide forrecharging the parasitic capacitances as the output levelschange from LOW to HIGH or HIGH to LOW.

4.5V

0.5V

IN

IN+2.5V ext.

SELVREF

1.24kΩ

4.99kΩ

0.1µF10µF

REF1004+2.5V

+

ADS803

+5V

VIN

+2VDC

DIGITAL INPUTS AND OUTPUTS

Over-Range (OVR)

One feature of the ADS803 is its ‘Over-Range’ (OVR) digitaloutput. This pin can be used to monitor any out-of-rangecondition, which occurs every time the applied analog inputvoltage exceeds the input range (set by VREF). The OVRoutput is LOW when the input voltage is within the definedinput range. It becomes HIGH when the input voltage isbeyond the input range. This is the case when the inputvoltage is either below the bottom reference voltage or abovethe top reference voltage. OVR will remain active until theanalog input returns to its normal signal range and anotherconversion is completed. Using the MSB and its complementin conjunction with OVR, a simple clue logic can be built thatdetects the over-range and under-range conditions, as shownin Figure 11. It should be noted that OVR is a digital outputthat is updated along with the bit information correspondingto the particular sampling incidence of the analog signal.Therefore, the OVR data is subject to the same pipelinedelay (latency) as the digital data.

CLOCK INPUT REQUIREMENTS

Clock jitter is critical to the SNR performance of high-speed,high-resolution A/D converters. It leads to aperture jitter (tA)which adds noise to the signal being converted. The ADS803samples the input signal on the rising edge of the CLK input.

OVR

MSB

Under = H

Over = H

FIGURE 11. External Logic for Decoding Under- and Over-Range Conditions.

ADS80312SBAS074Bwww.ti.com

FIGURE 12. Recommended Bypassing for Analog Supply Pins.

GROUNDING AND DECOUPLING

Proper grounding and bypassing, short lead length, and theuse of ground planes are particularly important for high-frequency designs. Multi-layer PC boards are recommendedfor best performance, since they offer distinct advantageslike minimizing ground impedance, separation of signal lay-ers by ground layers, etc. It is recommended that the analogand digital ground pins of the ADS803 be joined together atthe IC and be connected only to the analog ground of thesystem.

The ADS803 has analog and digital supply pins, however,the converter should be treated as an analog component andall supply pins should be powered by the analog supply. Thiswill ensure the most consistent results, since digital supplylines often carry high levels of noise that would otherwise becoupled into the converter and degrade the achievable per-formance.

Due to the pipeline architecture, the converter also generateshigh-frequency current transients and noise that are fed backinto the supply and reference lines. This requires that thesupply and reference pins be sufficiently bypassed. Figure12 shows the recommended decoupling scheme for the

+VS27 26

GND

ADS803

+

0.1µF 0.1µF

+VS16 17

GND

2.2µF

VDRV28

0.1µF

+5V/+3V+5V

analog supplies. In most cases, 0.1µF ceramic chip capaci-tors are adequate to keep the impedance low over a widefrequency range. Their effectiveness largely depends on theproximity to the individual supply pin. Therefore, they shouldbe located as close to the supply pins as possible. Inaddition, a larger size bipolar capacitor (1µF to 22µF) shouldbe placed on the PC board in close proximity to the convertercircuit.

PACKAGE OPTION ADDENDUM

www.ti.com 7-Mar-2017

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish(6)

MSL Peak Temp(3)

Op Temp (°C) Device Marking(4/5)

Samples

ADS803E ACTIVE SSOP DB 28 50 Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 ADS803E

ADS803E/1K ACTIVE SSOP DB 28 1000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 ADS803E

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

PACKAGE OPTION ADDENDUM

www.ti.com 7-Mar-2017

Addendum-Page 2

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

ADS803E/1K SSOP DB 28 1000 330.0 16.4 8.1 10.4 2.5 12.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 31-May-2013

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

ADS803E/1K SSOP DB 28 1000 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 31-May-2013

Pack Materials-Page 2

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