ACT® 930 - Versum Materials€¦ · INSTRUCTIONS FOR USE ACT 930 65°C to 75°C 5 to 30 minutes DI...
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ACT ® 930 etch residue remover and posive photoresist is a low- hydroxylamine (HA) based product for aluminum applicaons. It is low cost and extremely effecve in removing etch residue. It is well adopted in the worldwide semiconductor industry. ACT® 930 ––– ETCH RESIDUE REMOVER AND POSITIVE PHOTORESIST BENEFITS Rapid removal of stubborn via and metal etch residue, parcularly those with high inorganic content Operang condions; temperatures of 65°C to 75°C for 5 to 30 minutes Completely water soluble aſter stripping; no intermediate rinse necessary Low etch rates on most sensive metals, including Al, Ti, W Removal of bulk photoresist Low trace metal content TYPICAL PHYSICAL PROPERTIES Specific Gravity @ 25°C: 1.055 Boiling Point (for product): 114°C Flash Point (COC): > 100°C Viscosity @ 25°C: 14.2 cSt pH (5% soluon): 11.09 Freezing Point: < -20°C MATERIAL COMPATIBILITY This product is compable with the following materials used in the semiconductor industry*: 316LEP Stainless Steel High Density Polyethylene Polypropylene Kalrez 6375 UP PFA Polysulfone POE e-ring UHMW Polyethylene Teflon PTFE Polyethylene-CL * Test condions: 10 days at 25°C and 75°C For informaon on other materials, contact your Versum Materials ACT sales representave.
Transcript of ACT® 930 - Versum Materials€¦ · INSTRUCTIONS FOR USE ACT 930 65°C to 75°C 5 to 30 minutes DI...
ACT® 930 etch residue remover and positive photoresist is a low-hydroxylamine (HA) based product for aluminum applications. It is low cost and extremely effective in removing etch residue. It is well adopted in the worldwide semiconductor industry.
ACT® 930 ––– ETCH RESIDUE REMOVER AND POSITIVE PHOTORESIST
BENEFITS
Rapid removal of stubborn via and metal etch residue, particularly those with high inorganic content
Operating conditions; temperatures of 65°C to 75°C for 5 to 30 minutes
Completely water soluble after stripping; no intermediate rinse necessary
Low etch rates on most sensitive metals, including Al, Ti, W
Removal of bulk photoresist
Low trace metal content
TYPICAL PHYSICAL PROPERTIES
Specific Gravity @ 25°C: 1.055
Boiling Point (for product): 114°C
Flash Point (COC): > 100°C
Viscosity @ 25°C: 14.2 cSt
pH (5% solution): 11.09
Freezing Point: < -20°C
MATERIAL COMPATIBILITY This product is compatible with the following materials used in the semiconductor industry*: 316LEP Stainless Steel High Density Polyethylene
Polypropylene Kalrez 6375 UP
PFA Polysulfone
POE e-ring UHMW Polyethylene
Teflon PTFE Polyethylene-CL
* Test conditions: 10 days at 25°C and 75°C For information on other materials, contact your Versum Materials ACT sales representative.
INSTRUCTIONS FOR USE
ACT 930
65°C to 75°C
5 to 30 minutes
DI water rinse
ambient
5 minutes
Dry
Immediate rinse
ambient
5 minutes
DI water rinse
ambient,
5 minutes
either
or
ETCH RATES Etch rates on the following substrates**: TYPICAL MATERIALS ETCH RATES (Å/MIN) @ 75°C
Al 7
SiN < 1
TEOS < 1
Ti 2
W 2
TiN 1
**Metal thickness measurements were taken with a CDE ResMap 273 four-point probe. ***PolySi etch rate is bath life dependent.
TYPICAL PERFORMANCE RESULTS
BEFORE STRIP AFTER STRIP
TEOS VIA TO AL/CU APPLICATIONS
Process conditions: 75°C, 10 minutes
BEFORE STRIP AFTER STRIP
Process conditions: 75°C, 20 minutes
The information contained herein is offered without charge for use by technically qualified personnel at their discretion and risk. All statements, technical information and recommendations contained herein are based on tests and data which we believe to be reliable, but the accuracy or completeness thereof is not guaranteed and no warranty of any kind is made with respect thereto.
325-15-022-GLOBAL-May17
For more information, please contact us at:
VERSUM MATERIALS, LLC
VERSUMMATERIALS.COM
Versum and the Versum Materials logo are trademarks of Versum Materials, Inc. © 2017 Versum Materials, Inc.
Kalrez is a registered trademark of DuPont Dow Elastomers Teflon is a registered trademark of E.I. DuPont de Nemours & Co.
TYPICAL PERFORMANCE RESULTS
BEFORE STRIP AFTER STRIP
TIN/AL:CU/TI METAL LINE APPLICATION
Process conditions: 75°C, 30 minutes
BEFORE STRIP AFTER STRIP
