Accelerating Manufacturing Productivity

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450 mm Status Update

Tom Jefferson

450 mm Program ManagerDecember 7, 2009

2 December 2009 2

450 mm Progress in 2009

Dec-2008 Dec-2009

Wafer Inventory

Sintered wafers available for development

•Mechanical-grade single crystal wafers available for development

Process and Metrology Equipment

None •Particle inspection, wafer edge inspection, and particle removal equipment installed in ISMI’s cleanroom

•Film thickness equipment now available

•Performance metrics defined for 60 tool types

•Additional equipment capabilities are under development now

Factory Integration

380K handling cycles and 18K loadport cycles completed

•>5M handling robot cycles and >530K loadport open/close cycles completed with prototype carriers.

•4 EFEMs, 6 loadports, multiple carriers, and 2 PGVs under test

Standards Mechanical wafer standard passed, factory integration standards in blue ballot

•Test wafer standard in ballot

•FOUP and loadport standards are completed and passed

Solid Progress – But Many Challenges Remain

2 December 2009 3

450 mm Global Equipment Requirements

450 mm will re-use 300 mm guidelines and standards when possible to leverage learning where existing concepts are proven

300 mm Carryforward

Safety/EHS:

• S2, S8, CE Mark

• FMRC 4910/UL 2360

Facilities/Utilities:

• Height <12 ft

• Sub-fab:Fab footprint <0.75

• SEMI F47

Automation:

• E84, GEM300

Productivity:

• No TPT loss due to # of loadports on tool

450 mm

Safety/ESH:

• ISMI guidelines (manual handling risk characterization, fall protection, mass balance characterization)

• ≤1.0X utilities consumption, wasteemissions/effluent per wafer processed

Facilities/Utilities:

• ≤1.0X Footprint scalar (relative to throughput)

• ≤1.0X Install duration

• ≤1.0X Qual duration

2 December 2009 4

• The wafer quality is improving as suppliers and equipment manufacturers advance on the learning curve and new equipment becomes available.

NanoPhotonics haze maps reveal improvement between first and second polished wafer batch

Planetary pad ground single crystal wafer

Peter Wolters AC 2000-P³ processing 450 mm single crystal wafers

Wafer Quality Improvements

2 December 2009 5

450 mm Test Wafer Status

• Processing and measurement of test wafers has begun

• 450 mm wafers have received wet clean processing and particle measurements have been made– Experimental SC1 and DI processes from two different suppliers– Initial particle measurements appear repeatable

• NanoPhotonics tool calibrated down to 90 nm diameter with PSL

• Dielectric film metrology has passed source inspection and is ready for shipment– Manual load spectroscopic ellipsometer with 450 mm stage– Calibrated with known film thicknesses and types (non-450 mm)– Measured native oxide on both 450 mm sintered and single crystal

wafers

2 December 2009 6

ISMI Particle & Edge Inspection Tool- NanoPhotonics and Brooks Automation

450 mm metrology modules (particle and edge inspection)

450 mm EFEM

450 mm standard 12 mm pitch FOUP and loadport

Particle and edge inspection tool is qualified and has made measurements

First metrology tool shipped to ISMI

2 December 2009 7

ISMI Prototype Wafer Cleans Tool- SSEC

• First process tool shipped to ISMI

• Installation has begun

• Single wafer cleaning

• SC1/SC2 cleans

Photo Courtesy of Solid State Equipment Corp. (SSEC)Photo Courtesy of Solid State Equipment Corp. (SSEC)

2 December 2009 8

450 mm FOUPs and Shippers

• 450 mm FOUP and loadport standards are complete

• Horizontal multi-application carrier (H-MAC) prototype is under test

•H-MAC will replace FOSB in 450 mm for wafer shipment

•Same envelope and interface features as FOUP

Gudeng Rev 3 (12 mm) YB FOUPs Entegris Rev 3 (12 mm) FOUP Entegris Rev 0 (12 mm) H-MAC

2 December 2009 9

450 mm Resource Conservation Vision:No per wafer increase in energy and water use, air emissions, or waste

300 mm

450 mm450 mm Wafer = 2.25X

surface area

450 mm presents a unique opportunity to achieve a 55% reduction in resource use per cm2

Data from the 200–300 mm conversion tells us significant improvements can be achieved

Realizing this vision requires close cooperation between suppliers and end users

45%

300 mm n/cm2

450 mm n/cm2

2 December 2009 10

Key Messages - ISMI 450 mm Program (December 2009)

• ISMI maintains its focus on planning a cost-effective 450 mm transition and will continue to drive the activities required to support the needs of its members who are interested in realizing the 450 mm transition.

• 450 mm Test Wafer Generation Activity has started– ISMI’s first two 450 mm metrology tools are installed and operational; installation of the

first process equipment has begun.

• ISMI has defined the performance targets and test methods to execute 450 mm equipment demonstrations.

– ISMI member companies have clearly stated that they will use consortia demonstration results as input to their 450 mm equipment selection decisions.

• ISMI’s Interoperability Test Bed (ITB) has achieved its objective of enabling the evaluation of early prototypes to accelerate the development of factory integration standards.

• Initial progress has been made, but many challenges remain to realize a comprehensive 450 mm infrastructure at advanced technology nodes.

– ISMI will continue to engage constructively with interested suppliers and device makers to develop and validate solutions.

2 December 2009 11

For Further Information …

http://ismi.sematech.org/wafersize/index.htm

-or-

Tom JeffersonManager, ISMI 450 mm Program

tom.jefferson@ismi.sematech.org

.