A70 Product Specifications - Paoli · 2020. 4. 8. · LTE: +23dBm (Power Class 3) Application...

A70

Product Specifications

Issue 1.3

Date 2018-10-26

Neoway Product Document

A70


Copyright © Neoway Technology Co., Ltd i

Copyright © Neoway Technology Co., Ltd 2018. All rights reserved.

No part of this document may be reproduced or transmitted in any form or by any means without prior written

consent of Neoway Technology Co., Ltd.

is the trademark of Neoway Technology Co., Ltd.

All other trademarks and trade names mentioned in this document are the property of their respective

holders.

Notice

This document provides guide for users to use A70.

This document is intended for system engineers (SEs), development engineers, and test engineers.

THE INFORMATION IN THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE DUE TO

PRODUCT VERSION UPDATE OR OTHER REASONS.

EVERY EFFORT HAS BEEN MADE IN PREPARATION OF THIS DOCUMENT TO ENSURE ACCURACY

OF THE CONTENTS, BUT ALL STATEMENTS, INFORMATION, AND RECOMMENDATIONS IN THIS

DOCUMENT DO NOT CONSTITUTE A WARRANTY OF ANY KIND, EXPRESS OR IMPLIED.

Neoway provides customers complete technical support. If you have any question, please contact your

account manager or email to the following email addresses:

[email protected]

[email protected]

Website: http://www.neoway.com

http://www.neoway.com/

A70


Copyright © Neoway Technology Co., Ltd ii

Contents

About This Document ................................................................................... 1

Scope ................................................................................................................................................. 1

Audience ............................................................................................................................................ 1

Change History ................................................................................................................................... 1

Conventions ....................................................................................................................................... 2

Related Documents ............................................................................................................................ 2

1 About A70 .................................................................................................. 3

1.1 Product Overview ......................................................................................................................... 3

1.2 Block Diagram .............................................................................................................................. 5

1.3 Basic Features ............................................................................................................................. 6

2 Compliant Standards ................................................................................. 9

3 Module Pins ............................................................................................. 10

3.1 Pad Layout ................................................................................................................................. 10

3.2 Pin Description ............................................................................................................................ 11

3.3 MUX Interfaces .......................................................................................................................... 20

4 Electric Feature and Reliability ................................................................ 23

4.1 Electric Features ........................................................................................................................ 23

4.2 Temperature Feature .................................................................................................................. 26

4.3 ESD Protection ........................................................................................................................... 27

5 RF Features ............................................................................................. 28

5.1 Operating Bands ........................................................................................................................ 28

5.2 TX Power and RX Sensitivity ..................................................................................................... 29

5.3 GNSS Feature ............................................................................................................................ 32

6 Mechanical Features ............................................................................... 33

6.1 Dimensions ................................................................................................................................. 33

6.2 Label ........................................................................................................................................... 34

6.3 Three Views ............................................................................................................................... 34

6.4 Package ..................................................................................................................................... 35

6.4.1 Reel ................................................................................................................................... 35

6.4.2 Moisture ............................................................................................................................. 36

7 Mounting A70 onto the Application Board ................................................ 37

7.1 Application Foot Print ................................................................................................................. 37

7.2 Stencil ......................................................................................................................................... 38

7.3 Solder Paste ............................................................................................................................... 38

7.4 SMT Furnace Temperature Curve .............................................................................................. 38

8 Safety Recommendations ....................................................................... 40

A Conformity and Compliance .................................................................... 41

A70


Copyright © Neoway Technology Co., Ltd iii

A.1 Approvals ................................................................................................................................... 41

A.2 Chinese Notice........................................................................................................................... 41

A.2.1 CCC Class A Digital Device Notice ................................................................................... 41

A.2.2 Environmental Protection Notice ....................................................................................... 41

B Abbreviation ............................................................................................ 42

A70


Copyright © Neoway Technology Co., Ltd iv

Table of Figures

Figure 1-1 Block Diagram .................................................................................................................. 5

Figure 3-1 Pin Definition ................................................................................................................... 10

Figure 6-1 A70 dimensions .............................................................................................................. 33

Figure 6-2 A70 label ......................................................................................................................... 34

Figure 6-3 Three views of A70 ......................................................................................................... 34

Figure 6-4 A70 reel packaging ......................................................................................................... 35

Figure 6-5 A70 reel dimensions ....................................................................................................... 36

Figure 7-1 Recommended PCB Foot Print ...................................................................................... 37

Figure 7-2 SMT furnace temperature curve ..................................................................................... 38

A70


Copyright © Neoway Technology Co., Ltd v

Table of Tables

Table 1-1 Variant and frequency bands .............................................................................................. 3

Table 3-1 IO definition ....................................................................................................................... 11

Table 3-2 Pin Description ................................................................................................................. 12

Table 3-3 MUX pins .......................................................................................................................... 20

Table 4-1 Operating conditions of A70 ............................................................................................. 23

Table 4-2 Current consumption of A70 ............................................................................................. 23

Table 4-3 Current features of A70V2 ................................................................................................ 25

Table 4-4 Current features of A70V3 ................................................................................................ 25

Table 4-5 Temperature feature of A70 .............................................................................................. 26

Table 4-6 A70 ESD protection .......................................................................................................... 27

Table 5-1 Operating bands of A70 .................................................................................................... 28

Table 5-2 RF TX power of A70 ......................................................................................................... 29

Table 5-3 RF RX sensitivity of A70 ................................................................................................... 30

A70


Copyright © Neoway Technology Co., Ltd 1

About This Document

Scope

This document is applicable to A70 series.

It defines the features, indicators, and test standards of the A70 module.

Audience

This document is intended for system engineers (SEs), development engineers, and test engineers.

Change History

Issue Date Change Changed By

1.0 2017-09 Initial draft Li Huixiang

1.1 2017-12

Added WCDMA B5

Updated pin definition

Updated Table 1-2

Updated dimensions of A70 and application PCB

figure.

Li Huixiang

1.2 2018-03

Added A70V3

Added GNSS features

Added currents in flight mode and sleep mode

Added operating temperature range and modified the

storage temperature range

Updated the block diagram

Li Huixiang

1.3 2018-09

Modified the pin definition according to Neoway

Module Pin Definition.

Added variant information

Deleted IO type of P6 and added P8

Changed the default function of S4 to GPIO_43

Li Huixiang

A70



Conventions

Symbol Indication

This warning symbol means danger. You are in a situation that could cause fatal

device damage or even bodily damage.

Means reader be careful. In this situation, you might perform an action that could

result in module or product damages.

Means note or tips for readers to use the module

Related Documents

Neoway_A70_Hardware_User_Guide

Neoway_A70_AT_Command_Mannual

Neoway_A70_EVK_User_Guide

Neoway Module Reflow Manufacturing Recommendations.

A70



1 About A70

1.1 Product Overview

A70 is an automotive-grade LTE module that is developed on Qualcomm platform. It supports LTE-FDD, LTE-TDD, WCDMA, TD-SCDMA, CDMA, and

GSM cellular networks.

A70 series include multiple variants. Table 1-1 lists the variants and frequency bands supported.

Table 1-1 Variant and frequency bands

Model Variant Category Band Baseband

Chipset RF GNSS CODEC

Antenna

Switch

A70 CN Cat4

LTE FDD: B1, B3, B5, B8, B26

LTE TDD: B34, B38, B39, B40, B41

TD-SCDMA: B34, B39

UMTS: B1, B5, B8

EV-DO: BC0

CDMA 1x BC0

GSM/GPRS/EDGE: 900/1800 MHz

MDM9628 Automotive

-grade1 Optional Supported Supported

1 Automotive-grade RF: the OEMs of key RF components declare that the component complies with automotive-grade standard or they can provide PPAP report as required.

A70



EU2 Cat4

LTE FDD: B1, B3, B5, B7,B8, B20, B26, B283

UMTS: B1, B33, B5, B8


US2 Cat4

LTE FDD: B2, B4, B5, B12, B17

UMTS: B2, B4, B5


A70V2 CN Cat4

LTE FDD: B1, B3, B5, B8, B26

LTE TDD: B34, B38, B39, B40, B41

TD-SCDMA: B34, B39

UMTS: B1, B5, B8

EV-DO: BC0

CDMA 1x BC0


MDM9607 Industrial-

grade Optional

Optional, not

supported

by default

Optional,

not

supported

by default

A70V3 CN Cat4

LTE FDD: B1, B3, B5, B8, B26

LTE TDD: B34, B38, B39, B40, B41

TD-SCDMA: B34, B39

UMTS: B1, B5, B8

EV-DO: BC0

CDMA 1x BC0


MDM9628 Industrial-

grade Optional

Optional, not

supported

by default

Optional,

not

supported

by default

2 A70EU and A70US are in development phrase.

3 The frequency band is optional.

A70



A70 adopts 284-pin LGA package and its dimensions are 37 mm x 37 mm x 2.7 mm. With automotive-

grade performance, this module is well applicable to in-vehicle OEM applications.

A70 in this document refers to A70, A70V2, and A70V3 if not specified.

1.2 Block Diagram

A70 consists of the following functionality modules:

Baseband and memory

Crystal oscillation and power (VBAT_BB, VBAT_RF, VDD_1P8, AVDD_1P8, voltage drop

detection)

Digital interfaces (USIM, USB, HSIC, UART, SPI, SDIO, SDC/eMMC, GPIO, I2C, and I2S/PCM)

Analog interfaces (ADC, SGMII)

Analog audio interfaces (optional)

RF interfaces (main antenna, diversity antenna, GNSS antenna, antenna switch)

Figure 1-1 Block Diagram

Base

Band

RF transceiver

RF Section

Power

Manager

MCP

VBAT_BB

VBAT _ RF

CODEC

(Optional)

Interface

ADCAUDIO

(Optional)Control

I2SPCM

I2C

MAIN DIV GNSS

GPIOSDC

eMMCSDIOSPIUARTHSICUSBSGMII

MDIOUSIM2USIM1

LDO

LDO(Optional)

VDD _1P8

EN

Power Drop

Dectector

VBAT_BB

Switch Switch

AVDD_1P8

AVDD_1P8

(Optional)

(Optional)

19.2MHzCrystal

A70



1.3 Basic Features

Parameter Description

Physical features

Dimensions: (37.0±0.1) mm × (37.0±0.1) mm × (2.7±0.2) mm

Package: 284-pin LGA

Weight: around 8.4g

Temperature

ranges

Operating: -30°C to +75°C

Extended: -40°C to +85°C4

Storage: -45°C to +105°C

Operating voltage VBAT_BB: 3.4V to 4.2V, TYP: 3.8V

VBAT_RF: 3.4V to 4.2V, TYP: 3.8V

Current5

Flight mode 1.24mA

Sleep Mode

GSM DRX=6: 2.2 mA

GSM DRX=9: 1.45 mA

WCDMA DRX=2: 2 mA

WCDMA DRX=9: 1.54 mA

LTE (Paging Cycle 320ms): 6.5 mA

LTE (Paging Cycle 2.56s): 1.67 mA

Operating

Current

VBAT_BB: 1.5A MAX

VBAT_RF: 2.5A MAX

VBAT_BB+VBAT_RF: 3A MAX6

MIPS processor ARM Cortex-A7 processor, 1.3 GHz main frequency, 256kB L2 cache

Memory RAM: 256MB

ROM: 512MB

Band See Table 1-1.

Wireless data rate

GPRS: Max 85.6 Kbit/s(DL) / Max 85.6 Kbit/s(UL)

EDGE: Max 236.8 Kbit/s(DL) / Max 236.8 Kbit/s(UL)

CDMA2000@1x, 1xEV-DOrA: Max 3.1 Mbit/s (DL) / Max 1.8Mbit/s (UL)

TD-SCDMA: Max 4.2 Mbit/s (DL)/Max 2.2 Mbit/s (UL)

WCDMA: DC-HSPA+, Max 42Mbit/s(DL)/Max 5.76Mbit/s(UL)

4 RF performance might not meet 3GPP/3GPP2 standards in extended temperature but it does not affect functioning.

5 Indicates current features of A70CN. For current features of other variants, see Chapter 4.

6 indicates that VBAT_BB and VBAT_RF share one power supply.

A70



FDD-LTE: non-CA cat4, Max 150 Mbit/s(DL)/Max 50 Mbit/s (UL)

TDD-LTE: non-CA cat4, Max 130 Mbit/s(DL)/Max 35 Mbit/s(UL)

Transmit power

EGSM900: +33dBm (Power Class 4)

DCS1800: +30dBm (Power Class 1)

EDGE 900MHz: +27dBm (Power Class E2)

EDGE1800MHz: +26dBm (Power Class E2)

TD-SCDMA: +23 dBm (Power Class 3)

CDMA 1X/EVDO: +23 dBm (Power Class 3)

UMTS: +23 dBm (Power Class 3)

LTE: +23dBm (Power Class 3)

Application

Interfaces

2G/3G/4G antenna, 4G diversity antenna, GNSS antenna, 50Ω impedance

Two UART interfaces, at most 4 Mbit/s

Two USIM interfaces, compatible with 1.8V/2.85V USIM cards, dual-SIM

single-standby

One USB2.0 high-speed interface

One HSIC interface, used to connect high-speed chipset

Three 15-bit ADC interfaces, detectable voltage ranging from 0.1 to 1.7V.

One SPI interface, maximum frequency of 50MHz, support host mode only

One SDIO interface, used to control WLAN

One dual-voltage SD3.0 interface, used to control SD card or 4-bit eMMC

chipset

One I2S interface, used for digital audio transmission or configured as PCM

interface

One I2C interface, used to control external sensor, host mode only

One SGMII interface, used to connect to Ethernet PHY chipset

One MDIO interface, used to control PHY chipset (multiplexed from USIM2)

Two analog audio input interfaces (only supported by variants with CODEC

chipset)

Two analog audio output interfaces (only supported by variants with CODEC

chipset)

One analog power output interface (only supported by variants with CODEC

chipset)

One general power output interface, typically output 1.8V, a maximum current

of 200 mA.

A70



13 GPIO pins, five among which support interrupt.

AT commands 3GPP Release 13

Neoway extended commands

Emergency

response ERA-GLONASS, eCall (only for A70 and A70V3)

Dedicated in-

vehicle

communications

technology

DSRC-V2V, V2P 802.11p (only for A70 and A70V3, requiring a third-party

module)

SMS PDU, TXT

Data PPP, RNDIS, ECM, RMNET

Protocol TCP, UDP, MQTT, FTP/FTPS, HTTP/HTTP(S), SSL, TLS

Certification

approval CCC, SRRC, RoSH, ISO167507

7 The tests were performed in third-party labs.

A70



2 Compliant Standards

A70 complies with the following standards:

3GPP TS 07.07 AT command set for GSM Mobile Equipment (ME)

YD 1214-2006 Technical requirement of 900/1800MHz TDMA Digital Cellular Mobile

Telecommunication Network General Packet Radio Service (GPRS)Equipment: Mobile Stations

YD 1215-2006 Testing Methods of 900/1800MHz TDMA Digital Cellular Mobile

Telecommunication Network General Packet Radio Service (GPRS)Equipment: Mobile Stations

YD 1032-2000 Limits and Measurement Methods of Electromagnetic Compatibility for

900/1800MHz Digital Cellular Telecommunications System Part1:Mobile Station and Ancillary

Equipment

YD/T 2220-2011 Technical Requirement and test method of WCDMA/GSM(GPRS) dual mode

digit mobile user equipment (phase 4)

Ministry of Industry and Information Technology PRC, Measures for the Network Access

Management of Telecommunication Equipment (2014 Amendment)

GB4943.1-2011 Information technology equipment - Safety - Part 1: General requirements

GB/T22450.1-2008 Limits and measurement methods of electromagnetic compatibility for

900/1800MHz TDMA digital cellular telecommunications system - Part 1: Mobile station and

ancillary equipment

CNCA-O7C-031:2007 Rules for Compulsory Certification of Telecommunication Equipment

Telecommunication Terminal Equipment

3GPP TS GSM Specification Set

3GPP TS WCDMA Specification Set

CDMA2000@1x,1xAdvanced,1xEV-DOrA Specification Set

3GPP TS LTE Cat4 4G Specification Set

A70



3 Module Pins

There are 284 pins on A70 and their pads are introduced in LGA package.

3.1 Pad Layout

Figure 3-1 shows the pad layout of A70.

Figure 3-1 Pin Definition

GN

D

GN

D

GN

D

GN

D

RE

SE

RV

ED

GN

D

GN

D

GN

D

SP

I_M

ISO

RE

SE

RV

ED

VD

D_

SD

C_

PU

LL

SD

C_

DA

TA

2

SD

C_

DA

TA

0

GN

D

GP

IO_

11

UA

RT

3_

CT

S

UA

RT

3_

TX

D

GN

D

AN

T_

DIV

GN

D

RE

SE

RV

ED

GN

D

GN

D

AN

T_

GN

SS

GN

D

GN

D

SP

I_M

OS

I

EM

MC

_R

ES

ET

_N

SD

C_

DA

TA

3

SD

C_

DA

TA

1

SD

C_

CL

K

GP

IO_

10

UA

RT

3_

RT

S

UA

RT

3_

RX

D

WL

AN

_S

DI

O_

DA

TA

3

GN

D

GN

D

GN

D

GP

IO_

51

GP

IO_

52

GN

D

GN

D

GN

D

SP

I_C

S_

N

RE

SE

RV

ED

SD

C_

PW

R_

EN

SD

C_

DE

T

SD

C_

CM

D

GN

D

GN

D

WC

I_L

TE

_R

XD

WL

AN

_S

DI

O_

DA

TA

2

WL

AN

_S

DI

O_

DA

TA

1

GN

D

GN

D

RE

SE

RV

ED

RE

SE

RV

ED

GN

SS

_L

NA

_E

N

GN

D

GP

IO_

53

GN

D

SP

I_C

LK

GN

D

GN

D

GN

D

RE

SE

RV

ED

DS

RC

_S

LE

EP

_C

LK

WL

AN

_E

N

WC

I_L

TE

_T

XD

WL

AN

_S

DI

O_

DA

TA

0

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

RE

SE

RV

ED

RE

SE

RV

ED

RE

SE

RV

ED

GN

D

GN

D

GN

D

GN

D

BT

_E

N

WL

AN

_S

LE

EP

_C

LK

RF

CL

K2

_Q

CA

WL

AN

_P

WR

_E

N

WL

AN

_S

DI

O_

CM

D

RE

SE

RV

ED

RE

SE

RV

ED

UA

RT

5_

RX

D

RE

SE

RV

ED

GN

D

WL

AN

_S

DI

O_

CL

K

GN

D

RE

SE

RV

ED

UA

RT

5_

TX

D

GN

D

I2S

_M

CL

K

I2S

_R

X

I2S

_S

CLK

RE

SE

RV

ED

RE

SE

RV

ED

GP

IO_

58

GP

IO_

78

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

I2S

_W

S

I2S

_T

X

GN

D

GP

IO_

76

GP

IO_

79

GP

IO_

77

GN

D

GN

D

GN

D

GN

D

MIC

2_

P

GN

D

GN

D

GN

D

RE

SE

RV

ED

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

MIC

2_

N

EA

R2

_N

EA

R1

_P

RE

SE

RV

ED

RE

SE

RV

ED

RE

SE

RV

ED

GN

D

GN

D

GN

D

GN

D

MIC

1_

P

MIC

1_

N

EA

R2

_P

EA

R1

_N

RE

SE

RV

ED

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

MIC

_B

IAS

GN

D

GN

D

GN

D

GN

D

RE

SE

RV

ED

GN

D

GN

D

GN

D

GN

D

GN

D

I2C

_S

CL

I2C

_S

DA

AV

DD

_1

P8

GN

D

GN

D

RE

SE

RV

ED

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

RE

SE

RV

ED

GN

D

GN

D

RE

SE

RV

ED

RE

SE

RV

ED

RE

SE

RV

ED

RE

SE

RV

ED

RE

SE

RV

ED

US

IM2

_V

CC

RE

SE

RV

ED

SG

MII_

RX

_

N

RE

SE

RV

ED

RE

SE

RV

ED

GN

D

GN

D

US

IM2

_C

LK

SG

MII_

RX

_

P

GN

D

GN

D

GN

D

GN

D

GN

D

GP

IO_

25

GN

D

GN

D

US

IM1

_D

ET

US

IM1

_C

LK

US

IM1

_V

CC

AD

C3

AD

C1

GN

D

GN

D

US

IM2

_R

ES

ET

US

IM2

_D

AT

A

SG

MII_

TX

_

N

GN

D

GN

D

GN

D

RE

SE

RV

ED

SL

EE

P

GP

IO_

24

RE

SE

RV

ED

GP

IO_

43

US

IM1

_R

ES

ET

US

IM1

_D

AT

A

RE

SE

RV

ED

AD

C2

GN

D

GN

D

GN

D

US

IM2

_D

ET

SG

MII_

TX

_

P

GN

D

GN

D

GN

D

GN

D

RE

SE

RV

ED

RE

SE

RV

ED

RE

SE

RV

ED

VD

D_

1P

8

GN

D

GN

D

GN

D

GN

D

VB

AT

_B

B

VB

AT

_B

B

RE

SE

RV

ED

US

B_

ID

GN

D

GN

D

AN

T_

MA

IN

GN

D

GN

D

GN

D

RE

SE

RV

ED

RE

SE

RV

ED

RE

SE

RV

ED

GN

D

VB

AT

_R

F

VB

AT

_R

F

VB

AT

_R

F

GN

D

VB

AT

_B

B

VB

AT

_B

B

HS

IC_

DA

TA

US

B_

VB

US

US

B_

DP

GN

D

GN

D

GN

D

GN

D

PW

RK

EY

_N

RE

SE

T_

N

GN

D

GN

D

VB

AT

_R

F

VB

AT

_R

F

VB

AT

_R

F

GN

D

GN

D

VB

AT

_B

B

VB

AT

_B

B

HS

IC_

ST

B

US

B_

DM

GN

D

A B C D E F G H J K L M N P R S T U V W X Y AA AB AC AD AE AF AG AH AJ AK AL AM AN

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

A B C D E F G H J K L M N P R S T U V W X Y AA AB AC AD AE AF AG AH AJ AK AL AM AN

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

RE

SE

RV

ED

ANTGND

CONTROL

GPIO RESERVED UIM

ADC

USB SGMII

I2C

AUDIO

I2S

WLAN UART SDC/eMMC

SPI OTHERS

POWER

A70



3.2 Pin Description

Table 3-1 lists the definition of IO types.

Table 3-1 IO definition

IO Type

B Digital input/output, COMS level

DO Digital output, COMS level

DI Digital input, COMS level

OD Open drain

PO Power output

PI Power supply input

AO Analog output

AI Analog input

AIO Analog input/output

Level Feature

I/O Pin type Voltage Feature Output Current

Feature

P1

USIM1 interface

voltage, compatible with

1.8V/2.85V

1.8V

VIH=1.26V~2.1V

VIL=-0.3V~0.36V

VOH=1.44V~1.8V

VOL=0V~0.4V

2.85V

VIH=2V~3.15V,

VIL=-0.3V~0.57V

VOH=2.28V~2.85V

VOL=0V~0.4V

2 mA~16 mA,

adjustable at a

spacing of 2 mA

P2

USIM2 interface

voltage, compatible with

1.8V/2.85V

1.8V

VIH=1.26V~2.1V

VIL=-0.3V~0.36V

VOH=1.44V~1.8V

VOL=0V~0.4V

2.85V

VIH=2V~3.15V,

VIL=-0.3V~0.57V

VOH=2.28V~2.85V

VOL=0V~0.4V

2 mA~16 mA,

adjustable at a

spacing of 2 mA

P3 1.8V digital IO VIH min=1.2V, VIL max= 0.3V

VOH min=1.35V, VOL max= 0.45V

2 mA~16 mA,

adjustable at a

spacing of 2 mA

A70



P4

SDC interface voltage,

compatible with

1.8V/2.85V

1.8V

VIH=1.27V~2V,

VIL= -0.3V~0.58V

VOH=1.4V~1.8V,

VOL=0V~0.45V

2.85V

VIH=1.8V~3.15V,

VIL= -0.3V~0.7V

VOH=2.1V~2.85V,

VOL=0V~0.36V

2 mA~16 mA,

adjustable at a

spacing of 2 mA

P5 HSIC interface voltage,

1.2V

VIH=0.78V~1.2V, VIL =0V~0.42V

VOH =0.9V~1.2V, VOL=0V~0.3V

2 mA~16 mA,

adjustable at a

spacing of 2 mA

P7

GPIO from power

management chipset,

1.2V/1.8V/VBAT_BB

(input power of A70

baseband)

The level is not

automatically

adjustable. There are

three grades of currents

available.

VIH=0.65*VIO~(VIO+0.3V),

VIL=-0.3V~0.35*VIO

VOH=(VIO-0.45)V~VIO

VOL=0V~0.45V

(VIO is GPIO voltage,

1.2V/1.8V/VBAT_BB)

When VIO is 1.8V

High: 0.9mA

Medium: 0.6mA

Low: 0.15 mA

P8

The level of GPIO from

power management

chipset is fixed to 1.8V.

There are three grades

of currents available.

VIH=1.26V~2.1V

VIL=-0.3V~0.63V

VOH=1.35V~1.8V

VOL=0V~0.45V

High: 0.9mA

Medium: 0.6mA

Low: 0.15 mA

Table 3-2 Pin Description

Signal Pin I/O Function Level

Feature Remarks

Power Interfaces

VBAT_BB

AE1, AG1,

AD2, AF2,

AC3, AE3

PI Power input of A70

baseband Vmax=4.2V Peak current is up to 1.5A.

VBAT_RF

T1, V1,

X1, U2,

W2, Y2

PI RF power input Vmax=4.2V Peak current is up to 2.5A.

VDD_1P8 R3 PO 1.8V power output Vnorm=1.8V

Imax=200mA

Used only for level shifting

and IO power supply.

Leave this pin

unconnected if it is not

used.

A70



GND

A1, C1, D2, E1, G1, N1, R1, F2, H2, AA1, AC1, S2, AB2,

AN1, C5, A5, D4, B4, C3, A3, R5, N5, J5, F6, G5, E5, F4,

G3, E3, AA3, X3, V3, T3, AH6, AG5, AE5, AN3, AL3, AH4,

AF4, AD4, A13, D12, D10, C9, A9, B8, P12, P10, P8, R13,

R11, F12, R9, F10, G9, F8, Y12, Y10, S8, U8, W8, Y8,

X13, V13, T13, X11, W12, V11, T11, U12, S12, X9, W10,

V9, T9, U10, S10, AN13, AL13, AJ13, AM10, AK10, AN9,

AM8, AK8, C19, A19, D18, B18, C17, A17, A15, P14, R19,

N19, L19, M18, L17, J17, G17, E17, G15, Y14, W14, U14,

S14, AB18, AC17, AA17, X17, Y18, W18, V17, S18, AG19,

AE19, AK16, AH14, C21, A21, D20, R21, N21, L21, G21,

E21, P20, K20, H20, S20, AN21, E19, AE21

Ensure that all GND pins

are connected to the

ground.

Control Interfaces

RESET_N L1 DI Module reset input P3

Triggered by low level to

reset the module. Hold it

for 8 seconds, and the

module is shut down

forcibly.

PWRKEY_N J1 DI ON/OFF button P3


control the startup of the

module.

SLEEP K4 DI Sleep mode control P3


control the sleep mode of

the module. Leave this pin


used.

UART3 interface

UART3_TXD AL21 DO UART3 data

transmitting P3

Used for data transmission

UART3_RXD AK20 DI UART3 data

receiving P3

UART3_CTS AJ21 DI Clear to send P3

UART3_RTS AH20 DO Request to send P3

UART5 interface

UART5_TXD E15 DO UART5 data

transmitting P3

UART5_RXD F16 DI UART5 data

receiving P3

A70



USIM1 interface

USIM1_VCC X5 PO USIM1 power output Imax=50mA

USIM1_RESET U4 DO USIM1 reset P1

It should be connected to

USIM1_VCC through a 10

kΩ pull-up resistor.

USIM1_DATA W4 B USIM data IO P1

USIM1_CLK V5 DO USIM1 clock output P1

USIM1_DET T5 DI USIM1 detect P3

USIM2 Interface

USIM2_VCC AJ7 PO USIM2 power output Imax=50 mA

USIM2_RESET AJ5 DO USIM2 reset P2

USIM2_DATA AL5 B USIM2 data IO P2

It should be connected to

USIM2_VCC through a 10

kΩ pull-up resistor.

USIM2_CLK AK6 DO USIM2 clock P2

USIM2_DET AK4 DI USIM2 detect P3

USB interface

USB_DM AL1 AIO USB data negative

signal

Used for firmware

download and data

transmission.

DM and DP adopt

differential routing. USB_DP AM2 AIO

USB data positive

signal

USB_VBUS AK2 PI Charging voltage

check

3.3V~5.2V,

TYP: 5V

USB_ID AJ3 AI OTG detect

Leave this pin


used.

HSIC interface

HSIC_DATA AH2 B HSIC data IO P5

HSIC_STB AJ1 B HSIC strobe P5

ADC interface

ADC3 AA5 AI Analog-to-digital

signal conversion

Vmax=1.7V;

Vmin=0.1V

15-bit, detectable voltage

ranging from 0.1V to 1.7V

Leave this pin

A70




used.

ADC2 AB4 AI Analog-to-digital

signal conversion

Vmax=1.7V;

Vmin=0.1V



Leave this pin


used.

ADC1 AC5 AI Analog-to-digital

signal conversion

Vmax=1.7V;

Vmin=0.1V



Leave this pin


used.

SGMII interface

SGMII_TX_P AM4 AO SGMII transmit plus

SGMII_TX_N AN5 AO SGMII transmit minus

SGMII_RX_P AM6 AI SGMII receive plus

SGMII_RX_N AN7 AI SGMII receive minus

MDIO and PHY chipset control interface

MDIO_CLK AL5 DO MDIO clock output P2 Multiplexed from USIM2

MDIO_DATA AK6 B MDIO data IO P2 Multiplexed from USIM2

ETH_RST_N AJ5 DO Reset Ethernet PHY

chipset P2 Multiplexed from USIM2

ETH_INT_N AK4 DI Interrupt from

Ethernet PHY input P3 Multiplexed from USIM2

I2C interface

I2C_SCL AG9 OD I2C clock P3 Pulled up by a 2.2 kΩ

resistor internally.

I2C_SDA AJ9 OD I2C data P3 Pulled up by a 2.2 kΩ

resistor internally.

I2S/PCM interface

I2S_TX AM14 DO I2S data transmit P3 Multiplexed as

PCM_DOUT

I2S_RX AJ15 DI I2S data receive P3 Multiplexed as PCM_DIN

I2S_SCLK AL15 DO I2S serial clock P3 Multiplexed as PCM_CLK

I2S_WS AK14 B I2S word select P3 Multiplexed as

A70



PCM_SYNC

I2S_MCLK AG15 DO I2S main clock P3 12.288 MHz by default

Analog Audio Interfaces

MIC_BIAS AH10 PO MIC bias voltage Only supported by variants

with CODEC chipset

AVDD_1P8 AL9 PO 1.8V analog power

supply output

Vnorm=1.8V

Imax=180mA

Only supported by variants

with CODEC chipset

EAR1_N AN11 AO Left-channel EAR

output minus


with CODEC chipset

EAR1_P AM12 AO Left-channel EAR

output plus


with CODEC chipset

EAR2_N AK12 AO Right-channel EAR

output minus


with CODEC chipset

EAR2_P AL11 AO Left-channel EAR

output plus


with CODEC chipset

MIC1_P AG11 AI Left-channel MIC

input plus


with CODEC chipset

MIC1_N AJ11 AI Left-channel MIC

input minus


with CODEC chipset

MIC2_P AG13 AI Right-channel MIC

input plus


with CODEC chipset

MIC2_N AH12 AI Right-channel MIC

input minus


with CODEC chipset

SDIO/WLAN interface

WLAN_SDIO_D

ATA3 AM20 B

WLAN SDIO data bit

3 P3

WLAN_SDIO_D

ATA2 AL19 B

WLAN SDIO data bit

2 P3

WLAN_SDIO_D

ATA1 AN19 B

WLAN SDIO data bit

1 P3

WLAN_SDIO_D

ATA0 AM18 B

WLAN SDIO data bit

0 P3

WLAN_SDIO_C

MD AN17 B

WLAN SDIO

command P3

WLAN_SDIO_C AM16 DO WLAN SDIO clock P3

A70



LK

WLAN_PWR_E

N AL17 DO

WLAN power supply

enable P8

WLAN_EN AH18 DO WLAN enable P3

WCI_LTE_RXD AJ19 DI

Data receiving of

WLAN/LTE co-

existence

P3

WCI_LTE_TXD AK18 DO

Data transmitting of

WLAN/LTE co-

existence

P3

WLAN_SLEEP_

CLK AG17 DO WLAN sleep clock P7

DSRC_SLEEP_

CLK AF18 DO DSRC sleep clock P8

RFCLK2_QCA AJ17 DO

WLAN chipset clock,

used for some

Qualcomm QCA

chipsets

P3

Bluetooth Interface

BT_EN AE17 DO Bluetooth enable P8

SDC/eMMC Interface

SDC_DATA3 Y20 B SDC/eMMC data bit 3 P4

SDC_DATA2 AA21 B SDC/eMMC data bit 2 P4

SDC_DATA1 AB20 B SDC/eMMC data bit 1 P4

SDC_DATA0 AC21 B SDC/eMMC data bit 0 P4

SDC_CMD AC19 B SDC/eMMC

command P4

SDC_CLK AD20 DO SDC/eMMC data

clock P4

SDC_DET AA19 DI SDC/eMMC card

detect input P3

VDD_SDC_PUL

L X21 PO

Power for

SDC/eMMC data bit

to connect to through

a pull-up resistor

Imax=50mA

Automatically adjustable to

IO voltage.

Do not use it for any other

purpose except

connecting to data bit.

A70



SDC_PWR_EN X19 DO SDC/eMMC power

enable P7

EMMC_RESET

_N W20 DO

eMMC hardware

reset P3

SPI interface

SPI_MISO T21 DI Device output, host

input P3

SPI_MOSI U20 DO Device input, host

output P3

SPI_CS_N T19 DO Chip select P3

SPI_CLK U18 DO Clock signal P3

GPIO

GPIO_10 AF20 B GPIO P3

GPIO_11 AG21 B GPIO with interrupt P3

GPIO_24 M4 B GPIO P3

Do not connect it to an

external power supply or

VDD_1P8 through a pull-

up resistor before the

module is started.

GPIO_25 L5 B GPIO with interrupt P3

Do not connect it to an

external power supply or

VDD_1P8 through a pull-

up resistor before the

module is started.

GPIO_43 S4 B GPIO P3

GPIO_51 G19 B GPIO P3

GPIO_52 J19 B GPIO with interrupt P3

GPIO_53 P18 B GPIO P3

GPIO_58 D14 B GPIO P3

GPIO_76 C13 B GPIO with interrupt P3

GPIO_77 G13 B GPIO P3

GPIO_78 F14 B GPIO P3

GPIO_79 E13 B GPIO with interrupt P3

A70



Antenna Interface

ANT_GNSS M20 AI GNSS antenna 50Ω impedance

ANT_MAIN B2 AIO Main antenna 50Ω impedance

ANT_DIV B20 AI Diversity antenna 50Ω impedance

Other Interface

GNSS_LNA_EN K18 DO GNSS LNA enable P3

Reserved Pins

RESERVED

K2, M2, P2, C7, A7, D6, B6, G7, E7, P4, N3, L3, J3, H4,

Y4, AL7, AG7, AG3, B12, C11, A11, B10, D8, G11, E11,

E9, AH8, D16, B16, C15, B14, R17, N17, H18, F18, V19,

T17, AD18, AN15, AH16, J21, F20, V21

Leave RESERVED pins

unconnected.

A70



3.3 MUX Interfaces

Table 3-3 MUX pins

Pin Default Function GPIO Function 1 Function 2 Function 3 Function 4 With Interrupt

T5 USIM1_DET GPIO_34 Y

U4 USIM1_RESET GPIO_33

W4 USIM1_DATA GPIO_31

V5 USIM1_CLK GPIO_32

AK4 USIM2_DET GPIO_30 ETH_INT_N Y

AJ5 USIM2_RESET GPIO_29 ETH_RST_N Y

AL5 USIM2_DATA GPIO_27 MDIO_CLK

AK6 USIM2_CLK GPIO_28 MDIO_DATA Y

AM16 WLAN_SDIO_CLK GPIO_16 UART4_TXD Y

AN17 WLAN_SDIO_CMD GPIO_17 UART4_RXD Y

AM18 WLAN_SDIO_DATA0 GPIO_15 UART1_RTS SPI1_CLK I2C_SCL1

AN19 WLAN_SDIO_DATA1 GPIO_14 UART1_CTS SPI1_CS_N I2C_SDA1

AL19 WLAN_SDIO_DATA2 GPIO_13 UART1_RXD SPI1_MISO Y

AM20 WLAN_SDIO_DATA3 GPIO_12 UART1_TXD SPI1_MOSI Y

AK18 WCI_LTE_TXD GPIO_36

A70



AJ19 WCI_LTE_RXD GPIO_37 USB_BOOT8 Y

AH18 WLAN_EN GPIO_38 Y

AL21 UART3_TXD GPIO_0 SPI3_MOSI

AK20 UART3_RXD GPIO_1 SPI3_MISO Y

AJ21 UART3_CTS GPIO_2 SPI3_CS_N I2C_SDA3

AH20 UART3_RTS GPIO_3 SPI3_CLK I2C_SCL3 Y

AG21 GPIO_11 GPIO_11 SPI5_CLK I2C_SCL5 Y

AF20 GPIO_10 GPIO_10 SPI5_CS_N I2C_SDA5

F16 UART5_RXD GPIO_9 SPI5_MISO Y

E15 UART5_TXD GPIO_8 SPI5_MOSI Y

AA19 SDC_DET GPIO_26 Y

U18 SPI_CLK GPIO_7 UART2_RTS I2C_SCL2

T19 SPI_CS_N GPIO_6 UART2_CTS I2C_SDA2

T21 SPI_MISO GPIO_5 UART2_RXD Y

U20 SPI_MOSI GPIO_4 UART2_TXD

K18 GNSS_LNA_EN GPIO_54

P18 GPIO_53 GPIO_53 GNSS_DR_SYNC

J19 GPIO_52 GPIO_52 GNSS_TX_AGGRESSOR Y

8 Do not connect it to any external power supply or VDD_1P8 through a pull-up resistor before the module is started.

A70



K4 SLEEP GPIO_74 Y

C13 GPIO_76 GPIO_76 PCM2_DIN I2S_RX2 Y

G13 GPIO_77 GPIO_77 PCM2_DOUT I2S_TX2

F14 GPIO_78 GPIO_78 PCM2_CLK I2S_SCLK2

E13 GPIO_79 GPIO_79 PCM2_SYNC I2S_WS2 Y

AM14 I2S_TX9 GPIO_22 UART6_CTS SPI6_CS_N PCM1_DOUT I2C_SDA6

AJ15 I2S_RX9 GPIO_21 UART6_RXD SPI6_MISO PCM1_DIN

AL15 I2S_SCLK9 GPIO_23 UART6_RTS SPI6_CLK PCM1_CLK I2C_SCL6

AK14 I2S_WS9 GPIO_20 UART6_TXD SPI6_MOSI PCM1_SYNC Y

42 pins of A70 allow multiplexing and all of them can be used as GPIO. Please use their default functions if you do not have any special requirements

in your application.

9 I2S/PCM interface can be multiplexed for other functions only on variants without OCDEC.

A70



4 Electric Feature and Reliability

4.1 Electric Features

Table 4-1 Operating conditions of A70

Status Minimum Typical Maximum

VBAT_BB Vin 3.4V 3.8V 4.2V

Iin / / 1.5A

VBAT_RF Vin 3.4V 3.8V 4.2V

Iin / / 2.5A

VBAT_BB

VBAT_RF

Vin 3.4V 3.8V 4.2V

Iin / / 3A

Table 4-2 Current consumption of A70

Variant Status Test Conditions Test Result (Typ) Unit

CN

Power OFF Shut down the module. 20 μA

Sleep Mode

GSM900 DRX=2 1.9 mA

GSM900 DRX=9 1.3 mA

WCDMA DRX=2 2 mA

LTE Paying cycle = 320ms 6.5 mA


LTE Paying cycle = 1.28s 2.4 mA


Active Mode

GSM900 Voice Call PCL=5 245 mA


GPRS900 1DL/4UL PCL=5 459 mA


EGPRS900 1DL/4UL PCL=8 418 mA

A70




WCDMA Band1@ Max Tx power 510 mA



LTE-FDD Band1@ Max Tx power 544 mA





LTE-TDD Band34@ Max Tx power 255 mA





EU

Power OFF TBD TBD μA

Sleep Mode TBD TBD mA

Active Mode TBD TBD mA

US




Test Result in above table indicates the total current consumption of VBAT_BB and VBAT_RF.

Data in the table was obtained in test with instruments. LTE test conditions: 10 MHz bandwidth,

QPSK modulation, uplink 50RB

A70 in table heading refers to A70 only and does not include A70V2 and A70V3. For current

consumption of A70V2 and A70V3, see Table 4-3 and Table 4-4 respectively.

The values might change as software is optimized in later versions. If the values are different from

those in Hardware Test report, the result is subject to the test report.

A70



Table 4-3 Current features of A70V2


CN







The above table refers to A70V2.For current consumption of A70 and A70V3, see Table 4-2 and

Table 4-4 respectively.



Table 4-4 Current features of A70V3


CN

Power OFF Shut down the module. 20 μA

Sleep Mode

GSM900 DRX=2 1.9 mA

GSM900 DRX=9 1.3 mA

WCDMA DRX=2 2 mA





Active Mode






EGPRS1800 1DL/4UL PCL=2 435.7 mA


WCDMA Band5@ Max Tx power 487.9 mA

A70

















The above table refers to A70V3. For current consumption of A70 and A70V3, see Table 4-2 and

Table 4-3 respectively.



4.2 Temperature Feature

Table 4-5 Temperature feature of A70

Status Minimum Value Typical Value Maximum Value

Operating -30℃ 25℃ 75℃

Extended -40℃ 85℃

Storage -45℃ 105℃

RF performance might not meet 3GPP/3GPP2 standards in extended temperature but it does not

affect functioning.

A70



4.3 ESD Protection

Electronics need to pass ESD tests. The following table shows the ESD capability of key pins of this

module. It is recommended to add ESD protection based on the application scenarios to ensure product

quality when designing a product.

Humidity 45% Temperature 25℃

Table 4-6 A70 ESD protection

Testing Point Contact Discharge Air Discharge

VBAT_BB ±8kV ±15kV

VBAT_RF ±8kV ±15kV

GND ±8kV ±15kV

ANT ±8kV ±15kV

Cover ±8kV ±15kV

Others ±2kV ±4kV

A70

Hardware User Guide


5 RF Features

5.1 Operating Bands

Table 5-1 Operating bands of A70

Operating Bands Uplink Downlink

GSM850 824~849MHz 869~894MHz

EGSM900 880~915MHz 925~960MHz

DCS1800 1710~1785MHz 1805~1880MHz

PCS1900 1850~1909MHz 1930~1990MHz

CDMA BC0 824~849MHz 869~894MHz

WCDMA B1 1920~1980MHz 2110~2170MHz

WCDMA B2 1850~1910MHz 1930~1990MHz

WCDMA B3 1710~1785MHz 1805~1880MHz

WCDMA B4 1710~1755MHz 2110~2155MHz

WCDMA B5 824~849MHz 869~894MHz

WCDMA B8 880~915MHz 925~960MHz

TD-SCDMA B34 2010~2025MHz 2010~2025MHz

TD-SCDMA B39 1880~1920MHz 1880~1920MHz

FDD-LTE B1 1920~1980MHz 2110~2170MHz

FDD-LTE B2 1850~1910MHz 1930~1990MHz

FDD-LTE B3 1710~1785MHz 1805~1880MHz

FDD-LTE B4 1710~1755MHz 2110~2155MHz

FDD-LTE B5 824~849MHz 869~894MHz

FDD-LTE B7 2500~2570MHz 2620~2690MHz

FDD-LTE B8 880~915MHz 925~960MHz

FDD-LTE B12 699~716MHz 729~746MHz

FDD-LTE B13 777~787MHz 746~756MHz

A70

Hardware User Guide


FDD-LTE B17 704~716MHz 734~746MHz

FDD-LTE B20 832~862MHz 791~821MHz

FDD-LTE B26 814~849MHz 859~894MHz

FDD-LTE B28A 703~733MHz 758~788MHz

FDD-LTE B28B 718~748MHz 773~803MHz

TDD-LTE B34 2010~2025MHz 2010~2025MHz

TDD-LTE B38 2570~2620MHz 2570~2620MHz

TDD-LTE B39 1880~1920MHz 1880~1920MHz

TDD-LTE B40 2300~2400MHz 2300~2400MHz

TDD-LTE B41 2555~2655 MHz 2555~2655 MHz

5.2 TX Power and RX Sensitivity

Table 5-2 RF TX power of A70

Operating Band Max Power Min. Power

GSM850 33dBm+2/-2dB 5dBm+2/-2dBm

EGSM900 33dBm+2/-2dB 5dBm+2/-2dBm

DCS1800 30dBm+2/-2dB 0dBm+2/-2dBm

PCS1900 30dBm+2/-2dB 0dBm+2/-2dBm

CDMA BC0 24dBm +1/-1dBm <-50 dBm

WCDMA B1 24dBm +1/-3dBm <-50 dBm






TD-SCDMA B34 24dBm +1/-3dBm <-49 dBm

TD-SCDMA B39 24dBm +1/-3dBm <-49 dBm

FDD-LTE B1 23dBm+2/-2dBm <-40 dBm

A70

Hardware User Guide













FDD-LTE B28A 23dBm+2/-2dBm <-40 dBm

FDD-LTE B28B 23dBm+2/-2dBm <-40 dBm

TDD-LTE B34 23dBm+2/-2dBm <-40 dBm





Table 5-3 RF RX sensitivity of A70

Operating Band Sensitivity

GSM850 ≤-108dBm

EGSM900 ≤-108dBm

DCS1800 ≤-108dBm

PCS1900 ≤-108dBm

CDMA BC0 <-107dBm

WCDMA B1 <-108 dBm

WCDMA B2 <-107dBm

WCDMA B3 <-108 dBm

WCDMA B4 <-108 dBm

A70

Hardware User Guide


WCDMA B5 <-108 dBm

WCDMA B8 <-108 dBm

TD-SCDMA B34 <-109dBm

TD-SCDMA B39 <-109dBm

FDD-LTE B1 <-97dBm

FDD-LTE B2 <-95dBm

FDD-LTE B3 <-95dBm

FDD-LTE B4 <-97dBm

FDD-LTE B5 <-95dBm

FDD-LTE B7 <-95dBm

FDD-LTE B8 <-95dBm

FDD-LTE B12 <-95dBm

FDD-LTE B13 <-95dBm

FDD-LTE B17 <-95dBm

FDD-LTE B20 <-95dBm

FDD-LTE B26 <-95dBm

FDD-LTE B28A <-95dBm

FDD-LTE B28B <-95dBm

TDD-LTE B34 <-97dBm

TDD-LTE B38 <-97dBm

TDD-LTE B39 <-97dBm

TDD-LTE B40 <-97dBm

TDD-LTE B41 <-95dBm

All the values above are obtained in the lab environment. LTE test conditions: 10 MHz bandwidth,


In actual applications, there might be a difference due to the changes of test conditions and

environment.

A70

Hardware User Guide


5.3 GNSS Feature

Changes Parameter

GPS L1 operating frequency 1574.397~1576.443 MHz

GLONASS operating frequency 1597.5~1605.9MHz

BDS B1 operating frequency 1559.1~1563.1 MHz

Galileo operating frequency 1573.42~1577.42MHz

Tracking sensitivity GPS: -158 dBm max

Acquisition sensitivity GPS: -146dBm max

Re-acquisition sensitivity GPS: -155 dBm max

Positioning precision (in air) < 3m (CEP50)

Hot start (in air) <2.5s

Cold start (in air) <35s

Update frequency 1Hz by default

CNRin/CNRout 3dB

Max. positioning altitude 18000m

Max. positioning speed 515m/s

Max. positioning acceleration 4g

GNSS data type NMEA-0183

GNSS antenna type Passive/active antenna

Tracking sensitivity, acquisition sensitivity, and re-acquisition sensitivity were obtained in signaling

test on SPIRENT6300 and they are the maximum values of multiple tests on samples. No external LNA

or active antenna was used in the test.

A70

Hardware User Guide


6 Mechanical Features

6.1 Dimensions

Figure 6-1 A70 dimensions

1.0±0.1mm1.6±0.1mm 2.7±0.2mm

37.0±0.1mm

37.0±0.1mm

37.0±0.1mm

36.16±0.1mm

A70

Hardware User Guide


6.2 Label

The label is made of materials that are deformation-resistant, fade-resistant, and high-temperature-

resistant and it can endure high temperature up to 260 °C.

Figure 6-2 A70 label

The picture above is only for reference.

The silk-screen printing must be clear. No blur is allowed.

The material and surface finishing must comply with RoHS directives.

6.3 Three Views

The following figure shows the top view, bottom view, and side view of A70 module.

Figure 6-3 Three views of A70

A70

Hardware User Guide


6.4 Package

A70 modules are packaged in sealed vacuum bags with dryer, humidity card, and tray on delivery to

guarantee a long shelf life. Follow the same package method again in case of opened for any reasons.

6.4.1 Reel

A70 in mass production is delivered in the following packaging.

Figure 6-4 A70 reel packaging

A70

Hardware User Guide


Figure 6-5 A70 reel dimensions

6.4.2 Moisture

A70 is a level 3 moisture-sensitive electronic elements, in compliance with IPC/JEDEC J-STD-020

standard.

If the module is exposed to air for more than 48 hours at conditions not worse than 30°C/60% RH,

bake it at a temperature higher than 90 degree for more than 12 hours before SMT.Or, if the indication

card shows humidity greater than 20%, the baking procedure is also required.Do not bake modules

with the package tray directly.

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Hardware User Guide


7 Mounting A70 onto the Application Board

A70 is introduced in 284-pin LGA package. This chapter describes A70 foot print, recommended PCB

design and SMT information to guide users how to mount the module onto application PCB board.

7.1 Application Foot Print

Figure 7-1 Recommended PCB Foot Print

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Hardware User Guide


7.2 Stencil

The recommended stencil thickness is at least 0.12 mm to 0.15 mm.

7.3 Solder Paste

Do not use the kind of solder paste different from our module technique.

The melting temperature of solder paste with lead is 35 °C lower than that of solder paste

without lead. It is easy to cause voiding for LGA and LCC inside the module after second reflow

soldering.

When using only solder pastes with lead, please ensure that the reflow temperature is kept at

220 °C for more than 45 seconds and the peak temperature reaches 240 °C.

7.4 SMT Furnace Temperature Curve

Thin or long PCB might bend during SMT. So, use loading tools during the SMT and reflow soldering

process to avoid poor solder joint caused by PCB bending.

Figure 7-2 SMT furnace temperature curve

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Hardware User Guide


Technical parameters:

Ramp up rate: 1 to 4 °C/sec

Ramp down rate: -3 to -1 °C/sec

Soaking zone: 150-180 °C, Time: 60-100 s

Reflow zone: >220 °C, Time: 40-90 s

Peak temperature: 235-250 °C

Neoway will not provide warranty for heat-responsive element abnormalities caused by improper

temperature control.

For information about cautions in A70 storage and mounting, refer to Neoway Module Reflow

Manufacturing Recommendations.

When manually desoldering the module, use heat guns with great opening, adjust the temperature to

250 degrees (depending on the type of the solder paste), and heat the module till the solder paste is

melt. Then remove the module using tweezers. Do not shake the module in high temperatures while

removing it. Otherwise, the components inside the module might get misplaced.

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Hardware User Guide


8 Safety Recommendations

Ensure that this product is used in compliant with the requirements of the country and the environment.

Please read the following safety recommendations to avoid body hurts or damages of product or work

place:

Do not use this product at any places with a risk of fire or explosion such as gasoline stations, oil

refineries, etc

Do not use this product in environments such as hospital or airplane where it might interfere with

other electronic equipment.

Please follow the requirements below in application design:

Do not disassemble the module without permission from Neoway. Otherwise, we are entitled to

refuse to provide further warranty.

Please design your application correctly by referring to the HW design guide document and our

review feedback on your PCB design. Please connect the product to a stable power supply and

lay out traces following fire safety standards.

Please avoid touch the pins of the module directly in case of damages caused by ESD.

Do not remove the USIM card in idle mode if the module does not support hot plugging.

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Hardware User Guide


A Conformity and Compliance

A.1 Approvals

CCC

SRRC

RoHS

A.2 Chinese Notice

A.2.1 CCC Class A Digital Device Notice

This product has been tested and found to comply with the limits for class A digital devices.These limits

are designed to provide reasonable protection against harmful interference in a residential installation.

A.2.2 Environmental Protection Notice

This product is in compliant with China RoHS directives and does not contain any hazardous

substances as per the above referenced standard. Follow the regulations of the countries when storing,

applying, and discarding it.

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Hardware User Guide


B Abbreviation

Abbreviation English Full Name

ADC Analog-Digital Converter

BT Bluetooth

CDMA Code Division Multiple Access

CODEC COder-DECoder

DC-HSPA+ Dual-carrier HSPA+

DDR Double Data Rate

DSRC Dedicated Short Range Communications

DTR Data Terminal Ready

EGSM Enhanced GSM

eMMC Embedded Multi Media Card

EVDO Evolution Data Optimized

FDD Frequency Division Duplex

GNSS Global Navigation Satellite System

GPRS General Packet Radio Service

GPIO General-Purpose Input/Output

GPS Global Positioning System

GSM Global Standard for Mobile Communications

HSIC High-Speed Interchip

HSPA+ High-Speed Packet Access

HSUPA High-Speed Up-link Packet Access

I2C Interintegrated Circuit

I2S Inter-IC Sound

LGA Land Grid Array

LTE Long-Term Evolution

MDIO Management Data Input/Output

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Hardware User Guide


PCB Printed Circuit Board

RF Radio Frequency

SDC Secure Digital Controller

SGMII Serial Gigabit Media Independent Interface

SPI Serial Peripheral Interface

TBD To Be Determined

TDD Time Division Duplex

TD-SCDMA Time Division-Synchronous Code Division

Multiple Access

UART Universal Asynchronous Receiver-Transmitter

USIM Universal Subscriber Identity Module

UMTS Universal Mobile Telecommunications System

USB Universal Serial Bus

WCDMA Wide-band Code Division Multiple Access

WCI Wireless Coexistence Interface

WLAN Wireless Local Area Network

A70 Product Specifications - Paoli · 2020. 4. 8. · LTE: +23dBm (Power Class 3) Application...

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