4 g world 2011 renesas mobile overview
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Transcript of 4 g world 2011 renesas mobile overview
©2011 Renesas Electronics Corporation. All rights reserved.
Strictly Confidential
1 ©2011 Renesas Electronics Corporation. All rights reserved. 1
An Introduction to Renesas Mobile Slim Modems to Mobile Multimedia Platforms – Flexibility & Performance
Jim Harper, Renesas Mobile Corporation
4G World
Chicago, IL
October 26, 2011
©2011 Renesas Electronics Corporation. All rights reserved. 2
Overview of Renesas Mobile Corporation
Renesas Mobile’s mission
Future wireless trends and challenges
Building the LTE ecosystem – major factors
Flexibility and performance
Contents
©2011 Renesas Electronics Corporation. All rights reserved. 3
The Genesis of Renesas Mobile
Dec. 2010
Overall the World’s 3rd Largest Semiconductor Supplier
Legacy experience across GSM/EDGE, WCDMA/HSPA, and LTE, having shipped modems powering over 2 Billion mobile devices
Mobile Multimedia Business • Global No.1 APE &
Co-processor • Global No.5 RF Device • Most Efficient SoC
Implementation Technology
• Software & Integration
Wireless Modem Unit • Most robust & Widely
deployed Modem Technology
• Global Field support Infrastructure
• Strong IPR & Contributions for Standardization
©2011 Renesas Electronics Corporation. All rights reserved. 4
-2008 / Step1: Renesas DoCoMo platform and global AP business, developing complete Symbian and Linux platforms for DoCoMo
2009 / Step2: Licensing Nokia Modem IP, get global system integration capabilities, kicked-off Renesas LTE/DC-HSPA+ triple-mode modem program
2010 / Step3: Acquisition of Nokia Wireless Modem, start of establishing a portfolio of modem, CP (communication processors) and AP/modem platforms
2011 / Step4: Integrating Wireless Modem and MMBU into RMC and start full operation, execute product plans
2012+ / Step5: Leadership in modem platform technology with LTE and LTE-advanced
The Launch Milestones for Renesas Mobile
2008
2009
2010
2011
2012
©2011 Renesas Electronics Corporation. All rights reserved. 5
Renesas Mobile’s Worldwide Presence
FINLAND Helsinki
Oulu Tampere
Salo
INDIA Bangalore
USA San Diego
Irving
TAIWAN Taipei
DENMARK Copenhagen
UK Farnborough
CHINA Beijing
Shanghai
GERMANY Munich
JAPAN Tokyo, RMC HQ
Takasaki Kodaira Nagoya
FRANCE Rennes Paris
©2011 Renesas Electronics Corporation. All rights reserved. 6
Evolving Mobile Markets
Mobile Devices
Car Infotainment & Connected Cars
PC/Convergence
Digital Consumer Electronics
Connected Devices
Other Devices
Application Softwares
Open OS (Android, Windows etc)
Mobile Platform
Middleware
Multi Media Modem
Software
Drivers
Core Chipsets
APE APE HW
BB Modem HW
PMIC/Audio RF IC
©2011 Renesas Electronics Corporation. All rights reserved. 7
The wireless revolution: change and challenges
Spectrum
User demand dictates the need for additional spectrum
Spectrum fragmentation becomes a bigger problem
Cellular connectivity moves to non-traditional areas
Automotive, industrial, M2M, medical, etc
New and diverse requirements are placed on devices (e.g. size, form factor)
Regionalization and customization considerations
Local regulation must be taken into account in designs
Market sizes are smaller and the need to configure to serve multiple industries
New business models
Trends towards faster times to market
Changes in testing methodologies and depth of testing
©2011 Renesas Electronics Corporation. All rights reserved. 8
Leading Modem Technology merged with State-of-Art Application Processor
Mobile Platforms
World leading modem
technology combined with high
performance APEs with stunning
graphics supporting major OSs,
for smart phones and tablets,
both one or two chip
implementations.
Application Processors
Stunning hardware accelerated 3D and
HD graphics capability on multi-core
ARM processors leading to unrivalled
performance. World leading area and
power. Supporting all leading OS’s.
Slim Modem Platforms
Highly integrated high performance
stand alone 2G/3G/LTE-FDD/LTE-TDD
modem solutions including RF system for
M2M, data cards, tablets and smart
phones. Underlying modem technology
in ~2 billion handsets
©2011 Renesas Electronics Corporation. All rights reserved. 9
Current Platforms And Segmentation B
asic
R
ich
In
tern
et
/ C
on
su
mer e
xp
erie
nce
Mo
dem
p
latf
orm
s
New emerging device categories with new form factors.
High-tier, super-sized smartphone with a processor faster than 1GHz, and a main display over 4 inches.
Mid-tier or high-tier, data-centric handset with a branded, often licensable high-level OS.
SFP: Mid-tier or high-tier, mostly data-centric feature phone mostly with touch screen and Wi-Fi.
FP: Low-tier, mid-tier or high-tier, voice centric, partly data-centric, handset, usually with an unbranded, proprietary OS.
Low-tier, voice centric handset, often with a basic WAP browser, usually unbranded proprietary OS.
Modem modules such as embedded modules for laptops, USB stick modems, modem modules for CE or M2M devices.
Typ
ically s
ep
arate
mo
dem
an
d A
PE
H
igh
ly
inte
grate
d
sin
gle
ch
ip A
SIC
s
Basic Phones
Super Phones
USB sticks, Emb. modules
Tablets MID
Feature Phones
Smart Feature Phones
Smart Phones
©2011 Renesas Electronics Corporation. All rights reserved. 10
Developing the LTE Ecosystem & achieving the right balance
Platform Performance
Supported Modes
Power Consumption
Number of Processors
Product timing
Integration Level
Product Configurability
Product Volume
Cost
©2011 Renesas Electronics Corporation. All rights reserved. 11
Renesas Mobile Septa-band RF
for LTE
The wireless revolution: change and challenges
Product variants Higher costs
Growing number of LTE frequency band variants
RMC’s multi-band RF capability solves this problem
FDD Bands
TDD Bands
Config A
Config D
Config B
Config E Config F
Config C
Band 38 Band 39 Band 40 Band 41
Band 13 Band 17 Band 20 Band 21
Band 3 Band 4 Band 5 Band 7
Band 1 Band 2 Band 8 Band 12
S O L U T I O N
©2011 Renesas Electronics Corporation. All rights reserved. 12
Platform Performance – Key Challenge
Mobile computing efficiency … achieving the right balance of power, performance for highly portable devices
System Shared Streaming Cache
ARM®
CortexTM-A9
ARM®
CortexTM-A9
NEON PTM NEON PTM
I$ D$ I$ D$
Snoop Control Unit
L2 Cache
PowerVRTM
SGX543
3D Graphics
Crypt
Engine
R-VCPTM
Multi Codec
Video
Processor
Sound/Audio Processor
Visual 2D
Graphic
Engine ISP
JPEG
Engine
System Interconnect
Multimedia Interconnect
S3$ RAM
Real time
CPU
1080p30
35Mtri/s
20Mpixels
140hours
1.2GHz 1.2GHz
Peripherals
R-MobileU2
LTE
HSPA+
GSM/EDGE
Modem
Optimized combination of general purpose ARM cores plus dedicated processor blocks
Built on consumer, automotive and cellular expertise
Renesas Mobile MP5225
Designed to deliver outstanding performance with Android™
R-Mobile APE5R state-of-the-art low-power, high-performance application processor
Includes the industry’s first multi-core graphics engine, PowerVR SGX MP, to deliver class-leading 2D/3D graphics to deliver console-like games quality
©2011 Renesas Electronics Corporation. All rights reserved. 13
Renesas Mobile is developing the chipsets and platforms to address evolution in the wireless industry utilizing integration and systems knowledge across many industries and technologies
Renesas Mobile has leading modem, applications processor, RF, systems knowledge across the automotive, consumer and cellular markets
Innovation in RF area and the ability to support a broad range band variants across the 3GPP family of wireless technologies is a key strength
Conclusions
©2011 Renesas Electronics Corporation. All rights reserved. 14
THANK YOU
www.renesasmobile.com
©2011 Renesas Mobile Corporation. All rights reserved.