3-D IC Fabrication and Devices
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Transcript of 3-D IC Fabrication and Devices
3-D IC Fabrication and Devices
Mai Chery Vue and Dylan ScheunemannWednesday April 23, 2014
Abstract:3-D integrated circuits have unique fabrication designs that makes it inexpensive,
compact, and more efficient than planar circuits. The components are integrated vertically and horizontally using less material.
Outline❏ Fabrication
❏ Types❏ Monolithic❏ Wafer-on-Wafer❏ Die-on-Wafer❏ Die-on-Die
❏ Wafer-on-Wafer Steps❏ Advantages/Disadvantages❏ Applications
Introduction to 3-D IC’s❏ A Single Circuit with two or more layers of
active components.❏Components can be integrated both
vertically and horizontally.
3-D IC Stacked
Problem with stacking is heat dissipation.
Types of Fabrication❏ Monolithic
❏ Built on single wafer.❏ Diced into 3-D IC’s.
❏ Wafer-on-Wafer❏ Built on two or more wafers.❏ Aligned, bonded, and diced into 3-D IC’s.
❏ Die-On-Wafer❏ Components built on two wafers.❏ One wafer diced and aligned on the second wafer.
❏ Die-On-Die❏ Components built on multiple dice.❏ Aligned and bonded into 3-D IC’s.
Types of FabricationChip means Die
Fabrication (Wafer-on-Wafer)❏ Components are built on two or more wafers❏ Alignment of wafers
❏ Machine checks for alignment mark❏ Temporarily brought into contact❏ Inspected for correct alignment
❏ Bonding of wafers❏ Then bonded together using the method best suited for
that wafer❏ Such as Direct, Adhesive, or Thermocompression
bonding
Fabrication (Wafer-on-Wafer)❏ Thinning of wafers
❏ Can be thinned before or after bonding❏ Dicing Before Grinding
❏ Saws the front before thinning from the back
❏ Dicing By Thinning❏ Applies a trench-etching process❏ Reduces Damage
Fabrication (Wafer-on-Wafer)❏Dicing of wafers
❏ Scribe and Break❏ Mechanical Sawing❏ Laser Cutting
Advantages❏ Chip Performance
❏ Higher Bandwidth❏ Reduced Power Consumption
❏ Functionality❏ Circuit Security
❏ Device Packing Density❏ Fits into a small space❏ Shorter Interconnects
❏ Cheaper fabrication costs
Disadvantages❏Heat due to stacking❏ Testing methods❏ Interconnect design❏CAD algorithms and tools
Applications❏Monolithic IC 3D (Company in California)
❏ FPGA, Gate Array❏ DRAM❏ NAND Flash Memory❏ Image Sensors❏ Microdisplays
Summary3-D integrated circuits have layered active components that are vertically and
horizontally integrated. With these designs, there’s about four different fabrication types: monolithic, wafer-on-wafer, die-on-wafer, and die-on-die. These new fabrication designs provide for better chip performance, circuit security, smaller interconnects, and inexpensive circuits.
ReferencesInformation:
1. http://domino.research.ibm.com/tchjr/journalindex.nsf/9fe6a820aae67ad785256547004d8af0/2f263eb510ba6030852571c500032694!OpenDocument
2. http://en.wikipedia.org/wiki/Three-dimensional_integrated_circuit
3. http://homepages.rpi.edu/~luj/Papers/Luj4.pdf
4. http://www.wiley-vch.de/publish/dt/books/newTitles201201/3-527-32646-4/?sID=p2qlnooj68su7htl8qrrc2qjt3
5. http://electroiq.com/blog/2003/03/wafer-thinning-techniques-for-ultra-thin-wafers/
6. https://www.coherent.com/Applications/index.cfm?fuseaction=Forms.page&PageID=273
7. http://www.monolithic3d.com/applications.html
8. Three-Dimensional Integrated Circuit Design by Vasilis F. Pavlidis & Eby G. Friedman
Pictures:1. http://esl.epfl.ch/page-42448-en.html2. http://lsi.epfl.ch/page-13135-en.html3. http://www.intechopen.com/books/metallurgy-
advances-in-materials-and-processes/low-temperature-wafer-level-metal-thermo-compression-bonding-technology-for-3d-integration
4. http://www.tezzaron.com/technology/FaStack.htm
Five Key Concepts❏ A 3-D circuit is a Single Circuit with two or more layers
of active components.❏ 4 Types of Fabrications
❏ Monolithic, Wafer-on-Wafer, Die-on-Wafer, Die-on-Die
❏ Wafer-on-Wafer Fabrication❏ Align, Bond, Thin, Dice
❏ Disadvantage: Heat from stacking❏ Applications: NAND Flash Memory, and Micro Displays