2019 Media Planner - OpenSystems...
Transcript of 2019 Media Planner - OpenSystems...
2019 Media Planner
A publication of the Intel® Internet of Things (IoT) Solutions Alliance, insight.tech is the go-to destination for embedded and IoT design ideas, solutions, and trends. @IoT_Editor
Table of Contents
embedded world 2
Sponsorship Packages 3
Webinars 4 Co-Sponsored Webinar Solo Webinar
Online Sponsorships 5 Native Advertising White Paper Posting with Promotion
Custom Content 6
Custom Surveys 7
embedded world is the largest event targeting embedded technologies, security and intelligence and the internet of Things. Each year more than 1,000 exhibitors and 32,000 attendees visit the conference. This is a great opportunity to create awareness, drive traffic to your booth and increase your exposure at this industry leading event.
Internet of Things . 1 video from show floor with insight.tech editor-in-chief Kenton Williston. 1 custom piece of content created and posted on insight.tech during embedded world. 1 native ad promoted on insight.tech’s monthly newsletter. 1 social media post on Twitter (IoT_editor) using hashtags with a bonus push during the week of embedded world Price: $5,000
Check out our sample coverage from embedded world 2018
VIDEO: Congatec Interview: Moving Servers to the Edgehttps://www.insight.tech/industry/moving-servers-to-the-edge 6 Things to See at Embedded World https://www.insight.tech/retail/6-things-to-see-at-embedded-world Congatec Demos Edge Server Tech at embedded world 2018https://www.insight.tech/industry/congatec-demos-edge-server-tech-at-embedded-world-2018
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Sponsorship PackagesSave more than 10% by packaging together.
2019 Co-Sponsored Webinar TopicsFebruary Industrial IoTApril Connected Factories June Machine LearningAugust AIOctober Smart Cities December Medical
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$30,000
$21,000
$14,300
Package Includes Cost
. 2 Co-Sponsored Webinars . 3 White papers with promotion . 3 Native Ads, Industry Survey . 1 Paid Social Push 6x per year on Twitter (5,000 impressions each)
. 1 Co-Sponsored Webinar . 2 White papers . 2 Native ads . 1 Custom Piece of Content Creation, Industry Survey . 1 Paid Social Push 3x per year on Twitter (5,000 impressions each)
. 1 Co-Sponsored Webinar . 2 White paper . 1 Native ad . 1 Custom Piece of Content . 1 Paid Social Push once per year on Twitter (5,000 impressions)
GOLD
SILVER
BRONZE
Webinars
Co-Sponsored Webinar . 6 co-sponsored webinars will be featured throughout the year . Each co-sponsor will receive 10 minutes of presentation time, logo on all promotional material and all leads, promotion on Twitter, coverage on insight.tech site and in newsletter Price: $3,500 per sponsor, 4 slots available per topic
Solo Webinar. Sponsor selects a date and time for a solo hour-long webinar . The webinar will be moderated by an editor. The sponsor receives all leads. Promotion of the webinar includes email campaigns, logo on all promotional material, promotion on Twitter, coverage on insight.tech site and in newsletter Price: $10,650
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Co-Sponsored Webinar CalendarFebruary Industrial IoTApril Connected Factories June Machine LearningAugust AIOctober Smart Cities December Medical
All webinar production is coordinated through OpenSystems Media.
Online Sponsorships
Native Ads . Includes 150-300 words, large hero image, secondary photo and links. 10,000 guaranteed impressions including coverage on Twitter and on insight.tech newsletter for deployment. 3-month campaign Price: $2,000
White Paper Posting with Promotion. Designed for immediate lead generation . A custom HTML email will be deployed to the insight.tech subscriber database . Sponsor selects time and date for deployment Price: $4,000
Read About
Intel Xeon D
Using a common technology for multiple applications
Maximizing compute power
Overcoming sensor fusion challenges
Tackling the mobile server
DEFENSE SOLUTIONS
Intel Xeon D: A Significant Leap Forward in General Purpose Processor (GPP) Technology Across the Spectrum of Defense ApplicationsTE
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IntroductionDefense platforms and their associated physically constrained payloads have long been the limiting factor in terms of mission capability. In other words, there is a set power budget available, maximum weight and volume limits, and a fixed ceiling of heat that can be removed dependent on the particular platform-based payload. Whatever processing can be performed in this fixed size, weight and power (SWaP) envelope dictates and limits mission capability associated with the particular function of the payload.
Given the mandate to maximize performance for a given enclosure, the defense industry has largely gravitated towards using a mixture of heterogeneous processing elements with the idea being that developers play to the strengths of these individual elements, applying them to the most appropriate sensor processing stage. Three of the biggest contenders have been FPGAs, GPPs, and GPGPUs. FPGAs and GPGPUs have experienced tremendous strides in terms of processing densities. However, General Purpose Processors (GPPs) have not been experiencing this same rapid gain in functionality, for instance being limited to four cores as with the case of the Intel® Core™ i7 family. That is until now, where the GPP has been propelled forward, with the advent of a new multi-core Intel architecture family, the Xeon® D. This white paper will explore the technology behind the Xeon D’s flexibility and how it can solve a diverse range of military and aerospace challenges.
Infocurtisswrightds.com
Email [email protected] Figure 1: Example of board-level architectural options
(e.g. Curtiss-Wright Defense Solutions CHAMP™-XD family)
TPMPABS
IntelXeon D
8/12/16-CoreSoC
XMC
Pn6
P2Expansion PlaneX24s+X8d+X12d
Core Func.FPGA
DDR48/16 GB
x32 PCIe3Switch2 NTBs
x4 PCIe3
x16 PCIe3
LPC
BIOS
SPI
SDD Flash16/32 GB
2x RS-2324x DIO
B P1 AData Plane
2x 10GBase-KRor
2x 1GBase-KX
GigENIC
IPMIFPGA
Pn5
PowerSupplies
Jumpers
Vs3 (5V)3.3V_AUX
PCIe
IPMBA/B
SATA
2133 MHz
DDR48/16 GB 2133 MHz
NVRAM
SPI
P1
2xU
SB2,
1xU
SB3.
0
Build Option (Mode 4, 5, 7, D or J)
2xSA
TA3
4x DIO
1x USB 2.01x SATA
3.0
1xU
SB2.
0,1x
SATA
3
2x RS-422
2x SATA4x DIO
2x SATA2x USB 2.0
4x DIO1x SATA2x USB 2.0
2x RS-4222x USB 2.04
5
7
D
J4x DIO1x RS-4221x USB 3.0
P1
2x 10GBase-KR
x8 PCIe3
1000Base-T
x4 PCIe3
Flash
MAG
Base-T
Flash
SPI
16 MBSRAM
PCH PCIe2
or x8 PCIe
USB
SATA
PABS
Intel Xeon D
16-Core SoCXMC
Pn5 Pn6
x8 PCIe3
XMC I/O VITA 46.9
Core Func. FPGAXilinx
UltraScale DDR4 64 GB
DDR4 64 GB
2133 MHz
2133 MHz
Phy
PCIe
x80 PCIe3 Switch2 NTBs
16 MB BIOS SPI
SSD Flash32 GB
SATA
1000BASE-KXor 10GBASE-KR
422/485 Serial
16 x GPIO
232 Serial
P1Data Plane
CX-3 40 Gb
CX-3 40 Gb
x8 PCIe3 x8 PCIe3
x16 PCIe3
x16 PCIe3x16 PCIe3
P5P2
TPM
IPMI
I2C
4 x EIA-232
2 x EIA-422/485
16 x GPIO
Front Panel Connectors
VPX Backplane Connectors
232 Serial
1000 -BASE-T
LPCSPI
PowerSupplies
x8 PCIe3
USB
USBUSB
SATA SATA
PABS
Intel Xeon D
8/12/16-Core SoC
XMC
Pn5
Pn6
x8 PCIe3
XMC I/O VITA 46.9
Core Func. FPGAXilinx
UltraScale
DDR4 8/16 GB
DDR4 8/16 GB
2133 MHz
2133 MHz
Phy
PCIe G1
x96 PCIe3 Switch2 NTBs
16 MB BIOS SPI
SSD Flash
16/32 GBSATA
1000BASE-KXor 10GBASE-KR
422 Serial
16x GPIO
232/422 Serial
P1Data Plane
Intel Xeon D
8/12/16-Core SoC
DDR4 8/16 GB
DDR4 8/16 GB
2133 MHz
2133 MHz
CX-3 40Gb
CX-3 40Gb
x8 PCIe3 x8 PCIe3
x16 PCIe3 x16 PCIe3
x16 PCIe3x16 PCIe3
SPI
SATA
P5P2
TPM
PABS
16 MB BIOS
SSD Flash
16/32 GB
TPM
IPMI
I2C
4 x EIA-232
2 x EIA-422/485
16x GPIO
Front Panel Connectors
VPX Backplane Connectors
232/422 Serial
1000 BASE-T
LPCSPI SPI
LPCx8
CPLD
POWER RESET
PowerSupplies
CHAMP-XD1
High Memory 128G DDR4
High Compute 2 Xeon D’s
CHAMP-XD2MCHAMP-XD2
SWaP Compact
Briefing Document - IoT _______________________________________________________________________________________
I B A S E T e c h n o l o g y I n c .
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Internet of Things Solutions for Railways FOUR key design requirements for electronic equipment on board trains Prepared by IBASE Technology, October 2017
Sample Native Ad
Sample White Paper
Sample White Paper Email Campaign
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Custom Content
Do you need help creating dynamic content? We have a team of writers who can author compelling on any application in the IoT space. Once the content is created we can create an email campaign to drive leads.White Paper (1,500 words). Price: $2,500
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Content creation is coordinated through OpenSystems Media.
Custom Surveys
Surveys are great opportunities to drive leads and keep the pulse on the engineering community. Each survey includes 8 questions, a giveaway, an outbound email campaign and a paid social media push to our audience on Twitter (more than 5,000 impressions).
Survey topics may include: IoT, IIoT, AI, Machine Learning, Smart Cities, Medical, Connected Factory, Predictive Maintenance, or any topic you wish to use.
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Do you have a custom project you would like to brainstorm with our team? We are happy to help. Contact: Patrick Hopper at [email protected]