2015 SEMI Market Trends Forum-04-Expanding the Role Fan-In and FO-WLP Technology and Infrastructure...
Transcript of 2015 SEMI Market Trends Forum-04-Expanding the Role Fan-In and FO-WLP Technology and Infrastructure...
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12 x 12
10/10
300 dia
120
75
Single Die
Multi-Die SbSw/ Passives
PoP Stacked-Die
50 30
80 50
300plus dia 450 dia rectangular
8/8 5/5 2/2
25 x 25 (SiP) 30 x 30 (SiP)
2x2 Double Side2x1 Double Side
1x3 Single Side1x2 Single Side 1x4 Single Side
2014 2015 2016 2017
Package Size(mm )2
Line / Space(µm/µm)
Panel Size(mm)
Die-to-Die(µm)
Die-to-Pkg(µm)
PackageConstruction
MetallizationLayers
(RDL & UBM)
Source: Nanium
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Source: NANIUM
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