2013 iNEMIWorkshop Novel DS’s Low Loss...
Transcript of 2013 iNEMIWorkshop Novel DS’s Low Loss...
2013 iNEMI Workshop
Jeongdon Kwon
Novel DS’s Low Loss Materials for High Speed PCB
Oct. 22. 2013Product Development Team
Jeongdon KwonDoosan Corporation, Electro-Materials BG
Yongin, S. KOREA
Contents
1. Development of New Low Loss Material
- Background of Development
- Strategy of New Resin System
2. Characteristics of New Material
- Products Line-up
- Properties- Properties
- Transmission loss
- Reliability of New materials
3. Summary and Development Plan
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Background of Development
Mobile stationBase transceiver stationSwitching systemProcessing equipment
Satellite communicationMoblie communication
OA Network
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High speed transmission of large volume date High frequency device & module
Router/ switchserver
Communication networks
OA Network
Home NetworkRouter
Signal Higher Frequency
Signal Velocity (Propagation delay)
V = C/ (ε)1/2
Transmission loss α = Conductor loss(αc) + Dielectric loss (αd)
αd = 23.7 x (ε)1/2 × tan δ × f/C (tan δ : dielectric loss (Df), f : frequency)
(ε : dielectric constant (Dk), C : speed of light)
Why Low Dielectric?
For reduction of αd Low Dk & Df Materials
For reduction of αc Original lower profile or profile-free Conductor
(Required High adhesion technology for low surface roughness foildue to Skin Effect)
b
w
t
b : Dielectric layer thicknessw : Conductor widtht : Conductor thickness
4
εStandard Low Profile
Need Material having lower Df and better adhesion
with lower profile Cu foil.
Transmission loss
Why Low Dielectric? [Simulation by Polar]
Dk@1GHz Df@1GHz
Dk Simulation(Polar SI9000e)
4.2
0.0153.8
3.5
3.0
Dk@1GHz Df@1GHz
Df Simulation(Polar SI9000e)
4.0
0.015
0.010
0.005
0.002
1.2 mil
8.74 mil
10.1 mil
10.1 mil
8.74 mil
= Conductor loss(αc) + Dielectric loss (αd)
[ αd = 23.7 x Dk1/2 × Df× f/C ]
5
-35
-30
-25
-20
-15
-10
-5
0
4.2
3.8
3.5
3.0
S21 (d
B/line)
-35
-30
-25
-20
-15
-10
-5
0
0.015
0.010
0.005
0.002
20GHz
Frequency (Hz)10GHz0GHz
Df 0.015
Dk 4.0
20GHz
Frequency (Hz)10GHz0GHz
3.0 0.002
Relation Dielectric medium with Velocity, dielectric loss and signal
Generation of Electromagnetic field
Permeation into length of the surrounding interconnect material
An electrical signal propagation down an given conducting line
A dielectric interaction between electric field from the signal and the surrounding dielectric medium
Why Low Dielectric?
- Source : Handbook of Low and High Dielectric constant Materials and their Applications
Dielectric loss↑ and Velocity ↓(propagation delay)
surrounding dielectric medium
Required lower/non-polar or symmetric molecular structure materials
1 + 2(Σ φi / Σ Vi)
1 - (Σ φi / Σ Vi)ε =
- ε : Dielectric constant- φ : Molar polarization- V : Molar volume
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Peel Strength ↓ Adhesion, Processability & Reliability ↓
How To Overcome the Limitation ?
Concept of Material for High-Frequency PWBs
Hybrid Materials
Novel high performance material
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Normal or Low Dk/ Low Df Glass fabric
Non-polar oligomer
or polymer
Non-polar oligomer
or polymer
High Tg & Low Dk and Low
loss Hardener
High Tg & Low Dk and Low
loss Hardener
Low Dk & Df Inorganic
Filler
Low Dk & Df Inorganic
Filler
Low Dk & Low Df
Thermosetting resin
Low Dk & Low Df
Thermosetting resin
Low Profile Cu
Low Profile Cu
Contents
1. Development of New Low Dk/Df Materials
- Background of Development
- Strategy of New Resin System
2. Characteristics of New Materials
- Products Line-up
- Properties- Properties
- Transmission loss
- Reliability of New materials
3. Summary and Development Plan
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Line Up of High Performance Laminates
Scope by CISCO
(@10GHz, RTF)Product
FeaturesComment
Dk @1GHz Df @1GHz Tg () Td* ()
LeadfreeHigh Loss DS-7409S (F) 4.3 0.0170 > 170 > 340 Mass Prod.
Standard loss DS-7409D 3.9 0.0100 > 170 > 360 Mass Prod.
Lead-free
Middle Loss
(0.010~
0.015)
DS-7409D (X) 3.8 0.0040 > 185 > 360 Mass Prod.
DS-7409D (XN) 3.6 0.0035 > 185 > 360 Mass Prod.
* All products are compatible for lead-free solder process
Halogen
free
Standard Loss DS-7402H 4.4 0.012 > 170 > 380 Mass Prod.
Middle Loss DS-7402D (X) 3.8 0.004 > 170 > 380Under
Developing
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free Low loss
(0.005~
0.010)
DS-7409D (V) 3.65 0.0015 > 170 > 380Under
Evaluation
Ultra Low loss
(≤0.005) DS-7409D (VN) 3.35 0.0010 > 170 > 380Under
Evaluation
General Properties of New material
Condition UnitNew MaterialDS-7409D (V)
DS-7409D (ZN) DS-7409D (X)
Glass Type E SI(Low Dk) SI(Low Dk) E
Peel StrengthRTF(1 Oz)
kgf/cm> 0.85 > 0.85 0.95 0.95
HVLP(1 Oz) > 0.75 > 0.75 0.85 0.95
z-CTE, α1 TMA ppm/ 45 45 40 40
Z-axis Expansion
50-260 % 2.8 2.8 2.5 2.5
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Expansion
Dk (R/C 50%)1 GHz
(IPC TM 650 2.5.5.9)3.65 3.35 3.6 3.8
Df (R/C 50%)
1 GHz(IPC TM 650 2.5.5.9)
0.0015 0.0010 0.0025 0.005
10 GHz(SPDR)
0.0045 0.0025 0.0058 0.0088
Tg DSC 180 180 175 190
DecompositionTemperature
TGA 385 385 370 380
T-288 With Cu, IPC Min. >120 >120 >60 >60
inflammability UL94V-0
(Halogen)V-0
(Halogen)V-0
(Halogen)V-0
(Halogen)
Resin system and Frequency dependency
Measurement Method
SPDR : Split Post Dielectric Resonator
Vector Network Analyzer
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3.5
3.6
3.7
3.8
3.9
4
4.1
4.2
4.3
0 2 4 6 8 10 12
P6
DV
DZNE
DX
0
0.001
0.002
0.003
0.004
0.005
0.006
0.007
0.008
0.009
0.01
0 2 4 6 8 10 12
P6
DV
DZNE
DX
Dk Df
Frequency, GHz Frequency, GHz
BM
BM
Dk & Df vs. Temperature
Measurement Method
Impedance Analyzer @ 1 GHz
4.20Dk 09DV
0.0150 Df 09DV
Dk Df
12
3.20
3.40
3.60
3.80
4.00
15 25 35 45 55 65 75 85 95 105
Dk 09DV
Dk D(ZN)
Dk BM
0.0000
0.0025
0.0050
0.0075
0.0100
0.0125
15 25 35 45 55 65 75 85 95 105
Df 09DV
Df D(ZN)
Df BM
Temp., Temp.,
Cu Peel strength by Cu Foil type
Copper foil P/S (kgf/cm)
09D (V)
HTE (STD) 1.15~1.20
RTF (1) 0.90~0.95
- Test Method : IPC-TM-650-2.4.8, Condition B
- Copper thickness : 1oz
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09D (V) RTF (1) 0.90~0.95
HVLP 0.88~0.90
09D (X)
RTF (1) 0.94~0.97
RTF (2) 0.95~0.99
HVLP 0.90~0.94
Resin system & Moisture absorption
Wat
er A
bsor
ptio
n (w
t%)
1.0 mm declad Laminate, #2116 PCT (121/ 2 atm)
0.30%
0.40%
0.50%
DS-7409SF (High Tg)
DS-7409DX (Low Loss)
DS-7409DZN (Ulta Low Loss)
DS-7409DV (Ulta Low loss)
Wat
er A
bsor
ptio
n (w
t%)
Time (hr)
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-0.10%
0.00%
0.10%
0.20%
0 1 2 3 4 5
Transmission Loss of New material
Measurement MethodMeasurement Method
Stripline TV using a network analyzer (Stripline S-parameter Sweep Test Method)Zo : 50Ω,, Trace thickness : 1 OzTrace Length : 16 inchExtraction of Df : C comp. Software Version 1.0 at 10 GHz
Dielectric loss tangent (Df) @10 GHzDielectric loss tangent (Df) @10 GHz
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Dfa RTF Mode
RTF (1) HVLP (1) HVLP (2)
DX (E Glass) 0.0097 0.0088 0.0087
DV (E Glass) 0.0052 0.0044 0.0047
DV (SI Glass) 0.0035 0.0032 -
Transmission Loss by Resin system & Glass Type(Dielectric Loss)
-8.0
-6.0
-4.0
-2.0
0.0
DX RTF (1) DX RTF (1) DX RTF (1) DX RTF (1)
DV RTF (1)DV RTF (1)DV RTF (1)DV RTF (1)
DV(SI Glass) RTF (1) DV(SI Glass) RTF (1) DV(SI Glass) RTF (1) DV(SI Glass) RTF (1)
S21
(dB
)
16
-20.0
-18.0
-16.0
-14.0
-12.0
-10.0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
S21
(dB
)
Frequency(GHz)
Comparison of Glass fabric
CompositionE-glass
(Normal)
Low Dk/Df
NE-glass
NTB
L-glass
AGY
SiO2 52-56 52-56 52~56
CaO 15-25 0-10 4-8
Al2O3 12-16 12-16 11-16
B2O3 8-13 15-20 20-30
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B2O3 8-13 15-20 20-30
MgO 0-6 0-5 0
Na2O, K2O 0-1 0-1 -
Dk @10GHz(Supplier’s Data)
6.7 4.7 4.86
Df @10GHz 0.006 0.004 0.005
Issue -
Higher Price
Hollow fiber (CAF)
Higher moisture absorption
Line-Up
Standard RTF HVLP 1 HVLP 2
Surface
Transmission Loss by Cu Foil Maker or Type(Conductor Loss)
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X-Section
Rz
(, AFM)7.3 3.5 2.3 1.9
Thermal Resistance of New Material- Reflow Simulation
Reflow test 260, 10 cycle (As-ls)
- PCB : 28 layers, 2 Oz Cu in center, 3.2 T, made by a sample PCB shop- PTH: Hole 0.25Φ, Pitch 1.0 mm
- No abnormality is observed from the test sample.
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Thermal Resistance of New Material_ Solder Float cycling @288
Soldering Test at 288, 6 cycle
- PCB : 28 layers, 2 Oz Cu in center, 3.2 T, made by a sample PCB shop- PTH: Hole 0.25Φ, Pitch 1.0 mm
- No abnormality is observed from the test sample.
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Summary
Feature and Status
Excellent loss tangent@10GHz : 0.0062~0.032 Good Thermal-mechanical Properties Excellent Thermal Reliability of High-layer PCB Good Processability SI Test - On Evaluation by a OEM
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Ongoing and Future works
More severe Reliability Long Term Reliability test (CAF, ATC, etc) PWB Processability(ENIG, PSR) Development of a halogen-free material having lower dielectric properties
Thank youThank you