2009 IPC Midwest Show Directory

PRINTED BOARDS • ELECTRONICS ASSEMBLY • DESIGN • TEST

Enhance your knowledge and network with industry leaders.

Sunday–Thursday, September 20–24, 2009Renaissance Schaumburg Hotel & Convention Center, Schaumburg, Ill.

www.IPCMidwestShow.org877-472-4724 (U.S./Canada)

test • eleCtroniCs asseMbly • printed boards •

design

Show Directory

http://www.ipcmidwestshow.org

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To learn how IPC membership can enhance your company’s operations, stop by the IPC booth #331 or visit www.ipc.org.

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www.IPCMidwestShow.org | 1

Show ScheduleConvention Center Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . 2Show Schedule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

General InformationHotel and Business Center . . . . . . . . . . . . . . . . . . . . . . . . . . 8Registration Hours and Policies . . . . . . . . . . . . . . . . . . . . . . 8Schaumburg Area Information . . . . . . . . . . . . . . . . . . . . . . 10

Special EventsA-Line . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Free Opening Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12On the Show Floor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Free First-Timers’ Welcome Breakfast . . . . . . . . . . . . . . . . 12Luncheons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Free ForumsIPC Technology Roadmap . . . . . . . . . . . . . . . . . . . . . . . . . . 13Acceptability, Reliability and Failure Analysis . . . . . . . . . . 13

Technical ProgramTechnical Conference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Standards Development Meetings . . . . . . . . . . . . . . . . . . . 16Professional Development Courses . . . . . . . . . . . . . . . . . . . 23

ExhibitionExhibit Hall Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24New Products Listing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Index of Exhibitors by Category . . . . . . . . . . . . . . . . . . . . . 27Exhibitor Listings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Table of Contents

Standards Development MeetingsSeptember 20–24 . . . . . . . . . . 8:00 am–5:00 pm

Professional Development CoursesSeptember 24 . . . . . . . . . . . . 9:00 am–12:00 pm . . . . . . . . . . . . . . . . . . . . . . . . . 2:00 pm–5:00 pm

Technical Conference SessionsSeptember 23 . . . . . . . . . . . 10:00 am–12:00 pm . . . . . . . . . . . . . . . . . . . . . . . . . 1:30 am–4:45 am

Exhibits OpenWednesday, September 23 . . 10:00 am–6:00 pmThursday, September 24 . . . . 10:00 am–4:00 pm

IPC is a global, nonprofit trade association dedicated to furthering the competitive excellence and financial success of its members, who are participants in the electronics industry . In pursuit of these objectives, IPC will devote resources to management improvement and technology enhancement programs, the creation of relevant standards, protection of the environment and pertinent government relations . IPC encourages the active participation of all its members in these activities and commits to full cooperation with all related organizations .

• Advanced Packaging

• Circuitnet

• CircuiTree

• EMS007

• EMSNow

• EMT Worldwide

• Global SMT & Packaging

• PCB007

• SMT

• U.S. Tech

In Cooperation With:

Follow us on Twitter and get up-to-the-minute show announcements and daily bookstore discounts . Find us on www .IPCMidwestShow .org/twitter .

2 | www.IPCMidwestShow.org

Convention Center Floor Plan

restrooms

event registration

+ first aid

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Show Schedule

Event Title Code Time Chair/Moderator Room Page

Access the show schedule and a list of exhibitors from your mobile device at www .IPCMidwestShow .org/mobile . *Will be held indoors in the event of inclement weather .

Friday, September 18, 2009 IPC-A-610 Task Group 7-31b 8:00 am–5:00 pm Jennifer Day, Stanley Associates, U.S. Army Off-Site 20 Constantino Gonzalez, ACME Training & Consulting

Saturday, September 19, 2009 IPC-A-610 Task Group 7-31b 8:00 am–5:00 pm Jennifer Day, Stanley Associates, U.S. Army Nirvana C 20

Constantino Gonzalez, ACME Training & Consulting

Sunday, September 20Attendee Registration 7:00 am–5:00 pm Foyer

Terms and Definitions Committee 2-30 8:00 am–9:00 am Michael Green, Lockheed Martin Utopia A 22 Space Systems Company

J-STD-001 Task Group 5-22a 8:00 am–2:30 pm Teresa Rowe, AAI Corporation Schaumburg 16 GH

Joint Meeting — IPC-A-600 and Rigid Printed Board 7-31a/ 9:00 am–3:00 pm Mark Buechner, BAE Systems; Utopia A 20 Performance Specifications Task Group D-33a Randy Reed, Merix Corp

Committee Chairman Council (By Invitation) CCC 3:00 pm–4:30 pm Peter Bigelow, IMI Inc . Schaumburg 20 GH

Assembly and Joining Processes Planning 5-20 4:30 pm–6:00 pm Leo Lambert, EPTAC Corporation Schaumburg 16 Committee (By Invitation) GH

Committee Chairman’s Reception 6:00 pm–7:00 pm Sam&Harry’s Terrace*

Monday, September 21Attendee Registration 7:00 am–5:00 pm Foyer

Exhibitor Registration 10:00 am–5:00 pm Foyer

IPC Cleaning and Coating Committee 5-30 8:00 am–9:00 am Douglas Pauls, Rockwell Collins Innovation 17

Product Assurance Committee (By Invitation) 7-30 8:00 am–9:00 am Mel Parrish, STI Electronics, Inc. Nirvana C 20

Thermal Stress Test Methodology Subcommittee D-32 8:00 am–10:00 am Michael Freda, Sun Microsystems Inc. Utopia B 22

Electronic Documentation Technology Committee 2-40 8:00 am–12:00 pm Bryan Truax, CADParts & Consulting, LLC Epiphany 18

Laminate/Prepreg Materials Subcommittee 3-11 8:00 am–12:00 pm Tony Senese, Panasonic Electric Division Utopia A 17

Component and Wire Solderability Specification 5-23b 8:00 am–12:00 pm David Hillman, Rockwell Collins Euphoria 16 Task Group

EMS Program Manager Training and Certification 8:00 am–5:00 pm Susan Mucha, Powell-Mucha Consulting Serenity 23 Program — Introduction to Program Management

SMT Processes and Six Sigma Green Belt SMTA 8:00 am–5:00 pm Perfection

Potting and Encapsulation Task Group 5-33f 9:00 am–10:00 am Douglas Pauls, Rockwell Collins Innovation 18

Joint Meeting — J-STD-001 and IPC-A-610 5-22a/ 9:00 am–5:00 pm Jennifer Day, Stanley Associates, U.S. Army Nirvana C 16 Task Groups 7-31b Constantino Gonzalez, ACME Training & Consulting; Teresa Rowe, AAI Corporation

High Speed/High Frequency Committee D-20 10:15 am–12:00 pm Edward Sandor, Connection 19 Taconic Advanced Dielectric Division

Printed Board Process Capability, Quality and Relative D-36 10:15 am–12:00 pm Gary Long, Intel Corp. Utopia B 22 Reliability Benchmark Test Subcommittee

Committee Awards Luncheon 12:00 pm–1:30 pm Nirvana AB 12

Woven Glass Reinforcement Task Group 3-12d 1:30 pm–3:00 pm Patricia Goldman, Dielectric Solutions, LLC Utopia A 17


Show Schedule


FF=Free Forum | PD= Educational Course | S=Conference Session

Joint Meeting — Data Generation and Transfer 2-10/ 1:30 pm–5:00 pm Andrew Dugenske, Georgia Institute of Technology Epiphany 18 Committee and Shop Floor Communication 2-13 Karen McConnell, Lockheed Martin, EPI Center Subcommittee

Low-Halogen Electronics Standard Task Group 4-33a 1:30 pm–5:00 pm Scott O’Connell, Dell; Stephen Tisdale, Intel Corp. Utopia CD 19

Printed Circuit Board Solderability Specifications 5-23a 1:30 pm–5:00 pm Gerard O’Brien, Solderability Testing and Euphoria 16 Task Group Solutions Inc.

SIR and Electrochemical Migration Task Group 5-32b 1:30 pm–5:00 pm Chris Mahanna, Robisan Laboratory Inc. Innovation 18

IPC-A-630 Box Build Task Group 7-31j 1:30 pm–5:00 pm Eddie Hofer, Rockwell Collins Imagination 22 Richard Rumas, Honeywell Canada

High Speed/High Frequency Board D-22 1:30 pm–5:00 pm Mahendra Gandhi, Northrop Grumman Aerospace Connection 19 Performance Subcommittee Systems

Base Materials Roundtable Task Group 3-12e 3:15 pm–5:00 pm Edward Kelley, Isola Group SARL Utopia A 17

Tuesday, September 22Attendee Registration 7:00 am–5:00 pm Foyer


Show Sales Office 8:00 am–6:00 pm Exhibit Hall

Corrosion of Metal Finishes Task Group 3-11g 8:00 am–10:00 am Beverley Christian, Ph.D., Research In Motion Ltd. Utopia A 17

Metallic Foil Task Group 3-12a 8:00 am–10:00 am Rolland Savage, High Performance Copper Foil Inc. Euphoria 17

Space Electronic Assemblies J-STD-001 5-22as 8:00 am–10:00 am Garry McGuire, NASA Marshall Space Imagination 16 Addendum Task Group Flight Center

Embedded Devices Design Subcommittee D-51 8:00 am–10:00 am Gary Ferrari, FTG Circuits Knowledge 19

Cleaning & Alternatives Subcommittee 5-31 8:00 am–12:00 pm Mike Bixenman, Kyzen Corporation Connection 17

EMS Program Manager Training and Certification 8:00 am–12:00 pm Susan Mucha, Powell-Mucha Consulting Serenity 23 Program — Introduction to Program Management

Test Methods Subcommittee 7-11 8:00 am–12:00 pm Joe Russeau, Precision Analytical Laboratory, Inc. Nirvana C 22

Materials Declaration Task Group 2-18b 8:00 am–5:00 pm Mark Frimann, Texas Instruments Inc. Innovation 18

Assembly and Joining Handbook Subcommittee 7-35 8:00 am–5:00 pm Mary Muller, Crane Aerospace & Electronics Utopia D 16


Bottom Termination Components (BTCs) Task Group 5-21h 9:30 am–5:00 pm Ray Prasad, BeamWorks Inc. Epiphany 16 Vern Solberg, STC-Madison

Halogen-Free Materials Subcommittee 4-33 10:15 am–12:00 pm Douglas Sober, Kaneka Texas Corporation Utopia B 19

Flux Specifications Task Group 5-24a 10:15 am–12:00 pm Renee Michalkiewicz, Trace Laboratories–East Utopia A 16

Plated-Through Via (PTV) Reliability — 6-10c 10:15 am–12:00 pm Randy Reed, Merix Corp. Utopia C 22 Accelerated Test Methods Task Group Dewey Whittaker, Honeywell Inc.

CRANE Embedded Passives Committee CRANE 10:15 am–12:00 pm Jason Ferguson, NSWC Crane Euphoria 18 Meeting (By Invitation) Richard Snogren, Bristlecone LLC

Flexible Circuits Specifications Subcommittee D-12 10:15 am–12:00 pm Nick Koop, Minco Products Inc . Knowledge 19

Space Electronic Assemblies IPC/WHMA-A-620 7-31fs 10:15 am–5:00 pm Garry McGuire, NASA Marshall Space Flight Ctr. Imagination 20 Addendum Task Group

Committee Awards Luncheon 12:00 pm–1:30 pm Nirvana AB 12

Solder Alloy Task Group 5-24c 1:30 pm–3:00 pm David Scheiner, Kester Utopia A 16

Conductive Anodic Filament (CAF) Task Group 5-32e 1:30 pm–3:00 pm Karl Sauter, Sun Microsystems, Inc. Utopia B 18


Show Schedule


Access the show schedule and a list of exhibitors from your mobile device at www .IPCMidwestShow .org/mobile . *Will be held indoors in the event of inclement weather .

High Speed/High Frequency Test Methods D-24 1:30 pm–3:00 pm Don DeGroot, CCNi Knowledge 20 Subcommittee

SMT Attachment Reliability Test Methods Task Group 6-10d 1:30 pm–5:00 pm Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory Utopia C 22

IPC-A-600/IPC-6012 Technical Training Committee 7-31at 1:30 pm–5:00 pm Debora Obitz, Trace Laboratories–East Connection 22

Flexible Circuits Test Methods Subcommittee D-15 1:30 pm–5:00 pm Rocky Hilburn, CAC, Inc . Euphoria 19 Duane Mahnke, Mahnke Consulting

IPC-2221/2222 Task Group D-31b 1:30 pm–5:00 pm Gary Ferrari, FTG Circuits Nirvana C 22

Underfill Adhesives for Flip Chip Applications 5-24f 3:15 pm–5:00 pm Brian Toleno, Ph.D., Henkel Corporation Utopia A 16 Task Group

High Frequency Test Methods Task Group: D-24c 3:15 pm–5:00 pm Mike Janezic, National Institute of Standards Knowledge 20 Frequency-Domain Methods and Technology

Committee Reception 5:00 pm–6:00 pm Sam&Harry’s Terrace*

Wednesday, September 23Speaker Ready Room 7:00 am–5:00 pm Utopia C

Attendee Registration 7:00 am–6:00 pm Foyer



First Timer’s Welcome Breakfast 7:30 am–8:15 am Utopia A 12


FREE! Opening Session: A Leaded Engineer in a 8:30 am–9:30 am David Hillman, Rockwell Collins Euphoria 12 Lead-Free World

Declaration Process Management Subcommittee 2-18 9:30 am–12:00 pm Eric Simmon, NIST Epiphany 18

Solder Paste Task Group 5-24b 9:30 am–12:00 pm Brian Toleno, Ph.D., Henkel Corporation Serenity 16

Conformal Coating Handbook Task Group 5-33c 9:30 am–12:00 pm Amy Hagnauer, Raytheon Company Imagination 18 Jason Keeping, Celestica

A-620 Technical Training Task Group 7-31ft 9:30 am–12:00 pm Debbie Wade, Advanced Rework Technology-A.R.T Utopia D 20

Covercoat Materials Task Group D-13b 9:30 am–12:00 pm Steve Musante, Raytheon Missile Systems Connection 19

High Speed/High Frequency Base Materials D-23 9:30 am–12:00 pm Edward Sandor, Taconic Advanced Dielectric Div . Prosperity 20 Subcommittee

Printed Board Storage and Handling Subcommittee D-35 9:30 am–12:00 pm C . Don Dupriest, Lockheed Martin Missiles and Nirvana C 22 Fire Control; Tom Kemp, Rockwell Collins

Embedded Component Materials Subcommittee D-52 9:30 am–12:00 pm David McGregor, E.I. du Pont de Nemours and Co. Innovation 19

Ribbon Cutting Ceremony Ribbon 9:45 am–10:00 am Exhibit Hall

Exhibit Hall Open 10:00 am–6:00 pm Exhibit Hall

Lead Free Model Cage Match S01 10:00 am–12:00 pm Carol Handwerker, Ph.D., Purdue University Euphoria 14

Strategies for Fighting Counterfeiting S02 10:00 am–12:00 pm James Williams, Polyonics, Inc. Utopia A 14

Challenges in Building a High Reliability Military PWB S03 10:00 am–12:00 pm Vern Solberg, STC-Madison Utopia B 14

Awards Luncheon 12:00 pm–1:30 pm Nirvana AB 12

Plating Processes Subcommittee 4-14 1:30 pm–3:00 pm George Milad, UIC/Uyemura International Corp. Nirvana C 19 Gerard O’Brien, Solderability Testing and Solutions

J-STD-001 Training Task Group 5-22bt 1:30 pm–3:00 pm Teresa Rowe, AAI Corporation Utopia D 16


Show Schedule


FF=Free Forum | PD= Educational Course | S=Conference Session

Flexible Circuits Base Materials Subcommittee D-13 1:30 pm–3:00 pm Clark Webster, ALL Flex Inc . Connection 19

Embedded Devices Test Methods Subcommittee D-54 1:30 pm–3:00 pm Jan Obrzut, Ph.D., NIST Innovation 19

IPC Solder Products Value Council: Alloy S04 1:30 pm–3:00 pm Karl Seelig, AIM, Inc . Euphoria 15 Testing and Take Action Limits

The Quality and Reliability View As Seen S05 1:30 pm–3:00 pm Dieter Bergman, IPC Utopia A 15 from the Assembly Line

Printed Board Reliability Issues S06 1:30 pm–3:00 pm Cheryl Tulkoff, DfR Solutions Utopia B 15

Marking, Symbols and Labels for Identification 4-34b 1:30 pm–5:00 pm Jasbir Bath, Bath Technical Consultancy Epiphany 19 of Assemblies, Components and Devices Task Group Jack McCullen, Intel Corporation Lee Wilmot, TTM Technologies, Inc .

Joint Meeting — Ionic Conductivity and Bare 5-32a/ 1:30 pm–5:00 pm Douglas Pauls, Rockwell Collins; Imagination 18 Board Cleanliness Task Groups 5-32c John Radman, Trace Laboratories East Denver

IPC-HDBK-620 Handbook Task Group 7-31h 1:30 pm–5:00 pm Randy McNutt, Northrop Grumman Corp. Serenity 16 Brett Miller, USA Harness, Inc.

Reliability and the Solder Interface S07 3:15 pm–4:45 pm Werner Engelmaier, Engelmaier Associates, L.C. Euphoria 15

Environmental Issues S08 3:15 pm–4:45 pm Fern Abrams, IPC Utopia A 15

High Frequency Printed Boards S09 3:15 pm–4:45 pm Duane Mahnke, Mahnke Consulting Utopia B 15

Process Effects Handbook Subcommittee 7-23 3:15 pm–5:00 pm Dennis Fritz, MacDermid, Inc. Innovation 20

IPC-A-610 Certification Technical Committee 7-31bt 3:15 pm–5:00 pm Mary Muller, Crane Aerospace & Electronics Utopia D 20

Flexible Circuits Design Subcommittee D-11 3:15 pm–5:00 pm William Ortloff, Raytheon Company Nirvana C 19

FREE! Show Floor Welcome Reception 5:00 pm–6:00 pm Exhibit Hall 12

Thursday, September 24Attendee Registration 7:00 am–5:00 pm Foyer



Manufacturing Process Declaration Task Group 2-18a 8:00 am–12:00 pm Fritz Byle, Astronautics Corp. of America Perfection 18

Packaging Declarations Exploratory Meeting 2-18x 8:00 am–12:00 pm Michael Hutchings, Sun Microsystems Imagination 18

SMT Component Placement Equipment Subcommittee 5-41 8:00 am–12:00 pm Michael Cieslinski, Panasonic Factory Connection 16 Solutions Company of America

IPC EMS Program Manager Training and 8:00 am–5:00 pm Ray Prasad, BeamWorks Inc . Serenity 23 Certification Program — EMS II

EMS Program Manager Training and Certification 8:00 am–5:00 pm Don Turner — Penn State Outreach Program Prosperity 23 Program — Leadership Training

FREE! IPC Technology Roadmap FF01 8:30 am–10:00 am Dieter Bergman, IPC Euphoria 13 Jack Fisher, InterconnectTechnology Analysis Joe Fjelstad, Verdant Electronics Dennis Fritz, MacDermid, Inc.

Stencil Printing Process for Solder Paste Application PD-01 9:00 am–12:00 pm S. Manian Ramkumar, Rochester Institute Utopia A 23 — An In-Depth Look of Technology

LGA and QFN Design, Assembly and Rework Guide PD-03 9:00 am–12:00 pm Bob Willis, ASKBobWillis.com Utopia B 23

Fundamentals of Solder Joint Reliability PD-05 9:00 am–12:00 pm Werner Engelmaier, Engelmaier Associates, L.C. Utopia C 23

DFM: When a Six Sigma Process Is Not Sufficient to PD-07 9:00 am–12:00 pm Dale Lee, Plexus Epiphany 23 Achieve a High Yielding Manufacturing Process


Show Schedule


Access the show schedule and a list of exhibitors from your mobile device at www .IPCMidwestShow .org/mobile .

Event Title Code Time Chair/Moderator Room PageExhibit Hall Open 10:00 am–4:00 pm Exhibit Hall

Joint Meeting — UL/CSA and UL 796F and UL 746F 3-11f/ 10:00 am–12:00 pm Jack Bramel, Jack Bramel & Associates Utopia D 22 Task Groups D-12a Duane Mahnke, Mahnke Consulting

FREE! Cross-Sectional Preparation of FF 10:15 am–11:00 am Richard Wagner and Gabe Lucas, Buehler Ltd. Exhibit Hall 13 Specialty and Problematic Components Booth 731

FREE! Advanced Applications of XRF for FF 11:00 am–11:45 am Paul Lomax, Fischer Technology Inc. Exhibit Hall 13 Lead Detection on Electronic Assemblies Booth 731

FREE! Are the Test Results in Your C of C Still FF 11:45 am–12:30 pm Debby Obitz, John Radman and Exhibit Hall 13 Applicable to the Products You Are Buying? Renee Michalkiewicz, Trace Laboratories Booth 731

FREE! Implementing the New IPC Thermal FF 12:30 pm–1:15 pm Chris Mahanna, Robisan Laboratory Exhibit Hall 13 Stress, Convection Reflow Assembly Simulation Booth 731 Test Method, IPC-TM-650, Method 2.6.27

Joint Meeting — Roadmap Steering and Planning 8-40/ 1:00 pm–5:00 pm Jack Fisher, Interconnect Technology Analysis, Inc. Perfection 20 Committee and JISSO North America Council JNAC Dennis Fritz, MacDermid, Inc.

FREE! Analytical Methods of Detecting Lead in FF 1:15 pm–2:00 pm Mike Fredrickson and Carmine Meola, Exhibit Hall 13 Electronic Assemblies ACI Technologies Inc. Booth 731

Solder Products Value Council SPVC 1:30 pm–5:00 pm Karl Seelig, AIM, Inc . Imagination 20

FREE! Failures Resulting from Cleanliness: FF 2:00 pm–2:45 pm Joe Russeau, Precision Analytical Exhibit Hall 13 What to Test? Laboratory, Inc. Booth 731

FREE! Creep Corrosion — Immersion Silver FF 2:45 pm–3:30 pm Terry Munson, Foresite Exhibit Hall 13 Corrosion Issues Booth 731

Troubleshooting Your PCB Assembly Yields — On-Site PD-02 2:00 pm–5:00 pm Bob Willis, ASKBobWillis.com Utopia A 23 or Offshore

Advanced Component Packages and Processes PD-04 2:00 pm–5:00 pm S. Manian Ramkumar, Rochester Institute Utopia B 23 of Technology

Final Finishes and Their Compatibility with PD-06 2:00 pm–5:00 pm Michael Carano, OMG Electronic Chemicals Utopia C 23 Lead-Free Assembly

Accelerated Thermal Cycling and Acceleration Factors PD-08 2:00 pm–5:00 pm Jean-Paul Clech, Ph.D., EPSI Epiphany 23 for Lead-Free Surface Mount Assemblies

Industry Advisory Group Meeting for UL UL-IAG 2:00 pm–5:00 pm Jeff Brandt, Underwriters Laboratories Inc. Utopia D 22

Friday, September 25Certified Interconnect Designer (CID) Workshop 8:00 am–5:00 pm Dieter Bergman, IPC Connection 23

IPC EMS Program Manager Training and 8:00 am–5:00 pm Ray Prasad, BeamWorks Inc . Serenity 23 Certification Program — EMS II

EMS Program Manager Training and Certification 8:00 am–5:00 pm Don Turner — Penn State Outreach Program Prosperity 23 Program — Leadership Training

Saturday, September 26EMS Program Manager Training and Certification 8:00 am–12:00 pm Prosperity 23 Program — Exam

Certified Interconnect Designer (CID) Workshop 8:00 am–5:00 pm Dieter Bergman, IPC Serenity 23

Sunday, September 27Advanced Certified Interconnect Designer (CID+) Exam 8:00 am–12:00 pm Dieter Bergman, IPC Serenity 23

Certified Interconnect Designer (CID) Exam 8:00 am–1:00 pm Dieter Bergman, IPC Serenity 23


Technical Conference

Renaissance Schaumburg Hotel & Convention Center1551 Thoreau Drive Schaumburg, IL 60173 +1 847-303-4100

Parking is complimentary . The charge for valet parking is $14 per day .

Business CenterA full-service business center is available in the hotel near the escalators on the first floor . The center is open 24 hours with keycard access . A technician will be on-site Monday through Friday between the hours of 7:00 am and 5:00 pm.

Registration HoursSunday, September 20 . . . . . . . . . . . . . . . . . . . . . . 7:00 am–5:00 pmMonday, September 21 . . . . . . . . . . . . . . . . . . . . . 7:00 am–5:00 pmTuesday, September 22 . . . . . . . . . . . . . . . . . . . . . 7:00 am–5:00 pmWednesday, September 23 . . . . . . . . . . . . . . . . . . 7:00 am–6:00 pmThursday, September 24 . . . . . . . . . . . . . . . . . . . . 7:00 am–4:00 pm

Speaker Ready Room Utopia DWednesday, September 23 . . . . . . . . . . . . . . . . . . 7:30 am–5:00 pm

Exhibit Hall HoursWednesday, September 23 . . . . . . . . . . . . . . . . . . 10:00 am–6:00 pmThursday, September 24 . . . . . . . . . . . . . . . . . . . . 10:00 am–4:00 pm

Press OfficeWednesday, September 23 . . . . . . . . . . . . . . . . . . . 8:00 am–5:00 pmThursday, September 24 . . . . . . . . . . . . . . . . . . . . . 8:00 am–5:00 pm

+ First Aid is located by Adventure Hall .

Photography and Videography PolicyStill photography and video recording of any exhibit or function is prohibited within the exhibit hall, meeting rooms and lobbies . This applies to both exhibitors and attendees . Show Management, the official photographer and accredited members of the news media are exempt from this rule . Any photography during show hours must be ordered through CGPA Photography, the official photographer for the event. Exhibitors may take pictures of their own booth before and after show hours only . Photos taken by Show Management may be used in future promotional materials .

Event PoliciesChildren under the age of 18 are allowed on the trade show floor only during exhibit hall hours .

SuitcasingIPC does not permit solicitation by nonexhibiting companies . Any individual who is observed participating in activities to solicit or sell products to event attendees or exhibitors without having a booth at the event (known as “suitcasing”) will be asked to leave .

HospitalityFor more than 50 years, IPC has been consistent in its policy requesting that no one conduct or sponsor hospitality suites or functions at IPC events in order to preserve the focus on education, technology and standards de-velopment . Therefore, any function that is not part of the “official program” is prohibited during event hours . For details related to event policies, visit www .IPCMidwestShow .org/policies .

General Information

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Conference Notepad Sponsor

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Thanks to Our Sponsors!


Schaumburg Area Information

TaxiCall for a taxi through American Taxi at +1 847-253-4411.

FREE TrolleyThe Trolley offers free transportation with pickup directly in front of the Renaissance Schaumburg Hotel to seven local destinations: • IKEA • Roosevelt University • Woodfield Village Green (shopping center) • Costco • Woodfield Mall (two stops) • Streets of Woodfield (shopping center) •Pace Northwest Transportation Center.

Trolley service is available every 30 minutes, Friday–Sunday .

Trolley Hours of OperationFriday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12:00 pm–9:00 pm Saturday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10:00 am–9:00 pm Sunday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11:00 am–6:00 pm

PACE Dial-a-Ride Transportation (DART)As an alternative to the Trolley (and for use on weekdays), the Village of Schaumburg sponsors the PACE Dial-a-Ride Transportation Service throughout the operating area of the Trolley . One-way rates are approximately $1 .60 (subject to change) . To schedule a ride, call +1 847-352-8097. Advance reservation of 90 minutes is required.

PACE DART Hours of Operations Monday–Friday . . . . . . . . . . . . . . . . . . . . . . . . . 6:00 am–9:30 pm Saturday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9:00 am–6:00 pm

For more information about things to do and see while in Schaumburg (and valuable coupons!), visit www .chicagonorthwest .com .

Explore Chicago!Use the RTA (Regional Transportation Authority) Transportation and Itinerary Scheduler to make the most of your visit to the Chicago Metropolitan area. Visit www.GoRoo.com.

IPC A-Line

Check out the A-Line in the Exhibit Hall and see assembly in action! Follow a product from screen printing to component mounting (through hole and surface mount), and then through reflow — all while learning about the processes, equipment (and end-item cleaning) that were used to manufacture the assembly . At the end of the line, you’ll get a finished assembly thanks to our participating companies:

General Information Special Events

Streets of Woodfield Photo credit: Pete Hruda


Special Events

On the Show Floor

IPC Bookstore Booth # 331Informational resources to enhance the work you do, help train your staff and support your company’s strategic planning efforts are waiting for you in the IPC bookstore on the show floor .

Browse industry standards on design, board fabrication • and assembly .

Check out IPC training and certification programs .•

Review IPC’s catalog of multimedia training resources, including • DVDs, interactive CD-ROMs, online video resources, training and reference guides, wall posters and image archives .

Learn about IPC’s management programs, market research reports • and technology roadmaps .

Member prices will be extended to all attendees on-site, even if you aren’t one! And, save 25% on all IPC training DVDs … any quantity … any IPC title … only during show hours . While you’re at the bookstore, pick up a new IPC publications catalog and a free standards development CD .

Free Internet LoungeWe know you’re invaluable to your office, so go ahead and catch up with your office . Convenient, FREE access to the Internet will be available in the exhibit hall to help your show experience go smoothly .

Prefer Wi-Fi access? Contact Swank AV for service at the IPC registration desk . $10/day or $20 for 2 or more days .

FREE First-Timers’ Utopia A Welcome BreakfastWednesday, September 23 . . . . . . . . . . . . . . . . . . . 7:30 am–8:15 amWake up to breakfast replete with networking opportunities and informa-tion to make the most of your visit to the show . Find out how IPC resources and involvement in IPC can boost your career and benefit your company .

Luncheons (Registration required) Nirvana ABMonday, September 21 . . . . . . . . . . . . . . . . . . . . . 12:00 pm–1:30 pmTuesday, September 22 . . . . . . . . . . . . . . . . . . . . . 12:00 pm–1:30 pmWednesday, September 23 . . . . . . . . . . . . . . . . . . 12:00 pm–1:30 pm

Join your industry colleagues for lunch and make new friends and business contacts . Luncheons on Monday and Tuesday will recognize committee members and leaders with special recognition, committee leadership and distinguished committee service awards .

On Wednesday, IPC will present the coveted IPC Presidents Award to George Milad, Uyemura International Corp., for his long-term contribu-tions to IPC . In addition, Endicott Interconnect Technologies and Lockheed Martin will be recognized for 50 years of continuous membership .

FREE Opening Session: A Leaded Engineer in a Lead-Free World EuphoriaWednesday, September 23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8:30 am–9:30 amModerator: Dave Hillman, Rockwell CollinsPanelists: Linda Woody, Lockheed Martin Missile & Fire Control

Carol Handwerker, Sc.D., Purdue University Stephan Meschter, Ph.D., BAE Systems Platform Solutions Mark Fulcher, Continental AG

Lead-free assembly is here and growing in size and scope in many, but not necessarily all, product areas . Even with RoHS, there are products that are exempt from lead-free use . What is the view from these last bastions of tin-lead? How do designers and component and manufacturing engineers deal with a world that is becoming lead free while they’re still operating in leaded mode? Our panel of experts will fill you in on how they and their companies are coping with manufacturing RoHS-exempt product in a world where lead free is becoming the norm .

Show Floor ReceptionWednesday, September 23 . . . . . . . . . . . . . . . . . . . . . .5:00 pm–6:00 pmEnjoy a casual stroll through the exhibit floor and get familiar with the companies, products and services that can help you with your work . Celebrate friendships, new and old, and enjoy the company of colleagues that keep our industry vital .


IPC Technology Roadmap Free Forum EuphoriaThursday, September 24 8:30 am–10:00 am Moderator: Jack Fisher, Interconnect Technology Analysis, Inc. Panelists: Dieter Bergman, IPC, Joe Fjelstad, Verdant Electron-ics, Denny Fritz, MacDermid, Inc.Learn how you can put this critical tool for strategic planning to work for your company . The IPC International Technology Roadmap provides vision and direction for companies in the electronics manufacturing industry . It encompasses the future supply chain infrastructure needed for single chip and multichip packaging, printed board issues, assembly considerations, optoelectronics and related management/environmental key pressure points, and even includes a technical driver software tool so long-range planners can compare their current offerings with the technology needs of tomorrow .

Acceptability, Reliability and On the Show Floor Failure Analysis Free Forums Booth 731Thursday, September 24 10:15 am-3:30 pm After a product has been successfully built, delivered to the customer, and put in the field, something really bad can happen — it can come back. Failure analysis has always been on the final frontier of electronics assembly, but at IPC Midwest, we’re bringing it to the front of the line .

Learn the intricacies of ensuring reliability throughout the lifecycle of elec-tronic products and systems as the world’s foremost failure analysts present technical case studies and provide how-to guidance:

10:15 am Cross-Sectional Preparation of Specialty and Problematic Components Richard Wagner and Gabe Lucas, Buehler Ltd.

Explore cross-sectioning techniques for identification of failure sites and verification of failure mechanisms through actual case studies .

11:00 am Advanced Applications of XRF for Lead Detection on Electronic Assemblies Paul Lomax, Fischer Technology Inc.

RoHS regulations have forced component suppliers to provide components with many different solder finishes . Review a new technique for reliably identifying unknown samples of material for the presence of lead utilizing XRF instrumentation .

11:45 am Are the Test Results in Your C of C Still Applicable to the Products You Are Buying? Debby Obitz, John Radman and Renee Michalkiewicz, Trace Laboratories

What happens when materials tested don’t meet the require-ments of the specification that the Certificate of Compliance (C of C) states have been met? Learn which material purchases are the largest risks for the OEM and determine what questions need to be asked when receiving that C of C .

12:30 pm Implementing the New IPC Thermal Stress, Convection Reflow Assembly Simulation Test Method, IPC-TM-650, Method 2.6.27 Chris Mahanna, Robisan Laboratory

Get a handle on the implementation, qualification and ongoing verification of IPC’s new industry test method that simulates convection reflow rather than traditional wave soldering

1:15 pm Analytical Methods of Detecting Lead in Electronic Assemblies Mike Fredrickson and Carmine Meola, ACI Technologies Inc.

Understand recent advances in nondestructive methods of quanti-fying lead in electronic products through spectroscopy, fluores-cence and other elemental analysis .

2:00 pm Failures Resulting from Cleanliness: What to Test? Joe Russeau, Precision Analytical Laboratory, Inc.

Identify how failures resulting from cleanliness can be among the most difficult to diagnose, and address the disconnect between understanding what causes a fault and identifying the origin of the residue(s) that played a role in the fault .

2:45 pm Creep Corrosion — Immersion Silver Corrosion Issues Terry Munson, Foresite

Immersion silver has emerged as a cost effective replacement for HASL surface finishes with long shelf life protection, but its exposure to sulfur rich environments with moderate amounts of humidity can lead to a very distinct chemical reaction called “Creep Corrosion .” See how cleaning to remove corrosion and other contaminates prior to conformal coat applications is proving to be very effective .

Free Forums



FREE! Opening Session: Euphoria A Leaded Engineer in a Lead Free WorldWednesday, September 23 8:30 am–9:30 am David Hillman, Rockwell CollinsLead-free assembly is here and growing in size and scope in many, but not necessarily all prod-uct areas . Even with RoHS, there are products that are exempt from lead-free use . What is the view from these last bastions of tin-lead? How do designers and component and manufacturing engineers deal with a world that is becoming lead free while they’re still operating in leaded mode? Our panel of experts will fill you in on how they and their companies are coping with manufacturing RoHS-exempt product in a world where lead free is becoming the norm .

Take advantage of the Midwest’s premier technical conference to build your knowledge base, network with peers and stimulate ideas for new ways to approach your challenges. Registration is required.

S01 Lead Free Model Cage Match EuphoriaWednesday, September 23 10:00 am–12:00 pmCarol Handwerker, Ph.D., Purdue UniversityTin-lead solder is a well understood system with more than thirty years of reliability models development behind it . Lead-free solders are not so well understood . There have been attempts to develop models, but how successful have they been? Join us for some heated debate on what works and what doesn’t in lead-free systems .

• Solder Creep-Fatigue Model Parameters for SAC and SnAg Lead-Free Solder Joint Reliability Estimation Werner Engelmaier, Engelmaier Associates, L.C.

• Constitutive and Failure Behavior of SnAgCu Solder Joints Ganesh Subbaraya, Purdue University

• Filling in the Gaps in Lead-Free Reliability Modeling and Testing Jean-Paul Clech, Ph.D., EPSI

S02 Strategies for Fighting Counterfeiting Utopia AWednesday, September 23 10:00 am–12:00 pmJames Williams, Polyonics, Inc.Counterfeiting of components has become a serious issue . Learn how to fight counterfeiting from our distinguished panelists. Join us for a timely discussion of what to do about a very serious problem .

• Debra Eggeman, IDEA• Richard Stanton, Symetrics Industries• Dennis Fritz, MacDermid, Inc.

S03 Challenges in Building a High Reliability Military PWB Utopia BWednesday, September 23 10:00 am–12:00 pmVern Solberg, STC-MadisonReliability in mission-critical systems is a matter of life and death . This first of two sessions on reliability, will dissect the critical components of reliability for the printed board . If you are concerned about board reliability in the harsher manufacturing environments of lead free, this session is for you .

• Impact of Converting Flex Circuits from HASL to RoHS-Compliant Surface Finishes Al Wasserzug, Vulcan Flex Circuit Corporation

• Design Considerations for High Reliability PCB Raj Kumar, Dynamic Details, Inc.

• Lead-Free Reflow, PCB Degradation and the Influence of Moisture Absorption Cheryl Tulkoff, DfR Solutions

Lead Free Technologies

S01 Lead Free Model Cage Match

S04 IPC Solder Products Value Council: Alloy Testing and Take Action Limits

S07 Reliability and the Solder Interface

PCB Fabrication

S03 Challenges in Building a High Reliability Military PWB

S06 Printed Board Reliability Issues

S09 High Frequency Printed Boards

Assembly Processing

S05 The Quality and Reliability View As Seen From the Assembly Line

Supply Chain / Business Issues

S02 Strategies for Fighting Counterfeiting

Environmental

S08 Environmental Issues

Quality and Reliability

S01 Lead Free Model Cage Match

S03 Challenges in Building a High Reliability Military PWB

S05 The Quality and Reliability View As Seen From the Assembly Line

S06 Printed Board Reliability Issues

S07 Reliability and the Solder Interface

Standards Development Meetings



S04 IPC Solder Products Value Council: Alloy Euphoria Testing and Take Action Limits

Wednesday, September 23 1:30 pm–3:00 pmKarl Seelig, AIM, Inc.This session highlights the IPC Solder Products Value Council’s latest work on take action limits (TAL) for lead-free solder pot contamination and in develop-ing industry consensus on test methods for lead-free alloy comparison .

• Proposed Standardization of Lead-Free Alloy Testing Karl Seelig, AIM, Inc.

• Take Action Limits for SAC 305 Lead-Free Automated Soldering Processes Howard Stevens, Metallic Resources Inc.

• Vibration and Mechanical Shock Testing Thomas Woodrow, Ph.D., The Boeing Company

S05 The Quality and Reliability View As Seen Utopia A From the Assembly Line

Wednesday, September 23 1:30 pm–3:00 pmDieter Bergman, IPCWhat are the defining quality and reliability issues at manufacturing and test? Our speakers will guide you through the roadblocks and hurdles they have seen in their years of striving to keep the flag of quality and reliability flying over the manufacturing line .

• Implementing Quality and Reliability on the Assembly Line David Bergman, IPC

• High Performance Work Teams in EMS: The Critical Difference Leo Reynolds, Reynolds Consulting

• Manufacturing Quality Issues from the EMS Perspective Bill Barthel, Plexus Corp.

S06 Printed Board Reliability Issues Utopia BWednesday, September 23 1:30 pm–3:00 pmCheryl Tulkoff, DfR SolutionsIn our second session on board reliability, we expand on the issues for via reliability and the transition of telecom products into the era of lead free. Join us for the latest information .

• Microvia Reliability Failure Modes Paul Reid, PWB Interconnect Solutions Inc.

• Bare Board Material Performance After Lead-Free Reflow Ted Lach, Alcatel-Lucent

• Water Vapor Uptake and Release in Printed Boards Joseph Kane, BAE Systems Platform Solutions

S07 Reliability and the Solder Interface EuphoriaWednesday, September 23 3:15 pm–4:45 pmWerner Engelmaier, Engelmaier Associates, L.C.In this session, three speakers will guide you through some of the critical issues that influence the reliability of your solder joints .

• Why Electroless Palladium? Study on Impact of Electroless Palladium on Electroless Nickel Deposits Eric Stafstrom, Technic, Inc.

• A Study of Solder Optimization Development for Portable Electronic Devices Lee Hyun-Kyu, DUKSAN HI-METAL CO., LTD

• The Role of the Interfacial Intermetallic in Lead-free Solders Keith Howell, Nihon Superior USA

S08 Environmental Issues Utopia AWednesday, September 23 3:15 pm–4:45 pmFern Abrams, IPCKeeping tabs on ever-changing environmental regulations and customer prod-uct requirements is a major effort for the entire electronic supply chain . This session will review the growing number of worldwide regulations restricting the use of substances in products, and how standards making organizations are working to develop supply chain compliance tools, such as materials declaration standards .

• REACH, RoHS, TSCA — What’s Next? John Ciba, Brady Corporation

• International Environmental Standards for the Electronics Industry Walter Jager, Intertek

• Materials Declaration: Practical Tips for Cutting Through the Paperwork N. Nagaraj, Papros Inc.

S09 High Frequency Printed Boards Utopia BWednesday, September 23 3:15 pm–4:45 pmDuane Mahnke, Mahnke ConsultingThis session takes you from the board surface to the base material and into the fiber weave to do a complete look at what makes a high frequency board tick. Join us for a session of insight and innovation.

• High Frequency Materials Used in the PCB Industry John Coonrod, Rogers Corporation

• A Closer Look at Why Cleaning Prior to Conformal Coating is Key in Aspects of Climatic Reliability Jigar Patel, ZESTRON America

• Opening Eyes on Fiber Weave and CAF John Kuhn, Dielectric Solutions, LLC

Keep the Learning Going!We hope to see you at these upcoming 2009 events:

October 21–22 IPC Electronics Industry Executive Summit Scottsdale, Ariz .

November 9 “It’s Not Easy Being Green:” Complying with Changing Global Environmental Laws Conference Irvine, Calif .

November 10 IPC Materials Conference: Engineering for Compliance Irvine, Calif .

November 17-18 LEAN for Electronics Engineers Conference: Taking LEAN from the Executive Suite to the Floor Phoenix, Ariz .

December 9-10 IPC Technology Interchange — The North American PCB Industry: It Can and Will Support the Military Market Washington DC

Visit www .ipc .org/events for more information .



Assembly and Joining Processes

5-20 Assembly and Joining Processes Committee (By Invitation)

Sunday, September 20 4:30 pm–6:00 pm Schaumburg GHLeo Lambert, EPTAC CorporationThis is a planning meeting for the leaders of the Assembly and Joining Processes Committee.

5-21h Bottom Termination Components (BTCs) Task Group

Tuesday, September 22 9:30 am–5:00 pm EpiphanyRay Prasad, BeamWorks Inc.; Vern Solberg, STC-MadisonThis new task group is developing a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing bottom termination components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body .

5-22a J-STD-001 Task GroupSunday, September 20 8:00 am–2:30 pm Schaumburg GHTeresa Rowe, AAI CorporationThis task group is developing revision E to IPC J-STD-001. The leaders hope to be able to close all comments and action items as a prelude to ballot .

5-22a/ Joint Meeting of J-STD-001 7-31b and IPC-A-610 Task GroupsMonday, September 21 9:00 am–5:00 pm Nirvana CJennifer Day, Stanley Associates, U.S. Army Redstone Arsenal; Constantino Gonzalez, ACME Training & Consulting; Teresa Rowe, AAI CorporationThis is a joint working group to resolve comments common to revision E of both J-STD-001 and IPC-A-610 .

5-22as Space Electronic Assemblies J-STD-001 Addendum Task Group

Tuesday, September 22 8:00 am–10:00 am ImaginationGarry McGuire, NASA Marshall Space Flight CenterThis task group will be celebrating publication of a revision to Space Applications Electronics Hardware Addendum for J-STD-001D and will immediately begin work on the addendum for J-STD-001E.

5-22bt J-STD-001 Training Task GroupWednesday, September 23 1:30 pm–3:00 pm Utopia DTeresa Rowe, AAI CorporationThis task group will review progress toward updating the J-STD-001DS space addendum unique training and develop an outline for J-STD-001E training update.

5-23a Printed Circuit Board Solderability Specifications Task Group

Monday, September 21 1:30 pm–5:00 pm EuphoriaGerard O’Brien, Solderability Testing and Solutions Inc.This task group is working on the C revision of J-STD-003B which will address more wetting balance data generation and include a solder spread test protocol .

5-23b Component and Wire Solderability Specification Task Group

Monday, September 21 8:00 am–12:00 pm EuphoriaDavid Hillman, Rockwell CollinsThis task group is working on consolidating IPC/ECA J-STD-002C and JESD 22-B102 (JEDEC document on same topic) into a single document .

5-24a Flux Specifications Task GroupTuesday, September 22 10:15 am–12:00 pm Utopia ARenee Michalkiewicz, Trace Laboratories–EastThis task group will begin the revision of J-STD-004B.

5-24b Solder Paste Task GroupWednesday, September 23 9:30 am–12:00 pm SerenityBrian Toleno, Ph.D., Henkel CorporationThis task group is continuing work on revision A of J-STD-005.

5-24c Solder Alloy Task GroupTuesday, September 22 1:30 pm–3:00 pm Utopia ADavid Scheiner, KesterThis task group is revising J-STD-006C.

5-24f Underfill Adhesives for Flip Chip Applications Task Group

Tuesday, September 22 3:15 pm–5:00 pm Utopia ABrian Toleno, Ph.D., Henkel CorporationThis task group is updating J-STD-030.

7-31h IPC-HDBK-620 Handbook Task Group

Wednesday, September 23 1:30 pm–5:00 pm SerenityRandy McNutt, Northrop Grumman Corp.; Brett Miller, USA Harness, Inc.This task group is developing a handbook to support users of IPC/WHMA-A-620 .

7-35 Assembly and Joining Handbook Subcommittee

Tuesday, September 22 8:00 am–5:00 pm Utopia DMary Muller, Crane Aerospace & Electron-ics; Guy Ramsey, R & D AssemblyThis subcommittee is nearing completion of a major update to IPC-AJ-820 that now incorporates the best parts of IPC-HDBK-001, IPC-PE-740, IPC-HDBK-830, IPC-CM-770, and the component identification desk reference manual DRM-18 .

Assembly Equipment

5-41 SMT Component Placement Equipment Subcommittee

Thursday, September 24 8:00 am–12:00 pm ConnectionMichael Cieslinski, Panasonic Factory Solutions Company of AmericaThis committee is developing revision A to IPC-9850 to incorporate pick and place equipment technologies .


Get involved in the development of industry standards used by your company, customers, competitors and suppliers. Anyone in the industry is welcome to register and attend the standards development committee meetings, except for meetings listed as “By Invitation.” Registration is required.


Base Materials

3-11 Laminate/Prepreg Materials Subcommittee

Monday, September 21 8:00 am–12:00 pm Utopia ATony Senese, Panasonic Electric DivisionThis subcommittee is revising IPC-4101C .

3-11g Corrosion of Metal Finishes Task Group

Tuesday, September 22 8:00 am–10:00 am Utopia ABeverley Christian, Ph.D., Research In Motion LimitedThis task group is exploring and gathering data on the effects of corrosion on surface finishes .

3-12a Metallic Foil Task GroupTuesday, September 22 8:00 am–10:00 am EuphoriaRolland Savage, High Performance Copper Foil Inc.This task group is gathering data on copper foil surface roughness measurements for possible inclusion in revision B of IPC-4562 .

3-12d Woven Glass Reinforcement Task Group

Monday, September 21 1:30 pm–3:00 pm Utopia APatricia Goldman, Dielectric Solutions, LLCThis task group continues to explore the dielectric constant (permittivity) for E-glass and will examine the data obtained from testing this property by glass fiber manufacturers for possible inclusion into IPC-4412 .

3-12e Base Materials Roundtable Task Group

Monday, September 21 3:15 pm–5:00 pm Utopia AEdward Kelley, Isola Group SARLThis task group will explore needed specifications and characterization methods for strategic materials used to manufacture laminates and prepregs .

Cleaning and Coating

5-30 IPC Cleaning and Coating Committee

Monday, September 21 8:00 am–9:00 am InnovationDouglas Pauls, Rockwell Collins; Debora Obitz, Trace Laboratories–East This open session will feature a presentation on all its task group and subcommittee activities .

5-31 Cleaning & Alternatives Subcommittee

Tuesday, September 22 8:00 am–12:00 pm ConnectionMike Bixenman, Kyzen CorporationThis subcommittee is combining and updating four cleaning handbooks into a single document . The base documents are IPC-SC-60, IPC-SA-61, IPC-AC-62, and IPC-CH-65 .


5-32a/ Joint Meeting — Ionic 5-32c Conductivity and Bare Board

Cleanliness Task GroupsWednesday, September 23 1:30 pm–5:00 pm ImaginationDouglas Pauls, Rockwell Collins; John Radman, Trace Laboratories East Denver; Joe Russeau, Precision Analytical Laboratory, Inc.This joint meeting will address the completion of IPC-5704 on cleanliness assessment requirements for printed board fabricators and new test methods for ionic cleanliness .

5-32b SIR and Electrochemical Migration Task Group

Monday, September 21 1:30 pm–5:00 pm InnovationChris Mahanna, Robisan Laboratory Inc.; Graham Naisbitt, Gen3 Systems Limited; Russell Shepherd, Microtek LaboratoriesThis task group is developing a user guide for the IPC-B-52 SIR test board and reviewing international efforts on SIR and CAF .

5-32e Conductive Anodic Filament (CAF) Task Group

Tuesday, September 22 1:30 pm–3:00 pm Utopia BKarl Sauter, Sun Microsystems, Inc.This task group will consider comments to revision B, of IPC-9691A .

5-33c Conformal Coating Handbook Task Group

Wednesday, September 23 9:30 am–12:00 pm ImaginationAmy Hagnauer, Raytheon Company; Jason Keeping, Celestica; Fonda Wu, Raytheon CompanyThis task group is developing revision A to IPC-HDBK-830 .

5-33f Potting and Encapsulation Task Group

Monday, September 21 9:00 am–10:00 am InnovationDouglas Pauls, Rockwell CollinsThis newly formed task group is evaluating industry needs for potting and encapsulation of conformal coatings .

Data Generation & Transfer/Documentation

2-18 Declaration Process Management Subcommittee

Wednesday, September 23 9:30 am–12:00 pm EpiphanyEric Simmon, NISTThis subcommittee has developed IPC-1751 for supplier data exchanges, including materials declarations (IPC-1752) and manufacturing process declarations (IPC-1756), and will review the XML schema for all supplier declaration standards .

2-18a Manufacturing Process Declaration Task Group

Thursday, September 24 8:00 am–12:00 pm PerfectionFritz Byle, Astronautics Corp. of AmericaThis task group will discuss the development of a standard for the exchange of manufacturing process information, such as moisture sensitivity level, lead finish, and tin whisker mitigation .

2-18b Materials Declaration Task Group

Tuesday, September 22 8:00 am–5:00 pm InnovationMark Frimann, Texas Instruments Inc.This task group will review proposed revision 2 .0 of the materials declaration standard IPC-1752. Changes include multiple-part declarations and updating the data for global material restrictions beyond RoHS .

2-18x Packaging Declarations Exploratory Meeting

Thursday, September 24 8:00 am–12:00 pm ImaginationMichael Hutchings, Sun MicrosystemsThis is an exploratory meeting to determine the level of interest in the development of a data exchange standard for packaging/packing materials . The standard could address use of restricted materials as well as recycling, material content, applicable standards and laws, labels, etc .

Data Generation & Transfer/Shop Floor Communication

2-10/ Joint Meeting — Data 2-13 Generation and Transfer

Committee and Shop Floor Communication Subcommittee

Monday, September 21 1:30 pm–5:00 pm EpiphanyAndrew Dugenske, Georgia Institute of Technology; Gary Ferrari, FTG Circuits; Karen McConnell, Lockheed MartinThe 2-10 committee oversees all CAD, CAM and CAE data transfer standards described in the IPC-25XX series . The 2-13 subcommittee will discuss the IPC-2540 standards and their implications for both end-users and equipment suppliers on the factory floor .

Electronic Documentation Technology

2-40 Electronic Documentation Technology Committee

Monday, September 21 8:00 am–12:00 pm EpiphanyBryan Truax, CADParts & Consulting, LLCThe 2-40 committee covers documentation (IPC-2610 series) which includes hard copy, electronic copy and machine .

Embedded Components

CRANE Embedded Passives Committee (By Invitation)Tuesday, September 22 10:15 am–12:00 pm EuphoriaJason Ferguson, NSWC Crane; Richard Snogren, Bristlecone LLCStatus on current test vehicles will be presented, including the tv2 process demonstration, high frequency and resistor learning test vehicles . The emulator project will also be presented to encourage candidate designs for embedded passive integration .




D-51 Embedded Devices Design Subcommittee

Tuesday, September 22 8:00 am–10:00 am KnowledgeGary Ferrari, FTG Circuits; Richard Snogren, Bristlecone LLCThis subcommittee is developing a working draft of IPC-2227.

D-52 Embedded Component Materials Subcommittee

Wednesday, September 23 9:30 am–12:00 pm InnovationDavid McGregor, E.I. du Pont de Nemours and Co.This subcommittee is pursuing Amendment 1 to IPC-4821 and is continuing to address material impacts from the possible incorporation of active embedded components .

D-54 Embedded Devices Test Methods Subcommittee

Wednesday, September 23 1:30 pm–3:00 pm InnovationJan Obrzut, Ph.D., NISTThis subcommittee is developing test methods to address design, material and performance issues related to embedded passive devices used in printed boards and specifically, a power rating for embedded resistors .

Environment, Health & Safety (EHS)

4-33 Halogen-Free Materials Subcommittee

Tuesday, September 22 10:15 am–12:00 pm Utopia BDouglas Sober, Kaneka Texas CorporationThis subcommittee will consider new comments for revision B of the white paper/technical report on low-halogen base materials . This paper/report focuses on the legislative, marketing and environmental pressures to remove halogenated flame retardants from PCBs and electronic assemblies .

4-33a Low-Halogen Electronics Standard Task Group

Monday, September 21 1:30 pm–5:00 pm Utopia CDScott O’Connell, Dell; Stephen Tisdale, Intel Corp.This task group will review the draft standard on the definition of low-halogen electronics, including printed circuit boards, components, electronics assemblies, cables and mechanical plastics .

4-34b Marking, Symbols and Labels for Identification of Assemblies, Components and Devices Task Group

Wednesday, September 23 1:30 pm–5:00 pm EpiphanyJasbir Bath, Bath Technical Consultancy; Jack McCullen, Intel Corporation;Lee Wilmot, TTM Technologies, Inc.This combined working group of IPC and JEDEC will review IPC/JEDEC J-STD-609.

Fabrication Processes

4-14 Plating Processes SubcommitteeWednesday, September 23 1:30 pm–3:00 pm Nirvana CGeorge Milad, UIC/Uyemura International Corp.; Gerard O’Brien, Solderability Testing and Solutions Inc.This subcommittee develops guidelines, test methods and techniques for evaluating process control parameters on electrolytic and electroless/immersion plating . The subcommittee is continuing its work on IPC-4555 . In addition, the group will celebrate the release of IPC-4553A .

Flexible Circuits

D-11 Flexible Circuits Design Subcommittee

Wednesday, September 23 3:15 pm–5:00 pm Nirvana CMark Finstad, Minco Products, Inc.; William Ortloff, Raytheon CompanyThis subcommittee is initiating revision C of IPC-2223 that will include a new addendum providing design guidance/tutorials for the board designer .

D-12 Flexible Circuits Specifications Subcommittee

Tuesday, September 22 10:15 am–12:00 pm KnowledgeNick Koop, Minco Products Inc.; Mahendra Gandhi, Northrop Grumman Aerospace Systems This subcommittee is developing HDI acceptance criteria for IPC-6013 .

D-13 Flexible Circuits Base Materials Subcommittee

Wednesday, September 23 1:30 pm–3:00 pm ConnectionClark Webster, ALL Flex Inc.This subcommittee maintains IPC-4202, IPC-4203, and IPC-4204 . All three documents are being revised and balloting will begin this spring .

D-13b Covercoat Materials Task GroupWednesday, September 23 9:30 am–12:00 pm ConnectionSteve Musante, Raytheon Missile SystemsThis new task group will pursue the addition of one (or more) specification sheet(s) to IPC-4203 . The new specification sheets will address various liquid applied covercoat materials that are subsequently cured through photo and/or thermal exposure and need to be fully characterized as both flame resistant and electrically insulating .

D-15 Flexible Circuits Test Methods Subcommittee

Tuesday, September 22 1:30 pm–5:00 pm EuphoriaRocky Hilburn, CAC, Inc; Duane Mahnke, Mahnke ConsultingThis subcommittee provides test methods required by the other subcommittees within the D-10 Flexible Circuits Committee . IPC-TM-650, will be examined in detail for applicability and need for replacement or revision . Also, any test methods specified in new flexible circuitry documents will be generated . The test method on service temperature for flexible base materials is being revised and will be addressed .

High Speed/High Frequency Interconnections

D-20 High Speed/High Frequency Committee

Monday, September 21 10:15 am–12:00 pm ConnectionThomas Bresnan, R&D Circuits; Edward Sandor, Taconic Advanced Dielectric Divi-sionThis is a planning meeting for the task group and subcommittee leaders of the D-20 Committee . The group will discuss concepts for future revisions to IPC-2141, IPC-2251 and IPC-2252 .

D-22 High Speed/High Frequency Board Performance Subcommittee

Monday, September 21 1:30 pm–5:00 pm ConnectionMahendra Gandhi, Northrop Grumman Aerospace Systems; Michael Luke, Raytheon CompanyThis subcommittee is working on revision B to IPC-6018 .


D-23 High Speed/High Frequency Base Materials Subcommittee

Wednesday, September 23 9:30 am–12:00 pm ProsperityEdward Sandor, Taconic Advanced Dielectric Division; Roy Keen, Rockwell CollinsThis task group is developing revision A to the IPC-4103 materials specification for high frequency laminates .

D-24 High Speed/High Frequency Test Methods Subcommittee

Tuesday, September 22 1:30 pm–3:00 pm KnowledgeJames Baker-Jarvis, NIST; Don DeGroot, CCNiThis oversight subcommittee will discuss potential revisions to existing test methods to evaluate high speed/high frequency boards and materials .

D-24c High Frequency Test Methods Task Group: Frequency-Domain Methods

Tuesday, September 22 3:15 pm–5:00 pm KnowledgeMike Janezic, NISTThis task group determines the needs of the microelectronics industry for high frequency dielectric test methods . Currently, the task group is reviewing recent results from a transmission line test method for characterizing dielectric materials .

Management

8-40/JNAC Joint Meeting — Roadmap Steering and Planning Committee and JISSO North America Council

Thursday, September 24 1:00 pm–5:00 pm PerfectionJack Fisher, Interconnect Technology Analysis, Inc.; Dennis Fritz, MacDermidDuring this joint meeting, JNAC and the IPC Roadmap Steering and Planning Committee will coordinate activities. JNAC provides input to the Jisso International Council (JIC) on technology, materials, testing and standards through this cooperative effort .

CCC Committee Chairman Council (By Invitation)

Sunday, September 20 3:00 pm–4:30 pm Schaumburg GHPeter Bigelow, IMI Inc.This meeting of all task group, subcommittee and committee chairs is for general committee updates and discussion of IPC technical programs .

SPVC Solder Products Value Council (By Invitation)

Thursday, September 24 1:30 pm–5:00 pm ImaginationKarl Seelig, AIM, Inc.This council identifies and executes programs designed to enhance the competitive position of solder manufacturers and their customers .

Process Control

7-23 Process Effects Handbook Subcommittee

Wednesday, September 23 3:15 pm–5:00 pm InnovationDennis Fritz, MacDermid, Inc.This subcommittee is continuing with revision B to IPC-PE-740. The revision concentrates on updating printed circuit fabrication issues, including the impacts of lead-free assembly on the bare board .

Product Assurance

7-30 Product Assurance Committee (By Invitation)

Monday, September 21 8:00 am–9:00 am Nirvana CMel Parrish, STI Electronics, Inc.This is a planning meeting for all Product Assurance Committee task group and subcommittee leaders .

7-31a/ Joint Meeting — IPC-A-600 D-33a and Rigid Printed Board

Performance Specifications Task Groups

Sunday, September 20 9:00 am–3:00 pm Utopia AMark Buechner, BAE Systems; Randy Reed, Merix Corp.These task groups are preparing IPC-6012C and IPC-A-600H for ballot .

7-31b IPC-A-610 Task GroupFriday, September 18 8:00 am–5:00 pm Off-SiteSaturday, September 19 8:00 am–5:00 pm Nirvana CJennifer Day, Stanley Associates, U.S. Army Redstone Arsenal; Constantino Gonzalez, ACME Training & ConsultingThis task group is continuing development of revision E to IPC-A-610 . The goal at the meeting is to close all comments and action items as a prelude to ballot of this revision .

7-31bt IPC-A-610 Certification Technical Committee

Wednesday, September 23 3:15 pm–5:00 pm Utopia DMary Muller, Crane Aerospace & ElectronicsThis working group provides technical guidance to the developer of the certification program for IPC-A-610 and will be developing an outline to update the training program for Revision E .

7-31fs Space Electronic Assemblies IPC/WHMA-A-620 Addendum Task Group

Tuesday, September 22 10:15 am–5:00 pm ImaginationGarry McGuire, NASA Marshall Space Flight CenterThis task group will review the final draft before ballot of an addendum to IPC/WHMA-A-620 . This addendum will enable users of the standard and addendum to specify fabrication and acceptance of cable and wire harness assemblies used in rigorous space electronics hardware .

7-31ft A-620 Technical Training Task Group

Wednesday, September 23 9:30 am–12:00 pm Utopia DDebbie Wade, Advanced Rework Technology-A.R.TThis working group provides technical content direction for the IPC/WHMA-A-620 training and certification program . This meeting will focus on training for A-620AS Space Electronics Hardware Addendum.


IPC STANDARDS — EVERYTHING YOU NEED FROM START TO FINISH

End-Product

SolderabilityJ-STD-002J-STD-003

Acceptability of Printed BoardsIPC-A-600

Qualifications for Printed BoardsIPC-6011, 6012, 6013, 6017

Base Materials for Printed BoardsIPC-4101, 4104, 4202, 4203, & 4204

Design & Land PatternsIPC-2220 series + 7351

RepairIPC-7711/21

Assembly MaterialsJ-STD-004J-STD-005

IPC-HDBK-005J-STD-006

IPC-SM-817IPC-CC-830HDBK-830

Surface Treatments

IPC-4552IPC-4553IPC-4554

Copper FoilsIPC-4562

Requirements for SolderedElectronic Assemblies

J-STD-001

Acceptability of Electronic Assemblies

IPC-A-610

Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-A-620

BGA, CSP, HDIFlip Chip

J-STD-030IPC-7094IPC-7095

Solder MaskIPC-SM-840

Stencil DesignGuidelines

IPC-7525

ComponentsJ-STD-020J-STD-033J-STD-075

MORE IPC STANDARDS AVAILABLE ATwww.ipc.org/SpecTree (.pdf format)

®

Association Connecting Electronics Industries

Electrical TestIPC-9252

High Speed/FrequencyIPC-2141IPC-2251

Data Transfer and Electronic Product Documentation

IPC-2581 Series, IPC-2610 Series

Test MethodsIPC-TM-650

IPC-9691

MaterialsDeclaration

IPC-1751IPC-1752

Marking andLabeling

J-STD-609

PURCHASE IPC STANDARDS AT DISCOUNT MEMBER PRICESBOOTH #331

IPC STANDARDS — EVERYTHING YOU NEED FROM START TO FINISH


7-31j IPC-A-630 Box Build Task GroupMonday, September 21 1:30 pm–5:00 pm ImaginationEddie Hofer, Rockwell Collins; Richard Rumas, Honeywell CanadaThis task group will look at a “strawman” draft of IPC-A-630, Requirements and Acceptance for Enclosures, High Performance Applications.

Product Reliability

6-10c Plated-Through Via (PTV) Reliability — Accelerated Test Methods Task Group

Tuesday, September 22 10:15 am–12:00 pm Utopia CWerner Engelmaier, Engelmaier Associates; Randy Reed, Merix Corp.; Dewey Whittaker, Honeywell Inc.This task group is establishing a guideline for the attributes affecting lead-free assembly process survivability .

6-10d SMT Attachment Reliability Test Methods Task Group

Tuesday, September 22 1:30 pm–5:00 pm Utopia CReza Ghaffarian, Ph.D., Jet Propulsion Laboratory; Werner Engelmaier, Engelmaier Associates, L.C.This task group is reviewing the IPC/JEDEC-9707 spherical bend test method for determining printed board assembly strain limits as well as IPC-9708 for pad crater test methods .

Rigid Printed Boards

7-31at IPC-A-600/IPC-6012 Technical Training Committee

Tuesday, September 22 1:30 pm–5:00 pm ConnectionDebora Obitz, Trace Laboratories--EastThis will be the initial planning meeting to outline a major update to the IPC-A-600 training program .

D-31b IPC-2221/2222 Task GroupTuesday, September 22 1:30 pm–5:00 pm Nirvana CGary Ferrari, FTG Circuits; Cliff Maddox, Boeing CompanyThis task group is developing revision B of IPC-2221 .

D-32 Thermal Stress Test Methodology Subcommittee

Monday, September 21 8:00 am–10:00 am Utopia BMichael Freda, Sun Microsystems Inc.; Gerard O’Brien, Solderability Testing and Solutions Inc.This subcommittee has developed IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. The subcommittee is developing a test method user’s guide .

D-35 Printed Board Storage and Handling Subcommittee

Wednesday, September 23 9:30 am–12:00 pm Nirvana CC. Don Dupriest, Lockheed Martin Mis-siles and Fire Control; Tom Kemp, Rockwell CollinsThis task group is completing the forthcoming IPC-1601, Printed Board Handling and Storage Guidelines.

D-36 Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee

Monday, September 21 10:15 am–12:00 pm Utopia BGary Long, Intel Corp.; Michael Miller, NSWC-CraneThis subcommittee has developed a database for benchmarking board fabrication capability, quality and relative reliability . It maintains a family of process capability panel designs and standards for use by both subscribers and suppliers .

Terms and Definitions

2-30 Terms and Definitions CommitteeSunday, September 20 8:00 am–9:00 am Utopia AMichael Green, Lockheed Martin Space Systems Company; Vicka White, Honeywell Air Transport SystemsThis committee maintains standard industry definitions for the electronic interconnection industry within IPC-T-50 . The committee will provide an overview of terms currently being addressed .

Testing

7-11 Test Methods SubcommitteeTuesday, September 22 8:00 am–12:00 pm Nirvana CGraham Naisbitt, Gen3 Systems Limited; Joe Russeau, Precision Analytical Labora-tory, Inc.This subcommittee maintains and updates IPC-TM-650 . It is undergoing an extensive review of IPC test methods older than five years for reaffirmation, revision or cancellation .

UL-IAG Industry Advisory Group Meeting for UL

Thursday, September 24 2:00 pm–5:00 pm Utopia DJeff Brandt, Underwriters Laboratories Inc.To resolve questions about nontechnical developments related to Underwriters Laboratories documents as well as their enforcement within the global electronics interconnection industry, the re-establishment of an IAG for interpretation of the UL 746E, UL 796, UL 746F and UL 796F has begun. This group of industry and UL personnel will address items not appropriate for the UL-STP meetings, which cover technical modifications to the four UL documents above.

3-11f/ Joint Meeting — UL/CSA and D-12a UL 796F and UL 746F Task GroupsThursday, September 24 10:00 am–12:00 pm Utopia DJack Bramel, Jack Bramel & Associates; Duane Mahnke, Mahnke ConsultingThese two combined task groups provide a forum for ideas and data for both rigid and flexible printed boards and materials to support efforts on four UL standards: UL 746E, UL 796, UL 746F and UL 796F. This information will be provided to the appropriate UL Industry Advisory Group (IAG) for both rigid and flex materials / printed boards or to the Standards Technical Panel (STP) groups for rigid or flexible materials / printed boards, as industry input to the four identified UL standards.



Professional Development Courses

Find solutions to your company’s greatest challenges through learned guidance from our industry experts. Registration is required.

Thursday, September 249:00 am–12:00 pm

PD-01 Stencil Printing Process for Solder Paste Application — An In-Depth Look

Utopia AS. Manian Ramkumar, Rochester Institute of Technology

PD-03 LGA and QFN Design, Assembly and Rework GuideUtopia BBob Willis, ASKbobwillis.com

PD-05 Fundamentals of Solder Joint ReliabilityUtopia CWerner Engelmaier, Engelmaier Associates, L.C.

PD-07 DFM for Manufacturing: When a Six Sigma Process Is Not Sufficient to Achieve a High Yielding Manufacturing Process

EpiphanyDale Lee, Plexus

2:00 pm–5:00 pm

PD-02 Troubleshooting Your PCB Assembly Yields — On-Site or Offshore

Utopia ABob Willis, ASKbobwillis.com

PD-04 Advanced Component Packages and ProcessesUtopia BS. Manian Ramkumar, Rochester Institute of Technology

PD-06 Final Finishes and Their Compatibility with Lead-Free Assembly

Utopia CMichael Carano, OMG Electronic Chemicals

PD-08 Accelerated Thermal Cycling and Acceleration Factors for Lead-Free Surface Mount Assemblies

EpiphanyJean-Paul Clech, Ph.D., EPSI

September 21–22

IPC EMS Program Manager Training and Certification Program — Introduction to Program Management

September 24–26

EMS Program Manager Training and Certification — Leadership Training

For more information, contact Susan Filz at SusanFilz@ipc .org or visit www .ipc .org/EMSCert .

September 25–27

Certified Interconnect Designer (CID) Workshop and Exam

For more information on IPC’s designer certification programs, visit http://dc .ipc .org .

Certification Programs at IPC Midwest

CID+ Advanced Training Module n Rev. A

IPC PCB AdvAnCed desIgner CertIfICAtIon study guide

PWBADV-SGA

Designers Council

®

Earn Your CEPM CrEdEntial todaY!www.ipc.org/emscert

iPC EMSProgram manager Training and CerTifiCaTion Program


Exhibit Hall Floor Plan

300

302

304

306

307308

312

314

317

324

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331

400

403

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408 409

411

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500

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525

537

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714

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724

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730 731

732

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815

816

824

826

Inte

rnet

Lou

nge

IPCBookstore

Reliability and

Failure AnalysisForums

A-Line

Sale

s O

ffice

327

325 425 725

715

501 601 701401301

315 415


New Products Listing

Ascentech, LLC 633GENSONIC NEW ultra-sonic smt stencil aperature cleaning system

Asymtek 500DispenseJet® DJ-100 Jet High-speed jet dispensing

Fids-on-the-Fly™ High-speed fiducial capture

Calumet Electronics Corporation 400Dock-To-Stock Supply Chain Solutions Calumet solves the conflict between engineering, purchasing, and quality priorities by delivering the best value on the best printed circuit boards.

Dock-To-Stock Inventory Management Plan Standard packaging, standard procedures, exceptional savings.

Dock-To-Stock Life-Cycle Management Plan No more missed opportunities due to competitive pricing! No NRE, No Expedite, No Bull.

Dock-To-Stock Quality Management Plan Performance-based solutions eliminate redundancy and non-value adding activity.

CyberOptics Corporation 301SE500™ The fastest, most accurate SPI!

ESSEMTEC USA 704PANFLEX2-PKG

Fuji America Corporation 425Large Board All-in-one-placement system XPF-W

IPC — 331 Association Connecting Electronics Industries®

IPC-4101C, Specification for Base Materials for Rigid and Multilayer Printed Boards The new revision adds 11 new specification sheets to reflect the expanded offerings for current commercially available laminates and prepregs.

IPC-4553A, Specification for Immersion Silver Plating for Printed Boards This newly revised specification sets the requirements for the use of immersion silver as a surface finish for printed boards, adding a maximum deposit thickness based on performance criteria.

IPC Fast Facts Survey, Survival Strategies and Success Measures in the Electronics Industry With data from OEMs, EMS companies, PCB manufacturers and suppliers, the survey reveals strategies being used to weather the recession, the recession’s impact on relationships with suppliers, and success measures.

Annual IPC Studies, 2008–2009 Industry Analysis and Forecast for Rigid PCBs in North America and 2008–2009 Industry Analysis and Forecast for Flexible Circuits in North America Published this summer, these reports are based on surveys of North American PCB manufacturers conducted earlier this year.

Juki Automation Systems 715FlexSolder W510 FlexSolder W510 is a selective solder machine able to handle dual mini-waves for simultaneous or individual use.

MYDATA automation 525MY100SX Picking better ways to work just got easier.

Omron Electronics 601EzTS Easy Teaching Software Shortens AOI program setup, simple enough for operators to use

Q-upNAVI Quality Improvement Software Data mining software tool identifies root causes of failure

VP6000 Solder Paste Inspection System 3D inspection accurately measures solder volume and geometry to eliminate faults

VT-S700 High-Speed In-Line AOI High-speed, high resolution VT-S700 In-Line AOI System improves post-solder image accuracy using a new telecentric lens

VT-X X-ray Solder Inspection System Omron Shortens tact time for in-line x-ray inspections with the world’s first dual-mode ct scanner for pcbs with surface mount components on both sides

Panasonic Factory Solutions 307 Company of AmericaNPM (Next Production Modular) Fully integrated to maximize your productivity

PanaCIM Enterprise Edition Maximize your productivity with a new MES software solution

Pillarhouse 317Handex Jade

PillarGen 40 Pillarhouse introduces low cost Nitrogen generating system enabling turn key solution from single supplier

Synchrodex Orissa Modular high speed inline Synchrodex Orissa with multiple solder technologies available on one platform

Qualitek International Inc. 800DSP 866 No-Clean Lead Free Solder Paste Truly unique with 0% ppm total halogens

NC600-Sn100e Wire Solder No-clean, lead free, silver free, halogen free formulation

ZESTRON America 625VIGON® N 501 First-of-its-kind pH-neutral defluxing cleaning agent


Index of Exhibitors by Category

Adhesives AIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .700

Analytical/Laboratory Equipment & Supplies Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732

Artwork Generation/Phototooling Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .617

Assembly Equipment: Feeding Systems—Bulk Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826

Assembly Equipment: Chip Placement Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .701 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .704 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 Fuji America Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 425 Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .715 MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307

Assembly Equipment: Component Insertion Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .701 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 FKN Systek, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .715 MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307 SM Contact/KM USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609

Assembly Equipment: Fine-Pitch Placement Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .701 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .704 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 Fuji America Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 425 Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .715 MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307

Assembly Equipment: Flip-Chip Technology Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .701 Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .704 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 Fuji America Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 425 Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .715 MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307

Assembly Equipment: Multifunctional Placement A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815 Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .701 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .704 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 Fuji America Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 425 Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .715 MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307

Assembly Equipment: Odd Form Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .701 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 Fuji America Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 425 Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .715 MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307 PROMATION, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .724

Associations, Societies & Government Agencies IPC —Association Connecting Electronics Industries© . . . . . . . . . . . . . . . . . . 331 IPC Designers Council . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 331 NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .617

Ball Placement Systems & Equipment DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513

Barcode Printers & Readers ASYS Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 401 Control Micro Systems, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 508 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601 PROMATION, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .724

Board Handling Equipment (Conveyors & Depanelizers) A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815 Assembléon America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .701 ASYS Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 401 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .704 FKN Systek, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 PROMATION, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .724

Cable & Wire Harness Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732

Carts, Racks & Accessories AGI Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 FKN Systek, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 PROMATION, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .724

Cleaning Agents/Solvents AIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .700 A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815 Aqueous Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 411 DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 Petroferm Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 409 Qualitek International Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800 ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625

Cleaning Equipment/Systems A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815 Aqueous Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 411 Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633 CHEMCUT Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 414 Petroferm Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 409 ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625

Coating Equipment/Systems Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633 Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300

Coatings (Conformal, etc.) PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 Rogers Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502 ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625

Component Preparation Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 FKN Systek, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304

Consulting Services Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 IPC PCQR2 Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732 ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625



Curing Equipment & Systems Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300

Design Services: PCB Libraries and Models Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400

Design Services: PCB Tools Control Micro Systems, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 508 FKN Systek, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304

Design Services: Systems NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .617

Dicing Equipment Control Micro Systems, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 508

Die Bonding Equipment Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307

Dispensing Equipment Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633 Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .704 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307 PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300

Drilling & Routing Equipment & Supplies Control Micro Systems, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 508 FKN Systek, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304

Electronics Manufacturing Services (EMS)/ Contract Manufacturer A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815 Diversified Systems, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 424 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732

Encapsulation Equipment Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300

EOS/ESD Handling Products & Services FKN Systek, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304

Equipment Lease, Refurbish & Resale Apollo Seiko . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732

Flip Chip Bonding Equipment Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307

Flux AIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .700 Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 Qualitek International Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800 Senju Comtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600

Foils & Laminates Rogers Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502

Fume Extraction Systems Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826

Gas: Atmosphere Systems ACE Production Technologies, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .537

Hand Tools Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 Qualitek International Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800

Labeling Systems ASYS Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 401 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826

Laser Systems A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815 ASYS Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 401 Control Micro Systems, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 508 PROMATION, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .724

Marking Tools & Systems A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815 ASYS Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 401 Control Micro Systems, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 508 PROMATION, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .724

Masks & Screens for Soldering/Printing ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .704 MicroScreen LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .716 Qualitek International Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800

Material Handling Equipment/Automation Systems Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 FKN Systek, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601 SM Contact/KM USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609

Materials: Chip Packaging Qualitek International Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800 Rogers Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502

Materials: Other Qualitek International Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800 Rogers Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502

Media/Industry Publications Advanced Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Supporter Circuitnet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Supporter CircuiTree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312 EMS007 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .507 EMSNow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .702 EMT Worldwide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Poster Global SMT & Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Poster PCB007 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .507 SMT Magazine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .327 U.S. Tech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 426

Motion Control/Automation FKN Systek, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601

Package-On-Package Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307

Packing & Storage InsulFab PCB Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510

Pallets & Carriers AGI Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615 InsulFab PCB Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510

Photovoltaics DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324

Plating/Wet Process: Equipment CHEMCUT Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 414

Plating/Wet Process: Supplies Uyemura International Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 415

Printed Circuit Board (PCB) Manufacturer A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815 Bare Board Group, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 824 Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .617



Prototyping Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 Diversified Systems, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 424 ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .704 FKN Systek, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304

Reclamation/Recovery Systems (Environmental) Qualitek International Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800

Reflow Soldering Equipment (Ovens) Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .704 Pillarhouse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .317 Qualitek International Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800 Senju Comtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600

Repair & Rework Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 Pillarhouse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .317 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732

RFID Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601

Software: CAD/CAM/CIM Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .627 NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .617 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307

Software: Data Acquisition & Systems Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .627 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 IPC PCQR2 Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405

Software: Electronic Design Automation (EDA) Digitaltest Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325

Software: MES Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .627 Digitaltest Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307

Software: Other Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .627 Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307

Software: Process Control Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .627 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732

Software: Product Data Management (PDM) Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .627 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307

Software: Product Lifecycle Management (PLM) Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307

Solder (Paste/Bar/Cream/Powder) AIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .700 Qualitek International Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800 Senju Comtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600

Solder Resist: Materials Rogers Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502

Solderability Test Systems Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633

Soldering Equipment: Other ACE Production Technologies, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .537 Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .715 MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 Pillarhouse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .317 PROMATION, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .724 Senju Comtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600 SM Contact/KM USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609

Soldering Equipment: Selective ACE Production Technologies, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .537 A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815 Apollo Seiko . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314 Asymtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .715 Pillarhouse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .317 PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 Senju Comtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600

Soldering Equipment: Wave ACE Production Technologies, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .537 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 Juki Automation Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .715 Pillarhouse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .317 Qualitek International Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800 Senju Comtek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600

Soldering Irons/Tips/& Stations Apollo Seiko . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314 PROMATION, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .724 Qualitek International Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800

Stencil: Cleaning Systems A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815 Aqueous Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 411 Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 Petroferm Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 409 ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625

Stencil: Printing Systems A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815 ASYS Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 401 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 Control Micro Systems, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 508 DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 EKRA America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 403 ESSEMTEC USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .704 MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307

Stencil: Supplies & Accessories A-Line with IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815 DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 EKRA America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 403 MicroScreen LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .716

Surface Finishing (HASL/OSP/Other) Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 Uyemura International Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 415

Surface Prep CHEMCUT Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 414 Petroferm Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 409 Uyemura International Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 415



Tape & Reel Equipment & Services Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 Q Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .714

Test and Inspection: Equipment—Analog Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633 Digitaltest Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 IPC PCQR2 Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732

Test and Inspection: Equipment—AOI/Automated Aqueous Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 411 CyberOptics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 Digitaltest Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 MIRTEC Corp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .725 Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307 YESTech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501

Test and Inspection: Equipment—Boundary Scan Digitaltest Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325

Test and Inspection: Equipment—Digital Digitaltest Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 IPC PCQR2 Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732

Test and Inspection: Equipment—Environmental Chambers IPC PCQR2 Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732 ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625

Test and Inspection: Equipment—Fixtures/Handlers AGI Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615 Digitaltest Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325

Test and Inspection: Equipment—Functional Digitaltest Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 Europlacer North America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513 ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625

Test and Inspection: Equipment—In-Circuit Digitaltest Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325

Test and Inspection: Equipment—Infrared Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732

Test and Inspection: Equipment—Mixed Signal Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732

Test and Inspection: Equipment—Other Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633 CyberOptics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732 YESTech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501

Test and Inspection: Equipment—PXI Systems Digitaltest Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325

Test and Inspection: Equipment—Solder Paste Ascentech, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633 CyberOptics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601

Test and Inspection: Equipment—Vision/Videos CyberOptics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 YESTech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501

Test and Inspection: Equipment—Wire Harness Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732 SM Contact/KM USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609

Test and Inspection: Equipment—X-Ray Glenbrook Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 326 Omron Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601 YESTech . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501

Test and Inspection: Test Laboratory/Failure Analysis Acceptability, Reliability and Failure Analysis Forums . . . . . . . . . . . . . . . . . . .731 Robisan Laboratory Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .730 Trace Laboratories, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .726

Test and Inspection: Testing Services Aqueous Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 411 Digitaltest Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 IPC PCQR2 Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405 NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .617 Qualitek International Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800 Richard J. Bagan, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .732 Robisan Laboratory Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .730 Trace Laboratories, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .726 ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625

Test and Inspection: Testing Software Aegis Industrial Software Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .627 CyberOptics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 Digitaltest Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325

Tooling Equipment & Supplies DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 FKN Systek, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 InsulFab PCB Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510 MYDATA automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525

Training & Education AIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .700 Calumet Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 I-Connect007 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .507 IPC —Association Connecting Electronics Industries© . . . . . . . . . . . . . . . . . 331 IPC Designers Council . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 331 NSWC Crane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .617 Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307 Trace Laboratories, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .726 ZESTRON America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625

Via Filling/Plugging/Tenting DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324

Wafer Bumping Equipment DEK International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324

Wire Bonding Equipment Panasonic Factory Solutions Company of America . . . . . . . . . . . . . . . . . . . . .307 PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 SM Contact/KM USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609

Wire Cutting/Stripping and Wrapping Machine Tools Control Micro Systems, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 508 FKN Systek, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 SM Contact/KM USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609

Workstations/Ergonomics/Chairs ASYS Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 401 Capital Equipment Exchange Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 PROMATION, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .724


Exhibitor Listings

Acceptability, Reliability and Failure 731Analysis Free ForumsAfter a product has been successfully built, delivered to the customer, and put in the field, something really bad can happen — it can come back. Failure analysis has always been on the final frontier of electronics assembly, but at IPC Midwest, we’re bringing it to the front of the line .

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ACE Production Technologies, Inc. 5373010 North First Street Spokane Valley, WA 99216Phone: +1 509-924-4898 Fax: +1 509-533-1299sales@ace-protech .com Web: www .ace-protech .com Alan Cable, President +1 509-924-4898 The KISS (Keep It Simple Soldering) Selective Soldering Machines are the most widely accepted products on the market today . The KISS machines have an outstanding reputation for being robust, easy to operate, economically justifiable, and above all reliable . The KISS state-of-the-art features enable process development for an efficient production environment . These machines have a typical ROI of three to six months . The ACE product line also includes Re-work and Repair tools, and Lead Tinning Systems . A-Line Supplier

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Aegis Industrial Software Corporation 6275 Walnut Grove Drive, Suite 320 Horsham, PA 19044Phone: +1 215-773-3571 Fax: +1 215-773-3572sales@aiscorp .comWeb: www .aiscorp .com Robert Miklosey, Vice President of Product Management +1 215-773-3571, [email protected] Lynette Durringer, Office Manager +1 215-773-3571, [email protected] Software provides single-vendor information systems for high-reliability manufacturers, providing a critical complement to enterprise-level ERP and PLM capabilities . Aegis’ manufacturing execution system (MES) software fully manages the manufacturing information environment, from process planning and launch, through manufacturing execution and shop floor materials control, to operations analytics and real-time dashboard systems .

AGI Corporation 615177 Nick Fitcheard Road Huntsville, AL 35806Phone: +1 256-858-3300 Fax: +1 256-858-3304Web: www.AGIcorp.com Doug Williamson, Sales Manager +1 256-489-1434, dwilliamson@agicorp .com Amy Buford, Inside Sales +1 256-489-1422, [email protected] Corp is an internationally known supplier of Wave Solder Pallets and SMT Assembly Pallets from the simplest to the most complex . Ask about our Tita-nium Insert Pallet, Screen Printer Tooling, Wash Baskets, Feeder Carts, Tray Carts, Stencil Storage Carts as well as the many other types of fixtures AGI manufactures . We have the most aggressive design and machining techniques available . Let us help you!

A-Line with IPC 815

See assembly in action! Follow a product from screen printing to component mounting (through hole and surface mount), and then through reflow — all while learning about the processes, equipment (and end-item cleaning) that were used to manufacture the assembly . At the end of the line, you’ll get a finished assembly thanks to our participating companies:


Exhibitor Listings

Agilent Technologies, Inc. 8025301 Stevens Creek Boulevard Santa Clara, CA 95051Phone: +1 800-829-4444 Web: www .agilent .com/find/pcbAgilent Technologies (NYSE: A), the premier mea-surement company . Be sure to plan a stop by our booth for a visit with our experts . Learn more about our products and services and how Agilent “Has Got Your Needs Covered.”

AIM 70025 Kenney Drive Cranston, RI 2920Phone: +1 401-463-5605 Fax: +1 401-463-0203Web: www .aimsolder .com Kelly Cardone, Marketing Coordinator +1 401-463-5605, kcardone@aimsolder .comAIM offers a full line of solder assembly materials to the electronics industry including solder paste, liquid flux, bar, wire, preforms, adhesives, cleaners and chemicals, plating anodes and indium- and gold-based specialty alloys . We are ISO9001 and QS9000 certified with manufacturing, distribution and sup-port facilities located throughout the Americas, Asia-Pacific and Europe .

Apollo Seiko 3143969 West Lemon Creek Road Bridgman, MI 49106Phone: +1 269-465-3400 Fax: +1 269-465-3441info@apolloseiko .comWeb: www .apolloseiko .com Rick G. Schiffer, President +1 269-465-3400, rick@apolloseiko .com Stacey Barajas, Executive Assistant +1 269-465-3400, stacey@apolloseiko .comApollo Seiko is the world-wide leader in selective soldering solutions . Our technologies include direct power iron tip, micro-flame, laser diode and bot-tom side soldering . Table-top or in-line systems are available, equipment in stock .

Aqueous Technologies 4119055 Rancho Park Court Rancho Cucamonga, CA 91730Phone: +1 909-944-7771 Fax: +1 909-944-7775sales@aqueoustech .comWeb: www .aqueoustech .com Mike Konrad, President +1 909-944-7771, [email protected] Joe Herr, Sales Manager +1 909-944-7771, [email protected]

Aqueous Technologies manufactures a variety of award-winning cleaning and cleaning related products including: Semi-Automatic Aqueous De-Fluxing stations Batch-Format Automatic Aqueous De-Fluxing Systems In-Line Format Aqueous De-Fluxing Systems; Ultrasonic Stencil Cleaning Systems; Cleaning Chemistries; Ionic Contamination (Cleanliness) Testers. Aqueous Technologies’ cleaners are capable of removing all flux/paste types including Rosin, Water Soluble and removes no-clean solder paste . A-Line Supplier

Ascentech, LLC 633127 Goose Hill Road Chester, CT 6412Phone: +1 860-526-8903 Web: www .ascentechllc .com Randy Allinson +1 860-526-8903, rallinson@snet .net Gregory Alexander +1 860-395-8794, [email protected] LLC - North American Distributor of GEN3 Systems Ltd products, including: MUST System III Solderability Test (wetting Balance) SPA1000 - Solder Paste Analyzer Auto-SIR - Surface Insulation Resistance Test CM Se-ries - Ionic Contamination Testers Dip and Spray Conformal Coating Systems GENSONIC - NEW Ultra-Sonic SMT Stencil Cleaner New Product

Assembléon America 7015110 McGinnis Ferry Road Alpharetta, GA 30005Phone: +1 770-751-4420 Fax: +1 770-751-4450Web: www .assembleon .comAssembléon’s broad product range provides solutions for SMT electronics assembly with a focus on Pick-and-Place machinery and high-end screen print-ers . Assembléon also markets a wide range of software solutions and service capabilities . These total solutions support manufacturing from low volume high-mix batch production through to ultra-high volume continuous produc-tion of electronic assemblies . It’s machines are based on high precision X-Y positioning platforms incorporating advanced parallel placement technology and continuous software calibration for the most demanding applications .

Asymtek 5002762 Loker Avenue West Carlsbad, CA 92010Phone: +1 760-431-1919 Fax: +1 760-431-2678info@asymtek .comWeb: www .asymtek .com Jerry Frost, Regional Sales Manager - Midwest +1 760-431-1919, [email protected] Bernie McHugh, Regional Sales Manager - East +1 760-431-1919, [email protected] designs and manufactures a full line of automated precision dispens-ing and conformal coating systems, supported by an award-winning global service network . Established in 1983, Asymtek offers advanced applications for a range of industries, including semiconductor packaging, printed circuit board assembly, LEDs, flat panel display assembly, automotive, medical/biotech product assembly, and other precision assembly processes . Asymtek’s systems are known for technology leadership and patented processes in jetting and coating . A subsidiary of Nordson Corporation (Nasdaq:NDSN), Asymtek is ISO 9001:2000 certified . New Product

ASYS Inc. 401140 Satellite Boulevard, N .E ., Suite B-1 Suwanee, GA 30024Phone: +1 770-246-9706 Fax: +1 770-246-9866info@asys-group .comWeb: www .asys-group .com Markus Wilkens, General Manager +1 770-246-9706, [email protected] provides high quality equipment and excellent support worldwide . The product range includes SMD Board Handling, Marking Systems(Laser/Label/Inkjet), Depaneling Systems (In-/Offline), Final Assembly and Screen Printers (LTCC, Solar) . Find out more about the company that is Driven by Innovation at www .asys-group .com . A-Line Supplier


Exhibitor Listings

Bare Board Group, Inc. 8247401 - 114th Avenue North, Suite 501 Largo, FL 33773Phone: +1 727-549-2200 Fax: +1 727-549-2221sales@bareboard .comWeb: www .bareboard .com Greg Papandrew, President +1 727-549-2200, [email protected] Tom Coghlan, Operations Manager +1 727-549-2200, [email protected] Bare Board Group has the sourcing and distribution experience neces-sary to assist you in obtaining offshore PCBs at competitive pricing through our pre-qualifed network of U/L, ISO and QS approved manufacturers. BBG has personnel ready to meet your needs on both sides of the world for on-site expediting, source inspection and around-the-clock communication . A-Line Supplier

Calumet Electronics Corporation 40025830 Depot Street Calumet, MI 49913Phone: +1 906-337-1305 Fax: +1 906-337-5359sales@calumetelectronics .comWeb: www .calumetelectronics .com Stephen J. Marshall, National Sales Manager +1 906-337-1305, [email protected] Michael Messner, Sales Representative +1 906-337-1305, [email protected] has been manufacturing mission-critical printed circuit boards in the USA since 1968! A New Standard for Printed Circuit Board Manufactur-ing and Supply-Chain Partnerships Harnessing 21rst Century Technology and American Innovation, Calumet restores the competitive edge to printed circuit boards Made in the USA. Mission-Critical Manufacturing™ delivers Class 3 performance at Class 2 prices with dock-to-stock dependability. Calumet; A Legacy of Performance, A Leader in Innovation! www .calumetelectronics .com New Product

Capital Equipment Exchange Company 8262802 Barney Court McHenry, IL 60051Phone: +1 815-363-0800 Fax: +1 815-363-0809dlenhard@ce-exchange .comWeb: www .ce-exchange .com David Lenhard, Used Equipment Business Manager +1 815 363 0800, dlenhard@ce-exchange .com Jory Feustel, Technical Manager - Used Equipment +1 815 363 0800, jfeustel@ce-exchange .comThe Capital Equipment Exchange is pleased to offer you the best available used SMT equipment on the market today . CEE is looking to purchase your unused SMT equipment . SMT line sales are one of our specialties . Lenders, if you are looking for a first class organization to properly inspect/re-market your end of lease equipment, talk to our many satisfied customers . See our current inventory of conveyors, placement equipment, feeders, reflow ovens, printers, test and line support items on-line at www .ce-exchange .com . A-Line Supplier

CHEMCUT Corporation 414500 Science Park Road State College, PA 16803Phone: +1 814-272-2800 Fax: +1 814-272-5206bluebox@chemcut .netWeb: www .chemcut .net Rick Lies, CEO/General Manager rlies@chemcut .net Floyd Confer +1 814 272 2804, [email protected], the leading supplier of wet processing equipment to the PCB & Chem-Milling markets, delivers world leading process uniformity, state-of-the-art process controls, and customer-proven reliability . Modular systems that can be configured for any process with performance and flexibility backed by reliable post sale Chemcut service and support . Conference Notepad Sponsor

Circuitnet Supporter135 Ward Hill Avenue Haverhill, MA 1835Phone: +1 843-682-4755 info@circuitnet .comWeb: www .circuitnet .com Jeff Ferry, Publisher +1 843-682-4755, [email protected] Ken Cavallaro, Business Manager +1 978-363-2176, [email protected]’s our job to dig through the hundreds of news stories and articles posted every day around the world covering electronics assembly . We don’t waste your time with everyday business news . We select and link to only the biggest of the new ideas and articles designed for business professionals from the world of electronics assembly .

CircuiTree 312600 Willow Brook Lane, Suite 610 West Chester, PA 19382Phone: +1 610-436-4220 Fax: +1 248-502-1040espositot@bnpmedia .comWeb: www .circuitree .com Chris Wilson, Sales Manager +1 248-244-8264, wilsonc@bnpmedia .com Ed Lohmann, West Coast Sales Manager +1 925-648-2562, Lohmanne@bnpmedia .comCircuiTree is the only global magazine covering printed circuit board manufac-ture . Its monthly blend of technical and business articles is complemented by columnists who are regarded as industry experts . CircuiTree also translates technical articles into Chinese for its Asian edition . Please visit us at www .circuitree .com for a free subscription or advertising information .

**See our advertisement on page 37!**

Control Micro Systems, Inc. 5084420A Metric Drive Winter Park, FL 32792Phone: +1 407-679-9716 Fax: +1 407-657-6883salesmail@cmslaser .comWeb: www .cmslaser .com Sales Department +1 407-679-9716, [email protected] laser marking systems for fast, permanent marking of text, graphics, barcodes and ECC200 2D matrix codes on pc boards . Specializes in laser systems configured to specific marking requirements, including board mate-rial, board-handling, vision systems/readers and integration with computer networks .Systems configurations range from stand-alone marking islands to fully integrated, SMEMA in-line workstations .

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Get Plugged Into CircuiTree TVCircuiTree TV Lets You Discover the Latest Industry News Straight From the Experts

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CircuiTree Web Showrooms Get the industry’s latest product and company information.• Product Brochures • White Papers • News Releases • Video

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Print/Digital MagazineThe world’s best source of information for the printed circuit board industry, CircuiTree magazine, brings readers face-to-face with the technological and business news they need to know. Our exclusive editorial focuses on information for circuit board fabricators and designers, their suppliers, and OEM customers with purchasing authority for products such as fabrication and design equipment, materials, test, and assembly. CircuiTree is also available in a GREEN digital format. Just select digital when you subscribe.

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Exhibitor Listings

CyberOptics Corporation 3015900 Golden Hills Drive Golden Valley, MN 55416Phone: +1 763-542-5000 Fax: +1 763-542-5100info@cyberoptics .comWeb: www .cyberoptics .com Connie Prasher, Marketing Coordinator cprasher@cyberoptics .com Chris Rockwell, North American Sales Director +1 763-542-5979, [email protected] Corporation is a leading provider of market-based process yield and through-put improvement solutions for the global electronics assembly market . We offer stand-alone measurement and inspection systems used in the SMT electronic assembly market for process control and inspection . New Product


DEK International 3241785 Winnetka Circle Rolling Meadows, IL 60008Phone: +1 847-368-1155 Fax: +1 847-368-1177Web: www .dek .com Jim Bernhard, Vice President, Sales +1 508-699-9077, [email protected] Charles Moncavage, Vice President, Engineering +1 484-893-1028, cmoncavage@grid-lok .comWith award-winning customer support, decades of materials deposition experience and technologies that enable multiple applications from SMT to semiconductor packaging to photovoltaics, DEK delivers the knowhow and printing solutions you need to stay competitive . Designing every product mind-ful of customers’ future production needs, DEK keeps choice, versatility and low cost-of-ownership at the core of our development philosophy . Visit the booth to find out how DEK’s portfolio of screen printing, stencil and consum-able products can enable your process today and tomorrow .

Digitaltest Inc. 3255046 Commercial Circle, Suite C Concord, CA 94520Phone: +1 925-603-8650 Fax: +1 925-603-8651sales@digitaltest .netWeb: www .digitaltest .net Mark Harding, Director of Sales, North America +1 925-603-8650, sales@digitaltest .netDigitaltest offers In-Circuit and Functional test equipment and the 2nd Genera-tion CONDOR Flying Prober . Converters are available for migration from legacy testers to the SIGMA , saving your initial fixture investments. For a complete list of available converters and for more information on our products and services visit www .digitaltest .net .

Diversified Systems, Inc. 4243939 West 56th Street Indianapolis, IN 46254Phone: +1 317-299-9547 Fax: +1 317-298-2055sales@divsys .comWeb: www .divsys .com Tammie Fish, Executive VP +1 317-299-9547 x169, [email protected] Bob Howard, Business Development +1 317-299-9547, [email protected] 37 years, Diversified Systems Inc. has maintained its reputation as a premier electro-mechanical contract assembler by specializing in both pro-totype (including rapid) and production arenas . dsi specializes in engineering solutions for complete life cycle management of all electronic manufacturing needs, including full box build, electrical/mechanical design & layout, testing, encapsulation, coating and potting . We have all major industry certifications & registrations.

EKRA America 40334 Saint Martin Drive Marlborough, MA 1752Phone: +1 508-486-9566 Fax: +1 508-486-9567sales@ekra-america .comWeb: www .ekra-america .com Steve Hall, President +1 508-486-9566, shall@ekra-america .com Jeff Copson, Sales Manager +1 508-486-9566, jcopson@ekra-america .comA leading technology development company for over 50 years and now a division of the ASYS Group, EKRA designs and manufactures screen printing solutions for the SMT, Hybrid, and Semiconductor Packaging markets . By focusing on useful technology development EKRA products provide the highest value for printing processes .

EMSNow 70230 Mill Lane Stetchworth, Cambs, CB8 9TRUnited KingdomPhone: +44-7768-318111 Paul Stoten, Publisher +44 7768 318111, [email protected] is the leading online source for the global electronic manufacturing industry . Read by more than 50,000 people every month and using video, audio and the written word, it reaches every corner of the EMS world!


EMT Worldwide PosterIML Group plc Blair House, High StreetTonbridge, Kent, TN9 1BQUnited KingdomPhone: +44-0-1732-359990 Fax: +44-0-1732-770049Web: www .EmtWorldWide .com Tim Fryer, Editor +44 1732 359990, [email protected] Keith Murray, Advertising Manager +44 1732 359990, [email protected] is a new approach to online publishing . The newsletter is de-livered, free, weeky and contains the best news along with original comments from global correspondents . The newsletter is backed by a website packed with reference information, including ‘The ShortList’ - a unique buyers guide containing over 30,000 items of data .

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Exhibitor Listings

ESSEMTEC USA 704816 North Delsea Drive, Suite 308 Glassboro, NJ 8028Phone: +1 856-218-1131 Fax: +1 856-218-1134sales@essemtec-usa .comWeb: www .essemtec-usa .com Stephen Pollock, Vice President +1 856-218-1131, sales@essemtec-usa .comESSEMTEC is a worldwide leader in the manufacturer of Surface Mount Technology (SMT) production equipment . Essemtec specializes in high mix production equipment for Printed Circuit Boards (PCB) using Surface Mount Technology . Essemtec is the only manufacturer to cover the entire production process, from Printers and/or Dispensers, to Pick-and-Place and Soldering equipment . Therefore, customers benefit from unparallel knowledge and the ability to select, from a single source, a complete process . New Product

E-Tool 302870 68th Avenue Minnesota City, MN 55959Phone: +1 507-858-0004 Fax: +1 507-453-3662Web: www .e-tool .comAt E-Tool, our mission is to design and manufacture process pallets and tooling that enhance our customer’s qualified manufacturing process . E-Tool’s engineering staff has 40+ years of electronics manufacturing experience . We work together to implement solutions that have a direct impact on product quality and product cost .

Europlacer North America 5132521 Schieffelin Road, Suite 102 Apex, NC 27502Phone: +1 919-362-8623 Fax: +1 919-362-8628sales@europlacer-na .comWeb: www .europlacer .com John Perrotta, Vice President +1 267-884-6760, [email protected] David Fenton, Technical Services Manager +1 919-362-8623 x115, david .fenton@europlacer-na .comEuroplacer designs and manufactures a comprehensive range of highly flexible SMT placement systems for the global electronics industry . Europlacer North America attributes its strong growth to a commitment to its core values of customer-driven product innovation and genuine integrity in all its business activities .

FKN Systek, Inc. 30486 Kendall Avenue Framingham, MA 1702Phone: +1 508-935-2282 Fax: +1 508-935-2286fkn@fknsystek .comWeb: www .fknsystek .com Klaus Heimann, President +1 508-935-2282 Werner Christ, Sales Manager +1 508-935-2262FKN Systek designs and manufactures tools and equipment for the electronics industry . We supply a full line of depaneling equipment used for singulating fully loaded pre-scored and tab routed Printed Circuit Cards . This includes PLC controlled multi-blade saws, bench top routers, punches and automated and hand operated circular blade depanelizers for pre-scored boards . We also provide PCB racks and trays for in process board storage .

Fuji America Corporation 425171 Corporate Woods Parkway Vernon Hills, IL 60061Phone: +1 847-913-0162 Fax: +1 847-913-0186Web: www .fujiamerica .com Scott Wischoffer, Marketing Manager +1 847-821-2405, [email protected] New Fuji NXT-II modular placement system now better and faster than before . We will also show the New XPF-XL single machine solution with large board capabilities . New Product

A-Line Supplier

Glenbrook Technologies, Inc. 32611 Emery Avenue Randolph, NJ 7869Phone: +1 973-361-8866 Fax: +1 973-361-9286Web: www .glenbrooktech .com Steven Zweig, Vice President, Sales +1 973-361-8866 x104, [email protected] Technologies will be demonstrating The Jewel Box 70T real time x-ray inspection system . This system allows up to 500x geometric and 2,000x electronic magnification. It includes a 5 axis manipulator and GTI-5000 Soft-ware with auto-BGA analysis software.

Global Laminates Inc. 605179 Ward Hill Avenue Ward Hill, MA 1835Phone: +1 978-521-9700 Fax: +1 978-521-9701Web: www .globallaminates .com Bruce Hurley, President +1 978-388-9610, [email protected] Laminates, Inc is an international distributor of first quality copper clad rigid, interlayer and composite substrates . We have been serving the PCB industry for over 25 years. We serve the US, Canada and Mexico with fast, personal service from our office in Massachusetts and from distribution cen-ters in Chicago, Los Angeles, Toronto and China. All laminates are UL 94-V0 recognized, IPC 4101B certified; our thermoset plastics meet MILI 24768 type 2 . Certificates of Compliance are available for all products .

Global SMT & Packaging PosterP.O. Box 7579 Naples, FL 34112Phone: +1 866-948-5554 Fax: +1 239-236-4682news@globalsmt .netWeb: www .globalsmt .net Trevor Galbraith, Editor-in-Chief +1 239-784-7208, [email protected] Lino D’Andreti, VP Sales - Americas +1 603-918-8579, [email protected] SMT & Packaging contains authoritative technical articles on practical issues affecting SMT assembly and packaging . Visit our stand and collect your free copy . Distributed globally, it has a separate print and electronic circula-tion to the US, Europe, China and Korea, enabling companies to target their advertising to regionally or globally. Global SMT & Packaging also produces a weekly video news program .


Exhibitor Listings

I-Connect007 507P .O . Box 50 Seaside, OR 97138Phone: +1 510-738-6610 Fax: +1 [email protected]: www.iconnect007.com Steve Gold, Publisher/Editor +1 530-852-7076, [email protected] Barbara Hockaday, Sales Manager +1 916-608-0660, [email protected] I-Connect007 family of magazines include PCB007, EMS007, PCBDe-sign007, Flex007, PCB007China and EMS007China. Each magazine serves a specific group of readers within the electronics manufacturing supply chain . Combined, these sites offer broad industry news coverage, columns, business and technical articles on a daily basis . Publishing more than 35,000 articles since 1999, I-Connect007 is the industry’s oldest, online magazine. I-Con-nect007 also produces the popular Real Time with... series covering events around the world .


IEEE—Chicago Section 306335 East Geneva Drive, PMB 389 Carol Stream, IL 60188Phone: +1 630-493-4333Web: www .ieee-chicago .orgThe Chicago Section of the IEEE serves electrical engineers and computer professionals in the Chicago Metropolitan Area . Our committees provide opportunities to work on Programs and Special Events, Publications, History Projects, Government Activities.

InsulFab PCB Tooling 510834 Hayne Street Spartanburg, SC 29301Phone: +1 404-617-9899 Fax: +1 864-527-1044scain@insulfab .comWeb: www .insulfabtool .comInsulFab PCB tooling is your complete source of custom tooling for the PCB industry . Our tooling line includes product for processes such as SMT, Wave, Conformal Coat, AOI, Hand Solder, Press fit and Rework . InsulFab has 2 locations to serve your needs and is ISO and ITAR certified . Please visit our booth number 510 to talk with one of our engineers and discuss your toughest application and how we can assist with the project .

IPC — 331Association Connecting Electronics Industries®

3000 Lakeside Drive, Suite 309 S Bannockburn, IL 60015Phone: +1-847-615-7100 Fax: +1-847-615-7105info@ipc .orgWeb: www .ipc .org Denny McGuirk, President +1 847-597-2841, [email protected] Neal Bender, Director of Membership +1 847-597-2808, [email protected] is a global trade association serving 2700 member companies worldwide in the electronics assembly and printed board industries . Through the contri-butions of our members, IPC supports the industry with standards, education, training, market research,and environmental and government relations pro-grams. IPC has offices in the U.S., China and Europe. Visit the IPC bookstore and take advantage of special show prices on industry standards, publications and membership .

IPC Designers Council 3313000 Lakeside Drive, Suite 309-S

Designers Council

®Bannockburn, IL 60015Phone: +1 847-615-7100 Fax: +1 847-615-7105Web: http://dc .ipc .org Anne Marie Mulvihill, Manager, Designers Council +1 847-597-2827, [email protected] IPC Designers Council is an international network of designers . Its mission is to promote printed board and printed board assembly design as a profes-sion and to encourage, facilitate and promote the exchange of information and integration of new design concepts through communications, seminars, workshops and professional certification through a network of local chapters . The Designers Council is a council under IPC with its own set of membership benefits . Visit http://dc .ipc .org for more information .

IPC PCQR2 Database 405A Partnership between IPC and CAT, Inc.2595 86th Court West Northfield, MN 55057Phone: +1 952-652-9033 Fax: +1 952-487-0877dave .wolf@cat-test .infoWeb: www .pcbquality .com David L . Wolf, VP - Technical Marketing +1 952-652-9033, dave .wolf@cat-test .info Timothy A. Estes, Chairman & CEO +1 505-797-0100, [email protected], Inc . is a global provider of market-critical data utilized by designers, pur-chasers, assemblers and manufacturers of printed boards, and by material and equipment suppliers to the printed board industry . The products and services offered by CAT Inc . provide quantitative data on printed board manufacturing capability, quality and reliability . These services include process capability panel and coupon design, precision electrical testing, and comprehensive data analysis .

Juki Automation Systems 715507 Airport Boulevard Morrisville, NC 27560Phone: +1 919-460-0111 Fax: +1 919-469-0480Web: www .jas-smt .com Geron Ryden, Marketing Manager +1 919-460-0111, gryden@jas-smt .com Bob Black, President +1 919-460-0111, rjblack@jas-smt .comJuki manufactures high-quality SMT placement machines with over 21,000 systems shipped worldwide . Committed to outstanding service and support, Juki provides the lowest cost of ownership to its customers. Juki placement machines are backed by a 3 year full parts warranty in the Americas and Europe. Whether you operate in a high-speed or high-mix environment, Juki has a solution for you. Easy to operate and maintain, Juki machines will improve your production efficiency keeping you ahead of your competition .

New Product


Exhibitor Listings

Kyzen Corporation 816430 Harding Industrial Drive Nashville, TN 37211Phone: +1 615-831-0888 Fax: +1 615-831-0889contact_us@kyzen .comWeb: www .kyzen .com Sherry Stepp, Product Manager +1 615-831-0888, sherry_stepp@kyzen .com Tom Forsythe, Vice President, Sales +1 615-831-0888, tom_forsythe@kyzen .comKyzen provides award winning cleaning chemistries and services for electron-ics and advanced packaging applications . We offer a broad range of process solutions ranging from sprayable aqueous cleaning formulations to engi-neered vapor degreasing solvents . Kyzen also has a fully equipped applica-tions lab staffed with experts to help with customer process development . A-Line Supplier

MicroScreen LLC 7161106 South High Street South Bend, IN 46601Phone: +1 574-232-4358 Fax: +1 574-234-7496info@microscreen .orgWeb: www .microscreen .org Holly Wise, Technical Accounts Manager +1 574-232-4418, [email protected] Kathy Jenczewski, General Manager +1 574-232-4637, [email protected] cut and electroformed stencils for printing solder paste . Options for lead free stencils include: high nickel content metal for improved paste release and green indentification for isolation . All stencils 100% inspected for integrity using ScanCheck AOI . Distributors of Wizard Frame System and Space Saver Frames . A-Line Supplier

MIRTEC Corp. 7251 Jacks Hill Road Oxford, CT 6478Phone: +1 203-881-5559 Fax: +1 203-881-3322sales@mirtec .comWeb: www .mirtec .com Brian D’Amico, President +1 203-232-9343, bkdamico@sbcglobal .net Robert Horowitz, Regional Sales Manager +1 203-217-0271, [email protected] manufacturer and supplier of desktop, in-line (AOI) automatic optical inspection, and real-time x-ray inspection equipment . Among the many strengths are the ease of programming and the flexibility to be used anywhere in the manufacturing process .

The Morey Corporation A-Line Supporter100 Morey Drive Woodridge, IL 60517Phone: +1 630-754-2300 sales@moreycorp .comWeb: www .moreycorp .comDevelopment engineering services plus manufacturing and delivery, all from one source . A-Line Supplier

MYDATA automation 525320 Newburyport Turnpike Rowley, MA 1969Phone: +1 978-948-6919 Fax: +1 978-948-6915Web: www .mydata .com Brain Duffey, President +1 978-948-6919, [email protected] John McMahon, Director of Technical Services +1 978-948-6919, [email protected] automation AB designs and builds SMT placement machines and stencil-free printers for the electronics industry . Founded in Stockholm, Swe-den, in 1984, MYDATA has rapidly built a global customer base in the surface mount industry . Its mission is to be always innovating in order to satisfy the electronic industry’s need for surface mount technology and services that meet the highest demands in terms of productivity and quality . New Product

NSWC Crane 617300 Highway 361 Code GXSP, Building 3287ECrane, IN 47522Phone: +1 812-854-1299 Dean May, Production Manager +1 812-854-3073, [email protected] Roger Smith, Branch Manager +1 812-854-6430, roger .r .smith@navy .milThe Emerging Critical Interconnect Technology Program (ECIT) is a cooperative venture between the electronics industry (IPC) and NAVSEA Crane . The ECIT program provides support for new material and product technology develop-ment through teaming arrangements with military, private industry, and academic parties . The intent of the program is to promote domestic research and development as well as accelerate the integration of new technology into warfighter applications .

Omron Electronics 6011 Commerce Drive Schaumburg, IL 60173Phone: +1 866-88-OMRON Fax: +1 847-285-8011aoisales@omron .comWeb: www.omron247.com Chris Speck, AOI Business Unit Manage +1 916-300-5898, chris .speck@omron .com Tim Anderson, AOI - Sales Support Manager +1 847-285-7330, [email protected]’s PCB inspection systems lead the AOI market with the fastest produc-tion speeds, 3D imaging, and patented technology to support demand for in-creased productivity with the highest quality and fast changeover . Omron offers inline and benchtop AOI systems for solder paste, pre- and post-reflow, using a Windows OS. Omron’s Q-UP Navi software enables customers to optimize the inspection process by providing software that assists in identifying, document-ing and correcting the root cause of failures in the SMT process . New Product


Exhibitor Listings

Panasonic Factory Solutions 307Company of America909 Asbury Drive Buffalo Grove, IL 60089Phone: +1 847-495-6100 Fax: +1 847-495-6095pfsamarketing@us .panasonic .comWeb: www .panasonicfa .com John Stewart, Regional Sales Manager +1 847-495-6239, [email protected] Mary Lynn Chandler, Account Manager +1 847-495-6059, [email protected] Factory Solutions Company of America provides industry-leading, electronics assembly solutions that can improve manufacturers’ productivity, quality and profit through a combination of software, process, support and hardware offerings . Some of Panasonic’s latest solutions include the NPM, a fully integrated single-platform electronics assembly machine, and PanaCIM Enterprise Edition, a MES offering new levels of capability across your entire enterprise . New Product

Petroferm Inc. 4093938 Porett Drive Gurnee, IL 60031Phone: +1 847-244-3410 Fax: +1 847-249-6346Customerservice@petroferm .comWeb: www .petroferm .com Mike Savidakis, Market Manager +1 847-249-6826, [email protected]

Pillarhouse 317635 Touhy Avenue Elk Grove Village, IL 60007Phone: +1 847-593-9080 Fax: +1 847-593-9084sales@pillarhouseusa .comWeb: wwww .pillarhouseltd .com Adrian De’Ath, Vice President +1 847-593-9080 x117, [email protected] Jonathan Wol, President Pillarhouse USA +1 847-593-9080 x117, [email protected] offers a comprehensive line of selective solder machines to fit the needs of today’s ever changing production requirements . From single point to custom high speed multi dip processes, handling sizes from 1x1 to 24x48 . Sys-tems available in-line or hand load configurations . Pillarhouse offer windows interface, fiducial recognition, board warpage detection, closed loop wave height monitoring, universal tooling, multiple preheat options and more on our selective systems . New Product

PROMATION, Inc. 72410411 Corporate Drive, Suite 104 Pleasant Prairie, WI 53158Phone: +1 262-857-3100 Fax: +1 262-857-9847sales@pro-mation-inc .comWeb: www .Pro-mation-Inc .com Gary Goldberg, President & CEO Carl Ano, Marketing Manager +1 262-857-3100 x11, [email protected] provides a wide array of circuit board handling/routing systems, industrial conveyor solutions, and customized Robotic Soldering systems . A-Line Supplier

PVA 30015 Solar Drive Halfmoon, NY 12065Phone: +1 518-371-2684 Fax: +1 518-371-2688info@pva .netWeb: www .pva .net Frank Hart, Director of Mktg & Regional Sales +1 518-371-2684 x229, [email protected] John Bova, Sales Manager +1 518-371-2684 x226, [email protected] is a global manufacturer of multi-axis robotic solutions for selective conformal coating and dispensing applications including meter-mix, potting, bonding, gasketing, solder paste, and surface mount adhesive processes . PVA platforms are also integrated for robotic soldering, spray flux, and automatic screw-driving cells .

Q Corporation 714301 River Street P.O. Box 730Derby, KS 67037Phone: +1 800-835-1099 Fax: +1 316-788-7428qcorp@qcorporation .comWeb: www .qcorporation .com Ben Swigart, President +1 316-788-3746, [email protected] Paul Miller, Sales Manager +1 316-788-3746, [email protected] Corporation is a recognized world leader in component handling for surface mount technology and mass lead trimming . For 40 years, companies throughout the world have depended on Q quality to meet the most demand-ing production schedules .

Qualitek International Inc. 800315 Fairbank Street Addison, IL 60101Phone: +1 630-628-8083 Fax: +1 630-628-6543solder@qualitek .comWeb: www .qualitek .com Debbie Liguori, Marketing Department +1 630-628-8083 x122, dliguori@qualitek .com Charlie Han, VP Sales & Marketing +1 630-628-8083 x112, chan@qualitek .comQualitek International, Inc . A global provider of Soldering Solutions . World-wide solder materials manufacturer. Lead & Lead Free Alloys, Sn100e Alloys, Solder Paste, Flux, Bar, Wire, BGA Spheres, Stencil Cleaners, Residue Removers, Rework Materials, Ceasolder Mask, Dross Eliminators and Clean-ers. JT Lead Free Wave Soldering Systems and Reflow Ovens. BGA Rework Stations, Soldering Irons and Accessories . Metals reclamation service and full Solder Checkup Programs . Local technical support . Soldering materials sold in the U.S.A are made in the U.S.A. ISO 9001:2000 certified. New Product

A-Line Supplier


Exhibitor Listings

Richard J. Bagan, Inc. 7321280 S . Williams Drive P .O . Box 169Columbia City, IN 46725Phone: +1 260-244-5115 x2121 Fax: +1 260-244-4158Web: www .rjbagan .com Lydia McDevitt, VP, Sales & Marketing +1 800-552-5115, lmcdevit@rjbagan .comBagan is a technical services company whose primary business divisions pro-vide industrial electronic repair, precision calibration, and cable engineering to support manufacturing, military, and scientific industries worldwide .

**Participant in the Acceptability, Reliability and Failure Analysis Testing Corridor.**

RMD Instruments Corp. 50444 Hunt Street Watertown, MA 2472Phone: +1 617-668-6901 Fax: +1 617-926-9743leadtracer@rmdinc .comWeb: www .rmd-leadtracer .com Paul Delmonico, Sales Coordinator +1 617-668-6908, [email protected] Steve Glass, WEEE/RoHS Buisness Development Manager +1 805-432-5199, sglass@rmdinc .comThe Award Winning LeadTrecer-RoHS is the most effective XRF System de-signed specifically for screening of all RoHS/WEEE and Common Elements in electronics including China RoHS . LeadTracer-RoHS analysis of entire energy spectrum eliminates the limited capability of surface measurements by the x-ray tube XRF systems .

Robisan Laboratory Inc. 7306502 E . 21st Street Indianapolis, IN 46219Phone: +1 317-353-6249 Fax: +1 317-917-2379Web: www .robisan .com Chris Mahanna, President, Technical Manager +1 317-353-6249, [email protected] Theresa Nusbaum, Office Manager +1 317-353-6249, [email protected] Laboratory provides acceptability, reliability and destructive physical/failure analysis for the PB and PBA industry . We are very proud to offer one day turn PB structural integrity testing . We support IPC, military, and other commercial standards . Our scope includes: microsections, thermal cycling, thermal shock, NextGen thermal stress, SIR (continuous), ECM, CAF, cleanli-ness, solder joint analysis, underfill testing and more .

**Participant in the Acceptability, Reliability and Failure Analysis Testing Corridor and Forums. See page 13.**

Rogers Corporation 502100 S . Roosevelt Avenue Chandler, AZ 85226Phone: +1 480-961-1382 Fax: +1 480-961-4533Web: www .rogerscorp .comRogers is a global technology leader providing high performance printed cir-cuit materials for use in high frequency applications . Rogers will be showcas-ing their RO4000® LoPro™ laminates, RT/duroid® 6202PR along with their well known RT/duroid 5000, RT/duroid 6000, RO3000®, and TMM® laminates .

Senju Comtek 60020300 Stevens Creek Blvd ., Suite 300 Cupertino, CA 95014Phone: +1 408-446-7856 Fax: +1 408-253-2140sales@senjucomtek .comWeb: www .senju .com Derek Daily, General Manager +1 408-446-7866, [email protected] R. Hiro Suzuki, President & CEOSenju Metal Industry Co . (SMIC) is a global leader in solder materials and related equipments . Senju’s ECO Solder™ Lead Free materials include the world’s most widely used GRN360 and the newest S70G series. ECOPASCAL wave soldering system incorporates innovative pump technology for the hight-est and most stable wave pressure . As a total solution provider, Senju offers the latest soldering technologies in the industry .

SM Contact/KM USA 6095951 Loeb Road, Suite 140 Charlevoix, MI 49720Phone: +1 231-237-9060 Fax: +1 [email protected]: www.KMUSALLC.comKM USA provides solutions for various manufacturing processes. Our latest line is advenced technology for Splice Crimping and solder application . Along with it’s popular high quality crimping applicators, KM USA can provide the latest technology for complete wire processing, wire to component connec-tion, advanced soldering solutions, pin insersion, and PCB processing . With the ability to provide customized automation solutions for your product, it’s hard to find something we can’t do!


SMT Magazine 32798 Spit Brook Road Nashua, NH 3062Web: www .smtonline .comSMT Magazine provides greater technical depth than any other publication of its type for OEMs and EMS providers who design, assemble, and test surface mounted printed circuit boards . The monthly magazine, Web site, biweekly E-Newsletter, and Webcasts provide the latest information and analysis on technological developments and industry trends in surface mount assembly . SMT has more than 40,000 subscribers who request SMT, all 100% qualified with purchasing power .


SPEA AMERICA 3152609 SSW Loop 323 Tyler, TX 75701Phone: +1 903-595-4433 Fax: +1 903-595-5003Web: www .spea .com David Buhrkuhl, President +1 903-595-4433 x101, davidp@speaamerica .com Heidi Lockridge, Office Aministrator +1 903-595-4433, heidil@speaamerica .comSPEA is exhibiting both the highly successful 4040 Flying Probe tester with the new MultiProbe technique, and the 3030 ICT machine with dual stage capabil-ity to perform simultaneous ICT and FLASH programming on two boards . Launched last year in Europe to critical acclaim, this range of highly modular test systems is now available in the Americas . Badge Lanyard Sponsor


Exhibitor Listings

Trace Laboratories, Inc. 7265 North Park Drive Hunt Valley, MD 21030Phone: +1 410-229-4384 Fax: +1 410-584-9099info@tracelabs .comWeb: www .tracelabs .comTrace Laboratories is a US based, internationally accredited, full service test-ing and analysis company, with two state-of-the-art laboratories in Maryland and Illinois . Trace can address the full scope of your test and analysis require-ments . Our professionals have over 25 years experience with programs requir-ing strict adherence to existing specifications and custom programs designed around a specific requirement or company need .

**Participant in the Acceptability, Reliability and Failure Analysis Testing Corridor and Forums. See page 13.**

U.S. Tech 42610 Gay Street Phoenixville, PA 19460Phone: +1 610-783-6100 Fax: +1 610-783-0317ustech@gim .netWeb: www .us-tech .com Jacob Fattal, Publisher +1 610-783-6100, [email protected] Walter Salm, Editor +1 732-616-4716, [email protected] TECH, a monthly international hi-tech electronics publication reaches over 200,000 design engineers, manufacturing & production managers,buyers, product specifiers, and corporate management on the web and in print . We focus on new innovations in SMT, PCB design & fabrication, contract assembly, test equipment, components & distribution, and alternate energy technologies .

Uyemura International Corporation 4153990 Concours Street, Suite 425 Ontario, CA 91764Phone: +1 909-466-5635 Fax: +1 909-466-5177Web: www .uyemura .com Anthony R . Revier, President +1 909-466-5635, trevier@uyemura .com Donald Walsh, National Sales Manager/Director of Operations +1 860-793-4011, [email protected] finishes: electroless nickel/immersion gold, RGA immersion silver, RMK immersion tin and DIG immersion gold over copper. Uyemura’s electroless gold and palladium products; high throw electrolytic nickel; acid copper (includ-ing market leading via fill copper—EVF); Umicore Galvanotechnik ‘s precious metal electrolytic plating processes and MEC’s specialty copper etching processes .

**See our advertisement on the inside back cover!**

Viscom Inc. 4081775 Breckinridge Parkway, Suite 500 Duluth, GA 30096Phone: +1 678-966-9835 Fax: +1 678-966-9828Web: www .viscom .com Verena Zurhausen, Marcom Manager +1 678-966-9835, [email protected] Eric J. Moen, Regional Sales Manager - East +1 678-966-9835, [email protected] range of automatic optical (AOI) and X-ray (AXI) inspection equipment for PCB assembly . In-line inspection of paste, placement, post-reflow, post-wave, and selective solder . 100% solder joint inspection, including lead-free, to IPC standards . Highspeed and high performance solutions, 3D . Microelectronics inspection equipment for wire bond, thick film, and conductive glue .

YESTech 5012762 Loker Avenue West Carlsbad, CA 92010Phone: +1 760-918-8471 Fax: +1 760-918-8472sales@yestechinc .comWeb: www .yestechinc .com Don Miller, President +1 760-918-8471, [email protected] provides award-winning AOI and X-Ray inspection solutions for electronic manufactures . Our High Speed AOI systems are configurable with 5 megapixel top down and 4 side viewing cameras to inspect for part presence, position, correct part, polarity and solder . The new X3 X-Ray system’s propri-etary technology provides unsurpassed 3-D inspection capability for BGA’s and other hidden solder joints on double-sided PCBs . YESTech’s advanced SPC software is available with all systems to provide real-time yield information .

ZESTRON America 62511285 Assett Loop Manassas, VA 20109Phone: +1 703-393-9880 Fax: +1 [email protected]: www .zestron .com Sabine Braun, Marketing Specialist +1 703-393-9880, [email protected] Michael McCutchen, National Sales Manager +1 703-393-9880 x13, [email protected] cleaning products and services for all required applications in the electronics manufacturing industry . ZESTRON’s unique MPC technology (HMIS rating 0-0-0) gives water-based cleaning agents the performance of solvent-based cleaners . ZESTRON’sstate-of-the-art Application Technology Centers enable us to tailor our products specifically to your process requirements and provide the technical know-how for timely product quality assessments . New Product

Advertiser IndexAce Production Technologies . . . . . . . . . . . . 9CircuiTree. . . . . . . . . . . . . . . . . . . . . . . . . . . 35CyberOptics . . . . . . . . . . . . . . . . . . . . . . . . . 11EMSNow . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26EMTWorldWide . . . . . . . . . . . . . . . . . . . . . . 37I•Connect007 . . . . . . . . . . . . . . . . . . . . . . . . 31SM Contact/KM USA . . . . . . . . . . . . . . . . . . 17SMT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Uyemura USA. . . . . . . . . . . Inside back cover

Our Final Finishes are Your Competitive Edge!

Corporate Headquarters:Ontario, CA • ph: (909) 466-5635

(800) 969-4842 • fax: (909) 466-5177

RGA Immersion Silver deposits only oncopper. Exceptional distribution meets theneeds of high-density mounting. Stable bath –Low temperature; no attack of substrate orsolder mask. Uyemura is a leading supplierof immersion silver!

ENIG KAT Electroless Nickel/ ImmersionGold produces a uniform mid-phos ENdeposit with a thin topcoat of immersiongold, over copper. High corrosion-resistance;solderable, and aluminum wire bondable.Runs at least 10°F below competitive products. Plus, no “dummy plating” needed!Uyemura is #1 for ENIG in North America!

RMK-20 Immersion Tin deposits a uni-form co-planar tin surface over copper;superior thickness distribution. Ideal forlead-free soldering. Meets the needs of soldering and press fit connections.

DIG Direct Immersion gold on copper –the ultimate replacement for OSP finishes –and only Uyemura has it! Deposits a 1-2micro inch coating of immersion golddirectly on copper. Ideal for lead-free,high-temperature assembly.

Also ask about Electroless Gold – another Uyemura technology exclusive!

Tech Center:Southington, CT • ph: (860) 793-4011(800) 243-3564 • fax: (860) 793-4020

has the ULTIMATE“Final Four!”

UYEMURA

www.uyemura.com

UYEMURAUSA

See us at IPC Midwest, booth #415

Uyemura Final Four IPC Midwest Ad 7/31/09 6:21 PM Page 1

See you next year!September 27–October 1, 2010

Renaissance Schaumburg Hotel & Convention Center Schaumburg, Ill

www.IPCMidwestShow.org [email protected] • 877-472-4724 (U.S./Canada)

There’s no oTher show like iT in The world!Solve your manufacturing challenges, visit hundreds of exhibitors and meet thousands of peers and industry experts in electronics assembly, test, and board design and manufacture.

Benefit from the industry’s premier technical conference, full- and half-day educational courses and IPC standards development meetings. Focus on test technologies, advanced packaging, SMT processes, materials and environmental regulations.

Pre-register for free exhibit hall admission and take advantage of free keynotes, posters, forums and networking events.

ConferenCe & exhibition April 6–8, 2010

Meetings & eduCationApril 6–9, 2010

Mandalay bay resort & Convention CenterLas Vegas, Nevada USA

www.IPCAPEXEXPO.org

test • eleCtroniCs asseMbly • printed boards •

design

DISCOVER. CONNECT. THRIVE.

solutions

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Here

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2009 IPC Midwest Show Directory

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Transcript of 2009 IPC Midwest Show Directory