18 July 2001 Work in Progress – Not for Publication 1 ITRS Factory Integration Technology Working...

118 July 2001 Work in Progress – Not for Publication

ITRS Factory IntegrationTechnology Working Group

(FITWG)Industry Presentation

18 July 2001

Michio Honma, NEC

Jeff Pettinato, Intel


Agenda

1. Scope and Factory Drivers2. Difficult Challenges3. Key Technology Requirements4. Integrated Potential Solutions:

Process Control Agile Manufacturing Material Handling

5. Summary


Factory Integration GroupRegional Representatives

Europe

Klaus Eberhardt

Richard Oechsner

Claus Schneider

Taiwan

Hugo Chang

JJ Hsu

Japan

Michio Honma

Shoichi Kodama

Toshi Uchino

Hiromi Yajima

US

Court Skinner

Jeff Pettinato


Factory Integration Contributing MembersBob Bachrach (AMAT) Richard Oechsner (Fraunhofer IIS-B)Eddy Bass (Intel) Jeff Pettinato (Intel)Dave Bloss (Intel) Dev Pillai (Intel)Ray Bunkofske (IBM) Lisa Pivin (Intel)Chris Burkhart (Novellus) Joe Reiss (PRIA)Al Chasey (ASU) Lance Rist (ISMT) Hugo Chang (Winbond) Claus Schneider (Fraunhofer IIS-B)Ivan Chou (Compaq) Marlin Shopbell (AMD)Eric Christianson (AMD) Court Skinner (SRC)Blaine Crandell (TI) Arnie Stienman (ION Systems)Klaus Eberhardt (M+W Zandar) Keisuke Tanimoto (Sharp)John Ellis (SEMI-NA) Toshi Uchino (Trecenti)Rick Filippuzzi (Asyst) Brad Van Eck (ISMT)John Fowler (ASU) Hiromi Yajima (Toshiba)Karl Gartland (IBM) Dave Miller (IBM)Randy Goodall (ISMT) Mitsui-san (Matsushita)Dave Gross (AMD) Mori-san (Daifuku)Duane Howard (IBM) Rohan Nageswaran (Intel)Mani Janakiram (Intel) Seiichi Nakazawa (F-RIC)Giichi Inoue (Toshiba) John O’Reilly (ION Systems)Junji Iwasaki (Mitsubishi) Kunio Oishi (Ebara)Shoichi Kodama, (Toshiba) Mikio Otani (Shinko)

Many International members have contributed to FI


2001 Factory Integration Scope IncludesWafer, Chip and Product Manufacturing

WaferMfg.

ChipMfg.

ProductMfg.

Dis

trib

uti

on

Si S

ub

str

ate

Mfg

.The Factory

• FEOL• BEOL

• Probe/Test• Singulation

• Packaging• Test

The Factory is driven by Cost and Productivity:Reduce factory capital and operating costs per functionEnable efficient high-volume production with operational models for

varying product mixes (high to low) and other business strategies Increase factory and equipment reuse, reliability, and overall efficiencyQuickly enable process technology shrinks and wafer size changes


2001 Difficult Challenges

Managing Complexity Quickly and effectively

integrating rapid changes in semiconductor technologies and market conditions

Factory Optimization Productivity increases are not

keeping pace with needs

Flexibility, Extendibility, Scalability Ability to quickly convert to new

semiconductor technologies while reusing equipment, facilities, and skills

Post CMOS Manufacturing Uncertainty Inability to predict factory

requirements associated with post CMOS novel devices

450mm Wafer Size Conversion Timing and manufacturing

paradigm for this wafer size conversion

< 65nm after 2007> 65nm through 2007


FactoryOperations

Facilities MaterialHandling

ProductionEquipment

ComplexityManagement

FactoryOptimization

Extendibility,Flexibility,Scalability

Factory Areas or Thrusts

Dif

ficu

lt C

hal

len

ges

>65

nm

th

u 2

007

Example: Manufacturing rules, production size, mix

Examples: Building, cleanroom, utility systems, process fluid delivery

Examples: AMHS Transport, storage, ID Systems, interface standards

Factory Information and Control

SystemsExample: MES, Computers, Networks, Process Control

Example: Equipment unit, real-time process control, interface standards, Embedded Control

Reuse of building, production equipment, and factory information and control systems; Factory designs that support rapid process and technology changes/retrofits; Comprehend tighter ESH/Code requirements

Increased customer expectation to meet on time delivery; Increased urgency for improved factory effectiveness, High factory yield at startup; Reduce wafer and product cost; Satisfy all local regulations

Rapid changes to business needs & demands; Increasing process & product complexity; Larger wafers and carriers, Increased reliance on factory information & control systems

All factory areas must be integrated to solve these Difficult Challenges

Includes Wafer, Chip, and Product ManufacturingTechnology Requirements and Potential Solutions are expressed through these factory areas


Key Technology Requirements and Issues

1. Production equipment is not keeping up with Overall Equipment Efficiency (OEE) and Availability targets

Ex. 2001 OEE target of 83% vs. actual of 65% for bottleneck equipment

2. Process technology advances are occurring at ever faster rates; factories are expected to ramp and meet yield targets more quickly

New equipment for 157nm litho, High K gate stack, Low k dielectrics, SOI, copper will be implemented in factories over the next 2-5 years

3. A 45% reduction in manufacturing cycle times by 2007 is expected for high volume high mix factories

4. Direct transport systems capability must be ready for beta tests during 2002 and HVM implementation by 2004

5. Time required to a) build/ramp new factories, or b) convert/ramp existing factories to new technologies must improve 30% by 2007

6. 300mm software standards compliance is not meeting single wafer processing and intrabay AMHS needs


Integrated Solutions are Essential to Meet NeedsIntegrated Solutions

Agile Manufacturing- Equipment Engineering

Systems - EES

- Single wafer control

- e-Diagnostics

Process Control- Fault Detection Capabilities

- Feedback & Feed forward Process Control

- Machine to machine matching

Material Handling- Direct Transport AMHS

- AMHS for Send-Ahead wafers

- Integrated Sorters, Stockers, Metrology

Integrated Factory

Technology Requirements

New disruptive process technologies

157nm litho

High K gate stack

Low k dielectrics

Copper processing

+ Improved Productivity

Decreased Factory Cycle Time (QTAT)

Improved Equipment Efficiency

Reduction in non-product (I.e. test) wafer usage

More efficient direct labor

Faster factory conversion at technology nodes

Goal = Meet Factory Challenges and

Technology Requirements


Process Control Potential SolutionsType 1: Fault Detection and Classification

ProcessEquipment

Step N

UI

Fast FDCModule

Host SystemFDC Signal / Data

FDC Control

Outside of Tool• Host determines actions

based on type of fault• Host issues control command

Inside the Tool• FDC Models defined / configured• FDC host signals configured• FDC actions may be configured

External FDCModule

GEMInterface

Potential Solutions Needs Include: Real-time process sensors on process equipment Reporting of real-time data to host system Ability to stop processing at various intervals

via host command Factory Software systems capabilities to

manage areas and groups of equipment Software I/F Standards

Technology Requirement Drivers:• Overall Equipment Efficiency• Equipment Availability• Yield Particle Densities


Process Control Potential SolutionsType 2: Run to Run Control

MetrologyEquipment

UI

ProcessEquipment

UI

MetrologyEquipment

Step N-1Step N+1Step N

UI

Feed Forward and Feedback Control - Use preprocess or post metrology data to adjust processing for that lot

GE

MGE

M

GE

M

Recipe Adjustment

Control

Parameterized recipes required

Metrology datapipeline

MES(Equipment Control)

Factory Network

EE

EE

EE

Run to Run Control S/W & Models

Recipe Recommendations

Detailed wafer and chamber data required

EE Network

Potential Solutions Needs Include: Reporting of metro data to host system Ability to adjust key recipe parameters at

various intervals via host command Relationship between end process results

and adjustable process parameters Open software interfaces and standards

Technology Requirement Drivers:• Overall Equipment Efficiency• Optimize Process Performance

(for example):• Litho Gate CD control (nm)• Litho Overlay Control (nm)• Diffusion Oxide thickness


Process Control Potential SolutionsType 3: Integrated Metrology

IntegratedProcess andMetro Equip.

UI

GE

M

Parameterized recipes required

Host System

EquipController

Factory Network

EE

Integrated MetrologyModule (not Bolt on)

EE Network

Recipe and Model Selection via

remote interface

EESEES

Potential Solutions Needs Include: Hardware integration of process and

metrology equipment Software integration of metrology and

process equipment•Single SECS/GEM interface for integrated metrology and process equipment

No increase in process equipment footprint No degradation in equipment run rate or

availability

Technology Requirement Drivers:• Factory Cycle Time per Mask Layer• Interbay AMHS throughput• Intrabay AMHS throughput

Metrology data and detailed wafer and chamber data


Agile Manufacturing Means… Quick turn around [*faster cycle] time for production

Quick turn around time without productivity deterioration No productivity reduction even if many lots production formed

with few wafers

Quick capability to product, scale and technology change Quick ramp-up of equipment installation and product Assure high productivity even if low production volume

Speed Product: short ramp-up time Equipment: short ramp-up time Product Quick Turn Around

Time (QTAT)

Cost Equipment high OEE Product yield high at ramp-up

to Satisfy these Requirements…


Key Potential Solutions

Full Automation Equipment Engineering System

Fundamental technology

Single Wafer Control Multiple lots/single wafer control in equipment module (group)

Process Control Fault Detection and Classification Run to Run Integrated Metrology

Direct Transportation Real Time Scheduling (RTS) Supply Chain Management (SCM)


Copyright 2000 by Masato Fujita, Selete/Panasonic

Copyright 2000 by Masato Fujita, Selete/Panasonic

AMHS

MES

MCS

Operators still watch the tool to confirm its health status and do miscellaneous things

Suppliers

Manufacturing Execution System

Manufacturing Execution System

Equipment Engineering System

Equipment Engineering System

FAX and telephone be replaced by

Internet

MES

No more operator this side

No more operator this side

New!

e-Diag Capability

e-Diag Capability

What will Equipment EngineeringSystems (EES) replace?


ManufacturingExecution System - MES

Equipment/AMHS

Within a Factory (E-Factory)

Factory to Factory (E-Factory)

Company to Company (E-Commerce)

Factory A

Company A

Factory B

Company BSuppliers

Equipment Engineering

System

e-diagnosticscapability

Process or MetrologyEquipment

(side view)

ControlSystem

Station Controller

AMHSEqpt

(side view)

Material ControlSystem - MCS

Eth

erne

t

EESEES

e-Manufacturing Hierarchy

firewall


e-Business

e-ManufacturingProduct and pre-product’s e-CommerceChip buyers supportSpare parts logistics, etc.

e-DiagnosticsDiagnostics data collectionRemote access and analysis of diagnostic data

Equipment EngineeringReal time control (APC/AEC)Machine-to-Machine difference managementMaintenance scheduling, etc.

(EE)

The e-Business structure for manufacturing


Carrier Level integrated Flow and Control Type 1: Sorter and Metrology with Stockers

End View

Sorter

MetroTools

OHT Loop

Stocker

Stocker robot loadsSorters and Metroequipment Loadports

Metro

Process Tools

Process Tools

Sto

cker

s

OH

T L

oop

SorterMetro

MetroTools

Stocker robot interfaces directly withSorters and Metro equip

Potential Solutions Require:Standardized Intrabay OperationIntegrated Software

When Solutions Are Needed: •Research Required by 2001•Development Underway by 2002•Qualification/Production by 2003


Potential Solutions Require:I/F Standard (H/W, S/W)

Standardized EFEMSoftware

IntegratedWafer level APC

Standardized Intrabay Operation

Wafer Level Integrated Flow and ControlType 2: Connected EFEM


Wafer Staging

Carrier Staging

EquipmentSupplier A Equipment

Supplier B

EquipmentSupplier C

Conceptual Only


Potential Solutions Require:System controller of Equipment Group

Wafer DispatcherModule structure of equipment

Standardized I/F Standardized Width

Modular Process StepsHigh Speed Wafer TransferStandardized Intrabay Operation

Wafer Level Integrated Flow and ControlType 3: Expanded EFEM


Conceptual Only

StandardTool Widths


Potential Solutions Require:Ultra High Speed Wafer Transfer

Target M/C to M/C 7sec.Wafer Level Dispatching

Wafer Level Integrated Flow and ControlType 4: Continuous EFEM (Revolving Sushi Bar)


Target 450mm

Single ChamberProcess ToolStocker

MetrologyTool

Conceptual OnlySingleWafer

WaferTransport

Multi-WaferCarrier

CarrierLevel

Transport


….. …..

…..

….. …..

…..

…..

SupportingSystem

Mfg.System

PlanningSystem

E-MfgE-Mfg..

AgileAgile-Mfg.-Mfg.

DirectTransport

WaferLevel Control

E-Diagnostic

Supplier’sSCM

User’s SCM -Supply ChainManagement

EES

The Next Generation Factory Concept


Summary1. Advances in process technology are occurring at ever faster

rates

2. Equipment suppliers must deliver stable equipment running new process technologies with very high Overall Equipment Efficiency (OEE)

3. Agile manufacturing systems are needed to quickly ramp new process technologies into high volume production and to achieve cycle time goals

4. Process control and machine to machine matching are needed to get high yields at startup and reduce cycle time

5. Open standards are a Key Part of Potential Solutions

6. We invite and encourage you to participate in FITWG activities to convert these plans to reality

18 July 2001 Work in Progress – Not for Publication 1 ITRS Factory Integration Technology Working...

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